WO2014088044A1 - Dissipateur thermique - Google Patents

Dissipateur thermique Download PDF

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Publication number
WO2014088044A1
WO2014088044A1 PCT/JP2013/082635 JP2013082635W WO2014088044A1 WO 2014088044 A1 WO2014088044 A1 WO 2014088044A1 JP 2013082635 W JP2013082635 W JP 2013082635W WO 2014088044 A1 WO2014088044 A1 WO 2014088044A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
base plate
plate
heat pipe
heat receiving
Prior art date
Application number
PCT/JP2013/082635
Other languages
English (en)
Japanese (ja)
Inventor
佐々木　泰海
川畑　賢也
Original Assignee
古河電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to JP2014517299A priority Critical patent/JP5579349B1/ja
Priority to CN201390000739.1U priority patent/CN204596782U/zh
Priority to US14/423,002 priority patent/US20150219400A1/en
Publication of WO2014088044A1 publication Critical patent/WO2014088044A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink including a heat pipe disposed on a base plate.
  • a heat sink provided with a radiation fin is known (see, for example, Patent Document 1).
  • a base plate in contact with the heat pipe is made of a material having excellent thermal conductivity (for example, copper or copper alloy). Etc.).
  • the base plate is entirely made of copper or a copper alloy, there is a problem that the amount of copper used increases and the weight and manufacturing cost increase.
  • the heat pipe is sandwiched between the base plate and the heat radiation fins, so it is desirable to suppress the load applied to the heat pipe.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heat sink that suppresses a load applied to a heat pipe and improves heat transfer efficiency from a heating element to a radiation fin.
  • the present invention includes a base plate having a heat receiving portion to which a heating element is thermally connected, a heat pipe that is partly in contact with the heat receiving portion and disposed on the base plate, A heat dissipating fin disposed on the base plate and the heat pipe, the base plate is formed of a metal plate, and has an opening at a portion corresponding to the heat receiving portion, and the opening includes the
  • the heat receiving plate formed of a metal plate having a higher thermal conductivity than the base plate is disposed so that one surface of the heat receiving plate and the surface of the base plate on which the heat pipe is installed are substantially the same surface. It is characterized by.
  • the base plate is formed by bending a metal plate, and includes a groove portion in which the heat pipe is disposed, and placement portions on which the heat radiation fins are placed on both sides of the groove portion. While providing the said opening part, you may form the surface of the said groove part, and the back surface of the said mounting part in the same height position.
  • the heat receiving plate may be fixed to the back surface of the mounting portion.
  • the heat dissipating fins may include a plurality of fin plates provided in parallel, and the fin plates may be arranged in the extending direction of the heat pipe.
  • the heat dissipating fin may include a plurality of housing grooves for housing the heat pipes on a surface facing the base plate, and a leg portion contacting the surface of the base plate may be provided between the housing grooves.
  • the base plate is formed of a metal plate, and has an opening at a portion corresponding to the heat receiving portion, and the heat receiving portion formed of a metal plate having higher thermal conductivity than the base plate in the opening. Since the plate is provided, the heat from the heating element can be efficiently transmitted to the heat radiating fin through the heat receiving plate and the heat pipe. Furthermore, since the heat receiving plate is disposed on the same surface (substantially flush) with the surface of the base plate where the heat pipe is installed, the step on the base plate is prevented, and the radiating fins are connected to the base plate and the heat pipe. Even in the case of overlapping, it is possible to prevent an excessive load from being applied to the heat pipe.
  • FIG. 1 is an exploded perspective view of the heat sink 10 according to the first embodiment
  • FIG. 2 is an external perspective view of the heat sink 10.
  • the heat sink 10 is used, for example, in an electronic device such as a personal computer, and is thermally connected to a semiconductor element (heating element) 11 such as a CPU mounted on a circuit board (not shown) to cool the semiconductor element 11. Is what you do.
  • the heat sink 10 includes a flat base plate 21, and a plurality of (three in this embodiment) heat pipes 22 are arranged side by side on the base plate 21.
  • a plurality of (two in the present embodiment) radiation fins 23 are arranged side by side on the heat pipe 22. That is, in this configuration, the heat pipe 22 is sandwiched and held between the base plate 21 and the radiation fins 23 as shown in FIG.
  • the base plate 21 is formed by bending a metal plate such as aluminum by press molding. As shown in FIG. 1, the base plate 21 includes a wide groove portion 31 extending in the longitudinal direction (Y direction in the drawing) at the approximate center in the short direction (X direction in the drawing), and the groove portions on both sides of the groove portion 31. And a pair of bank portions (mounting portions) 32 formed higher than 31. The bank portions 32 are formed at substantially the same height, and the edge portions 33 of the bank portions 32 are bent downward.
  • the heat pipe 22 is disposed in the groove portion 31, and the radiation fins 23 are placed on the bank portion 32.
  • Each bank portion 32 is formed with two hole portions 34 (four in total). These holes 34 are holes through which fixing screws for fixing the heat sink 10 to the circuit board pass.
  • the groove part 31 is provided in the approximate center of the width direction in the base board 21, it is not restricted to this, You may provide in any position of the said width direction.
  • This type of base plate can be formed by, for example, die casting, extrusion, or cutting, in addition to bending and forming a metal plate.
  • die casting and extrusion molding there is a situation in which a mold cost for molding occurs and it is not suitable for small-scale production.
  • processing costs and material costs increase.
  • the die-cast product is generally inferior in thermal conductivity to the metal plate, if the other conditions are the same, a difference in the cooling performance of the heat sink occurs due to the difference in the thermal conductivity of the base plate.
  • the base plate 21 is formed by bending a metal plate by press molding.
  • the thermal conductivity of the base plate 21 itself can be increased and the manufacturing cost can be reduced as compared with the above-described one. Furthermore, since the groove part 31 and the edge part 33 bent by the base plate 21 exhibit the function as the reinforcing rib, the weight and thickness can be reduced while ensuring the rigidity of the base plate 21.
  • the base plate 21 includes an opening 35 at a substantially center in the longitudinal direction of the groove 31 (a position corresponding to a heat receiving portion thermally connected to the semiconductor element 11).
  • a heat receiving plate 36 made of a metal (for example, copper) having a higher thermal conductivity than the plate 21 is disposed.
  • the above-described semiconductor element 11 is connected to the back surface (lower surface in the drawing) 36A of the heat receiving plate 36, and is fixed to the front surface (upper surface in the drawing) 36B with a part of the heat pipe 22 in contact therewith. In this configuration, heat generated from the semiconductor element 11 is transmitted to the heat pipe 22 through the heat receiving plate 36.
  • the heat receiving plate 36 is made of a metal having a higher thermal conductivity than the base plate 21, the heat of the semiconductor element 11 can be quickly transmitted to the heat radiating fins 23 through the heat receiving plate 36 and the heat pipe 22.
  • the cooling performance of the heat sink 10 can be enhanced.
  • weight reduction and reduction of a material and manufacturing cost can be achieved.
  • the heat pipe 22 is a member for diffusing the heat received by the heat receiving plate 36 to the heat radiating fins 23.
  • the heat pipe 22 is formed by, for example, sealing a working fluid such as water in a reduced pressure inside a sealed container made of a metal having excellent thermal conductivity such as copper or an alloy made of the above metal. Yes.
  • the container is formed flat in order to suppress the height (thickness) and secure a large contact area with the base plate 21 and the radiation fins 23.
  • the heat pipe 22 is fixed to the groove portion 31 and the heat receiving plate 36 of the base plate 21 by soldering, brazing, or the like.
  • the heat radiating fins 23 release heat transferred through the heat pipe 22 into the air.
  • the heat radiating fins 23 are formed to be approximately half the length of the heat pipe 22 and are arranged side by side in the extending direction of the heat pipe 22. ing.
  • the heat radiating fins 23 are formed in a region including directly above the heat receiving plate 36, and exist over a wide area in a region on the base plate 21.
  • the number of the heat dissipating fins 23 can be changed according to the length of the heat pipe 22 and can be a single heat dissipating fin.
  • Each radiating fin 23 includes a plurality of fin plates 43 formed in a substantially U-shaped cross-section by bending an upper edge 41 and a lower edge 42 of a metal plate 40 such as aluminum, for example, substantially in parallel. These fin plates 43 are arranged side by side in the extending direction of the heat pipe 22, and the fin plates 43 are fixed integrally by soldering, for example. Air can flow through a gap between adjacent fin plates 43. For this reason, in the radiation fin 23, the heat transmitted to the heat pipe 22 can be diffused throughout the radiation fin 23, and this heat can be dissipated by exchanging heat with the air flowing through the gaps between the fin plates 43 described above. .
  • the heat radiating fin 23 includes a housing groove 24 for housing the heat pipe 22 on a lower surface (opposing surface) 23 ⁇ / b> A facing the base plate 21 and the heat pipe 22.
  • the housing groove 24 is formed in accordance with the outer shape of the heat pipe 22 to improve the heat transfer area between the heat pipe 22 and the heat radiating fins 23.
  • leg portions 25 are provided between the respective housing grooves 24, and these leg portions 25 are formed on the surface of the groove portion 31 of the base plate 21 (when the radiating fins 23 are placed on the bank portion 32 of the base plate 21 ( The surface on which the heat pipe 22 is installed) abuts on 31A.
  • the heat sink 10 is integrally configured by fixing the radiating fins 23 to the base plate 21 and the heat pipes 22 by soldering or the like. Further, the radiating fin 23 is provided with a notch 26 at a location corresponding to the hole 34 provided in the base plate 21.
  • the base plate 21 is formed by bending a metal plate in order to increase the thermal conductivity of the base plate 21 with an inexpensive configuration, and at the heat receiving portion thermally connected to the semiconductor element 11.
  • An opening 35 is provided at a corresponding location, and a heat receiving plate 36 made of a metal having a higher thermal conductivity than the base plate 21 is disposed in the opening 35.
  • the heat sink 10 is configured such that the heat radiating fins 23 are placed on the base plate 21 so that the heat pipe 22 is sandwiched between the base plate 21 and the heat radiating fins 23. It is desirable to suppress the load.
  • the heat receiving plate 36 has a surface (upper surface; upper surface in the drawing) 36B of the heat receiving plate 36 that is not stepped from the surface 31A of the groove portion 31 (upper surface in the drawing) 31A of the base plate 21 or
  • the steps are arranged in such a manner that there are very few steps, that is, the surface 36B of the heat receiving plate 36 and the surface 31A of the groove 31 of the base plate 21 are substantially the same surface (substantially flush).
  • the base plate 21 is formed by bending a metal plate so that the front surface 31A of the groove portion 31 and the back surface (lower surface in the drawing) 32A of the bank portion 32 are at the same height position.
  • the heat receiving plate 36 is formed to be larger than the width of the groove portion 31 and is fixed to the back surface 32A of the bank portion 32 by soldering or the like. According to this, as shown in FIG. 4, the heat receiving plate 36 is attached to the opening 35 from the back surface 32A side of the bank portion 32 and fixed to the back surface 32A.
  • the heat receiving plate 36 can be disposed in the opening 35 of the base plate 21 with the surface 31A of the groove portion 31 being substantially the same surface (substantially flush). For this reason, a step between the heat receiving plate 36 and the base plate 21 can be prevented, and even when the radiating fins 23 are arranged on the base plate 21 and the heat pipe 22, an excessive load is applied to the heat pipe 22. This can be prevented.
  • FIG. 5 is a plan view of the base plate 21 before press molding.
  • the metal plate is punched into the outer shape shown in FIG. 5, and the opening 35 and the hole 34 are formed at predetermined positions.
  • the punched metal plate is bent into a desired shape by press molding. Specifically, the line 50 along the inner side of the predetermined distance from the edge of the metal plate and the line 51 along the inner edge 35A of the opening 35 are folded and the line along the inner side of the predetermined distance from the line 51.
  • the base plate 21 is formed by valley-folding 52.
  • recesses 35B extending outward from the edge 35A are formed at the four corners of the edge 35A of the opening 35.
  • the base plate 21 having the heat receiving portion to which the semiconductor element 11 is thermally connected, the heat pipe 22 partially disposed in contact with the heat receiving portion, and the base
  • the base plate 21 is formed of a metal plate and has an opening 35 in a portion corresponding to the heat receiving portion.
  • the opening 35 includes a heat radiating fin 23 disposed on the plate 21 and the heat pipe 22. Since the heat receiving plate 36 made of a metal plate having a higher thermal conductivity than the base plate 21 is provided, the heat from the semiconductor element 11 is efficiently transferred to the radiating fins 23 through the heat receiving plate 36 and the heat pipe 22. be able to.
  • the heat receiving plate 36 is disposed on a surface (substantially flush) with the surface 31A on which the heat pipe 22 of the base plate 21 is installed, the step on the base plate 21 is prevented, and the radiating fins 23 are installed. Even in the case where the heat pipe 22 is placed over the base plate 21 and the heat pipe 22, it is possible to prevent an excessive load from being applied to the heat pipe 22.
  • the base plate 21 is formed by bending a metal plate, and the groove portion 31 in which the heat pipe 22 is disposed, and the bank portion 32 in which the radiation fins 23 are placed on both sides of the groove portion 31.
  • the opening portion 35 is provided in the groove portion 31 and the front surface 31A of the groove portion 31 and the back surface 32A of the bank portion 32 are formed at the same height position, so that the heat receiving plate 36 is formed from the back surface 32A side of the bank portion 32.
  • the heat receiving plate 36 is arranged so that the surface 36B of the heat receiving plate 36 and the surface 31A of the groove portion 31 are substantially the same surface (substantially flush) by a simple operation such as applying to the opening 35 and fixing to the back surface 32A. Can be disposed in the opening 35 of the base plate 21.
  • the fixing structure can be simplified and the appearance of the heat sink 10 is improved because the fixing portion is not exposed on the surface. be able to.
  • the radiating fins 23 include a plurality of fin plates 43 provided in parallel, and these fin plates 43 are arranged along the extending direction of the heat pipe 22, so that the heat pipes The transmitted heat can be diffused to each fin plate 43 via 22, and the heat can be dissipated by exchanging heat with the air flowing through the gaps between the fin plates 43.
  • the radiating fin 23 includes the plurality of housing grooves 24 for housing the heat pipes 22 on the lower surface 23 ⁇ / b> A facing the base plate 21, and the groove portions of the base plate 21 between these housing grooves 24. Since the leg portion 25 that abuts on the surface 31A of the base plate 31 is provided, the leg portion 25 abuts on the surface 31A of the groove portion 31 of the base plate 21 when the radiating fin 23 is placed on the bank portion 32 of the base plate 21. Through the legs 25, heat conduction can be performed directly from the base plate 21 to the heat radiation fins 23. Furthermore, the load applied to the heat pipe 22 can be reduced by supporting the load of the radiating fin 23 with the leg portion 25.
  • the heat sink 100 of the second embodiment is different from that of the first embodiment in the shape of the base plate. For this reason, in this 2nd Embodiment, only the point from which a structure differs is demonstrated, the same code
  • FIG. 6 is a side view of the heat sink 100 according to the second embodiment
  • FIG. 7 is a side sectional view of the heat sink 100.
  • the base plate 121 of the present embodiment is formed of a metal plate that is not subjected to bending processing.
  • the heat receiving plate 36 is formed in substantially the same size as the opening 135 provided in the base plate 121, and the surface 36B of the heat receiving plate 36 and the surface (upper surface in the drawing) 121A of the base plate 121 The heat receiving plate 36 is fixed to the opening 135 so that they are substantially the same surface (substantially flush).
  • a base plate 121 is arranged on the surface 121A side of the base plate 121 (surface on which the heat pipe 22 is installed), and the base plate 121 is in contact with the surface 36B of the heat receiving plate 36 against the base plate.
  • the base plate 121 and the heat receiving plate 36 are fixed by soldering or the like from the back surface 121B side.
  • a technique is required for fixing the heat receiving plate 36 as compared with the first embodiment described above, but the surface 36B of the heat receiving plate 36 and the surface 121A of the base plate 121 are simply arranged on substantially the same surface (substantially surface). 1)
  • the heat sink 100 can be made thinner as much as the thickness of the base plate 121 can be suppressed.
  • this invention is not limited to the said embodiment, It can change in the range which does not deviate from the summary.
  • the three heat pipes 22 are arranged on the base plates 21 and 121 in the above embodiment, the number of the heat pipes 22 may be changed as appropriate.
  • the heat pipe 22 has a flat shape, it may be a round shape.
  • the openings 35 and 135 are provided at substantially the center of the base plates 21 and 131.
  • the present invention is not limited to this, and the openings 35 and 135 are changed according to the position of the semiconductor element 11 disposed on the circuit board. May be.
  • the semiconductor element 11 arranged on the circuit board is a heating element.
  • the present invention is not limited to this.
  • Heat sink 11 Semiconductor element (heating element) 21, 121 Base plate 22 Heat pipe 23 Radiation fin 23A Lower surface (opposing surface) 24 receiving groove 25 leg 31 groove 31A, 121A surface (surface on which heat pipe is arranged) 32 Bank portion 32A Back surface 35, 135 Opening portion 36 Heat receiving plate 36B Front surface 43 Fin plate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dissipateur thermique avec lequel la charge sur un caloduc est réduite et l'efficacité du transfert de chaleur d'un corps générateur de chaleur vers une ailette de dissipation de chaleur est améliorée. Le dissipateur thermique selon l'invention comprend : une plaque de base (21) qui possède une partie réceptrice de chaleur à laquelle est relié thermiquement un élément semiconducteur (11) ; un caloduc (22) qui est disposé sur la plaque de base (21) de manière à se trouver en contact partiel avec la partie réceptrice de chaleur ; et une ailette de dissipation de chaleur (23) qui est disposée au-dessus de la plaque de base (21) et du caloduc (22). La plaque de base (21) est constituée d'une plaque métallique et possède une ouverture (35) à une position correspondant à la partie réceptrice de chaleur. Une plaque réceptrice de chaleur (36), qui est constituée d'une plaque métallique possédant une conductivité thermique supérieure à celle de la plaque de base (21), est disposée à l'intérieur de l'ouverture (35) de sorte que la plaque réceptrice de chaleur (36) se trouve globalement sur le même plan que la plaque de base (21).
PCT/JP2013/082635 2012-12-06 2013-12-04 Dissipateur thermique WO2014088044A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014517299A JP5579349B1 (ja) 2012-12-06 2013-12-04 ヒートシンク
CN201390000739.1U CN204596782U (zh) 2012-12-06 2013-12-04 散热器
US14/423,002 US20150219400A1 (en) 2012-12-06 2013-12-04 Heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012267171 2012-12-06
JP2012-267171 2012-12-06

Publications (1)

Publication Number Publication Date
WO2014088044A1 true WO2014088044A1 (fr) 2014-06-12

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PCT/JP2013/082635 WO2014088044A1 (fr) 2012-12-06 2013-12-04 Dissipateur thermique

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US (1) US20150219400A1 (fr)
JP (1) JP5579349B1 (fr)
CN (1) CN204596782U (fr)
WO (1) WO2014088044A1 (fr)

Cited By (5)

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JP2017183590A (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 ヒートシンク
JP2017188601A (ja) * 2016-04-07 2017-10-12 富士通株式会社 電子機器
JP2018056350A (ja) * 2016-09-29 2018-04-05 富士通株式会社 放熱部品及び放熱部品を備える端末装置
KR20220002943U (ko) * 2021-06-08 2022-12-15 윤국영 메모리 유닛용 쿨러
WO2023276940A1 (fr) * 2021-06-30 2023-01-05 日本軽金属株式会社 Dissipateur thermique de refroidissement de dispositif thermique

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JP6203693B2 (ja) * 2014-09-12 2017-09-27 Idec株式会社 電気機器
CN109168288B (zh) * 2014-09-26 2020-07-14 华为技术有限公司 散热器及电子产品
US9468086B1 (en) * 2015-04-03 2016-10-11 Motorola Soultions, Inc. Electronic device including an externally-mounted heat pipe
TWM512883U (zh) * 2015-05-05 2015-11-21 Cooler Master Co Ltd 散熱模組、水冷式散熱模組及散熱系統
JP5945047B1 (ja) 2015-08-19 2016-07-05 株式会社フジクラ 携帯型電子機器用熱拡散板
USD805043S1 (en) * 2016-02-22 2017-12-12 Heatscape.Com, Inc. Heatsink for optical modules
TWD181170S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(1)
TWD181171S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(2)
CN107072110B (zh) * 2017-01-09 2023-07-25 四川埃姆克伺服科技有限公司 一种用于伺服驱动器的穿墙式散热组件
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