WO2012176884A1 - サーマルヘッドおよびこれを備えるサーマルプリンタ - Google Patents
サーマルヘッドおよびこれを備えるサーマルプリンタ Download PDFInfo
- Publication number
- WO2012176884A1 WO2012176884A1 PCT/JP2012/066014 JP2012066014W WO2012176884A1 WO 2012176884 A1 WO2012176884 A1 WO 2012176884A1 JP 2012066014 W JP2012066014 W JP 2012066014W WO 2012176884 A1 WO2012176884 A1 WO 2012176884A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- electrode
- main surface
- thermal head
- heat generating
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3354—Structure of thermal heads characterised by geometry
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
- B41J2/3357—Surface type resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Definitions
- the present invention relates to a thermal head and a thermal printer including the same.
- the thermal head has a plurality of heat generating portions on a substrate, includes a first electrode and a second electrode that supply a voltage to each of the plurality of heat generating portions, and covers the heat generating portion, the first electrode, and the second electrode. Is provided with a protective layer (see, for example, Patent Document 1).
- thermal head may cause chipping or cracking at the edge of the substrate.
- the thermal head according to the present invention includes a substrate and a plurality of heat generating portions provided on the substrate.
- the substrate is connected to the first main surface, the second main surface located on the opposite side of the first main surface, and the first main surface and the second main surface, and the first along the arrangement direction of the plurality of heat generating portions. It has one end face. Edges are provided on the first main surface, the first end surface, and the second main surface of the substrate in directions that intersect with the arrangement direction of the plurality of heat generating portions, respectively.
- a first reinforcing member and a second reinforcing member that is separated from the first reinforcing member are provided on the edge of the first main surface of the substrate. The first reinforcing member is provided from the edge of the first main surface of the substrate to the edge of the first end surface of the substrate and the edge of the second main surface.
- the thermal printer of the present invention includes the thermal head described above, a transport mechanism that transports the recording medium onto the heat generating portion, and a platen roller that presses the recording medium onto the heat generating portion.
- the possibility of chipping or cracking at the edge of the substrate can be reduced.
- FIG. 2 is a cross-sectional view taken along line II of the thermal head of FIG. 1.
- FIG. 2 is a sectional view of the thermal head of FIG. 1 taken along line II-II.
- A) shows the top view of the board
- (b) is an enlarged plan view which expands and shows a part of (a).
- FIG. 1 It is a schematic plan view which shows the outline of the thermal head produced from the board
- FIG. 1 It is a schematic plan view which shows the outline of the thermal head produced from the board
- the thermal head X1 is a heat radiator 1, a head base 3 disposed on the heat sink 1, and an external substrate connected to the head base 3.
- a flexible printed wiring board 5 (hereinafter referred to as FPC 5) is provided.
- FPC 5 flexible printed wiring board 5
- illustration of the FPC 5 is omitted, and a region where the FPC 5 is arranged is indicated by a one-dot chain line.
- the protrusion part 1b of the heat radiator 1 is abbreviate
- the heat dissipating body 1 is arranged on a plate-like base portion 1 a having a rectangular shape in plan view, and an upper surface of the base portion 1 a, and one long side of the base portion 1 a. And a protrusion 1b extending along the line.
- the radiator 1 is made of a metal material such as copper or aluminum, for example, and has a function of radiating a part of heat generated in the heat generating portion 9 of the head base 3 that does not contribute to printing as will be described later. have.
- the head base 3 includes a substrate 7 having a rectangular shape in plan view, a plurality of heat generating units 9 arranged along the longitudinal direction of the substrate 7, and the heat generating unit 9. And a plurality of driving ICs 11a which are control units arranged side by side on the first main surface 7c of the substrate 7 along the arrangement direction.
- the substrate 7 has a first end surface 7a, a second end surface 7b, a first main surface 7c, and a second main surface 7d.
- the first end surface 7 a is a surface that is connected to the first main surface 7 c and the second main surface 7 d and extends in the arrangement direction of the plurality of heat generating portions 9.
- the second end surface 7b is a surface located on the opposite side of the first end surface 7a.
- a plurality of heat generating portions 9 are arranged in a row on the second end face 7b.
- the first main surface 7c, the first end surface 7a, and the second main surface 7d are provided with edge portions 7g in the direction intersecting with the arrangement direction of the plurality of heat generating portions 9, respectively.
- the second main surface 7d is a surface located on the opposite side of the first main surface 7c.
- the edge portion 7g indicates a region in the vicinity of the end face orthogonal to the arrangement direction of the heat generating portions 9, and is a region from each end surface of the substrate 7 to 20% of the length of the substrate 7. For example, when the length of the substrate 7 is 30 mm, a region between 6 mm from the end surface orthogonal to the arrangement direction of the heat generating portions 9 becomes the edge portion 7g.
- the substrate 7 is made of an electrically insulating material such as alumina ceramic or a semiconductor material such as single crystal silicon.
- the head base 3 is formed by providing on the substrate 7 members for driving the thermal head X1, such as the heat generating portion 9 or the driving IC 11a.
- the head base 3 is disposed on the upper surface of the base 1 a of the radiator 1, and the first end surface 7 a of the substrate 7 is disposed so as to face the protrusion 1 b of the radiator 1. Further, the lower surface of the head substrate 3, more specifically, the lower surface of the third protective layer 29 described later and the upper surface of the base portion 1a are bonded by a double-sided tape (not shown). 1a.
- a heat storage layer 13 is formed on the second end surface 7 b of the substrate 7.
- the second end surface 7b of the substrate 7 has a convex curved surface when viewed in cross section, and the heat storage layer 13 is formed on the second end surface 7b. Therefore, the surface of the heat storage layer 13 is also curved.
- the heat storage layer 13 functions so as to favorably press a recording medium (not shown) to be printed against a first protective layer 25 described later formed on the heat generating portion 9.
- the heat storage layer 13 is formed of, for example, glass having low thermal conductivity, and the time required to raise the temperature of the heat generating part 9 by temporarily storing a part of the heat generated in the heat generating part 9. And the thermal response characteristic of the thermal head X1 is enhanced.
- the heat storage layer 13 is formed only on the second end surface 7b of the substrate 7, and heat can be stored at a position close to the heat generating portion 9, so that the thermal head X1 Thermal response characteristics can be improved more effectively.
- the heat storage layer 13 is obtained, for example, by applying a predetermined glass paste obtained by mixing a glass powder with an appropriate organic solvent onto the second end surface 7b of the substrate 7 by screen printing or the like, and baking it. It is formed.
- an electric resistance layer 15 is provided on the first main surface 7c of the substrate 7, the heat storage layer 13, and the second main surface 7d and the second end surface 7b of the substrate 7.
- the electrical resistance layer 15 is interposed between the substrate 7 and the heat storage layer 13, the individual electrode 19, and the common electrode 17. Further, the IC-FPC connection electrode 21 is provided on the first main surface 7c.
- the region of the electrical resistance layer 15 located on the first main surface 7c of the substrate 7 has the same shape as the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 in plan view. Is formed.
- the region of the electric resistance layer 15 located on the heat storage layer 13 is a region formed in the same shape as the common electrode 17 and the individual electrode 19 as viewed from the side, and the common electrode 17 and the individual electrode 19. And a plurality of regions (hereinafter referred to as exposed regions) exposed between the two.
- the region of the electric resistance layer 15 located on the second main surface 7 d of the substrate 7 is provided over the entire second main surface 7 d of the substrate 7 and has the same shape as the common electrode 17. Is formed.
- each region of the electrical resistance layer 15 is formed in this way, in FIG. 1, the electrical resistance layer 15 is hidden by the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 and is not illustrated. . In FIG. 2, the electrical resistance layer 15 is hidden by the common electrode 17 and the individual electrode 19, and only the exposed region is shown.
- Each exposed region of the electrical resistance layer 15 generates heat when a voltage is applied to form the heat generating portion 9.
- a plurality of exposed regions are arranged in a row on the heat storage layer 13 as shown in FIG.
- the plurality of heat generating portions 9 are illustrated in a simplified manner in FIG. 2, but are arranged at a density of, for example, 180 dpi to 2400 dpi.
- the electric resistance layer 15 is formed of a material having a relatively high electric resistance such as TaN, TaSiO, TaSiNO, TiSiO, TiSiCO, or NbSiO. Therefore, when a voltage is applied between the common electrode 17 and the individual electrode 19 which will be described later and a current is supplied to the heat generating portion 9, the heat generating portion 9 generates heat due to Joule heat generation.
- a common electrode 17, a plurality of individual electrodes 19, and a plurality of IC-FPC connection electrodes 21 are provided on the electric resistance layer 15.
- the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 are formed of a conductive material, for example, any one of aluminum, gold, silver, and copper, or an alloy thereof. Is formed by.
- the plurality of individual electrodes 19 are for connecting each heat generating part 9 and the drive IC 11a. As shown in FIGS. 1 to 3, each individual electrode 19 has one end connected to the heat generating portion 9 and individually extends in a band shape from the second end surface 7 b of the substrate 7 to the first main surface 7 c of the substrate 7. .
- each individual electrode 19 is arranged in the arrangement area of the drive IC 11a, and the other end of each individual electrode 19 is connected to the drive IC 11a, whereby each heat generating part 9 and the drive IC 11a are electrically connected. Is done. More specifically, the individual electrode 19 divides a plurality of heat generating portions 9 into a plurality of groups, and electrically connects the heat generating portions 9 of each group to a drive IC 11 a provided corresponding to each group.
- the plurality of IC-FPC connection electrodes 21 are for connecting the driving IC 11a and the FPC 5 and are formed so as to send electrical signals to the driving IC 11a. As shown in FIGS. 1 and 3, each IC-FPC connection electrode 21 extends in a strip shape on the first main surface 7 c of the substrate 7, one end is disposed in the region where the drive IC 11 a is disposed, and the other end is disposed on the substrate 7. The first main surface 7c is disposed in the vicinity of an extension portion 17a of a common electrode 17 to be described later.
- the plurality of IC-FPC connection electrodes 21 are electrically connected between the drive IC 11a and the FPC 5 by having one end connected to the drive IC 11a and the other end connected to the FPC 5.
- the IC-FPC connection electrode 21 constitutes the second electrode of the present invention.
- the plurality of IC-FPC connection electrodes 21 connected to each drive IC 11a are composed of a plurality of electrodes having different functions.
- the plurality of IC-FPC connection electrodes 21 include an IC electrode 22, a ground electrode 24, an IC control electrode 26, a temperature measuring electrode 28a, and the like.
- the IC electrode 22 applies a voltage for operating the driving IC 11a.
- the ground electrode 24 holds the drive IC 11a and the individual electrode 19 connected to the drive IC 11a at a ground potential of, for example, 0 to 1V.
- the IC control electrode 26 supplies an electric signal for operating the drive IC 11a so as to control the on / off state of the switching element in the drive IC 11a.
- the temperature measuring electrode 28a supplies the temperature measured by the temperature measuring member 33 to the outside as a signal.
- the drive IC 11 a is arranged corresponding to each group of the plurality of heat generating portions 9 and is connected to the other end of the individual electrode 19 and one end of the IC-FPC connection electrode 21.
- the drive IC 11a is for controlling the energization state of each heat generating portion 9, and has a plurality of switching elements inside.
- As the drive IC 11a a known IC that is energized when each switching element is in an on state and de-energized when each switching element is in an off state can be used.
- drive IC11a was illustrated as a control part, a control part should just be able to control the electricity supply state of the heat generating part 9, and is not limited to drive IC.
- Each drive IC 11a is provided with a plurality of switching elements (not shown) inside so as to correspond to each individual electrode 19 connected to each drive IC 11a.
- one connection terminal 11 d (hereinafter referred to as the first connection terminal 11 d) connected to each switching element is connected to the individual electrode 19.
- the other connection terminal 11e (hereinafter, second connection terminal 11e) connected to each switching element is connected to the ground electrode 24 of the IC-FPC connection electrode 21.
- the first connection terminal 11d and the second connection terminal 11e of the drive IC 11a are soldered onto a coating layer 30 (described later) formed on the individual electrode 19 and the IC-FPC connection electrode 21 with solder (not shown). It is joined. Thereby, when each switching element of the driving IC 11a is in the ON state, the individual electrode 19 connected to each switching element and the ground electrode 24 of the IC-FPC connection electrode 21 are electrically connected.
- the common electrode 17 is for connecting the plurality of heat generating portions 9 and the FPC 5. As shown in FIGS. 1, 3, and 4, the common electrode 17 includes an extending portion 17a, a protruding portion 17b protruding from the extending portion 17a, and a lead portion 17c.
- the extending portion 17a is formed over the entire surface of the second main surface 7d and the first end surface 7a of the substrate 7, and is formed to extend along the first end surface 7a on the first main surface 7c of the substrate 7. .
- the common electrode 17 is formed over substantially the entire surface of the second main surface 7d and the first end surface 7a of the substrate 7, the area of the common electrode 17 can be increased, and the wiring of the common electrode 17 can be increased. Resistance can be reduced. Further, the current capacity of the common electrode 17 can be increased by increasing the area of the common electrode 17.
- the protruding portion 17 b is formed on the first main surface 7 c of the substrate 7 and protrudes from the extending portion 17 a located at the edge portion 7 g of the substrate 7.
- the lead portions 17 c individually extend from the extending portions 17 a located on the second main surface 7 d of the substrate 7 toward the heat generating portions 9.
- Each lead portion 17c has a tip portion disposed opposite one end of the individual electrode 19 with each heat generating portion 9 interposed therebetween.
- one end of the common electrode 17 is connected to the heat generating portion 9 on the first end face 7 a of the substrate 7. And it is provided in the state extended from the 1st end surface 7a of the board
- the other end of the common electrode 17 is disposed at one end of the first main surface 7c.
- the common electrode 17 constitutes the first electrode of the present invention.
- the common electrode 17 includes an extending portion 17 a located on the first main surface 7 c of the substrate 7 and a protruding portion 17 b located at the end of the common electrode 17.
- the electric resistance layer 15, the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 are formed by applying a material layer constituting each of them onto a substrate 7 on which the heat storage layer 13 is formed, such as a sputtering method. After sequentially laminating by a well-known thin film forming technique, the laminate is formed into a predetermined pattern by using a conventionally well-known photoetching or the like.
- the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 can be simultaneously formed by the same process.
- the thickness of the electric resistance layer 15 is, for example, 0.01 ⁇ m to 0.2 ⁇ m, and the thicknesses of the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 are, for example, 0.05 ⁇ m to 2.5 ⁇ m. be able to.
- the drive IC 11a is omitted, and the position where the drive IC 11a is mounted and the position where the temperature measuring member 33 is mounted are indicated by a one-dot chain line. Further, the terminals to which the driving IC 11a is connected are also omitted.
- a protrusion 17 b of the common electrode 17 is provided on the edge 7 g of the first main surface 7 c of the substrate 7, and the protrusion 17 b functions as the first reinforcing member 8. That is, the first reinforcing member 8 is formed by a part of the common electrode 17. Therefore, when the common electrode 17 is provided on the first main surface 7c of the substrate 7, the first reinforcing member 8 can also be formed. That is, it is not necessary to separately provide the first reinforcing member 8 by providing a separate manufacturing process, and the thermal head X1 provided with the first reinforcing member 8 can be easily manufactured.
- the first reinforcing member 8 includes a common electrode 17 provided on the edge 7g of the first main surface 7c, a common electrode 17 provided on the edge 7g of the first end surface 7a, and the second main surface 7d.
- the common electrode 17 is provided on the edge 7g. That is, the first reinforcing member 8 is provided over the first main surface 7c, the first end surface 7a, and the second main surface 7d of the substrate 7.
- the thermal head X1 the possibility that the edge 7g of the substrate 7 is chipped or cracked can be reduced. Therefore, the reliability of the thermal head X1 can be improved. In addition, even when the plurality of thermal heads X1 are divided and manufactured from the thermal head substrate, the possibility that the edge 7g of the thermal head X1 is chipped or cracked can be reduced.
- the first reinforcing member 8 is formed as a part of the common electrode 17, the first reinforcing member 8 is provided on the first main surface 7 c of the substrate 7 by providing the common electrode 17 integrally. It is provided over the first end surface 7a and the second main surface 7d. Therefore, the edge portion 7g of the substrate 7 can be further reinforced, and the possibility of occurrence of chipping or cracking can be reduced.
- the ground electrode 24 is provided on the edge 7g of the first main surface 7c, and the ground electrode 24 located on the edge 7g of the first main surface 7c is used as the second reinforcing member 10. Function. That is, the second reinforcing member 10 is formed by a part of the ground electrode 24. Therefore, when the ground electrode 24 is provided on the first main surface 7c of the substrate 7, the second reinforcing member 10 can also be formed.
- the second reinforcing member 10 is provided separately from the first reinforcing member 8. Therefore, even when the first reinforcing member 8 is thermally expanded due to heat generated when the thermal head X1 is driven, a space is provided between the first reinforcing member 8 and the second reinforcing member 8. The possibility that the second reinforcing member 10 is stressed due to the expansion and the second reinforcing member 10 is peeled off from the substrate 7 can be reduced.
- the thermal head X1 since the first reinforcing member 8 and the second reinforcing member 10 are provided on the edge 7g of the substrate 7, the possibility that the edge 7g of the substrate 7 is chipped or cracked is reduced. be able to. Therefore, the reliability of the thermal head X1 can be improved. In addition, even when a plurality of thermal heads X1 are divided from a thermal head substrate, the possibility of chipping or cracking at the end of the substrate 7 can be reduced.
- the thermal head X1 is provided so that the ground electrode 24 surrounds the IC electrode 22 and the IC control electrode 26. Therefore, even when a signal having a high frequency is supplied to the IC electrode 22 and the IC control electrode 26, the high frequency generated by the IC electrode 22 and the IC control electrode 26 can be shielded, and various components constituting the thermal head X1. Can be protected from high frequency.
- the ground electrode 24 is provided so as to surround the temperature measuring electrode 28a, the temperature measuring electrode 28a can be protected from the high frequency generated by the IC electrode 22 and the IC control electrode 26. Thereby, the temperature measurement temperature detected by the temperature measurement member 30 can be accurately transmitted.
- the heat generating portion 9 is provided on the second end surface 7b, and the common electrode 17 extends from the edge 7g of the first main surface 7c of the substrate 7 to the first end surface 7a of the substrate 7 and Since the second main surface 7b is provided over the second main surface 7b, the contact area of the heat generating portion 9 with the recording medium can be improved and the electric capacity of the common electrode 17 can be increased.
- the temperature measuring member 33 provided on the temperature measuring electrode 28a is provided to measure the temperature of the thermal head X1, and by controlling the drive IC 11a based on the temperature measured by the temperature measuring member 33, The thermal head X1 is controlled.
- the temperature measuring member 33 a member having a function of measuring temperature can be used.
- a member such as a thermocouple or a chip thermistor can be used.
- a part of the heat generating part 9 As shown in FIGS. 1 to 5, on the heat storage layer 13 and on the first main surface 7 c and the second main surface 7 d of the substrate 7, a part of the heat generating part 9, a part of the common electrode 17 and one of the individual electrodes 19 are provided.
- a first protective layer 25 that covers the portion is formed.
- the first protective layer 25 is provided so as to cover the entire surface of the heat storage layer 13, and the second main surface 7 d of the substrate 7 is provided so as to cover a region corresponding to the first main surface 7 c of the substrate 7.
- the first protective layer 25 protects the area covered with the heat generating portion 9, the common electrode 17 and the individual electrode 19 from corrosion due to adhesion of moisture contained in the atmosphere or wear due to contact with the recording medium to be printed. Is to do.
- the first protective layer 25 can be formed of, for example, a SiC-based material, a SiN-based material, a SiO-based material, or a SiON-based material. Further, the first protective layer 25 can be formed by using a conventionally well-known thin film forming technique such as a sputtering method or a vapor deposition method, or a thick film forming technique such as a screen printing method.
- the first protective layer 25 may be formed by stacking a plurality of material layers.
- the first protective layer 25 is likely to have a level difference on the surface due to the level difference between the surface of the common electrode 17 and the individual electrode 19 and the surface of the heat generating portion 9, but the thickness of the common electrode 17 and the individual electrode 19 is reduced. For example, by reducing the thickness to 0.2 ⁇ m or less, the step formed on the surface of the first protective layer 25 can be eliminated or reduced.
- a second protective layer 27 that partially covers the individual electrode 19 and the IC-FPC connection electrode 21 is provided on the first main surface 7 c of the substrate 7. Yes.
- the formation region of the second protective layer 27 is indicated by a one-dot chain line, and the illustration is omitted.
- the second protective layer 27 is for protecting the region covered with the individual electrode 19 and the IC-FPC connection electrode 21 from oxidation due to contact with the atmosphere or corrosion due to adhesion of moisture contained in the atmosphere. It is.
- the 2nd protective layer 27 can be formed with resin materials, such as an epoxy resin and a polyimide resin, for example.
- the second protective layer 27 can be formed using a thick film forming technique such as a screen printing method, for example.
- the end portion of the IC-FPC connection electrode 21 for connecting the FPC 5 is exposed from the second protective layer 27 so that the exposed region and the substrate 7 are connected. Yes.
- the second protective layer 27 is formed with an opening 27a (see FIG. 4) for exposing the end portions of the individual electrode 19 and the IC-FPC connection electrode 21 to which the driving IC 11a is connected.
- the individual electrode 19 and the IC-FPC connection electrode 21 are connected to the drive IC 11a via the.
- a coating layer 30 to be described later is formed on the end portions of the individual electrode 19 and the IC-FPC connection electrode 21 exposed from the opening 27a, and these layers are interposed via the coating layer 30 as described above.
- the electrode is soldered to the drive IC 11a.
- the connection strength of the drive IC 11a on the individual electrode 19 and the IC-FPC connection electrode 21 can be improved by solder-joining the drive IC 11a on the coating layer 30 formed by plating.
- the drive IC 11a is connected to the individual electrode 19 and the IC-FPC connection electrode 21 to protect the drive IC 11a itself, and to protect the connection portion between the drive IC 11a, the individual electrode 19 and the IC-FPC connection electrode 21. Therefore, it is sealed by being covered with a covering member (not shown) made of a resin such as an epoxy resin or a silicon resin.
- a third protective layer 29 that partially covers the common electrode 17 is provided on the second main surface 7 d of the substrate 7.
- the third protective layer 29 is provided so as to partially cover a region on the right side of the second main surface 7d of the substrate 7 with respect to the first protective layer 25.
- the third protective layer 29 is for protecting the region covered with the common electrode 17 from oxidation due to contact with the atmosphere or corrosion due to adhesion of moisture or the like contained in the atmosphere.
- the third protective layer 29 can be formed of a resin material such as an epoxy resin or a polyimide resin.
- the third protective layer 29 can be formed using a thick film forming technique such as a screen printing method.
- the region in the vicinity of the second end surface 7b of the common electrode 17 located on the second main surface 7d of the substrate 7 is not covered with the third protective layer 29,
- the coating layer 30 is adapted to be covered.
- the corner portion 7e formed by the first main surface 7c and the second end surface 7b of the substrate 7 and by the second main surface 7d and the second end surface 7b of the substrate.
- a region of the common electrode 17 located on the corner portion 7f is covered with a covering layer 30 formed by plating. More specifically, the covering layer 30 includes the entire region of the common electrode 17 positioned on the first main surface 7c and the second end surface 7b of the substrate 7 and the common electrode 17 positioned on the second main surface 7d of the substrate 7. The region in the vicinity of the second end face 7b is continuously covered.
- the covering layer 30 can be formed by, for example, well-known electroless plating or electrolytic plating.
- a first coating layer made of nickel plating may be formed on the common electrode 17, and a second coating layer made of gold plating may be formed on the first coating layer.
- the thickness of the first coating layer can be set to, for example, 1.5 ⁇ m to 4 ⁇ m
- the thickness of the second coating layer can be set to, for example, 0.02 ⁇ m to 0.1 ⁇ m.
- the coating layer 30 formed by plating is also formed on the end of the IC-FPC connection electrode 21 that connects the FPC 5. Thereby, as will be described later, the FPC 5 is connected to the coating layer 30.
- the coating layer 30 formed by plating is formed on the individual electrodes 19 exposed from the openings 27a of the second protective layer 27 and the end portions of the IC-FPC connection electrodes 21. Also formed.
- the drive IC 11a is connected to the individual electrode 19 and the IC-FPC connection electrode 21 via the coating layer 30.
- the FPC 5 extends along the arrangement direction of the heat generating portions 9, and extends the common electrode 17 provided on the first main surface 7 c of the substrate 7 as described above. It is connected to the portion 17a, the protruding portion 17b of the common electrode 17, and each IC-FPC connection electrode 21.
- the FPC 5 a well-known one in which a plurality of printed wirings 5b are wired inside an insulating resin layer can be used. Each printed wiring 5b is electrically connected to an external power supply device and control device (not shown) via a connector 31.
- Such a printed wiring 5b is generally formed of, for example, a metal foil such as a copper foil, a conductive thin film formed by a thin film forming technique, or a conductive thick film formed by a thick film printing technique. Further, the printed wiring 5b formed of a metal foil or a conductive thin film is patterned by, for example, partially etching these by photoetching or the like.
- each printed wiring 5b formed inside the insulating resin layer 5a is exposed at the end on the head base 3 side, and the conductive bonding material
- the common electrode 17 and the IC-FPC connection electrode 21 are connected by a bonding material 32 made of, for example, a solder material or an anisotropic conductive material (ACF) in which conductive particles are mixed in an electrically insulating resin. ing.
- the coating layer 30 is formed on the common electrode 17 located on the first main surface 7c of the substrate 7 as described above, the printed wiring 5b connected to the common electrode 17 is formed. Are connected on the covering layer 30 via the bonding material 32. Further, as shown in FIG. 4, since the coating layer 30 is also formed on the end portion of each IC-FPC connection electrode 21, the printed wiring 5b connected to each IC-FPC connection electrode 21 is bonded to the bonding material. It is connected to this coating layer 30 via 32. Thus, the connection strength of the printed wiring 5b on the common electrode 17 and the IC-FPC connection electrode 21 can be improved by connecting the printed wiring 5b onto the coating layer 30 formed by plating.
- the common electrode 17 When each printed wiring 5b of the FPC 5 is electrically connected to an external power supply device and a control device (not shown) via the connector 31, the common electrode 17 has a power supply held at a positive potential of 20 to 24V, for example. Electrically connected to the positive terminal of the device.
- the individual electrode 19 is electrically connected to the negative terminal of the power supply device held at the ground potential via the ground electrode 24 of the drive IC 11a and the IC-FPC connection electrode 21. Therefore, when the switching element of the drive IC 11a is in the on state, a voltage is applied to the heat generating part 9, and the heat generating part 9 generates heat.
- each printed wiring 5b of the FPC 5 is electrically connected to an external power supply device and control device (not shown) via the connector 31, the IC electrode 22 of the IC-FPC connection electrode 21 is Similar to the common electrode 17, it is electrically connected to the positive terminal of the power supply device held at a positive potential.
- a voltage for operating the drive IC 11a is applied to the drive IC 11a by the potential difference between the IC electrode 22 of the IC-FPC connection electrode 21 to which the drive IC 11a is connected and the ground electrode 24.
- the IC electrode 22 of the IC-FPC connection electrode 21 is electrically connected to an external control device that controls the driving IC 11a. Thereby, the electric signal transmitted from the control device is supplied to the drive IC 11a.
- the FPC 5 is fixed on the radiator 1 by being bonded to the upper surface of the protrusion 1b of the radiator 1 by a double-sided tape or an adhesive (not shown).
- the common electrode 17 is provided over the entire surface of the second main surface 7d.
- the common electrode 17 may not be provided over the entire surface of the second main surface 7d.
- the first reinforcing member 8 can be formed at the end of the substrate 7 in the arrangement direction of the heat generating portions 9 by providing the common electrode 17 at the end of the substrate 7 in the arrangement direction of the heat generating portions 9. The possibility of chipping or cracking in the thermal head X1 can be suppressed.
- the covering layer 30 may be provided on the common electrode 17 provided at the end of the substrate 7 in the arrangement direction of the heat generating portions 9. Even in that case, the strength of the edge portion 7g of the substrate 7 in the arrangement direction of the heat generating portions 9 can be further improved.
- the first reinforcing member 8 may be formed by the extending portion 17 a of the common electrode 17.
- FIG. 6 is a plan view showing a thermal head substrate Y1
- FIG. 7 is a schematic plan view schematically showing a thermal head X1 produced by dividing the thermal head substrate Y1.
- the thermal head substrate Y1 includes a plurality of heat generating portions 9, a control terminal group 11c, an individual electrode 19, an IC-FPC connection electrode 21, and a temperature measuring terminal group 28c.
- the control terminal group 11a is formed by forming a plurality of control terminals 11b for mounting the drive IC 11a.
- the temperature measuring terminal group 28c is formed by forming a plurality of temperature measuring terminals 28b, which are terminals for electronic components for mounting electronic components such as the temperature measuring member 33. Note that the driving IC 11a and the temperature measuring member 33 are not mounted on the thermal head substrate Y1, but the mounting positions are indicated by a one-dot chain line.
- the thermal head substrate Y1 includes a plurality of IC-FPC connections including a heat generating portion 9, a plurality of control terminal groups 11c, a plurality of individual electrodes 19, an IC electrode 22, a ground electrode 24, and an IC control electrode 26. It has the section 14 of the area
- the thermal head X1 can be manufactured by dividing such a thermal head substrate Y1 into sections. Specifically, it can be divided by marking the part indicated by A in FIG. 6 and laser cutting. Alternatively, a groove called a scribe may be provided in a marked portion by laser processing, and then pressed to be divided.
- the thermal head X1 is mounted on the divided thermal head substrate Y1 by mounting electronic components such as the driving IC 11a, the temperature measuring member 33, the capacitor (not shown), the resistor (not shown), or the coil (not shown). Can be produced.
- FIG. 8 is a schematic configuration diagram of the thermal printer Z of the present embodiment.
- the thermal printer Z of the present embodiment includes the above-described thermal head X1, the transport mechanism 40, the platen roller 50, the power supply device 60, and the control device 70.
- the thermal head X1 is attached to an attachment surface 80a of an attachment member 80 provided in a housing (not shown) of the thermal printer Z1.
- the thermal head X1 is attached to the attachment member 80 such that the arrangement direction of the heat generating portions 9 is along a direction orthogonal to the conveyance direction S of the recording medium P, which will be described later, in other words, along the main scanning direction. .
- the transport mechanism 40 transports the recording medium P such as thermal paper, image receiving paper, card, etc. in the direction of arrow S in FIG. 8 and on the plurality of heat generating portions 9 of the thermal head X1 (more specifically, on the protective layer 25). And has conveying rollers 43, 45, 47, and 49.
- the transport rollers 43, 45, 47, and 49 are formed by, for example, covering cylindrical shaft bodies 43a, 45a, 47a, and 49a made of metal such as stainless steel with elastic members 43b, 45b, 47b, and 49b made of butadiene rubber or the like. Can be configured.
- an ink film is transported together with the recording medium P between the recording medium P and the heat generating portion 9 of the thermal head X1.
- the platen roller 50 is for pressing the recording medium P onto the heat generating portion 9 of the thermal head X1, and is disposed so as to extend along a direction orthogonal to the conveyance direction S of the recording medium P. Both ends are supported so as to be rotatable while being pressed on the heat generating portion 9.
- the platen roller 50 can be configured by, for example, covering a cylindrical shaft body 50a made of metal such as stainless steel with an elastic member 50b made of butadiene rubber or the like.
- the power supply device 60 is for supplying a current for causing the heat generating portion 9 of the thermal head X1 to generate heat and a current for operating the drive IC 11a as described above.
- the control device 70 is for supplying a control signal for controlling the operation of the driving IC 11a to the driving IC 11a in order to selectively generate heat in the heat generating portion 9 of the thermal head X1 as described above.
- the heating mechanism 9 is selected by the power supply device 60 and the control device 70 while conveying the recording medium P onto the heating portion 9 of the thermal head X1 by the conveyance mechanism 40.
- a predetermined printing can be performed on the recording medium P.
- the recording medium P is an image receiving paper, a card, or the like
- printing on the recording medium P can be performed by thermally transferring ink of an ink film (not shown) conveyed with the recording medium P to the recording medium P. .
- the thermal head X2 shown in FIG. 9 is provided with a second reinforcing member 10 at a portion surrounded by a two-dot chain line C.
- a second reinforcing member 10 As the second reinforcing member 10, an IC-FPC connection electrode 21 is provided. As described above, the IC electrode 22, the ground electrode 24, the IC control electrode 26, and the temperature measuring electrode 28a connect the joining auxiliary member 12 to each other. It is composed. Other configurations are the same as those of the first embodiment.
- the common electrode 17 is provided on the edge 7 g of the substrate 7. Therefore, the common electrode 17 serves as the first reinforcing member 8 and the ground electrode 24 serves as the joining auxiliary member 12, and the strength of the edge portion 7g of the substrate 7 can be improved.
- the FPC 5 and the substrate 7 are electrically connected at the other end of the common electrode 17. More specifically, the extension portion 17a and the protruding portion 17b are electrically connected. Similarly, the other end of the IC-FPC connection electrode 21 and the FPC 5 are electrically connected. More specifically, the IC electrode 22, the ground electrode 24, the IC control electrode 26, the temperature measuring electrode 28a, and the FPC 5 are electrically connected.
- the coefficient of thermal expansion differs depending on the formed material. Deformation extending in the direction may occur. The FPC may peel from the substrate due to the stress generated by the deformation. This may occur particularly at the edge of the substrate having a large amount of deformation.
- the thermal head X2 since the joining auxiliary member 12 is provided apart from the first reinforcing member 8 and the heat generating portion 9 in the arrangement direction, the IC as the joining auxiliary member 12 is provided. -When the FPC connection electrode 21 and the printed wiring 5b of the FPC 5 are connected by solder, the stress generated by the deformation of the FPC 5 by the solder can be relieved, and the possibility that the substrate 7 and the FPC 5 are separated is reduced. be able to. That is, compared with the case where the joining auxiliary member 12 is not provided, the joining area between the substrate 7 and the FPC 5 can be increased, and the stress generated in each solder connecting the substrate 7 and the FPC 5 can be dispersed. Therefore, the possibility that the substrate 7 and the FPC 5 are separated can be reduced.
- the common electrode 17 as the first reinforcing member 8 on the edge 7g of the substrate 7, it is possible to reduce the stress generated at the edge 7g of the substrate 7 where peeling easily occurs. Thereby, possibility that peeling with the board
- the joining auxiliary member 12 located on the edge portion 7g of the substrate 7 and the FPC 5 may peel off, but the joining auxiliary member 12 and the FPC 5 peel off.
- the joining auxiliary member 12 and the FPC 5 are not electrically connected, and the possibility that the electrical connection between the substrate 7 and the FPC 5 is cut off can be reduced.
- the common electrode 17 as the first reinforcing member 8 or the IC-FPC connection electrode 21 as the joining auxiliary member 12 is provided.
- the thickness of the anisotropic conductive adhesive in the arrangement direction of the heat generating portions 9 can be made close to uniform. That is, if the joining auxiliary member 12 is not provided, the thickness of the edge portion 7g of the substrate 7 is reduced by the thickness equivalent to the thickness of the joining auxiliary member 12, and the joining strength of the edge portion 7g of the substrate 7 is weakened. there is a possibility.
- the thermal head X2 can make the thickness of the anisotropic conductive adhesive in the arrangement direction of the heat generating portions 9 uniform by providing the joining auxiliary member 12. Therefore, the connection strength between the substrate 7 and the FPC 5 can be improved.
- the bonding auxiliary member 12 can be easily provided on the substrate 7 without providing a separate pattern.
- substrate 7 and FPC5 is not limited to the connection by solder and ACF connection.
- solder a conductive adhesive
- the connection between the substrate 7 and the FPC 5 can be strengthened.
- the protruding portion 16 protruding toward the ground electrode 24 from the extending portion 17a of the common electrode 17 provided on the first main surface 7c is provided. Is provided. That is, a plurality of protruding portions 16 protruding toward the IC-FPC connection electrode 21 are provided. In addition, a protruding portion 16 that protrudes from the extending portion 17a of the common electrode 17 provided on the first main surface 7c to the temperature measuring electrode 28a on which the temperature measuring member 33 is mounted is also provided. The protruding portion 16 that protrudes toward the temperature measuring electrode 28 a of the first electrode extends to a region where the temperature measuring member 33 is mounted so as to enter below the temperature measuring member 33.
- the IC-FPC connection electrode 21 for connecting the driving IC 11a and the FPC 5 is provided with high density wiring. Therefore, when the thermal head X3 is activated, the temperature becomes high, and the temperature of the temperature measuring member 33 provided on the temperature measuring electrode 28a is detected to be higher than the actual temperature, thereby controlling the thermal head X3 with high accuracy. It may not be possible.
- the thermal head X3 since the protrusion 16 of the common electrode 17 is directed toward the IC-FPC connection electrode 21, heat in the vicinity of the IC-FPC connection electrode 21 passes through the protrusion 16. Heat is radiated to the common electrode 17 provided on the second main surface 7d. Thereby, the heat in the vicinity of the IC-FPC connection electrode 21 can be efficiently radiated, and the temperature can be accurately measured by the temperature measuring member 33. Therefore, it is possible to control the thermal head X3 with high accuracy. Note that the protruding portion 16 that protrudes toward the temperature measuring electrode 28a of the first electrode may not extend to a region where the temperature measuring member 33 is mounted. Even in that case, the possibility that the vicinity of the temperature measuring member 33 becomes high can be reduced.
- thermal head substrate Y2 for producing the thermal head X3 will be described with reference to FIGS.
- the thermal head substrate Y2 shown in FIG. 11 is provided with a joining auxiliary member 12 at both ends in the arrangement direction of the heat generating portions 9. And it has further the protrusion part 16 which protruded toward the temperature measuring terminal group 28c from the extension part 17a of the common electrode 17.
- the part surrounded by the alternate long and short dash line C functions as the joining auxiliary member 12.
- the joining auxiliary member 12 is provided with the IC-FPC connection electrode 21.
- the IC electrode 22, the ground electrode 24, the IC control electrode 26, and the temperature measuring electrode 28a constitute the joining auxiliary member 12. Yes.
- the temperature measuring terminal group 28 c also constitutes the joining auxiliary member 12.
- Other configurations are the same as those of the thermal head substrate Y1 according to the first embodiment.
- the section 14 indicated by B is repeatedly patterned in the longitudinal direction of the thermal head substrate Y2.
- the section 14 has a plurality of individual electrodes 19, an IC-FPC connection electrode 21, a temperature measuring electrode 28 a, and a common electrode 17. More specifically, as shown in FIG. 11 (b), the section 14 is provided so as to be surrounded by the ground electrode 24, the extended portion 17 a of the common electrode 17, and the protruding portion 16 of the common electrode 17.
- the temperature measuring terminal group 28c, the control terminal group 11c, and the protruding portion 16 are provided inside.
- the joining auxiliary member 12 is provided at the end portion in the arrangement direction of the heat generating portions 9, when the thermal head X3 is manufactured by being divided, the joining auxiliary member 12 is provided at the end portion of the thermal head X3. be able to.
- the thermal head X3 can be manufactured by dividing the thermal head substrate Y2 on which the same and repeated sections 14 are formed, the thermal head X3 having an arbitrary length can be easily manufactured. Further, since the section 14 has the temperature measuring terminal group 28c, after dividing the thermal head substrate Y2, an arbitrary temperature measuring member 33 or the like can be mounted on the temperature measuring terminal group 28c in accordance with the purpose. Therefore, the structure of the thermal head X3 can be easily changed, and the design change of the thermal head X3 can be facilitated.
- the thermal head X3 including the joining auxiliary member 12 in the arrangement direction of the heat generating portions 9 can be easily manufactured. .
- the section 14 has one control element group 11c, the length of the thermal head X3 can be changed for each of the nine heat generating sections corresponding to one drive IC 11a. Therefore, the productivity of the thermal head can be improved.
- the thermal head X4 according to the fourth embodiment is configured by dividing the protruding portion 16 shown in the thermal head X3 according to the third embodiment into a plurality of parts.
- the IC-FPC connection electrode 21 has a plurality of protrusions 21 b adjacent to the protrusion 16 of the common electrode 17. Then, the width of the protruding portion 21b of the IC-FPC connection electrode 21 in the arrangement direction of the heat generating portion 9 connected to the printed wiring 5b of the FPC 5 and the width of the protruding portion 16 of the common electrode 17 in the arrangement direction of the heat generating portion 9 Are substantially equal.
- the connection state between the protrusion 16 and each IC-FPC connection electrode 21 and the printed wiring 5b of the FPC 5 has a similar shape. That is, the solder forms a fillet and each is connected, but the shape of the fillet can be brought close to the same shape. Therefore, the stress generated in each solder connecting the substrate 7 and the FPC 5 can be made close to each other, and the bonding strength between the substrate 7 and the FPC 5 can be improved.
- the anisotropic conductivity provided on the second reinforcing member 10 is also provided.
- the adhesive can be made to uniformly flow between the IC-FPC connection electrodes 21, and the thickness of the anisotropic conductive adhesive provided on the IC-FPC connection electrodes 21 can be made close to uniform.
- the thickness of the anisotropic conductive adhesive can be made uniform in the arrangement direction of the heat generating portions 9, and the bonding strength can be made uniform.
- the width of the IC-FPC connection electrode 21 in the arrangement direction of the heat generating portions 9 and the width of the end portion of the common electrode 17 in the arrangement direction of the heat generating portions 9 are substantially equal to each other, which includes a range of errors generated in the manufacturing process. Is.
- the first reinforcing member 8 and the second reinforcing member 10 may be formed as separate members.
- the first reinforcing member 8 and the second reinforcing member 10 can be formed of the same material as the second protective layer 27 or the first protective layer 25.
- the first reinforcing member 8 and the second reinforcing member 10 can be easily provided in a predetermined shape. . Furthermore, since it does not need to have a function as an electrode, it can also be manufactured by an insulating member. Examples of the method for forming the first reinforcing member 8 and the second reinforcing member 10 include printing, sputtering, dipping, and the like. The first reinforcing member 8 and the second reinforcing member 10 may be formed using a predetermined method depending on the material to be formed.
- the first reinforcing member 8 may be formed by a part of the common electrode 17, and the first reinforcing member 8 may be provided as a separate member.
- the second reinforcing member 10 may be formed by a part of the IC-FPC connection electrode 21, and the second reinforcing member 10 may be provided as a separate member. Thereby, the strength of the edge 7g of the substrate 7 can be further improved.
- the common electrode 17 and the IC-FPC connection electrode 21 provided on the substrate 7 of the head base 3 are electrically connected to an external power supply device, a control device, etc. via the FPC 5.
- the present invention is not limited to this.
- various wirings of the head base 3 are connected to an external power source via a hard printed wiring board instead of a flexible printed wiring board having flexibility like the FPC 5. It may be electrically connected to a device or the like.
- the common electrode 17 and the IC-FPC connection electrode 21 of the head substrate 3 and the printed wiring of the printed wiring board may be connected by wire bonding or the like.
- the electric resistance layer 15 is not only on the heat storage layer 13, but also the first main surface 7c and the second main surface of the substrate 7. Although it is provided also on 7d, as long as it is connected to the common electrode 17 and the individual electrode layer 19 on the 2nd end surface 7b of the board
- the common electrode 17 extends from the second end surface 7 b of the substrate 7 to the second main surface 7 d of the substrate 7, and is folded back on the second main surface 7 d of the substrate 7. In this manner, the first main surface 7c of the substrate 7 may be extended via the second end surface 7b of the substrate 7.
- the second end surface 7b of the substrate 7 has a convex curved surface, but the surface of the second end surface 7b of the substrate 7
- the shape and the inclination angle are not particularly limited, and can take any form.
- the second end surface 7b of the substrate 7 may have a planar shape or a bent surface.
- the angle formed between the first main surface 7c and the second main surface 7d of the substrate 7 and the second end surface 7b of the substrate 7 may not be a right angle but may be an obtuse angle or an acute angle.
- the common electrode 17 is formed on the substrate 7 via the second end surface 7b of the substrate 7, the second main surface 7d of the substrate 7, and the first end surface 7a of the substrate 7. 7 extends over the first main surface 7c of the first embodiment, but is not limited thereto.
- the common electrode 17 may be formed only on the second end surface 7b and the second main surface 7d of the substrate 7. In this case, the common electrode 17 formed on the second main surface 7d of the substrate 7 and the printed wiring 5b of the FPC 5 may be connected by a separately provided jumper line.
- the first reinforcing member 8 can suppress the possibility of chipping or cracking of the substrate 7.
- the substrate 7 is preferably provided at both ends of the substrate 7 in the arrangement direction of the heat generating portions 9 in order to prevent the substrate 7 from being chipped or cracked.
- the first holding member 8 may be provided on the end surface of the substrate 7 orthogonal to the arrangement direction of the heat generating portions 9. Even in that case, the strength of the end portion of the substrate 7 in the arrangement direction of the heat generating portions 9 can be further improved.
- X1 to X5 Thermal head 1 Radiator 3 Head base 5 Flexible printed circuit board 7 Substrate 7a First end surface 7b Second end surface 7c First main surface 7d Second main surface 7g Edge portion 8 First reinforcing member 9 Heating portion 10 Second Reinforcing member 11 Drive IC 12 Joint Auxiliary Member 14 Partition 16 Projection 17 Common Electrode 19 Individual Electrode 21 IC-FPC Connection Electrode 22 IC Electrode 24 Ground Electrode 26 IC Control Electrode 28a Temperature Measuring Electrode
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Electronic Switches (AREA)
Abstract
Description
以下、本発明のサーマルヘッドの第1の実施形態について、図面を参照しつつ説明する。
図9を用いて本発明の第2の実施形態について説明する。
図10に示すように、第3の実施形態に係るサーマルヘッドX3は、第1主面7c上に設けられた共通電極17の延出部17aから、グランド電極24側へ突出する突出部16が設けられている。つまり、IC-FPC接続電極21に向けて突出した複数の突出部16を有している。また、第1主面7c上に設けられた共通電極17の延出部17aから、測温部材33が実装される測温電極28aへ突出する突出部16も設けられている。第1電極の測温電極28aへ向けて突出する突出部16は、測温部材33の下方に入り込むように、測温部材33が搭載される領域にまで延びている。
図13に示すように、第4の実施形態に係るサーマルヘッドX4は、第3の実施形態に係るサーマルヘッドX3で示した突出部16が複数に分割されて構成されている。また、IC-FPC接続電極21は、共通電極17の突出部16と隣り合う複数の突出部21bを有している。そして、FPC5のプリント配線5bと接続される、発熱部9の配列方向におけるIC-FPC接続電極21の突出部21bの幅と、共通電極17の突出部16の発熱部9の配列方向における幅とが略等しくなっている。
1 放熱体
3 ヘッド基体
5 フレキシブルプリント配線基板
7 基板
7a 第1端面
7b 第2端面
7c 第1主面
7d 第2主面
7g 縁部
8 第1補強部材
9 発熱部
10 第2補強部材
11 駆動IC
12 接合補助部材
14 区画
16 突出部
17 共通電極
19 個別電極
21 IC-FPC接続電極
22 IC電極
24 グランド電極
26 IC制御電極
28a 測温電極
Claims (11)
- 基板と、
該基板上に設けられた複数の発熱部と、を備え、
前記基板は、第1主面、該第1主面の反対側に位置する第2主面、および前記第1主面と前記第2主面とにつながっており、かつ複数の前記発熱部の配列方向に沿う第1端面を有し、
前記基板の前記第1主面、前記第1端面および前記第2主面には、それぞれ複数の前記発熱部の配列方向と交差する方向に縁部が設けられており、
前記基板の前記第1主面の前記縁部上に、第1補強部材および該第1補強部材と離間する第2補強部材が設けられており、
前記第1補強部材は、前記第1主面の前記縁部上から、前記第1端面の前記縁部上および前記第2主面の前記縁部上にわたって設けられていることを特徴とするサーマルヘッド。 - 前記発熱部に電気を供給するための外部基板と、
前記基板上に設けられており、かつ前記発熱部および前記外部基板を電気的に接続する第1電極と、をさらに備え、
前記第1補強部材が前記第1電極の一部を兼ねている、請求項1に記載のサーマルヘッド。 - 前記基板の前記第1主面上に設けられた制御部と、
前記基板の前記第1主面上に設けられており、かつ前記制御部および前記外部基板を電気的に接続する第2電極と、をさらに備え、
前記第2補強部材が前記第2電極の一部を兼ねている、請求項2に記載のサーマルヘッド。 - 前記基板の前記第1主面上に、前記接合補助部材が設けられており、
前記接合補助部材は、前記第1補強部材と複数の前記発熱部の配列方向に離間して配置されている、請求項3に記載のサーマルヘッド。 - 前記基板は、前記第1端面の反対側に位置する第2端面をさらに有し、
前記複数の発熱部が前記第2端面上に設けられており、
前記第1電極が、前記基板の前記第1主面上から、前記基板の前記第1端面上、前記第2主面上および前記第2端面にわたって設けられている、請求項2乃至4のいずれか1項に記載のサーマルヘッド。 - 前記第1電極が、前記基板の前記第1端面および前記第2主面の略全面にわたって設けられている、請求項5に記載のサーマルヘッド。
- 前記第1電極は、前記基板の前記第1主面の前記第1端面との縁に沿って設けられた延出部と、該延出部より前記第1端面側から前記第2電極側へ突出する突出部を有しており、
該突出部が前記第2電極に囲まれている、請求項3乃至6のいずれか1項に記載のサーマルヘッド。 - 前記第2電極は、前記第1電極の前記突出部と隣り合う複数の突出部を有し、前記第1電極の前記突出部の幅と、前記第2電極の前記突出部の幅とが略等しい、請求項7に記載のサーマルヘッド。
- 前記発熱部の温度を測定するための測温部材と、
前記基板の前記第1主面上に設けられており、前記測温部材が実装される測温電極と、をさらに備え、
前記第1電極の前記突出部は、前記測温部材側へ向けて突出している、請求項7または8に記載のサーマルヘッド。 - 前記突出部が、前記測温部材の下方にまで延びている、請求項9に記載のサーマルヘッド。
- 請求項1乃至10のいずれかに記載のサーマルヘッドと、前記発熱部上に記録媒体を搬送する搬送機構と、前記発熱部上に前記記録媒体を押圧するプラテンローラとを備えることを特徴とするサーマルプリンタ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013521637A JP5744200B2 (ja) | 2011-06-24 | 2012-06-22 | サーマルヘッドおよびこれを備えるサーマルプリンタ |
CN201280028226.1A CN103596767B (zh) | 2011-06-24 | 2012-06-22 | 热敏头以及具备该热敏头的热敏打印机 |
US14/128,590 US8922610B2 (en) | 2011-06-24 | 2012-06-22 | Thermal head and thermal printer provided with same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-140788 | 2011-06-24 | ||
JP2011140788 | 2011-06-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012176884A1 true WO2012176884A1 (ja) | 2012-12-27 |
Family
ID=47422711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/066014 WO2012176884A1 (ja) | 2011-06-24 | 2012-06-22 | サーマルヘッドおよびこれを備えるサーマルプリンタ |
Country Status (4)
Country | Link |
---|---|
US (1) | US8922610B2 (ja) |
JP (1) | JP5744200B2 (ja) |
CN (1) | CN103596767B (ja) |
WO (1) | WO2012176884A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3162575B1 (en) * | 2014-06-24 | 2019-11-20 | KYOCERA Corporation | Thermal head and thermal printer |
US9744775B2 (en) * | 2014-07-29 | 2017-08-29 | Kyocera Corporation | Thermal head and thermal printer |
US9937728B2 (en) * | 2014-08-26 | 2018-04-10 | Kyocera Corporation | Thermal head and thermal printer |
CN107000446B (zh) * | 2014-12-25 | 2018-12-04 | 京瓷株式会社 | 热敏头以及热敏打印机 |
US10596826B2 (en) * | 2015-09-28 | 2020-03-24 | Kyocera Corporation | Thermal head and thermal printer |
JP6904728B2 (ja) * | 2017-02-27 | 2021-07-21 | セイコーインスツル株式会社 | ヘッド駆動装置、サーマルプリンタ、及び制御方法 |
US10543696B2 (en) * | 2017-06-08 | 2020-01-28 | Rohm Co., Ltd. | Thermal print head |
JP7037401B2 (ja) * | 2018-03-26 | 2022-03-16 | ローム株式会社 | サーマルプリントヘッド |
CN112721460B (zh) * | 2021-01-13 | 2023-11-17 | 广州晖印科技有限公司 | 一种分离式反置结构的热敏打印头 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0585642U (ja) * | 1992-04-24 | 1993-11-19 | 株式会社三協精機製作所 | 平面型サーマルヘッド |
JP2001096783A (ja) * | 1999-09-29 | 2001-04-10 | Kyocera Corp | サーマルヘッド |
JP2006231703A (ja) * | 2005-02-24 | 2006-09-07 | Fuji Photo Film Co Ltd | 記録ヘッド |
JP2006312244A (ja) * | 2005-05-06 | 2006-11-16 | Alps Electric Co Ltd | サーマルヘッド及びその製造方法 |
JP2007055230A (ja) * | 2005-07-28 | 2007-03-08 | Kyocera Corp | 記録ヘッド及びそれを用いたプリンタ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02297457A (ja) * | 1989-05-12 | 1990-12-07 | Copal Co Ltd | 静電遮閉膜付サーマルヘッド |
US5200760A (en) * | 1990-09-28 | 1993-04-06 | Tohoku Pioneer Electronic Corporation | Thermal head for a thermal printer |
JP3476927B2 (ja) | 1994-10-31 | 2003-12-10 | 京セラ株式会社 | サーマルヘッド |
CN100430232C (zh) * | 2004-10-27 | 2008-11-05 | 京瓷株式会社 | 热敏头与热敏头的制造方法以及热敏打印机 |
CN101499465A (zh) * | 2008-01-29 | 2009-08-05 | 京瓷株式会社 | 热电模块及其制造方法 |
-
2012
- 2012-06-22 US US14/128,590 patent/US8922610B2/en active Active
- 2012-06-22 JP JP2013521637A patent/JP5744200B2/ja active Active
- 2012-06-22 CN CN201280028226.1A patent/CN103596767B/zh active Active
- 2012-06-22 WO PCT/JP2012/066014 patent/WO2012176884A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0585642U (ja) * | 1992-04-24 | 1993-11-19 | 株式会社三協精機製作所 | 平面型サーマルヘッド |
JP2001096783A (ja) * | 1999-09-29 | 2001-04-10 | Kyocera Corp | サーマルヘッド |
JP2006231703A (ja) * | 2005-02-24 | 2006-09-07 | Fuji Photo Film Co Ltd | 記録ヘッド |
JP2006312244A (ja) * | 2005-05-06 | 2006-11-16 | Alps Electric Co Ltd | サーマルヘッド及びその製造方法 |
JP2007055230A (ja) * | 2005-07-28 | 2007-03-08 | Kyocera Corp | 記録ヘッド及びそれを用いたプリンタ |
Also Published As
Publication number | Publication date |
---|---|
US8922610B2 (en) | 2014-12-30 |
JPWO2012176884A1 (ja) | 2015-02-23 |
US20140132696A1 (en) | 2014-05-15 |
CN103596767A (zh) | 2014-02-19 |
JP5744200B2 (ja) | 2015-07-08 |
CN103596767B (zh) | 2016-08-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5744200B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5836825B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5952176B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
WO2020241581A1 (ja) | サーマルプリントヘッド | |
JP5937309B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6001465B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP2013028021A (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5882613B2 (ja) | サーマルヘッドの製造方法 | |
JP2012030380A (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6017923B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5806002B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5840917B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6290632B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5783709B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ、ならびにサーマルヘッドの製造方法 | |
JP6075767B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6582060B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP6670654B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP5917870B2 (ja) | サーマルヘッド、およびこれを備えるサーマルプリンタ | |
JP6189714B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6154339B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP5649439B2 (ja) | サーマルヘッド | |
JP5844550B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP5918049B2 (ja) | サーマルヘッドおよびこれを備えるサーマルプリンタ | |
JP6199814B2 (ja) | サーマルヘッドおよびサーマルプリンタ | |
JP5952122B2 (ja) | サーマルヘッド、およびサーマルプリンタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12802742 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013521637 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14128590 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12802742 Country of ref document: EP Kind code of ref document: A1 |