WO2013161862A1 - Composition de résine photosensible positive chimiquement amplifiée, procédé de fabrication d'un film durci, film durci, dispositif d'affichage el organique et dispositif d'affichage à cristaux liquides - Google Patents

Composition de résine photosensible positive chimiquement amplifiée, procédé de fabrication d'un film durci, film durci, dispositif d'affichage el organique et dispositif d'affichage à cristaux liquides Download PDF

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WO2013161862A1
WO2013161862A1 PCT/JP2013/062027 JP2013062027W WO2013161862A1 WO 2013161862 A1 WO2013161862 A1 WO 2013161862A1 JP 2013062027 W JP2013062027 W JP 2013062027W WO 2013161862 A1 WO2013161862 A1 WO 2013161862A1
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group
acid
resin composition
structural unit
photosensitive resin
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PCT/JP2013/062027
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English (en)
Japanese (ja)
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健太 山▲ざき▼
政憲 疋田
達也 霜山
大助 柏木
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富士フイルム株式会社
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Priority to KR1020147029609A priority Critical patent/KR20140148431A/ko
Priority to CN201380022517.4A priority patent/CN104254805B/zh
Priority to KR1020167009369A priority patent/KR20160044059A/ko
Priority to JP2014512640A priority patent/JP5849152B2/ja
Publication of WO2013161862A1 publication Critical patent/WO2013161862A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6237—Polymers of esters containing glycidyl groups of alpha-beta ethylenically unsaturated carboxylic acids; reaction products thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
    • C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
    • C08G18/792—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups formed by oligomerisation of aliphatic and/or cycloaliphatic isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/807—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
    • C08G18/8074—Lactams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements

Abstract

L'invention concerne une composition de résine photosensible ayant une haute sensibilité, une excellente stabilité dimensionnelle et une excellente adhésivité, la composition de résine photosensible pouvant conserver une transmittance élevée même après chauffage. Une composition de résine photosensible positive chimiquement amplifiée comporte : (A) un composant polymère contenant un polymère qui satisfait (1) et/ou (2) ci-dessous, (S) un composé exprimé par la formule générale (S) (dans la formule générale (S), R1, R2 et R3 sont des groupes substituants, et au moins l'un de R1, R2 et R3 est un groupe substituant qui satisfait (S-1) ci-dessous), (B) un agent générant un photoacide, et (D) un solvant>. (1) est un polymère ayant (a1) un motif structurel qui comporte des groupes dans lesquels un groupe acide est protégé par un groupe acidolytique, et (a2) un motif structurel qui comporte un groupe de réticulation ; (2) est un polymère ayant (a1) un motif structurel qui comporte des motifs dans lesquels un groupe acide est protégé par un groupe acidolytique, et (a2) un polymère ayant un motif structurel qui comporte un groupe de réticulation ; (S-1) est un groupe substituant ayant un groupe fonctionnel capable de se réticuler entre le composant polymère (A) et le composé exprimé par la formule générale (S), ou entre deux composés exprimés par la formule générale (S), la réticulation étant accomplie en utilisant un acide et/ou un chauffage à pas moins de 150 °C.
PCT/JP2013/062027 2012-04-27 2013-04-24 Composition de résine photosensible positive chimiquement amplifiée, procédé de fabrication d'un film durci, film durci, dispositif d'affichage el organique et dispositif d'affichage à cristaux liquides WO2013161862A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020147029609A KR20140148431A (ko) 2012-04-27 2013-04-24 화학 증폭형 포지티브형 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 유기 el 표시 장치 및 액정 표시 장치
CN201380022517.4A CN104254805B (zh) 2012-04-27 2013-04-24 化学增幅型正型感光性树脂组合物、硬化膜及其制造方法、有机el显示装置及液晶显示装置
KR1020167009369A KR20160044059A (ko) 2012-04-27 2013-04-24 화학 증폭형 포지티브형 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 유기 el 표시 장치 및 액정 표시 장치
JP2014512640A JP5849152B2 (ja) 2012-04-27 2013-04-24 化学増幅型ポジ型感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置

Applications Claiming Priority (4)

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JP2012104002 2012-04-27
JP2012-104002 2012-04-27
JP2013019172 2013-02-04
JP2013-019172 2013-02-04

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WO2013161862A1 true WO2013161862A1 (fr) 2013-10-31

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JP (1) JP5849152B2 (fr)
KR (2) KR20140148431A (fr)
CN (1) CN104254805B (fr)
TW (1) TWI581064B (fr)
WO (1) WO2013161862A1 (fr)

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JP2015098519A (ja) * 2013-11-18 2015-05-28 住友ベークライト株式会社 樹脂組成物、部材、光学装置および電子装置
JP2015184389A (ja) * 2014-03-20 2015-10-22 東京応化工業株式会社 化学増幅型ポジ型感光性樹脂組成物
WO2016076205A1 (fr) * 2014-11-14 2016-05-19 Jsr株式会社 Composition de résine sensible au rayonnement, film durci pour éléments d'affichage, procédé de formation de film durci pour éléments d'affichage, et élément d'affichage
JP2017134355A (ja) * 2016-01-29 2017-08-03 富士フイルム株式会社 感光性樹脂組成物、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置および硬化膜の製造方法
WO2019009360A1 (fr) * 2017-07-06 2019-01-10 Jsr株式会社 Dispositif électroluminescent, dispositif d'électroluminescence organique et procédé de fabrication de dispositif électroluminescent et de dispositif d'électroluminescence organique
WO2020004122A1 (fr) * 2018-06-26 2020-01-02 日産化学株式会社 Composition de formation de film de sous-couche de réserve comprenant un produit de réaction à partir d'un composé d'ester glycidylique
WO2021177253A1 (fr) * 2020-03-04 2021-09-10 Ａｇｃ株式会社 Composition de résine photosensible de type positif
US11435667B2 (en) * 2017-07-26 2022-09-06 Sk Innovation Co., Ltd. Polymer for organic bottom anti-reflective coating and bottom anti-reflective coatings comprising the same
TWI821467B (zh) * 2018-12-21 2023-11-11 日商東京應化工業股份有限公司 負型感光性樹脂組成物、感光性阻劑薄膜、圖型形成方法
JP7477011B2 (ja) 2018-12-12 2024-05-01 Jsr株式会社 感光性樹脂組成物、レジストパターン膜の製造方法、およびメッキ造形物の製造方法

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CN105895661B (zh) * 2015-02-17 2019-03-01 富士胶片株式会社 薄膜晶体管基板的制造方法及其应用
KR102635564B1 (ko) * 2016-05-03 2024-02-08 동우 화인켐 주식회사 포지티브형 감광성 수지 조성물 및 이로부터 제조된 절연막
TWI724029B (zh) * 2016-09-28 2021-04-11 奇美實業股份有限公司 化學增幅型正型感光性樹脂組成物、附有鑄模的基板的製造方法以及電鍍成形體的製造方法
KR20200118007A (ko) * 2018-02-02 2020-10-14 닛산 가가쿠 가부시키가이샤 디설파이드구조를 갖는 레지스트 하층막형성 조성물

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WO2016076205A1 (fr) * 2014-11-14 2016-05-19 Jsr株式会社 Composition de résine sensible au rayonnement, film durci pour éléments d'affichage, procédé de formation de film durci pour éléments d'affichage, et élément d'affichage
JP2017134355A (ja) * 2016-01-29 2017-08-03 富士フイルム株式会社 感光性樹脂組成物、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置および硬化膜の製造方法
JPWO2019009360A1 (ja) * 2017-07-06 2020-04-30 Jsr株式会社 発光装置及び有機ｅｌ装置、並びにこれらの製造方法
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US11435667B2 (en) * 2017-07-26 2022-09-06 Sk Innovation Co., Ltd. Polymer for organic bottom anti-reflective coating and bottom anti-reflective coatings comprising the same
WO2020004122A1 (fr) * 2018-06-26 2020-01-02 日産化学株式会社 Composition de formation de film de sous-couche de réserve comprenant un produit de réaction à partir d'un composé d'ester glycidylique
JPWO2020004122A1 (ja) * 2018-06-26 2021-08-05 日産化学株式会社 グリシジルエステル化合物との反応生成物を含むレジスト下層膜形成組成物
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JP7477011B2 (ja) 2018-12-12 2024-05-01 Jsr株式会社 感光性樹脂組成物、レジストパターン膜の製造方法、およびメッキ造形物の製造方法
TWI821467B (zh) * 2018-12-21 2023-11-11 日商東京應化工業股份有限公司 負型感光性樹脂組成物、感光性阻劑薄膜、圖型形成方法
WO2021177253A1 (fr) * 2020-03-04 2021-09-10 Ａｇｃ株式会社 Composition de résine photosensible de type positif

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