JP5863413B2 - 部品装着ライン - Google Patents
部品装着ライン Download PDFInfo
- Publication number
- JP5863413B2 JP5863413B2 JP2011256664A JP2011256664A JP5863413B2 JP 5863413 B2 JP5863413 B2 JP 5863413B2 JP 2011256664 A JP2011256664 A JP 2011256664A JP 2011256664 A JP2011256664 A JP 2011256664A JP 5863413 B2 JP5863413 B2 JP 5863413B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- component
- head
- cycle time
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 108
- 238000003860 storage Methods 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 13
- 238000011144 upstream manufacturing Methods 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000004904 shortening Methods 0.000 claims description 3
- 230000032258 transport Effects 0.000 description 47
- 238000004519 manufacturing process Methods 0.000 description 30
- 238000000034 method Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 18
- 238000003384 imaging method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011256664A JP5863413B2 (ja) | 2011-11-24 | 2011-11-24 | 部品装着ライン |
CN201280056780.0A CN103947310B (zh) | 2011-11-24 | 2012-11-05 | 元件安装线 |
PCT/JP2012/078640 WO2013077177A1 (ja) | 2011-11-24 | 2012-11-05 | 部品装着ライン |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011256664A JP5863413B2 (ja) | 2011-11-24 | 2011-11-24 | 部品装着ライン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013110371A JP2013110371A (ja) | 2013-06-06 |
JP5863413B2 true JP5863413B2 (ja) | 2016-02-16 |
Family
ID=48469625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011256664A Active JP5863413B2 (ja) | 2011-11-24 | 2011-11-24 | 部品装着ライン |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5863413B2 (zh) |
CN (1) | CN103947310B (zh) |
WO (1) | WO2013077177A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6193994B2 (ja) * | 2013-06-27 | 2017-09-06 | 富士機械製造株式会社 | 部品実装機 |
JP6678596B2 (ja) * | 2014-02-07 | 2020-04-08 | ユニヴァーサル インストゥルメンツ コーポレイションUniversal Instruments Corporation | ポンプとモーターを持つピックアンドプレースヘッド |
KR102062277B1 (ko) | 2014-08-22 | 2020-01-03 | 한화정밀기계 주식회사 | Smt 공정의 생산 시간 시뮬레이션 방법 |
JPWO2016046897A1 (ja) * | 2014-09-23 | 2017-06-29 | 富士機械製造株式会社 | 部品供給システム |
WO2016151797A1 (ja) * | 2015-03-25 | 2016-09-29 | 富士機械製造株式会社 | 実装装置及び実装方法 |
CN110602939B (zh) * | 2015-03-26 | 2020-10-27 | 株式会社富士 | 元件安装线的最优化装置及元件安装线的最优化方法 |
JP6604604B2 (ja) * | 2016-01-29 | 2019-11-13 | 株式会社Fuji | 基板生産方法及び基板生産の条件決定方法 |
US11586169B2 (en) * | 2017-05-18 | 2023-02-21 | Yamaha Hatsudoki Kabushiki Kaisha | Production management device |
JP7142203B2 (ja) * | 2017-12-06 | 2022-09-27 | パナソニックIpマネジメント株式会社 | 部品実装システムおよび部品装着装置ならびに基板搬送方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0157945B1 (ko) * | 1995-11-24 | 1998-12-15 | 이종수 | 진화 연산을 이용한 부품 장착 방법 |
JP3589658B2 (ja) * | 2001-09-28 | 2004-11-17 | 松下電器産業株式会社 | 最適化装置、装着装置及び電子部品装着システム |
JP4644162B2 (ja) * | 2006-06-22 | 2011-03-02 | 富士機械製造株式会社 | 段取データ群作成方法 |
JP5020030B2 (ja) * | 2007-11-16 | 2012-09-05 | 富士機械製造株式会社 | 電子回路生産システム及び電子回路生産方法 |
CN101925868B (zh) * | 2008-01-23 | 2013-09-11 | 松下电器产业株式会社 | 部件安装条件确定方法 |
JP5009939B2 (ja) * | 2008-02-25 | 2012-08-29 | パナソニック株式会社 | 実装条件決定方法 |
JP5480776B2 (ja) * | 2010-11-02 | 2014-04-23 | ヤマハ発動機株式会社 | 実装モード決定方法及び部品実装システム |
-
2011
- 2011-11-24 JP JP2011256664A patent/JP5863413B2/ja active Active
-
2012
- 2012-11-05 WO PCT/JP2012/078640 patent/WO2013077177A1/ja active Application Filing
- 2012-11-05 CN CN201280056780.0A patent/CN103947310B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103947310B (zh) | 2016-06-29 |
JP2013110371A (ja) | 2013-06-06 |
CN103947310A (zh) | 2014-07-23 |
WO2013077177A1 (ja) | 2013-05-30 |
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