M403601 五、新型說明： ^所屬之技術領域】 本斩型是有關於一種發光裝置，且特別是有關於一種 發光二極體裝置。 【先前技術】 ^ 知'而言’發光二極體（Light Emitting Diode，LED)相 ^點傳統光源來說’具有省電、高效率以及使用壽命長等 故目前已廣泛地應用於各種領域。 先製作多個上，於傳統發光二極體的封裝結構中，主要係 完成封敦。出成型的支架，而後在此支架内製作座體以 具，因此必二'支架的過程通常需要先開模製作模 大幅提高。/此=費=筆龐大的費用，使得整體的製作成本 品時，仍必須再^是爾後需要設計或推出不同種類的產 且使用上安裝不二一筆龐大的費用另行開模製作模具， 【新型内容】x 。是故，上述作法不利於節省製作成本。 本新型之一目 讓使用者易於安裝且供一種發光二極體裝置，藉此 依據本新型一=切作時所需花費的魔大成本。 載體、一控制電路、卷齡發光一極體裝置包含一基板、一 載體與控制電路係配置於^光二極體以及-電路板結構。 載體和控制電路中至少二二板上，上述發光二極體承載於 〆一者上，而電路板結構則是配置於 3 M403601 基板上，並環繞載體、控制電路以及發光二極體。 依據本新型一實施例，電路板結構更包含一第一電路 板層，其中第一電路板層配置於基板上，並藉由導線與載 - 體電性連接。此外，第一電路板層配置於基板上，並可藉 由導線與控制電路電性連接。再者第一電路板層配置於基 板上，並可藉由導線與上述發光二極體中至少一者電性連 接。 ' 依據本新型另一實施例，電路板結構更包含一第二電 φ 路板層，第二電路板層配置於第一電路板層上，且第二電 路板層之寬度係小於第一電路板層之寬度。 依據本新型另一實施例，第一電路板層與第二電路板 層之總厚度可大於載體與發光二極體之總厚度，或大於控 制電路與發光二極體之總厚度。 依據本新型再一實施例，發光二極體裝置更包含一反 光片，其沿著第一電路板層與第二電路板層形成之結構上 方配置，用以反射發光二極體所發出之光線。其中，反光 . 片上可設有至少一個孔洞，使得第一電路板層藉由導線透 ' 過孔洞與載體、控制電路以及上述發光二極體中至少一者 電性連接。此外，第一電路板層可具有一凸出部由孔洞伸 出至載體或控制電路附近，而發光二極體裝置可更包含一 填充膠體，其配置於由第一電路板層與第二電路板層所形 成之容置空間中，而由第二電路板層防止溢流。其次，發 光二極體裝置可更包含一透光體，其配置於第一電路板層 與第二電路板層形成之結構、反光片以及填充膠體上方。 依據本新型又一實施例，發光二極體裝置更包含一填 4 M403601 充膠體，其覆蓋載體、控制電路以及發光二極體，並位於 由電路板結構環繞載體、控制電路以及發光二極體所形成 之容置空間中。 依據本新型更一實施例’上述電路板結構係為—兩層 型階梯式印刷電路板結構。 ^ 由上述可知，應用本新型之實施例不需另行開模製作 模具，節省了製作模具所需耗費的龐大製作成本及製作時 間。此外，利用電路板結構取代傳統發光二極體裝置中支 • 架的使用，更可使發光二極體裝置的設計更具有彈性。再 者，將控制電路直接設置於發光二極體裝置中，更有利於 藉由控制電路來控制發光二極體的操作。 【實施方式】 下文係舉實施例配合所附圖式作詳細說明，但所提供 之實施例並非用以限制本新型所涵蓋的範圍，而結構運作 之描述非用以限制其執行之順序，任何由元件重新組合之 ® 結構’所產生具有均等功效的裝置，皆為本新型所涵蓋的 範圍。此外，圖式僅以說明為目的，並未依照原尺寸作圖。 第1圖係依照本新型實施例繪示一種發光二極體 (Light Emitting Diode，LED)裝置的剖面示意圖X。發光二極 體裝置100包含基板110、載體120、控制電路13〇、數個 發光二極體H0以及電路板結構15〇。載體12〇與控制電 路uo係配置於基板110上，上述發光二極體14〇承載於 載體120和控制電路130中至少其中一者上，在本實施例 中，上述發光二極體！40係分別承载於載體⑽和控制電 5 M403601 路130上。電路板結構150則是配置於基板110上，迷壤 繞載體120、控制電路130以及發光二極體140。 在實作上’基板110可以是無線路的鋁板，載體12〇 可以矽（Si)基板來製作，而控制電路13〇可以是如中華民國 專利申請號98133560中所述可直接操作在交流電壓下的微 型化電子裝置。在一實施例中，控制電路130係以控制積體 電路來實現，且其表面上鍍有一層金屬材料(例如：銀）。 此外’在一實施例中，上述電路板結構15〇可為一種 階梯式印刷電路板(PCB)結構，且印刷電路板的種類可包括 一般市面上常見的印刷電路板，例如：軟式印刷電路板、 硬式印刷電路板、陶瓷印刷電路板或金屬印刷電路板等 等。 · 值得注意的是，在本新型中所稱之「電路板」或「電 路板結構」’可包含一般常見的印刷電路板或製作印刷電路 板時所採用的結構、材料，或甚至是因應不同需求而採用 的特殊電路板。換言之，任何熟習此技藝者，在不脫離本 新型之精神和範圍内’當可採用各種不同型式或種類的電 路板，並不以上述種類或字面上的解釋為限。 在本實施例中’電路板結構150更包含第一電路板層 152以及第二電路板層154。第一電路板層152配置於基板 Π0上’環繞載體120、控制電路π〇以及發光二極體〗4〇, 並藉由導線112 (如：金線)與載體120和（或)控制電路13〇 和（或）發光二極體140中至少一者電性連接，使得載體 120、控制電路130或發光二極體14〇可透過第—電路板層 152與外部電路或裝置共同操作。 6 M403601 此外，第二電路板層154則配置於第—電路板層152 上，且同樣環繞載體120、控制電路130以及發光二極體 140’其中第二電路板層154之寬度係小於第一電路板層 152之寬度’使得第一電路板層152與第二電路板層154 形成的結構看似呈階梯式的配置。其次，第一電路板層152 並不限於第1圖所示’第一電路板層152可朝向遠離載體 120或控制電路13〇的方向往外延伸，使得第一電路板層 152上可另配置如靜電放電防護電路(ESD)等附加的外部電 路。 在一實施例中，第一電路板層152與第二電路板層154 之總厚度係大於載體120與所承載之發光二極體140之總 厚度’或大於控制電路130與所承載之發光二極體140之 總厚度。在另一實施例中，第一電路板層152與第二電路 板層154之總厚度係同時大於载體120及控制電路130與 所承載之發光二極體140之總厚度。 在本實施例中，發光二極體裝置100更包含反光片 φ 160,其中反光片160係沿著第一電路板層152與第二電路 板層154形成之結構上方配置，用以反射發光二極體140 所發出之光線，藉此增加出光量。在實作上，反光片160 的表面上可鑛有一層金屬材料（例如：銀）。 舉例而言，如第1圖所示，第一電路板層152與第二 電路板層154形成的結構呈階梯式配置，而反光片160可 沿著第二電路板層154的表面，經由第一電路板層152與 第二電路板層154的側邊，一直延伸至靠近第一電路板層 152的底部而覆蓋部分的基板11〇。 7 M403601 另外，反光片160上可設有至少一個孔洞ι62，使得 第一電路板層152可藉由導線112透過孔洞162與载體 120、控制電路130以及發光二極體140中至少一者電性連 接’使得載體120、控制電路130或發光二極體14〇可透 過第一電路板層152與外部電路或裝置共同操作。其次， 第一電路板層152可具有一凸出部158經由孔洞162延伸 穿過反光片160至載體120或控制電路13〇附近。 在本實施例中，發光二極體裝置100更包含填充膠體 • 170，其中填充膠體170覆蓋載體120、控制電路130以及 發光二極體140 ’並位於由電路板結構150環繞載體120、 控制電路130以及發光二極體140所形成之容置空間中。 舉例來說，如第1圖所示，由於第一電路板層152與 第二電路板層154形成的結構具有一定的厚度，因此相對 一電路板層152與第二電路板層154較低之處會形成容置 的空間，而填充膠體17〇即是配置於此空間内。如此一來， 位置較高的第二電路板層154便可發揮止膠的作用，防止 φ 填充膠體170溢流出發光二極體裝置100之外，有利於封 ' 裝的過程。 在本實施例中，發光二極體裝置100更包含透光體 180,其中透光體180配置於第一電路板層152與第二電路 板層154形成之結構、反光片160以及填充膠體Π0上方， 其中透光體180可作為聚光、散光、保護…等之用，使得 發光二極體140所發出的光可藉由透光體180發射至外 部，而且更可藉此保護位於透光體180下方的發光二極體 140或其它元件電路。在實作上，透光體180可藉由鏡面 8 M403601 玻璃、霧面玻璃或其它可透光材質來製作。 值得注意的是，雖然上述均以兩層電路板作為本新型 的實施例，但其僅為方便說明起見，並非用以限定本新型； . 換言之，任何熟習此技藝者，在不脫離本新型之精神和範 圍内，當可採用多層階梯式的電路板結構，並不以上述為 限。 由上述本新型實施方式可知，利用電路板取代傳統發 ' 光二極體裝置中支架的使用，不僅可避免開模製作模具的 φ 過程，節省製作模具所需耗費的龐大製作成本及時間，而 且更可使發光二極體裝置的設計更具有彈性。此外，由於 電路板的製作成本低，取得方式也容易，因此使得發光二 極體裝置在製作上非常方便。再者，將控制電路直接設置 於發光二極體裝置中，更有利於藉由控制電路來控制發光 二極體的操作。 雖然本新型已以實施方式揭露如上，然其並非用以限 定本新型，任何熟習此技藝者，在不脫離本新型之精神和 φ 範圍内，當可作各種之更動與潤飾，因此本新型之保護範 • 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下： 第1圖係依照本新型實施例繪示一種發光二極體裝置 的剖面示意圖。 9 M403601 【主要元件符號說明】 100 :發光二極體裝置 110 :基板 112 :導線 120 :載體 130 :控制電路 140 :發光二極體 150 :電路板結構 152 :第一電路板層 154 :第二電路板層 158 ··凸出部 160 :反光片 162 :孔洞 170 :填充膠體 180 :透光體M403601 V. New Description: ^Technical Fields Included] This type is related to a light-emitting device, and in particular to a light-emitting diode device. [Prior Art] ^ Knowing that 'Light Emitting Diodes (LEDs) are traditionally used in various fields, such as power saving, high efficiency, and long service life. First of all, in the package structure of the traditional light-emitting diode, the main system is completed. The formed bracket is formed, and then the seat body is made in the bracket, so the process of the two-bracket usually requires a large opening of the mold. / This = fee = the huge cost of the pen, so that when the overall cost of production, the product must still be designed and launched after the different types of production and use the installation of a huge cost of another mold to mold, [ New content] x. Therefore, the above practices are not conducive to saving production costs. One of the novels allows the user to easily install and provide a light-emitting diode device, thereby reducing the cost of the cutting according to the present invention. The carrier, a control circuit, and the coil-aged one-pole device comprise a substrate, a carrier and a control circuit disposed on the optical diode and the circuit board structure. At least two or two plates in the carrier and the control circuit, the light emitting diodes are carried on the other one, and the circuit board structure is disposed on the 3 M403601 substrate, and surrounds the carrier, the control circuit and the light emitting diode. According to an embodiment of the present invention, the circuit board structure further includes a first circuit board layer, wherein the first circuit board layer is disposed on the substrate, and is electrically connected to the carrier through the wires. In addition, the first circuit board layer is disposed on the substrate and can be electrically connected to the control circuit by wires. Furthermore, the first circuit board layer is disposed on the substrate, and is electrically connected to at least one of the light emitting diodes by wires. According to another embodiment of the present invention, the circuit board structure further includes a second electrical φ board layer, the second circuit board layer is disposed on the first circuit board layer, and the width of the second circuit board layer is smaller than the first circuit The width of the slab. According to another embodiment of the present invention, the total thickness of the first circuit board layer and the second circuit board layer may be greater than the total thickness of the carrier and the light emitting diode, or greater than the total thickness of the control circuit and the light emitting diode. According to still another embodiment of the present invention, the LED device further includes a retroreflective sheet disposed along the structure formed by the first circuit board layer and the second circuit board layer for reflecting the light emitted by the LED. . Wherein, the reflective film may be provided with at least one hole, such that the first circuit board layer is electrically connected to at least one of the carrier, the control circuit and the light emitting diode through the through hole. In addition, the first circuit board layer may have a protrusion protruding from the hole to the vicinity of the carrier or the control circuit, and the LED device may further include a filling gel disposed on the first circuit board layer and the second circuit. The slab is formed in the accommodating space, and the second circuit board layer prevents overflow. Secondly, the light-emitting diode device may further comprise a light-transmissive body disposed on the structure formed by the first circuit board layer and the second circuit board layer, the retroreflective sheeting and the filling gel. According to still another embodiment of the present invention, the light emitting diode device further comprises a filling 4 M403601 filling body covering the carrier, the control circuit and the light emitting diode, and is located around the carrier, the control circuit and the light emitting diode by the circuit board structure In the formed space. According to a further embodiment of the present invention, the above circuit board structure is a two-layer stepped printed circuit board structure. ^ As can be seen from the above, the embodiment of the present invention does not require a separate mold to be produced, which saves the enormous production cost and production time required for the mold. In addition, the use of the circuit board structure instead of the support of the conventional light-emitting diode device makes the design of the light-emitting diode device more flexible. Furthermore, the control circuit is directly disposed in the light emitting diode device, which is more advantageous for controlling the operation of the light emitting diode by the control circuit. The embodiments are described in detail below with reference to the accompanying drawings, but the embodiments are not intended to limit the scope of the present invention, and the description of structural operation is not intended to limit the order of execution thereof. Devices with equal efficiency resulting from the re-combination of the ® structure are the scope covered by the new model. In addition, the drawings are for illustrative purposes only and are not drawn to the original dimensions. 1 is a cross-sectional view X of a Light Emitting Diode (LED) device according to an embodiment of the present invention. The light-emitting diode device 100 includes a substrate 110, a carrier 120, a control circuit 13A, a plurality of light-emitting diodes H0, and a circuit board structure 15A. The carrier 12 and the control circuit uo are disposed on the substrate 110, and the light-emitting diodes 14 are carried on at least one of the carrier 120 and the control circuit 130. In the embodiment, the light-emitting diodes are provided! The 40 series are respectively carried on the carrier (10) and the control circuit 5 M403601. The circuit board structure 150 is disposed on the substrate 110, and is woven around the carrier 120, the control circuit 130, and the light emitting diode 140. In practice, the substrate 110 may be an aluminum plate of a wireless circuit, the carrier 12 may be fabricated by a (Si) substrate, and the control circuit 13 may be directly operated under an alternating voltage as described in the Republic of China Patent Application No. 98133560. Miniaturized electronic device. In one embodiment, control circuit 130 is implemented by controlling an integrated circuit and is coated with a layer of metallic material (e.g., silver). In addition, in an embodiment, the circuit board structure 15 can be a stepped printed circuit board (PCB) structure, and the type of the printed circuit board can include a printed circuit board commonly used in the market, for example, a flexible printed circuit board. , hard printed circuit boards, ceramic printed circuit boards or metal printed circuit boards, and so on. · It is worth noting that the term "circuit board" or "circuit board structure" as used in the present invention may include the structure, materials, or even the corresponding ones used in the common printed circuit boards or printed circuit boards. A special board for demand. In other words, anyone skilled in the art can use various types or types of circuit boards without departing from the spirit and scope of the present invention, and is not limited to the above categories or literal interpretations. In the present embodiment, the circuit board structure 150 further includes a first circuit board layer 152 and a second circuit board layer 154. The first circuit board layer 152 is disposed on the substrate '0 to surround the carrier 120, the control circuit π〇, and the LEDs, and is connected to the carrier 120 and/or the control circuit 13 by wires 112 (eg, gold wires). At least one of the 〇 and/or the light emitting diodes 140 are electrically connected such that the carrier 120, the control circuit 130 or the light emitting diodes 14 〇 can be operated together with the external circuit or device through the first circuit board layer 152. 6 M403601 In addition, the second circuit board layer 154 is disposed on the first circuit board layer 152, and also surrounds the carrier 120, the control circuit 130, and the light emitting diode 140', wherein the width of the second circuit board layer 154 is smaller than the first The width of the board layer 152' makes the structure formed by the first circuit board layer 152 and the second circuit board layer 154 appear to be in a stepped configuration. Secondly, the first circuit board layer 152 is not limited to the first circuit board layer 152 shown in FIG. 1 and may extend outward in a direction away from the carrier 120 or the control circuit 13A, so that the first circuit board layer 152 may be additionally configured as Additional external circuitry such as an ESD protection circuit (ESD). In one embodiment, the total thickness of the first circuit board layer 152 and the second circuit board layer 154 is greater than the total thickness of the carrier 120 and the carried LEDs 140 or greater than the control circuit 130 and the carried light. The total thickness of the polar body 140. In another embodiment, the total thickness of the first circuit board layer 152 and the second circuit board layer 154 is greater than the total thickness of the carrier 120 and the control circuit 130 and the light-emitting diodes 140 carried. In this embodiment, the LED device 100 further includes a reflective sheet φ 160, wherein the reflective sheet 160 is disposed above the structure formed by the first circuit board layer 152 and the second circuit board layer 154 for reflecting the light emitting The light emitted by the polar body 140, thereby increasing the amount of light emitted. In practice, the surface of the retroreflective sheeting 160 may be coated with a layer of metallic material (eg, silver). For example, as shown in FIG. 1, the structure formed by the first circuit board layer 152 and the second circuit board layer 154 is arranged in a stepped manner, and the reflective sheet 160 may be along the surface of the second circuit board layer 154. A circuit board layer 152 and a side of the second circuit board layer 154 extend up to the bottom of the first circuit board layer 152 to cover a portion of the substrate 11A. 7 M403601 In addition, at least one hole ι62 may be disposed on the retroreflective sheeting 160, so that the first circuit board layer 152 can pass through the hole 112 and the carrier 120, the control circuit 130, and the light emitting diode 140 through the wire 112. The connection ' allows the carrier 120, the control circuit 130 or the light-emitting diodes 14 to operate in conjunction with an external circuit or device through the first circuit board layer 152. Second, the first circuit board layer 152 can have a projection 158 extending through the aperture 162 through the retroreflective sheeting 160 to the carrier 120 or the vicinity of the control circuit 13A. In this embodiment, the LED device 100 further includes a filling gel 170, wherein the filling gel 170 covers the carrier 120, the control circuit 130, and the LED body 140', and is located around the carrier 120, the control circuit by the circuit board structure 150. 130 and the accommodating space formed by the light emitting diode 140. For example, as shown in FIG. 1, since the structure formed by the first circuit board layer 152 and the second circuit board layer 154 has a certain thickness, it is lower than the one circuit board layer 152 and the second circuit board layer 154. The space is formed, and the filling gel 17 is disposed in the space. In this way, the second circuit board layer 154 having a higher position can function as a stopper to prevent the φ filling gel 170 from overflowing out of the LED device 100, which is advantageous for the process of sealing. In this embodiment, the light emitting diode device 100 further includes a light transmitting body 180, wherein the light transmitting body 180 is disposed on the first circuit board layer 152 and the second circuit board layer 154, the reflective sheet 160 and the filling gel Π0. The light-transmitting body 180 can be used for collecting light, astigmatism, protection, etc., so that the light emitted by the light-emitting diode 140 can be emitted to the outside through the light-transmitting body 180, and the light-transmitting body 180 can be protected from light transmission. Light-emitting diode 140 or other component circuit below body 180. In practice, the light transmissive body 180 can be fabricated by mirror 8 M403601 glass, matte glass or other permeable material. It should be noted that although the above two layers of the circuit board are used as the embodiment of the present invention, it is merely for convenience of description, and is not intended to limit the present invention; in other words, anyone skilled in the art can not deviate from the present invention. In the spirit and scope, when a multi-layered circuit board structure can be employed, it is not limited to the above. It can be seen from the above-mentioned new embodiment that the use of the circuit board in place of the bracket in the conventional hair-light diode device can not only avoid the φ process of mold-making the mold, but also save the huge production cost and time required for the mold production, and more The design of the light-emitting diode device can be made more flexible. In addition, since the manufacturing cost of the circuit board is low and the acquisition method is also easy, the light-emitting diode device is very convenient to manufacture. Furthermore, the control circuit is directly disposed in the light emitting diode device, which is more advantageous for controlling the operation of the light emitting diode by the control circuit. The present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope of protection is determined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the description of the drawings is as follows: FIG. 1 is a light-emitting two according to an embodiment of the present invention. Schematic diagram of the polar body device. 9 M403601 [Description of main component symbols] 100: Light-emitting diode device 110: Substrate 112: Wire 120: Carrier 130: Control circuit 140: Light-emitting diode 150: Circuit board structure 152: First circuit board layer 154: Second Circuit board layer 158 · · protruding portion 160 : reflective sheet 162 : hole 170 : filling colloid 180 : light transmitting body