TW201246341A - Method for applying film, method for grinding back surface, method for forming semiconductor chip, and apparatus for applying film - Google Patents

Abstract

In the technology for applying a film to a surface of an object for grinding a back surface etc., to apply a film accurately by using a simple technique. An object 10 having a first surface 10a and a second surface 10b opposite to the first surface, a flexible film 12 having a front surface 12a larger than the first surface of the object, a frame member 14 shaped and sized so as to be placeable along a perimeter of the film and having a rigidity higher than a rigidity of the film, and a liquid adhesive 16, are provided. The liquid adhesive is arranged on the first surface of the object or the front surface of the film. The frame member is fixed to the film along the perimeter of the film. The object and the film are arranged in a relative position where the first surface is opposed to the front surface, and a region of the film along the perimeter of the film extends outward from the object, and the first surface and the front surface are both brought into contact with the liquid adhesive. The liquid adhesive is solidified to securely attach the film to the first surface of the object.

Description

201246341 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of coating a film onto the surface of an object. The present invention is also directed to a method of grinding the back surface of an article prior to application of the film to a surface prior to application. The invention is also directed to a method of forming a semiconductor wafer, the method of forming a semiconductor wafer comprising the step of grinding the back surface of the wafer. [Prior Art] In the field of manufacturing a semiconductor integrated circuit, a method of manufacturing a plurality of semiconductor wafers is known, in which a protective film or a protective film is formed after a circuit is formed on a surface of a wafer of a predetermined thickness or In the case where a glass plate is applied to a surface on which a circuit pattern is formed (hereinafter referred to as a circuit side), the thickness of the wafer is uniformly reduced by grinding the surface of the wafer in the side opposite to the circuit side and cutting Thinned wafers (generally referred to as dicing) are divided to obtain a plurality of semiconductor wafers. For example, Japanese Unexamined Patent Publication (Kokai) No. 2005-1502W discloses a semiconductor surface protection method and a semiconductor surface protection sheet which permits back grinding of a semiconductor wafer to an ultra-thin wafer. . The semiconductor B has a high protrusion (such as a solder bump) on the side of the polishing circuit. The semiconductor surface protection method disclosed in Japanese Unexamined Patent Publication No. Hei No. Hei-5-150235 comprises the steps of: laminating a polymer film material to the circuit side of a semiconductor wafer via a surface protective layer 'The surface protective layer is Fluid at room temperature or fluidized by heating and hardened after exposure to radiant energy or by heating; and solidification of the protective sheet of the semiconductor I60620.doc 201246341. Regarding the method of using the surface protective sheet, there is a description that the surface protective sheet can be laminated by bringing the surface protective sheet into close contact with the circuit side of the semiconductor wafer after heating or during heating. The sheet can be brought into close contact with the circuit side of the wafer in the vacuum chamber. This method can be used to achieve a perfect laminate that does not include bubbles. In the case where the circuit side of the wafer is protected by the surface protective sheet, the wafer can be thinned by polishing the surface of the wafer opposite to the circuit side. After the wafer obtained by the back grinding step is fixed by bonding the finished abrasive surface to the dicing sheet, the obtained wafer is transferred onto the diced sheet by removing the surface protective sheet by peeling off' 'And send the obtained wafer to the dicing step. A method for effectively preventing the flattening in a dicing block in a method of manufacturing a semiconductor wafer, including a dicing step of a semiconductor wafer, is disclosed in Japanese Laid-Open Patent Publication No. 2005-159155. The method of manufacturing a semiconductor wafer disclosed in Japanese Unexamined Patent Publication (Kokai) No. Hei No. Hei No. Hei No. Hei No. Hei No. No. 2005-159155, which comprises the step of coating a light/heat exchange layer (including a light absorber and a thermally decomposable resin) on a light-transmitting support. Providing a semiconductor wafer having a circuit side having a circuit pattern and a non-circuit side opposite to the circuit side; laminating the semiconductor wafer to the light transmitting branch via a photocurable adhesive And a photocurable adhesive hardened by irradiation with light from a side of the light-transmitting support to form a laminate having an external non-circuit side; a non-circuit that polishes the semiconductor wafer Side until the semiconductor wafer reaches a desired thickness, dicing the ground semiconductor wafer from the non-circuit side and cutting it into a plurality of semiconductor wafers; and illuminating with the radiant energy from the light transmissive branch member The light/heat exchange layer is decomposed and

160620.doc S 201246341 The light/heat exchange layer is divided into a semiconductor wafer having the adhesion layer and a light transmissive support. Regarding the method of separating the semiconductor wafer from the light-transmitting support members, there is a description that the adhesive attach 52 is disposed on the wafer side of the laminate 1 having a plurality of wafers. The adhesive 52 is fixed in the plane by means of an annular metal frame (Fig. 5(b)). Next, the laminate 1 is irradiated with the laser light 54 from the support side (Fig. 5(c)). After irradiation with the laser light, the support member $ is pulled up to separate the support member 5 from the wafer 6 (Fig. 5(d)). Finally, the adhesion layer 3 can be removed by spalling to obtain a thinned wafer pattern. Again, the following description: The light transmissive support is preferably sufficiently rigid to prevent warpage of the semiconductor wafer during grinding. The bending rigidity of the support member is preferably not less than 2xlO_3 (Pam3), and more preferably 3xl0-2 (Pam3). Examples of useful supports include glass plates, acrylic plates, etc. and the photocurable adhesives preferably have a temperature at the coating and lamination operation (eg, less than 1 〇〇〇〇 cps 2 viscosity at 25 〇 to adhere) The layer is filled into the uneven circuit pattern on the wafer to achieve a uniform thickness. In various methods to be described later, the liquid adhesive is preferably applied by a spin coating step, regarding the adhesive, uv curing type And a photocurable adhesive is particularly preferred. A method of manufacturing a split wafer is disclosed in the Kokai Patent Publication No. 2008-010464, in which a prior dicing and regrind process is performed (wherein In the case of performing dicing before grinding the back, even if a wafer having a large unevenness or a wafer having a high aspect ratio is formed, the jump of the wafer in the case of grinding on the back and the damage to the adjacent wafer can be eliminated. The method for manufacturing a split wafer disclosed in the Japanese Unexamined Patent Publication No. includes the following steps: • Filling with a liquid adhesive such as 160620.doc 201246341 Cutting the gap between the individual wafers; laminating the article to be ground on a rigid support to expose the back; hardening or solidifying the adhesive to form a laminate having a plurality of wafers to be ground The article, the adhesive solids, and the rigid support are sequentially disposed; the laminate is ground from the back surface of the article to be abraded to obtain a thinned separate individual wafer on the laminate; the rigid support is moved from the laminate In addition to the removal of the rigid support, the flexible adhesive sheet is bonded to the adhesive solids of the laminate; and the individual wafers held by the adhesive solids on the flexible adhesive sheet are picked up and collected. There is a description that any type of adhesive (including a curable adhesive, a solvent-based adhesive, a hot-melt adhesive, or a water-dispersible adhesive) can be used as an adhesive, and the rigid support is required to be sufficiently rigid so that The warpage preventing & product is ground during grinding of the back surface and permits stress free grinding. Useful supports include, for example, thin layers of resin material, glass Member. SUMMARY OF THE INVENTION In a case where one object such as a wafer, one of the wafer base material and the article package so 'as the article for semiconductor

The step of the surface is also required to accurately perform the reduction of the borrowing and the cutting into the 160620 by using a simple method of polishing the thickness of the wafer by grinding the back surface, including polishing one wafer. Doc 3 201246341 Line = division into a number of wafers. In addition, in the technique of applying a film to the surface of the article for polishing the article or the like, it is desirable to apply the film to the article by using a simple technique. In one aspect of the invention, a method of coating a film is provided, the method comprising the steps of: providing an object having a first surface and opposite the first surface - a second a surface; the flexible film having a front surface that is larger than the first surface of the object; the frame member being shaped and dimensioned so as to be positionable along the periphery of the film and having a higher a rigid rigidity of the film; and a liquid adhesive; the liquid adhesive is disposed on the first surface of the article or the front surface of the film; the frame member is fixed to the film along the periphery of the film Positioning the article and the film in a relative position, wherein the first surface is opposite the front surface and a region of the film along the periphery of the film extends outwardly from the article and the first surface is caused Contacting the liquid adhesive with both the front surface; and causing the liquid The body adhesive solidifies and the film is firmly attached to the first surface of the article. In another aspect of the invention, a method is provided comprising the steps of: providing a method of coating a film, the object having a first surface and a second surface opposite the first surface a flexible film and a liquid adhesive; the liquid adhesive is placed on the first surface of the object or the front surface of the film; the object and the film are disposed in a relative position, wherein The surface is opposite to the front surface, and the first surface and the front surface are in contact with the liquid adhesive; in the case where the first surface and the front surface are in contact with the liquid adhesive, the object and the object are Film spinning 160620.doc • 8 - 201246341 rotation to spread the liquid adhesive on a gap between the first surface and the front surface; and solidifying the liquid adhesive and firmly attaching the film to The first surface of the article. In still another aspect of the present invention, there is provided a method of grinding a back surface of an article, the method comprising the steps of: • passing the coating film according to one of the aspects described above Method, the film is firmly attached to the first surface of the article; and the second surface of the article is 'polished' with the film firmly attached to the first surface. In another aspect of the invention, a method of grinding a back surface is provided, the method comprising the steps of: firmly attaching the crucible to the article via the method according to another aspect described above The first surface; and in a state in which one of the articles is fixedly supported, the second surface is ground while the film is firmly attached to the first surface. In still another aspect of the present invention, a method of forming a semiconductor wafer is provided, the method comprising the steps of: grinding the second object of an object via the method of polishing the back surface according to the aspect described above a surface, the article comprising a wafer having a circuit side as the first surface. In a further aspect of the invention, a device for coating a film is provided, the device comprising: a frame support portion And for steadily cutting the frame material relative to the object in contact with both the first surface of the article and the front surface of the film; and a driving portion for The frame i-floor portion is rotated relative to the object and the solid soil is also supported in the state of the frame member, so that the object and the film are rotated in a coaxial configuration. β 160620.doc • 9 201246341 In a further aspect of the invention, there is provided a device for coating a film, the package comprising: a film-retaining portion for use on the first surface of an object Where the front surface of the film is in contact with a liquid adhesive, the film is stably supported against the object; and a driving portion for stably supporting the film supporting portion relative to the object In one state of the film, the article and the film are rotated in a coaxial configuration. With respect to the method of coating a film according to an aspect of the present invention, since a frame member having rigidity higher than a rigidity of the film is fixed to the film along a periphery of the film, it can be held in the frame The central region of the film inside the component is undistorted such that the first surface of the article and the front surface of the film can be disposed substantially parallel to each other and can contact a liquid adhesive. Since a liquid adhesive is used as a member for bonding the article and the film, the unevenness and unevenness of the first surface of the article can be filled by the liquid adhesive, and the The flatness of the film after the liquid adhesive solidifies, and a bonding layer (not including the liquid adhesive after solidification) is formed between the object and the film. The bonding layer can stably maintain high adhesion strength for a long time. A longer period. Therefore, with regard to the above method of coating a film, the film can be accurately applied to an object by using a simple technique. A method of coating a film according to another aspect of the present invention, wherein the object and the object are contacted by the first surface of the object and the front surface of a film contacting a liquid adhesive The film is rotated so that the liquid adhesive can be spread over the first surface and the front surface, and the film phase 160620 during the rotation of the article and the film can be prevented by firmly supporting the film ' .doc 201246341 Possible rise of the object and positional deviation of the two central axes. Therefore, the flatness of the film after the liquid adhesive is entangled and the parallelism of the first surface of the article with the front surface of the film can be ensured. Since the liquid-adhesive agent is used as a member for bonding the article and the film, the bonding layer (the liquid adhesive after solidification) which does not include bubbles can be formed between the article and the film. This bonding layer maintains high adhesion strength for a long period of time. Thus, with respect to the above method of coating a film, the film can be accurately applied to an article by using a simple technique. The method for polishing a back surface of an object according to still another aspect of the present invention, since the first surface of the object is protected by a film, and the method of using the glass plate for protection Compared, it can reduce costs. Since a frame member having a rigidity higher than the rigidity of the film is fixed along the periphery of the film, the central portion of the film located inside the frame member can be kept free of distortion and the first surface of the object The front surface of the film may be disposed substantially parallel to each other, and may contact the liquid adhesive in this state. Further, the process of grinding the second surface of the article can be performed quickly by disposing the frame member. In addition, since the liquid adhesive is used as a member for bonding the article and the film, the flatness of the film after the liquid adhesive is solidified is ensured, and a film can be formed between the object and the film. This bonding layer including bubbles is included. By ensuring the flatness of the film and the parallelism between the first surface of the article and the front surface of the film, the second surface of the article can be uniformly ground to form a flat finished surface, and The thickness of the article can be uniformly reduced to about a few tens of microns. The bonding layer not including the bubbles can stably maintain the high adhesion strength for a long period of time, and can effectively prevent the treatment medium from entering the bonding layer during the grinding operation. Therefore, with respect to the above method of grinding a back surface, the thickness of an object can be accurately reduced by using a simple technique. With respect to the method of forming a semiconductor wafer according to still another aspect of the present invention, the cutting step can be accurately performed on the wafer (object) having a machined surface. The machined surface is as described above. Forming the method of grinding a back surface, the cutting step being at the same position as performing the grinding of the back surface and the high adhesion provided by the bonding layer between the wafer (object) and the film Performed under intensity. Because of &, the method of forming: a semiconductor wafer can be performed by using a simple technique to accurately perform the reduction of the thickness of the wafer by the grinding-back surface and the plurality of wafers by cutting Division. [Embodiment] The present invention will be described in detail with reference to the drawings showing embodiments of the invention. Throughout the figures, corresponding components are represented by common reference numerals and symbols. The method of coating a film as shown in the drawings has the purpose of applying a flexible film to the surface of a relatively solid object. The method can be implemented as a step of a method of grinding a back surface, wherein in an object (ie, an object to be ground), such as a wafer as a base material of a semiconductor wafer, the object has The surface of the primary function (i.e., the first surface) and the back surface opposite the first surface (i.e., the second surface) grind the second surface to thereby uniformly reduce the thickness of the article. The method of polishing the back surface can be implemented as a process for polishing the back surface to uniformly reduce the thickness of the wafer by 160620.doc -12 - 201246341 in a method of forming a semiconductor wafer. The method includes grinding a back surface opposite to the circuit side in a state in which the circuit side is protected by coating a protective film after forming a circuit pattern on the surface of the wafer of a specified thickness. However, the method of coating a film according to an embodiment of the present invention and the method of grinding the back surface according to another embodiment are not limited to such applications as described above. 1 and 3(a) show an exemplary method of coating a film (or a method of polishing a back surface). First, an object is provided: an object 1 having a first surface 10a and a second surface 10b a flexible film 12 having a front surface 12a that is larger than the first surface 10a of the object 1〇; a frame member 14 having a shape and size that can be placed along the periphery 12c of the film 12 and having a higher Membrane I: rigid rigidity; and a liquid adhesive 丨6. The object 10 includes: a first surface 10a and a second surface 1b extending substantially parallel to each other; and an outer circumference 1cc between the first surface 1a and the second surface 10b extend. The article 1 can be a flat member, and it is contemplated that the flat member can be thinned from the initial thickness to a desired uniform thickness by grinding the entire second surface 10b. Alternatively, the object 1 may be a flat member for which the polishing of the second surface 丨〇b and the resulting thinning are not expected. The object 10 may be a wafer or a substrate formed by cutting, deuterated gallium, quartz, sapphire, glass or the like. In the case where the object 10 has a disk-like shape, the diameter of the object 10 may be, for example, 5 〇 mm to 50 〇mme When the method of applying the uncoated film in the process of polishing the back surface in the process of forming a semiconductor wafer is used, the object 1 is a rounded material which is a base material of the semiconductor wafer. Usually, the first surface 1〇a is formed into a desired circuit pattern 160620.doc

-13- S Circuit side of 201246341. In this case, the first surface 10a can have various convex portions 11 (Fig. 4) due to a printed wiring or the like. The first surface 10a may have a linear groove cut into a thickness direction at a predetermined position when performing "first dicing and regrind" as described in Japanese Unexamined Patent Publication (Kokai) No. 2008-010464 ( The thickness of the wafer not shown is, for example, about 5 cucurbits to 1 mm, and is normalized along with the diameter. The thickness of the semiconductor wafer after grinding the back surface is, for example, 5 〇 4 „1 to 1 〇〇. Μπι, but recently the need for semiconductor wafer advancement thinning. The object shown has a disc shape (having a central axis 10d (Fig. 3(a)))) (as generally seen for wafers), but The shape of the rectangular plate (as seen, for example, as a substrate for a display device). In any case, the material, shape, size, and the like of the article 10 are not particularly limited. The film 12 is a flexible diaphragm member having a front The surface 12& and the back surface 12b and the periphery 12c opposite to the front surface are formed of a resin or the like in a substantially uniform thickness. The film 12 may have the function of: firmly securing the film 12 with the liquid adhesive 16 Attached to object 1〇筮Le-surface l〇a to protect the first surface W. When a light-curing adhesive (described later) is used as the liquid adhesion (four), the film U desirably has sufficient transparency and can be used by The formed polymer film: for example, a polygraph (such as polyethylene terephthalate: a teacher), a polyglycol resin (such as polypropylene, polychlorinated ethylene: ^ spotted polyvinylidene chloride wax, poly The step of grinding the back surface in the method of encapsulating the amine resin or the like, in the step of performing the process, the film 12 desirably has the following material properties: it can be protected during the step of grinding the side surface or during the step of dicing The circuit side of the wafer of the first surface of the first surface is such that the circuit side is not contaminated or damaged. In this case, the thickness of the film 12 is, for example, 5 to 200 μm. The film 12 may be pre-cut in the form of a sheet or may be supplied from the drum to be cut just prior to use. The excess portion of the film 2 may be pre-cut and removed so that the film 12 has a shape similar to that of the object. Or can be cut after being applied to the article 10 The excess portion is removed so that the film 12 has a shape similar to that of the article. The film 12 shown has a shape similar to the disk shape of the object 10 (having a central axis 12d (Fig. 3(a))), except The material, shape, size, and the like of the film 12 are not particularly limited as follows: the film 12 has a front surface 12a larger than the first surface 10a of the article 10. The frame member 14 is an annular member having a first surface I4a and a second surface 14b opposite to the first surface, an inner circumference i4c extending between the first surface and the second surface 14b, and an outer circumference 14d' opposite to the inner circumference i4c and composed of, for example, metal, resin or The like is formed so as to have a substantially uniform thickness. The frame member 14 has a rigidity sufficient to maintain the central portion of the film 12 located inside the inner circumference 14C when the first surface 14a or the second surface 14b is fixed to the front surface 12a or the back surface 12b along the periphery 12c of the film 12. In an extended state. The rigidity of the frame member 14 can be determined based on material, size, shape, etc., and can be selected to prevent the frame member i 4 from significantly bending or deforming (even when any tension is applied to the film 12). For example, in the case where the annular frame member 14 is made of stainless steel, the following shape is suitable: the frame member 14 that can be used, for example, for a polycrystalline silicon wafer having a diameter of 3 mm has about 1 Thickness from mm to 2 mm, approx.

S 160620.doc 15 201246341 Inner diameter of 350 mm and outer diameter of approximately 400 mm. The frame member 14 is shown to have an annular shape similar to the disc shape of the article 10 (having a central axis 14e (Fig. 3(a))), but the material, shape or size of the frame member 14 is other than the following. There is no particular limitation: the frame member 丨 4 has a shape and size that allows it to be placed along the periphery 12c of the film 12, and the frame member μ has a rigidity higher than that of the film 12. The frame member 14 can be formed of the same material as the film 12. The liquid adhesive 16 exhibits high adhesion strength so as to be able to firmly adhere the front surface 12a of the film cartridge 2 to the first surface i〇a of the article 10, and may be, for example, a curable adhesive, a solvent-based adhesive, including A thermoplastic resin or a water-dispersible adhesive of a hot-melt adhesive or the like. Here, the curable adhesive is a liquid hardened by applying heat or by irradiation with energy (such as uv irradiation). Adhesives Solvent-based adhesives are liquid adhesives that solidify by evaporation of the solvent. A hot-melt adhesive is an adhesive that refines after heating and solidifies upon cooling. The water-dispersible adhesive is an adhesive containing an adhesive component dispersed in water and solidified by evaporating water. The curable adhesive comprises: a one-component heat curable adhesive based on epoxy resin or amino carboxylic acid vinegar; a two-component reactive adhesive based on epoxy resin, urethane or acrylic resin; UV curable adhesive based on acrylic resin or epoxy resin; and electron beam curable adhesive. The solvent-based adhesive includes a rubber-based adhesive that dissolves rubber, an elastomer, or the like in a solvent. The terms "cured" and "coagulated" refer to hardening. The method of coating the film can be carried out in the step of grinding the back surface for forming a semiconductor wafer. In this case, the liquid adhesive 16 preferably has the following material 160620.doc • 16 · 201246341 Properties: permit the liquid adhesive 16 to be evenly and smoothly filled between the convex portions before the liquid adhesive 16 is solidified In the gap or in the linear trench for the "first dicing and re-polishing process", and forming a bonding layer 18 with a minimum of bubbles to no bubbles between the object (wafer) 1 〇 and the film 12 (Fig. 3 (Fig. 3 b)). In particular, in order to achieve a uniform thickness of the bonding layer 18, in one embodiment, prior to solidification, the liquid adhesive 16 has less than 1 〇pa.s in a working environment (eg, 25C) (i〇〇〇〇cp ) the viscosity. Here, the viscosity is a value measured by a Brookfield-type rotational viscosity (and the value is converted to (viscosity) = (indicative value) x (conversion factor) according to the rotor shape and the number of revolutions). For example, at 25. (: The environment uses a Brookfield-type viscometer (BM) having a rotor shape No. 2 and 12 claws (for example, "rvdV-E" available from Ky〇wa Kagaku KK (Tokyo)) The viscosity is measured. The liquid adhesive 16 is preferably in an operating environment (eg, at 25 C>c) after removal of the solvent (in the case of solvent-based adhesives), after curing (in the form of a curable adhesive) In the condition), after solidification (in the case of a hot-melt adhesive), has a storage elastic modulus of not less than 100 MPa, and at the highest achievable temperature during the step of grinding the back surface (for example, at 5 〇) It has a storage elastic modulus of not less than 10 MPa. In the case of storing the elastic modulus of the liquid adhesive, the distortion of the liquid adhesive 16 due to stress during the step of grinding the back surface can be prevented. And the second surface 10b of the article 10 can be uniformly ground. The storage elastic modulus is measured by an adhesive for a sample size of 22.7 mm MO mm x 50 4 claws under the following conditions: Temp Ramp mode, tensile test mode, At the frequency of i Hz, 0.04% strain and 5aC/min temperature increase rate. Available by 160620.doc •17_ s 201246341

The storage elastic modulus was measured by SOLID ANALYZER RSA II (trade name) manufactured by Rheometric Co. In order to prevent the ingress of water during the step of grinding the back surface or the flattening (edge flattening) during the dicing step, the liquid adhesive preferably has, for example, 〇·1 N/25 mm to 0.5 N after solidification. Adhesion strength of /25 mm, more preferably adhesion strength of 0.1 N/25 mm to 0.2 N/25 mm. Here, the adhesion strength is measured by the method according to JIS Z 0237 (that is, under pressure, 'a round trip at 5 mm/sec of a rubber roller having a weight of 2.0 Kg' will be 25 mm width The test piece is adhered to an adhesive body (SUS43 0BA plate) and the test piece is self-adhered with a tensile tester at 3 〇〇 ± 3 〇 mm/min in the direction of 180° 20 to 40 minutes after the adhesion. Stripped). The thickness of the bonding layer 18 after the liquid adhesive 16 is solidified is not particularly limited, but is preferably in a range permitting filling of the unevenness of the first surface 10a and flattening the film 12, for example, at 10 It is in the range of μηι to 15〇μηη, and more preferably in the range of 20 μm to 100 μηη. For the component group as described above, the liquid adhesive 16 is disposed on the first surface 10a of the article 10 or the film 12 in the next step of the method of coating the film (or the method of polishing the back surface). Before the surface 123. The liquid adhesive 16 can be disposed on the first surface 10a of the article 10 or the front surface 12& of the film 12 by dropping or coating the liquid adhesive 16 with a suitable device. In the configuration shown, the object 1 is placed on the stage 20 with the first surface 10a facing up (Fig. 4(a))' and a sufficient amount of the liquid adhesive 16 is disposed on the object 10 In the region of the center axis 1〇d of the first surface 10a (Fig. 4(b)). When the liquid adhesive 16 is disposed on the first surface of the object 1160160620.doc -18-201246341, the liquid can be liquidated by, for example, rotating the object 10 about its central axis 1〇d or vibrating the object The adhesive 16 is uniformly spread over the entire first surface 10a. On the other hand, the frame member 丨4 is firmly attached to the film 12 along the periphery 12c of the film bundle 2 (Fig. 3(b)). In the drawings, the frame member 14 is uniformly fixed to an annular region along the entire periphery 12c of the weir surface 12a of the film 12. The frame member 14 can be fixed by various bonding members such as an adhesive, double-sided adhesive bonding, fusion bonding, and the like. In the configuration shown, the same liquid adhesive as the liquid adhesive 16 is used as the bonding member, and the second surface Mb of the frame member 14 is firmly fixed by the bonding layer 22 formed by solidification of the liquid adhesive 16. To the front surface 12a of the film 12 (Fig. 3(b)). This liquid adhesive can be placed in a continuous line along the front surface of the membrane 藉2 by using a suitable nozzle! The annular region of the periphery 12c is disposed on the second surface 14b of the frame member 14. The liquid adhesive can be configured by using a stationary nozzle while rotating the membrane 12 or the frame member 14 about the central axis 12d or 14e, or by using an automated machine such as a robot. The circular track is moved to the stationary film 12 or the frame member 14. Next, the article 10 and the film 12 are disposed in opposite positions, wherein the first surface 10a and the front surface 12a are opposed to each other. The area of the film 12 along the periphery 12c (and therefore the frame member 14) extends outwardly from the article 1〇. Both the first surface i〇a and the front surface 12a are in contact with the liquid adhesive 16 (Fig. 4(c)). Next, the liquid adhesive 16 is widely spread between the first surface i〇a of the article 10 and the front surface 12a of the film 12 (圊4(d), Fig. 4(e)). Since the frame member is "fixed to the media 2" uniformly along the periphery 12, the central portion 12e of the film 12 located inside the frame 14 of the frame 160620.doc • 19· 201246341 can be maintained by the frame member 14 (Fig. 3(b) )) is in a fully extended state (i.e., no twisted state). Therefore, the first surface 10a of the article and the front surface 12a of the film 12 can be placed in contact with the liquid adhesive 16 in substantially parallel relationship with each other. The agent 16 solidifies to firmly adhere the film 12 to the first surface 10a of the article 10 (Fig. 4(f)). For example, if the liquid adhesive 16 is a UV curable adhesive, it is from the side of the back surface 12b. The film 12 is irradiated with UV radiation to solidify the liquid adhesive 16. Since the liquid adhesive 16 has the material properties as described above, the liquid adhesive 丨6 fills the convex portion formed on the first surface 10a of the article 丨a gap between the turns or a linear groove (not shown) for the "cutting and re-polishing process", and a bonding layer 18 not including bubbles is formed between the object (wafer) 1 and the film 12 ( The bonding layer 18 stabilizes the front surface 12a of the film 12. Attached to the entire first surface 10a' of the object 1〇 so that the object 10 and the film 12 can stably support each other. In the illustrated construction, when the liquid adhesive 16 is solidified, the object 1〇, the film 12 and The frame members 14 are disposed substantially coaxially with each other. Further, an annular gap having a substantially uniform size is formed between the periphery 1 〇c of the article 1 与 and the inner circumference 14c of the frame member 丨 4 (Fig. 2, Fig. 3 (b In the configuration as described above, the fixing of the frame member 14 to the film 12 may be performed before the first surface 10a of the article 1 and the front surface na of the film 12 are brought into contact with the liquid adhesive 16. Alternatively, the fixing step may be performed at the same time as or after the first surface 10a of the article 1a and the surface i2a before the film i2a is contacted with the liquid adhesive 16. The same liquid adhesive 16 is used. The frame member 14 is fixed to the structure of the film 12, and the liquid adhesive 16 can be disposed on, for example, the entire front surface 12a of the film 12 by coating or the like, 160620.doc -20 201204641. The first surface 10a is in contact with both the front surface 12a of the film 12. The body adhesive 16 can also contact the second surface 14b of the frame member 14 with the liquid adhesive 16 at the same time or a little before or after the step. In this state, the entire liquid adhesive 丨6 can be solidified. The bonding layers 18, 22 are formed to adhere the film 12 to both the article 1 and the frame member 4. In this case, it is necessary to perform the following steps in a vacuum environment: bringing the article 10, the film 12 and the frame member 14 into contact with the liquid The step of adhering '丨6' and the step of solidifying the liquid adhesive 16. All of the above steps (including the steps of contact and solidification) can be performed in a vacuum environment. In the method having the configuration of the coating film as described above, since the frame member 14 having rigidity higher than the rigidity of the film 12 is fixed to the film 12' along the periphery i2c, the film located inside the frame member 丨4 can be maintained The central region 12e of the crucible 2 is in a substantially undistorted state. Therefore, the first surface 10a of the article 1 and the front surface 12a of the film 12 can be disposed substantially parallel to each other and can contact the liquid adhesive 16. Since the liquid adhesive 16 is used as a bonding member for bonding the film 12 to the object 1 , various irregularities of the first surface 10a of the article 10 can be filled by the liquid adhesive 16 to achieve the liquid. The flatness of the film 12 after the adhesive 16 is solidified. Further, a bonding layer 8 substantially free of air bubbles can be formed between the object 10 and the film 12. This bonding layer 18 can stably maintain a high adhesion strength for a long period of time. Regarding the method of coating a film as described above, the film 12 can be accurately applied to the article 1 by using a simple technique. In the case where the film 12 is firmly attached to the first surface 10a of the article 10 by using a method of coating a film as described above, in the method of polishing the back surface, The article 10 and the film 12 are picked up from the table 20 together with the frame member 14. After the combination is reversed, the combination is placed on the other stationary platform 24 with the second surface l〇b of the article facing up (Fig. 3(b)). The object 10 and the film 12 are fixedly supported on the stationary stage 24 inside the frame member 14 by using a holding member such as a vacuum suction device. In order to eliminate unnecessary stress applied from the frame member 14 to the film 12 and to maintain the flat form of the film 12, the frame member 14 can be held in a state where the frame member 14 is fixed to the article 1 and the film 2. In this state, the entire second surface 10b of the article (7) is ground by a grinding device (not shown) to form a flat machined surface 23(c)). In the method of polishing the back surface having the configuration described above, since the first surface 10a of the article 10 is protected by the film 12, it can be reduced as compared with the method of using a glass plate for protection. cost. Since the frame member 14 having rigidity higher than the rigidity of the film 12 is fixed to the film 12 along the periphery i2c, the central portion 12e of the film 12 located inside the frame member 14 can be kept substantially free of distortion. The first surface i〇a of the object 1〇 and the front surface 12a of the film opening may be disposed substantially parallel to each other, and may contact the liquid adhesive 16 and may be quickly performed by the treatment frame member “for the abrasive article 10 The first surface-preparation of the surface l〇b (for example, reversing it, placing it on a stationary platform, etc.). Since the liquid adhesive 16 is used as a member for bonding the crucible 12 to the object 1〇, it is ensured. The flatness of the film after the liquid adhesive 16 is solidified and a bonding layer not including bubbles may be formed between the object 1〇 and the film 12160.doc

S • 22· 201246341 18 in the case where there is a flatness of the film 12 and a parallelism between the first surface of the object 1 and the surface 12a of the film 12, the first surface 10b of the object 1 can be uniformly ground so that Forming a flat machined surface %. The thickness of the article 10 can be uniformly reduced to about several tens of micrometers. The bonding layer 18, which substantially does not include bubbles, can maintain high adhesion strength for a longer period of time and additionally has a prevention process The effect of the liquid entering during the grinding step. Thus with regard to the method of grinding the back surface as described above, the thickness of the article 1 can be accurately reduced by using a simple technique. Forming a semiconductor wafer as disclosed herein In this method, the back surface (ie, the second surface 1〇b) opposite to the circuit side (ie, the first surface 10a) of the wafer (ie, the 'object 10) is ground to form a machined surface. In the case where the wafer (object 10) has the formed machined surface 26 formed, the machined surface 26 is cut (diced) along a predetermined cutting line to divide the wafer (object 10) into a plurality of crystals. (Not shown here, when the wafer having the machined surface 26 (object 10) is placed on the stationary stage 24, the bonding layer 18 between the wafer (object 1) and the film 12 can be used. The sharpness is also provided under the strong adhesion. (4) Therefore, the method for forming a semiconductor wafer can use a simple technique to accurately perform the reduction of the thickness of the round by polishing the back surface and by cutting A plurality of wafers are formed. Regarding a method of forming a semiconductor wafer according to another embodiment of the present invention, a first cut as described in the above-mentioned Japanese Unexamined Patent Publication (Kokai) No. 2008-010464 Block re-polishing process. In this configuration 'pre-position on the circuit side of the wafer (ie, object 10) in the thickness direction (ie, 'first surface 1 Ga') (described above) 160620.doc •23·201246341 Cutting position in the dicing step) is cut to pre-form a linear groove. Therefore 'When grinding and wafers (object 1 〇) by the steps described above in grinding the back surface Circuit side (ie, the first When a surface 1 〇 a) an opposite back surface (ie, the second surface 10b) forms the machined surface 26, the wafer (object 10) can be divided into a plurality of wafers (not shown). Details of the dicing step and the dicing regrind method. In the method of coating a film described above (or a method of polishing a back surface, a method of forming a semiconductor wafer), when the frame member 14 is fixed to the periphery 12c to At the time of film 12, frame member 14 can be secured to film 12 by a substantially uniform tension applied radially outward to film 12. Thus, film 12 (especially in central region 12e) is fully extended and stretched (Fig. 5 (Fig. 5 a) and Fig. In this configuration, it is necessary to apply the frame member 14 to the film 12 under tension using the same liquid adhesive as the liquid adhesive 16. When the film 12 is under tension, the liquid adhesive is allowed to set. In the case of the bonding layer 22 thus formed, the second surface 14b of the frame member i 4 is firmly fixed to the front surface 12a of the film 12. In this case, the excess portion of the film 12 can be pre-cut and removed so that the film 12 has a shape similar to that of the frame member 14 prior to fixing the frame member 14. Alternatively, excess portions of film 12 can be cut and removed so that film dome 2 has a shape similar to frame member 14 after fixing frame member 14. Preferably, the tension or tensile force applied to the film 12 is determined to minimize the deflection of the film 12 and the tension may be in the range of, for example, 1 () g/cm to 1000 g/cni. The frame member 14 is required to have a rigidity sufficient to maintain the tension film 12 in a tensioned state. In the case of this configuration, it can be firmly maintained by the frame member 丨4

160620.doc •24· S 201246341 The central region 12e of the membrane 12 inside the inner circumference 14c of the frame member 14 is substantially free of distortion for a longer period. Therefore, the steps of film coating, the step of grinding the back surface, and the dicing step can be performed more accurately. In the method of coating a film as described above (or a method of polishing a back surface, a method of forming a semiconductor wafer) 'When the frame member 丨 4 is fixed to the film 12 along the periphery 12c', the frame member 14 can be fixed to the film The back surface 12b of 12 is as shown in Figure 6(a). In this illustration, the frame member 14 is uniformly fixed to an annular region along the entire periphery 12c of the back surface 12b of the film 12. The fixing of the frame member 14 can be achieved by various bonding members such as an 'adhesive, double-sided adhesive, fusion bonding, and the like. In the configuration shown, the same liquid adhesive as the liquid adhesive 16 was used as the bonding member. The bonding layer formed after the liquid adhesive is solidified securely fixes the first surface 14a of the frame member 4 to the back surface i2b of the film 12. The details of applying this liquid adhesive are the same as those in the prior construction of securing the frame member 14 to the first surface 12& In the case of this configuration, as in the previous configuration of fixing the frame member 14 to the first surface 12a of the film cartridge 2, the central portion 12e of the film 12 located inside the inner circumference 14c of the frame member 14 can be maintained by the frame member 丨4. In a substantially non-twisted state 'so that the film 12 can be accurately applied to the article 10 using simple techniques. Particularly in the case of this configuration, in the step of grinding the back surface or in the dicing step, the central region I2e of the film 12 is fixedly placed on the stationary platform with the second surface 10b of the object 1 facing upward. 24 (Fig. 6(b)) 'can eliminate the fear that the presence of the frame member 14 hinders the smooth handling of the grinding device or the dicing device. Also, it is possible to retain the abrasive fragments of the object 1

• 25· 160620.doc S 201246341 The fear in the annular gap between the article 10 and the frame member 14 is minimized. Therefore, the step of grinding the back surface and the dicing step can be performed more accurately. In the method of coating a film as described above (or a method of polishing a back surface, a method of forming a semiconductor wafer), before the step of solidifying the liquid adhesive 16 'on the first surface 10a and the front surface 12a When the two are in contact with the liquid adhesive 16, the object 1 and the film 12 are rotated so that the liquid adhesive 16 can be completely spread between the first surface 1 & and the front surface i2a (Fig. 4(d) ). In this case, the excess liquid adhesive 16' is removed by the action of centrifugal force and the object 1 and the film can be stopped when the front surface 12a of the film 12 substantially contacts the convex portion 11 of the first surface 10a of the object 1〇. Rotate (Fig. 4(e)). In the case of this technique, which is generally referred to as a spin coating step, even if the first surface 10a of the article 10 has various irregularities, the liquid adhesive 16 can be completely disposed to the first surface i〇a of the object 1〇. In each corner of the gap with the front surface 12a of the film 12. Therefore, after the liquid adhesive 16 is solidified, the bonding layer 18 not including the air bubbles can be reliably formed (Fig. 4(f)). In the spin coating step as described above, when the first surface 1a and the front surface 12a are in contact with the liquid adhesive 16, the object and the mold 12 are rotated as shown in Fig. 7(a). It is shown that the object 1 and the film 12 can be rotated in a coaxial configuration while the frame member 14 is fixedly supported to the object 1〇. In the case of this configuration, the possible rise of the film 12 relative to the object 10 and the positional deviation of the central axes 1〇d, i2d (which may occur during rotation) can be prevented by fixedly selecting to the frame member 14 of the article. ). Therefore, after the liquid adhesive 16 is solidified, the improved flatness and the object of the film 12 can be obtained.

160620.doc •26· S 201246341 The parallelism between a surface l〇a and the front surface 12a of the film 12. In addition to or instead of the configuration shown in FIG. 7(a), in the case where both the first surface 1 〇a and the front surface 12a are in contact with the liquid adhesive 16 ' The article 10 and film 12 are rotated in a coaxial configuration while the film 12 is fixedly supported to the article 10, as shown in Figure 7(b). Also in this configuration, the possible movement of the film 12 relative to the article 10 and the positional deviation of the central axes l〇d, l2d can be prevented by fixedly supporting the film 12 to the article (which may be in the spin coating step) Occurs during the period). Therefore, the flatness of the film 12 and the parallelism between the first surface i〇a of the object 1〇 and the front surface 12a of the film 12 are ensured to be high after the liquid adhesive i 6 is solidified. A coating film according to an embodiment of the present invention for use in implementing the spin coating step shown in Figure 7(a) includes a frame support portion 28 for use on the first surface of the article 10. a and the front surface 12a of the crucible 12 are in contact with the liquid adhesive 16, the strut frame member 14 is firmly fixed with respect to the object 10; and a driving portion (for one of the table 2 turns and the frame supporting portion 28) A mechanism (not shown) for rotating the article 1 and the film 12 in a coaxial configuration in a state where the frame supporting portion 28 firmly supports the frame member 14 with respect to the article 10. The frame supporting portion 28 has a supporting platform capable of being stabilized in a coaxial configuration with respect to objects fixedly placed on the table 2 with the respective center axes 1〇d, 12d, 14e overlapping each other. The frame member 14 is supported (the film 12 is fixed to the frame member 14 along the periphery 12c). The support platform 3G can have a correction mechanism for correcting, if any, the distortion of the frame member 丨4 itself. The frame-retaining portion 28 can also have an annular wall portion 32 that is radially located inside the cutting platform (9) 160620.doc 27·s 201246341, and the annular wall portion 32 is adapted to receive the object 10 and the membrane 12 by centrifugal force. Excess liquid adhesion agent 16 discharged between the gaps. For example, the excess liquid adhesive 16 received by the wall portion 32 is collected by a recycling mechanism not shown and can be reused. The wall portion 32 can have a shape that permits support of the frame member 14 to the support platform. In the case of 30, the central region i2e of the film 12 is raised a little to become convex in the back surface 12b (as shown). In the case of this configuration, even if the frame member 14 itself has a twist, the first surface i〇a of the article 10 and the front surface 12a of the film 12 can be brought into contact with the liquid adhesive 16 without being affected by the distortion. Although the object 10 is placed on the stage 20 with the first surface 10a facing up in the illustrated configuration, the positional relationship of the object 1 and the film 12 in the vertical direction may be reversed. The frame supporting portion 28 may be One unit is integrally connected to the table 20, or the frame support portion 28 can be functionally separated from the table 20. If the frame supporting portion 28 is integrally connected to the stage 20, the object 1〇 and the film 12 are synchronously rotated via the frame member 14 by the case where the liquid adhesive 16 is inserted between the object 1 and the film 12 The object 1 is rotated in synchronism with the film 12, and in some cases, the flatness of the film 12 can be improved. If the frame support portion 28 is functionally separated from the table 20, the article 10 can be intentionally rotated asynchronously with the frame member 14 (by which the film 12). By rotating the article 10 and the film 12 at different rotational speeds while inserting the liquid adhesive 16 between the article 1 and the film 12, the flatness of the film 12 can be improved in some cases. The apparatus for coating a film may further include a mechanism for the relative positional relationship between the fine adjustment stage 20 and the support platform 30 (hence, the relative positional relationship between the object 10 and the film 12) 160620.doc • 28·201246341 The mechanism 'or mechanism for vibrating the stage 20 for pre-distributing the liquid adhesive 16 over the entire first surface 10a of the article 10. A coated film according to another embodiment of the present invention, in addition to or in place of the frame supporting portion 28 described above, for use in implementing the embodiment shown in Figure 7(b) The apparatus for the spin coating step also includes: a film supporting portion 34' for stably holding the liquid adhesive 16 between the first surface 10a of the object 1 and the front surface 12a of the film 12, with respect to the object 10. a support film 12; and a driving portion (for one of the table 20 and the film supporting portion 34, a rotational driving mechanism (not shown)) for stably supporting the film 12 at the film supporting portion 34 with respect to the object 1 In the state, the object 1 and the film 12 are rotated in a coaxial configuration. The film supporting portion 34 has a supporting platform 36'. The supporting platform 36 can be stably supported in a coaxial configuration with respect to an object fixedly placed on the table 2 in a case where the respective center axes i〇d, I2d coincide with each other. Membrane 12. The support platform 36 can support the central region I2e of the membrane 12 from the back surface 12b by means of, for example, a vacuum inhalation device or adhesive force. The membrane support portion 34 can be constructed such that, in the case where the membrane 12 is supported on the pedestal platform 36, the membrane support portion 34 can prevent the pressure from the membrane 12 (due to its own weight) from being applied to the article 1 〇 Alternatively, or the membrane support portion 34 may intentionally apply pressure from the membrane 12 to the article 1 , or the membrane support portion 34 may lift the membrane 12 away from the article 1 . In any configuration, in the case where the liquid adhesive 16 is inserted between the article 1 and the film 12, the flatness of the film 12 can be improved under some conditions. The ankle support portion 34 can be constructed to rotate in rotation with the table 2' or to deliberately rotate asynchronously with the table 20. In any configuration 'in the case where the liquid adhesive 16 is inserted between the object 1 and the film 12

160620.doc -29 S 201246341 Bottom In some cases, the flatness of the film 12 can be improved. A method of coating a film, a method of polishing a back surface, and a method of forming a semiconductor wafer according to still another embodiment of the present invention will be described hereinafter with reference to FIG. Except that the spin coating step is not included (in the spin coating step, in the case where both the first surface 1a and the surface 12a contact the liquid adhesive 丨6, the object 丨〇 and the film 12 are rotated) The method of display has the same construction as that described above with reference to Figures 3 and 4. Therefore, the description of the corresponding configuration will be omitted as appropriate. First, the following is provided (FIG. 1): an object 1〇 having a first surface 10a and a second surface 1〇b opposite to the first surface 1〇a: a flexible film 12 having a larger than A front surface 12a of a surface 1A; a frame member 14 having a shape and size that can be placed along the periphery 12c of the film 12 and having a rigidity higher than that of the film 12; and a liquid adhesive 16. Next, the article 10 is placed on the table 2 with the first surface 10a facing upward (Fig. 8(a)). Next, the liquid adhesive 16 is disposed on an area including the central axis 10d of the first surface 10a of the object ί (Fig. 8(b)). In this state, the article 10 is rotated about the central axis 10d to spread the liquid adhesive 16 over the entire first surface i〇a (Fig. g(c)). On the other hand, the frame member 14 is fixed to the film 12 along the periphery 12c. Next, the article 10 and the film 12 are disposed in a relative position, wherein the first surface 10a is opposite the front surface 12a and extends from the object 10 outwardly along an area of the film 12 of the perimeter 12c (and thus the frame member 14), and Both the first surface 1a and the front surface 12a contact the liquid adhesive 16 (Fig. 8(d)). Since the frame member 14 is uniformly fixed along the periphery 12c of the crucible 12, the central portion 12e of the film 12 inside the frame member 14 can be extended by the frame member μ maintaining the position 160620.doc -30-201246341 (ie, The non-twisted state is such that the first surface 10a of the object 1 and the front surface 12a of the film 12 can be disposed in substantially parallel relationship with each other to contact the liquid adhesive 16. Next, the liquid adhesive 16 is solidified and the first surface 10a of the article 10 is firmly attached to the film 12 (Fig. 8(e)). Since the liquid adhesive 16 has the material properties as described above, the liquid adhesive 16 can uniformly and smoothly fill the gap formed between the convex portions 11 formed on the first surface 1 〇a of the article 10, and can be A bonding layer 18 that does not include air bubbles is formed between the article 10 and the film 12. This operation completes the process of coating the film (method of coating the film in the process of coating film described above, the step of at least bringing the article 10 and the film 12 into contact with the liquid adhesive 16 in a vacuum environment and a step of solidifying the liquid adhesive in a state in which the film 12 is firmly adhered to the first surface 10a of the article 10 in the process of coating a film as described above, in the method of grinding the back surface as shown 'Picking the object 1 from the table 20 and the film 12 together with the frame member 14, turning it upside down' and placing it on the other stationary platform with the second surface 10b of the article 1 facing up. Then, using, for example, vacuum suction The holding member of the device fixedly supports the object 10 and the film 12 inside the frame member 14, and holds the frame member 14 fixed relative to the object 1 and the film 12. In this state, a grinding device is used (not shown) The entire second surface i〇b of the object 1 is polished to form a flat machined surface 26 (Fig. 8(f)). This operation completes the process of grinding the back surface (the method of grinding the back surface). Display formation In the method of guiding the bulk wafer, the process of polishing the back surface 160620.doc 201246341 (including the process of coating the film) is performed to uniformly reduce the thickness of the wafer by grinding the back surface opposite to the circuit side. In the method of semiconductor wafer, the processing of forming the back surface (the second surface 1 〇b) opposite to the circuit side (the first surface 10a) by polishing the wafer (the object ίο) in the process of polishing the back surface In the case of the surface 26, the machined surface 26 (diced) is cut along a predetermined cutting line 38 to divide the wafer (object 10) into a plurality of wafers 40 (Fig. 8(g)). The following operations pick up each of the divided wafers 40 from the film 12 one by one: colliding the wafer with the undisplayed pins from the back surface 12b of the film i2 so as to be on the surface of the bonding layer 8 and the wafer 40. Peeling occurs in the interfacial plane. The cutting line 38 is usually provided in advance on the circuit side (first surface 10a) of the wafer (object 10), and it is substantially difficult to visually recognize the cutting line from the side of the machined surface 26. 38. Therefore, as above In the dicing step, it is possible to use, for example, a dicing device having image recognition capability as described in Japanese Unexamined Patent Publication (KOKAI) No. 2005-159155. The cutting line 3 8 on the circuit side (first surface 1 〇 a) is identified on the image of the honor to accurately cut the machined surface 26 (cut). Regarding the implementation according to Fig. 8 having the configuration as described above The method of coating a film, the method of polishing the back surface, and the method of forming a semiconductor wafer, a method of coating a film by the methods described with reference to FIGS. 3 and 4, a method of polishing a back surface, and a method of forming a semiconductor wafer can be obtained. The effect obtained by the method is the same. Next, referring to Fig. 9, a method of coating a film, a method of polishing a back surface, and a method of forming a semiconductor wafer according to still another embodiment will be described. Except 160620.doc. 32

S 201246341 does not include a spin coating step (in the spin coating step, in the case where both the first surface 10a and the front surface 12a are in contact with the liquid adhesive 16, the object 1 and the film 12 are rotated) The method of display has the same construction as that described above with reference to Figures 3 and 4. Therefore, the description of the corresponding configuration will be omitted as appropriate. First, k is provided for the following (Fig. 1): an object 1 〇 having a first surface 10a and a second surface opposite the first surface 10a 1 〇 1 &gt A flexible film 12 having a front surface 12a that is larger than the first surface 10a: a frame member 14 having a shape and size that can be placed along the periphery 12c of the film 12 and having a higher film than the film 12 Rigid rigidity; and a liquid adhesive]6. Here, the article 10 has a linear groove 42 cut into a thickness direction at a predetermined position on its first surface 1A. Next, the object 1 is placed on the stage 20 with the first surface 1 〇 & face up (Fig. 9 (a)). Next, the liquid adhesive 16 is disposed on an area including the object 1 The central axis 10d of the first surface of the crucible (Fig. 9(b)). In this state, the object 1〇 is rotated about the central axis i〇d to spread the liquid adhesive 16 over the entire first surface 1 (Fig. 9(c)). 10 and the film 12 is disposed in a relative position, wherein the first surface 1A is opposed to the front surface 12a and along the periphery (5) (thus, an area of the film 12 of the frame member (4) extends outward from the object 10' i the first surface Both i〇a and the front surface! 2a are in contact with the liquid adhesive 16 (Fig. 9 (4)). Since the periphery of the frame member core film 12 is uniformly fixed, it can be erected inside the frame member 14 by the frame member 14 The central region of the membrane 12 is in the shape of - extending 160620.doc

The S:33 201246341 state (i.e., the state without distortion) is such that the first surface 1&> of the article 10 and the front surface 12a of the film 12 are contactable with the liquid adhesive 16 in a substantially parallel configuration relative to each other. Next, the liquid adhesive 16 is solidified and the first surface 10a of the article 1 is firmly attached to the film 12 (Fig. 9(e)". Since the liquid adhesive 16 has the material properties as described above, the liquid The adhesive 16 can uniformly and smoothly fill the gap between the convex portions 丨丨 formed on the first surface 10a of the object 1〇, and can form a bonding layer between the object 10 and the film 12 without including bubbles. 18»This operation completes the process of coating the film (method of coating the film in the process of coating film described above, the step of bringing the object 10 and the film 12 into contact with the liquid adhesive 16 in a vacuum environment and The step of solidifying the liquid adhesive in this state is in the case where the film 12 is firmly attached to the first surface 10a of the article 10 in the process of coating the film as described above, in the polished back shown In the method of the surface, the object 10 and the film j2 are picked up from the table 20 together with the frame member 14, reversed, and placed on the other stationary platform with the second surface 1b of the object 10 facing up. Then, Use of a holding structure such as a vacuum inhalation device The article 10 and the film 12 are fixedly supported inside the frame member 14, and the frame member 14 is held fixed relative to the object 1 and the film 12. In this state, it is ground by a polishing device (not shown). The entire second surface i〇b of the object 1〇 forms a flat machined surface 26 (Fig. 9(f)). This operation completes the process of grinding the back surface (the method of grinding the back surface is shown in the semiconductor wafer formation shown) In the method, the process of grinding the back surface (including the process of coating the film) is performed so as to be opposite to the circuit side by grinding 160620.doc

The back surface of S • 34· 201246341 to evenly reduce the thickness of the wafer. In this method of forming a semiconductor wafer, the back side (the second surface 10b) opposite to the circuit side (the first surface 1) of the wafer (object 10) is polished until reaching the circuit provided for the wafer (object 1) The linear groove 42 on the side (the first surface 1Ga) is formed to form the machined surface 26. The wafer (object 1) can be divided into a plurality of wafers 4 (Fig. 9(f)). The following operations, for example, pick up each of the divided wafers 40 from the film 12 one by one: colliding the wafer with the undisplayed pins from the back surface 12b of the film 12 for bonding between the bonding layer 18 and the wafer 4. Peeling occurs in the boundary surface between the surfaces. The method of coating a film according to the embodiment of Fig. 9 having the configuration as described above, the method of polishing the back surface, and the method of forming the semiconductor wafer are available and can be seen by reference The effects of the method of coating a film, the method of polishing the back surface, and the method of forming a semiconductor wafer described in Figures 3 and 4 are the same. The method of coating a film, the polishing back shown in Figures 8 and 9 Surface method and formation of semi-conductive In the method of wafer, the object 10 is rotated to spread the liquid adhesive 16 over the entire first surface i〇a with the liquid adhesive 16 disposed on the first surface 10a of the article 10 (Fig. 8). (c), the step of the figure 'instead of rotating the object 10 or in addition to rotating the object 1 ,, the object 10 may also be vibrated to spread the liquid adhesive 16 on the first surface 1 〇 & An example of a device for placing an adhesive that can apply this vibration to the article 10. The device for placing an adhesive comprises: a 44, the article 10 can be fixedly placed on the table 44; and a motor 46 connected to the table 44. A bias 160620.doc -35- 201246341 The hammer 50 is mounted on the rotary power output shaft 48 of the motor 46 for coaxial rotation with the central axis l〇d of the object 10. The table 44 and the motor 46 are supported on the stationary platform 54 via the spring 52. When the motor 46 is started, the eccentric clock 50 is eccentrically rotated 'with the vibration of the table 44 and the motor 46 and thus the objects placed on the table 44 10 vibrations by imposing a vibration induced by rotation on the object 1' The liquid adhesive 16 is rapidly spread over the entire first surface 10a of the article 1 . In still another aspect of the present invention, a method of coating a film according to an embodiment will be described hereinafter with reference to FIG. The method does not use the frame member 14. This method of coating the film has the same configuration as that described above with reference to Figures 3 and 4 and Figure 7(b), except that the frame member 14 is not used. The description of the corresponding configuration is omitted as appropriate. In the method of coating a film, 'firstly, the following is provided: an object 10 having a first surface 10a and a second surface opposite to the first surface; The film 12 and a liquid adhesive 16 are used. Next, the object 1 is placed on the table 2 with the first surface 10a facing up. Next, the article 1 and the film 12 are disposed in opposite positions, wherein the first surface 1 & is opposite the front surface i2a, and both the first surface 10a and the front surface 12a are in contact with the liquid adhesive 16. In this state, when the film supporting portion 34 is used to fix the film 12 with respect to the object 1 ', the object 1 〇 and the 臈 12 are rotated in a coaxial configuration to spread the liquid adhesive 16 on the first surface 1 () & and the front surface (2) finally, the liquid adhesive is solidified to firmly adhere the film 12 to the first surface 10a of the object ig. In the method of displaying the mask in Figure 11, the method of placing the membrane, as shown in Figure 7(b), 20doC -36-

In the method of S 201246341, the membrane support portion 34 can be constructed such that when the membrane 12 is supported on the support platform, the membrane support portion 34 prevents the pressure from the membrane 12 (due to its own weight) from being applied. To the article 10, or the membrane support portion 34, deliberately applies pressure from the membrane 12 to the article 10, or the membrane support portion 34 lifts the membrane 12 away from the object 丨0. The ankle support portion 34 can be constructed to rotate in synchronization with the table 20 or to deliberately rotate asynchronously with the table 2 . In addition, since the frame supporting portion 28 as shown in Fig. 7(b) is not used, the film supporting portion can be constructed to transmit the rotation of the object 1〇 rotated by the table 2 to the film 12 ( Due to the viscosity of the liquid adhesive 16), and thus, the film 12 is caused to rotate. In any configuration, in the case where the liquid adhesive 16 is inserted into the article 1 , the flatness of the film 2 can be improved under some conditions. With regard to the method of coating a film according to the embodiment of Fig. 3 having the configuration as described above, the same effect as that obtained by the method of coating a film described with reference to Figs. 3 and 4 can be obtained. Also in the above method of coating a film, before the first surface 10a of the article ίο and the front surface 12a of the film 12 are brought into contact with the liquid adhesive 16, the device for applying the adhesive shown in Fig. 10 can be used to make The article 10 vibrates to spread the liquid adhesive 16 over the entire first surface 1〇3. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining a method of coating a film according to an embodiment of the present invention. This figure schematically shows a component thereof before a coating film in a perspective view. Figure 2 is a perspective view showing the assembly shown in the figure after coating the film.

I60620.doc • 37· S 201246341 FIGS. 3( a ) to 3 ( c ) are cross-sectional views showing the assembly of FIGS. 1 and 2 together with the method of grinding the back surface according to an embodiment of the present invention. The main steps. 4(a) to 4(f) are schematic views showing main steps of a method of coating a film according to an embodiment of the present invention. 5(a) to 5(c) are cross-sectional views showing main steps of a method of coating a film according to another embodiment of the present invention. 6(a) through 6(b) are cross-sectional views showing the components to demonstrate the method of coating a film according to still another embodiment of the present invention and the main steps of the method of polishing the back surface. 7(a) to 7(b) are cross-sectional views schematically showing an example of a spin coating step which can be used in the method of coating a film shown in Fig. 4. 8(a) to 8(g) are cross-sectional views schematically showing main steps of a method of coating a film, a method of polishing a back surface, and a method of forming a semiconductor wafer according to still another embodiment of the present invention. 9(a) to 9(f) are cross-sectional views schematically showing main steps of a method of coating a film, a method of polishing a back surface, and a method of forming a semiconductor wafer according to still another embodiment of the present invention. Fig. 10 is a cross-sectional view schematically showing an example of a device for placing an adhesive agent. The device can be used in a method of coating a film according to an embodiment of the present invention. Fig. 11 is a cross-sectional view schematically showing an example of a spin coating step which can be used in a method of coating a film according to an embodiment of the present invention. [Main component symbol description] 160620.doc

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S 201246341 10 Object 10a First surface 10b Second surface 10c External circumference 10d Central axis 11 Convex portion 12 Flexible film 12a Front surface 12b Back surface 12c Periphery 12d Center axis 12e Center area 14 Frame part 14a First surface 14b Second Surface 14c Inner circumference 14d Outer circumference 14e Center axis 16 Liquid adhesive 18 Bonding layer 20 Table 22 Bonding layer 24 Stationary platform 26 Flat machine 160620.doc -39- 201246341 28 Frame support portion 30 Support platform 32 Annular wall portion 34 Membrane Support portion 36 support platform 38 predetermined cutting line 40 wafer 42 linear groove 44 table 46 motor 48 rotary power output shaft 5 0 eccentric clock 52 adhesive attachment / spring 54 laser light / stationary platform

160620.doc • 40· S

Claims (1)

201246341 VII. Patent application scope: 1. A method for coating a film, comprising the steps of: providing an object having a first surface and a second surface opposite to the first surface; The flexible film has a front sill--hry W surface that is larger than the first surface of the article, a frame member that is shaped and sized so as to be positionable along one of the ridges and has a rigidity higher than the rigidity of the film; and a liquid adhesive; 2 the liquid adhesive is placed on the first surface of the object or the front surface of the film; the frame member is along the periphery of the film Fixed to the film; the article and the film are disposed in a relative position, wherein the first surface is opposite to the front surface and the two regions of the film along the periphery of the film extend outward from the cow, and the - contacting the surface with the front surface with the liquid adhesive; and solidifying the liquid adhesive and firmly adhering the film to the first surface of the article. 2: The method of claim 1, wherein the step of securing the frame member comprises the step of applying to the component of the hexagram. The periphery of the film is fixed to the frame, the method comprising: step (4) defining the step of the frame member: the frame member is fixed to the front surface of the film and the front and back surfaces of the film Step 2 of at least one of the steps of claim 2, wherein the step of solidifying the agent further comprises: contacting the first surface with the front surface before the liquid is adhered to 160620-doc S 201246341 the liquid adhesive In the case of rotating the article and the film to spread the liquid adhesive over a gap between the first surface and the front surface. 5. The method of claim 4, wherein, in the case where the first surface and the front surface are in contact with the liquid adhesive, the article and the film are rotated in a coaxial configuration while the frame member is opposed to The object is firmly supported. 6. The method of claim 4 or 5, wherein, in the case where the first surface and the front surface are in contact with the liquid adhesive, the article and the film are rotated in a coaxial configuration while the film is opposed Stabilize the object on the object. 7. The method of claim 1, wherein the step of placing the liquid adhesive comprises the step of placing the liquid adhesive on the first surface of the article, and vibrating the article to adhere the liquid a step of spreading the agent onto the first surface. The method of claim 1, wherein the step of placing the liquid adhesive comprises the step of placing the liquid adhesive on the first surface of the object and rotating the object to apply the liquid adhesive a step of spreading over the first surface. The method of claim 7 or 8, wherein after the liquid adherent is spread on the first surface, the step of contacting the first surface and the front surface with the liquid adhesive is performed in a vacuum environment . 10. A method of coating a film, comprising the steps of: k for the following: • mesh + _. 具有. an object having a first surface and a second surface of the first surface, a flexible film and a liquid adhesive 160620.doc S -2 - 201246341 a surface or the film is placed on the first front surface of the object; the article and the film are disposed in a relative In the position, wherein the first surface is opposite to the front surface, and the first surface and the front surface are in contact with the liquid adhesive; in the case where the first surface and the front surface are in contact with the liquid adhesive And rotating the article and the film in a coaxial configuration while stably supporting the film relative to the object to spread the liquid adhesive on a gap between the first surface and the front surface; The liquid adhesive is allowed to set and the film is firmly attached to the "surface" of the article. 11. The method of claim 10, wherein the step of placing the liquid adhesive comprises the step of placing the liquid adhesive on the first surface of the article, and vibrating the object to The step of spreading the liquid adhesive on the first surface. A method of grinding a back surface, comprising the steps of: firmly attaching the film to the first surface of the article via the method of claim 1; and fixing the article to one of the interior of the frame member In a state at the location, the second surface of the article is 'polished' with the film firmly attached to the first surface. A method of grinding a back surface, comprising the steps of: firmly attaching the film to the first surface of the article via the method of claim (7) or ^; and 160620.doc S 201246341 fixedly supporting the object In one state, the second surface of the article is ground with the film firmly attached to the first surface. 14. A method of forming a semiconductor wafer, the method comprising: grinding the second surface of the object via the method of claim 12 or 13, the object comprising a wafer having one of the first surfaces Circuit side. 15. The method of claim 14, further comprising the step of cutting a polished side obtained by grinding the second surface to divide the wafer into a plurality of wafers. 16. A device for coating a film, the device being adapted to perform the method of claim $, the device comprising: a frame support portion contacting the liquid adhesive on both the first surface and the front surface a case in which the frame member is stably supported with respect to the object; and a driving portion that stably supports the frame portion (four) with respect to the object in the frame supporting portion, so that the object and the film are A coaxial configuration rotates. 17. A device for coating a film, the device being adapted to perform the method of claim 6 or 10, the device comprising: - a film support portion on the first surface and the front surface In the case of contacting the liquid adhesive, the driving portion is stably supported relative to the object to support the rotation of the film. Providing the object and the film in a coaxial configuration under the condition that the film supporting portion is stable relative to the object 160620.doc