WO2011087117A1 - Dissipateur de chaleur - Google Patents

Dissipateur de chaleur Download PDF

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Publication number
WO2011087117A1
WO2011087117A1 PCT/JP2011/050633 JP2011050633W WO2011087117A1 WO 2011087117 A1 WO2011087117 A1 WO 2011087117A1 JP 2011050633 W JP2011050633 W JP 2011050633W WO 2011087117 A1 WO2011087117 A1 WO 2011087117A1
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WO
WIPO (PCT)
Prior art keywords
heat
fins
thin plate
heat sink
thin
Prior art date
Application number
PCT/JP2011/050633
Other languages
English (en)
Japanese (ja)
Inventor
真一 古本
伊藤　信一
川畑　賢也
Original Assignee
古河電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to CN2011800025535A priority Critical patent/CN102473696A/zh
Priority to JP2011550030A priority patent/JP5228115B2/ja
Publication of WO2011087117A1 publication Critical patent/WO2011087117A1/fr
Priority to US13/340,738 priority patent/US20120097372A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink used for cooling a component to be cooled in an electronic device, for example, a heat generating component such as a CPU or MPU.
  • Cooling of heat-generating parts such as CPUs and MPUs with higher performance is always an important technical issue. Furthermore, in electrical and electronic devices other than computers, cooling of heat-generating components and heat-generating elements that improve performance occupies a significant weight as an important issue in the demand for space saving in electrical and electronic devices. .
  • a method for cooling electronic components mounted on electric / electronic devices for example, there is a method in which a fan is attached to the device, the fan is rotated electrically, and the temperature of the air in the device casing is lowered by cooling air. Furthermore, a method of directly cooling a cooled component by attaching a cooling body to the cooled component without using a fan is known.
  • a plate material made of a material having excellent heat conductivity such as a copper material or an aluminum material is often used as a cooling body attached to such a component to be cooled. Furthermore, various heat pipes and the like are often applied as the cooling body. Specifically, a heat sink composed of a base plate that is thermally connected to the heat-generating component and thin plate fins that are thermally connected to the base plate is used, and a heat sink and various heat pipes are used in combination. .
  • a space serving as a flow path for the working fluid is provided inside the heat pipe, and the working fluid accommodated in the space undergoes a phase change or movement such as evaporation or condensation, thereby transferring heat. That is, on the heat absorption side of the heat pipe, the working fluid evaporates due to the heat generated by the parts to be cooled that are conducted through the material of the container constituting the heat pipe, and the vapor moves to the heat radiation side of the heat pipe. To do. On the heat radiating side, the working fluid vapor is cooled and returned to the liquid phase again. The working fluid that has returned to the liquid phase in this way moves (refluxs) again to the heat absorption side. Heat is transferred by such phase transformation and movement of the working fluid.
  • the size of the thin plate fins is large in order to improve heat dissipation from the fins, making it difficult to reduce the size of the heat sink become.
  • a space for attaching the fan is required, and it is difficult to arrange the fan in a thin casing that saves space.
  • the fan is enlarged or the rotational speed is increased in order to bring out the fan performance, there is a problem that sound and vibration for driving the fan increase.
  • an object of the present invention is to provide a heat sink that can improve the heat dissipation performance and can reduce the size of the fins to save space.
  • At least one heat pipe is provided to extend along the longitudinal direction of the plate-like fin, and is sandwiched between the first plate material and the second plate material, and is thermally connected thereto. Has been. However, heat dissipation for cooling heat-generating components such as CPUs and MPUs with higher performance has not been sufficient.
  • Patent Document 2 conventionally, when trying to insert a hate sink from the base surface into the fin portion, it is difficult to place the fin in the heat pipe bending R portion, and the degree of freedom in design is limited.
  • the inventor has intensively studied to solve the conventional problems. As a result, two types of thin plate fins with different heights are used, a low thin plate fin is disposed at the main portion, a high thin fin is disposed at the end, and the thin fin is thermally connected to the heat pipe, and further, It has been found that if a part of the heat pipe is inserted into a high thin fin portion, the heat dissipation from the fin can be improved even if the fin size is reduced in general.
  • the fin can be brought into contact with the entire length of the heat pipe, and the heat transferred from the heat generating component to the heat pipe is transferred to the low thin fin through the upper plate, and is radiated from the thin fin, and at the same time, inserted into the high thin fin.
  • the heat pipe can efficiently dissipate heat from the thin fins.
  • a first aspect of the heat sink according to the present invention includes a base plate thermally connected to a heat generating component on one surface, or a base plate thermally connected to a first radiating fin portion made of a thin plate fin, and one surface. Between the upper plate to which the second radiating fin portion composed of two types of thin plate fins having different heights is thermally connected, and between the other surface of the base plate and the other surface of the upper plate.
  • a heat sink including a plurality of heat pipes including a heat pipe that is connected and arranged and at least a part of which is inserted into a part of the second radiation fin part.
  • the second radiating fin portion is adjacent to the plurality of low thin plate fins arranged perpendicular to the one surface of the upper plate, and the plurality of low thin plate fins.
  • the heat sink is composed of a plurality of vertically arranged thin thin fins.
  • the second heat dissipating fin portion includes a plurality of low thin plate fins arranged perpendicular to the one surface of the upper plate and one of the plurality of low thin fins.
  • a heat sink comprising a plurality of thin plate fins arranged horizontally on an end portion.
  • the first radiating fin portion includes a plurality of thin plate fins arranged perpendicular to a portion on the one surface of the base plate corresponding to the plurality of high thin plate fins. It is the heat sink characterized by becoming.
  • the plurality of heat pipes are at least partially made of flat heat pipes, arranged in parallel at a central portion, and at one end at both longitudinal ends of the upper plate.
  • the heat sink is characterized in that the portion is disposed so as to expand toward both outer sides of the upper plate.
  • the heat pipe inserted into a part of the second radiating fin portion includes any one heat pipe disposed at both ends, and the plurality of the heat pipes disposed vertically. It is a heat sink characterized by inserting a thin plate fin having a large height from one side to the other side.
  • the heat pipe inserted into a part of the second heat radiating fin portion includes heat pipes arranged at both ends, and a plurality of thin plate fins arranged in the horizontal direction.
  • the heat sink of the present invention two types of thin plate fins having different heights are used, the two types of thin plate fins having different heights are adjacent to each other, a thin plate fin at the main force portion, and a thin plate at the end portion. If the fins are placed and thermally connected to the heat pipes throughout the thin fins, and a part of the heat pipe is inserted into the higher thin fins, The heat dissipation can be improved. Furthermore, the heat dissipation is improved by thin plate fins thermally connected to the surface of the base plate where the heat generating components are located.
  • FIG. 1 is a perspective view for explaining one embodiment of the heat sink of the present invention.
  • FIG. 2 is a view showing the back surface of the heat sink of the embodiment shown in FIG.
  • FIG. 3 is a top view of the heat sink of the present invention.
  • FIG. 4 is a rear view of the heat sink of the present invention as seen from the high thin plate fin (B) side.
  • FIG. 7 is a perspective view for explaining another embodiment of the heat sink of the present invention.
  • FIG. 8 is a view showing the back surface of the heat sink of the embodiment shown in FIG.
  • FIG. 9 is a top view of the heat sink of the present invention.
  • FIG. 1 is a perspective view for explaining one embodiment of the heat sink of the present invention.
  • FIG. 2 is a view showing the back surface of the heat sink of the embodiment shown in FIG.
  • FIG. 3 is a top view of the heat sink of the
  • FIG. 10 is a rear view of the heat sink according to the present invention as viewed from the side of the plurality of laminated thin plate fins (D) in contact with the upper surface of the low thin plate fin (E).
  • FIG. 11 is a side view of the heat sink.
  • FIG. 12 is a cross-sectional view schematically showing an example in which thin plate fins are joined to a base plate or an upper plate.
  • the heat sink of this invention is demonstrated referring drawings.
  • One aspect of the heat sink of the present invention includes a base plate thermally connected to one surface with a heat-generating component and thermally connected to a first heat radiating fin portion made of a thin plate fin, and having a height on one surface.
  • the upper radiating fin portion composed of two different types of thin plate fins is thermally connected between the upper plate thermally connected, and the other surface of the base plate and the other surface of the upper plate,
  • the first radiating fins are preferably connected to the base plate, but may not be connected. When connecting, it can be connected to the whole or part of the base plate excluding the part in contact with the heat generating component.
  • FIG. 1 is a perspective view for explaining one embodiment of the heat sink of the present invention.
  • the second heat dissipating fin portion composed of two types of thin plate fins having different heights includes a plurality of low thin plate fins (A) arranged perpendicular to one surface of the upper plate, and a plurality of low thin plate fins. It consists of a plurality of high thin fins (B) arranged adjacent to each other vertically.
  • the first radiating fin 7 (details will be described later) is heated on the same side as the heat generating component on the base plate 2 (lower side in the drawing) thermally connected to the heat generating component.
  • the upper plate 3 is disposed on the opposite side of the base plate 2 so as to sandwich the plurality of heat pipes 8.
  • the second heat radiating fin portion 5 is arranged thermally connected.
  • the second heat radiating fin portion 5 is composed of two types of thin plate fins having different heights including a plurality of parallel low thin plate fins (A) and a plurality of parallel high thin plate fins (B). In this aspect, both the low thin plate fin (A) and the high thin plate fin (B) are arranged perpendicular to the upper surface of the upper plate.
  • the second heat dissipating fin portion 5 has a plurality of low thin fins (A) arranged vertically over substantially the entire upper plate 3 except for one end portion, and a plurality of low thin plate fins (A) are disposed on one end portion of the upper plate 3.
  • High thin fins (B) are arranged vertically.
  • Adjacent to the plurality of low thin plate fins (A), a plurality of high thin plate fins (B) having a large area are provided to enhance the heat dissipation performance of the heat sink.
  • FIG. 2 is a view showing the back surface of the heat sink in the embodiment shown in FIG. The arrangement of the heat pipe will be described with reference to FIG.
  • the above-described first radiating fin portion 7 is thermally connected to one end portion of the base plate 2 that is thermally connected to the heat generating component 10.
  • the first radiating fin portion 7 is composed of a plurality of parallel thin plate fins (C) that are thermally connected perpendicularly to the surface of the base plate 2 on the side where the heat generating components are located.
  • the thin plate fin (C) is disposed at an end portion on the side corresponding to the high thin plate fin (B) of the second radiating fin portion 5.
  • the radiating fins 7 are preferably arranged at the end of the second radiating fin portion 5 on the side corresponding to the high thin fin (B), but the area can be increased or not arranged.
  • FIG. 2 shows an example of arrangement of a plurality of heat pipes by dotted lines.
  • a plurality of heat pipes 8, and central heat pipes 8-3 and 8-4 are arranged substantially straight along the longitudinal direction of the heat sink 1, and at one end thereof, respectively, The heat sink 1 is bent toward both outer sides.
  • each of the heat pipes 8-1 to 8-4 has a thin tubular thin structure in which a working fluid is sealed, and comes into contact with the base plate 2 and the upper plate 3 in a large upper and lower area.
  • the arrangement is as follows.
  • the cross-sectional shape of the heat pipe is a thin rectangular shape between the base plate and the upper plate.
  • the cross-sectional shape of the heat pipe can be appropriately changed depending on the arrangement location.
  • the portion penetrating the thin fin can be appropriately changed in accordance with the desired function and environment, such as a tubular member having a circular cross section or a wide shape in order to increase the contact area.
  • the heat pipes 8-1, 8-2 on both sides are arranged in a straight line with the central part in the longitudinal direction substantially parallel to the other heat pipes, and one end is bent toward both outer sides of the heat sink 1. ing. At the other end (that is, the end where the thin plate fin (C) is arranged), one outer heat pipe 8-1 is bent toward the outside of the heat sink, and the other heat pipe 8- 2 is bent toward the outside of the heat sink and then rises upward, and is inserted so as to penetrate a plurality of high thin fins (B) laterally. In the aspect shown in FIG. 2, the front-end
  • Each of the plurality of heat pipes 8 is flat except for a part thereof, the width is compressed, the contact area with the base plate 2 and the upper plate 3 is increased, and heat transfer is facilitated.
  • At least one of the plurality of heat pipes 8 penetrates the plurality of thin thin plate fins (B) having a large area in the lateral direction, so that heat is applied from the heat pipe 8 to the plurality of thin plate fins (B). introduce. It is desirable that the heat pipe 8 and the high thin fin (B) are in contact with each other over as wide an area as possible and have a low thermal resistance. Therefore, for example, the through holes of the thin plate fins can be burned and further connected by soldering and brazing. Thus, the heat dissipation performance of the radiation fin is enhanced by thermally connecting the heat pipe 8 and the high thin plate fin (B).
  • the heat of the heat generating component 10 is transmitted to the plurality of heat pipes 8-1, 8-2, 8-3, 8-4 through the base plate, and further transmitted to the upper plate 3 to promote heat dissipation.
  • the heat pipe 8-2 penetrates the high thin fin (B) is shown, but if necessary, a plurality of heat pipes 8 may be configured to penetrate. Also good.
  • the heat pipes 8 having the curved portions are radiated through the plurality of low thin plate fins (A) arranged perpendicularly to the upper surface of the upper plate 3 and thermally connected. Furthermore, the end part of at least one heat pipe of the plurality of heat pipes 8 is inserted through a plurality of high thin fins (B) having high heat dissipation performance in the lateral direction to further enhance the heat dissipation performance of the fins. Therefore, in the heat sink of this invention, the heat dissipation performance of the fin can be enhanced while reducing the size of the fin.
  • the thin plate fin is processed into a U shape from the hole or the end of the fin, and the heat pipe is inserted. The hole may be burned. After passing through the fins, it can be connected with solder, brazing or the like as required.
  • FIG. 3 is a top view of the heat sink of the present invention.
  • a plurality of low thin plate fins (A) are vertically arranged on the upper surface of the upper plate except for one end portion. Further, at one end, a plurality of high thin plate fins (B) having a large area are disposed adjacent to the low thin plate fins (A).
  • a fixing portion 6 to which the upper plate 3 and the base plate 2 are fixed is provided on a part of both outer sides of the heat sink so as to sandwich a plurality of heat pipes 8.
  • FIG. 4 is a rear view of the heat sink of the present invention as seen from the high thin fin (B).
  • end portions 9 of one heat pipe of the plurality of heat pipes 8 disposed between the base plate 2 and the upper plate 3 rise upward, and a plurality of high thin fins (B) are laterally moved. It is inserted in the direction.
  • the thin plate fin (C) is arrange
  • FIG. 5 is a side view of the heat sink. 6 is a side view seen from the opposite side to FIG.
  • a plurality of parallel thin plate fins (C) which are the first heat radiating fin portions 7, are arranged vertically on the end portion of the base plate 2 that is thermally connected to the heat-generating component.
  • the high thin plate fin (B) is provided at the end on the side corresponding to the thin plate fin (C).
  • the base plate 2 and the upper plate 3 are fixed by a fixing portion 6 with a plurality of heat pipes 8 sandwiched therebetween.
  • the end 9 of at least one heat pipe of the plurality of heat pipes 8 rises upward, and the high thin plate fin (B) of the second radiating fin portion 5 is inserted in the lateral direction.
  • the heat radiating fins are formed of low thin fins, the fins are miniaturized, high thin fins with a large area are arranged at the ends, and a part of the heat pipe is inserted horizontally. The heat dissipation performance of the fins is improved.
  • FIG. 7 is a perspective view for explaining another embodiment of the heat sink of the present invention.
  • the second heat dissipating fin portion composed of two types of thin plate fins having different heights includes a plurality of low thin plate fins arranged perpendicular to one surface of the upper plate and one end of the plurality of low thin plate fins. And a plurality of thin plate fins arranged in a horizontal direction on the portion.
  • the first radiating fins 7 are thermally connected to the base plate 2 (lower side in the figure) that is thermally connected to the heat generating component on the same side as the heat generating component. .
  • the upper plate 3 is disposed so as to sandwich the plurality of heat pipes 8.
  • the second heat radiating fin portion 5 is arranged thermally connected.
  • the second heat dissipating fin portion 5 is horizontally stacked on one end portion of the plurality of parallel low thin plate fins (E) and the plurality of low thin plate fins disposed vertically on the entire upper surface of the upper plate 3. It consists of a plurality of thin plate fins (D).
  • the low thin plate fins (E) are arranged perpendicular to the upper surface of the upper plate 3, and the laminated thin plate fins (D) are arranged so as to be laminated upward in parallel to the upper surface of the upper plate 3. Has been.
  • the second heat dissipating fin portion 5 has a plurality of low thin plate fins (E) arranged vertically over substantially the entire upper plate 3, and a plurality of laminated layers on the upper surface of the end portions of the plurality of low thin plate fins (E).
  • the thin plate fins (D) are arranged in parallel with the upper plate.
  • a plurality of laminated thin plate fins (D) having a large area are provided in contact with the upper surface of one end of the plurality of low thin plate fins (E) to enhance the heat dissipation performance of the heat sink.
  • FIG. 8 is a view showing the back surface of the heat sink in the embodiment shown in FIG. The arrangement of the heat pipe will be described with reference to FIG.
  • the above-described first heat radiating fin portion 7 is thermally connected to one end portion of the base plate 2 that is thermally connected to the heat generating component 10.
  • the first radiating fin portion 7 is composed of a plurality of parallel thin plate fins (C) that are thermally connected perpendicularly to the surface of the base plate 2 on the side where the heat generating components are located.
  • the thin plate fin (C) is disposed at an end portion on the side corresponding to the laminated thin plate fin (D) of the second heat radiation fin portion 5. If the radiating fins 7 do not contact the heat-generating components, the area can be increased or the radiating fins 7 can be omitted.
  • a plurality of heat pipes 8 are arranged so as to be sandwiched between the upper plate 3 and the base plate 2. As shown by the dotted lines in FIG. 8, the plurality of heat pipes 8 are arranged such that the central heat pipes 8-3 and 8-4 are arranged substantially straight along the longitudinal direction of the heat sink, and at one end thereof, Each of them is bent toward both outer sides of the heat sink 1.
  • the heat pipes 8-1, 8-2 on both sides are arranged in a straight line with the central part in the longitudinal direction substantially parallel to the other heat pipes 8-3, 8-4, and one end is on each outer side of the heat sink 1. It is arranged to bend toward. At the other end (that is, the end where the thin plate fin (C) is disposed), the end 9-1 of the heat pipe 8-1 rises upward, and a plurality of stacked thin plate fins (D) are placed. It is inserted through the vertical direction. Similarly, the end portion 9-2 of the heat pipe 8-2 rises upward and is arranged by inserting a plurality of laminated thin plate fins (D) in the vertical direction.
  • Each of the plurality of heat pipes 8 is flat except for a part (end portions 9-1 and 9-2), the width is compressed, the contact area with the base plate 2 and the upper plate 3 is increased, and heat transfer is performed. Has become easier.
  • At least two ends of a plurality of heat pipes are inserted through a plurality of laminated thin plate fins (D) in the vertical direction, thereby improving the heat dissipation performance of the heat dissipation fins. That is, the heat of the heat generating component 10 is transmitted to the plurality of heat pipes 8-1, 8-2, 8-3 and 8-4 through the base plate and further transmitted to the upper plate 3.
  • heat is transmitted through the plurality of low thin plate fins (E) arranged perpendicularly to the upper surface of the upper plate 3 and thermally connected by the plurality of heat pipes 8 having the curved portions.
  • the end portions 9-1 and 9-2 of at least two heat pipes 8-1 and 8-2 of the plurality of heat pipes 8 vertically extend the plurality of laminated thin plate fins (D) having high heat dissipation performance.
  • the fins are further improved in heat dissipation performance. Therefore, in the heat sink of this invention, the heat dissipation performance of the fin can be enhanced while reducing the size of the fin.
  • FIG. 9 is a top view of the heat sink of the present invention.
  • a plurality of low thin plate fins (E) are vertically arranged on the upper surface of the upper plate 3 as a whole.
  • a plurality of laminated thin plate fins (D) are disposed at one end of the upper surface of the low thin plate fin (E) in contact with the upper surface of the low thin plate fin (E).
  • a fixing portion 6 to which the upper plate 3 and the base plate 2 are fixed is provided in a part on both outer sides of the heat sink 1 so as to sandwich a plurality of heat pipes 8.
  • FIG. 10 is a rear view of the heat sink of the present invention, as viewed from the side of a plurality of laminated thin plate fins (D) in contact with the upper surface of the low thin plate fin (E).
  • the end portions 9-1 and 9-2 of the two heat pipes 8-1 and 8-2 of the plurality of heat pipes 8 sandwiched between the base plate 2 and the upper plate 3 are located upward.
  • the plurality of laminated thin plate fins (D) are inserted in the vertical direction.
  • the thin plate fin (C) is arrange
  • a hole is formed in the thin fin (D) for insertion in the vertical direction, and this hole may be burned. After passing through the fins, it can be connected with solder, brazing or the like as required.
  • FIG. 11 is a side view of the heat sink.
  • a plurality of parallel thin plate fins (C), which are first radiating fin portions 7, are arranged vertically on the end portion of the base plate 2 that is thermally connected to the heat-generating component.
  • low thin fins (E) and laminated thin fins (D), which are the second radiation fin portions 5, are arranged on the upper surface of the upper plate 3.
  • the laminated thin plate fins (D) are provided in contact with the upper end surfaces of the low thin plate fins (E) at the end corresponding to the thin plate fins (C).
  • the base plate 2 and the upper plate 3 are fixed by a fixing portion 6 with a plurality of heat pipes 8 sandwiched therebetween.
  • FIG. 12 is a cross-sectional view illustrating a shape in which the thin fins of the heat sink of the present invention are joined to a base plate, an upper plate, or the like.
  • the thin plate fin can take various shapes so as to match the location of the heat sink, the space where it can be placed, and other conditions. Various shapes of thin fins can be freely combined.
  • FIG. 12 the shape of connecting the thin plate fins C when the thin plate fin portions 7 are provided on the base plate 2 is illustrated.
  • the present invention is also applicable to the case where the thin plate fins A and B are connected to the upper plate 3.
  • thin fins having a U-shaped cross section composed of a bottom surface, a vertical surface, and an upper surface are arranged in parallel in the horizontal direction to form a heat radiation fin portion.
  • a plurality of bottom surfaces are arranged in parallel to form a flat heat receiving surface, and the base plate 2 is thermally connected to the flat heat receiving surface.
  • the upper surface on which the plurality of heat dissipating fins are arranged in parallel also forms a flat surface.
  • various known techniques other than soldering and brazing can be adopted (the same applies to other examples).
  • thin plate fins having an L-shaped cross section consisting of a bottom surface and a vertical surface are arranged in parallel in the horizontal direction to form a heat radiation fin portion. Also in this aspect, a plurality of bottom surfaces are arranged in parallel to form a flat heat receiving surface, and the heat dissipating fin portion is open on the upper surface side.
  • the above-described thin plate fin having a U-shaped cross section composed of a bottom surface, a vertical surface, and an upper surface, and a thin plate fin having an L-shaped cross section composed of a bottom surface and a vertical surface are combined as appropriate.
  • Part 4 is formed.
  • the combination is not limited to the mode shown in the figure, and the radiating fin portions described with reference to FIG. 12B are arranged on both end sides, and the radiating fin portions described with reference to 12A are combined in the center portion. Other free combinations are also possible.
  • the thin plate fins of the embodiment shown in FIGS. 12 (a) to 12 (c) are bonded and fixed to the base plate 2 by soldering, brazing or the like at the bottom.
  • the thin plate fin of the aspect shown to FIG. 12 (a) to (c) can be combined suitably on both surfaces of the base plate 2 including the same thin plate fin and a different thin plate fin, respectively.
  • thin plate fins can be attached to the lower surface of the base plate 2 as shown in FIG. 12A, and thin plate fins can be attached to the upper surface of the base plate 2 as shown in FIG.
  • the heat sink of the present invention two types of thin plate fins having different heights are used, and these two types of thin plate fins having different heights are adjacent to each other, and there is almost no space between them.
  • the heat pipe can be brought into contact with the fin over the entire length including the plurality of parallel thin thin plate fins (B) or the laminated thin plate fins (D) in the second heat dissipating fin portion, and the heat dissipating performance is improved.
  • heat dissipation is improved by thin plate fins that are thermally connected perpendicularly to the surface of the base plate on which the heat generating components are located.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Materials Engineering (AREA)
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  • Sustainable Development (AREA)
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  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dissipateur de chaleur qui présente des caractéristiques améliorées de dissipation de chaleur, et qui occupe moins de place grâce à la dimension réduite des ailettes. Le dissipateur de chaleur comprend : une plaque de base qui présente une surface connectée thermiquement à un élément générateur de chaleur et qui présente, connectée thermiquement à ce dernier, une première section ailette de dissipation de chaleur composée d'une ailette en forme de plaque mince ; une plaque supérieure qui présente une seconde section ailette de dissipation de chaleur composée d'une ailette en forme de plaque mince, ladite seconde section ailette de dissipation de chaleur étant composée de deux types d'ailettes en forme de plaque mince présentant des hauteurs différentes ; et plusieurs conduits de chaleur qui sont disposés entre l'autre surface de la plaque de base et l'autre surface de la plaque supérieure en étant connectés thermiquement auxdites surfaces, et qui comprennent un conduit de chaleur dont au moins une partie est insérée dans une partie de la seconde section ailette de dissipation de chaleur.
PCT/JP2011/050633 2010-01-18 2011-01-17 Dissipateur de chaleur WO2011087117A1 (fr)

Priority Applications (3)

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CN2011800025535A CN102473696A (zh) 2010-01-18 2011-01-17 散热器
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JPWO2011087117A1 (ja) 2013-05-20
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US20120097372A1 (en) 2012-04-26
JP5228115B2 (ja) 2013-07-03
TW201142579A (en) 2011-12-01

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