WO2012078419A2 - Procédé d'application de film et procédé de broyage d'une surface arrière, procédé de formation d'une puce semi-conductrice et appareil d'application de film - Google Patents

Procédé d'application de film et procédé de broyage d'une surface arrière, procédé de formation d'une puce semi-conductrice et appareil d'application de film Download PDF

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Publication number
WO2012078419A2
WO2012078419A2 PCT/US2011/062523 US2011062523W WO2012078419A2 WO 2012078419 A2 WO2012078419 A2 WO 2012078419A2 US 2011062523 W US2011062523 W US 2011062523W WO 2012078419 A2 WO2012078419 A2 WO 2012078419A2
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WO
WIPO (PCT)
Prior art keywords
film
liquid adhesive
frame member
front surface
grinding
Prior art date
Application number
PCT/US2011/062523
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English (en)
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WO2012078419A3 (fr
Inventor
Kazuta Saito
Shinya Nakajima
Original Assignee
3M Innovative Properties Company
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Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of WO2012078419A2 publication Critical patent/WO2012078419A2/fr
Publication of WO2012078419A3 publication Critical patent/WO2012078419A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Definitions

  • the present invention relates to a method for applying a film to a surface of an object.
  • the present invention also relates to a method for grinding a back surface of an object with a film applied on the front surface of the object.
  • the present invention also relates to a method for forming a semiconductor chip including the step of grinding a back surface of a wafer.
  • circuit side a protective film or a glass plate applied to the surface having circuit pattern formed thereon
  • the thickness of the wafer is uniformly reduced by grinding the wafer surface in the side opposite to the circuit side, and the thinned wafer is cut and divided (generally called as dicing) to obtain a plurality of semiconductor chips.
  • Japanese Unexamined Patent Publication (Kokai) No. 2005-150235 discloses a semiconductor surface protection method and a semiconductor surface protection sheet that permits backside grinding of a semiconductor wafer to an ultra thin wafer, and permits backside grinding of a semiconductor wafer having high protrusions such as solder bumps on the circuit side.
  • the semiconductor surface protection method as disclosed in Japanese Unexamined Patent Publication (Kokai) No. 2005-150235 comprises the steps of laminating polymer film material to said circuit side of the semiconductor wafer via a surface protection layer which is fluid at room temperature or is fluidified by heating, and is hardened upon irradiation of radiation energy or by heating, and solidifying said semiconductor protection sheet.
  • the surface protection sheet can be laminated by bringing it to close contact with the circuit side of the semiconductor wafer after heating or during heating.
  • the sheet can be brought into close contact with the circuit side of the wafer in a vacuum chamber. Perfect lamination that is free from inclusion of air bubbles can be achieved with these methods.
  • the wafer With the circuit side of the wafer protected by the surface protection sheet, the wafer can be thinned by grinding the wafer surface opposite to the circuit side.
  • the wafer obtained via said backside grinding step after being fixed by bonding the finished ground surface to a dicing sheet, is transferred onto the dicing sheet by removing the surface protection sheet by peeling, and is sent to the dicing step.
  • Japanese Unexamined Patent Publication (Kokai) No. 2005-159155 discloses a method for effectively preventing chipping in dicing in the method of manufacturing semiconductor chips, including dicing step of a semiconductor wafer.
  • 2005-159155 comprises the steps of applying a light/heat exchange layer including a light absorber and heat-decomposable resin on a light transparent supporter, providing a semiconductor wafer having a circuit side provided with a circuit pattern and a non-circuit side opposite to the circuit side, laminating said semiconductor wafer to said light transparent supporter via a photo-curing type adhesive and hardening the photo-curing type adhesive by irradiation with light from the side of said light transparent supporter to form a laminate having the non-circuit side on the outside, grinding the non-circuit side of said semiconductor wafer until the semiconductor wafer attains a desired thickness, dicing the ground semiconductor wafer from the non-circuit side and cutting it into a plurality of semiconductor chips, and irradiating with radiation energy from said light transparent supporter side to decompose said light/heat exchange layer and to separate it to a
  • an adhesive tape 52 is disposed on the chip side of the laminate 1 having a plurality of chips.
  • the adhesive tape 52 is fixed in the plane by means of a ring- shaped metal frame (Fig. 5(b)).
  • the laminate 1 is irradiated with laser light 54 from the supporter side (Fig. 5(c)).
  • the supporter 5 is pulled up to separate the supporter 5 from the chip 6 (Fig. 5(d)).
  • the adhesive layer 3 can be removed by peeling to obtain a thinned chip 6 (Fig. 5(e)).
  • the light transparent supporter preferably has sufficient rigidity in order to prevent warping of the semiconductor wafer during grinding.
  • Bending rigidity of the supporter is preferably not less than 2 x 10 "3 (Pam 3 ), and more preferably 3 x 10 "2 (Pam 3 ).
  • Examples of useful supporter include a glass plate, an acrylic plate, etc. and that the photo-curing type adhesive preferably has the viscosity less than 10000 cps at the temperature of applying and laminating operation (for example, 25 °C in order to fill the adhesive layer into uneven circuit pattern on the silicon wafer to achieve uniform thickness.
  • Such a liquid adhesive is preferably applied by spin-coating step among various methods to be described later.
  • As the adhesive UV-curing type and photo-curing type adhesives are particularly preferred.
  • Japanese Unexamined Patent Publication (Kokai) No. 2008-010464 discloses a method for manufacturing split chip in which, in dicing-before-grinding process wherein dicing is performed prior to grinding of a backside, even if chips having large unevenness or chips having high aspect ratio are formed, skip of chip under grinding on the backside and damage on the adjoining chips due to contact can be eliminated.
  • manufacturing split chip disclosed in Japanese Unexamined Patent Publication (Kokai) No. 2008-010464 comprises the steps of filling the gap between respective chips formed by said cutting with a liquid adhesive, laminating the article to be ground on a rigid support so as to expose the backside thereof, hardening or solidifying the adhesive to form a laminate where the article to be ground having a plurality of chips, an adhesive solid, and the rigid support are arranged sequentially, grinding the laminate from the back surface of the article to be ground to obtain thinned, separated individual chips on the laminate, removing the rigid support from the laminate, bonding a flexible adhesive sheet to the adhesive solid of the laminate with the rigid support removed, and picking up and collecting individual chips held by the adhesive solid on the flexible adhesive sheet.
  • any type of adhesive including a curing type adhesive, a solvent based adhesive, a hot-melt type adhesive or a water dispersion type adhesive may be used as the adhesive, and that it is desirable that the rigid support has sufficient rigidity in order to prevent warping of the article from being ground during grinding of the back surface and to permit stress-free grinding.
  • Useful supports include, for example, sheet member formed of resin material, glass.
  • an object such as a wafer which is used as a base material for semiconductor chips and which comprises a front surface (a first surface) having a main function and a back surface (a second surface) opposite to the first surface
  • a method for grinding the back surface to uniformly reduce thickness by grinding the second surface
  • the reduction of thickness of the object to be ground can be achieved accurately by using a simple technique.
  • a method for forming a semiconductor chip which includes the step of grinding a back surface of a wafer, that reduction of thickness of the wafer by grinding the back surface and division into a plurality of chips by cutting can be carried out accurately by using a simple technique.
  • the film can be applied to the object accurately by using a simple technique.
  • a method for applying a film comprising the steps of: providing an object having a first surface and a second surface opposite to the first surface, a flexible film having a front surface larger than the first surface of the object, a frame member shaped and sized so as to be placeable along a perimeter of the film and having a rigidity higher than that of the film, and a liquid adhesive; arranging the liquid adhesive on the first surface of the object or the front surface of the film; fixing the frame member to the film along the perimeter of the film; arranging the object and the film in a relative position where the first surface is opposed to the front surface and a region of the film along the perimeter of the film extends outward from the object, and bringing both of the first surface and the front surface into contact with the liquid adhesive; and solidifying the liquid adhesive and securely attaching the film to the first surface of the object.
  • a method for applying a film comprising the steps of: providing an object having a first surface and a second surface opposite to the first surface, a flexible film, and a liquid adhesive; placing the liquid adhesive on the first surface of the object or the front surface of the film; arranging the object and the film in a relative position where the first surface is opposed to the front surface, and bringing both of the first surface and the front surface into contact with the liquid adhesive; rotating the object and the film with both of the first surface and the front surface in contact with the liquid adhesive, so as to spread the liquid adhesive over a gap between the first surface and the front surface; and solidifying the liquid adhesive and securely attaching the film to the first surface of the object.
  • a method of grinding a back surface of an object comprising the steps of: securely attaching the film to the first surface of the object through the method of applying the film according to one of the aspects described above; and grinding the second surface of the object with the film securely attached to the first surface.
  • a method for grinding a back surface comprising the steps of: securely attaching the film to the first surface of the object through the method according to other aspect described above; and grinding the second surface with the film securely attached to the first surface in a state where the object is fixedly supported.
  • a method of forming a semiconductor chip comprising the step of grinding the second surface of an object, the object comprising a wafer having a circuit side as the first surface, through the method of grinding back surface according to the above-described aspect.
  • an apparatus for applying a film comprising: a frame support part for securely supporting the frame member relative to an object with both the first surface of the object and the front surface of the film in contact with a liquid adhesive; and a drive part for rotating the object and the film in a coaxial arrangement, in a state where the frame support part securely supports the frame member relative to the object.
  • an apparatus for applying a film comprising a film support part for securely supporting a film relative to an object with the first surface of the object and the front surface of the film both in contact with a liquid adhesive; and a drive part for rotating the object and the film in a coaxial
  • the central region of the film inside the frame member can be kept free from distortion, so that the first surface of the object and the front surface of the film can be arranged generally in parallel to each other, and can be brought into contact with a liquid adhesive.
  • a liquid adhesive is used as means for bonding the object and the film, various ruggedness and unevenness of the first surface of the object can be filled by the liquid adhesive, and flatness of the film after solidification of the liquid adhesive is ensured, and the bonding layer (the liquid adhesive after solidification) free from inclusion of air bubbles is formed between the object and the film.
  • Such a bonding layer can maintain high adhesive strength stably for a long period. Therefore, with the above method for applying a film, the film can be applied to an object accurately by using a simple technique.
  • the liquid adhesive can be spread over the first surface and the front surface, and possible rising-up of the film relative to the object and positional deviations of the two center axes during the rotation of the object and the film can be prevented by securely supporting the film.
  • flatness of the film and parallelism of the first surface of the object and the front surface of the film after solidification of the liquid adhesive can be ensured.
  • the bonding layer (the liquid adhesive after solidification) free from inclusion of air bubbles can be formed between the object and the film.
  • Such a bonding layer can maintain high adhesive strength stably for a long period. Therefore, with the above method for applying a film, the film can be applied to an object accurately by using a simple technique.
  • the method for grinding a back surface of an object since a first surface of the object is protected with a film, cost can be reduced as compared to a method in which a glass plate is used for protection. Since a frame member having a rigidity higher than that of the film is fixed along the perimeter of the film, the central region of the film situated inside the frame member can be kept free from distortion, and the first surface of the object and the front surface of the film can be arranged generally in parallel to each other and can be brought into contact with a liquid adhesive in this state. In addition, the procedures for grinding the second surface of the object can be carried out rapidly by handling of the frame member.
  • a liquid adhesive is used as means for bonding the object and the film, flatness of the film after solidification of the liquid adhesive is ensured, and the bonding layer that is free from inclusion of air bubbles can be formed between the object and the film.
  • the second surface of the object can be ground uniformly to form a flat finished surface, and thickness of the object can be reduced uniformly to the order of several tens of microns.
  • Bonding layer that is free from inclusion of air bubbles can maintain high adhesive strength stably for a long period, and can effectively prevent processing medium from entering into the bonding layer during grinding operation. Therefore, with the above method for grinding a back surface, thickness of an object can be reduced accurately by using a simple technique.
  • cutting step can be accurately carried out on the wafer (object) having a machined surface formed in accordance with the method for grinding a back surface as described above, in the same position as the grinding of the back surface was carried out and under the high adhesive strength provided by the bonding layer between the wafer (object) and the film. Therefore, with the method of forming a semiconductor chip, reduction of thickness of the wafer by grinding a back surface as well as division into a plurality of chips by cutting can be performed accurately by using a simple technique.
  • FIG. 1 A view for explaining a method for applying a film, according to an embodiment of the present invention, schematically showing the components thereof, before applying the film, in a perspective view.
  • FIG. 2 A perspective view showing the components shown in Fig. 1 after applying the film.
  • FIGs. 3(a)-3(c) A sectional view showing the components shown in Figs. 1 and 2, together with main steps of the method for grinding a back surface according to an embodiment of the present invention.
  • FIGs. 4(a)-4(f) A schematic view showing main steps of the method for applying a film according to an embodiment of the present invention.
  • FIGs. 5(a)-5(c) A sectional view showing main steps of the method for applying a film according to another embodiment of the present invention.
  • FIGs. 6(a)-6(b) A sectional view showing the components to show main steps of the method for applying a film and the method for grinding back surface according to still another embodiment of the present invention.
  • Figs. 7(a)-7(b) A sectional view schematically showing an example of spin coating step that can be employed in the method for applying a film shown in Fig. 4.
  • FIGs. 8(a)-8(g) A sectional view schematically showing main steps of the method for applying a film, the method for grinding a back surface and the method for forming a semiconductor chip according to still another embodiment of the present invention.
  • FIGs. 9(a)-9(f) A sectional view schematically showing main steps of the method for applying a film, the method for grinding a back surface and the method for forming a semiconductor chip according to yet another embodiment of the present invention.
  • Fig. 10 A sectional view schematically showing an example of an apparatus for placing an adhesive, which can be employed in the method for applying a film according to an embodiment of the present invention.
  • Fig. 11 A sectional view schematically showing an example of spin coating step that can be employed in the method for applying a film according to an embodiment of the present invention.
  • the method for applying a film shown in the drawing has the purpose of applying a flexible film to a surface of a relatively sturdy object.
  • the method can be implemented as one step of a method for grinding a back surface in which, in an object (i.e., an object to be ground) having a surface for main function (i.e., a first surface) and a back surface opposite to the first surface (i.e., a second surface) such as a wafer as a base material of a
  • the method shown for grinding a back surface can be implemented in a method for forming a semiconductor chip as a process for grinding a back surface to reduce thickness of a wafer uniformly.
  • the method includes grinding the back surface opposite to a circuit side, in a state where, after a circuit pattern is formed on a surface of the wafer of a specified thickness, the circuit side is protected by application of a protective film.
  • use of the method for applying a film according to an embodiment of the present invention, and the method for grinding a back surface according to another embodiment is not limited to such applications as described above.
  • Figs. 1 and 3(a) shows an exemplary method for applying a film (or the method for grinding a back surface), first, an object 10 having a first surface 10a and a second surface
  • a frame member 14 that has shape and size placeable along the perimeter 12c of the film 12 and has a rigidity higher than that of the film 12, and a liquid adhesive 16, are provided.
  • the object 10 comprises a first surface 10a and a second surface 10b extending generally in parallel to each other, and an outer circumference 10c extending between the first surface 10a and the second surface 10b.
  • the object 10 may be a flat plate element which can be expected to be thinned from an initial thickness to a desired uniform thickness by grinding the entire second surface 10b.
  • the object 10 may be a flat plate element for which grinding of the second surface 10b and the resulting thinning cannot be expected.
  • the object 10 may be a wafer or a substrate formed from silicon, gallium arsenide, quartz, sapphire, glass or the like. Where the object 10 has a disc-like shape, diameter of the object 10 may be, for example, 50mm-500mm.
  • the object 10 is a wafer as the base material for a semiconductor chip.
  • the first surface 10a is a circuit side having a desired circuit pattern formed thereon.
  • the first surface 10a may have various convex portions 11 due to printed wire etc. (Fig. 4).
  • the first surface 10a may have linear grooves (not shown) cut into thickness direction at
  • Thickness of the wafer is, for example, about 0.5mm- lmm, and is standardized together with the diameter.
  • Thickness of a semiconductor chip after grinding of a back surface is, for example, 50 ⁇ -100 ⁇ , but recently further thinning of semiconductor chip is desired.
  • the object 10 shown has a disc-like shape (having a center axis lOd
  • Fig. 3(a) as generally seen for a wafer, but may have a shape of rectangular plate as seen, for example, as a substrate for a display device.
  • material, shape, size, etc. of the object 10 is not particularly restricted.
  • the film 12 is a flexible membrane element having a front surface 12a and a back surface 12b opposite to the front surface, and a perimeter 12c, and is formed from resin or the like in generally uniform thickness.
  • the film 12 may have the function of protecting the first surface 10a of the object 10 by being securely attached to the first surface 10a with a liquid adhesive 16.
  • a radiation curing type adhesive (to be described later) is used as the liquid adhesive 16
  • the film 12 desirably has sufficient radiation transparency, and may be a polymer film formed from, for example, polyester such as polyethylene terephthalate, polyolefm resin such as polypropylene, polyvinyl chloride resin, polyvinylidene chrolide resin, polyamide resin or the like.
  • the film 12 desirably has the material properties capable of protecting the circuit side of a wafer as the first surface of the object 10 so as not to be polluted or damaged during the step of grinding back surface or the step of dicing.
  • thickness of the film 12 is, for example, 5 ⁇ -200 ⁇ .
  • the film 12 may be supplied as a precut sheet or it may be supplied from a roll to be cut just prior to use.
  • the film 12 may have excess portion cut and removed beforehand so as to have a shape similar to the object 10, or the excess portion may be cut and removed after application to the object 10 so as to have a shape similar to the object.
  • the shown film 12 has the shape of a disc (having a center axis 12d (Fig. 3(a)) similar to the disc shape of the object 10, but material, shape, size, etc. of the film 12 is not particularly limited except that it has a front surface 12a larger than the first surface 10a of the object 10.
  • the frame member 14 is a ring-shaped element having a first surface 14a and a second surface 14b opposite to the first surface, an inner circumference 14c extending between the first surface 14a and the second surface 14b and an outer circumference 14d opposite to the inner circumference 14c, and is formed from, for example, metal, resin or the like, so as to have generally uniform thickness.
  • the frame member 14 has a rigidity that is sufficient to maintain the central region of the film 12 situated inside the inner circumference 14c in an extended state when the first surface 14a or the second surface 14b is fixed to the front surface 12a or the back surface 12b along the perimeter 12c of the film 12.
  • the rigidity of the frame member 14 may be determined based on the materials, dimensions, shapes, etc., and may be selected to prevent the frame member 14 from being significantly bent or deformed even when any tensile force is applied to the film 12.
  • an annular frame member 14 is made of a stainless steel, it is appropriate that the frame member 14, usable, e.g., for a silicone wafer with a diameter of 30mm, has a thickness of approximately 1-2 mm, an inner diameter of approximately 350 mm, and an outer diameter of approximately 400 mm.
  • the shown frame member 14 has an annular shape (having a center axis 14e (Fig.
  • material, shape, or size of the frame member 14 is not particularly limited except that it has a shape and size that permits it to be placed along the perimeter 12c of the film 12, and that it has a rigidity higher than that of the film 12.
  • the frame member 14 may be formed from the same material as the film 12.
  • the liquid adhesive 16 exhibits high adhesive strength so as to be able to securely attach the front surface 12a of the film 12 to the first surface 10a of the object 10, and may be, for example, a curing type adhesive, a solvent-based adhesive, a thermoplastic resin including a hot-melt type adhesive, or a water dispersion type adhesive or the like.
  • a curing type adhesive is a liquid adhesive that is hardened by application of heat or by irradiation with energy radiation, such as UV radiation.
  • a solvent-based adhesive is a liquid adhesive solidified by evaporation of the solvent.
  • a hot-melt type adhesive is an adhesive that melts upon heating and solidifies upon cooling.
  • a water dispersion type adhesive is an adhesive that contains adhesive component dispersed in water, and is solidified by evaporation of water.
  • Curing type adhesives include one-component, heat curable adhesives based on epoxy or urethane, two-component reaction type adhesive based on epoxy, urethane or acrylic resin, UV curable adhesive based on acrylic or epoxy resin, and electron beam curable adhesives.
  • Solvent based adhesives include rubber based adhesives that dissolves rubber, elastomer, etc. in a solvent.
  • solidified and “solidification” refer to hardening.
  • the method for applying a film can be implemented in a step of grinding a back surface for forming a semiconductor chip.
  • the liquid adhesive 16 preferably has material properties that permit it, before solidification, to be filled uniformly and smoothly into gaps between convex portions 11 or linear grooves for "dicing-before grinding process", and to form a bonding layer 18 (Fig. 3(b)) with minimal to no inclusion of air bubbles between the object (wafer) 10 and the film 12.
  • the liquid adhesive 16 has viscosity before solidification less than 10 Pa.s (10000 cP) under work environment (for example, 25 °C).
  • viscosity is measured with a Brookfield-type viscometer (BM) with rotor shape No. 2 and at 12 rpm under 25°C environment (e.g., "RVDV-E” available from Kyowa Kagaku K.K. (Tokyo)).
  • the liquid adhesive 16 preferably has, in operation environment (for example, at 25 °C), after removal of solvent in the case of solvent based adhesive, after curing in the case of curable type adhesive, after solidification in the case of hot-melt type adhesive, a storage elastic modulus of not less than 100 MPa, and at highest attainable temperature during the step of grinding a back surface (for example, at 50°C), a storage elastic modulus of not less than 10 MPa.
  • a storage elastic modulus of the liquid adhesive 16 distortion of the liquid adhesive 16 due to stress during the step of grinding a back surface can be prevented and the second surface 10b of the object 10 can be ground uniformly.
  • Storage elastic modulus is the value measured for the adhesive of sample size of 22.7mm x 10mm x 50 ⁇ under the conditions of Temp Ramp Mode, tensile test mode, at frequency of 1 Hz, strain of 0.04%, and rate of temperature rise of 5°C/min.
  • Such storage elastic modulus can be measured with SOLID ANALYZER RSA II (trade name) manufactured by Rheometric Co.
  • the liquid adhesive preferably has adhesive strength after solidification of, for example, 0.1 N/25mm-0.5 N/25mm, more preferably 0.1 N/25mm-0.2 N/25mm.
  • adhesive strength is measured by the method in accordance with LIS Z 0237 (i.e., a test piece of 25mm width is adhered under pressure to an adherend (SUS430BA plate) with one round trip at 5mm/sec of a rubber roller of 2.0 Kg in weight, and 20-40 minutes after adhesion, the test piece is peeled off in the direction of 180° from the adherend at 300+30 mm/min with a tensile tester).
  • Thickness of the bonding layer 18 after solidification of the liquid adhesive 16 is not particularly limited, but is preferably in the range that permits ruggedness of the first surface 10a to be filled and the film 12 to be flattened, for example in the range of 10 ⁇ -150 ⁇ , and more preferably in the range of 20 ⁇ -100 ⁇ .
  • the liquid adhesive 16 is arranged on the first surface 10a of the object 10 or on the front surface 12a of the film 12.
  • the liquid adhesive 16 can be arranged on the first surface 10a of the object 10 or on the front surface 12a of the film 12 by dripping or coating with a suitable device.
  • the object 10 is placed on a table 20 with the first surface 10a facing upward (Fig. 4(a)), and sufficient quantity of the liquid adhesive 16 is arranged in the region including the center axis lOd of the first surface 10a of the object 10 (Fig. 4(b)).
  • the liquid adhesive 16 can be spread uniformly all over the first surface 10a by, for example, rotating the object 10 about its center axis lOd or vibrating the object 10.
  • the frame member 14 is securely attached to the film 12 along its perimeter 12c (Fig. 3(b)).
  • the frame member 14 is fixed uniformly to the annular region along the entire perimeter 12c of the front surface 12a of the film 12.
  • the frame member 14 can be fixed by various bonding means such as an adhesive, a double-faced adhesive tape, fusion bonding, etc.
  • same liquid adhesive as the liquid adhesive 16 is used as the bonding means, and the second surface 14b of the frame member 14 is securely fixed to the front surface 12a of the film 12 with the bonding layer 22 formed by solidification of the liquid adhesive 16 (Fig. 3(b)).
  • Such liquid adhesive can be arranged as a continuous line by using a suitable nozzle on the annular region along the perimeter 12c of the front surface 12a of the film 12, or on the second surface 14b of the frame member 14.
  • the liquid adhesive can be arranged by using a stationary nozzle while rotating the film 12 or the frame member 14 about the center axis 12d or 14e, or by using an automated machine such as a robot to move a nozzle in a circular orbit onto the stationary film 12 or frame member 14.
  • the object 10 and the film 12 are arranged in relative position where the first surface 10a and the front surface 12a are opposed to each other.
  • the region of the film 12 along the perimeter 12c (thus, the frame member 14) extends outward from the object 10.
  • the first surface 10a and the front surface 12a are both brought into contact with the liquid adhesive 16 (Fig. 4(c)).
  • the liquid adhesive 16 is spread extensively between the first surface 10a of the object 10 and the front surface 12a of the film 12 (Fig. 4(d), (e)). Because the frame member 14 is uniformly fixed to the film 12 along the perimeter 12c, the central region 12e of the film 12 situated inside the frame member 14 (Fig.
  • the frame member 14 i.e., in a distortion-free state.
  • the first surface 10a of the object 10 and the front surface 12a of the film 12 can be brought into contact with the liquid adhesive 16 in generally parallel arrangement to each other.
  • the liquid adhesive 16 is solidified to securely attach the film 12 to the first surface 10a of the object 10 (Fig. 4(f)). If, for example, the liquid adhesive 16 is a UV-curable type adhesive, the film 12 is irradiated with UV radiation from the side of the back surface 12b to solidify the liquid adhesive 16. Because the liquid adhesive 16 has material properties as described above, the liquid adhesive 16 fills gaps between convex portions 11 or linear grooves (not shown) for "dicing-before grinding process" formed on the first surface 10a of the object 10, and forms a bonding layer 18 (Fig. 3(b)) free from inclusion of air bubbles between the object (wafer) 10 and the film 12.
  • the bonding layer 18 securely attaches the front surface 12a of the film 12 to the entire first surface 10a of the object 10 so that the object 10 and support the film 12 can stably support each other.
  • the object 10, the film 12, and the frame member 14 are arranged generally coaxial to each other.
  • an annular gap of generally uniform size is formed between the perimeter 10c of the object 10 and the inner circumference 14c of the frame member 14 (Fig. 2, Fig. 3(b)).
  • the step of fixing the frame member 14 to the film 12 may be performed before the first surface 10a of the object 10 and the front surface 12a of the film 12 are both brought into contact with the liquid adhesive 16.
  • the step of fixing may be performed at the same time as or after the first surface 10a of the object 10 and the front surface 12a of the film 12 are both brought into contact with the liquid adhesive 16.
  • the liquid adhesive 16 may be arranged, for example, on the entire front surface 12a of the film 12 by coating, etc.
  • the second surface 14b of the frame member 14 may also be brought into contact with the liquid adhesive 16.
  • the entire liquid adhesive 16 may be solidified to thereby form the bonding layers 18, 22 to attach the film 12 to both of the object 10 and the frame member 14.
  • the step of bringing the object 10, the film 12 and the frame member 14 into contact with the liquid adhesive 16, and the step of solidifying the liquid adhesive 16 are performed in a vacuum environment. All of the aforementioned steps including the steps of bringing and solidifying may be performed in a vacuum environment.
  • the frame member 14 having a rigidity higher than that of the film 12 is fixed to the film 12 along the perimeter 12c, the central region 12e of the film 12 situated inside the frame member 14 can be maintained in a state substantially free from distortion. Therefore, the first surface 10a of the object 10 and the front surface 12a of the film 12 can be arranged generally in parallel to each other and can be brought into contact with the liquid adhesive 16. Because the liquid adhesive 16 is used as bonding means for bonding the film 12 to the object 10, various ruggedness of the first surface 10a of the object 10 can be filled by the liquid adhesive 16 to achieve flatness of the film 12 after solidification of the liquid adhesive 16.
  • the bonding layer 18 substantially free from inclusion of air bubbles can be formed between the object 10 and the film 12.
  • Such bonding layer 18 can maintain high adhesive strength stably for a long period.
  • the object 10 and the film 12 together with the frame member 14 are picked up from the table 20. After being reversed upside down, the combination is placed on another stationary stage 24 with the second surface 10b of the object 10 facing upward (Fig. 3(b)).
  • holding means such as a vacuum suction device, etc.
  • the object 10 and the film 12 are supported fixedly on the stationary stage 24 inside the frame member 14.
  • the frame member 14 may be held in the state of being fixed to the object 10 and the film 12. In this state, the entire second surface 10b of the object 10 is ground with a grinding apparatus (not shown) to form a flat machined surface 26 (Fig. 3(c)).
  • the central region 12e of the film 12 situated inside the frame member 14 can be kept substantially free from distortion.
  • the first surface 10a of the object 10 and the front surface 12a of the film 12 can be arranged generally in parallel to each other and can be brought into contact with the liquid adhesive 16. Further, preparation work (for example, reversing them upside down, placing them on the stationary stage, etc.) for grinding the second surface 10b of the object 10 can be carried out rapidly by handling the frame member 14.
  • the liquid adhesive 16 is used as means for bonding the film 12 to the object 10, flatness of the film 12 after solidification of the liquid adhesive 16 is ensured, and the bonding layer 18 free from inclusion of air bubbles can be formed between the object 10 and the film 12.
  • the second surface 10b of the object 10 can be ground uniformly so as to form a flat machined surface 26. Thickness of the object 10 can be uniformly reduced to the order of several tens of microns.
  • the bonding layer 18 substantially free from inclusion of air bubbles can maintain high adhesive strength for a long period, and in addition, has the effect of preventing ingress of the processing liquid during the grinding step.
  • thickness of the object 10 can be reduced accurately by using a simple technique.
  • the back surface (i.e., the second surface 10b) opposite to the circuit side (i.e., the first surface 10a) of the wafer (i.e., the object 10) is ground to form a machined surface 26.
  • cutting (dicing) is performed on the machined surface 26 along predetermined cutting lines to divide the wafer (object 10) into a plurality of chips (not shown).
  • the cutting step can be carried out accurately under the strong adhesive force provided by the bonding layer 18 between the wafer (object 10) and the film 12. Therefore, with this method for forming a semiconductor chip, reduction of thickness of the wafer by grinding of the back surface and forming a plurality of chips by cutting can be carried out accurately using a simple technique.
  • a dicing-before-grinding process as described in above-mentioned Japanese Unexamined Patent Publication (Kokai) No. 2008-010464 may be employed.
  • linear grooves are formed beforehand by cutting in the direction of thickness at predetermined positions (cutting positions in the dicing step described above) on the circuit side (i.e., the first surface 10a) of the wafer (i.e., the object 10).
  • the machined surface 26 is formed by grinding the back surface (i.e., the second surface 10b) opposite to the circuit side (i.e., the first surface 10a) of the wafer (object 10) in the above- described step of grinding a back surface
  • the wafer (object 10) can be divided into a plurality of chips (not shown). Detail of the dicing step and the dicing-before-grinding method will be described later.
  • the frame member 14 when the frame member 14 is fixed to the film 12 along the perimeter 12c, the frame member 14 can be fixed to the film 12 with substantially uniform tension applied radially outward to the film 12.
  • the film 12 especially in the central region 12e, is fully extended and stretched (Figs. 5(a) and (b)).
  • the liquid adhesive is solidified while the film 12 is under tension.
  • the second surface 14b of the frame member 14 is securely fixed to the front surface 12a of the film 12.
  • excess portion of the film 12 may be cut and removed beforehand so as to have a shape similar to the frame member 14 before the frame member 14 is fixed.
  • excess portion of the film 12 may be cut and removed so as to have a shape similar to the frame member 14 after the frame member 14 is fixed. It is preferred that the tension or tensile force applied to the film 12 is determined so as to minimize the flexure of the film 12, and may be in the range of, e.g., 10-1000 g/cm. It is desired that the frame member 14 has a rigidity sufficient to maintain the tensioned film 12 in a tensioned state.
  • the central region 12e of the film 12 situated inside the inner circumference 14c of the frame member 14 can be securely maintained substantially free from distortion for a long period by the frame member 14. Therefore, the step of film application, the step of grinding a back surface, as well as the dicing step, can be carried out more accurately.
  • the frame member 14 when the frame member 14 is fixed to the film 12 along the perimeter 12c, the frame member 14 can be fixed to the back surface 12b of the film 12 as shown in Fig. 6(a).
  • the frame member 14 is fixed uniformly to the annular region along the entire perimeter 12c of the back surface 12b of the film 12.
  • Fixing of the frame member 14 can be effected by various bonding means such as an adhesive, a double-faced adhesive tape, fusion bonding, etc.
  • the same liquid adhesive as the liquid adhesive 16 is used as the bonding means.
  • the bonding layer formed upon solidification of the liquid adhesive securely fixes the first surface 14a of the frame member 14 to the back surface 12b of the film 12. Detail of application of such liquid adhesive is the same as in the previous construction where the frame member 14 is fixed to the first surface 12a of the film 12.
  • the central region 12e of the film 12 situated inside the inner circumference 14c of the frame member 14 can be maintained in a state substantially free from distortion by the frame member 14, so that the film 12 can be applied accurately to the object 10 using a simple technique.
  • the step of grinding a back surface or in the dicing step by fixedly placing the central region 12e of the film 12 on the stationary stage 24 with the second surface 10b of the object 10 facing upward (Fig. 6(b)), the fear of the presence of the frame member 14 obstructing smooth handling of the grinding apparatus or the dicing apparatus can be eliminated. Also, the fear of the grinding debris of the object 10 being retained in the annular gap between the object 10 and the frame member 14 can be minimized. Therefore, the step of grinding a back surface as well as the dicing step can be carried out more accurately.
  • the object 10 and the film 12 before the step of solidifying the liquid adhesive 16, can be rotated with the first surface 10a and the front surface 12a both in contact with the liquid adhesive 16, so that the liquid adhesive 16 may be fully spread between the first surface 10a and the front surface 12a (Fig. 4(d)).
  • excess liquid adhesive 16 is removed by the action of centrifugal force, and rotation of the object 10 and the film 12 can be stopped when the front surface 12a of the film 12 is brought into substantial contact with the convex portion 11 of the first surface 10a of the object 10 (Fig. 4(e)).
  • the liquid adhesive 16 can be arranged fully into every corner of the gap between the first surface 10a of the object 10 and the front surface 12a of the film 12. As a result after solidification of the liquid adhesive 16, the bonding layer 18 free from inclusion of air bubbles can be reliably formed (Fig. 4(f)).
  • the object 10 and the film 12 can be rotated in coaxial arrangement while the film 12 is fixedly supported to the object 10, as shown in Fig. 7(b), with the first surface 10a and the front surface 12a both in contact with the liquid adhesive 16.
  • possible movement of the film 12 relative to the object 10 and positional deviation of the center axes lOd, 12d which may occur during spin coating step, can be prevented by the film 12 being fixedly supported to the object.
  • flatness of the film 12 and parallelism between the first surface 10a of the object 10 and the front surface 12a of the film 12 can be ensured at high level.
  • An apparatus for applying a film according to an embodiment of the present invention for implementing the spin coating step shown in Fig. 7(a), comprises a frame support part 28 for securely supporting the frame member 14 relative to the object 10 with both of the first surface 10a of the object 10 and the front surface 12a of the film 12 in contact with the liquid adhesive 16, and a drive part (a rotational drive mechanism (not shown) for the table 20 and the frame support part 28) for rotating the object 10 and the film 12 in a coaxial arrangement, in a state where the frame support part 28 securely supports the frame member 14 relative to the object 10.
  • the frame support part 28 has a support stage 30 capable of securely supporting the frame member 14 having the film 12 fixed thereto along the perimeter 12c relative to the object fixedly placed on the table 20 in a coaxial arrangement with respective center axes lOd, 12d, 14e coinciding with each other.
  • the support stage 30 may have a correcting mechanism for correcting, if any, the distortion of the frame member 14 itself.
  • the frame support part 28 may also have an annular wall part 32 radially inside the support stage 30 for receiving excess liquid adhesive 16 discharged from the gap between the object 10 and the film 12 by centrifugal force. Excess liquid adhesive 16 received by the wall part 32 is collected by an unshown recovery mechanism, and may be reused, for example.
  • the wall part 32 may have a shape that permits, with the frame member 14 supported on the support stage 30, the central region 12e of the film 12 to be raised a little so as to become convex in the back surface 12b as shown. With such construction, even if the frame member 14 itself has distortion, the first surface 10a of the object 10 and the front surface 12a of the film 12 can be brought into contact with the liquid adhesive 16 without being influenced by such distortion.
  • the object 10 is placed on the table 20 with the first surface 10a facing upward, the positional relation of the object 10 and the film 12 in vertical direction can be reversed.
  • the frame support part 28 may be integrally connected to the table 20 in one unit, or it may be functionally separated from the table 20. If the frame support part 28 is integrally connected to the table 20, the object 10 and the film 12 are rotated in synchronism via the frame member 14. By the synchronous rotation of the object 10 and the film 12, with the liquid adhesive 16 interposed between the object 10 and the film 12, the flatness of the film 12 may be improved in some cases. If frame support part 28 is functionally separated from the table 20, the object 10 and the frame member 14 (thereby the film 12) can be rotated intentionally out of synchronism. By rotation of the object 10 and the film 12 at different rotational speed, with the liquid adhesive 16 interposed between the object 10 and the film 12, the flatness of the film 12 may be improved in some cases.
  • the shown apparatus for applying a film may further comprise a mechanism for fine-adjusting the relative positional relation of the table 20 and the support stage 30 (therefore, relative positional relation of the object 10 and the film 12), or a mechanism for vibrating the table 20 for spreading the liquid adhesive 16 all over the first surface 10a of the object 10 beforehand.
  • An apparatus for applying a film for implementing the spin coating step shown in Fig. 7(b) comprises, in addition to, or in place of, the frame support part 28 described above, a film support part 34 for securely supporting the film 12 relative to the object 10 with the first surface 10a of the object 10 and the front surface 12a of the film 12 both in contact with the liquid adhesive 16, and a drive part (a rotational drive mechanism (not shown) for the table 20 and the film support part 34) for rotating the object 10 and the film 12 in coaxial arrangement, in a state where the film support part 34 securely supports the film 12 relative to the object 10.
  • the film support part 34 has a support stage 36 capable of securely supporting the film 12 relative to the object fixedly placed on the table 20 in coaxial arrangement with respective center axes lOd, 12d coinciding with each other.
  • the support stage 36 can support the central region 12e of the film 12 from the back surface 12b by means of, for example, a vacuum suction device, or adhesion.
  • the film support part 34 may be constructed such that, with the film 12 supported on the support stage 36, it can prevent the pressure from the film 12 due to its own weight etc. from being applied to the object 10, or it can intentionally apply the pressure from the film 12 to the object 10, or it can raise the film 12 away from the object 10. In any construction, with the liquid adhesive 16 interposed between the object 10 and the film 12, flatness of the film 12 may be improved in some cases.
  • the film support part 34 may be constructed so as to be rotated in synchronism with the table 20, or so as to be rotated intentionally out of
  • an object 10 having a first surface 10a and a second surface 10b opposite to the first surface 10a, a flexible film 12 having a front surface 12a larger than the first surface 10a, a frame member 14 having shape and size placeable along a perimeter 12c of the film 12 and having a rigidity higher than that of the film 12, and a liquid adhesive 16, are provided
  • the object 10 is placed on a table 20 with the first surface 10a facing upward (Fig. 8(a)). Then, the liquid adhesive 16 is arranged on a region including a center axis lOd of the first surface 10a of the object 10 (Fig. 8(b)). In this state, the object 10 is rotated about the center axis lOd to spread the liquid adhesive 16 all over the first surface 10a (Fig. 8(c)).
  • the frame member 14 is fixed to the film 12 along the perimeter
  • the object 10 and the film 12 are arranged in a relative position where the first surface 10a is opposed to the front surface 12a and a region of the film 12 along the perimeter 12c (therefore, the frame member 14) extends outward from the object 10, and the first surface 10a and the front surface 12a are both brought into contact with the liquid adhesive 16 (Fig. 8(d)).
  • the central region 12e of the film 12 situated inside the frame member 14 can be maintained in a state extended by the frame member 14 (i.e., in a state free of distortion) so that the first surface 10a of the object 10 and the front surface 12a of the film 12 can be brought into contact with the liquid adhesive 16 in generally parallel arrangement relative to each other.
  • the liquid adhesive 16 is solidified and the first surface 10a of the object 10 is securely attached to the film 12 (Fig. 8(e)). Since the liquid adhesive 16 has material properties as described above, the liquid adhesive 16 can uniformly and smoothly fill gaps between convex portions 11 formed on the first surface 10a of the object 10, and can form the bonding layer 18 without inclusion of air bubbles between the object 10 and the film 12.
  • This completes the process of applying a film (method for applying a film).
  • the object 10 and the film 12 together with the frame member 14 are picked up from the table 20, reversed upside down, and are placed on another stationary stage with the second surface 10b of the object 10 facing upward. Then, using holding means such as a vacuum suction device, the object 10 and the film 12 are fixedly supported inside the frame member 14, and the frame member 14 is held fixed relative to the object 10 and the film 12. In this state, the entire second surface 10b of the object 10 is ground with a grinding apparatus (not shown) to form a flat machined surface 26 (Fig. 8(f)). This completes the process of grinding a back surface (method for grinding a back surface).
  • the process of grinding a back surface including the process of applying a film is implemented in order to reduce thickness of the wafer uniformly by grinding the back surface opposite to the circuit side.
  • the machined surface 26 is cut along predetermined cutting lines 38 (dicing) to divide the wafer (object 10) into a plurality of chips 40 (Fig. 8(g)).
  • Each of the divided chips 40 can be picked up one by one from the film 12 by, for example, knocking up the chip with an unshown pin from the back surface 12b of the film 12 so as to generate a peeling in a boundary face between the bonding layer 18 and the surface of the chip 40.
  • the cutting lines 38 are usually provided on the circuit side (the first surface 10a) of the wafer (object 10) beforehand, and it is generally difficult to visually recognize the cutting lines 38 from the side of the machined surface 26. Therefore, in the dicing step as described above, it is possible to use, for example, a dicing apparatus having image recognition capability as described in above-mentioned Japanese Unexamined Patent Publication (Kokai) No.
  • a method for applying a film, a method of grinding a back surface, and a method for forming a semiconductor chip according to still another embodiment will be described.
  • the method shown has the same construction as the method described above with reference to Figs. 3 and 4 except that the spin coating step in which the object 10 and the film 12 are rotated with the first surface 10a and the front surface 12a both in contact with the liquid adhesive 16 is not included. Therefore, description of
  • an object 10 having a first surface 10a and a second surface 10b opposite to the first surface 10a, a flexible film 12 having a front surface 12a larger than the first surface 10a, a frame member 14 having shape and size placeable along a perimeter 12c of the film 12 and having a rigidity higher than that of the film 12, and a liquid adhesive 16, are provided (Fig. 1).
  • the object 10 has, on the first surface 10a thereof, linear grooves 42 cut into thickness direction at predetermined positions.
  • the object 10 is placed on a table 20 with the first surface 10a facing upward (Fig. 9(a)).
  • the liquid adhesive 16 is arranged on a region including a center axis lOd of the first surface 10a of the object 10 (Fig. 9(b)). In this state, the object 10 is rotated about the center axis lOd to spread the liquid adhesive 16 all over the first surface 10a (Fig. 9(c)).
  • the frame member 14 is fixed to the film 12 along the perimeter 12c. Then, the object 10 and the film 12 are arranged in a relative position where the first surface 10a is opposed to the front surface 12a and a region of the film 12 along the perimeter 12c (therefore, the frame member 14) extends outward from the object 10, and the first surface 10a and the front surface 12a are both brought into contact with the liquid adhesive 16 (Fig. 9(d)).
  • the central region 12e of the film 12 situated inside the frame member 14 can be maintained in a state extended by the frame member 14 (i.e., in a state free of distortion) so that the first surface 10a of the object 10 and the front surface 12a of the film 12 can be brought into contact with the liquid adhesive 16 in generally parallel arrangement relative to each other.
  • the liquid adhesive 16 is solidified and the first surface 10a of the object 10 is securely attached to the film 12 (Fig. 9(e)).
  • the liquid adhesive 16 has material properties as described above, the liquid adhesive 16 can uniformly and smoothly fill gaps between convex portions 11 formed on the first surface 10a of the object 10, and can form the bonding layer 18 without inclusion of air bubbles between the object 10 and the film 12.
  • This completes the process of applying a film (method for applying a film).
  • the object 10 and the film 12 together with the frame member 14 are picked up from the table 20, reversed upside down, and are placed on another stationary stage with the second surface 10b of the object 10 facing upward. Then, using holding means such as a vacuum suction device, the object 10 and the film 12 are fixedly supported inside the frame member 14, and the frame member 14 is held fixed relative to the object 10 and the film 12. In this state, the entire second surface 10b of the object 10 is ground with a grinding apparatus (not shown) to form a flat machined surface 26 (Fig. 9(f)). This completes the process of grinding back surface (method for grinding a back surface).
  • the process of grinding a back surface including the process of applying a film is implemented in order to reduce thickness of the wafer uniformly by grinding the back surface opposite to the circuit side.
  • the back surface (second surface 10b) opposite to the circuit side (first surface 10a) of the wafer (object 10) is ground until the linear grooves 42 provided on the circuit side (first surface 10a) of the wafer (object 10) has been reached to form the machined surface 26.
  • the wafer (object 10) can be thereby divided into a plurality of chips 40 (Fig. 9(f)).
  • Each of the divided chips 40 can be picked up one by one from the film 12 by, for example, knocking up the chip 40 with an unshown pin from the back surface 12b of the film 12 so as to generate a peeling in a boundary face between the bonding layer 18 and the surface of the chip 40.
  • Fig. 10 shows an example of an apparatus for placing an adhesive, which can impose such vibration on the object 10.
  • the shown apparatus for placing an adhesive comprises a table 44 on which the object
  • the 10 can be fixedly placed, and a motor 46 connected to the table 44.
  • An eccentric weight 50 is mounted on the rotary power output shaft 48 of the motor 46 so as to be rotated coaxially with the center axis lOd of the object 10.
  • the table 44 and the motor 46 are supported on a stationary stage 54 via a spring 52.
  • the eccentric weight 50 is rotated eccentrically, and is accompanied by vibration of the table 44 and the motor 46, and hence, vibration of the object 10 placed on the table 44.
  • the liquid adhesive 16 can be spread rapidly all over the first surface 10a of the object 10.
  • a method for applying a film according to an embodiment which does not use the frame member 14, will be described below with reference to Fig. 11.
  • This method for applying a film has the same construction as the method described above with reference to Figs. 3 and 4 and Fig. 7(b), except that the frame member 14 is not used. Therefore, description of corresponding construction will be suitably omitted.
  • an object 10 having a first surface 10a and a second surface opposite to the first surface, a flexible film 12, and a liquid adhesive 16 are provided.
  • the object 10 is placed on a table 20 with the first surface 10a facing upward.
  • the object 10 and the film 12 are arranged in relative position where the first surface 10a is opposed to the front surface 12a, and the first surface 10a and the front surface 12a are both brought into contact with the liquid adhesive 16.
  • a film support part 34 is used to fixedly support the film 12 relative to the object 10
  • the object 10 and the film 12 are rotated in coaxial arrangement to spread the liquid adhesive 16 between the first surface 10a and the front surface 12a.
  • the film support part 34 can be constructed such that, when supporting the film 12 on the support stage, it prevents the pressure from the film 12 due to its own weight from being exerted to the object 10, or it intentionally exerts the pressure from the film 12 to the object 10, or it raises the film 12 away from the object 10.
  • the film support part 34 may be constructed so as to be rotated in synchronism with the table 20, or so as to be rotated intentionally out of synchronism with the table 20. Further, since the frame support part 28 as shown in Fig.
  • the film support part can be constructed such that the rotation of the object 10 rotated by the table 20 is transmitted to the film 12 due to viscosity of the liquid adhesive 16, and as a result, it is entrained to be rotated.
  • flatness of the film 12 with the liquid adhesive 16 interposed to the object 10 may be improved in some case.
  • the same effect can be obtained as with the method for applying a film described with reference to Figs. 3 and 4.
  • the apparatus for applying an adhesive shown in Fig. 10 can be used to vibrate the object 10 to spread the liquid adhesive 16 all over the first surface 10a.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Cette invention concerne généralement les techniques d'application d'un film sur une surface d'un objet afin de broyer une surface arrière etc., et plus particulièrement l'application d'un film de manière précise au moyen d'une technique simple. Le procédé selon l'invention comprend l'étape consistant à utiliser un objet (10) comprenant une première surface (10a) et une seconde surface (10b) opposée à la première surface, un film souple (12) présentant une surface avant (12a) plus grande que la première surface de l'objet, un élément cadre (14) formé et dimensionné de façon à pouvoir être disposé le long d'un périmètre du film et présentant une rigidité supérieure à celle du film et un adhésif liquide (16). Ledit procédé comprend de plus l'étape consistant à appliquer l'adhésif liquide sur la première surface de l'objet ou la surface avant du film. Le procédé comprend en outre les étapes consistant à fixer l'élément cadre au film le long du périmètre du film, et agencer l'objet et le film dans une position relative dans laquelle la première surface est opposée à la surface avant et une région du film située le long du périmètre du film s'étend vers l'extérieur à partir de l'objet. Ledit procédé comprend enfin les étapes consistant à mettre en contact la première surface et la surface avant avec l'adhésif liquide et solidifier ledit adhésif liquide pour solidariser le film à la première surface de l'objet.
PCT/US2011/062523 2010-12-06 2011-11-30 Procédé d'application de film et procédé de broyage d'une surface arrière, procédé de formation d'une puce semi-conductrice et appareil d'application de film WO2012078419A2 (fr)

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JP2010-271893 2010-12-06
JP2010271893A JP5882577B2 (ja) 2010-12-06 2010-12-06 フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置

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WO2012078419A3 WO2012078419A3 (fr) 2012-08-02

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JP6149223B2 (ja) * 2013-04-18 2017-06-21 株式会社ディスコ 板状物の貼着方法
JP6322472B2 (ja) * 2014-05-01 2018-05-09 スリーエム イノベイティブ プロパティズ カンパニー シート貼付方法、シート貼付装置及びウエハ加工方法
CN110211913A (zh) * 2019-05-29 2019-09-06 浙江荷清柔性电子技术有限公司 一种柔性芯片的制造方法
JP2023046922A (ja) * 2021-09-24 2023-04-05 株式会社ディスコ 板状物の加工方法

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