WO2013077177A1 - 部品装着ライン - Google Patents

部品装着ライン Download PDF

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Publication number
WO2013077177A1
WO2013077177A1 PCT/JP2012/078640 JP2012078640W WO2013077177A1 WO 2013077177 A1 WO2013077177 A1 WO 2013077177A1 JP 2012078640 W JP2012078640 W JP 2012078640W WO 2013077177 A1 WO2013077177 A1 WO 2013077177A1
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WO
WIPO (PCT)
Prior art keywords
head
mounting
component
cycle time
component mounting
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Application number
PCT/JP2012/078640
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English (en)
French (fr)
Japanese (ja)
Inventor
安井　義博
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to CN201280056780.0A priority Critical patent/CN103947310B/zh
Publication of WO2013077177A1 publication Critical patent/WO2013077177A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Definitions

  • a plurality of component mounting apparatuses each including two board transfer units extending in parallel are arranged in series, and a part of the plurality of component mounting apparatuses includes mounting heads having different mounting speeds.
  • the component mounting line is arranged in series, and a part of the plurality of component mounting apparatuses.
  • the component mounting apparatus for mounting components includes two substrate transfer units provided in parallel to each other, so that two substrates of the same type or different types can be simultaneously positioned on the two substrate transfer devices at the mounting position. In some cases, components are sequentially mounted, and the production efficiency is improved by carrying the substrate to the other conveyance unit during mounting on the substrate positioned in one conveyance unit.
  • the number of parts to be mounted on the board to be carried into the two board transfer units is significantly different, boarding into the other board is not completed by the end of the mounting on one board, and the production efficiency is not improved.
  • Patent Document 1 is composed of module type component mounting devices arranged in parallel, and each component mounting device is provided in parallel with a first transport unit and a first transport unit for transporting a substrate, respectively. The thing provided with the 2nd conveyance part is indicated. And the 1st conveyance part of the component mounting apparatus of each module is connected, a 1st conveyance lane is comprised, and the 2nd conveyance part of the component mounting apparatus of each module is connected, and the 2nd conveyance lane is comprised. Is described.
  • a substrate carry-in portion that is provided at the top of the line and carries substrates into both transfer lanes
  • an intermediate substrate carry-in portion that is provided in the middle of the second transfer lane and carries substrates into the second transfer lane
  • an intermediate substrate carry-in portion In a dual conveyor line that is provided adjacent to the upstream side and has a transport lane changing unit that transports the substrate in the second transport lane by changing it to the first transport lane, the number of components mounted on the first substrate and the second substrate It describes that the positions of the intermediate board carry-in section and the transport lane changing section are changed according to the ratio with the number of mounted parts. And the production efficiency is improved by equalizing the total time (work volume) of the work time for each transport lane used for mounting parts in the two transport lanes.
  • the components that can be mounted on the board are limited for each component mounting device, and considering the conditions of such a device, it is difficult to allocate the mounting components (work load) to each component mounting device accurately and evenly. As a result, the component mounting time by a specific component mounting apparatus becomes long.
  • mounting heads for mounting electronic components on a substrate include a high-speed head having a plurality of suction nozzles and a high-speed head for mounting components and a general-purpose head having only one suction nozzle and a low mounting speed.
  • the mounting time can be shortened.
  • the parts that can be used with high-speed heads with high speed are limited by dimensions, so when mounting multiple types of components on the board.
  • the parts that cannot be used with the high-speed head are concentrated on the remaining general-purpose heads with a low speed. It becomes longer and this becomes the cycle time of the component mounting line.
  • the present invention has been made in view of the conventional problems, and optimizes production efficiency by using module type component mounting devices each having two parallel substrate transfer units and arranged in series. It is providing the component mounting line which can aim at.
  • the structural feature of the invention according to claim 1 is that a pair of parallelly provided substrate transfer devices that carry a substrate into and out of a component mounting position, and a component storage device that stores a plurality of components
  • a component supply device that detachably sets a plurality of components
  • a mounting head that collects the components from the component storage device of the component supply device and mounts the components on the substrate
  • a head drive mechanism that drives the mounting head
  • the other cycle time for mounting the component is calculated for each component mounting device to obtain a combined cycle time, and the pair of substrates so that the combined cycle time is equalized between the component mounting devices And a component equal distribution unit that distributes components to be mounted to each component mounting device.
  • each component transfer device of each of the plurality of component mounting devices includes a general-purpose head having a large number of mountable component types and low mounting efficiency, and mounting A plurality of types of mounting heads including a high-speed head having a small number of possible component types and a high mounting efficiency can be selectively mounted, and the mounting cycle time is shortened through each of the plurality of component mounting devices. It is further provided with a mounting head type replacement unit that replaces these types.
  • the mounting head type replacement unit temporarily places all types of mounting heads of the component transfer devices of the component mounting devices on the general-purpose head. Then, the type of the mounting head is replaced from the general-purpose head to the high-speed head in order from the component mounting device on the upstream side of the substrate transfer device so as to reduce the maximum value of the total cycle time.
  • the total cycle time calculation unit is configured such that each of the high-speed heads mounts a component on the two types of boards with each component mounting device replaced with a high-speed head. Side total cycle time, and each general-purpose head side total cycle time for mounting components on the two types of substrates with each component mounting apparatus that is not replaced with the high-speed head but remains as a general-purpose head, and the mounting head type
  • the replacement unit compares the high-speed head side total cycle time calculated by the total cycle time calculation unit with the general-purpose head side total cycle time, and the maximum value of the general-purpose head-side total cycle time is the high-speed head-side total cycle time. Immediately before the maximum cycle time is exceeded, the replacement with the high-speed head is stopped.
  • the structural feature of the invention according to claim 5 is that, in any one of claims 1 to 4, the arrangement order of the component types of the plurality of component storage devices in the component supply device of each of the component mounting devices is the two types. It is possible to change for each combination of the two substrates, and further includes a component type arrangement determining unit that determines the arrangement order of the component types for each combination of the two types of substrates.
  • one side cycle time for mounting the component on one substrate and the other side cycle time for mounting the component on the other substrate are combined for each component mounting apparatus, thereby calculating the total cycle time required for mounting the components on two types of boards in one component mounting apparatus.
  • the total cycle time is equalized by equally distributing the components (for example, the component type and the number of components) distributed for each component mounting apparatus.
  • the one-side cycle time is long, the other-side cycle time can be shortened to achieve equalization with the combined cycle time. It is possible to equalize cycle times more easily than equalization.
  • This equalization of the total cycle time improves the production efficiency of the entire component mounting line by eliminating the prominent total cycle time in some component mounting devices that hinders the reduction of the line cycle time of the production line. be able to.
  • each component transfer device of each component mounting device includes a general-purpose head having a large number of mountable component types and a low mounting efficiency, and a high-speed head having a small number of mountable component types and a high mounting efficiency. Since it can be selectively mounted, replacing the general-purpose head with a high-speed head by the mounting head type replacement unit improves the overall production efficiency of the component mounting line by reducing the total cycle time of each component mounting device. Can be made. Further, since the type and the number of parts to be mounted for each substrate are different, the mounting head configuration that can be produced most efficiently is different for each substrate.
  • the production efficiency of the component mounting line is such that the component mounting device causes a waiting time to occur in other component mounting devices when a plurality of substrates are continuously manufactured with two types of substrates as one set. That is, it is restricted to the component mounting apparatus having the maximum total cycle time.
  • a small component that can be used by a high-speed head may not be mounted unless it is mounted on a substrate before a large component. Therefore, in order to reduce the maximum value of the total cycle time, the production efficiency of the component mounting line can be improved by replacing the general-purpose head with the high-speed head in order from the component mounting device on the upstream side.
  • the production efficiency is improved by replacing the general-purpose head having a low mounting speed with a high-speed head having a high mounting speed as much as possible.
  • the value of the total cycle time in the general-purpose head increases, and the production efficiency of the component mounting line deteriorates.
  • the mounted head type replacement unit compares the maximum value of the total cycle time of the high-speed head after replacement with the maximum value of the total cycle time of the general-purpose head that remains without replacement, and determines the total cycle time of the general-purpose head. When the value increases, it is detected that there are many parts that cannot use the high-speed head concentrated on the general-purpose head.
  • the mounting efficiency is improved by replacing with the high-speed head.
  • the component type arrangement determining unit collects the positions of the component types to be mounted, for example, for each combination of two types of boards in the component storage device, or recognizes the component types that are used more frequently. By placing it near the part imaging position by the camera for use, the movement distance until the part attracted by the part storage device is mounted on the board is shortened, and the total cycle time of the part mounting line is further shortened. Can do.
  • FIG. 5 is a flowchart showing a procedure for optimizing the mounting head in the first embodiment.
  • a table showing values obtained by temporarily placing all mounting heads on a general-purpose head and calculating the total cycle time for each electronic component mounting apparatus of each module.
  • surface which shows the value which calculated the total cycle time at the time of replacing with the high-speed head to the module 7 for every electronic component mounting apparatus of each module.
  • surface which shows the value which calculated the total cycle time at the time of replacing with the high-speed head to the module 8 for every electronic component mounting apparatus of each module. 10 is a flowchart showing a procedure for optimizing the mounting head in the second embodiment.
  • Example 1 A first embodiment of a component mounting line in which electronic component mounting devices for a plurality of modules according to the present invention are arranged in series will be described below with reference to the drawings.
  • the component mounting line 2 includes an electronic component mounting device 4 as a component mounting device, and a plurality of units (total 12 units) are arranged in series.
  • the electronic component mounting device 4 includes a substrate transport device 8 that transports a substrate 6 to a loading position and positions the substrate 6 at a predetermined component mounting position A, a component supply device 10, and a transport direction of the substrate 6.
  • a component transfer device 16 and a mark recognition camera 18 having a mounting head 14 provided on a moving table 12 supported so as to be movable in a certain X direction and a Y direction that is horizontally orthogonal to the X direction;
  • a component recognition camera 20 fixed between the component supply device 10 and a control device 22 for controlling mounting by the component transfer device 16 is provided.
  • the substrate transfer device 8 is a so-called dual conveyor type composed of a first transfer unit 8a and a second transfer unit 8b, and each conveyor is arranged in parallel along a guide rail 24 extending in the X direction.
  • a conveyor belt (not shown) provided in parallel, a support frame (not shown) for supporting each of the loaded substrates 6, and a position where the supported substrate 6 is mounted (predetermined)
  • a lifting device (not shown) that lifts up to the component mounting position A) and a clamping device (not shown) that clamps the substrate 6 at the mounting position (component mounting position A).
  • the component supply device 10 is configured by arranging a plurality of cassette type feeders (component storage devices) 26 in parallel on the side portion (front side in FIG. 1) of the substrate transfer device 8.
  • Each of the cassette type feeders 26 includes a case part that is detachably attached to a slot (not shown), a supply reel provided at the rear part of the case part, and a component take-out part provided at the tip of the case part.
  • An elongated tape (not shown) in which electronic components (not shown) as components are enclosed at a predetermined pitch is wound and held on the supply reel, and this tape is pulled out at a predetermined pitch by a sprocket (not shown). The encapsulated state is released and the components are sequentially fed into the component take-out section.
  • a code (identification code) is affixed to the cassette-type feeder 26.
  • Corresponding data between this code and the electronic part ID, part number, number of enclosures, part weight, etc. is a host computer that manages the entire line in the control device 22. 28 is pre-recorded in the mounting program data transmitted from 28.
  • An X-direction moving beam 30 is provided above the substrate transfer device 8, and the X-direction moving beam 30 extends in the Y direction and extends in the X direction along the substrate transfer device 8 ( It is provided so as to be movable along (not shown).
  • the moving table 12 is provided on the X-direction moving beam 30 so as to be movable on a Y-direction rail (not shown) provided on the side surface of the X-direction moving beam 30 via a slider (not shown). It has been.
  • a component transfer device 16 having a mounting head 14 and a mark recognition camera 18 are movably held on the moving table 12 together with the moving table 12.
  • the X-direction moving beam 30 is driven by a servo motor through a ball screw mechanism (not shown), and the moving table 12 is driven by a servo motor (not shown) through a Y-direction moving ball screw mechanism. .
  • the drive of these servo motors is controlled by the control device 22.
  • the optical axis of the mark recognition camera 18 is parallel to the X direction and the Z direction perpendicular to the Y direction.
  • a captured image captured by the mark recognition camera 18 is input to an unillustrated image recognition apparatus including an unillustrated A / D converter.
  • the image recognition device captures the captured image and reads information from a reference mark (not shown) attached to the surface of the substrate 6. Then, the positional deviation of the reference mark is calculated by a calculation device (not shown) provided in the control device 22. Next, when the mark recognition camera 18 is moved, the position deviation is corrected and moved.
  • the component transfer device 16 includes the moving table 12, and a mounting head lifting device 29 (see FIG. 4) as a head driving mechanism supported by the moving table 12 so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction.
  • the mounting head 14 is supported by the mounting head lifting device 29.
  • the mounting head 14 can be selectively attached to the mounting head lifting device 29 and can be replaced by a mounting head removing / mounting machine (not shown) or an operator.
  • the mounting head 14 is not limited to three types, and the present invention can be implemented even when there are two types of high-speed heads and general-purpose heads, or when there are four or more types.
  • the high-speed head (H12) 32 is a head having a low mounting efficiency and a low mounting efficiency. As shown in FIG. 2, the high-speed head 32 holds the holder holder 40 on the lower side of the head body 38 so as to be movable up and down and rotatable.
  • the holder holder 40 has a plurality of, for example, twelve nozzle holders 42 facing downward, and each nozzle holder 42 holds the suction nozzle 44 so as to be detachable downward.
  • a locking portion 38 a is provided on the back side of the head main body 38, and the locking portion 38 a is detachably locked to the mounting head lifting device 29 provided on the movable table 12.
  • the parts that can be mounted are limited to small parts 46 such as chip resistors and chip capacitors. .
  • a maximum of 12 small parts 46 can be mounted in one mounting cycle, and the mounting efficiency is high.
  • the general-purpose head (H01) 36 is the mounting head 14 that has many mountable component types and low mounting efficiency. As shown in FIG. 4, the general-purpose head 36 holds only one nozzle holder 50 on the lower side of the head body 48 so as to be movable up and down and rotatable. The nozzle holder 50 can attach and detach the suction nozzle 52 downward. Hold on. A locking portion 48 a is provided on the back side of the head main body 48, and the locking portion 48 a is detachably locked to the mounting head lifting device 29 provided on the movable table 12. Since the nozzle holder 50 and the suction nozzle 52 of the general-purpose head 36 are large, they can be used for mounting large-sized parts 54 and special-shaped parts, and are highly versatile. On the other hand, one mounting cycle is required for each part. next, the mounting efficiency is low.
  • the medium speed head (H04) 34 is the mounting head 14 having intermediate characteristics between the high speed head 32 and the general-purpose head 36. As shown in FIG. 3, the medium-speed head 34 has a holder holding body 58 that can be moved up and down and rotated under the head main body 56, and the four nozzle holders 60 are provided downward on the holder holding body 58. ing. A locking portion 56 a is provided on the back side of the head body 56, and the locking portion 56 a is detachably locked to the mounting head lifting device 29 provided on the movable table 12.
  • Each nozzle holder 60 is formed in the middle size between the large nozzle holder 50 of the general-purpose head 36 and the small nozzle holder 42 of the high-speed head 32, and each nozzle holder 60 has a medium suction nozzle 62. Removably held downward. Since the suction nozzle 62 is of a medium size and the distance between the suction nozzles 60 adjacent to each other is longer than that of the high-speed head 32, a very large part cannot be picked up. can do. Very small parts cannot be picked up. A maximum of four components can be mounted in one mounting cycle, and the mounting efficiency is intermediate between the high-speed head 32 and the general-purpose head 36.
  • the mounting heads 32, 34, and 36 each have a nozzle drive unit and a pneumatic control unit (not shown) inside the head main bodies 38, 48, and 56.
  • the nozzle drive unit is a part that moves the suction nozzles 44, 52, and 62 up and down and uses the servo motor as a drive source.
  • the air pressure control unit is a part that generates and controls negative pressure when adsorbing components, and includes an air pump, valves, and the like.
  • FIG. 5 is a diagram showing the approximate sizes of components that can be mounted on the three types of mounting heads 32, 34, and 36.
  • the horizontal axis indicates the size L of the component
  • the vertical axis indicates the type of the mounting head.
  • the high-speed head 32 can mount only small components 46 having a minimum size of L1 to L3.
  • the minimum size L2 of the mountable component is larger than the minimum size L1 of the high speed head 32
  • the maximum size L4 of the mountable component is the maximum size L3 of the high speed head 32.
  • the minimum size L1 of the parts that can be mounted is smaller than L2 of the medium speed head 34, and the maximum size L5 of the parts that can be mounted is medium speed. It is larger than the maximum size L4 of the head 34 (L4 ⁇ L5).
  • control device 22 includes a storage unit 64 that stores programs, data, and the like, a calculation unit 66 that calculates based on the programs and various data, and the mounting head 14 and the substrate transfer device based on the calculated data. 8, a mark recognition camera 18, a component recognition camera 20, and the like.
  • the calculation unit 66 includes a total cycle time calculation unit 70, a component equal distribution unit 72, a mounting head type replacement unit 74, and a component type arrangement determination unit 76.
  • the component equal distribution unit 72 determines that the component types and the number of components of the electronic components L1 to L5 to be mounted are equal among the component mounting apparatuses 4, and stores the determination result in the storage unit 64.
  • the total cycle time calculation unit 70 is provided for the mounting time (one-side cycle time) of one substrate 6 mounted at a predetermined position of the first transport unit 8a and the predetermined position of the second transport unit 8b for each component mounting device 4.
  • the mounting time (the other-side cycle time) of one substrate 6 to be mounted is added, and the combined cycle time is stored in the storage unit 64 as the combined cycle time.
  • the cycle time of the first transport unit 8a and the cycle time of the second transport unit 8b are the time required for the mounting head 14 to move from the component supply device 10 to the mounting position on the board 6 via the component recognition camera 20, and the respective mounting times.
  • the calculation is performed based on the mounting time required for mounting the component, the movement time between the mounted components, and the like.
  • the mounting head type replacement unit 74 instructs the mounting head removal mounting machine, for example, to replace the general-purpose head 36 provided in each component mounting device 4 with the high-speed head 32, and is calculated by the total cycle time calculation unit. Whether or not the replacement is possible is determined based on a result of comparing the general-purpose head-side total cycle time with the high-speed head-side total cycle time.
  • the component type arrangement determining unit 76 determines the position of the component storage device (cassette type feeder) 26 based on the usage status of the included component types so that the production efficiency is improved.
  • the component type arrangement determining unit 76 is provided in the component feeder 10 of the cassette type feeder 26 of the same component type to be mounted, for example, for each combination of the two types of substrates 6 conveyed to the first conveyance unit 8a and the second conveyance unit 8b. Put the position together. Also, a cassette type feeder 26 of a part type that is frequently used is arranged near the part imaging position by the part recognition camera 20. In this way, the moving distance of the electronic components L1 to L5 to be mounted is shortened, and the total cycle time is shortened.
  • the control device 22 is connected to the host computer 28 via the network 78.
  • step 100 the control device 22 starts optimization of the mounting head 14 (step 100, hereinafter abbreviated as “S100”).
  • All the mounting heads 14 of all the electronic component mounting apparatuses 4 divided into modules are temporarily placed on the general-purpose head 36 (S101). Thereby, although the mounting efficiency is low, the mounting head 14 on which all components can be mounted is attached to each electronic component mounting device 4.
  • L1, L2, L3, L4, and L5 are mounted on a plurality of sets of boards, one set of main board and sub board, and the plurality of sets of boards are mounted on the electronic component mounting apparatus 4 of 12 modules.
  • the control device 22 distributes the types and quantities of the electronic components L1 to L5 to be mounted so as to be equalized for each electronic component mounting device 4 by the component equal distribution unit 72 (S102).
  • the electronic component L1 is distributed as evenly as possible from the electronic component mounting device 4 of the module 1 to the electronic component mounting device 4 of the module 12, and the electronic component L2 is continuously allocated from the point where the electronic component L1 could not be allocated due to a shortage. To do.
  • the electronic components L3 to L5 are distributed as evenly as possible from the electronic component mounting device 4 of the module 1 to the electronic component mounting device 4 of the module 12.
  • components mounted on the first transport unit 8a in different electronic component mounting apparatuses 4 or components mounted on the second transport unit 8b may be uneven.
  • the type and quantity of electronic components to be mounted are distributed evenly for each electronic component mounting device 4 combined with the two transport unit 8b.
  • the cycle time of the first transport unit 8a is long, the cycle time of the second transport unit 8b is shortened, thereby achieving equalization with the combined cycle time obtained in the next step.
  • the cycle time can be equalized more easily than the conventional case where the cycle time is equalized with only one transport unit.
  • the total cycle time is It is made uniform among the electronic component mounting apparatuses 4, and it is possible to prevent the cycle time of the entire component mounting line from being increased by a part of the electronic component mounting apparatuses 4 having a long combined cycle time. To shorten the cycle time.
  • control device 22 causes the calculation unit 66 to use the cycle time in the first transport unit 8a and the second transport unit 8b, which are the mounting time required to mount the components on one board allocated in step 102.
  • the calculation of the cycle time is started for each electronic component mounting apparatus 4 (S103).
  • control device 22 adds the cycle time of the first transport unit 8 a and the cycle time of the second transport unit 8 b for each electronic component mounting device 4 by the total cycle time calculation unit 70. (S104).
  • the control device 22 sets the cycle time (cycle time of the component mounting line 2) that passes through all the electronic component mounting devices 4 to be the one with the largest value (maximum value) among the total cycle times ( S105).
  • cycle time cycle time of the component mounting line 2
  • maximum value the total cycle time of the component mounting line 2
  • the total cycle time (38.73 seconds) of the electronic component mounting apparatus 4 of the fourth module is the cycle time of the component mounting line 2.
  • the control device 22 determines whether the maximum value of the cycle time of the component mounting line 2 has been shortened (S106). When it is determined that the maximum value of the cycle time of the component mounting line 2 has been shortened, the process proceeds to step 107. In the first case, the cycle time of the component mounting line 2 is shortened by equalizing the component type and the number of components to be mounted.
  • the control device 22 stores the head configuration and component type distribution in that case as the best value and stores the storage unit 64. (S107).
  • step 106 If it is determined in step 106 that the cycle time of the component mounting line 2 has not been shortened, and if the best value is stored in step 107, the process proceeds to step 108.
  • step 109 since the cycle time of the high-speed head 32 to be compared is not calculated, the process proceeds to step 109.
  • step 108 the control device 22 determines whether or not the maximum value of the cycle time of the high-speed head 32 is larger than the maximum value of the cycle time of the general-purpose head 36 (S108).
  • the maximum combined cycle time of the electronic component mounting apparatus 4 of the module 1 replaced with the high-speed head 32 is 21.60 seconds, and the combined cycle of the electronic component mounting apparatus 4 of the module 9 including the general-purpose head 36.
  • the process proceeds to step 109.
  • step 109 the control device 22 determines whether there is a module of the electronic component mounting device 4 that can replace the general-purpose head 36 with the high-speed head 32 in order from the top of the component mounting line 2 (from the upstream side) (S109). . Whether or not the general-purpose head 36 can be replaced with the high-speed head 32 is determined depending on whether or not the component to be mounted can be mounted with the high-speed head 32 to be replaced. For example, when the parts to be mounted are L4 and L5, it is determined that the high-speed head 32 cannot be replaced because the high-speed head 32 cannot perform suction.
  • step 109 If it is determined in step 109 that there is a module of the electronic component mounting apparatus 4 that can be replaced with the high-speed head 32, the process proceeds to step 110.
  • control device 22 switches the general-purpose head 36 of the electronic component mounting device 4 determined to be replaceable by the mounting head type replacement unit 74 in order from the electronic component mounting device 4 of the module 1 (from the upstream side). It is replaced with (S110).
  • the control device 22 uses the component uniform distribution unit 72 to determine the type (L 1 to L 5) and the quantity of electronic components to be mounted. Then, optimization is performed by distributing the electronic component mounting apparatuses 4 so as to be equal (S102). Then, the control device 22 calculates the total cycle time for each electronic component mounting device 4 of each module in the electronic components L1 to L5 newly distributed evenly by the total cycle time calculation unit 70 (S103). Thereafter, the flow procedure is repeated in the same manner (S102 to S110).
  • the control device 22 determines that the cycle time of the component mounting line 2 has not been shortened ( S106).
  • control device 22 determines through step 107 that the total cycle time (18.14 seconds) of the high-speed head 32 is smaller than the total cycle time (23.47) of the general-purpose head 36 (S108).
  • the process proceeds to step 111, and the best value shown in FIG. 9 stored in step 107 is not updated, and the process ends (S111).
  • step 108 If it is determined in step 108 that the total cycle time of the high-speed head 32 is greater than the total cycle time of the general-purpose head 36, it is determined in step 109 that there is no module of the electronic component mounting apparatus 4 that can be replaced with the high-speed head.
  • the process proceeds to step 111 and is stored in step 107. Then, the processing is terminated without updating the head configuration and the component type distribution according to the best value (S111).
  • Example 2 a second embodiment of a component mounting line in which a plurality of module electronic component mounting devices according to the present invention are arranged in series will be described below. Since the configuration of the apparatus used is the same as that of the first embodiment, the description thereof is omitted. The present embodiment is performed continuously with the flow procedure of the first embodiment, and can be performed as a subsequent process of step 111. Further, the medium speed head 34 in the present embodiment corresponds to the high speed head in claims 3 and 4 with respect to the general-purpose head 36.
  • the control device 22 determines whether there is an electronic component mounting apparatus 4 that can replace the medium speed head 34. Is determined (S201).
  • the control device 22 replaces the general-purpose head 36 with the medium-speed head 34 from the upstream side (S202).
  • the electronic component mounting device 4 of the module 8 is replaced in order.
  • the electronic component mounting apparatus 2 of the module 10 is replaced with the medium-speed head 34 from the general-purpose head 36.
  • the general-purpose head 36 is removed from a not-illustrated locked portion of the moving base 12, and the medium speed head 34 has a locking portion 56 a provided on the back surface of the head main body 56 of the medium speed head 34. It is locked by engaging with a substantially locked portion.
  • This operation may be performed by a mounting head detaching and mounting machine (not shown), or may be performed manually by an operator.
  • a mounting head detaching and mounting machine (not shown), or may be performed manually by an operator.
  • the electronic component mounting device 4 from the module 1 to the module 7 to which the high speed head is mounted the electronic component mounting device 4 of the module 8 to which the medium speed head is mounted, and
  • the electronic component mounting apparatuses 4 of the modules 9 to 12 to which the general-purpose heads are attached are arranged on the component mounting line 2.
  • the types and quantities of the electronic components L1 to L5 are distributed evenly for the electronic component mounting apparatuses 4 of the modules 1 to 12 (S203).
  • the mounting work amount is made uniform among the electronic component mounting apparatuses 4.
  • the electronic components mounted on the respective electronic component mounting apparatuses 4 of the modules 1 to 7 provided with the high-speed head 32 are also distributed, so that the electronic component provided with the high-speed head 32 is provided.
  • the number of electronic components distributed to the mounting device 4 is reduced to shorten the cycle time.
  • control device 22 starts calculating the one-side cycle time (cycle time of the first transport unit 8a) and the other-side cycle time (cycle time of the second transport unit 8b) for each electronic component mounting device 4. (S204).
  • control device 22 adds the cycle time of the first transport unit and the cycle time of the second transport unit for each electronic component mounting device 4 (S205).
  • control device 22 sets the cycle time (cycle time of the component mounting line 2) that passes through all the electronic component mounting devices 4 to be the one with the largest value (maximum value) among the total cycle times ( S206).
  • control device 22 determines whether the maximum value of the cycle time of the component mounting line 2 has been shortened (S207). If it is determined that the maximum value of the cycle time of the component mounting line 2 has been shortened, the process proceeds to step 208.
  • control device 22 stores the head configuration and component type distribution in that case as the best value and stores the storage unit 64. (S208).
  • step 207 If it is determined in step 207 that the cycle time of the component mounting line 2 has not been shortened, and if the best value is stored in step 208, the process proceeds to step 209.
  • control device 22 determines whether or not the maximum value of the cycle time of the medium speed head 34 is larger than the maximum value of the cycle time of the general-purpose head 36 (S209).
  • control device 22 When determining that the maximum value of the cycle time of the medium speed head 34 is larger than the maximum value of the cycle time of the general-purpose head 36, the control device 22 proceeds to step 201 and repeats the same flow procedure ( S201 to S209).
  • the electronic component mounting device 4 of the module 8 to the module 10 is sequentially replaced from the general-purpose head 36 to the medium speed head 34 (S202).
  • control device 22 distributes the types and quantities of the electronic components L1 to L5 to be mounted so as to be equal for each electronic component mounting device 4 (S203). As a result, the mounting work amount is made uniform among the electronic component mounting apparatuses 4.
  • control device 22 starts calculating the cycle time of the first transport unit 8a and the cycle time of the second transport unit 8b for each electronic component mounting device 4 (S204).
  • control device 22 adds the cycle time of the first transport unit and the cycle time of the second transport unit for each electronic component mounting device 4 (S205).
  • control device 22 sets the cycle time (cycle time of the component mounting line 2) that passes through all the electronic component mounting devices 4 to be the one with the largest value (maximum value) among the total cycle times ( S206). For example, as shown in FIG. 12, the maximum value of the total cycle time was calculated to be 19.21 seconds.
  • control device 22 determines whether the maximum value of the cycle time of the component mounting line 2 has been shortened (S206). Compared with the maximum value (not shown) of the total cycle time before replacing the module 10 with the medium speed head 34, it is determined that the maximum value of the cycle time of the component mounting line 2 has been shortened, and the routine proceeds to step 208. .
  • control device 22 stores and stores the head configuration and component type distribution in that case as the best values, assuming that the mounting head has been improved ( S208).
  • control device 22 determines whether or not the maximum value of the cycle time of the medium speed head 34 is larger than the maximum value of the cycle time of the general-purpose head 36 (S209).
  • the maximum value (18.07 seconds) of the cycle time of the medium speed head 34 is larger than the maximum value (14.71 seconds) of the cycle time of the general-purpose head 36. It determined that, the process proceeds to step 201.
  • the control device 22 determines whether or not there is the electronic component mounting device 4 of the module of the general-purpose head 36 that can be changed from the upstream side (the head) (S201). In this embodiment, it is determined that there is an electronic component mounting apparatus 4 for the module of the general-purpose head 36 that can be changed, and the process proceeds to step 202.
  • the general-purpose head 36 of the changeable module electronic component mounting apparatus 4 is replaced with the medium-speed head 34 (S202).
  • step 203 the process proceeds to step 203, and similarly, the types and quantities of the electronic components L1 to L5 are equally distributed to the electronic component mounting apparatuses 4 of the modules 1 to 12 (S203).
  • the calculation of the cycle time is started (S204), and the total cycle time for each electronic component mounting device 4 of each module is calculated (S205). Then, the maximum value of the total cycle time is set as the cycle time of the component mounting line 2 (S206). In this case, as shown in FIG. 13, the cycle time 29.33 seconds in the module 12 becomes the cycle time of the component mounting line 2.
  • step 207 judges whether the cycle time of the component mounting line 2 was shortened.
  • the cycle time of the component mounting line 2 is longer than 19.21 seconds of the cycle of the component mounting line 2 before the module 11 is replaced with the medium speed head 34. It is determined that 22 is not shortened, and the process proceeds to step 209.
  • step 209 the control device 22 determines whether or not the maximum value of the cycle time of the medium speed head 34 is larger than the maximum value of the cycle time of the general-purpose head 36.
  • the maximum value (16.29 seconds) of the cycle time of the medium speed head 34 is determined to be smaller than the maximum value (29.33 seconds) of the cycle time of the general-purpose head 36.
  • large parts that can only be mounted by the general-purpose head 36 are concentrated on the general-purpose head 36 that remains without being replaced, and the work time of the electronic component mounting apparatus 4 having the general-purpose head 36 is significantly increased. It is in the state. Therefore, the process proceeds to step 210, and the process ends without updating the distribution of the head configuration and the component type based on the best value (value shown in FIG. 12) stored in step 208.
  • components L1 to L5 are placed on one substrate 6 for two types of substrates 6 positioned and transported at the component mounting position A.
  • the cycle time of the first transport unit 8a to be mounted and the cycle time of the second transport unit 8b to mount the components L1 to L5 on the other substrate 6 for each component mounting device 4 one electronic component mounting The total cycle time required for mounting the parts L1 to L5 on the two types of boards 6 in the apparatus 4 is calculated. Then, the total cycle time is equalized by equally distributing the component types and the number of components of the electronic components L1 to L5 distributed to each electronic component mounting apparatus 4.
  • the cycle time of the first transport unit 8a when the cycle time of the first transport unit 8a is long, the cycle time of the second transport unit 8b is shortened, so that equalization with the combined cycle time can be achieved. It is possible to equalize the cycle time more easily than to equalize the cycle time with only one transport unit.
  • By equalizing the total cycle time in this way by eliminating the protruding total cycle time of some of the electronic component mounting apparatuses 4 that hinders the shortening of the cycle time of the component mounting line 2, the production efficiency of the entire component mounting line can be reduced. it is possible to improve the.
  • each component transfer device 16 of each electronic component mounting device 4 includes a general-purpose head 36 with many mountable component types and a low mounting efficiency, and a high-speed head 32 (or medium speed) with a small number of mountable component types and a high mounting efficiency. Since the general-purpose head 36 is replaced with the high-speed head 32 by the mounting head type replacement unit 74, the total cycle time through each electronic component mounting apparatus 4 can be shortened. it can. Further, since the type and the number of components to be mounted for each substrate 6 are different, the mounting head configuration that can be produced most efficiently is different for each substrate 6.
  • the mounting head (the high speed head 32 or the medium speed head 34) that reduces the total cycle time of the two substrates 6 is selected, so that the optimum head as a whole can be selected.
  • the production efficiency of the component mounting line 2 is that the electronic component mounting device 4 causes a waiting time to be generated in another electronic component mounting device 4 when a plurality of substrates 6 are continuously manufactured with two types of substrates 6 as one set.
  • the electronic component mounting apparatus 4 is limited to the maximum total cycle time.
  • the small components L1, L2, and L3 that can be used by the high-speed head 32 may not be mounted unless they are mounted on the substrate before the large components L4 and L5 (or the small components that can be used by the medium-speed head 34).
  • the parts L3 and L4 may not be mounted unless they are mounted on the board before the larger part L5). Therefore, in order to reduce the maximum value of the total cycle time, the general-purpose head 36 is replaced with the high-speed head 32 (or the medium-speed head 34) in order from the electronic component mounting apparatus 4 on the upstream side. Production efficiency can be improved.
  • the production efficiency is improved by replacing the general-purpose head 36 having a low mounting speed with the high-speed head 32 (or the medium-speed head 34) having a high mounting speed as much as possible.
  • large parts L4 and L5 large part L5 for medium speed head 34
  • specially shaped parts that cannot use high-speed head 32 (or medium-speed head 34) or the other general-purpose heads 36 having a low speed are used as remaining general-purpose heads 36 having a low speed.
  • the value of the total cycle time in the general-purpose head 36 is increased, and the production efficiency of the component mounting line 2 is deteriorated.
  • the mounted head type replacement unit 74 sets the maximum value of the total cycle time of the high-speed head 32 (or medium-speed head 34) after replacement and the maximum value of the total cycle time of the general-purpose head 36 that remains without being replaced. In comparison, when the value of the total cycle time in the general-purpose head 36 becomes large, it is detected that there are many components that cannot be used by the high-speed head 32 (or the medium-speed head 34) concentrated on the general-purpose head 36.
  • the general-purpose head 36 to the high-speed head 32 (or medium-speed head 34) until the state immediately before the maximum value of the total cycle time of the general-purpose head 36 exceeds the maximum value of the total cycle time of the high-speed head 32 (or medium-speed head 34).
  • the component type arrangement determining unit 76 collects, for example, the positions of the component types to be mounted in the component storage device (cassette type feeder) 26 for each combination of the two types of substrates 6, and the more frequently used component types the components. By arranging it near the imaging position, the total cycle time of the component mounting line 2 can be further shortened.
  • each electronic component mounting apparatus 4 has one mounting head 14, but is not limited to this.
  • the mounting head is used for mounting the same substrate, the mounting head is Two things may be sufficient.
  • the combination of the two types of boards is a combination of the main board and the sub board, but is not limited to this.
  • a board on which the front side is mounted and a board of the same board type that is mounted on the back side Or a combination of two other types of substrates that are not particularly related to each other.
  • mounting heads that is, a high-speed head, a medium-speed head, and a general-purpose head, it is not limited to this. It may be based on the type of mounting head.
  • the present invention is not limited to this, and may be, for example, 6 types or more, or 4 types or less.
  • the general-purpose head can be used for all suction from the small electronic component L1 to the large electronic component L5.
  • the general-purpose head is not limited to this.
  • the thing which can be used for adsorption to L5 may be used.
  • the high-speed head that adsorbs the small electronic component L1 is arranged in the electronic component mounting devices of several modules on the upstream side, and the general-purpose head is temporarily placed on the electronic component mounting devices of all other modules. You can start with.
  • the component mounting line according to the present invention is suitable for a component mounting line that uses a module type component mounting apparatus in which a plurality of parallel substrate transfer units are provided and a plurality of units are arranged in series.
  • DESCRIPTION OF SYMBOLS 2 ... Component mounting line, 4 ... Electronic component mounting apparatus, 6 ... Board

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2012/078640 2011-11-24 2012-11-05 部品装着ライン WO2013077177A1 (ja)

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KR102062277B1 (ko) 2014-08-22 2020-01-03 한화정밀기계 주식회사 Smt 공정의 생산 시간 시뮬레이션 방법
WO2016151797A1 (ja) * 2015-03-25 2016-09-29 富士機械製造株式会社 実装装置及び実装方法
CN110602939B (zh) * 2015-03-26 2020-10-27 株式会社富士 元件安装线的最优化装置及元件安装线的最优化方法
JP6604604B2 (ja) * 2016-01-29 2019-11-13 株式会社Ｆｕｊｉ 基板生産方法及び基板生産の条件決定方法
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