WO2013099167A1 - セラミックパッケージ - Google Patents
セラミックパッケージ Download PDFInfo
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- WO2013099167A1 WO2013099167A1 PCT/JP2012/008151 JP2012008151W WO2013099167A1 WO 2013099167 A1 WO2013099167 A1 WO 2013099167A1 JP 2012008151 W JP2012008151 W JP 2012008151W WO 2013099167 A1 WO2013099167 A1 WO 2013099167A1
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- Prior art keywords
- metallized layer
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- plan
- layer
- ceramic package
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- 239000000919 ceramic Substances 0.000 title claims abstract description 119
- 238000001465 metallisation Methods 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 68
- 239000002184 metal Substances 0.000 claims abstract description 68
- 238000005219 brazing Methods 0.000 claims description 96
- 239000000463 material Substances 0.000 claims description 74
- 238000007789 sealing Methods 0.000 abstract description 8
- 239000013078 crystal Substances 0.000 abstract description 5
- 238000005304 joining Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 230000008646 thermal stress Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10075—Non-printed oscillator
Definitions
- the present invention relates to a ceramic package having a cavity in which an electronic component such as a crystal resonator, a semiconductor element, or a piezoelectric element is mounted and the opening can be reliably sealed.
- a first-stage metallization pattern is formed in layers around the cavity.
- a thin third-stage metallization pattern having a hat-shaped cross section in the inner and outer directions along the upper side is formed, and the seal ring (metal frame) is disposed above the third-stage pattern via a brazing material.
- a ceramic package sealing structure in which a cap (metal lid) is welded onto the ring after brazing has been proposed (for example, see Patent Document 1).
- a first-stage metallization layer is formed in a frame shape on almost the entire surface of the insulating substrate surrounding the opening of the concave portion (cavity) in which the electronic component is accommodated in a square shape in plan view.
- a brazing material is provided above the metallized layers of the first step and the second step.
- JP-A-9-139439 (pages 1-6, FIGS. 1-6) JP 2010-135711 A (pages 1 to 15, FIGS. 1 to 4)
- the present invention solves the problems described in the background art, a ceramic having a cavity in which an electronic component such as a crystal resonator is mounted, a metal frame can be flatly bonded around the opening, and sealing can be reliably performed
- the issue is to provide a package.
- the present invention provides a surface of the package body surrounding the opening of the cavity on the surface of the first metallization layer formed almost entirely on the surface, and having a width narrower than that of the first metallization layer.
- the second metallized layer is formed with the idea that the width is made different between the straight side portion and the corner portion. That is, a first ceramic package according to the present invention (Claim 1) is formed on a ceramic package body having a front surface and a back surface and having a cavity opened on the front surface, and the surface having a frame shape in plan view.
- the width of the package along the inner and outer directions of the second metallized layer in the corner portion of the surface in plan view is in the inner and outer directions of the second metallized layer in a region excluding the corner portion in plan view. It is characterized by being narrower than the width along it.
- the ceramic includes a high-temperature fired ceramic such as alumina, or a glass-ceramic that is a kind of low-temperature fired ceramic.
- the corner portion of the surface is a pair of two inner and outer directions that intersect with both ends of the rounded surface and are orthogonal to each other in a plan view that is located at each inner corner of the side surface of the cavity having a rectangular shape in plan view.
- the corner portion in the form in which the package body and the cavity have an oval shape in a plan view is a quarter of a circle in a plan view in a pair of semicircular parts excluding a pair of opposing linear sides.
- the inside-outside direction is a radial direction connecting the center of the cavity and the frame-shaped surface surrounding the opening of the cavity in a plan view of the package body.
- the first metallized layer and the second metallized layer may be made of W or Mo and their alloys when the ceramic is a high-temperature fired ceramic, and Ag or Cu when the ceramic is a low-temperature fired ceramic. Etc. apply.
- the width of the second metallized layer in the corner portion is 20 to 80% of the width of the second metallized layer in the side portion.
- the surfaces (exposed surfaces) of the first and second metallized layers are coated with a Ni plating film or an Au plating film.
- the first ceramic package may have a multi-cavity configuration in which a plurality of the packages are arranged adjacent to each other vertically and horizontally in a plan view.
- a second ceramic package according to the present invention is formed on a ceramic package body having a front surface and a back surface, and having a cavity opened on the front surface, and the surface having a frame shape in plan view.
- a third metallization layer having a circular shape in plan view and separated from the adjacent band-shaped second metallization layer formed in each corner part, and the circular third metallization layer in plan view The diameter is smaller than the width along the inner and outer directions of the band-shaped second metallized layer.
- the said surface and back surface in the package main body of a said 2nd ceramic package mainly exhibit a rectangle (square or a rectangle) by planar view, it is not limited to this rectangle.
- the diameter of the circular third metallization layer at the corner is narrower than the width of the band-shaped second metallization layer at the side, specifically, 20 to 20 of the second metallization layer. 80%.
- a gap formed only by the first metallized layer located between the circular third metallized layer and the band-shaped second metallized layer adjacent thereto is not more than three times the diameter of the third metallized layer. This is desirable from the viewpoint of securing the fluidity of the brazing material described later.
- the second ceramic package may have a multi-cavity configuration in which a plurality of the packages are arranged adjacent to each other vertically and horizontally in a plan view.
- a third ceramic package according to the present invention is formed on a ceramic package body having a front surface and a back surface, and having a cavity opened on the front surface, and the surface having a frame shape in plan view.
- a first metallization layer, a second metallization formed in a frame shape on the surface of the first metallization layer, and having a width along the inner and outer directions of the package body smaller than the width of the first metallization layer, and the first metallization layer
- a metal frame bonded to the upper part of the second metallization layer via a brazing material, the second metallization being above the first metallization layer in the corner portion of the surface in a plan view.
- the inclination angle formed between the outer surface of the brazing material located on the outer side of the layer and the surface of the first metallized layer is on the surface excluding the corner portion in plan view.
- the third ceramic package is obtained by joining a metal frame to the first ceramic package above the first metallized layer and the second metallized layer via a brazing material.
- the outer surface of the brazing material in each corner portion is a curved surface (commonly referred to as a fillet) that protrudes downward in a side view.
- the outer side surface of the brazing material in the side portion is either a convex surface that is convex upward or a curved surface that is convex downward in a side view.
- the outer side surface may have a shape in which the upper end reaches the outer side surface of the front second metallized layer or is bent in the middle of the vertical cross section.
- the metal frame (ring-type metal fitting) is, for example, Kovar (Fe-29 wt% Ni-17 wt% Co), 42 alloy (Fe-42 wt% Ni), or 194 alloy (Cu-2.3 wt% Fe-0). 0.03 wt% P) is applied. Furthermore, for example, Ag brazing (Ag-15 wt% Cu) is used for the brazing material.
- the surface of the first metallized layer is an imaginary horizontal plane for determining the inclination angle
- the outer surface of the brazing material located outside the second metallized layer is an outer edge of the outer surface. An imaginary tangent line extending inward and outward from the edge and obliquely upward.
- the second metallized layer is formed on the surface of the first metallized layer in the inner and outer directions of the package main body than the end portion of the package main body on the outer surface side of the first metallized layer.
- the inner and outer direction positions of the second metallized layer at the corners of the second metallized layer are formed at positions close to the end of the second metallized layer.
- a ceramic package (Claim 4) formed at a position closer to the end on the cavity side than the position.
- region is a side part except each corner part in the surface of the said 1st metallization layer.
- the present invention also includes a ceramic package (Claim 5) in which the package body has the same cavity on the back surface symmetrically with the cavity opened on the surface.
- a ceramic package (Claim 5) in which the package body has the same cavity on the back surface symmetrically with the cavity opened on the surface.
- a plurality of ceramic packages having a cavity, first and second metallized layers, a brazing material, and a brazed metal frame on the front surface side of the package body, and having a cavity opened on the back surface of the package body. It is good also as a form.
- the width of the second metallized layer along the inner and outer directions in the corner portion of the frame-like surface in a plan view is a region excluding the corner portion in the plan view (straight line).
- the width is formed narrower than the width along the inner and outer directions at the side of the shape. Therefore, the thickness of the second metallized layer at the corner portion and the side portion excluding the corner portion is relatively uniform as compared with the case where the thickness is formed with the same width along the entire circumference of the surface as in Patent Document 1. Yes. Therefore, it becomes easy to join the metal frame that is brazed over the first and second metallization layers so as to be parallel to the surface of the package body.
- the thickness of the second metallized layer located in the corner portion is thinner than the thickness in the form in which the above-described conventional width is constant over the entire surface, so that the difference in thickness between the corner portion and the side portion is reduced. Is suppressed, and the thickness of the second metallized layer is made uniform at all corners and sides. Therefore, when the package body before firing (unfired) in which a plurality of green sheets are laminated at the time of manufacture, the situation where the surface of the corner portion is warped is suppressed.
- the cross-sectional shape of the space (space) in which the brazing material used for brazing the metal frame is disposed later is formed.
- the thickness is reduced and the shape becomes wider in the inner and outer directions.
- the brazing material for joining the metal frame to the space is arranged in almost the same amount as in the past, the metal frame can be joined with high brazing strength and no gap between the brazing materials.
- the band-shaped second metallized layer is formed along the surface of the first metallized layer in a region (side portion) excluding a corner portion of the frame-shaped surface in plan view.
- a circular third metallized layer having a circular shape in plan view and having a diameter smaller than the width of the band-shaped second metallized layer is formed apart from the adjacent band-shaped second metallized layer.
- the thickness of the circular third metallized layer located in the corner portion is smaller than the thickness in the form in which the conventional width is constant over the entire surface, so that the difference in thickness between the corner portion and the side portion is reduced.
- the thicknesses of the second and third metallized layers are made uniform at all corners and sides. Therefore, it is also possible to suppress a situation where the corner portion warps when firing an unfired package body in which a plurality of green sheets are laminated at the time of manufacture.
- a cross section of a space in which a brazing material used for brazing the metal frame later is disposed.
- the shape is thinner than the conventional one and is wider in the inner and outer directions. As a result, even when the brazing material for joining the metal frame to the space is disposed in the same amount as the conventional one, the metal frame can be joined by joining with a brazing material having high brazing strength and no gap. At the same time, it is possible to reduce the peeling of the ceramic near the surface due to the thermal stress generated by brazing the metal frame.
- the ceramic package of the third aspect between the outer surface of the brazing material and the surface of the first metallized layer located above the first metallized layer and outside the second metallized layer in the corner portion of the surface.
- the brazing material located outside the second metallized layer at the corner is thinner than the brazing material at the same position on the side and is longer along the inner and outer directions, and the first metallized layer and the metal frame Are joined together with a relatively high brazing strength.
- the metal frame can be flattened and firmly bonded to the surface of the package body, and the metal frame can be securely sealed by welding a metal lid or the like. Further, since the shortage of the flow of the molten brazing material to the corner portion can be suppressed, it becomes possible to prevent gap defects due to the lack of the brazing material over the entire circumference of the surface of the package body.
- the second metallized layer is formed at a position close to the end on the cavity side on the surface of the first metallized layer in a plan view, and at the corner part, the corner part is It is formed at a position closer to the end on the cavity side than the excluded region.
- the space where the brazing material used for brazing the metal frame later is disposed at a position above the first metallization layer and outside the second metallization layer.
- the cross-sectional shape of this is thinner than the conventional one and is wider in the inner and outer directions.
- the metal frame can be joined by joining the brazing material with high brazing strength and without any gap between the brazing materials. At the same time, it is possible to reliably prevent the peeling of the ceramic near the surface due to the thermal stress generated by brazing the metal frame.
- the bottom surface (ceiling surface) of the cavity that opens to the back surface has a cavity that opens to the front surface.
- An electronic component such as an IC chip that does not require sealing, such as a mounted crystal resonator, can be mounted.
- FIG. 4 is a partial enlarged cross-sectional view of a side portion taken along line XX in FIG. 1 and a partial cross-sectional view showing a third ceramic package in the same portion.
- FIG. 4 is a partially enlarged cross-sectional view of a corner portion taken along the line YY in FIG. 1 and a partial cross-sectional view showing a third ceramic package in the same portion.
- FIG. 1 is a plan view showing a first ceramic package 1 according to the present invention
- the left side of FIG. 2 is a partially enlarged sectional view of a side portion along the line XX in FIG. 1
- the left side of FIG. FIG. 2 is a partial enlarged cross-sectional view of a corner portion taken along the line YY in FIG.
- the first ceramic package 1 has a frame-like surface 3 in plan view and a back surface 4 that is rectangular (rectangular) in plan view. And a first metallized layer 11 and a second metallized layer 12 formed along the surface 3.
- the package body 2 is a box-shaped body including a plurality of ceramic layers made of a ceramic S such as alumina, for example, including four outer sides 5. Further, the cavity 6 has a rectangular shape in plan view, a bottom surface 7 sandwiching the four corners, a side surface 8 sandwiching the four corners, and a short side surface 8 located on the left side of FIG. It is comprised from a pair of base 9 which protrudes adjacently. On each upper surface of the pair of pedestals 9, electrodes (both not shown) connected to external terminals of electronic components such as a crystal resonator to be mounted later are formed. The electrode is made of, for example, W or Mo.
- the first metallized layer 11 is formed with a relatively uniform thickness over almost the entire surface 3.
- the second metallized layer 12 formed in a region (hereinafter referred to as a side part) excluding the four corners C on the surface 3 has a width w1 along the inside / outside direction of the package body 2 having the first metallized layer. 11 and a width w2 along the inner and outer direction of the second metallized layer 12a located at each corner C is narrower than the width w1.
- the width w2 of the second metallized layer 12a in the corner portion C is 20 to 80% of the width w1 of the second metallized layer in the side portion.
- the second metallized layer 12a in the corner portion C in plan view is formed in a pattern such that the outer curved surface is closer to the inner curved line in plan view than the second metallized layer 12 in the side portion.
- the second metallized layer 12 located on the side of the surface 3 is located outside the package main body 2 in the inner and outer directions of the first metallized layer 11 along the inner and outer directions of the package main body 2. It is formed at a position closer to the end on the side of the cavity 6 with a shorter distance L1 than the distance L2 to the end on the side surface 5 side.
- the second metallized layer 12 a located at the corner C of the surface 3 is located on the cavity 6 side in the inner and outer directions of the first metallized layer 11 along the inner and outer directions of the package body 2. At a position closer to the end on the cavity 6 side than the outer side surface 5 of the package body 2 so that the distance L3 to the end on the outer side surface 5 side of the package body 2 becomes larger than the distance L1 from the end portion. Is formed.
- the first and second metallized layers 11, 12, and 12a are also made of W or Mo, and on these surfaces (exposed surfaces), only the Ni plating film or both the Ni plating film and the Au plating film are formed. It is covered.
- the corner portion C includes two pieces that intersect with both ends of the rounded surface and are orthogonal to each other in a plan view located at each inner corner between the side surfaces 8 and 8 of the cavity 6. Indicates a region sandwiched between a pair of phantom lines along the inner and outer directions.
- first metallized layer 11 is formed on the frame-shaped surface 3 at a position slightly separated from the outer sides 5 of the four sides of the package body 2 because the plurality of ceramic packages 1 are adjacent vertically and horizontally in plan view.
- the brazing material described below disposed above the first and second metallized layers 11 and 12 of the adjacent ceramic packages 1 and 1 is provided with a metal frame on them. This is to prevent a problem that the brazing material is linked to each other in a cross-linked state when the solder is melted to join.
- the first and second metallizations 11 formed on the frame-like surface 3 and Ni-plated on the surface
- a brazing material preformed in the form of a sheet frame was placed over 12 and 12a, and after placing the metal frame 20 on the brazing material, the brazing material was heated and melted.
- the brazing material is made of, for example, Ag-15 wt% Cu brazing
- the metal frame 20 is made of, for example, Kovar, and has a rectangular frame shape in plan view.
- a third ceramic package 1b having 20 bonded thereto was obtained.
- a brazing material 16 having a longitudinally curved surface 17 having a similar cross section and facing the cavity 6 side is provided inside the second metallized layers 12 and 12a in the side portion of the surface 3 and the corner portion C, respectively. It was solidified in the space surrounded by the first and second metallized layers 11, 12, 12 a and the metal frame 20.
- the second metallized layers 12, 12 a and the first metallized layers 12, 12 a and the first metallized layers 12, 12 a are formed on the sides of the surface 3 and the corner C.
- the brazing material 14 surrounded by the surface 10 of the metallized layer 11 and the metal frame 20 and having a curved outer surface 15 that protrudes downward between the outermost part of the first metallized layer 11 and the outermost part of the metal frame 20 is solidified.
- the inclination angle ⁇ 2 formed between the surface 10 of the first metallized layer 11 in the brazing material 14 of the corner portion C and the tangent line s in contact with the outermost edge portion of the outer side surface 15 is determined by the soldering of the side portion.
- the inclination angle ⁇ ⁇ b> 1 formed between the surface 10 of the first metallized layer 11 in the material 14 and the tangent line s in contact with the outermost edge portion of the outer side surface 15 was lower.
- the reason why the inclination angle ⁇ 2 is lower than the inclination angle ⁇ 1 is that the width w2 of the second metallized layer 12a in the corner portion C is narrower than the width w1 of the second metallized layer 12 in the side portion, and 2 metallized layer 12a is formed closer to the cavity 6 side in the inner and outer direction of the surface 3 than the second metallized layer 12 at the side, and a relatively wide space is formed outside the second metallized layer 12a in the corner C. Because it was formed. In addition, outside the second metallized layer 12a of the corner portion C, the first metallized layer 11 protrudes outward from the outer surface of the metal frame 20 along the inner and outer directions longer than the side portions.
- a relatively thin brazing material 14 was formed on the surface 10 of the metallized layer 11 with an outer surface 15 inclined at a low level. As a result, the bonding strength between the first metallized layer 11 and the metal frame 20 by the brazing material 14 in the corner portion C can be increased, and the outer brazing material 14 is continuously formed without gaps on the entire circumference of the surface 3. I was able to.
- the surface 10 of the first metallized layer 11 is an imaginary line parallel to the surface 3 of the package body 2. Further, the outermost thin portion of the brazing material 14 including the outer surface 15 is called a so-called fillet.
- the second metallized layers 12 and 12a have the width w2 along the inner and outer directions in the corner portion C of the frame-like surface 3 in plan view, and the inner and outer sides at the side portions. Since it is narrower than the width w1 along the direction, the thicknesses of the second metallized layers 12 and 12a at the corner portion C and the side portion are relatively uniform. As a result, the metal frame 20 to be brazed over the first and second metallized layers 11 and 12 can be joined so as to be parallel to the surface 3 of the package body 2.
- the thickness of the second metallized layer 12a of the corner portion C is thinner than the conventional form in which the width is constant over the entire surface, the difference in thickness between the corner portion C and the side portion can be suppressed.
- the thickness of the layers 12, 12 a is made uniform over the entire surface 3. Therefore, the situation where the vicinity of the surface 3 of the corner portion C warps when the unfired package body in which a plurality of green sheets are laminated at the time of manufacture is also suppressed.
- the shape of the space in which the brazing material 14 for brazing the metal frame 20 is disposed is thinner than before and slightly in the inner and outer directions.
- the metal frame 20 can be joined without a gap of the brazing material 14 with high brazing strength, It is also possible to reduce the peeling of the ceramic S in the vicinity of the surface 3 due to the thermal stress accompanying the brazing.
- the brazing material 14 positioned outside the second metallized layer 12a at the corner portion C is: As shown by the relationship of the inclination angle ( ⁇ 2 ⁇ 1), the first metallized layer 11 and the metal frame 20 are thinner than the brazing material 14 at the same position on the side and long in the inner and outer directions. Bonded with relatively high brazing strength. Therefore, the metal frame 20 can be flattened and bonded to the surface 3 of the package body 2, and sealing such as welding of a metal lid to the metal frame 20 can be reliably performed.
- the shortage of the flow due to the melting of the brazing material 14 can be suppressed outside the second metallized layer 12a in the corner portion C, the insufficient filling due to the lack of the brazing material can be prevented along the entire circumference of the surface 3 of the package body 2. .
- first ceramic package 1a having a different form from the package 1, and a third ceramic package 1c having a different form in which the metal frame 20 is brazed and joined to the package 1a in the same manner as described above.
- the first metallized layer 11 is formed on the entire side of the surface 3 of the package body 2, and the surface 10 of the first metallized layer 11 on the side is formed.
- the second metallized layer 12 having the same width w1 as described above places the same short distance L1 as the end portion on the cavity 6 side and a long distance L4 to the end portion of the outer surface 5 of the package body 2. Is formed.
- the first ceramic package 1 a has the first metallized layer 11 formed on the entire surface of the corner portion C on the surface 3 of the package body 2, and the first metallized layer of the corner portion C is formed.
- the second metallized layer 12a having the same width w1 as described above is placed at a short distance L1 from the end on the cavity 6 side, and further longer to the end of the outer surface 5 of the package body 2. It is formed with a distance L5.
- the first ceramic package 1a as described above can achieve the same effects as the package 1.
- the ceramic package 1a With respect to the ceramic package 1a, as shown on the right side of FIG. 4 and FIG. 5, above the first and second metallizations 11, 12, 12a formed on the frame-like surface 3 and Ni-plated on the surface. A preformed brazing material was placed across the metal, and after placing the metal frame 20 on the brazing material, the brazing material was heated and melted. As a result, as shown on the right side of FIGS. 4 and 5, the plan view is a rectangular frame above the first metallized layer 11 and the brazing materials 14 and 16 outside and inside the second metallized layers 12 and 12a. The 3rd ceramic package 1c of the different form which joined the metal-shaped metal frame 20 was able to be obtained. That is, as shown on the right side of FIGS.
- the second metallized layers 12, 12 a and the first metallized layers are formed on the sides of the surface 3 and the outer peripheral side of the second metallized layers 12, 12 a at the corner C.
- 11 is surrounded by the surface 10 and the metal frame 20, and is curved outwardly protruding outwardly between the outermost part of the first metallized layer 11 and the outermost part of the metal frame 20, or the outer surface 15b bent in the middle.
- the brazing material 14 having solidified.
- the inclination angle ⁇ 4 formed between the surface 10 of the first metallized layer 11 in the brazing material 14 of the corner portion C and the tangent line s in contact with the outermost edge portion of the outer side surface 15 is the first metallization in the brazing material 14 at the side portion.
- the inclination angle ⁇ 3 formed between the surface 10 of the layer 11 and the tangent s in contact with the outermost edge portion of the outer side surface 15 is lower ( ⁇ 3> ⁇ 4), and the reason is the same as described above.
- the third ceramic package 1c as described above can provide the same effects as the package 1b.
- FIG. 6 is a partial plan view showing the second metallized layer 12b in a different form in the corner portion C of the first ceramic package 1.
- FIG. That is, as shown in FIG. 6, on the first metallized layer 11 formed on almost the entire surface of the frame-like surface 3 in the package body 2 and the position close to the end on the cavity 6 side in the inner and outer directions of the surface 3
- a band-shaped second metallized layer 12 is formed for each side along the second metallized layer 12b of the corner portion C, and adjacent two second metallized layers 12 are connected at right angles.
- An arcuate recess 18 is formed on the outside of the connecting portion in plan view.
- FIG. 7 is a partial plan view showing a second metallized layer 12 c in a different form in the corner portion C of the first ceramic package 1. That is, as shown in FIG. 7, a band-shaped first portion is formed for each side portion on the first metallized layer 11 formed on the surface 3 in the same manner as described above and along the position close to the end portion on the cavity 6 side in the inner and outer directions. Two metallized layers 12 are formed, and two second metallized layers 12 adjacent to each other in a plan view are connected to the second metallized layer 12c of the corner portion C at a right angle. A chamfer 19 intersecting at an angle of about 45 degrees is formed.
- FIG. 8 is a partial plan view showing the second metallized layer 12d having a different form in the corner portion C of the first ceramic package 1.
- FIG. That is, as shown in FIG. 8, the second band-shaped second on each side along the position on the first metallized layer 11 formed on the surface 3 in the same manner as described above and toward the end on the cavity 6 side in the inner and outer directions.
- Two metallization layers 12 adjacent to each other in a plan view are connected to the second metallization layer 12d of the corner portion C at a right angle, and the same chamfer 19 and the chamfer 19 are formed outside the connection portion.
- a convex portion 22 that protrudes small in an arc shape from the middle to the outside and curves in parallel with the inner peripheral side is formed.
- the second metallized layers 12b, 12c, and 12d of the corner portion C as described above are also narrower in the inner and outer directions of the surface 3 than the width w1 in the inner and outer directions of the second metallized layer 12 of the side portion.
- the thickness of the second metallized layers 12, 12b to 12d along the entire circumference is relatively uniform as compared with the case where the entire circumference is formed with the same width.
- the metal frame 20 is connected to the brazing members 14 and 16 through the brazing members 14 and 16, respectively.
- FIG. 9 is a plan view showing a second ceramic package 1d according to the present invention.
- the second ceramic package 1 d includes a package body 2 similar to the above, a first metallized layer 11 formed on the surface 3 having a frame shape in plan view, and a corner of the surface 3.
- the strip-shaped second metallization layer 12 formed in parallel to the end on the cavity 6 side in the longitudinal direction and inward and outward directions on the first metallization layer 11 for each side excluding the part C, and each corner of the surface 3
- a third metallized layer 24 is formed on the first metallized layer 11 for each part C, and is circular in plan view and separated from each adjacent band-shaped second metallized layer 12.
- the diameter d of the circular third metallized layer 24 is set to be smaller than the width w1 along the inner and outer directions of the band-shaped second metallized layer 12. Specifically, the diameter d of the circular third metallized layer 24 in the corner portion C is 20 to 80% of the width w1 of the second metallized layer 12 in the side portion.
- the gap between the circular third metallized layer 24 and each adjacent band-shaped second metallized layer 12 has an appropriate amount in the corner C at least in the range of the diameter d and not more than 3 times the diameter d. This is desirable in terms of ensuring fluidity along the inner and outer directions of the brazing material.
- the center of the circular third metallized layer 24 is located near the position where the virtual extension lines extending the inner side surfaces of the pair of orthogonally adjacent strip-shaped second metallized layers 12 intersect each other. It is desirable from the viewpoint and the width of the brazing material 16 used on the outside.
- the second ceramic package 1d as described above is mounted on the frame-shaped surface 3 above the first metallized layer 11, the band-shaped second metallized layer 12, and the circular third metallized layer 24 as described above.
- a metal frame 20 similar to the above was placed through the brazing material, and the brazing material was melted and solidified.
- it is individually located outside the second and third metallized layers 12 and 24 in the side portion or corner portion C, and the same as described above.
- a third ceramic package similar to that described above including the brazing material 14 having the outer surfaces 15, 15a and 15b having the inclination angles ⁇ 1 to ⁇ 4 could be obtained.
- the thickness of the circular third metallized layer 24 in the corner portion C and the band-shaped second metallized layer 12 in the side portion is relatively uniform.
- the metal frame 20 that is brazed over the second and third metallization layers 11, 12, and 24 can be reliably bonded so as to be parallel to the surface 3 of the package body 2.
- the thickness of the circular third metallized layer 24 located at the corner portion C is smaller than that of the conventional configuration in which the width is constant over the entire surface, and the difference in thickness between the corner portion C and the side portion can be suppressed. Therefore, the thicknesses of the second and third metallized layers 12 and 24 are made uniform over the entire surface 3 of the package body 2.
- Three or more circular third metallized layers 24 may be provided in the same corner portion C so as to be separated from each other.
- the third metallized layer 24 has an elliptical shape in plan view in which the major axis is along the shortest distance between the ends of the pair of second metallized layers 12 and 12 adjacent to each other and the minor axis is in the inner and outer directions.
- An elliptical shape may be used.
- FIG. 10 is a plan view showing a ceramic package 30 which is an application form of the first ceramic package 1.
- the ceramic package 30 is made of the same ceramic as described above, and has a package body 32 having an oblong surface 33 and a back surface 34 in plan view, and an oblong frame-shaped surface 33 in plan view.
- a cavity 36 having an oval shape in plan view, a first metallized layer 41 formed almost on the entire surface 33, and formed on the first metallized layer 41 and along the cavity 36 side.
- the second metallized layers 42 and 42a having a narrow width are provided.
- the cavity 36 includes a bottom surface 37 having an oval shape in plan view, and long cylindrical side surfaces 38 and 39 erected from the periphery of the bottom surface 37.
- FIG. 10 is a plan view showing a ceramic package 30 which is an application form of the first ceramic package 1.
- the ceramic package 30 is made of the same ceramic as described above, and has a package body 32 having an oblong surface 33 and a back surface 34 in
- a pair of left and right side surfaces 39 having a semicircular shape in plan view is located between the pair of upper and lower flat side surfaces 38, and two corner portions along the inner and outer directions including the side surfaces 39 are located.
- C is continuous.
- a light emitting element mounting portion 40 is located at the center of the bottom surface 37.
- the package body 32 also has a pair of flat outer surfaces 35 and a pair of semi-cylindrical outer surfaces 35r.
- the side portions on the first metallized layer 41 formed on the oblong frame-shaped surface 33 in a plan view are band-shaped closer to the end portion on the cavity 36 side than the outer surface 35.
- the second metallized layer 42 having a relatively wide width is formed, and the left and right corner portions C, C are semicircular and closer to the side surface 39 of the cavity 36 than the outer side surface 35r, and the second metallized layer 42 is formed.
- a second metallized layer 42a having a narrower width is formed.
- a hypotenuse 43 corresponding to the difference between the two widths is located outside the second metallized layers 42 and 42a.
- the first metallized layer 41 and the second metallized layers 42 and 42a are also made of W or Mo as described above.
- the same effects as those of the first ceramic package 1 and 1a can be obtained.
- a light emitting element such as a light emitting diode
- the surfaces (exposed surfaces) of the first and second metallized layers 41, 42, and 42a are covered with only the Ni plating film or both the Ni plating film and the Au plating film as described above.
- a metal frame having an oval frame in plan view is joined to the first and second metallized layers 41, 42, and 42a via the same brazing material as described above.
- FIG. 11 is a vertical cross-sectional view showing a ceramic package 1 e which is a different application form of the first ceramic package 1.
- the package 1 e includes a package body 2 a provided with a cavity 6 that opens symmetrically on the back surface 4 in addition to the cavity 6 that opens on the same surface 3.
- a ceramic partition plate 4a is located between the bottom surfaces 7, 7 of the pair of cavities 6, 6, and a via conductor (not shown) passes therethrough.
- an electronic component such as an IC chip that does not require sealing on the bottom surface 7 of the cavity 6 opened on the back surface 4 side.
- the same cavity 36 as the cavity 36 opened in the front surface 33 may be formed symmetrically on the back surface 34 of the ceramic package 30.
- the ceramic constituting the package body may be a high-temperature fired ceramic such as mullite or aluminum nitride, or a glass-ceramic which is a kind of low-temperature fired ceramic, in addition to the alumina.
- the ceramic is made of a low-temperature fired ceramic, Ag or Cu is applied to the conductors such as the first and second metallized layers.
- the ceramic package 30 having the package body 32 including the front surface 33 and the back surface 34 having an oval shape in plan view on the first metallized layers 41 of two continuous corner portions C having a semicircular shape in plan view.
- the ceramic packages 1, 1a to 1d may have a multi-cavity configuration in which a plurality of ceramic packages 1, 1a to 1d are provided side by side in a plan view.
- a ceramic package having a cavity in which an electronic component such as a piezoelectric element is mounted, a metal frame can be joined flatly around the opening, and the opening can be sealed reliably can be provided.
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Abstract
Description
即ち、本発明による第1のセラミックパッケージ(請求項1)は、表面および裏面を有し、該表面に開口するキャビティを有するセラミック製のパッケージ本体と、平面視が枠状の上記表面に形成された第1メタライズ層、および該第1メタライズ層の表面に枠状に形成され且つパッケージ本体の内外方向に沿った幅が該第1メタライズ層の幅より狭い第2メタライズ層と、を備えたセラミックパッケージであって、平面視で上記表面のコーナ部における上記第2メタライズ層の上記内外方向に沿った幅は、平面視で上記コーナ部を除いた領域における上記第2メタライズ層の上記内外方向に沿った幅よりも狭い、ことを特徴とする。
また、前記表面のコーナ部とは、平面視が矩形状を呈するキャビティの側面における内隅ごと位置する平面視でアール面の両端と交差し且つ互いに直交する2本の内外方向に沿った一対の仮想線に挟まれた領域を指す。換言すると、コーナ部を除いた領域とは、コーナ部を含まないパッケージ本体の表面(辺部)を指す。
あるいは、前記パッケージ本体およびキャビティが平面視で長円形状を呈する形態におけるコーナ部は、対抗する一対の直線状の辺部を除いた一対の半円形部分における平面視で円形の4分の1である扇形状の領域を指す。
更に、前記内外方向とは、前記パッケージ本体の平面視において、キャビティの中央部と該キャビティの開口部を囲む前記枠状の表面とを結ぶ放射方向である。
更に、前記第1のセラミックパッケージにおいて、コーナ部における第2メタライズ層の幅は、辺部における第2メタライズ層の幅の20~80%である。
また、前記第1および第2メタライズ層の表面(露出面)には、Niメッキ膜ないしAuメッキ膜が被覆されている。
加えて、前記第1のセラミックパッケージは、複数の該パッケージを平面視で縦横に隣接して併設された多数個取りの形態としても良い。
加えて、前記第2のセラミックパッケージも、複数の該パッケージを平面視で縦横に隣接して併設された多数個取りの形態としても良い。
また、前記第3のセラミックパッケージにおいて、各コーナ部における前記ロウ材の外側面は、側面視で下向きに凸の湾曲面(通称フィレット)である。これに対し、辺部における前記ロウ材の外側面は、側面視で上向きに凸あるいは下向きに凸の湾曲面の何れかとなる。該外側面は、その上端部が前第2メタライズ層の外側面にまで達していたり、垂直断面の中間で屈曲した形態であっても良い。
更に、前記金属枠(リング型金具)は、例えば、コバール(Fe-29wt%Ni-17wt%Co)、42アロイ(Fe-42wt%Ni)、あるいは194合金(Cu-2.3wt%Fe-0.03wt%P)が適用される。更に、前記ロウ材には、例えば、Agロウ(Ag-15wt%Cu)が用いられる。
加えて、前記第1メタライズ層の表面は、前記傾斜角度を決定するための架空の水平面であり、且つ第2メタライズ層の外側に位置する前記ロウ材の外側面は、該外側面の外端縁から内外方向で且つ斜め上向きに沿った架空の接線である。
更に、コーナ部に位置する第2メタライズ層の厚みが、前述した従来の幅を表面全体で一定とした形態での厚みに比べて薄くなることで、該コーナ部と辺部との厚みの差が抑えられ、第2メタライズ層の厚みが全てのコーナ部と辺部との双方で均一化されている。そのため、製造時において複数のグリーンシートを積層した焼成前(未焼成)のパッケージ本体を焼成する際に、コーナ部の表面が反り上がる事態が抑制されている。
しかも、前記コーナ部では、第1メタライズ層の上側で且つ第2メタライズ層の外側の位置では、追って金属枠をロウ付けするために用いるロウ材が配設される空間(スペース)の断面形状が、従来に比べて厚みが薄くなり且つ内外方向で広くなった形状になっている。その結果、上記空間に金属枠を接合するためのロウ材を従来とほぼ同量で配設した場合でも、金属枠を高いロウ付け強度で且つ該ロウ材の隙間ない接合により金属枠を接合できると共に、上記ロウ付けに伴って生じる熱応力による表面付近のセラミックの剥離を低減することも可能となる。
更に、コーナ部に位置する円形の第3メタライズ層の厚みが、従来の幅を表面全体で一定とした形態での厚みに比べて薄くなることで、該コーナ部と辺部との厚みの差が抑えられ、第2および第3メタライズ層の厚みが全てのコーナ部と辺部との双方において均一化にされている。そのため、製造時において複数のグリーンシートを積層した未焼成のパッケージ本体を焼成する際に、コーナ部が反り上がる事態を抑制することも可能となる。
しかも、前記コーナ部では、第1メタライズ層の上側で且つ円形の第3メタライズ層の外側の位置では、追って金属枠をロウ付けするために用いるロウ材が配設される空間(スペース)の断面形状が、従来に比べ厚みが薄くなり且つ内外方向では広くなった形状になっている。その結果、上記空間に金属枠を接合するためのロウ材を従来と同量で配設した場合でも、金属枠を高いロウ付け強度で且つ隙間のないロウ材で接合によって該金属枠を接合できると共に、該金属枠のロウ付けにより生じる熱応力による表面付近のセラミックの剥離を低減することも可能となる。
図1は、本発明による第1のセラミックパッケージ1を示す平面図、図2の左側は、図1中のX-X線の矢視に沿った辺部分の部分拡大断面図、図3の左側は、図1中のY-Y線の矢視に沿ったコーナ部の部分拡大断面図である。
第1のセラミックパッケージ1は、図1~図3に示すように、平面視が枠状の表面3および平面視が長方形(矩形)の裏面4を有し、該表面3に開口するキャビティ6を有するパッケージ本体2と、上記表面3に沿って形成された第1メタライズ層11および第2メタライズ層12とを備えている。
上記パッケージ本体2は、四辺の外側面5を含み、例えば、アルミナなどのセラミックSからなる複数のセラミック層を積層した箱状体である。また、前記キャビティ6は、平面視が長方形状で四隅のアール辺を挟んだ底面7と、四隅のアール面を挟んだ4つの側面8と、図1の左側に位置する短辺の側面8に隣接して突出する一対の台座9とから構成されている。該一対の台座9の上面ごとには、追って実装される水晶振動子などの電子部品の外部端子と接続される電極(何れも図示せず)が形成されている。該電極は、例えば、WまたはMoなどからなる。
一方、表面3における4箇所のコーナ部Cを除いた領域(以下、辺部とする)に形成された第2メタライズ層12は、パッケージ本体2の内外方向に沿った幅w1が第1メタライズ層11よりも狭く、且つコーナ部Cごとに位置する第2メタライズ層12aの内外方向に沿った幅w2は、上記幅w1よりも狭くなっている。具体的には、コーナ部Cにおける第2メタライズ層12aの幅w2は、辺部における第2メタライズ層の幅w1の20~80%である。平面視でコーナ部Cの第2メタライズ層12aは、辺部の第2メタライズ層12に比べ、平面視で内側の曲線に対し、外側の曲面が一層接近するようなパターンで形成されている。
また、図3の左側に示すように、表面3のコーナ部Cに位置する第2メタライズ層12aは、パッケージ本体2の内外方向に沿った第1メタライズ層11の内外方向において、キャビティ6側の端部からの距離L1よりも、パッケージ本体2の外側面5側の端部までの距離L3が大きくなるように、パッケージ本体2の外側面5よりもキャビティ6側の端部に寄った位置に形成されている。
更に、第1メタライズ層11には、パッケージ本体2のうち、キャビティ6を囲む側壁の少なくとも1つを垂直方向に沿って貫通するビア導体の一端が接続され、該ビア導体は、前記台座9の各端子とも導通している裏面4側の外部端子(何れも図示せず)と電気的に接続されている。
加えて、前記枠状の表面3において、第1メタライズ層11をパッケージ本体2における四辺の外側面5から若干離した位置に形成したのは、複数のセラミックパッケージ1を平面視で縦横に隣接して配置する多数個取りの形態とした場合において、隣接するセラミックパッケージ1,1の第1および第2メタライズ層11,12の上方に配設する次述するロウ材を、それらの上に金属枠を接合すべく溶融した際に、該ロウ材が架橋状に互いに連なる不具合を予防するためである。
その結果、図示のように、第1メタライズ層11の上側で且つ第2メタライズ層12,12aの外側および内側のロウ材14,16を介して、平面視が矩形枠状の金属枠(リング)20を接合した第3のセラミックパッケージ1bを得ることができた。そのうち、表面3の辺部およびコーナ部Cにおける第2メタライズ層12,12aの内側には、それぞれ同様な断面を備え且つキャビティ6側に面した縦長の湾曲面17を有するロウ材16が、第1および第2メタライズ層11,12,12aと金属枠20と囲まれた空間で凝固していた。
そして、図示のように、コーナ部Cのロウ材14における第1メタライズ層11の表面10と外側面15の最外縁部にて接する接線sとの間でなす傾斜角度θ2は、辺部のロウ材14における第1メタライズ層11の表面10と外側面15の最外縁部にて接する接線sとの間でなす傾斜角度θ1よりも低くなっていた。
その結果、コーナ部Cにおけるロウ材14による第1メタライズ層11と金属枠20との接合強度を高くできると共に、表面3の全周において、外側のロウ材14を隙間なく連続して形成することもできた。
尚、第1メタライズ層11の前記表面10は、パッケージ本体2の表面3と平行な仮想線である。また、外側面15を含むロウ材14の最外側の薄肉部分は、いわゆるフィレットと称されている。
更に、コーナ部Cの第2メタライズ層12aの厚みが従来の幅を表面全体で一定とした形態に比べて薄くなり、コーナ部Cと辺部との厚みの差が抑えられるので、第2メタライス層12,12aの厚みが表面3の全体で均一化されている。そのため、製造時において複数のグリーンシートを積層した未焼成のパッケージ本体を焼成する際に、コーナ部Cの表面3付近が反り上がる事態も抑制されている。
しかも、前記コーナ部Cにおける第2メタライズ層12aの外側の位置では、追って金属枠20をロウ付けするためのロウ材14を配設する空間の形状が、従来に比べ薄くなり且つ内外方向で若干広くなるので、上記空間に金属枠20を接合するためのロウ材14を従来とほぼ同量で配設した場合でも、金属枠20を高いロウ付け強度によりロウ材14の隙間なく接合できると共に、該ロウ付けに伴う熱応力による表面3付近のセラミックSの剥離を低減することも可能となる。
図4の左側に示すように、第1のセラミックパッケージ1aは、パッケージ本体2の表面3における辺部の全面に第1メタライズ層11が形成され、該辺部の第1メタライズ層11の表面10上には、前記と同じ幅w1である第2メタライズ層12がキャビティ6側の端部と前記と同じ短い距離L1を置くと共に、パッケージ本体2の外側面5の端部までの長い距離L4を置いて形成されている。
また、図5の左側に示すように、第1のセラミックパッケージ1aは、パッケージ本体2の表面3におけるコーナ部Cの全面にも第1メタライズ層11が形成され、該コーナ部Cの第1メタライズ層11の表面10上には、前記と同じ幅w1である第2メタライズ層12aがキャビティ6側の端部と短い距離L1を置くと共に、パッケージ本体2の外側面5の端部までの更に長い距離L5を置いて形成されている。以上のような第1セラミックパッケージ1aによっても、前記パッケージ1と同様の効果を奏することが可能である。
その結果、図4,図5の右側に示すように、第1メタライズ層11の上側で且つ第2メタライズ層12,12aの外側および内側のロウ材14,16を介して、平面視が矩形枠状の金属枠20を接合した異なる形態の第3のセラミックパッケージ1cを得ることができた。即ち、図4,図5の右側に示すように、表面3の辺部およびコーナ部Cにおける第2メタライズ層12,12aの外周側には、該第2メタライズ層12,12aと第1メタライズ層11の表面10と金属枠20とに囲まれ、第1メタライズ層11の最外部と金属枠20の最外部との間に下向きに凸の湾曲した外側面15a、あるいは中間で屈曲した外側面15bを有するロウ材14が凝固していた。
更に、コーナ部Cのロウ材14における第1メタライズ層11の表面10と外側面15の最外縁部において接する接線sとの間でなす傾斜角度θ4は、辺部のロウ材14における第1メタライズ層11の表面10と外側面15の最外縁部において接する接線sとの間でなす傾斜角度θ3よりも低くなって(θ3>θ4)おり、その理由は前記と同様であった。以上のような第3セラミックパッケージ1cによっても、前記パッケージ1bと同様の効果を奏することが可能である。
即ち、図7に示すように、表面3に前記同様に形成された第1メタライズ層11の上で且つ内外方向でキャビティ6側の端部に寄った位置に沿って辺部ごとに帯状の第2メタライズ層12が形成され、且つコーナ部Cの第2メタライズ層12cには、平面視で隣接する2つの第2メタライズ層12が直角に接続されると共に、該接続部分の外側には平面視で斜め約45度で交差する面取り19が形成されている。
即ち、図8に示すように、表面3に前記同様に形成された第1メタライズ層11の上で且つ内外方向でキャビティ6側の端部に寄った位置に沿って辺ごとに帯状の第2メタライズ層12が形成され、且つコーナ部Cの第2メタライズ層12dには、平面視で隣接する2つの第2メタライズ層12が直角に接続され、かかる接続部分の外側に前記同様の面取り19とその中間から外側に円弧形で小さく突出し且つ内周側と平行に湾曲する凸部22が形成されている。
その結果、コーナCに前記第2メタライズ層12aを形成した前記第1のセラミックパッケージ1と同様な効果を奏することが可能であると共に、前記金属枠20を前記ロウ材14,16を介して各メタライズ層1,12上に接合することで、前記第3のセラミックパッケージ1b,1cと同様な効果を奏し得る。
該第2のセラミックパッケージ1dは、図9に示すように、前記同様のパッケージ本体2と、平面視が枠状の表面3に前記同様に形成された第1メタライズ層11と、表面3のコーナ部Cを除く辺部ごとの第1メタライズ層11上の長手方向で且つ内外方向でキャビティ6側の端部に寄って平行に形成された帯状の第2メタライズ層12と、表面3の各コーナ部Cごとの第1メタライズ層11の上に形成され且つ隣接する各帯状の第2メタライズ層12と離隔した平面視が円形の第3メタライズ層24と、を備えている。
上記円形の第3メタライズ層24の直径dは、帯状の第2メタライズ層12の内外方向に沿った幅w1よりも小さく設定されている。具体的には、コーナ部Cにおける円形の第3メタライズ層24の直径dは、辺部における第2メタライズ層12の幅w1の20~80%である。
前記のような第2のセラミックパッケージ1dに対して、枠状の表面3における第1メタライズ層11、帯状の第2メタライズ層12、および円形の第3メタライズ層24の上方に載置した前記同様のロウ材を介して前記同様の金属枠20を配置し、且つ該ロウ材を溶融および凝固させた。
その結果、前記図2~図5の各右側に示したのと同様に、辺部あるいはコーナ部Cにおける前記第2、第3メタライズ層12,24の外側に個別に位置し、且つ前記同様の傾斜角度θ1~θ4の外側面15,15a,15bを有するロウ材14を含む前記同様の第3のセラミックパッケージを得ることができた。
更に、コーナ部Cに位置する円形の第3メタライズ層24の厚みが、従来の幅を表面全体で一定とした形態に比べて薄くなり、コーナ部Cと辺部との厚みの差が抑えられるので、パッケージ本体2の表面3全体で第2および第3メタライズ層12,24の厚みが均一化されている。そのため、製造時において複数のグリーンシートを積層した未焼成のパッケージ本体を焼成する際に、コーナ部Cが反り上がる事態を抑制することも可能となる。
しかも、コーナ部Cの第2メタライズ層の外側では、追って金属枠20を接合するロウ材14の配設空間の形状が、内外方向において広くなるため、該空間に金属枠20を接合するためのロウ材14を従来とほぼ同量で薄くして配設した場合でも、金属枠20を高いロウ付け強度を持つロウ材14により隙間なく接合できると共に、該ロウ付けに伴う熱応力による表面3付近のセラミックSの剥離を低減することも可能となる。
尚、前記円形の第3メタライズ層24は、同じコーナ部Cに2個以上を互いに離隔して併設しても良い。また、第3メタライズ層24は、長径が隣接する一対の第2メタライズ層12,12の端部間の最短距離に沿っており且つ短径が内外方向に沿っている平面視が長円形状あるいは楕円形状の形態としても良い。
上記キャビティ36は、平面視が長円形状の底面37と、該底面37の周辺から立設する長円筒形状の側面38,39とからなる。図10で上下一対の平坦な側面38,38間には、平面視が半円形状を呈する左右一対の側面39が位置しており、該側面39を含む内外方向に沿って2箇所のコーナ部Cが連続している。上記底面37の中央部には、例えば、発光素子の搭載部40が位置している。
尚、前記パッケージ本体32は、一対の平坦な外側面35と一対の半円筒形状の外側面35rも有している。
尚、前記第1および第2メタライズ層41,42,42aの表面(露出面)には、前記同様にNiメッキ膜のみ、あるいはNiメッキ膜とAuメッキ膜との双方が被覆されている。また、該第1および第2メタライズ層41,42,42aの上方には、前記同様のロウ材を介して、平面視で長円形状の枠体を呈する金属枠が追って接合される。
尚、一対のキャビティ6,6の底面7,7間には、セラミックの仕切版4aが位置し、且つ図示しないビア導体が貫通している。
以上のようなセラミックパッケージ1cによれば、裏面4側に開口するキャビティ6の底面7に封止を必要としないICチップなどの電子部品を更に実装することが可能となる。
尚、前記セラミックパッケージ30の裏面34にも、表面33に開口するキャビティ36と同じキャビティ36を対称に形成した形態としても良い。
例えば、前記パッケージ本体を構成するセラミックは、前記アルミナのほか、ムライトや窒化アルミニウムなどの高温焼成セラミックとしたり、低温焼成セラミックの一種であるガラス-セラミックとしても良い。
また、前記セラミックが低温焼成セラミックからなる場合、前記第1および第2メタライズ層などの導体には、AgあるいはCuが適用される。
更に、平面視が長円形状の表面33および裏面34を含むパッケージ本体32を有する前記セラミックパッケージ30において、平面視が半円形を呈する2つの連続するコーナ部Cの第1メタライズ層41の上に、平面視が円形、長円形、あるいは楕円形を呈し且つ互いに離隔する複数の第2メタライズ層を配設した形態としても良い。
加えて、前記セラミックパッケージ1,1a~1dは、平面視で縦横に複数個が併設されている多数個取りの形態とされていても良い。
1b,1c…………………第3のセラミックパッケージ
1d…………………………第2のセラミックパッケージ
2,2a,32……………パッケージ本体
3,33……………………表面
4,34……………………裏面
5,35……………………外側面
6,36……………………キャビティ
10…………………………第1メタライズ層の表面
11,41…………………第1メタライズ層
12,42…………………辺部の第2メタライズ層
12a~12c,42a…コーナ部の第2メタライズ層
14…………………………ロウ材
15,15a,15b……ロウ材の外側面
20…………………………金属枠
24…………………………コーナ部の第3メタライズ層
S……………………………セラミック
C……………………………コーナ部
w1,w2…………………幅
θ1,θ2…………………傾斜角度
d……………………………直径
Claims (5)
- 表面および裏面を有し、該表面に開口するキャビティを有するセラミック製のパッケージ本体と、
平面視が枠状の上記表面に形成された第1メタライズ層、および該第1メタライズ層の表面に枠状に形成され且つパッケージ本体の内外方向に沿った幅が該第1メタライズ層の幅より狭い第2メタライズ層と、を備えたセラミックパッケージであって、
平面視で上記表面のコーナ部における上記第2メタライズ層の上記内外方向に沿った幅は、平面視で上記コーナ部を除いた領域における上記第2メタライズ層の上記内外方向に沿った幅よりも狭い、
ことを特徴とするセラミックパッケージ。 - 表面および裏面を有し、該表面に開口するキャビティを有するセラミック製のパッケージ本体と、
平面視が枠状の上記表面に形成された第1メタライズ層、該第1メタライズ層の表面における各コーナ部を除く領域に帯状に形成され且つパッケージ本体の内外方向に沿った幅が該第1メタライズ層の幅より狭い帯状の第2メタライズ層、および各コーナ部に形成され且つ隣接する上記帯状の第2メタライズ層と離隔した平面視が円形の第3メタライズ層と、を備えたセラミックパッケージであって、
平面視における上記円形の第3メタライズ層の直径は、上記帯状の第2メタライズ層の内外方向に沿った幅よりも小さい、
ことを特徴とするセラミックパッケージ。 - 表面および裏面を有し、該表面に開口するキャビティを有するセラミック製のパッケージ本体と、
平面視が枠状の上記表面に形成された第1メタライズ層、および該第1メタライズ層の表面に枠状に形成され且つパッケージ本体の内外方向に沿った幅が該第1メタライズ層の幅より狭い第2メタライズと、
上記第1メタライズ層および第2メタライズ層の上方にロウ材を介して接合された金属枠と、を備えたセラミックパッケージであって、
平面視で上記表面のコーナ部における上記第1メタライズ層の上側で且つ第2メタライズ層の外側に位置する上記ロウ材の外側面と上記第1メタライズ層の表面との間でなす傾斜角度は、平面視で上記コーナ部を除いた表面における上記第1メタライズ層の上側で且つ第2メタライズ層の外側に位置する上記ロウ材の外側面と上記第1メタライズ層の表面との間でなす傾斜角度よりも低い、
ことを特徴とするセラミックパッケージ。 - 前記第2メタライズ層は、前記第1メタライズ層の表面において、前記パッケージ本体の内外方向で、該パッケージ本体における第1メタライズ層の外側面側の端部よりも前記キャビティ側の端部に寄った位置に形成されていると共に、
上記第2メタライズ層のコーナ部における上記内外方向の位置は、上記表面のコーナ部を除いた領域における上記第2メタライズ層の上記内外方向の位置よりも上記キャビティ側の端部に寄った位置に形成されている、
ことを特徴とする請求項1乃至3の何れか一項に記載のセラミックパッケージ。 - 前記パッケージ本体は、前記裏面にも前記同様のキャビティを前記表面に開口する前記キャビティと対称に有している、
ことを特徴とする請求項1乃至4の何れか一項に記載のセラミックパッケージ。
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- 2012-12-20 KR KR1020147016450A patent/KR101630547B1/ko active IP Right Grant
- 2012-12-20 CN CN201280056761.8A patent/CN103959461B/zh not_active Expired - Fee Related
- 2012-12-20 US US14/360,143 patent/US9412676B2/en active Active
- 2012-12-20 WO PCT/JP2012/008151 patent/WO2013099167A1/ja active Application Filing
- 2012-12-26 TW TW101149965A patent/TWI523288B/zh not_active IP Right Cessation
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FR3019375A1 (fr) * | 2014-03-31 | 2015-10-02 | Commissariat Energie Atomique | Procede de realisation d'un boitier hermetique destine a l'encapsulation d'un dispositif implantable et boitier correspondant |
EP2926865A1 (fr) * | 2014-03-31 | 2015-10-07 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d'un boitier hermetique destine a l'encapsulation d'un dispositif implantable et boitier correspondant |
US9387336B2 (en) | 2014-03-31 | 2016-07-12 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for producing a hermetically sealed casing intended for encapsulating an implantable device, and corresponding casing |
Also Published As
Publication number | Publication date |
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CN103959461B (zh) | 2016-08-17 |
US20140319982A1 (en) | 2014-10-30 |
TW201340430A (zh) | 2013-10-01 |
JP2013138070A (ja) | 2013-07-11 |
KR101630547B1 (ko) | 2016-06-14 |
TWI523288B (zh) | 2016-02-21 |
JP5836796B2 (ja) | 2015-12-24 |
US9412676B2 (en) | 2016-08-09 |
CN103959461A (zh) | 2014-07-30 |
KR20140112013A (ko) | 2014-09-22 |
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