WO2011150781A1 - 一种在电容式触摸屏表面进行化学镀金的方法 - Google Patents

一种在电容式触摸屏表面进行化学镀金的方法 Download PDF

Info

Publication number
WO2011150781A1
WO2011150781A1 PCT/CN2011/074833 CN2011074833W WO2011150781A1 WO 2011150781 A1 WO2011150781 A1 WO 2011150781A1 CN 2011074833 W CN2011074833 W CN 2011074833W WO 2011150781 A1 WO2011150781 A1 WO 2011150781A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass
double
plating
gold plating
minutes
Prior art date
Application number
PCT/CN2011/074833
Other languages
English (en)
French (fr)
Inventor
蔡青源
西正秀
Original Assignee
无锡阿尔法电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 无锡阿尔法电子科技有限公司 filed Critical 无锡阿尔法电子科技有限公司
Priority to KR1020127032973A priority Critical patent/KR101513344B1/ko
Priority to US13/701,496 priority patent/US20130082026A1/en
Publication of WO2011150781A1 publication Critical patent/WO2011150781A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Definitions

  • the invention relates to the technical field of gold plating on the surface of a capacitive touch screen, in particular to a method for performing chemical gold plating on the surface of a capacitive touch screen.
  • the existing capacitive touch screen is gold-plated by electroplating gold. Since it generally includes many small pieces of touch glass on the large ITO glass, it is necessary to reserve a conductive area around the large ITO glass so as to form an electrode during electroplating. At the same time, a small piece of touch glass It is also necessary to form a loop separately from the conductive region, and it is necessary to leave sufficient gap between each single small piece of touch glass to ensure the stroke of the loop, and then form a metal film on the ITO glass by electroplating gold, because the existence of the conductive region is reduced. The actual use rate of large ITO glass, at the same time, a metal layer is also formed on the conductive region, which increases the use amount of the gold plating liquid, so that the cost is increased.
  • the present invention provides a method for performing electroless gold plating on the surface of a capacitive touch screen, which can improve the practical use rate of the ITO glass, save the use of the gold plating liquid, and reduce the cost.
  • the capacitive touch screen glass substrate After ITO sputtering on the surface of the capacitive touch screen glass substrate, it becomes a double-sided ITO glass, and the double-sided ITO glass divides the visible area and the surrounding area of the touch glass according to the typesetting, and uses a photo process in each touch.
  • the visible area of the control glass etches the sensor sensing electrode, the surrounding area etches the trace, and then prints a gold-plated protective film on the visible area of each touch glass, and then touches each touch by electroless nickel plating and electroless gold plating process.
  • the glass trace is gold-plated, and the gold-plated protective film is resistant to strong acid and high temperature. A protective film in which Ni and Au metal particles cannot adhere.
  • the electroless nickel plating process is performed on the traces of the surrounding areas of each touch glass, and then electroless gold plating is performed to strengthen the wiring.
  • the gold plating protective film is composed of a mass percentage, and the composition thereof specifically includes: 55 to 65% of a vinyl acetate resin derivative, 10 to 20% of a fatty acid ester, 10 to 20% of an epoxy resin, and less than 5% of a polymer flame retardant. Agent, less than 5% thixotropic agent, less than 1% organic pigment, less than 3% defoamer;
  • the photoresist and the protective film are used to etch the sensing electrodes and the traces of the sensors in the X and Y directions on each of the touch glasses arranged on the double-sided ITO glass through a photo process;
  • the step of pre-processing the capacitive T/P is specifically:
  • the double-sided ITO glass is immersed in a standard acid bath at a temperature of 15 to 28 ° C for 5 minutes and then washed with water for two minutes;
  • the double-sided ITO glass is placed in an etchant of 10 to 50 g/L or 10 to 50 mL/L of an acidic etchant for immersion treatment at a temperature of 10 to 50 ° C for 5 minutes, and then washed with water for two minutes to finely roughen the surface of the ITO.
  • an etchant of 10 to 50 g/L or 10 to 50 mL/L of an acidic etchant for immersion treatment at a temperature of 10 to 50 ° C for 5 minutes, and then washed with water for two minutes to finely roughen the surface of the ITO.
  • the electroless nickel plating and the electroless gold plating process are specifically: placing the double-sided ITO glass in a metal stabilizer for lead, pH: 1 to 5, temperature of 50 to 100 ° C, and film stress. Electroless nickel plating in a sodium-free plating bath of ⁇ 0, after which it will already The electroless nickel-plated double-sided ITO glass is washed with water for two minutes, and then subjected to electroless gold plating in a cyanide plating bath having a pH of 1 to 5 and a temperature of 50 to 100 ° C;
  • the electroless nickel plating and the electroless gold plating process are specifically: placing the double-sided ITO glass on the metal stabilizer as lead, pH: 1 to 5, temperature of 50 to 100 ° C, and film stress.
  • the electroless nickel plating and the electroless gold plating process are specifically: placing the double-sided ITO glass in a metal-free stabilizer, pH: 6-10, temperature 50-100 ° C, low film stress, suitable for testing Electroless gold plating in the plating bath of the product, through the sulfur-based additive The stability of the plating bath was maintained, followed by water washing for two minutes, and the double-sided ITO glass was subjected to electroless gold plating in a substantially cyanide-free bath having a pH of 6 to 10 and a temperature of 50 to 100 °C.
  • the sensor sensing electrode is etched in the visible area of each touch glass by using a photo process, the surrounding area is etched, and then a gold-plated protective film is printed on the visible area of each touch glass, and then The wires of each of the touch glasses are gold-plated by electroless nickel plating and electroless gold plating, and the gold-plated protective film is resistant to strong acid and high temperature.
  • a protective film that Ni and Au metal particles cannot adhere to, which completely eliminates the presence of conductive regions, thereby greatly improving ITO The actual use rate of the glass, and at the same time, since there is no conductive region, the use amount of the gold plating liquid is lowered, so that the cost is lowered.
  • Embodiment 1 Gold plating on a precision wiring substrate
  • the capacitive touch screen glass substrate After ITO sputtering on the surface of the capacitive touch screen glass substrate, it becomes a double-sided ITO glass, and the entire double-sided ITO
  • the glass is the touch glass, which is divided into two parts: the visible area and the surrounding area;
  • the gold-plated protective film is composed of mass percentage, and its composition includes: 55% vinyl acetate resin derivative, 10% fatty acid ester, 10% Epoxy grease, less than 5% polymeric flame retardant, less than 5% thixotropic agent, less than 1% organic pigment, less than 3% defoamer;
  • the double-sided ITO glass is immersed in a standard acid bath at a temperature of 15 ° C for 5 minutes and then washed with water for two minutes;
  • the double-sided ITO glass is immersed in an acid etchant of 10 g/L etching solution at a temperature of 10 ° C for 5 hours. Minutes, then two minutes of water washing, so that the surface of the ITO is slightly roughened to improve the adhesion of the coating;
  • the double-sided ITO glass was immersed in a solution having an activator concentration of 10 mL/L at a temperature of 10 ° C for a period of time 1 Minutes, followed by two minutes of washing;
  • the double-sided ITO glass subjected to the above steps is placed at pH: 1, temperature: 50 Electroless gold plating is carried out in a cyanide plating bath at °C.
  • the gold-plated protective film is resistant to strong acid and high temperature, and the ink of Ni and Au metal particles cannot be attached to the visible area sensing electrode.
  • the gold-plated protective film is by mass percentage, and its composition specifically includes : 60% vinyl acetate resin derivative, 15% fatty acid ester, 15% epoxy resin, less than 5% polymeric flame retardant, less than 5% thixotropic agent, less than 1% organic pigment, Less than 3% of defoaming agent;
  • the electroless nickel plating process is performed on the traces of the surrounding areas of each small ITO glass, and then electroless gold plating is performed to strengthen the wiring.
  • the double-sided ITO glass is immersed in a standard acidic bath at a temperature of 23 ° C for 5 minutes and then washed with water for two minutes;
  • the double-sided ITO glass was placed in an etchant having an acid etchant of 25 g/L for immersion treatment at a temperature of 30 ° C for 5 minutes, and then washed with water for two minutes to finely roughen the surface of the ITO to improve the adhesion of the plating layer;
  • the double-sided ITO glass is placed in a metal bath with a metal stabilizer of lead, pH: 3, a temperature of 75 ° C, a low film stress, a test bath, and a plating bath requiring a thick coating, followed by water washing for two minutes;
  • the double-sided ITO glass subjected to the above steps was subjected to electroless gold plating in a low-etching type plating bath having a pH of 8 and a temperature of 75 °C.
  • the gold-plated protective film is printed on the visible region of the visible region with an ink that can withstand strong acid, high temperature, and Ni and Au metal particles.
  • the gold-plated protective film is by mass percentage, and its composition specifically includes : 65% vinyl acetate resin derivative, 20% fatty acid ester, 20% epoxy resin, less than 5% polymeric flame retardant, less than 5% thixotropic agent, less than 1% organic pigment, Less than 3% of defoaming agent;
  • the electroless nickel plating process is performed on the traces of the surrounding areas of each small ITO glass, and then electroless gold plating is performed to strengthen the wiring.
  • the double-sided ITO glass is immersed in a standard acidic bath at a temperature of 28 ° C for 5 minutes and then washed with water for two minutes;
  • the double-sided ITO glass was placed in an etching solution having an acid etchant of 50 g/L for immersion treatment at a temperature of 50 ° C for 5 minutes, and then washed with water for two minutes to finely roughen the surface of the ITO to improve the adhesion of the plating layer;
  • the glass substrate is placed in a metal-free stabilizer, pH: 10, temperature is 100 ° C, and the film stress is low.
  • the electroless gold plating is applied to the plating bath of the test product, and the stability of the plating bath is maintained by the sulfur-based additive, followed by washing. Two minutes;
  • the double-sided ITO glass subjected to the above steps was subjected to electroless gold plating in a substantially cyanide-free bath placed at pH: 10 and temperature: 100 °C.
  • RoHS is a mandatory standard enacted by EU legislation. Its full name is the Directive on Restricting the Use of Certain Hazardous Components in Electrical and Electronic Equipment.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacture Of Switches (AREA)
  • Position Input By Displaying (AREA)

Description

一种在电容式触摸屏表面进行化学镀金的方法 技术领域
本发明涉及电容式触摸屏表面镀金的技术领域，具体为一种在电容式触摸屏表面进行化学镀金的方法。
背景技术
为满足芯片对回路输入阻抗的限制，必须要降低电容式触控屏边缘走线部分的阻抗，通过化学镀金可以在边缘走线上形成一层导电性良好的金属膜。
现有的电容式触摸屏，采用电镀金的方法进行镀金，由于其在大片的ITO玻璃上面一般包括有很多小片的触控玻璃，故需要在大片ITO玻璃四周预留导电区，以便电镀时形成电极，同时单小片的触控玻璃 也需要单独和导电区形成回路，需要在各个单小片触控玻璃之间留有足够的间隙确保回路的行程，再经过电镀金在在ITO玻璃上形成金属膜，因为导电区的存在，降低了大片ITO玻璃实际使用率，同时，导电区上也会形成金属层，增加了镀金液的使用量，使得成本提高。
 技术问题
针对上述问题，本发明提供了一种在电容式触摸屏表面进行化学镀金的方法，其可以使ITO玻璃实际使用率得到提高、同时节约镀金液的使用，降低了成本。
技术解决方案
其技术方案是这样的：
其特征在于： 在电容式触摸屏玻璃基板的表面进行ITO溅镀后，使其成为双面ITO玻璃，所述双面ITO玻璃根据排版划分出触控玻璃的可视区域、四周区域，用照片工艺在每块触控玻璃的可视区域蚀刻出传感器感应电极、四周区域蚀刻出走线，之后在每块触控玻璃的可视区域印刷镀金保护膜，然后通过化学镀镍、化学镀金工艺对所述每块触控玻璃的走线进行镀金，所述镀金保护膜为可耐强酸、耐高温、 Ni和Au金属粒子不能附着的保护膜。
其进一步特征在于： 其具体工艺步骤如下：
（1）、在电容式触摸屏玻璃基板上进行双面的ITO溅镀，使其成为双面ITO玻璃，所述双面ITO玻璃根据排版划分出触控玻璃的可视区域、四周区域；
（2）、用照片工艺分别在每块触控玻璃的可视区域蚀刻出X和Y方向的传感器的感应电极，在四周区域分别蚀刻出X和Y方向的传感器的走线；
（3）、在每块触控玻璃的可视区域印刷镀金保护膜，所述镀金保护膜用可耐强酸、耐高温、Ni、Au金属粒子不能附着的油墨丝印在可视区感应电极上；
（4）、对双面ITO玻璃进行预处理后，然后对每块触控玻璃的四周区域的走线分别进行化学镀镍工艺后再进行化学镀金达到对配线的强化。
其更进一步特征在于：
所述镀金保护膜按质量百分比，其成分具体包括：55~65%的醋酸乙烯树脂衍生物、10~20%的脂肪酸脂、10~20%的环氧脂、少于5%的聚合阻燃剂、少于5%的触变剂、少于1%的有机颜料、少于3%的除泡剂；
所述照片工艺的具体步骤为：
采用光刻胶、保护膜通过照片工艺对双面ITO玻璃上所排布的每块触控玻璃蚀刻出X和Y方向的传感器的感应电极、走线；
所述对电容式T/P进行预处理的步骤具体为：
1.脱脂
双面ITO玻璃在标准酸性浴中进行浸渍处理，温度15～28℃，时间5分钟，然后两分钟水洗；
2.蚀刻
将双面ITO玻璃放入酸性蚀刻剂为10~50g/L或10~50mL/L蚀刻液中进行浸渍处理，温度10～50℃，时间5分钟，然后两分钟水洗，使得ITO表面细微粗化，提高镀层的密着性；
3.敏化
将双面ITO玻璃置于钯盐浓度：10~50mL/L、0.1mol/L KOH溶液浓度：1.5mL/L的溶液中进行浸渍处理，温度10～50℃，时间1~10分钟，之后两分钟水洗；
4、活化
将双面ITO玻璃置于活化剂浓度为： 10mL/L的溶液中进行浸渍处理，温度10～50℃，时间1~10分钟，之后两分钟水洗；
在精密布线基板上镀金的情况下，所述化学镀镍、化学镀金工艺具体为：将双面ITO玻璃置于金属稳定剂为铅、pH：1~5、温度为50~100℃、皮膜应力为±0的无钠镀浴中进行化学镀镍，之后将已经 化学镀镍的双面ITO玻璃经过两分钟水洗后，置于pH：1~5、温度：50~100℃的氰化物镀浴中进行化学镀金；
在加厚1μm以上镀金的情况下，所述化学镀镍、化学镀金工艺具体为：将双面ITO玻璃置于金属稳定剂为铅、pH：1~5、温度为50~100℃、皮膜应力低、适用于试做品以及需要镀膜加厚的镀浴中进行 化学镀镍，之后水洗两分钟，再将双面ITO玻璃置于pH：6~10、温度：50~100℃的低侵蚀型镀浴中进行化学镀金；
对应RoHS的情况下，所述化学镀镍、化学镀金工艺具体为：将双面ITO玻璃置于无金属稳定剂、pH：6~10、温度为50~100℃、皮膜应力低，适用于试做品的镀浴中进行化学镀金，通过硫磺系添加剂来 维持镀浴的稳定性，之后水洗两分钟，再将双面ITO玻璃置于pH：6~10、温度：50~100℃的基本无氰化物浴中进行化学镀金。
 有益效果
采用本发明的方法后，由于用照片工艺在每块触控玻璃的可视区域蚀刻出传感器感应电极、四周区域蚀刻出走线，之后在每块触控玻璃的可视区域印刷镀金保护膜，然后通过化学镀镍、化学镀金工艺对所述每块触控玻璃的走线进行镀金，所述镀金保护膜为可耐强酸、耐高温、 Ni 和 Au 金属粒子不能附着的保护膜，其可以完全消除导电区的存在，从而大大提高了 ITO 玻璃实际使用率，同时由于不存在导电区，故镀金液的使用量降低，使得成本得到降低。
附图说明
本发明的最佳实施方式
本发明的实施方式
具体实施例一：在精密布线基板上镀金
（ 1 ）、在容式触摸屏玻璃基板表面进行 ITO 溅镀后，其成为双面 ITO 玻璃，整个双面 ITO 玻璃即为触控玻璃，其被分为可视区域、四周区域两部分；
（ 2 ）、用照片工艺分别双面的可视区域蚀刻出 X 、 Y 方向的传感器的感应电极，在相对应的面的四周区域分别蚀刻出 X 、 Y 方向的传感器的走线；
（ 3 ）、在可视区域印刷镀金保护膜，镀金保护膜用可耐强酸、耐高温、 Ni 、 Au 金属粒子不能附着的油墨丝印在可视区感应电极上，镀金保护膜按质量百分比，其成分具体包括： 55% 的醋酸乙烯树脂衍生物、 10% 的脂肪酸脂、 10% 的环氧脂、少于 5% 的聚合阻燃剂、少于 5% 的触变剂、少于 1% 的有机颜料、少于 3% 的除泡剂；
（ 4 ）、对双面 ITO 玻璃进行预处理后，然后对四周区域的走线分别进行化学镀镍工艺后再进行化学镀金达到对配线的强化。
其具体步骤如下：
a 、脱脂
双面 ITO 玻璃在标准酸性浴中进行浸渍处理，温度 15 ℃，时间 5 分钟，然后两分钟水洗；
b 、蚀刻
将双面 ITO 玻璃放入酸性蚀刻剂为 10g/L 蚀刻液中进行浸渍处理，温度 10 ℃，时间 5 分钟，然后两分钟水洗，使得 ITO 表面细微粗化，提高镀层的密着性；
c 、敏化
将双面 ITO 玻璃置于钯盐浓度： 10mL/L 、 0.1mol/L KOH 溶液浓度： 1.5mL/L 的溶液中进行浸渍处理，温度 10 ℃，时间时间 1 分钟，之后两分钟水洗；
d 、活化
将双面 ITO 玻璃置于活化剂浓度为：10mL/L 的溶液中进行浸渍处理，温度 10 ℃，时间 1 分钟，之后两分钟水洗；
e 、化学镀镍
将双面 ITO 玻璃置于金属稳定剂为铅、 pH :1 、温度为 50 ℃、皮膜应力为± 0 的无钠镀浴中进行化学镀镍，之后将已经化学镀镍的玻璃基板经过两分钟水洗；
f 、化学镀金
将经上述步骤的双面 ITO 玻璃置于 pH ： 1 、温度： 50 ℃的氰化物镀浴中进行化学镀金。
具体实施例二：在加厚1μm以上镀金的情况
（1）、在容式触摸屏玻璃基板表面进行ITO溅镀后，其成为双面ITO玻璃，整个双面ITO玻璃排布有六块小的触控玻璃，每块小的ITO玻璃均包括可视区域、四周区域；
（2）、用照片工艺分别在每块小的ITO玻璃的双面的可视区域蚀刻出X、Y方向的传感器的感应电极，在其相对应的四周区域分别蚀刻出X、Y方向的传感器的走线；
（3）、在每块小的ITO玻璃的双面的可视区域印刷镀金保护膜，镀金保护膜用可耐强酸，耐高温，Ni、Au金属粒子不能附着的油墨丝印在可视区感应电极上，镀金保护膜按质量百分比，其成分具体包括 ：60%的醋酸乙烯树脂衍生物、15%的脂肪酸脂、15%的环氧脂、少于5%的聚合阻燃剂、少于5%的触变剂、少于1%的有机颜料、少于3%的除泡剂；
（4）、对电容式T/P进行预处理后，然后对每块小的ITO玻璃的四周区域的走线分别进行化学镀镍工艺后再进行化学镀金达到对配线的强化。
其具体步骤如下：
a、脱脂
双面ITO玻璃在标准酸性浴中进行浸渍处理，温度23℃，时间5分钟，然后两分钟水洗；
b、蚀刻
将双面ITO玻璃放入酸性蚀刻剂为25g/L的蚀刻液中进行浸渍处理，温度30℃，时间5分钟，然后两分钟水洗，使得ITO表面细微粗化，提高镀层的密着性；
c、敏化
将双面ITO玻璃置于钯盐浓度：30mL/L、0.1mol/L KOH溶液浓度：1.5mL/L的溶液中进行浸渍处理，温度30℃，时间5分钟，之后两分钟水洗；
d、活化
将双面ITO玻璃置于活化剂浓度为： 10mL/L的溶液中进行浸渍处理，温度30℃，时间5分钟，之后两分钟水洗；
e、化学镀镍
将双面ITO玻璃置于金属稳定剂为铅、pH：3、温度为75℃、皮膜应力低、适用于试做品以及需要镀膜加厚的镀浴中进行化学镀镍，之后水洗两分钟；
f、化学镀金
将经上述步骤的双面ITO玻璃置于pH：8、温度：75℃的低侵蚀型镀浴中进行化学镀金。
具体实施例三：对应RoHS的情况
（1）、在容式触摸屏玻璃基板表面进行ITO溅镀后，其成为双面ITO玻璃，整个双面ITO玻璃排布有十块小的触控玻璃，每块小的ITO玻璃均包括可视区域、四周区域；
（2）、用照片工艺分别在每块小的ITO玻璃的双面的可视区域蚀刻出X、Y方向的传感器的感应电极，在其相对应的四周区域分别蚀刻出X、Y方向的传感器的走线；
（3）、在每块小的ITO玻璃的双面的可视区域印刷镀金保护膜，镀金保护膜用可耐强酸、耐高温、Ni、Au金属粒子不能附着的油墨丝印在可视区感应电极上，镀金保护膜按质量百分比，其成分具体包括 ：65%的醋酸乙烯树脂衍生物、20%的脂肪酸脂、20%的环氧脂、少于5%的聚合阻燃剂、少于5%的触变剂、少于1%的有机颜料、少于3%的除泡剂；
（4）、对电容式T/P进行预处理后，然后对每块小的ITO玻璃的四周区域的走线分别进行化学镀镍工艺后再进行化学镀金达到对配线的强化。
其具体步骤如下：
a、脱脂
双面ITO玻璃在标准酸性浴中进行浸渍处理，温度28℃，时间5分钟，然后两分钟水洗；
b、蚀刻
将双面ITO玻璃放入酸性蚀刻剂为50g/L的蚀刻液中进行浸渍处理，温度50℃，时间5分钟，然后两分钟水洗，使得ITO表面细微粗化，提高镀层的密着性；
c、敏化
将双面ITO玻璃置于钯盐浓度： 50mL/L、0.1mol/L KOH溶液浓度：1.5mL/L的溶液中进行浸渍处理，温度50℃，时间时间10分钟，之后两分钟水洗；
d、活化
将双面ITO玻璃置于活化剂浓度为： 10mL/L的溶液中进行浸渍处理，温度50℃，时间10分钟，之后两分钟水洗；
e、化学镀镍
将玻璃基板置于无金属稳定剂、pH：10、温度为100℃、皮膜应力低，适用于试做品的镀浴中进行化学镀金，通过硫磺系添加剂来维持镀浴的稳定性，之后水洗两分钟；
f、化学镀金
将经上述步骤的双面ITO玻璃置于置于pH： 10、温度：100℃的基本无氰化物浴中进行化学镀金。
RoHS是由欧盟立法制定的一项强制性标准，它的全称是《关于限制在电子电器设备中使用某些有害成分的指令》。
 工业实用性
序列表自由内容

Claims (8)

  1. 一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：在电容式触摸屏玻璃基板的表面进行 ITO 溅镀后，使其成为双面 ITO 玻璃，所述双面 ITO 玻璃根据排版划分出触控玻璃的可视区域、四周区域，用照片工艺在每块触控玻璃的可视区域蚀刻出传感器感应电极、四周区域蚀刻出走线，之后在每块触控玻璃的可视区域印刷镀金保护膜，然后通过化学镀镍、化学镀金工艺对所述每块触控玻璃的走线进行镀金，所述镀金保护膜为可耐强酸、耐高温、 Ni 和 Au 金属粒子不能附着的保护膜。
  2. 根据权利要求 1 所述的一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：
    其具体工艺步骤如下：
    （ 1 ）、在电容式触摸屏玻璃基板上进行双面的 ITO 溅镀，使其成为双面 ITO 玻璃，所述双面 ITO 玻璃根据排版划分出触控玻璃的可视区域、四周区域；
    （ 2 ）、用照片工艺分别在每块触控玻璃的可视区域蚀刻出 X 和 Y 方向的传感器的感应电极，在四周区域分别蚀刻出 X 和 Y 方向的传感器的走线；
    （ 3 ）、在每块触控玻璃的可视区域印刷镀金保护膜，所述镀金保护膜用可耐强酸，耐高温， Ni 、 Au 金属粒子不能附着的油墨丝印在可视区感应电极上；
    （ 4 ）、对双面 ITO 玻璃进行预处理后，然后对每块触控玻璃的四周区域的走线分别进行化学镀镍工艺后再进行化学镀金达到对配线的强化。
  3. 根据权利要求 1 所述的一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：所述镀金保护膜按质量百分比，其成分具体包括： 55~65% 的醋酸乙烯树脂衍生物、 10~20% 的脂肪酸脂、 10~20% 的环氧脂、少于 5% 的聚合阻燃剂、少于 5% 的触变剂、少于 1% 的有机颜料、少于 3% 的除泡剂。
  4. 根据权利要求 2 所述的一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：
    所述照片工艺的具体步骤为： 采用光刻胶、保护膜通过照片工艺对双面 ITO 玻璃上所排布的每块触控玻璃蚀刻出 X 和 Y 方向的传感器的感应电极、走线。
  5. 根据权利要求 2 所述的一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：
    所述对电容式 T/P 进行预处理的步骤具体为：
    a. 脱脂
    双面 ITO 玻璃在标准酸性浴中进行浸渍处理，温度 15 ～ 28 ℃，时间 5 分钟，然后两分钟水洗；
    b. 蚀刻
    将双面 ITO 玻璃放入酸性蚀刻剂为 10~50g/L 或 10~50mL/L 蚀刻液中进行浸渍处理，温度 10 ～ 50 ℃，时间 5 分钟，然后两分钟水洗，使得 ITO 表面细微粗化，提高镀层的密着性；
    c. 敏化
    将双面 ITO 玻璃置于钯盐浓度： 10~50mL/L 、 0.1mol/L KOH 溶液浓度： 1.5mL/L 的溶液中进行浸渍处理，温度 10 ～ 50 ℃，时间 1~10 分钟，之后两分钟水洗；
    d 、活化
    将双面 ITO 玻璃置于活化剂浓度为： 10mL/L 的溶液中进行浸渍处理，温度 10 ～ 50 ℃，时间 1~10 分钟，之后两分钟水洗。
  6. 根据权利要求 2 所述的一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：在精密布线基板上镀金的情况下，所述化学镀镍、化学镀金工艺具体为：将双面 ITO 玻璃置于金属稳定剂为铅、 pH ： 1~5 、温度为 50~100 ℃、皮膜应力为± 0 的无钠镀浴中进行化学镀镍，之后将已经化学镀镍的双面 ITO 玻璃经过两分钟水洗后，置于 pH ： 1~5 、温度： 50~100 ℃的氰化物镀浴中进行化学镀金。
  7. 根据权利要求2所述的一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：在加厚1μm以上镀金的情况下，所述化学镀镍、化学镀金工艺具体为：将双面ITO玻璃置于金属稳定剂为铅、pH：1~5、温度为50~100℃、皮膜应力低、适用于试做品以及需要镀膜加厚的镀浴中进行化学镀镍，之后水洗两分钟，再将双面ITO玻璃置于pH：6~10、温度：50~100℃的低侵蚀型镀浴中进行化学镀金。
  8. 根据权利要求2所述的一种在电容式触摸屏表面进行化学镀金的方法，其特征在于：对应RoHS的情况下，所述化学镀镍、化学镀金工艺具体为：将双面ITO玻璃置于无金属稳定剂、pH：6~10、温度为50~100℃、皮膜应力低，适用于试做品的镀浴中进行化学镀金，通过硫磺系添加剂来维持镀浴的稳定性，之后水洗两分钟，再将双面ITO玻璃置于pH：6~10、温度：50~100℃的基本无氰化物浴中进行化学镀金。
PCT/CN2011/074833 2010-06-01 2011-05-28 一种在电容式触摸屏表面进行化学镀金的方法 WO2011150781A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020127032973A KR101513344B1 (ko) 2010-06-01 2011-05-28 정전용량 방식의 터치스크린 표면에 화학도금을 진행하는 방법
US13/701,496 US20130082026A1 (en) 2010-06-01 2011-05-28 Method for chemically plating metal on surface of capacitive touch panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010188452.9 2010-06-01
CN2010101884529A CN101845625B (zh) 2010-06-01 2010-06-01 一种在电容式触摸屏表面进行化学镀金的方法

Publications (1)

Publication Number Publication Date
WO2011150781A1 true WO2011150781A1 (zh) 2011-12-08

Family

ID=42770441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/074833 WO2011150781A1 (zh) 2010-06-01 2011-05-28 一种在电容式触摸屏表面进行化学镀金的方法

Country Status (4)

Country Link
US (1) US20130082026A1 (zh)
KR (1) KR101513344B1 (zh)
CN (1) CN101845625B (zh)
WO (1) WO2011150781A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103425372A (zh) * 2013-07-25 2013-12-04 浙江金指科技有限公司 一种电容式触摸屏金属刻蚀工艺
CN106325629A (zh) * 2015-07-06 2017-01-11 湖州胜僖电子科技有限公司 一种优化化学镀金析出的ito走线设计方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101845625B (zh) * 2010-06-01 2012-03-21 无锡阿尔法电子科技有限公司 一种在电容式触摸屏表面进行化学镀金的方法
CN102455807A (zh) * 2010-10-19 2012-05-16 睿明科技股份有限公司 触控面板的低阻抗电控线路及其制造方法
CN102176194B (zh) * 2011-03-18 2014-06-25 深圳南玻显示器件科技有限公司 金属引线电极的加工方法
CN102207806B (zh) * 2011-05-31 2012-12-26 无锡阿尔法电子科技有限公司 一种在电容式触摸屏上均匀化学镀金ito走线的方法
CN102214042A (zh) * 2011-06-07 2011-10-12 南京福莱克斯光电科技有限公司 基于电荷转移的传感器结构制作方法
CN102200654A (zh) * 2011-06-07 2011-09-28 南京福莱克斯光电科技有限公司 一体化触摸显示装置及其制作方法
CN102289315A (zh) * 2011-06-07 2011-12-21 南京福莱克斯光电科技有限公司 基于电荷转移的传感器结构
CN103132057A (zh) * 2011-11-24 2013-06-05 睿明科技股份有限公司 触控面板的低阻抗电控线路及其制造方法
CN102915165A (zh) * 2012-09-26 2013-02-06 深圳市雅视科技有限公司 一种触摸屏双面ito刻蚀方法
KR101663854B1 (ko) * 2012-12-21 2016-10-07 (주)인터플렉스 무전해도금을 이용한 터치패널 형성 방법
CN104281337B (zh) * 2013-07-03 2017-11-03 湖南点燃科技有限公司 电容屏边缘走线镀金属方法及电容屏
CN104281338A (zh) * 2013-07-03 2015-01-14 向火平 Ogs制作工艺及单层电容式触摸面板
CN103436869B (zh) * 2013-08-13 2016-03-09 中国地质大学（武汉） 一种在玻璃容器内壁获得纳米金镀层的方法
CN103882492B (zh) * 2014-02-24 2016-08-24 哈尔滨工程大学 金属基体化学镀前处理方法
CN106775151A (zh) * 2016-12-12 2017-05-31 晟光科技股份有限公司 电容触摸屏玻璃传感器中替换钼铝钼金属膜层的加工工艺
CN107313036A (zh) * 2017-06-19 2017-11-03 合肥市惠科精密模具有限公司 一种在电容式触摸屏表面进行化学镀钼的方法
CN108389936A (zh) * 2018-04-10 2018-08-10 苏州太阳井新能源有限公司 一种太阳能电池上tco导电材料的表面处理方法
CN109158590B (zh) * 2018-09-29 2020-11-24 淮阴师范学院 一维棒状核壳结构的复合金粉的制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56152958A (en) * 1980-04-30 1981-11-26 Mitsubishi Electric Corp Electroless gold plating solution
CN1802451A (zh) * 2003-06-05 2006-07-12 株式会社日矿材料 无电镀金液
CN1896308A (zh) * 2005-07-11 2007-01-17 佛山市顺德区汉达精密电子科技有限公司 化学镀镍镀液及工艺
CN1912180A (zh) * 2005-08-11 2007-02-14 中国船舶重工集团公司第七二五研究所 化学镀镍磷合金镀层的制备方法
CN101634021A (zh) * 2008-07-24 2010-01-27 罗门哈斯电子材料有限公司 无电镀金液
CN101706703A (zh) * 2009-11-24 2010-05-12 无锡阿尔法电子科技有限公司 一种电容式触摸屏四边边缘金属膜的制作方法
CN101845625A (zh) * 2010-06-01 2010-09-29 无锡阿尔法电子科技有限公司 一种在电容式触摸屏表面进行化学镀金的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830760B2 (ja) * 1980-10-09 1983-07-01 株式会社日立製作所 プリント回路板の製法
US5100714A (en) * 1986-07-24 1992-03-31 Ceramic Packaging, Inc. Metallized ceramic substrate and method therefor
JPH0756336A (ja) * 1993-06-07 1995-03-03 Ajinomoto Co Inc 樹脂組成物
US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
US5944879A (en) * 1997-02-19 1999-08-31 Elf Atochem North America, Inc. Nickel hypophosphite solutions containing increased nickel concentration
JP2000297380A (ja) * 1999-04-14 2000-10-24 Yamato Denki Kogyo Kk ガラスセラミック基板への無電解めっき方法
US20050260338A1 (en) * 2004-05-19 2005-11-24 Trendon Touch Technology Corp. Method of manufacturing circuit layout on touch panel by utilizing metal plating technology
US8026903B2 (en) * 2007-01-03 2011-09-27 Apple Inc. Double-sided touch sensitive panel and flex circuit bonding
KR100826360B1 (ko) * 2007-04-18 2008-05-02 삼성전기주식회사 반도체 패키지용 인쇄회로기판의 제조방법
KR101172112B1 (ko) * 2008-11-14 2012-08-10 엘지이노텍 주식회사 터치 스크린 및 그 제조방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56152958A (en) * 1980-04-30 1981-11-26 Mitsubishi Electric Corp Electroless gold plating solution
CN1802451A (zh) * 2003-06-05 2006-07-12 株式会社日矿材料 无电镀金液
CN1896308A (zh) * 2005-07-11 2007-01-17 佛山市顺德区汉达精密电子科技有限公司 化学镀镍镀液及工艺
CN1912180A (zh) * 2005-08-11 2007-02-14 中国船舶重工集团公司第七二五研究所 化学镀镍磷合金镀层的制备方法
CN101634021A (zh) * 2008-07-24 2010-01-27 罗门哈斯电子材料有限公司 无电镀金液
CN101706703A (zh) * 2009-11-24 2010-05-12 无锡阿尔法电子科技有限公司 一种电容式触摸屏四边边缘金属膜的制作方法
CN101845625A (zh) * 2010-06-01 2010-09-29 无锡阿尔法电子科技有限公司 一种在电容式触摸屏表面进行化学镀金的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103425372A (zh) * 2013-07-25 2013-12-04 浙江金指科技有限公司 一种电容式触摸屏金属刻蚀工艺
CN106325629A (zh) * 2015-07-06 2017-01-11 湖州胜僖电子科技有限公司 一种优化化学镀金析出的ito走线设计方法
CN106325629B (zh) * 2015-07-06 2024-01-02 湖州胜僖电子科技有限公司 一种优化化学镀金析出的ito走线设计方法

Also Published As

Publication number Publication date
KR20130032317A (ko) 2013-04-01
CN101845625B (zh) 2012-03-21
US20130082026A1 (en) 2013-04-04
KR101513344B1 (ko) 2015-04-17
CN101845625A (zh) 2010-09-29

Similar Documents

Publication Publication Date Title
WO2011150781A1 (zh) 一种在电容式触摸屏表面进行化学镀金的方法
TWI247567B (en) Method for fabricating a double-sided wiring glass substrate
WO2009145492A2 (ko) 마그네트론 스퍼터링에 의한 후막제조방법
CN1195395C (zh) 积层板用铜合金箔
KR101468074B1 (ko) 직접 도금에 의한 도전성 박막소재 및 이의 제조방법
WO2015008952A1 (ko) 무전해 니켈 도금액, 이를 이용한 무전해 니켈 도금 방법, 및 이를 이용하여 제조된 연성 니켈 도금층
KR20070088611A (ko) 무전해도금 전처리제 및 플렉시블 기판용 동장 적층체
JPH0126069B2 (zh)
WO2017016395A1 (zh) 一种聚酰亚胺无胶柔性印刷线路板的制备方法
WO2013059980A1 (zh) 电路板化学镀镍金工艺
CN107112311B (zh) 用于主动组件的电磁屏蔽和热管理的方法
CN1222042C (zh) 金属互接件以及采用金属互接件的有源矩阵基底
CN101706703B (zh) 一种电容式触摸屏四边边缘金属膜的制作方法
NL8002375A (nl) Werkwijze voor de vervaardiging van gedrukte bedra- dingen.
KR101619109B1 (ko) 바이오센서 전극 스트립 및 이의 제조방법
TWI686361B (zh) 附膜玻璃板之製造方法
TW451226B (en) Method for fabricating metal wirings
CN1865500A (zh) 一种在硅片上化学镀铜的方法
WO2018124807A1 (ko) 레이저 직접 구조화 공정용 열가소성 수지 조성물 및 이로부터 제조된 성형품
CN104427778A (zh) 印制电路板镀金方法
KR101681663B1 (ko) 전도성 패턴 적층체 및 이의 제조방법
JP4300890B2 (ja) 多層配線板の製造方法
WO2023214857A1 (ko) 도전성 중공형 금속 입자 및 그 제조 방법
WO2018043897A1 (ko) 반도체 패키지 리플로우 공정용 폴리이미드 필름 및 그 제조 방법
JPS58217693A (ja) 微小部分銀メツキ処理物及びそのメツキ方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11789160

Country of ref document: EP

Kind code of ref document: A1

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 13701496

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20127032973

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 11789160

Country of ref document: EP

Kind code of ref document: A1