WO2017154304A1 - Procédé de transfert de substrat et dispositif de transfert de substrat - Google Patents

Procédé de transfert de substrat et dispositif de transfert de substrat Download PDF

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Publication number
WO2017154304A1
WO2017154304A1 PCT/JP2016/087443 JP2016087443W WO2017154304A1 WO 2017154304 A1 WO2017154304 A1 WO 2017154304A1 JP 2016087443 W JP2016087443 W JP 2016087443W WO 2017154304 A1 WO2017154304 A1 WO 2017154304A1
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WO
WIPO (PCT)
Prior art keywords
adhesive tape
substrate
tape
wafer
ring frame
Prior art date
Application number
PCT/JP2016/087443
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English (en)
Japanese (ja)
Inventor
孝夫 松下
山本　雅之
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201680083263.0A priority Critical patent/CN108713247B/zh
Priority to KR1020187024601A priority patent/KR20180123018A/ko
Publication of WO2017154304A1 publication Critical patent/WO2017154304A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Definitions

  • the present invention provides a substrate transfer method in which a desired process is applied to various substrates such as semiconductor wafers, circuit boards, and LEDs (Light Emitting Diodes) adhered and held on a ring frame via an adhesive tape, and then transferred to a new adhesive tape.
  • the present invention relates to a method and a substrate transfer apparatus.
  • a general semiconductor wafer (hereinafter simply referred to as a “wafer”) is protected by attaching a protective tape to the surface after circuit patterns of many elements are formed on the surface.
  • the wafer whose surface is protected is ground or polished from the back surface in a back grinding process to a desired thickness.
  • the protective tape is peeled from the thinned wafer and conveyed to the dicing process, the wafer is bonded and held to the ring frame via a supporting adhesive tape (dicing tape) in order to reinforce the wafer.
  • ⁇ Wafer bonded and held on the ring frame has different processing steps depending on the semiconductor chip to be manufactured. For example, when a semiconductor chip is miniaturized, a laser dicing process is performed. At this time, if the dicing is performed from the surface on which the circuit pattern is formed, the circuit is damaged due to the influence of heat. Therefore, it is necessary to perform a half cut from the back surface before the back grinding process. When each chip is mounted at a desired position after breaking the half-cut wafer, the adhesive tape and the protective tape on the surface are peeled off because the chip is sucked and transported by the collet from the chip surface.
  • the adhesive tape is re-applied from the back side of the peeled wafer such as the adhesive tape, and bonded and held on a new ring frame, and then the wafer is broken. That is, it is necessary to transfer the wafer again to a new ring frame before breaking.
  • the adhesive tape to be used is soft, the conventional method can function effectively.
  • a hard (for example, PET) adhesive tape is used to give rigidity to the wafer, it is difficult to elastically deform, so that a sufficient gap can be earned even if the ring frame and the wafer are moved relatively apart. Can not. That is, there is a problem that the adhesion between the adhesive tapes cannot be avoided.
  • the present invention has been made in view of such circumstances, and a main object of the present invention is to provide a substrate transfer method and a substrate transfer apparatus capable of accurately transferring a substrate to a new adhesive tape.
  • the present invention has the following configuration. That is, the present invention is a substrate transfer method for transferring a substrate adhered and held in a ring frame to a second adhesive tape via a supporting first adhesive tape, from the first adhesive tape side.
  • a holding step of holding the ring frame and the substrate with a holding member, a tape cutting step of cutting the first adhesive tape along the outer shape of the substrate held by the holding member, and the cut out first A tape recovery step for recovering the adhesive tape, and a transfer step for transferring the second adhesive tape from the non-holding surface side of the substrate after the tape recovery step.
  • the first adhesive tape is cut along the outer shape of the held substrate, and the cut out first adhesive tape is recovered. Therefore, regardless of the characteristics of the adhesive tape such as altitude and adhesive strength, the portion of the first adhesive tape that protrudes from the outer diameter of the substrate and exposes the adhesive surface is recovered. Therefore, the adhesive surfaces of the first adhesive tape and the second adhesive tape are bonded to each other when transferring from the first adhesive tape to the second adhesive tape without being influenced by the characteristics of the adhesive tape. It can avoid suitably.
  • the substrate can be transferred to a new adhesive tape as follows, for example.
  • the first adhesive tape may be cut so that a length of a portion of the first adhesive tape protruding from an outer diameter of the substrate is equal to or less than a thickness of the substrate. preferable. According to this method, even when the portion protruding outward from the outer diameter of the substrate is deformed at the edge of the wafer, the contact between the first adhesive tape and the second adhesive tape is surely avoided. it can. Therefore, when transferring from the first pressure-sensitive adhesive tape to the second pressure-sensitive adhesive tape, it is possible to more reliably avoid adhesion of the pressure-sensitive adhesive surfaces of the first pressure-sensitive adhesive tape and the second pressure-sensitive adhesive tape. It can be improved.
  • the substrate may be transferred to the second adhesive tape by holding the substrate on a holding member smaller than the diameter of the substrate.
  • the first adhesive tape can be cut through the tape cutting step, the first adhesive tape can be more reliably cut along the outer shape of the substrate. Therefore, it can avoid more reliably that the 1st adhesive tape and the 2nd adhesive tape adhere in a transfer process. Further, by downsizing the holding member, it is possible to avoid an increase in the size of the substrate transfer apparatus.
  • the substrate can be transferred to a new adhesive tape as follows, for example.
  • the first adhesive tape may be cut using a cutter blade.
  • the first adhesive tape may be cut using a laser.
  • the first adhesive tape can be suitably cut along the outer shape of the substrate, it is possible to more reliably avoid the adhesion of the first adhesive tape and the second adhesive tape in the transfer process.
  • the tape collecting step it is preferable to collect the cut-out first adhesive tape that is bonded to the ring frame together with the ring frame.
  • the cut out first adhesive tape can be recovered by holding and recovering the ring frame that is more difficult to deform. Therefore, the cut out first adhesive tape can be collected more easily and reliably.
  • the transfer step it is preferable to perform transfer by superimposing a new ring frame on which the second adhesive tape has been applied in advance on the substrate and attaching the second adhesive tape from the non-holding surface side of the substrate.
  • the second adhesive tape is affixed to the ring frame in advance, the process and time for transferring the substrate can be shortened. Therefore, the transfer efficiency of the substrate can be improved.
  • the present invention has the following configuration in order to achieve such an object.
  • a substrate transfer apparatus for transferring a substrate bonded and held in a ring frame to a second adhesive tape via a supporting first adhesive tape, A substrate holding part for holding the substrate via the first adhesive tape; A frame holding unit for holding the ring frame; A tape cutting unit for cutting the first adhesive tape along the outer shape of the substrate held by the substrate holding unit; A tape collecting unit for collecting the first adhesive tape cut out by the tape cutting unit; After the cut out first adhesive tape is collected, a transfer mechanism for attaching and transferring the second adhesive tape from the non-holding surface side of the substrate; It is provided with.
  • the substrate transfer method and the substrate transfer apparatus of the present invention even when the substrate is bonded and held to the frame via the adhesive tape that is hard and hardly elastically deformed, the substrate is transferred again to a new adhesive tape. Sometimes, the adhesive surfaces of both adhesive tapes can be accurately avoided.
  • FIG. 1 It is a top view which shows the basic composition of a board
  • (A) is sectional drawing which shows the structure of the mount frame before and behind transcription
  • (b) is a perspective view of a mount frame. It is a front view of a tape cutting mechanism. It is a top view of a tape sticking mechanism. It is a front view of a tape cutting mechanism. It is a front view of a reversing unit. It is a figure explaining operation
  • (A) is a flowchart explaining operation
  • (b) is the schematic explaining the structure of the mount frame in each step. It is a front view explaining the structure of the mount frame in step S1.
  • (A) is a figure which shows the structure when cut
  • (b) is a figure which shows the structure after cut
  • (A) is a figure which shows the structure at the time of sticking adhesive tape T2
  • (b) is a figure which shows the structure after sticking adhesive tape T2. It is a front view explaining the structure of the mount frame in step S6. It is a figure explaining the structure which performs the transfer which concerns on a prior art example.
  • (A) is a figure which shows the structure which deform
  • (b) is a figure which shows the structure which inserts an adhesion preventing material. It is a figure explaining the structure of the tape peeling mechanism which concerns on a modification.
  • (A) is a front view explaining the structure of a tape peeling mechanism
  • (b) is a perspective view explaining the state which peels an adhesive tape. It is a figure explaining the structure of the tape peeling mechanism which concerns on a modification.
  • (A) is a front view explaining the structure which makes a cutter contact a wafer holding part, and cut
  • (b) is the state which cut
  • FIG. 1 shows a plan view of the basic configuration of a substrate transfer apparatus 1 according to the present invention.
  • the substrate transfer apparatus 1 includes a wafer W from a mount frame MF1 in which an adhesive tape T1 is attached to one surface of a semiconductor wafer W (hereinafter simply referred to as “wafer W”).
  • the wafer W is transferred to a mount frame MF2 having an adhesive tape T2 attached to the other surface.
  • the mount frame MF1 is manufactured by sticking an adhesive tape T1 to one surface of the wafer W and the ring frame f.
  • the mount frame MF2 is manufactured by attaching an adhesive tape T2 to the other surface of the wafer W and the ring frame f.
  • the ring frame f in the mount frame MF1 is denoted by reference numeral f1
  • the ring frame f in the mount frame MF2 is denoted by reference numeral f2 to distinguish between them.
  • the adhesive tape T1 and the adhesive tape T2 used in this embodiment are made of a tape mainly made of PET (Polyethylene Terephthalate) in order to give the wafer W rigidity.
  • PET Polyethylene Terephthalate
  • the material of the adhesive tape T1 and the adhesive tape T2 is not limited to PET, and other known materials may be used.
  • the substrate transfer apparatus 1 includes a mount frame storage unit 3, a first transport mechanism 5, a holding table 7, a tape cutting mechanism 9, a ring frame supply unit 11, and a tape application.
  • a mechanism 13, a tape cutting mechanism 15, a reversing unit 19, an ultraviolet irradiation mechanism 21, a tape peeling mechanism 23, and a mount frame collection unit 25 are provided.
  • the x direction in FIG. 1 is the left-right direction and the z direction is the up-down direction.
  • the lower side of FIG. 1 is referred to as “front side”, and the upper side of FIG. That is, the mount frame collection unit 25 is disposed on the back side of the mount frame storage unit 3 in the substrate transfer apparatus 1 shown in FIG.
  • the mount frame storage unit 3 is provided with a storage unit (not shown) that stores a mount frame MF1 manufactured by attaching an adhesive tape T1 to one surface of the wafer W and the ring frame f1.
  • the storage unit includes a vertical rail connected and fixed to the apparatus frame, and a lifting platform that is screwed up and down by a motor along the vertical rail. Therefore, the mount frame storage unit 3 is configured to place the mount frame MF on the lifting platform and move it up and down by pitch feed.
  • the ring frame supply unit 11 and the mount frame collection unit 25 have the same configuration as the mount frame supply unit 3.
  • the first transport mechanism 5 transports the mount frame MF1 stored in the mount frame storage unit 3 to the holding table 7 disposed at the cutting position S. Further, as will be described later, the first transport mechanism 5 also has a function of transporting the ring frame f1 separated from the wafer W to the mount frame storage unit 3 after the adhesive tape T1 is cut out by the tape cutting mechanism 9. That is, the ring frame f1 and the adhesive tape T1 separated from the wafer W are collected in the mount frame storage unit 3 by the first transport mechanism 5.
  • the first transport mechanism 5 corresponds to the tape collecting unit in the present invention.
  • the adhesive tape T1 corresponds to the first adhesive tape in the present invention.
  • the holding table 7 mounts and holds the mount frame MF1, and is configured to be able to reciprocate between the cutting position S and the transfer position R shown in FIG.
  • the holding table 7 includes an annular frame holding portion 29 that holds the ring frame f and a circular wafer holding portion 31 that holds the wafer W.
  • the wafer holder 31 corresponds to the substrate holder in the present invention.
  • the frame holding unit 29 corresponds to the frame holding unit in the present invention.
  • An adsorption hole for adsorbing and holding the ring frame f is formed on the holding surface of the frame holding unit 29.
  • a suction hole for sucking and holding the wafer W is formed on the holding surface of the wafer holder 31. From the viewpoint of more suitably performing the cutting of the adhesive tape T1, it is preferable that the diameter of the wafer holder 31 is equal to or less than the diameter of the wafer W.
  • the tape cutting mechanism 9 is disposed above the holding table 7, and includes a frame 33, a movable table 35, a support arm 37, And a cutter unit 39.
  • the movable table 35 can be moved up and down along the frame 33.
  • the support arm 37 is provided at the lower end of the arm that is cantilevered from the movable table 35, and is configured to expand and contract in the radial direction of the wafer W.
  • the cutter unit 39 is connected to the movable table 35 via the support arm 37.
  • the cutter unit 39 is mounted with a cutter 41 with a cutting edge facing downward via a cutter holder.
  • the cutter unit 39 is configured so that the turning radius can be adjusted via the support arm 37.
  • the cutter 41 cuts the adhesive tape T1 attached to the mount frame MF1 along the outer shape of the wafer W.
  • the tape cutting mechanism 9 corresponds to a tape cutting unit in the present invention.
  • the ring frame supply unit 11 includes a frame transport unit F that transports a new ring frame f2 to the transfer position R.
  • the tape applying mechanism 13 when the holding table 7 is located at the transfer position R, the tape applying mechanism 13 is disposed above the holding table 7, and includes a tape supply unit 43, an applying roller 45, and a peeling roller 49. And a tape recovery unit 51.
  • the tape supply unit 43 is loaded with a wide adhesive tape T2 wound in a roll.
  • the affixing roller 45 affixes the adhesive tape T2 over the upper surfaces of the wafer W carried into the transfer position R and the ring frame f2 newly supplied from the ring frame supply unit 11.
  • the wafer W is transferred to the adhesive tape T2 by the tape applying mechanism 13, and the mount frame MF2 is produced.
  • the tape sticking mechanism 13 corresponds to the transfer mechanism in the present invention.
  • the adhesive tape corresponds to the second adhesive tape in the present invention.
  • the tape cutting mechanism 15 is arranged above the holding table 7 when the holding table 7 is located at the transfer position R, similarly to the tape applying mechanism 13. As shown in FIG. 5, the tape cutting mechanism 15 includes a frame 53, a support shaft 55, a support arm 57, a cutter 59, and a pressing roller 61.
  • the support shaft 55 is capable of moving up and down along the frame 53, and rotates around an axis in the z direction.
  • a plurality of support arms 57 extend in the radial direction about the support shaft 55.
  • the cutter 59 is provided at the tip of the support arm 57a, and cuts the adhered adhesive tape T2 along the ring frame f.
  • the pressing roller 61 is provided at the tip of the support arm 57b and presses while rolling the tape cutting portion on the ring frame f2.
  • the reversing unit 19 is cantilevered on a lifting platform 65 that can be moved up and down along a vertically fixed vertical rail 63 and a receiving frame 69 that can be rotated around a horizontal support shaft r by a rotary actuator 67.
  • the chuck claws 71 are mounted on the base and the tip of the receiving frame 69 so as to be rotatable around the support shaft s.
  • the reversing unit 19 After receiving the mount frame MF2, the reversing unit 19 reverses the mount frame MF2 so that the adhesive tape T2 is on the lower side of the wafer W and the adhesive tape T1 is on the upper side of the wafer W.
  • the ultraviolet irradiation mechanism 21 irradiates the adhesive tape T1 positioned on the upper side of the wafer W with ultraviolet rays. Since the adhesive tape T1 is an ultraviolet curable tape, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays.
  • the tape peeling mechanism 23 peels and collects the adhesive tape T1 from the wafer W.
  • the mount frame collection unit 25 collects and stores the mount frame MF2 from which the adhesive tape T1 has been peeled off.
  • the substrate transfer apparatus 1 further includes a wafer storage unit 91, a wafer transfer mechanism 93, and a wafer alignment unit 95.
  • the wafer storage unit 91 stores the wafers W in a stacked manner.
  • the wafer transfer mechanism 93 transfers the wafer W stored in the wafer storage unit 91 to the wafer alignment unit 95.
  • the wafer alignment unit 95 aligns the transferred wafer W.
  • mount frame MF1 is already manufactured and stored in the mount frame storage portion 3
  • the substrate transfer apparatus 1 uses the wafer W to mount the mount frame MF1. It can also be used as a wafer mount device to be manufactured.
  • FIG. 7A is a flowchart showing the operation of the substrate transfer apparatus 1.
  • FIG. 7B is a diagram showing a schematic configuration of the mount frame MF in each step.
  • the surface where the circuit pattern is formed on the wafer W will be described as the surface.
  • the mounting frame MF1 has an adhesive tape T1 attached to the surface of the wafer W.
  • the adhesive layer of the adhesive tape T1 uses an ultraviolet curable adhesive.
  • Step S1 holding the mount frame
  • the mount frame storage unit 3 stores and stores a mount frame MF1 that is manufactured by adhering the adhesive tape T1 to the surface of the wafer W.
  • the first transport mechanism 5 holds the upper surface of the mount frame MF1 by suction and moves from the position indicated by the dotted line to the position indicated by the solid line as shown in FIG.
  • the first transport mechanism 5 places the mount frame MF1 on the holding table 7 located at the cutting position S with the surface to which the adhesive tape T1 is attached facing down. After placing the mount frame MF1, the first transport mechanism 5 moves to a retracted position (a left position indicated by a dotted line as an example). After the mount frame MF1 is mounted, the frame holding unit 29 sucks and holds the ring frame f1, and the wafer holding unit 31 sucks and holds the wafer W. A series of steps in step S1 corresponds to a holding step in the present invention.
  • Step S2 cutting adhesive tape T1
  • the tape cutting mechanism 9 operates and the cutting of the adhesive tape T1 is started. That is, when the tape cutting mechanism 9 is operated, the cutter unit 39 is lowered to a predetermined height and the cutter 41 is pierced into the adhesive tape T1 as shown in FIG. In this state, the adhesive tape T1 is cut along the outer shape of the wafer W. In this embodiment, since the adhesive tape T1 is cut while the cutter 41 is in contact with the outer diameter of the wafer W, the adhesive tape T1 is cut out to the same size as the wafer W.
  • step S2 corresponds to a tape cutting step in the present invention.
  • Step S3 selection of ring frame f1
  • the frame f1 is collected by the first transport mechanism. That is, the first transport mechanism 5 moves from the retracted position to the cutting position S as shown in FIG. The first transport mechanism 5 descends to a predetermined height above the mount frame MF1, and holds the upper surface of the ring frame f1 by suction. The first transport mechanism 5 holding the ring frame f1 by suction is raised again and moved to the left side to store the ring frame f1 in the mount frame storage unit 3.
  • step S2 since the adhesive tape T1 is cut along the outer shape of the wafer W, the cut adhesive tape T1 (the adhesive tape T1 in a portion separated from the wafer W) is moved together with the ring frame f1 to the first transport mechanism. 5 is collected.
  • the exposed adhesive tape T1 includes an exposed portion P. Therefore, since the exposed portion P of the adhesive tape T1 is collected along with the ring frame f1, it is possible to avoid exposing the adhesive surface of the adhesive tape T1 on the holding table 7 by the processes of Step S2 and Step S3.
  • the series of steps in step S3 corresponds to the tape collecting step in the present invention.
  • Step S4 supply of ring frame f2
  • the holding table 7 moves from the cutting position S to the transfer position R while holding the wafer W by suction.
  • the frame transport unit F sucks and holds the upper surface of the ring frame f2 stored in the ring frame supply unit 11 and moves to the transfer position R.
  • the frame transport unit F places the ring frame f2 on the ring frame holding unit 29 located at the transfer position R.
  • the frame transport unit F moves to the retracted position after placing the ring frame f2.
  • the frame holding unit 29 sucks and holds the ring frame f2.
  • the supply of the ring frame f2 is completed when the ring frame f2 is sucked and held.
  • Step S5 (Affixing adhesive tape T2) After supplying the ring frame f2 to the wafer W, the tape sticking mechanism 13 is activated to start sticking the adhesive tape T2. That is, when the tape sticking mechanism 13 is operated, the sticking roller 45 is lowered to a predetermined height and rolls from right to left in the figure as shown in FIG. As the sticking roller 45 rolls, the adhesive tape T2 loaded in the tape supply unit 43 is stuck over the upper surfaces of the wafer W and the ring frame f2 (FIG. 12B).
  • step S5 the exposed portion P of the adhesive tape T1 has already been separated from the wafer W and recovered and removed at the time of starting step S5. Therefore, since the adhesive surface of the adhesive tape T1 does not protrude outside the wafer W, it is ensured that the adhesive tape T1 adheres between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2 when the adhesive tape T2 is applied. To be avoided.
  • the wafer W is transferred from the adhesive tape T1 to a new adhesive tape T2. That is, a new mount frame MF2 is produced by transfer.
  • a series of steps in step S5 corresponds to a transfer step in the present invention.
  • Step S6 cutting the adhesive tape T2 After adhering the adhesive tape T2 to the wafer W and the ring frame f2, the tape cutting mechanism 15 operates to start cutting the adhesive tape T2. That is, as shown in FIG. 13, when the tape cutting mechanism 15 is operated, the support shaft 55 is lowered to a predetermined height, and the cutter 59 is pierced by the adhesive tape T2. In this state, the support shaft 55 is rotated around the axis in the z direction, and the adhesive tape T2 is cut into a circle along the ring frame f2.
  • the part where the adhesive tape T2 is cut on the ring frame f2 is pressed by the rolling pressing roller 61. Thereafter, the peeling roller 49 provided in the tape applying mechanism 13 is rolled from the right to the left in the figure, and the unnecessary adhesive tape T2 left outside the cutting line is peeled from the ring frame f2. The peeled unnecessary adhesive tape T2 is wound and collected by the tape collecting unit 51.
  • Step S7 (mount frame inversion)
  • the mount frame MF2 is transported to the reversing unit 19 by a second transport mechanism (not shown).
  • the reversing unit 19 holds the mount frame MF2 with chuck claws 71 provided on the receiving frame 69, and rotates the receiving frame 69 around the horizontal support shaft r.
  • the mount frame MF2 is inverted from the state where the adhesive tape T2 is set to the upper side to the state where the adhesive tape T1 is set to the upper side.
  • Step S8 (Peeling of adhesive tape T1) After inverting the mount frame MF2, the peeling of the adhesive tape T1 attached to the surface of the wafer W is started.
  • the ultraviolet irradiation mechanism 21 irradiates the adhesive tape T1 of the mount frame MF2 with ultraviolet rays. Since the adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays.
  • the mount frame MF2 after being irradiated with ultraviolet rays is transported to the tape peeling mechanism 23 by a third transport mechanism (not shown).
  • the tape peeling mechanism 23 peels and collects the adhesive tape T1 located on the upper surface side of the wafer W from the wafer W (see FIGS. 7B and S8).
  • the mount frame MF2 from which the adhesive tape T1 has been peeled is transported to the mount frame collection unit 25 by a fourth transport mechanism (not shown).
  • the mount frame collection unit 25 collects and stores the mount frame MF2 from which the adhesive tape T1 has been peeled off. Through the series of operations described above, transfer is performed from the mount frame MF1 configured by adhering the adhesive tape T1 to the surface of the wafer W to the mount frame MF2 configured by adhering the adhesive tape T2 to the back surface of the wafer W. All steps are completed.
  • the substrate transfer apparatus 1 includes a tape cutting mechanism 9 and a first transport mechanism 5.
  • the tape cutting mechanism 9 cuts the adhesive tape T1 of the mount frame MF1 held on the holding table 7 along the outer shape of the wafer W.
  • the adhesive tape T ⁇ b> 1 that protrudes outward from one surface of the wafer W, that is, the exposed portion P, is separated from the wafer W.
  • the separated exposed portion P is collected by the first transport mechanism 5 together with the ring frame f1 and stored in the mount frame storage portion 3.
  • the adhesive surface of the adhesive tape T1 does not protrude outside the wafer W when the adhesive tape T2 is attached to the other surface of the wafer. Therefore, when the adhesive tape T2 is attached to the ring frame f2 and the wafer W, it is possible to reliably avoid contact between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2. Therefore, the operation of transferring the wafer to a new adhesive tape can be performed with higher accuracy.
  • the adhesive tape T1 is deformed so as to be separated from the adhesive tape T2, or the adhesive tape T1 is exposed as shown in FIG. 14 (b).
  • a method of inserting a non-tacky adhesion preventing material B into the part P has been used.
  • the adhesive tape T1 it is necessary to deform the adhesive tape T1 in the conventional method shown in FIG. For this reason, when a material that is hard and hardly elastically deformed, such as PET (Polyethylene Terephthalate), is used as the adhesive tape T1, it is difficult to apply the conventional method. Moreover, even if the distance between the exposed portion P and the adhesive tape T2 is increased, the exposed portion P is in a state of protruding outside the wafer W, so that it is possible to reliably avoid the adhesion between the exposed portion P and the adhesive tape T2. Have difficulty.
  • PET Polyethylene Terephthalate
  • the adhesive tape T1 is cut along the outer shape of the wafer W to avoid adhesion between the adhesive tapes. That is, in the configuration according to the embodiment, it is not necessary to deform the adhesive tape when transferring the wafer W. Therefore, even if the adhesive tape is a hard material that is difficult to elastically deform, adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided.
  • the substrate transfer apparatus 1 it is not necessary to newly use an adhesion preventing material. Therefore, even when the adhesive force of the adhesive tape is strong, the adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided while avoiding damage to the wafer W. Therefore, in the substrate transfer apparatus 1 according to the embodiment, the adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided without being influenced by the characteristics of the adhesive tape such as hardness and adhesive force. Further, in the holding table 7 according to the embodiment, since the wafer holding unit 31 can be made smaller than the diameter of the wafer W, it is possible to avoid an increase in the size of the substrate transfer apparatus 1.
  • the present invention is not limited to the above embodiment, and can be modified as follows.
  • the process according to step S8 is not limited to the configuration using the ultraviolet irradiation mechanism 21. That is, the adhesive tape T1 may be peeled by a method using a peeling adhesive tape and a peeling member without irradiating the mount frame MF2 with ultraviolet rays.
  • the tape peeling mechanism 23 includes a movable base 81 that holds the mount frame MF2 and a guide that guides the roll-off peeling tape Q as shown in FIG. A roller 83, a knife-edge-shaped peeling member 85, and a winding shaft 87 for collecting the peeling tape Q are provided.
  • the peeling tape Q is guided to the peeling member 85 by the guide roller 83, and after being reversed and reversed by the peeling member 85, it is wound and collected by the winding shaft 87. That is, the release tape Q is attached to the adhesive tape T1 attached to the surface of the wafer W with respect to the mount frame MF2 held on the movable table 81. And the movable stand 81 is moved to the middle right of Fig.15 (a) in the state which affixed the peeling tape Q to adhesive tape T1.
  • the peeling tape Q is turned back at the tip of the peeling member 85, so that the adhesive tape T1 is integrated with the peeling tape Q and the surface of the wafer W. Is peeled off.
  • the method using the peeling tape Q as shown in FIG. 15A and the method using the ultraviolet irradiation mechanism 21 may be used in combination.
  • the cut-off portion of the adhesive tape T1 is collected together with the ring frame f1 in step S3.
  • the present invention is not limited to this. That is, a configuration may be adopted in which the cut-out portion of the adhesive tape T1 is peeled off from the ring frame f1, and only the cut-out portion of the adhesive tape T1 is recovered.
  • the adhesive tape T2 can be pasted over the ring frame f1 and the other surface of the wafer W in step S6 without newly using the ring frame f2. Accordingly, since the ring frame f2 and the ring frame supply unit 11 can be omitted, it is possible to avoid an increase in the size of the substrate transfer apparatus 1 and to reduce the cost.
  • the adhesive tape T2 is attached to the upper surface of the ring frame f2 and the wafer W in step S6, but transferred to the adhesive tape T2.
  • the configuration to be performed is not limited to this. That is, the ring frame f2 with the adhesive tape T2 attached in advance may be supplied to the wafer W carried into the transfer position R, and the adhesive tape T2 may be attached to the upper surface of the wafer W.
  • the tape cutting mechanism 9 is configured to use the cutter 41, but may be configured to cut the adhesive tape with a laser instead of the cutter blade.
  • the semiconductor wafer has been described as an example of the substrate.
  • the apparatus can be applied to substrates of various shapes and sizes such as LED substrates and circuit boards.
  • the shape of the adhesive tape T1 cut in the tape cutting step is changed according to the outer shape of the substrate to be applied.
  • the substrate support frame to be used is not limited to the wafer ring frame f, and a square frame or the like corresponding to the shape of the substrate to be used can also be used.
  • a rectangular frame for example, a plurality of rectangular substrates can be bonded and held with an adhesive tape, and dead space can be reduced. As a result, work efficiency can be improved.
  • the transfer source ring frame f and the transfer destination new ring frame f have the same shape.
  • frames having different shapes may be used in combination.
  • a pre-cut type adhesive tape T2 previously cut into a ring frame shape may be attached to the ring frame f2.
  • step S2 the cutter 41 is cut while being in contact with the outer shape of the wafer while being held by the wafer holder 31 smaller than the diameter of the wafer W.
  • the tape cutting process according to step S2 is not limited to the configuration in which such an adhesive tape T1 is cut out to the same size as the wafer W. That is, as shown in FIG. 16A, the adhesive tape T1 may be cut while the cutter 41 is in contact with the outer shape of the wafer holder 31 while being held by the wafer holder 31 larger than the diameter of the wafer W. .
  • the adhesive tape T1 is cut out so as to have a larger size than the diameter of the wafer W in step S2.
  • the size of the cut out adhesive tape T1 is adjusted to a size that can reliably avoid the adhesion between the adhesive tape T1 and the adhesive tape T2 in the transfer process according to step S5.
  • the length k of the portion of the adhesive tape T1 cut out that protrudes outside the wafer W is equal to or less than the thickness G of the wafer W. preferable.
  • the cutter 41 is not brought into contact with either the outer diameter of the wafer W or the outer diameter of the wafer holding unit 31.
  • a configuration in which the adhesive tape T1 is cut out to be slightly wider than the wafer W may be employed.
  • the difference between the radius Tr of the removed adhesive tape T1 and the radius Wr of the wafer W is preferably equal to or less than the thickness G of the wafer W.
  • the adhesive tape T1 is deformed so as to be bent at the end of the wafer W from the position indicated by the dotted line to the position indicated by the solid line in the transfer process. Even if it is a case, it can avoid reliably that adhesive tape T1 and adhesive tape T2 contact. Therefore, adhesion between the pressure-sensitive adhesive tapes in the transfer process can be avoided more reliably, so that the accuracy of transfer to the pressure-sensitive adhesive tape T2 can be further improved.
  • the radius D of the wafer holder 31 is smaller than the radius Tr of the cut adhesive tape T1.
  • the cutter 41 can be cut so as to penetrate the adhesive tape T1, the adhesive tape T1 can be more suitably cut.
  • “cutting the adhesive tape along the outer shape of the wafer” in the tape cutting step means not only the case where the adhesive tape T1 is cut to the same size as the wafer W. The case where the adhesive tape T1 is cut to a size wider than the outer shape of the wafer W to the extent that the adhesion between the adhesive tape T1 and the adhesive tape T2 can be surely avoided in the transfer step is also included.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)

Abstract

Selon la présente invention, un cadre de montage MF1 est maintenu par une bande adhésive T1 placée en dessous, la bande adhésive T1 est découpée en suivant la forme extérieure d'une tranche W, et la bande adhésive T1 découpée est récupérée. La tranche W est dotée d'un nouveau cadre annulaire f2, et un nouveau ruban adhésif T2 est collé sur les surfaces supérieures de la tranche W et du cadre annulaire. Etant donné que la bande adhésive T1 dans la partie excédentaire sur le côté extérieur de la tranche W a été séparée de la tranche W et récupérée, l'adhérence entre le ruban adhésif T1 et le ruban adhésif T2 lors du transfert peut être évitée avec certitude.
PCT/JP2016/087443 2016-03-07 2016-12-15 Procédé de transfert de substrat et dispositif de transfert de substrat WO2017154304A1 (fr)

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CN201680083263.0A CN108713247B (zh) 2016-03-07 2016-12-15 基板转印方法和基板转印装置
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US11609336B1 (en) 2018-08-21 2023-03-21 Innovusion, Inc. Refraction compensation for use in LiDAR systems
JP7458245B2 (ja) 2020-06-05 2024-03-29 リンテック株式会社 転写装置および転写方法
JP2023037700A (ja) 2021-09-06 2023-03-16 株式会社ディスコ ウエーハの移し替え方法
JP2023038724A (ja) 2021-09-07 2023-03-17 株式会社ディスコ ウエーハの移し替え方法
JP2023120503A (ja) 2022-02-18 2023-08-30 株式会社ディスコ ウェーハ転写方法、及びウェーハ転写装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045023A (ja) * 2003-07-22 2005-02-17 Toshiba Corp 半導体装置の製造方法および半導体製造装置
JP2005228794A (ja) * 2004-02-10 2005-08-25 Tokyo Seimitsu Co Ltd チップ製造方法
JP2005332931A (ja) * 2004-05-19 2005-12-02 Tokyo Seimitsu Co Ltd ウェーハマウンタ
US8450188B1 (en) * 2011-08-02 2013-05-28 Micro Processing Technology, Inc. Method of removing back metal from an etched semiconductor scribe street
JP2016178244A (ja) * 2015-03-20 2016-10-06 リンテック株式会社 シート剥離装置および剥離方法、並びに、シート転写装置
JP2016178245A (ja) * 2015-03-20 2016-10-06 リンテック株式会社 シート剥離装置および剥離方法、並びに、シート転写装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012216606A (ja) * 2011-03-31 2012-11-08 Nitto Denko Corp 基板転写方法および基板転写装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045023A (ja) * 2003-07-22 2005-02-17 Toshiba Corp 半導体装置の製造方法および半導体製造装置
JP2005228794A (ja) * 2004-02-10 2005-08-25 Tokyo Seimitsu Co Ltd チップ製造方法
JP2005332931A (ja) * 2004-05-19 2005-12-02 Tokyo Seimitsu Co Ltd ウェーハマウンタ
US8450188B1 (en) * 2011-08-02 2013-05-28 Micro Processing Technology, Inc. Method of removing back metal from an etched semiconductor scribe street
JP2016178244A (ja) * 2015-03-20 2016-10-06 リンテック株式会社 シート剥離装置および剥離方法、並びに、シート転写装置
JP2016178245A (ja) * 2015-03-20 2016-10-06 リンテック株式会社 シート剥離装置および剥離方法、並びに、シート転写装置

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CN108713247A (zh) 2018-10-26
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TWI707818B (zh) 2020-10-21
TW201738164A (zh) 2017-11-01
CN108713247B (zh) 2023-07-07
JP6695173B2 (ja) 2020-05-20

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