JP2013254819A - Film sticking method and film sticking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adhere a film having flexibility to an annular frame member without any slack.SOLUTION: A film sticking device 22 has a plurality of pressing members 24 for applying force F in a direction toward the outside of a frame member 12 to a plurality of respective force application points 18 set in a first film area 16 overlapped on the frame member 12 of a film 10, and a loading member 26 for applying a load L in a direction toward the film 10 to each of the plurality of pressing members 24. Each of the pressing members 24 has a base part 28 for receiving the load L from the loading member 26, and a contact part 30 for being brought into contact with the force application point 18 to apply the force F to the force application point 18 by the load L. The pressing member 24 is disposed in a posture in which the contact part 30 is located at an outer side from the base part 28 in projection to a virtual plane perpendicular to the direction of the load L.

Description

  The present invention relates to a film sticking method and a film sticking apparatus for sticking a film to a frame member.

  A technique for sticking a flexible film to an annular frame member having higher rigidity than that of the film and holding the film in a slack-free state by the frame member is used in various fields. For example, in a semiconductor chip manufacturing method, after the back surface of the wafer opposite to the circuit formation surface is ground to uniformly reduce the thickness of the wafer, the thinned wafer is cut by cutting (generally referred to as dicing). In doing so, it is known that, prior to dicing, the wafer is fixedly supported in a region inside the frame member of the film to which the frame member is attached.

  For example, Patent Document 1 discloses that “a laminated body that allows a substrate to be ground such as a silicon wafer fixed on a support to be easily peeled off from the support, a method for manufacturing such a stacked body, and a manufacturing apparatus for the same. In addition, a manufacturing method and a manufacturing apparatus for a thinned substrate ”are described. Further, as a process after grinding the laminated body, “First, considering the final dicing process, a die bonding tape 41 is disposed on the wafer side of the laminated body 1 when necessary (FIG. 4A). ), Or the die bonding tape 41 is not arranged (FIG. 4A ′), and then the dicing tape 42 and the dicing frame 43 are arranged (FIG. 4B). (FIG. 4 (c)) After the laser light irradiation, the support 5 is pulled up and separated from the wafer 2 (FIG. 4 (d)). 3 is peeled off with a peel to obtain a thinned silicon wafer 2 (FIG. 4E) ”.

JP 2004-64040 A (paragraphs 0001, 0035)

  In the technique of sticking a flexible film to an annular frame member, it is possible to fix the film to the frame member in a slack-free state with a simpler method and with a simpler device configuration. It is desired.

  One embodiment of the present invention is a film sticking method, the step of preparing a flexible film, a rigid frame member, and a liquid adhesive, and the liquid adhesive between the film and the frame member And a step of superimposing the film and the frame member on each other, and a force in a direction toward the outside of the frame member at a plurality of contact points set in the first film region of the film overlapping the frame member. In addition, the step of removing the slack of the second film region located inside the frame member of the film, and the liquid adhesive is solidified in a state where the slack of the second film region is removed, so that the first of the film Fixing the film region to the frame member.

  Another aspect of the present invention is a film sticking apparatus for sticking a flexible film to a rigid annular frame member using a liquid adhesive, wherein the film overlaps the frame member. A plurality of pressing members for applying a force in a direction toward the outside of the frame member to each of a plurality of contact points set in one film region, and a load in a direction toward the film on each of the plurality of pressing members Each of the plurality of pressing members is in contact with a base receiving a load from the load member and one of the plurality of contact points, and a force applied to the contact point by the load received by the base. The plurality of pressing members are spaced apart from each other in a posture in which the respective contact portions are located outside the respective base portions in the projection onto a virtual plane orthogonal to the direction of the load. Free It is disposed Jo embodiment, a film sticking apparatus.

  According to the film sticking method according to one aspect of the present invention, the contact point set in the first film region of the film supported by the frame member is directed to the outside of the frame member by a simple technique such as pressing. A force can be applied to remove slack in the second film region of the film. In addition, since the contact point is locally provided in the first film region of the film, even if the force remains applied to the contact point, the solidification action due to the presence of the object to apply the force. Thus, the liquid adhesive interposed between the film and the frame member can be solidified by a method corresponding to the composition.

  According to the film sticking device according to another aspect of the present invention, the contact point in the first film region of the film supported by the frame member by the pressing force applied to the film from the pressing member according to the load received from the load member. A force toward the outside of the frame member can be applied. Therefore, for example, when compared with a configuration in which the outer peripheral edge of the film or the periphery thereof is pulled outward in the radial direction, there is no need to install a traction mechanism or the like outside the frame member. The slack in the two film areas can be removed. In addition, since the plurality of pressing members are arranged at a distance from each other, even if the contact portion of each pressing member is kept in contact with the contact point, the solidification action due to the presence of the pressing member is achieved. Thus, the liquid adhesive interposed between the film and the frame member can be solidified by a method corresponding to the composition.

It is a figure explaining the film sticking method by one Embodiment, and is a perspective view which shows the component group before film sticking roughly. It is a perspective view which shows the component group of FIG. 1 in the state after film sticking. It is sectional drawing explaining the film sticking method of FIG. 1, (a) Preparatory step, (b) The superimposition step of a film and a frame member, (c) The slack removal and adhering step of a film are shown. It is a figure which shows schematically the film sticking apparatus by one Embodiment, (a) The perspective view shown from the lower surface side, (b) The partially expanded perspective view from the lower surface side which reversed the a figure. It is a top view explaining the film sticking method using the film sticking apparatus of FIG. It is sectional drawing explaining the film sticking method using the film sticking apparatus of FIG. 4, (a) The superimposition step of a film and a frame member, (b) The slack removal and adhering step of a film are shown. It is sectional drawing explaining the film sticking method using the film sticking apparatus by a modification, (a) The superimposition step of a film and a frame member, (b) The slack removal and adhering step of a film are shown. (A)-(f) is a figure which shows typically the modification of the press member which the film sticking apparatus of FIG. 4 has, respectively. It is a figure which shows schematically the film sticking apparatus by another modification, (a) Sectional drawing, (b) The front view of a press member. Furthermore, it is a figure which shows schematically the film sticking apparatus by another modification, (a) Sectional drawing, (b) The front view of a press member. It is a figure explaining the film sticking method using the film sticking apparatus by another modification, (a) Top view, (b) Cross-sectional view. It is a figure explaining the film sticking method using the film sticking apparatus by another modification, (a) Top view, (b) Cross-sectional view. It is a figure explaining the film sticking method using the film sticking apparatus by another modification, (a) Top view, (b) Cross-sectional view. (A)-(g) is sectional drawing which shows typically an example of the main step of the semiconductor chip preparation method which can apply the film sticking method by one Embodiment.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Corresponding components are denoted by common reference symbols throughout the drawings.
FIGS. 1 and 2 are diagrams showing a group of components handled by a film sticking method according to an embodiment, and FIGS. 3A to 3C are diagrams schematically showing main steps of the film sticking method, 4A and 4B are diagrams showing a film sticking apparatus according to an embodiment, and FIGS. 5 and 6 are views showing a film sticking method using the film sticking apparatus.

  The component group of FIG. 1 handled with the film sticking method and film sticking apparatus by one Embodiment contains the film 10 which has flexibility, and the frame member 12 which has rigidity. The frame member 12 is an annular member having higher rigidity than the film 10. The illustrated component group, film sticking method, and film sticking apparatus include, for example, a film 10 (for supporting a wafer when dicing a thinned wafer (not shown) after back grinding in a semiconductor chip manufacturing method. For example, it can be applied to a step of attaching a frame member 12 (for example, referred to as a dicing frame) to the film 10 (hereinafter referred to as a frame attaching step) in order to maintain a slack-free state. is there. However, the use of the film sticking method according to one aspect of the present invention and the film sticking apparatus according to another aspect of the present invention is not limited to the frame attaching step.

  In the film sticking method according to the illustrated embodiment, first, a flexible film 10 (hereinafter simply referred to as a film 10), a rigid frame member 12 (hereinafter simply referred to as a frame member 12), and a liquid form. An adhesive 14 is prepared (FIGS. 1 and 3A).

  The film 10 is a flexible membrane element having a circular contour. As shown in FIG. 3A, the film 10 has a first surface 10a (lower surface in the drawing), a second surface 10b (upper surface in the drawing) opposite to the first surface, an outer peripheral edge 10c, and a central axis 10d. The film 10 is produced, for example, from a resin or the like with a uniform thickness throughout. When using a radiation curable adhesive, which will be described later, as the liquid adhesive 14, it is desirable that the film 10 has sufficient radiation transparency. For example, polyester such as polyethylene terephthalate, polyolefin resin such as polypropylene, poly It can be a polymer film made of a vinyl chloride resin, a polyvinylidene chloride resin, a polyamide resin or the like. When the illustrated film sticking method is performed in the above-described frame mounting process in the semiconductor chip manufacturing method, the film 10 has physical properties that can protect the circuit forming surface of the wafer from being contaminated during the subsequent dicing process. It is desirable. In this case, the film 10 may be, for example, a circular one made of polyethylene terephthalate, and may have a thickness of about 5 μm to about 200 μm and a diameter of about 100 mm to about 600 mm.

  The film 10 may be supplied as a sheet that has been cut into an appropriate shape and size in advance, or may be fed out from a roll and cut immediately before use. Further, the surplus portion of the film 10 may be cut and removed in advance so as to have a shape similar to the frame member 12 before being attached to the frame member 12, or similar to the frame member 12 after being attached to the frame member 12. The excess portion may be cut and removed so as to have a shape to be formed. Alternatively, the film 10 may have a shape that is not similar to the frame member 12. In addition, although the illustrated film 10 has a circular outline, in the film sticking method and the film sticking apparatus according to the present invention, the material, shape, dimensions, etc. of the film are not particularly limited.

  The frame member 12 is an annular element having a circular contour, and has a shape and a dimension that can be disposed so as to partially overlap the outer peripheral edge 10 c of the film 10. As shown in FIG. 3A, the frame member 12 includes a first surface 12a (lower surface in the drawing), a second surface 12b (upper surface in the drawing) opposite to the first surface 12a, and a first surface 12a and a second surface 12b. It has an inner peripheral surface 12c extending therebetween, an outer peripheral surface 12d on the opposite side, and a central axis 12e. The diameter (that is, the inner diameter) of the inner peripheral surface 12 c of the frame member 12 is smaller than the diameter of the film 10, and the diameter (that is, the outer diameter) of the outer peripheral surface 12 d of the frame member 12 is larger than the diameter of the film 10. The frame member 12 is made, for example, from metal, resin, or the like to a uniform thickness as a whole. When the illustrated film sticking method is performed in the above-described frame mounting step in the method of manufacturing a semiconductor chip, the frame member 12 is, for example, an annular shape made of stainless steel or a plastic material, and has a thickness of about 1 mm to about 1 mm. The inner diameter can be about 2 mm, the inner diameter is about 60 mm, and the outer diameter can be about 650 mm.

  The frame member 12 is a film located on the inner side of the inner peripheral surface 12c by fixing the first surface 12a or the second surface 12b to the first surface 10a or the second surface 10b along the outer peripheral edge 10c of the film 10. It has the rigidity which can maintain 10 center area | regions in the extended state without slack. The rigidity of the frame member 12 can be set depending on the material, dimensions, shape, etc. For example, when some tension is applied to the film 10 fixed to the frame member 12, the frame member 12 itself does not bend or deform significantly. Any degree of rigidity may be used. The frame member 12 may be formed from the same material as the film 10. Although the illustrated frame member 12 has a circular outline whose outer diameter is larger than the diameter of the film 10, in the film sticking method and film sticking apparatus according to the present invention, the material, shape, dimensions, etc. of the frame member. Is not particularly limited, except that it has higher rigidity than the film and that at least a portion can overlap the film. The film and frame member used in the present invention have dimensions and shapes such that, for example, a part or the whole of the region along the outer peripheral edge of the film protrudes to the outside of the frame member in a state where the film is attached to the frame member. You may have.

  The liquid adhesive 14 is in a liquid state before being cured or solidified, and can exhibit an adhesive force for holding the film 10 firmly fixed to the frame member 12 by being cured or solidified. The liquid adhesive 14 can be, for example, a curable adhesive, a solvent-based adhesive, a thermoplastic resin including a hot-melt adhesive, a water-dispersed adhesive, or the like. Here, the curable adhesive is a liquid or heat-bonded film-like adhesive that is cured by energy rays such as heat and radiation (for example, ultraviolet rays), and the solvent-based adhesive is solidified by evaporation of the solvent. A hot-melt adhesive is an adhesive that melts by heating and solidifies by cooling. The water-dispersed adhesive is an adhesive in which an adhesive component is dispersed in water and is solidified by evaporation of water. Curing adhesives include one-part thermosetting adhesives based on epoxy and urethane, two-component mixed reaction adhesives based on epoxy, urethane, and acrylic, radiation based on acrylic and epoxy (such as UV and UV Electron beam) curable adhesive. Examples of the solvent-based adhesive include a rubber-based adhesive in which rubber, elastomer or the like is dissolved in a solvent. In the present application, curing and solidification in a narrow sense are collectively referred to as “solidification”.

  In the next step of the illustrated film sticking method, the liquid adhesive 14 is interposed between the film 10 and the frame member 12 as shown in FIG. And the frame member 12 are overlapped with each other. In the configuration shown in FIGS. 1 to 3, the first surface 10 a of the film 10 and the second surface 12 b of the frame member 12 are opposed to each other via the liquid adhesive 14. In this step, the film 10 is simply overlaid on the frame member 12 and may have an unintentional slack S (FIG. 3B). Further, in this step, the overlapped film 10 and frame member 12 are in a direction substantially parallel to the first surface 10a and the second surface 12b in accordance with the fluidity and viscosity of the liquid adhesive 14 before solidification. Can move relative.

  For example, the film 10 and the frame member 12 are relatively positioned so that their central axes 10d and 12e substantially coincide with each other. As a result, the entire annular outer peripheral region having a substantially uniform width (diameter dimension) along the outer peripheral edge 10 c of the first surface 10 a of the film 10 is the inner peripheral surface of the second surface 12 b of the frame member 12. It is arrange | positioned on the cyclic | annular inner periphery area | region which has a substantially uniform width | variety (diameter direction dimension) along 12c. Alternatively, on the condition that the entire outer peripheral edge 10c of the film 10 is disposed on the second surface 12b of the frame member 12, the central axes 10d and 12e may be shifted from each other. When the illustrated film sticking method is performed in the above-described frame mounting step in the semiconductor chip manufacturing method, the width (radial dimension) of the annular region where the first surface 10a of the film 10 and the second surface 12b of the frame member 12 overlap each other. ) Can be on the order of about 10 mm.

  The liquid adhesive 14 is intermittently applied to a region along the outer peripheral edge 10c of the first surface 10a of the film 10 or a region along the inner peripheral surface 12c of the second surface 12b of the frame member 12 using an appropriate nozzle. It can arrange | position by dripping at a liquid or apply | coating continuously in linear form. At this time, a liquid adhesive is arranged by a stationary nozzle while rotating the film 10 or the frame member 12 around the central axis 10d or 12e, or an automatic machine such as a robot is used for the stationary film 10 or the frame member 12. The liquid adhesive can be arranged while moving the nozzle along a circular track. When the film 10 and the frame member 12 have the dimensions described above, the liquid adhesive 14 is supplied to the second surface 12b of the frame member 12 rotating at a speed of about 20 mm / second, for example, at a mass flow rate of about 6 mg / second. And thereby can be arranged on the second surface 12b as a layer having an average thickness of about 50 μm.

  When the center axis 10d of the film 10 and the center axis 12e of the frame member 12 substantially coincide with each other, the entire circumferential direction is between the first surface 10a of the film 10 and the second surface 12b of the frame member 12. A substantially uniform amount of the liquid adhesive 14 can be interposed. In this case, after the liquid adhesive 14 is solidified, the frame member 12 can support the film 10 with substantially uniform adhesive strength over the entire circumferential direction. In order to interpose a substantially uniform amount of the liquid adhesive 14 between the film 10 and the frame member 12 over the entire circumferential direction, the flexibility of the film 10 and the rigidity of the frame member 12 are taken into consideration. It is preferable to place the film 10 on the frame member 12 after placing the frame member 12 on a substantially horizontal support surface (not shown) and disposing the liquid adhesive 14 on the frame member 12.

  In the next step, as shown in FIG. 3 (c), a plurality of contact points 18 set in the first film region 16 (corresponding to the above-described outer peripheral annular region) of the film 10 overlapping the frame member 12, Applying a force F in the direction toward the outside of the frame member 12, the slack S of the second film region 20 (corresponding to the aforementioned central region) located inside the frame member 12 of the film 10 (FIG. 3B). ) Is removed. The contact point 18 is a local region in the first film region 16 where an object for applying force F (a specific example will be described later) is contacted. . Before the liquid adhesive 14 is solidified, the film 10 can move with respect to the frame member 12 as described above. Therefore, by applying the force F to the plurality of force application points 18, the individual force application points 18 can be moved to the frame member 12. The slack S is removed along with the movement toward the outside. In a state in which the force F is applied to all of the plurality of applied force points 18, the film 10 is stationary with respect to the frame member 12 by the balance of the forces F. In this balanced state, the manner in which the force F is applied is appropriately adjusted so that the entire outer peripheral edge 10c of the film 10 is disposed on the second surface 12b of the frame member 12.

  The number and position of the applied force points 18 and the magnitude and direction of the force F are appropriately determined based on the requirement that the slack S of the second film region 20 can be removed in a state where individual forces F toward the outside of the frame member 12 are balanced. You can choose. For example, in the first film region 16 of the film 10, a plurality of applied points 18 are set at equal intervals along a virtual circle centered on the central axis 10d (FIG. 3B), and the central axis 10d is set at these applied points 18. In the configuration in which a uniform force F is applied radially as viewed from the top, the entire second film region 20 of the film 10 can be extended substantially radially outward. In this case, the uniformity of extension increases as the number of applied points 18 increases. Further, the magnitude of the force F in the balanced state is so small that the tension is not substantially applied to the second film region 20 of the film 10 between the plurality of applied points 18 as long as the slack S can be removed. Good. Alternatively, the force F in the balanced state can be set to a magnitude in which tension is applied to the second film region 20 of the film 10 between the plurality of applied points 18. In this case, the tension applied to the second film region 20 of the film 10 by the force F can be such that no residual stress is substantially generated in the second film region 20 after the liquid adhesive 14 is solidified. . Alternatively, the tension applied to the second film region 20 of the film 10 by the force F can intentionally cause residual stress in the second film region 20.

  The adhesion point 18 is a local region such as a dot-like, linear or planar depression on the second surface 10b of the film 10 or a through hole extending from the second surface 10b of the film 10 to the first surface 10a. . The force F can be a component force of a pressing force applied to the applied point 18 at an acute angle with respect to the second surface 10b of the film 10. Such an oblique pressing force is received by the frame member 12 that overlaps the first film region 16 of the film 10, while the presence of the liquid adhesive 14 reduces the friction between the film 10 and the frame member 12. Therefore, the force F as a component force can be generated efficiently.

  In the next step, the liquid adhesive 14 is solidified in a state where the slack S in the second film region 20 of the film 10 is removed, and the first film region 16 of the film 10 is fixed to the frame member 12 (FIG. 2). FIG. 3 (c)). In this step, the liquid adhesive 14 can be solidified by a method according to its composition without releasing the force F applied to the adhesion point 18 of the film 10. Alternatively, on the assumption that the slack S removed in the previous step does not recur in the second film region 20 of the film 10, the liquid adhesive 14 in a state where the force F applied to the applied force point 18 is weakened or substantially released. Can be solidified.

  For example, when the liquid adhesive 14 is a radiation curable adhesive, even if the force F is still applied to the adhesion point 18 of the film 10, the adhesion point 18 is locally present in the first film region 16 of the film 10. Since it is a target area | region, the quantity of the radiation interrupted by the object (not shown) for applying force F can be reduced, and the liquid adhesive 14 can be solidified with a required quantity of radiation. In addition, after force F is applied to the adhesion point 18 of the film 10 and the liquid adhesive 14 is partially solidified by irradiation, the force F is released and the liquid adhesive 14 is completely removed by further irradiation. The first film region 16 of the film 10 may be firmly fixed to the frame member 12 by solidifying.

  Thus, in the film sticking method having the above configuration, in the first film region 16 of the film 10 supported by the frame member 12, for example, the second application point 18 is a local force region on the second surface 10 b. The slack S of the second film region 20 of the film 10 can be removed by applying a force F toward the outside of the frame member 12 by a simple method of applying a pressing force obliquely to the surface 10b. In addition, since the applied force point 18 is a local region in the first film region 16 of the film 10, the object for applying the force F even when the force F is applied to the applied force point 18 of the film 10. The influence on the solidifying action due to the presence of (not shown) is reduced, and the liquid adhesive 14 can be solidified by a method according to its composition.

  Next, with reference to FIGS. 4-6, the structure of the film sticking apparatus 22 by one Embodiment and an example of the film sticking method performed using the film sticking apparatus 22 are demonstrated. The film sticking device 22 can carry out the film sticking method described above for sticking the flexible film 10 to the annular frame member 12 having higher rigidity than the film 10 using the liquid adhesive 14. Constituent elements corresponding to those shown in FIGS. 1 to 3 are denoted by common reference numerals, and detailed description thereof is omitted. 4A is a view showing the film sticking device 22 from the lower surface side, FIG. 4B is an enlarged view showing a part of the film sticking device 22 from the upper surface side, and FIG. FIG. 6A is a view showing a film sticking method, FIG. 6A is a view showing an overlapping step of the film 10 and the frame member 12, and FIG. 6B is a view showing a slack removal and fixing step of the film 10. .

  The film sticking device 22 applies a force F in the direction toward the outside of the frame member 12 to each of the plurality of force points 18 set in the first film region 16 overlapping the frame member 12 of the film 10 (FIG. 6B). )) And a load member 26 for applying a load L (FIG. 6B) in the direction toward the film 10 to each of the plurality of press members 24. Each pressing member 24 abuts against a base 28 that receives a load L from the load member 26 and one of a plurality of applied points 18 and applies a force F to the applied point 18 by the load L received by the base 28. 30.

  As shown in FIGS. 4 and 6, the pressing member 24 has a plate-like shape bent into a U shape including a central curved portion 24a and flat portions 24b and 24c on both sides thereof. The curved portion 24a is a rectangular plate-like element bent uniformly in one direction so as to have a predetermined curvature. The pair of flat portions 24b and 24c are extended from both ends of the curved portion 24 so as to be spaced apart from and substantially parallel to each other. One flat portion 24b is a rectangular flat plate-like element having the same width W (FIG. 5) as the curved portion 24a, and has a rectangular flat plate shape bent at a substantially right angle to the flat portion 24b at the end thereof. The base 28 is provided. The base 28 is fixed to the load member 26 by, for example, bolts 32. The other flat portion 24c is a pentagonal flat plate-like element including a rectangular portion having the same width W (FIG. 5) as the curved portion 24a, and has a sharp tip 30a corresponding to one vertex of the pentagon at the end. A contact portion 30 is provided. The abutment portion 30 can be fixedly engaged with the film 10 by having the pointed tip 30a puncture the film 10 at the application point 18 to form the application point 18 as a dot-like depression or through hole, Therefore, it is possible to prevent the applied point 18 from being displaced on the film 10 while the force F is applied.

  The pressing member 24 has elasticity that can be restored like a spring. The elastic pressing member 24 is elastically deformed between the base portion 28 attached to the load member 28 and the abutting portion 30 abutting against the film 10 by the load L received from the load member 26, and the elastic restoration thereof is performed. Under the force, the contact portion 30 presses the applied force point 18 and applies a force F to the applied force point 18. In the plate-shaped pressing member 24 bent in a U-shape, the flat portion 24b adjacent to the base portion 28 and the central curved portion 24a are elastically deformed mainly by the load L (FIG. 6B). The pressing member 24 is made of a metal, a resin, or the like with a uniform thickness as a whole. The elastic pressing member 24 can be formed into a uniform thickness by a pressing process such as punching and bending from a stainless steel sheet metal material, for example. The illustrated pressing member 24 has a spring-like elasticity and a plate-like shape bent in a U-shape and a contact portion 30 composed of a sharp tip 30a. In the sticking device, the material, shape, dimensions, and the like of the pressing member are not particularly limited, except that the pressing member can receive a load from the load member and apply a force to the adhesion point of the film.

  The load member 26 is a disk-like block body to which a plurality of pressing members 24 are attached. As shown in FIG. 6, the load member 26 extends between the first surface 26a (the lower surface in the drawing), the second surface 26b (the upper surface in the drawing) opposite to the first surface 26a, and the first surface 26a and the second surface 26b. It has the outer peripheral surface 26c and the center axis line 26d. The load member 26 has a mass M (FIG. 6), and a load L can be applied to each of the plurality of pressing members 24 by the mass M. Alternatively, the load member 26 can apply the load L to each pressing member 24 by an external force applied to the load member 26 regardless of the mass M or in addition to the mass M. The load member 26 also has rigidity that does not cause bending or deformation of the load member 26 itself while applying the load L to the plurality of pressing members 24.

  The load member 26 is made of, for example, a metal, a resin, or the like with a substantially uniform thickness. The load member 26 may be a solid body having no holes or voids, or may be a hollow body having holes or voids having an appropriate shape, size, number, and arrangement. Further, the mass M should be appropriately adjusted according to the magnitude of the force F required in the film sticking method by the film sticking device 22 and the magnitude of the load L required to generate the force F on each pressing member 24. A plurality of the same or different load members 26 can be used in combination. The illustrated load member 26 is a disk-like solid block body that does not bend or deform due to the load L. However, in the film sticking apparatus according to the present invention, the material, shape, and dimensions of the load member are shown. Etc. are not particularly limited except that it is a requirement that the force applied to the film force point can be generated in the pressing member by a load applied to the plurality of pressing members.

  In each of the plurality of pressing members 24, the base portion 28 is fixed to a portion of the first surface 26 a of the load member 26 adjacent to the outer peripheral surface 26 c by, for example, a bolt 32, and the contact portion 30 is in the radial direction of the load member 26. As shown in FIG. More specifically, in the projection onto a virtual plane (a virtual plane parallel to the first surface 26a in FIG. 6) orthogonal to the direction of the load L, the plurality of pressing members 24 have their respective base portions as their base portions. In an attitude located outside of 28, they are arranged in an annular form, ie in an annular row, spaced apart from each other (FIG. 5).

  When the pressing member 24 receives the load L from the load member 26 at the base portion 28, the contact portion 30 applies the reaction force of the pressing force applied to the applied force point 18 by the load L to the first film region 16 of the film 10. It receives from the frame member 12 to support. Therefore, when each pressing member 24 is arranged with respect to the load member 26 at the position and posture shown in FIGS. 5 and 6, the load L received by the base portion 28 from the load member 26 and the contact portion 30 are reduced. Due to the reaction force of the pressing force received from the frame member 12, torque about the base portion 28 acts on the pressing member 24. The pressing member 24 is elastically deformed under this torque, and the pair of flat portions 24 b and 24 c are tilted in a direction in which the curved portion 24 a approaches the load member 26. As the flat portions 24 b and 24 c are tilted, the contact portion 30 moves away from the load member 26, and the applied force point 18 at which the contact portion 30 is in contact with the pressing force together with the contact portion 30. It moves in the direction toward the outside of the frame member 12. Further, during the tilting operation of the flat portions 24 b and 24 c, the base portion 28 of the pressing member 24 moves together with the load member 26 in a direction approaching the film 10. Due to such behavior of the pressing member 24, the abutting portion 30 continues to press the applying force point 18 without leaving the film 10 under the load L, and the force F toward the outside of the frame member 12 is applied to the applying point 18. Can be added.

  As shown in FIGS. 5 and 6, the diameter of the load member 26 is smaller than the inner diameter of the frame member 12. The plurality of pressing members 24 attached to the load member 26 in the above-described arrangement are configured so that the respective contact portions 30 of the film 10 stacked on the frame member 12 are not subjected to the torque and are not elastically deformed. It can be positioned in the first film region 16. Further, each of the plurality of pressing members 24 attached to the load member 26 in the above-described arrangement has a flat portion 24b adjacent to the base portion 28 in a state where the torque does not act and is not elastically deformed. The curved portion 24a is disposed so as to be substantially parallel to the surface 26c, and is disposed so as to protrude from the second surface 26b of the load member 26. The contact portion 30 at the tip of the other flat portion 24c is the first portion of the load member 26. It arrange | positions in the position which protruded only the predetermined distance from the surface 26a. The protruding distance of the contact portion 30 from the first surface 26 a of the load member 26 is a position where the load member 26 is separated from the film 10 while the pressing member 24 applies force F to the applied force point 18 at the contact portion 30. Is set as the distance that can be held. In addition, the number, arrangement | positioning, etc. of the press member 24 can be variously set on the condition that the slack S (FIG. 6A) of the film 10 can be removed.

  In the configurations shown in FIGS. 4 to 6, the plurality of pressing members 24 are arranged in an annular row shape defined along the outer peripheral surface 26 c of the load member 26, and are rotationally symmetric with respect to each other around the central axis 26 d. And are arranged at equal intervals. Specifically, a total of 16 pressing members 24 are attached to the load member 26 in a rotationally symmetrical manner with an equal pitch P (FIG. 5) having a central angle of 22.5 degrees. Here, the pitch P represents the shortest distance between two corresponding points of the pressing members 24 adjacent to each other in the circumferential direction as an angle around the central axis 26d in a virtual plane parallel to the first surface 26a. is there. Therefore, in the film sticking method using the film sticking device 22, the center axis 26 d of the load member 26 is matched with the center axis 10 d of the film 10, so that the film corresponds to the position of the contact portion 30 of each pressing member 24. A total of 16 force points 18 are set at equal intervals of a central angle of 22.5 degrees along a virtual circle centered on the central axis 10d in the ten first film regions 16 (FIG. 5).

  When the frame member 12 has a circular contour, as described above, the plurality of application points 18 are set to the film center point corresponding to the geometric center of the frame member 12 in the first film region 16 of the film 10 (that is, the center axis 10d). ) Is set to a plurality of positions having the same central angle with respect to each other), when all the forces F are balanced, a uniformly uniform force F can be applied to all the applied force points 18 as viewed from the central axis 10d. . By such a uniform force F, the entire second film region 20 of the film 10 can be extended substantially radially outward and the slack S can be efficiently removed. The uniformity of extension of the second film region 20 increases as the number of pressing members 24 increases.

  When the film sticking method by the film sticking device 22 is performed on the film 10 and the frame member 12 having the dimensions described above, the pressing member 24 and the load member 26 can have the following configurations. The pressing member 24 can be made of, for example, stainless steel, has a thickness of about 0.5 mm, a width W (FIG. 5) of about 30 mm, a curvature radius R (FIG. 6 (a)) of the curved portion 24a of about 15 mm, and a curved portion. 24a (a radial dimension in projection onto a virtual plane parallel to the first surface 26a) B (FIG. 6 (a)) is about 30 mm, and the total height (curved portion 24a in projection onto a virtual surface parallel to the outer peripheral surface 26c) H1 (FIG. 6 (a)) is about 45 mm and the height is partial from the bulge vertex of the curved portion 24a in the projection onto the virtual plane parallel to the outer peripheral surface 26c. The shortest distance to the vertex of the rectangular portion 24c) H2 (FIG. 6A) is about 30 mm. The load member 26 can be formed of, for example, an aluminum material, and has a thickness T (FIG. 6A) of about 20 mm, a diameter D (FIG. 6A) of about 200 mm, and a mass M of about 2 kg to about 6 kg. is there.

  Hereinafter, an example of the film sticking method by the film sticking apparatus 22 will be described according to the configuration shown in FIGS. 5 and 6.

  First, in the same manner as in each step described with reference to FIGS. 3A and 3B, the flexible film 10, the annular frame member 12 having higher rigidity than the film 10, and the liquid bonding An agent 14 is prepared, and the liquid adhesive 14 is interposed between the first surface 10a of the film 10 and the second surface 12b of the frame member 12, and the film 10 and the frame member 12 are overlapped with each other (FIG. 6). (A)). In this step, the film 10 is simply overlaid on the frame member 12 and may have an unintentional slack S (FIG. 6 (a)) in the second film region 20 located inside the frame member 12. There is sex.

  Here, as an example, a film 10 made of polyethylene terephthalate having a thickness of about 75 μm and a diameter of about 270 mm (for example, WSF075 available from Sumitomo 3M Limited (Tokyo)), a thickness of about 1 mm, and an inner diameter of about 250 mm And a stainless steel frame member 12 having an outer diameter of about 300 mm and a liquid adhesive 14 made of an ultraviolet curable adhesive (for example, an acrylic ultraviolet curable adhesive EXP available from Sumitomo 3M Limited (Tokyo)) -697). In addition, the frame member 12 with the second surface 12b facing upward is placed on a horizontal support surface (not shown), and the frame member 12 is rotated at a speed of 20 mm / second, so that the liquid adhesive 14 is 6 mg / second. Is supplied to the second surface 12b at a mass flow rate of about 50 μm and a layer of the liquid adhesive 14 having an average thickness of about 50 μm is formed. Then, the film 10 is placed on the frame member 12 so that the central axes 10d and 12e of the film Overlapping at position.

  Next, the load member 26 of the film sticking device 22 is disposed with its first surface 26a facing the second surface 10b of the film 10 and with its center axis 26d substantially coinciding with the center axis 10d of the film 10. (FIGS. 5 and 6A). At this relative position, the abutment portions 30 of the plurality of pressing members 24 of the film sticking device 22 are brought into contact with the second surface 10b in the first film region 16 of the film 10 to set a plurality of force points 18. .

  Next, in a state in which the contact portions 30 of the individual pressing members 24 are in contact with the applied force point 18 of the film 10, the mass M of the load member 26 or an external force (not shown) applied to the load member 26 is mass. In addition to M, a load L in the direction toward the film 10 is applied to the base 28 of each pressing member 24 (FIG. 6B). Here, since the pressing member 24 has a U-shaped curved portion 24a, for example, each pressing member 24 has a molding dimension error or an attachment position error, and a plurality of force points 18 are set. Even in a case where the contact portions 30 of all the pressing members 24 do not uniformly contact the second surface 10b of the film 10 in the state of the step described above (FIG. 6A), the contact is first made. While the pressing member 24 abutting on the film 10 at the contact portion 30 first elastically deforms the curved portion 24a, the other pressing members 24 can abut on the film 10 at the abutting portion 30. The movement of the film 10 until all the forces F are balanced can be minimized.

  The pressing member 24 that has received the load L at the base portion 28 is elastically deformed and tilted by the torque described above, so that the base portion 28 approaches the film 10 integrally with the load member 26, while the contact portion 30 is the film. A force F in a direction toward the outside of the frame member 12 is applied to the ten applied force points 18 (FIG. 6B). Due to this force F, the force point 18 of the film 10 moves in a direction toward the outside of the frame member 12 integrally with the contact portion 30 of the pressing member 24. When the force F applied to the corresponding applied force points 18 from the contact portions 30 of the plurality of pressing members 24 is balanced, the uniform force F is applied to all applied force points 18 and the second film region 20 of the film 10 is loosened. S is removed. Note that the force F in this balanced state is a component force of an elastic restoring force (a pressing force applied obliquely to the second surface 10b of the film 10) generated by the pressing member 24 according to the load L. Further, the magnitude of the force F in the balanced state may be such that no tension is applied to the second film region 20 of the film 10 between the plurality of application points 18, or between these application points 18. A tension may be applied to the second film region 20.

  Next, in a state where the slack S of the second film region 20 of the film 10 is removed, the liquid adhesive 14 is released without releasing the force F applied to the applied force point 18 from the contact portion 30 of each pressing member 24. Is solidified to fix the first film region 16 of the film 10 to the frame member 12. Here, in order to solidify the liquid adhesive 14 made of an ultraviolet curable adhesive, it is possible to irradiate ultraviolet rays from the outside of the individual pressing members 24 toward the second surface 10 b of the film 10. Since the plurality of pressing members 24 are arranged in an annular row at an interval along the outer peripheral surface 26 c of the load member 26, the abutting portions 30 of the pressing members 24 are brought into contact with the force application point 18. Even if it remains as it is, the amount of ultraviolet rays blocked by the pressing member 24 is reduced, and the liquid adhesive 14 can be solidified by the ultraviolet rays that pass through the film 10.

  As necessary, after the liquid adhesive 14 is partially solidified to the extent that the film 10 does not move on the frame member 12 or the slack S reappears in the second film region 20 of the film 10 due to ultraviolet irradiation. The contact portions 30 of the individual pressing members 24 are separated from the second surface 10b of the film 10, and the film 10 is further irradiated with ultraviolet rays in a state where the force F is released and obstacles to ultraviolet irradiation are eliminated. In this manner, the liquid adhesive 14 can be completely solidified by irradiating the necessary amount of ultraviolet rays, and the first film region 16 of the film 10 can be firmly fixed to the frame member 12.

  Thus, in the film sticking apparatus 22 having the above configuration, the film supported by the frame member 12 by the pressing force applied from the pressing member 24 to the second surface 10b of the film 10 according to the load L received from the load member 26. A force F directed to the outside of the frame member 12 can be applied to the applied force points 18 in the ten first film regions 16. Therefore, for example, when compared with a configuration in which the outer peripheral edge 10c of the film 10 or the periphery thereof is pulled outward in the radial direction, there is no need to install a traction mechanism or the like outside the frame member 12, so that the apparatus is reduced in size and simplified. The slack S in the second film region 20 can be removed by the configuration. In addition, since the plurality of pressing members 24 are spaced apart from each other, even if the contact portion 30 of each pressing member 24 is kept in contact with the applied force point 18, The influence of the presence on the solidifying action is reduced, and the liquid adhesive 14 can be solidified by a method according to its composition.

The structure of the film sticking apparatus 22 is not limited to the said structure, It can change variously.
For example, the film sticking device 34 shown as a modification in FIG. 7 applies the load L to the pressing member 24 instead of the load member 26 (FIG. 6) that does not cause bending or deformation due to the load L applied to the pressing member 24. Sometimes it includes a load member 36 which itself elastically bends. The load member 36 can be formed of a flat plate made of stainless steel having resilience such as a leaf spring. In this case, the pressing member 24 attached to the load member 36 may or may not have elasticity like a spring.

  When an example of the above-described film sticking method is carried out by the film sticking device 34 provided with the load member 36, the load member 36 substantially corresponds to the film 10 superimposed on the frame member 12 via the liquid adhesive 14. In the state where it is not bent, the contact portions 30 of the plurality of pressing members 24 are brought into contact with the second surface 10b in the first film region 16 of the film 10 to set a plurality of force points 18 (FIG. 7 ( a)). Next, in the state in which the contact portions 30 of the individual pressing members 24 are in contact with the applied point 18 of the film 10, the mass M of the load member 36 or an external force (not shown) applied to the load member 36 is mass. In addition to M, a load L in the direction toward the film 10 is applied to the base 28 of each pressing member 24 (FIG. 7B). As the external force added to the mass M, for example, a thrust applied to the load member 36 by a drive source such as an electric motor (not shown) can be used.

  When the pressing member 24 receives the load L from the load member 36 at the base portion 28, the contact portion 30 applies the reaction force of the pressing force applied to the applied force point 18 by the load L to the first film region 16 of the film 10. It receives from the frame member 12 to support. The load member 36 has a central portion close to the film 10 due to the reaction force received by the individual pressing members 24 from the frame member 12 and the mass M of the load member 36 itself (and the external force applied to the load member 26 when used). So that it bends elastically (FIG. 7B). When the load member 36 causes such bending, the pair of flat portions 24 b and 24 c of the pressing member 24 tilts in a direction in which the curved portion 24 a approaches the load member 36. As the flat portions 24 b and 24 c are tilted, the contact portion 30 moves away from the load member 36, and the applied force point 18 at which the contact portion 30 is in contact with the pressing force together with the contact portion 30. It moves in the direction toward the outside of the frame member 12. Further, during the tilting operation of the flat portions 24 b and 24 c, the base portion 28 of the pressing member 24 moves together with the load member 36 in a direction approaching the film 10. Due to such behavior of the pressing member 24, the abutting portion 30 continues to press the applying force point 18 without leaving the film 10 under the load L, and the force F toward the outside of the frame member 12 is applied to the applying point 18. Can be added.

  The force point 18 of the film 10 is moved in the direction toward the outside of the frame member 12 integrally with the contact portion 30 of the pressing member 24 by the force F. When the force F applied to the corresponding applied force points 18 from the contact portions 30 of the plurality of pressing members 24 is balanced, the uniform force F is applied to all applied force points 18 and the second film region 20 of the film 10 is loosened. S is removed. In a state where the slack S of the second film region 20 of the film 10 is removed, the liquid adhesive 14 is solidified without releasing the force F applied to the applied force point 18 from the contact portion 30 of each pressing member 24. Then, the first film region 16 of the film 10 is fixed to the frame member 12. Thus, the film sticking apparatus 34 provided with the load member 36 having elasticity like a spring acts in the same manner as the film sticking apparatus 22 provided with the load member 26 having no elasticity. The effect is equivalent to the effect.

  It can replace with the said structure and can also be set as the structure which attaches the base 28 of the press member 24 to the load member 26 which does not have elasticity through the separate spring component which is not shown in figure. In this configuration, the base portion 28 is attached to the load member 26 so as to be rotatable in a hinged manner, for example. In this case, the pressing member 24 attached to the load member 36 may or may not have elasticity like a spring. Even in such a configuration, the pressing member 24 causes the above-described tilting operation when the load L from the load member 26 is applied to the base portion 28, and applies the force F to the applied force point 18 of the film 10 at the contact portion 30. be able to.

FIG. 8 shows various modifications of the pressing member 24.
The pressing member 241 shown in FIG. 8A has a flat plate-like portion 241a that does not include a curved portion. A rectangular flat plate-like base 28 bent at an obtuse angle with respect to the plate-like portion 241a is provided at one end of the plate-like portion 241a, and a contact portion 30 is provided at the other end of the plate-like portion 241a. The contact part 30 may or may not have a sharp tip 30a (FIG. 4).

  The pressing member 242 shown in FIG. 8B has a central curved portion 242a bulging outward and flat portions 242b and 242c on both sides thereof. Both flat portions 242b and 242c are arranged on the same plane. At one end of one flat portion 242b, a rectangular flat base 28 bent at an obtuse angle with respect to the flat portion 242b is provided, and an abutting portion 30 is provided at the end of the other flat portion 242c. The contact part 30 may or may not have a sharp tip 30a (FIG. 4).

  The pressing member 243 shown in FIG. 8C has a central curved portion 243a bulging inward and flat portions 243b and 243c on both sides thereof. Both flat portions 243b and 243c are arranged on the same plane. At one end of one flat portion 243b, a rectangular flat base 28 bent at an obtuse angle with respect to the flat portion 243b is provided, and an abutting portion 30 is provided at the end of the other flat portion 243c. The contact part 30 may or may not have a sharp tip 30a (FIG. 4).

  The pressing member 244 shown in FIG. 8D has a first curved portion 244a that bulges outward and a second curved portion 244b that is gradually bent inward from one end and extended. A rectangular flat plate-shaped base 28 bent at an obtuse angle with respect to the curved portion 244a is provided at one end of the first curved portion 244a, and an abutting portion 30 is provided at the end of the second curved portion 244b. . The contact part 30 may or may not have a sharp tip 30a (FIG. 4).

  The pressing member 245 shown in FIG. 8 (e) has a first flat portion 245a that does not include a curved portion and a second flat portion 245b that is bent and extended inward from one end thereof at an obtuse angle. One end of the first flat portion 245a is provided with a rectangular flat base 28 bent at an obtuse angle with respect to the flat portion 245a, and an abutting portion 30 is provided at the end of the second flat portion 245b. . The contact part 30 may or may not have a sharp tip 30a (FIG. 4).

  The pressing member 246 shown in FIG. 8F has a central curved portion 246a bulging outward and flat portions 246b and 246c on both sides thereof. Both flat portions 246b and 246c are arranged on two planes intersecting each other. At one end of one flat portion 246b, a rectangular flat base 28 bent at an obtuse angle with respect to the flat portion 246b is provided, and at the end of the other flat portion 246c, the contact portion 30 is provided. The contact part 30 may or may not have a sharp tip 30a (FIG. 4).

  Any of the pressing members 241 to 246 according to the various modifications described above is a projection on a virtual plane orthogonal to the direction of the load L (a virtual plane parallel to the first surface 26a of the load member 26). Is attached to the load member 26 in a posture positioned outside the base portion 28. As described above, the configuration of the pressing member 24 is not limited to these modified examples.

  FIG. 9 shows a film sticking device 38 according to still another modification. The film sticking device 38 is formed of a material that can be fixedly engaged with the film 10 by frictional force or adhesive force, instead of the pressing member 24 having the contact portion 30 (FIG. 4) having a sharp tip 30 a. A pressing member 42 having a contact portion 40 is provided. The pressing member 42 has the same configuration as the pressing member 24 described above except for the contact portion 40. The contact portion 40 has a plate-like shape bent in a U shape from a material having a high coefficient of friction with respect to the material of the film 10 such as rubber or a material having adhesiveness such as a removable adhesive. It can be formed by fixing to the edge of the pressing member 42. As shown in FIG. 9B, the contact portion 40 may be provided at a linear end edge of the pressing member 42 or may be provided at a curved end edge (not shown).

  When carrying out an example of the film sticking method described above by the film sticking device 38 provided with the pressing member 42, the film 10 superimposed on the frame member 12 via the liquid adhesive 14 was attached to the load member 26. The abutting portions 40 of the plurality of pressing members 42 are brought into contact with the second surface 10b in the first film region 16 of the film 10 to set a plurality of force points 18 (FIG. 9A). At this time, the contact portion 40 is fixedly engaged with the film 10 at a linear adhesion point 18 formed on the second surface 10b of the film 10 by frictional force or adhesive force.

  Thereafter, the same steps as those of the film sticking device 22 described above can be performed. That is, a load in a direction toward the film 10 is applied from the load member 26 to the base portion 28 of each pressing member 42 in a state in which the contact portions 40 of the individual pressing members 42 are in contact with the force point 18 of the film 10. Then, each pressing member 42 is tilted, and a force in a direction toward the outside of the frame member 12 is applied from the contact portion 40 to the applying force point 18 of the film 10. Since the contact portion 40 is fixedly engaged with the second surface 10b of the film 10 by a frictional force or an adhesive force, the applied point 18 can be prevented from being displaced on the film 10 while a force is applied.

  When the forces applied to the corresponding applied force points 18 from the contact portions 40 of the plurality of pressing members 42 are balanced, a uniform force is applied to all applied force points 18 and the slack S ( FIG. 9A is removed. In a state where the slack S of the second film region 20 of the film 10 is removed, the liquid adhesive 14 is solidified without releasing the force applied to the applied force point 18 from the contact portion 40 of each pressing member 42. The first film region 16 of the film 10 is fixed to the frame member 12.

  FIG. 10 shows a film sticking device 44 according to still another modification. The film sticking device 44 is provided with a contact member 46 having a contact portion 46 having a suction structure that can be applied to the film so that the vacuum can be released instead of the press member 24 having the contact portion 30 (FIG. 4) including the sharp tip 30a. 48. The pressing member 48 has the same configuration as the pressing member 24 described above except for the contact portion 46. The abutting portion 46 is a nozzle-like member having a suction pad 50 that can be adsorbed to the film 10 at the tip, and can be formed by being fixed to the edge of a pressing member 48 having a plate shape bent in a U-shape. . The contact portion 46 is connected to a vacuum source (not shown) by the tube 52, and the suction pad 50 sucks the film 10 by applying a vacuum from the vacuum source.

  When carrying out an example of the above-described film sticking method by the film sticking device 44 provided with the pressing member 48, the film 10 superimposed on the frame member 12 via the liquid adhesive 14 was attached to the load member 26. The suction pads 50 of the contact portions 46 of the plurality of pressing members 48 are brought into contact with the second surface 10b in the first film region 16 of the film 10 to set a plurality of force points 18 (FIG. 10A). . In this state, a vacuum is applied to the contact portion 46 so that the suction pad 50 is attracted to the planar applied force point 18 formed on the second surface 10 b of the film 10.

  Thereafter, the same steps as those of the film sticking device 22 described above can be performed. That is, a load in the direction toward the film 10 is applied from the load member 26 to the base portion 28 of each pressing member 48 in a state in which the contact portions 46 of the individual pressing members 48 are in contact with the force point 18 of the film 10. Then, each pressing member 48 is tilted, and a force in a direction toward the outside of the frame member 12 is applied from the abutting portion 46 to the applying force point 18 of the film 10. Since the suction pad 50 vacuum-sucks the second surface 10 b of the film 10, the contact portion 46 can prevent the applied point 18 from being displaced on the film 10 while applying a force.

  When the forces applied to the corresponding applied force points 18 from the contact portions 46 of the plurality of pressing members 48 are balanced, a uniform force is applied to all applied force points 18 and the slack S (2) of the second film region 20 of the film 10 ( FIG. 10A is removed. In a state where the slack S of the second film region 20 of the film 10 is removed, the liquid adhesive 14 is solidified without releasing the force applied to the applied force point 18 from the contact portion 46 of each pressing member 48. The first film region 16 of the film 10 is fixed to the frame member 12.

  FIG. 11 shows a film sticking device 54 according to still another modification. The film sticking device 54 is for sticking not the film 10 having a circular contour but the film 56 having a regular triangular contour to the frame member 12 having a circular contour. The film 56 has a first surface 56a, a second surface 56b opposite to the first surface 56a, a vertex 56c of an equilateral triangular contour, and a central axis 56d. The film 56 has a distance from the geometric center (center axis 56d) to each vertex 56c that is larger than the inner diameter of the frame member 12, and is overlapped with the frame member 12 in three end regions including the vertex 56c. A film region 58 is formed.

  The film sticking device 54 includes the pressing member 24 and the load member 26 having the same structure as the pressing member 24 and the load member 26 of the film sticking device 22 described above. However, in the film sticking device 54, a total of three pressing members 24 are attached to the load member 26 in a rotationally symmetrical manner with an equal pitch P (FIG. 11A) having a central angle of 120 degrees. The three pressing members 24 are in a virtual plane orthogonal to the direction of the load applied from the load member 26 (in FIG. 11B, a virtual plane parallel to the first surface 26a of the load member 26), as in the film sticking device 22. In the projection, each contact portion 30 is arranged in an annular form, that is, in an annular row with a space between each contact portion 30 in a posture that is located outside the respective base portion 28 (FIG. 11A). The three pressing members 24 attached to the load member 26 in this arrangement position the respective contact portions 30 in the three first film regions 58 of the film 56 superimposed on the frame member 12. Can do. Other configurations of the film sticking device 54 are the same as those of the film sticking device 22.

  When an example of the above-described film sticking method is performed by the film sticking device 54, the load member 26 is applied to the film 56 that is superimposed on the frame member 12 in the three first film regions 58 via the liquid adhesive 14. The abutting portions 30 of the three pressing members 24 attached are brought into abutment with the second surface 56b in the respective first film regions 58 of the film 56, and three application points 60 are set. Next, a load in the direction toward the film 56 is applied from the load member 26 to the base portion 28 of each pressing member 24 in a state where the contact portions 30 of the individual pressing members 24 are in contact with the force points 60 of the film 56. In addition, each pressing member 24 is tilted by the torque described above, and a force in a direction toward the outside of the frame member 12 is applied from the abutting portion 30 to the applying force point 60 of the film 56.

  When the forces applied to the corresponding applied force points 60 from the abutting portions 30 of the three pressing members 24 are balanced, a uniform radial force is applied to all the applied force points 60 as viewed from the central axis 56d. The second film region 62 (the region located inside the frame member 12) extends substantially evenly toward the individual vertices 56c, so that the slack S (FIG. 11 (b)) of the second film region 62 is removed. Is done. In a state where the slack S of the second film region 62 of the film 56 is removed, the liquid adhesive 14 is solidified without releasing the force applied from the contact portion 30 of each pressing member 24 to the application point 60, The three first film regions 58 of the film 56 are fixed to the frame member 12.

  FIG. 12 shows a film sticking device 64 according to still another modification. The film sticking device 64 is for sticking the film 66 having a square contour, not the film 10 having a circular contour, to the frame member 12 having a circular contour. The film 66 has a first surface 66a, a second surface 66b opposite to the first surface 66a, a vertex 66c of a square outline, and a central axis 66d. The film 66 has a distance from the geometric center (center axis 66d) to each vertex 66c that is larger than the inner diameter of the frame member 12, and is overlapped with the frame member 12 in four end regions including the vertex 66c. A film region 68 is formed.

  The film sticking device 64 includes the pressing member 24 and the load member 26 having the same structure as the pressing member 24 and the load member 26 of the film sticking device 22 described above. However, in the film sticking device 64, a total of four pressing members 24 are attached to the load member 26 in a rotationally symmetrical manner with an equal pitch P (FIG. 12A) having a central angle of 90 degrees. The four pressing members 24 are virtual planes orthogonal to the direction of the load applied from the load member 26 (the virtual plane parallel to the first surface 26a of the load member 26 in FIG. 12B), as in the film sticking device 22. In the projection, each contact portion 30 is arranged in an annular form, that is, in an annular row with a space between each contact portion 30 in an attitude located outside the respective base portion 28 (FIG. 12A). The four pressing members 24 attached to the load member 26 in this arrangement position the respective contact portions 30 in the four first film regions 68 of the film 66 superimposed on the frame member 12. Can do. Other configurations of the film sticking device 64 are the same as those of the film sticking device 22.

  When an example of the above-described film sticking method is performed by the film sticking device 64, the load member 26 is applied to the film 66 superimposed on the frame member 12 in the four first film regions 68 via the liquid adhesive 14. The abutment portions 30 of the four pressing members 24 attached are brought into contact with the second surface 66b in the respective first film regions 68 of the film 66, and four application points 70 are set. Next, a load in the direction toward the film 66 is applied from the load member 26 to the base portion 28 of each pressing member 24 in a state where the contact portion 30 of each pressing member 24 is in contact with the force point 70 of the film 66. In addition, each pressing member 24 is tilted by the above-described torque, and a force in a direction toward the outside of the frame member 12 is applied from the abutting portion 30 to the applying force point 70 of the film 66.

  When the force applied to the corresponding applied force points 70 from the contact portions 30 of the four pressing members 24 is balanced, a uniform radial force is applied to all applied force points 70 as viewed from the central axis 66d, and the film 66 The second film area 72 (area located inside the frame member 12) extends substantially evenly toward the individual vertices 66c, so that the slack S (FIG. 12B) of the second film area 72 is removed. Is done. In a state where the slack S of the second film region 72 of the film 66 is removed, the liquid adhesive 14 is solidified without releasing the force applied to the applied force point 70 from the contact portion 30 of each pressing member 24, The four first film regions 68 of the film 66 are fixed to the frame member 12.

  FIG. 13 shows a film sticking device 74 according to still another modification. The film sticking device 74 is for sticking the film 76 having a rectangular outline instead of the film 10 having a circular outline to the frame member 78 having a rectangular outline instead of the frame member 12 having a circular outline. The film 76 has a first surface 76a, an opposite second surface 76b, an outer peripheral edge 76d including a vertex 76c of a rectangular outline, and a central axis 76e. The frame member 78 includes a first surface 78a, a second surface 78b opposite to the first surface 78a, an inner peripheral surface 78c extending between the first surface 78a and the second surface 78b, and a rectangular shape on the opposite side of the inner peripheral surface 78c. It has an outer peripheral surface 78e including a contour apex 78d and a central axis 78f. The film 76 has a short side and a long side at the outer peripheral edge 76d larger than the short side and the long side at the inner peripheral surface 78c of the frame member 12, respectively, and is attached to the frame member 78 in a rectangular annular region along the outer peripheral surface 78e. An overlapping first film region 80 is formed.

  The film sticking device 74 includes a pressing member 24 having the same structure as the pressing member 24 of the film sticking device 22 described above, and a load member 82 having a structure similar to the load member 26 of the film sticking device 22 described above. The load member 82 has the same configuration as the load member 26 except that the load member 82 is a flat block body having a rectangular outline. The load member 82 includes a first surface 82a, a second surface 82b opposite to the first surface 82a, an outer peripheral surface 82d including a vertex 82c having a rectangular outline, and a central axis line between the first surface 82a and the second surface 82b. 82e.

  In the film sticking device 74, the four pressing members 24 are attached to the first surface 82 a at positions adjacent to the four apexes 82 c of the load member 82, and the two pressing members 24 are each a rectangular shape of the load member 82. It is attached to the first surface 82a at a position corresponding to the center of the long side of the contour. A total of six pressing members 24 are virtual planes orthogonal to the direction of the load applied from the load member 82 (the virtual plane parallel to the first surface 82a of the load member 82 in FIG. ), The respective contact portions 30 are arranged in the form of a rectangular ring, that is, arranged in a rectangular ring form at a distance from each other in a posture that is positioned outside the respective base part 28 (FIG. 13A). ). The six pressing members 24 attached to the load member 82 in such an arrangement position the respective abutting portions 30 in the first annular film region 80 of the film 76 superimposed on the frame member 78. be able to. Other configurations of the film sticking device 74 are the same as those of the film sticking device 22.

  When carrying out an example of the film sticking method described above by the film sticking device 74, the film 76 superimposed on the frame member 78 in the first film region 80 via the liquid adhesive 14 was attached to the load member 82. The abutment portions 30 of the six pressing members 24 are brought into contact with the second surface 76 b in the first film region 80 of the film 76 to set six force points 84. At this time, the contact portion 30 of the pressing member 24 installed at a position adjacent to the apex 82c of the load member 82 contacts the second surface 76b at a position adjacent to the corresponding apex 76c of the film 76, so 84 is set. Further, the abutting portion 30 of the pressing member 24 installed at a position corresponding to the center of the long side of the load member 82 contacts the second surface 76b at a position adjacent to the center of the corresponding long side of the film 76, so Point 84 is set. Next, a load in the direction toward the film 76 is applied from the load member 82 to the base portion 28 of each pressing member 24 in a state where the contact portion 30 of each pressing member 24 is in contact with the force point 84 of the film 76. In addition, each pressing member 24 is tilted by the above-described torque, and a force in a direction toward the outside of the frame member 78 is applied from the contact portion 30 to the applying force point 84 of the film 76.

  When the forces applied to the corresponding applied force points 84 from the contact portions 30 of the six pressing members 24 are balanced, a total of four applied force points 84 adjacent to the apex 76c of the film 76 are radially uniform as viewed from the central axis 76e. In addition, a uniform force is applied radially to the total two applied points 84 adjacent to the center of the long side of the film 76 as viewed from the central axis 76e, so that the second film region 86 (of the frame member 78) of the film 76 is applied. The region located on the inner side) extends substantially evenly toward the individual application points 84, so that the slack S (FIG. 13B) of the second film region 86 is removed. In a state where the slack S of the second film region 86 of the film 76 is removed, the liquid adhesive 14 is solidified without releasing the force applied to the applied force point 84 from the contact portion 30 of each pressing member 24, The first film region 80 of the film 76 is fixed to the frame member 78.

  By analogy with the film sticking device 74 according to the above modification, the film sticking method according to one aspect of the present invention is a non-circular contour (polygon such as a square, rectangle, trapezoid, star, etc., a polygon with rounded vertices, A frame member having an oval shape or the like can be configured to affix a film having an arbitrary shape. In this configuration, the frame member has at least one overhanging edge (vertex 78d in FIG. 13) that touches the smallest virtual circle that has a non-circular contour and includes a non-circular contour therein, and a plurality of application points (FIG. In FIG. 13, at least one of the applied force points 84) is set at a position adjacent to the projecting edge of the frame member in the first film region (first film region 80 in FIG. 13).

  The above-described film sticking method and film sticking apparatus 22, 34, 38, 44, 54, 64, 74 are used when dicing a thinned wafer (not shown) after back grinding in the semiconductor chip manufacturing method. The present invention can be applied to a frame mounting process in which a frame member (for example, referred to as a dicing frame) is attached to a film in order to maintain a film (for example, referred to as a dicing film) for supporting a wafer in a state without sagging. The above-mentioned film sticking method and film sticking apparatus 22, 34, 38, 44, 54, 64, 74 are the specification or drawing of the original application of Japanese Patent Application No. 2010-271893, which is a prior patent application by the applicant of the present application. It can also be applied to the semiconductor chip manufacturing method described in 1.

  FIG. 14 schematically shows main steps when the above-described film sticking method is applied to the semiconductor chip manufacturing method described as an embodiment in the specification or drawing of the above-mentioned prior patent application. In this semiconductor chip manufacturing method, first, a film 10 having a wafer 90 having a first surface (circuit surface) 90a and a second surface 90b on the opposite side, and a first surface 10a larger than the first surface 90a of the wafer 90. And a frame member 12 having a shape and dimensions that can be arranged along the outer peripheral edge 10 c of the film 10, and a liquid adhesive 92. The liquid adhesive 92 having the same composition as the liquid adhesive 14 (FIG. 3) for fixing the film 10 to the frame member 12 can be used.

  Next, the wafer 90 is mounted on the table 94 with the first surface 90a facing upward (FIG. 14A), and the liquid adhesive 92 is applied to the region including the central axis 90c of the first surface 90a of the wafer 90. Is arranged (FIG. 14B). In this state, the wafer 90 is rotated around the central axis 90c, and the liquid adhesive 92 is spread over the entire first surface 90a (FIG. 14C). The liquid adhesive 92 fills the gaps between the convex portions 96 formed on the first surface 90a of the wafer 90 by printed wiring or the like.

  On the other hand, the frame member 12 is fixed along the outer peripheral edge 10c of the film 10 by the above-described film sticking method (FIG. 3) (the liquid adhesive 14 is not shown in FIG. 14). This frame attaching step can be performed using the film sticking devices 22, 34, 38, 44, 54, 64, 74 described above. As described above, the second film region 20 located inside the frame member 12 of the film 10 to which the frame member 12 is fixed is in a state without slack.

  Next, the relative positions of the wafer 90 and the film 10 such that the first surface 90 a and the first surface 10 a face each other and the region along the outer peripheral edge 10 c of the film 10 and the frame member 12 project outside the wafer 90. The first surface 90a and the first surface 10a are both brought into contact with the liquid adhesive 92 (FIG. 14D). At this time, since the frame member 12 is uniformly fixed along the outer peripheral edge 10c of the film 10, the second film region 20 of the film 10 is maintained in a state of being stretched by the frame member 12 (that is, in a state without slack). However, the first surface 90a of the wafer 90 and the first surface 10a of the film 10 can be brought into contact with the liquid adhesive 92 in a substantially parallel arrangement.

  Next, the liquid adhesive 92 is solidified by a method according to its composition, and the film 10 is fixed to the first surface 90a of the wafer 90 (FIG. 14E). Since the liquid adhesive 92 has the same physical properties as the liquid adhesive 14 described above, the liquid adhesive 92 smoothly and uniformly fills the gaps between the convex portions 96 of the first surface 90a of the wafer 90. A bonding layer 98 free from contamination can be formed between the wafer 90 and the film 10. In this way, the attachment of the film 10 to the wafer 90 is completed. In addition, as for the film sticking process with respect to the wafer 90, it is desirable to perform at least the step which makes the wafer 90 and the film 10 contact the liquid adhesive 92, and the step which solidifies the liquid adhesive 92 in the state in a vacuum environment. Moreover, all the steps including these steps can be performed in a vacuum environment.

  Next, the wafer 90 on which the film 10 is fixed to the first surface 90a is picked up from the table 94 together with the frame member 12 and turned upside down, and another stationary state with the second surface 90b of the wafer 90 facing up. Place it on a table. For example, the wafer 90 and the film 10 are fixedly supported inside the frame member 12 using a holding means such as vacuum suction, and the frame member 12 is held in a fixed state with respect to the wafer 90 and the film 10. . In this state, the entire second surface 90b of the wafer 90 is ground by a grinding device (not shown) to form a flat processed surface 100 (FIG. 14 (f)). Thereby, the back surface grinding of the wafer 90 is completed.

  A plurality of wafers 90 are formed by cutting (dicing) the processed surface 100 along a predetermined cutting line 102 with respect to the wafer 90 having the processed surface 100 formed on the opposite side of the first surface (circuit surface) 90a by back surface grinding. The chip 104 is divided (FIG. 14G). The divided individual chips 104 are pushed up from the second surface 10b of the film 10 with pins or the like (not shown), for example, to cause separation at the interface between the bonding layer 98 and the surface of the chip 104, so that one by one from the film 10 Can be taken up. Note that the cutting line 102 is usually provided in advance on the first surface 90a of the wafer 90, and it is generally difficult to visually recognize the cutting line 102 from the processing surface 100 side. Therefore, in the above-described dicing process, by using a dicing apparatus having an image recognition function, the machining surface 100 can be accurately diced while the cutting line 102 on the first surface 90a side is recognized on the image.

10, 56, 66, 76 Film 12, 78 Frame member 14 Liquid adhesive 16, 58, 68, 80 First film region 18, 60, 70, 84 Adhesion point (contact point)
20, 62, 72, 86 Second film region 22, 34, 38, 44, 54, 64, 74 Film sticking device 24, 42, 48 Press member 26, 36, 82 Load member 28 Base 30, 40, 46 Contact Part F Force L Load S Looseness

Claims (12)

A method for attaching a film,
Providing a flexible film, a rigid frame member, and a liquid adhesive;
Interposing the liquid adhesive between the film and the frame member, and superimposing the film and the frame member on each other;
The film is positioned on the inner side of the frame member by applying a force in a direction toward the outer side of the frame member to a plurality of contact points set in the first film region overlapping the frame member of the film. Removing the slack in the second film area to
Solidifying the liquid adhesive in a state where the slack of the second film region is removed, and fixing the first film region of the film to the frame member;
A film sticking method including:   The film sticking method according to claim 1, wherein the uniform force is applied to the plurality of contact points.   The film sticking method according to claim 1 or 2, wherein a tension is generated in the second film region by applying the force to the plurality of contact points of the first film region overlapped with the frame member.   The frame member has a circular outline, and the plurality of contact points are set at a plurality of positions having equal central angles with respect to a center point corresponding to a geometric center of the frame member in the first film region. The film sticking method of any one of Claims 1-3.   The frame member has a non-circular contour and at least one overhanging edge in contact with a minimum virtual circle including the non-circular contour therein, and at least one of the plurality of contact points is the first film region In Claim 1, The film sticking method of any one of Claims 1-3 set to the position adjacent to the said overhang | projection edge part of the said frame member. A film sticking device for sticking a flexible film to a rigid annular frame member using a liquid adhesive,
A plurality of pressing members for applying a force in a direction toward the outside of the frame member to each of a plurality of contact points set in the first film region of the film overlapping the frame member;
A load member for applying a load in a direction toward the film to each of the plurality of pressing members,
Each of the plurality of pressing members is in contact with a base receiving the load from the load member and one of the plurality of contact points, and applies the force to the contact point by the load received by the base. A contact portion,
In the projection onto a virtual plane orthogonal to the direction of the load, the plurality of pressing members are annularly spaced apart from each other in a posture in which the respective contact portions are positioned outside the respective base portions. Arranged,
Film sticking device.   The film sticking device according to claim 6, wherein the plurality of pressing members are annularly arranged at equal intervals.   The film sticking device according to claim 6 or 7, wherein each of the plurality of pressing members has elasticity.   9. The film sticking apparatus according to claim 6, wherein each of the contact portions of the plurality of pressing members has a pointed tip that can be fixedly engaged with the film.   The film according to any one of claims 6 to 9, wherein the contact portion of each of the plurality of pressing members is formed of a material that can be fixedly engaged with the film by frictional force or adhesive force. Pasting device.   The film affixing device according to any one of claims 6 to 8, wherein the abutting portion of each of the plurality of pressing members has an adsorption structure that is applied to the film so as to be able to release a vacuum.   The film loader according to any one of claims 6 to 11, wherein the load member is a block body to which the bases of the plurality of pressing members are attached.

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