WO2011065144A1 - 組成物、硬化体および電子デバイス - Google Patents
組成物、硬化体および電子デバイス Download PDFInfo
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- WO2011065144A1 WO2011065144A1 PCT/JP2010/068114 JP2010068114W WO2011065144A1 WO 2011065144 A1 WO2011065144 A1 WO 2011065144A1 JP 2010068114 W JP2010068114 W JP 2010068114W WO 2011065144 A1 WO2011065144 A1 WO 2011065144A1
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- 239000000203 mixture Substances 0.000 title claims abstract description 110
- 150000001875 compounds Chemical class 0.000 claims abstract description 84
- -1 polysiloxane Polymers 0.000 claims description 30
- 125000000962 organic group Chemical group 0.000 claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- 239000003381 stabilizer Substances 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 125000003342 alkenyl group Chemical group 0.000 claims description 14
- 125000000304 alkynyl group Chemical group 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 9
- 125000005843 halogen group Chemical group 0.000 claims description 8
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 8
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 6
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 5
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 5
- 125000004429 atom Chemical group 0.000 claims description 5
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 5
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- VKNUORWMCINMRB-UHFFFAOYSA-N diethyl malate Chemical compound CCOC(=O)CC(O)C(=O)OCC VKNUORWMCINMRB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims 2
- 239000000047 product Substances 0.000 description 56
- 239000011521 glass Substances 0.000 description 27
- 238000010521 absorption reaction Methods 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 230000007062 hydrolysis Effects 0.000 description 17
- 238000006460 hydrolysis reaction Methods 0.000 description 17
- 239000002245 particle Substances 0.000 description 17
- 229920001577 copolymer Polymers 0.000 description 16
- 239000010954 inorganic particle Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000002516 radical scavenger Substances 0.000 description 12
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 9
- 150000001335 aliphatic alkanes Chemical class 0.000 description 8
- 238000000354 decomposition reaction Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000003230 hygroscopic agent Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- YGUHUONDOURLNB-UHFFFAOYSA-N tris[2-(2-ethenoxyethoxy)ethoxy]alumane Chemical compound C(=C)OCCOCCO[Al](OCCOCCOC=C)OCCOCCOC=C YGUHUONDOURLNB-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- JQRRFDWXQOQICD-UHFFFAOYSA-N biphenylen-1-ylboronic acid Chemical compound C12=CC=CC=C2C2=C1C=CC=C2B(O)O JQRRFDWXQOQICD-UHFFFAOYSA-N 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 4
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 3
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- LDYCCFJRAVYLID-UHFFFAOYSA-N C(=O)=[Pt]C(C=C)C=C Chemical compound C(=O)=[Pt]C(C=C)C=C LDYCCFJRAVYLID-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- XBEXIHMRFRFRAM-UHFFFAOYSA-N tridodecylalumane Chemical compound CCCCCCCCCCCC[Al](CCCCCCCCCCCC)CCCCCCCCCCCC XBEXIHMRFRFRAM-UHFFFAOYSA-N 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 229910018540 Si C Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 125000005066 dodecenyl group Chemical group C(=CCCCCCCCCCC)* 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000005064 octadecenyl group Chemical group C(=CCCCCCCCCCCCCCCCC)* 0.000 description 2
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920006389 polyphenyl polymer Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 2
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910021647 smectite Inorganic materials 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- YXFVVABEGXRONW-JGUCLWPXSA-N toluene-d8 Chemical compound [2H]C1=C([2H])C([2H])=C(C([2H])([2H])[2H])C([2H])=C1[2H] YXFVVABEGXRONW-JGUCLWPXSA-N 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- PUEPVAKVGRXGNH-UHFFFAOYSA-K 1-butylsulfanylbutane;rhodium(3+);trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Rh+3].CCCCSCCCC.CCCCSCCCC.CCCCSCCCC PUEPVAKVGRXGNH-UHFFFAOYSA-K 0.000 description 1
- BDKDHWOPFRTWPP-UHFFFAOYSA-N 2,2-bis(prop-2-enoxymethyl)butan-1-ol Chemical compound C=CCOCC(CO)(CC)COCC=C BDKDHWOPFRTWPP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- YOIZTLBZAMFVPK-UHFFFAOYSA-N 2-(3-ethoxy-4-hydroxyphenyl)-2-hydroxyacetic acid Chemical compound CCOC1=CC(C(O)C(O)=O)=CC=C1O YOIZTLBZAMFVPK-UHFFFAOYSA-N 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- DDLWXYPMKCKXQR-UHFFFAOYSA-N BOCCCCCCCCCCCCC Chemical compound BOCCCCCCCCCCCCC DDLWXYPMKCKXQR-UHFFFAOYSA-N 0.000 description 1
- HHKWKBYBZVWIJY-UHFFFAOYSA-N C(CCCCCCCCC)OB Chemical compound C(CCCCCCCCC)OB HHKWKBYBZVWIJY-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PQYJRMFWJJONBO-UHFFFAOYSA-N Tris(2,3-dibromopropyl) phosphate Chemical compound BrCC(Br)COP(=O)(OCC(Br)CBr)OCC(Br)CBr PQYJRMFWJJONBO-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical compound [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 1
- 229910052795 boron group element Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical class [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910021387 carbon allotrope Inorganic materials 0.000 description 1
- 229910052800 carbon group element Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910001849 group 12 element Inorganic materials 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- PQPVPZTVJLXQAS-UHFFFAOYSA-N hydroxy-methyl-phenylsilicon Chemical class C[Si](O)C1=CC=CC=C1 PQPVPZTVJLXQAS-UHFFFAOYSA-N 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- JTBKFHQUYVNHSR-UHFFFAOYSA-N propan-2-yloxyalumane Chemical compound CC(C)O[AlH2] JTBKFHQUYVNHSR-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000010420 shell particle Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- QXZGXRIXJAVMTI-UHFFFAOYSA-N tribenzylsilicon Chemical compound C=1C=CC=CC=1C[Si](CC=1C=CC=CC=1)CC1=CC=CC=C1 QXZGXRIXJAVMTI-UHFFFAOYSA-N 0.000 description 1
- YGRHYJIWZFEDBT-UHFFFAOYSA-N tridecylaluminum Chemical compound CCCCCCCCCCCCC[Al] YGRHYJIWZFEDBT-UHFFFAOYSA-N 0.000 description 1
- PNRSICAVRDRYOH-UHFFFAOYSA-N tridodecoxyalumane Chemical compound [Al+3].CCCCCCCCCCCC[O-].CCCCCCCCCCCC[O-].CCCCCCCCCCCC[O-] PNRSICAVRDRYOH-UHFFFAOYSA-N 0.000 description 1
- HWJYGSDXNANCJM-UHFFFAOYSA-N tridodecyl borate Chemical compound CCCCCCCCCCCCOB(OCCCCCCCCCCCC)OCCCCCCCCCCCC HWJYGSDXNANCJM-UHFFFAOYSA-N 0.000 description 1
- CJJSDLFJDBSUJU-UHFFFAOYSA-N trioctadecoxyalumane Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] CJJSDLFJDBSUJU-UHFFFAOYSA-N 0.000 description 1
- ZFYVMCFENKKDFG-UHFFFAOYSA-N trioctoxyalumane Chemical compound [Al+3].CCCCCCCC[O-].CCCCCCCC[O-].CCCCCCCC[O-] ZFYVMCFENKKDFG-UHFFFAOYSA-N 0.000 description 1
- UZOZRSIHIWRJEX-UHFFFAOYSA-N tris(dodec-2-enoxy)alumane Chemical compound CCCCCCCCCC=CCO[Al](OCC=CCCCCCCCCC)OCC=CCCCCCCCCC UZOZRSIHIWRJEX-UHFFFAOYSA-N 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/58—Metal-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/057—Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Definitions
- the present invention relates to a composition, a cured body formed from the composition, and an electronic device including the cured body.
- an organic EL element that is a typical sealed electronic device has a problem in that light emission characteristics such as luminance and light emission efficiency are gradually lowered due to moisture that has entered the organic EL element as the driving period becomes longer. is there.
- Japanese Patent Application Laid-Open No. 2005-298598 and Japanese Translation of PCT International Publication No. 2008-518399 disclose in advance trapping of moisture such as organometallic compounds and metal alkoxides in the device. Techniques are being studied to place the agent and keep the inside of the device in a low humidity environment.
- a decomposition product such as alkane or alcohol is produced by reacting with water.
- decomposition products diffuse into the device, they may be absorbed by an organic material such as a charge transport layer or an organic light emitting layer constituting the device, or may cause a volume expansion of voids existing in the device.
- pinholes are generated in the device, and the device is deformed to promote moisture intrusion, thereby shortening the device life.
- the coating liquid by dissolving the moisture scavenger in a solvent, forming the coating liquid by a coating method such as spin coating, and removing the solvent.
- the solvent may remain in the film.
- the solvent remaining in the film diffuses inside the device and is absorbed by an organic material such as a charge transport layer or an organic light emitting layer constituting the device, or in the device.
- an organic material such as a charge transport layer or an organic light emitting layer constituting the device, or in the device.
- There is a risk of causing volume expansion of existing voids As a result, there is a possibility that a pinhole is generated in the device, and the device is further deformed to accelerate the intrusion of moisture, thereby shortening the device life. Therefore, it has been desired to develop a moisture scavenger from which the solvent is removed as much as possible.
- such a moisture scavenger may be deformed by heat flow in an environment of use (for example, about 80 ° C. in organic EL lighting or the like) or may become opaque by reacting with water.
- the moisture scavenger is usually formed on the surface of a glass substrate or the like, it is required to have excellent film forming properties and excellent glass adhesion.
- some embodiments according to the present invention solve the above-mentioned problems, and are excellent in water absorption, heat fluidity (heat resistance), and also excellent in transparency, film formability, and glass adhesion.
- the present invention provides a moisture capturing composition capable of forming a body, a cured body formed from the composition, and an electronic device provided with the cured body.
- the present invention has been made to solve at least a part of the above-described problems, and can be realized as the following aspects or application examples.
- composition according to the present invention is: Compound (A) represented by the following general formula (1), Compound (B) having a structure represented by the following general formula (2), Containing.
- R 1 is selected from a substituted or unsubstituted alkyl group, alkenyl group, alkynyl group, cyclic alkyl group, aryl group, carboxyl group and a group represented by R 3 O—.
- a plurality of R 1 may be the same or different, but at least one of the plurality of R 1 is a group having one or more unsaturated bonds, and R 3 is a substituted or non-substituted group.
- M is 2 to 4 A valence atom.
- R 2 is one selected from a hydrogen atom, a halogen atom and an organic group.
- the compound (A) may have a carbon-carbon unsaturated bond.
- the M in the general formula (1) may be at least one selected from aluminum, boron, magnesium, calcium, titanium, zirconium and zinc.
- the compound (B) may be a polysiloxane having a repeating unit represented by the following general formula (3).
- R 2 is one selected from a hydrogen atom, a halogen atom and an organic group.
- the compound (A) may be a compound represented by the following general formula (4).
- R 4 is a divalent organic group.
- R 5 is a hydrogen atom or a monovalent organic group. A plurality of R 4 and R 5 may be the same or different.
- a catalyst (C) for promoting the hydrosilylation reaction between the compound (A) and the compound (B) can be further contained.
- composition described in any one of the application examples 1 to 7 can be used for the purpose of capturing moisture.
- Application Example 9 One aspect of the cured body according to the present invention is: It is formed using the moisture capturing composition described in Application Example 8.
- Application Example 10 One aspect of the electronic device according to the present invention is: The cured product according to Application Example 9 is provided.
- the composition according to the present invention can form a cured body (coating film, film, etc.) having excellent hygroscopicity and heat resistance, as well as excellent transparency, film forming properties, and glass adhesion.
- the cured body is not deformed by heat flow even under a use environment exceeding 80 ° C., for example.
- composition according to the present invention can take a form not containing a solvent.
- the solvent does not remain in the cured body. Therefore, by mounting the cured body in the electronic device, it is possible to prevent harmful effects that occur in the electronic device due to the solvent remaining in the cured body, for example, the occurrence of pinholes and moisture intrusion due to device deformation. .
- the cured product is suitable for use as a moisture scavenger in an electronic device such as an organic EL element, and when it is excellent in transparency, it can be used, for example, in a top emission type organic EL element.
- FIG. 1 is a diagram schematically showing a cross section of the organic EL element according to the first embodiment.
- FIG. 2 is a diagram schematically showing a cross section of the organic EL element according to the second embodiment.
- FIG. 3 is a 1 H-NMR spectrum of tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum.
- FIG. 4 is a 1 H-NMR spectrum of tri (2- (2-vinyloxyethoxy) ethoxy) aluminum.
- composition The composition concerning this Embodiment is A compound (A) represented by the following general formula (1) (hereinafter also simply referred to as “component (A)”) and a compound (B) having a structure represented by the following general formula (2) (hereinafter simply referred to as “ (B) also referred to as “component”).
- R 1 is selected from a substituted or unsubstituted alkyl group, alkenyl group, alkynyl group, cyclic alkyl group, aryl group, carboxyl group and a group represented by R 3 O—.
- a plurality of R 1 may be the same or different, but at least one of the plurality of R 1 is a group having one or more unsaturated bonds, and R 3 is a substituted or non-substituted group.
- M is 2 to 4 A valence atom.
- R 2 is one selected from a hydrogen atom, a halogen atom and an organic group.
- composition concerning this Embodiment contains the compound (A) shown by the said General formula (1).
- One of the functions of the component (A) is to capture moisture when the R 1 -M bond present in the component (A) reacts with moisture.
- a cured product having excellent hygroscopicity can be obtained. That is, in order to use a cured product formed from the composition according to the present embodiment for capturing moisture, it is necessary that the R 1 -M bond is substantially present in the cured product. For this purpose, the R 1 -M bond needs to be substantially present in the composition according to the present embodiment.
- R 1 is selected from a substituted or unsubstituted alkyl group, alkenyl group, alkynyl group, cyclic alkyl group, aryl group, carboxyl group, and group represented by R 3 O—.
- a plurality of R 1 may be the same or different, but at least one of the plurality of R 1 is a group having one or more unsaturated bonds.
- R 1 is preferably a group represented by R 3 O—, and R 3 is selected from a substituted or unsubstituted alkyl group, alkenyl group, alkynyl group, cyclic alkyl group or aryl group. It is a seed.
- R 1 and R 3 may be linear or cyclic, or may have a branched chain.
- R 1 or R 3 is an alkenyl group or an alkynyl group
- the position and number of double bonds and triple bonds are not particularly limited.
- R 1 can be appropriately selected from groups described above in consideration of the characteristics of the cured product of interest.
- R 1 is the group described above, the compatibility between the component (A) and the component (B) described later can be improved. As a result, a phase separation can be suppressed even if left as it is, and a composition having good storage stability can be produced.
- n is an integer of 2 to 4, there are a plurality of R 1 .
- a plurality of R 1 may be the same or different, but at least one of the plurality of R 1 has one or more unsaturated bonds.
- the position and number of unsaturated bonds are not particularly limited.
- the Si—H bond present in component (B) is cleaved and added to the unsaturated bonds present in R 1 (so-called hydrosilylation reaction). can do.
- the component (A) and the component (B) can be combined and immobilized.
- R 1 existing in plural numbers, to have all unsaturated bonds more preferable.
- the amount of R 1 remaining without reacting with the component (B) can be reduced when the component (A) and the component (B) described later are bonded and immobilized. .
- the occurrence of hydrolysis component such as an alkane or an alcohol derived from R 1 (R 1 H) can be suppressed.
- the unsaturated bond present in R 1 is preferably a carbon-carbon unsaturated bond. If it is a carbon-carbon unsaturated bond, it can react with the Si—H bond to generate a stable Si—C bond. As a result, it is possible to suppress the occurrence of even if the component (A) is hydrolyzed, since Si-C bond is stable, hydrolysis component such as an alkane or an alcohol derived from R 1 (R 1 H) .
- the carbon-carbon unsaturated bond is more preferably an ethylenically unsaturated bond. Since the ethylenically unsaturated bond is rich in reactivity with the Si—H bond, the reaction between the component (A) and the component (B) described later easily proceeds. As a result, it is possible to suppress the occurrence of (B) can be reduced R 1 amount remaining without reacting with the component, thus hydrolyzing component such as an alkane or an alcohol derived from R 1 (R 1 H).
- R 1 preferably has 6 to 30 carbon atoms, more preferably 10 to 20 carbon atoms, and particularly preferably 12 to 20 carbon atoms.
- hydrolysis component such as an alkane or an alcohol derived from R 1 (R 1 H) are generated.
- the carbon number of R 1 is in the above-mentioned range since the boiling point of these hydrolysis components is high, it is difficult to become an outgas component, and a uniform mixture with the component (B) described later is easily formed. Further, the carbon number of R 1 is in the above range, the generated hydrolysis component (R 1 H) does not act as a plasticizer for the cured product, preferred in that it does not increase the thermal fluidity.
- the boiling point of a hydrolysis component is 200 degreeC or more in 1 atmosphere, and it is more preferable that it is 250 degreeC or more. If it is 200 degreeC or more, the spreading
- R 1 is a group having two or more unsaturated bonds
- the crosslinked structure of the reaction product with the component (B) is maintained even after hydrolysis, which is more preferable.
- alkyl group examples include hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, hexadecyl group, tetramethylhexadecyl group, octadecyl group and the like.
- alkenyl group examples include octenyl group, dodecenyl group, octadecenyl group, allyl group and the like.
- alkynyl group examples include ethynyl group, propynyl group, phenylethynyl group and the like.
- Examples of the cyclic alkyl group include a cyclohexyl group.
- aryl group examples include a phenyl group and a benzyl group.
- M is a divalent to tetravalent atom.
- examples of such atoms include Group 2 elements, Group 4 elements, Group 12 elements, Group 13 elements, and Group 14 elements in the IUPAC periodic table.
- Al, B, Mg, Zn, Ti, Zr, Si, etc. are mentioned.
- Al is preferable from the viewpoint of being excellent in hygroscopicity and capable of maintaining transparency after being decomposed by trapping moisture without being colored.
- the compound represented by the general formula (1) is preferably a compound represented by the following general formula (4).
- R 4 is a divalent organic group.
- the divalent organic group is preferably a substituted or unsubstituted alkylene group or oxyalkylene group.
- R 5 is a hydrogen atom or a monovalent organic group.
- the monovalent organic group is preferably one selected from a substituted or unsubstituted alkenyl group, alkynyl group, cyclic alkyl group, aryl group and carboxyl group.
- R 4 and R 5 can be appropriately selected according to the properties of the target cured product.
- the ether structure is present in the group represented by R 4 or R 5 , the compatibility between the component (A) and the component (B) described later is further improved.
- the blending ratio of the component (A) and the component (B) can be freely controlled. Furthermore, since the compound represented by the general formula (4) has an ethylenically unsaturated bond, it can easily react with a Si—H bond. As a result, it is possible to greatly reduce the occurrence of low molecular weight components that are generated by the hydrolysis of the component (A).
- Specific examples of the compound represented by the general formula (4) include, for example, tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum, tri (2- (2-vinyloxyethoxy) ethoxy) Examples thereof include aluminum and tri (2-dodecenoxy) aluminum.
- tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum and tri (2- (2-vinyloxyethoxy) ethoxy) aluminum are novel compounds having an excellent water scavenging action, It has a structure shown by following formula (5) and following formula (6).
- tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum represented by the following formula (5) has a boiling point of alcohol generated by reacting with moisture of 258 ° C. under 1 atm. It has the feature of producing alcohol that is less likely to volatilize in the environment of use.
- the compounds represented by the following formula (5) and the following formula (6) are both excellent in compatibility with the compound (B) described later, and a transparent composition can be produced.
- the compound represented by the above formula (5) is obtained by adding triisobutylaluminum to 2.8 to 3.5 equivalents of trimethylolpropane diallyl ether little by little with stirring, and starting from 1 hour at an appropriate temperature of 0 to 150 ° C. It can be easily produced by reacting for 4 hours. Then, the compound shown by said Formula (5) is obtained by post-processing in accordance with a conventional method. In addition, in the production process of the compound represented by the formula (5), components derived from the reaction solution and by-products that are inevitably mixed in the product may be mixed, but the formula (5) indicates Any product containing a compound as a main component can be applied to this embodiment as it is.
- the content of the component (A) in the composition according to the present embodiment is preferably 10% by mass to 90% by mass, and more preferably 50% by mass when the total mass of the composition is 100% by mass. % To 80% by mass. It is preferable for the content of the component (A) to be within the above range because the action of capturing moisture can be effectively expressed in the cured body. Furthermore, when the content of the component (A) is within the above range, an appropriate viscosity as described later can be imparted to the composition, and workability such as film formation when forming a cured product is good. Become.
- composition concerning this Embodiment contains the compound (B) which has a structure shown by the said General formula (2).
- Such a compound (B) may be a polymer having a structure represented by the general formula (2) or a monomer.
- the Si—H bond present in the component (B) is cleaved ( A)
- An addition reaction (so-called hydrosilylation reaction) can be performed on the unsaturated bond present in the component.
- a cured product in which the component (A) is fixed to the component (B) can be formed.
- “low molecular weight” means that the molecular weight is up to about 300.
- the component (B) When the component (B) is a monomer, the component (B) itself undergoes a polymerization reaction in the step of curing the composition according to the present embodiment to form a cured product, and the component (A) and ( A cured product in which the component (A) is immobilized on the component (B) can be formed by a copolymerization reaction with the component B).
- the component (B) when the component (B) is a bifunctional or higher monomer, crosslinking occurs even if the component (B) itself does not cause a polymerization reaction, and the component (A) and the component (B) are bonded to each other.
- a cured body can be formed. By forming such a cured body, it is possible to prevent the hydrolysis product generated when the component (A) absorbs moisture from being reduced in molecular weight. Thereby, volatilization of the hydrolysis product can be suppressed.
- the component (B) is more preferably a compound having a structure represented by the following general formula (3).
- R 2 is one selected from a hydrogen atom, a halogen atom and an organic group.
- R 2 is one selected from a hydrogen atom, a halogen atom, and an organic group.
- R 2 can be appropriately selected from the groups described above in consideration of the properties of the target cured product.
- the compatibility between the component (A) and the component (B) described later can be improved.
- the organic group include a substituted or unsubstituted alkyl group, alkenyl group, alkynyl group, cyclic alkyl group or aryl group, and the group may contain a halogen atom or an ether group.
- organic groups may be linear or cyclic, and may have a branched chain.
- the position and number of double bonds and triple bonds are not particularly limited.
- the organic group is preferably an organic group having 1 to 30 carbon atoms.
- R 2 is an organic group having 1 to 30 carbon atoms, the compatibility between the component (A) and the component (B) may be further improved, and a composition having better storage stability may be produced.
- alkyl group examples include hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, hexadecyl, tetramethylhexadecyl, octadecyl, 3,3,3-trifluoropropyl. Groups and the like.
- alkenyl group examples include a vinyl group, an octenyl group, a dodecenyl group, an octadecenyl group, and an allyl group.
- alkynyl group examples include ethynyl group, propynyl group, phenylethynyl group and the like.
- Examples of the cyclic alkyl group include a cyclohexyl group.
- aryl group examples include a phenyl group and a benzyl group.
- the component (B) is preferably a polymer having a repeating unit represented by the general formula (2), and more preferably a polysiloxane having a repeating unit represented by the general formula (3).
- Examples of the component (B) include polydihydrogensiloxane, poly (methylhydrogensiloxane), poly (ethylhydrogensiloxane), poly (phenylhydrogensiloxane), polyphenyl (dimethylhydrogensiloxy) siloxane, and poly [ (Methylhydrogensiloxane) (dimethylsiloxane)] copolymer, poly [(methylhydrogensiloxane) (ethylmethylsiloxane)] copolymer, poly [(methylhydrogensiloxane) (diethylsiloxane)] copolymer, poly [(methylhydrogen) Siloxane) (hexylmethylsiloxane)] copolymer, poly [(methylhydr
- the weight average molecular weight is preferably 300 to 100,000, more preferably 1,000 to 50,000.
- “weight average molecular weight” refers to a weight average molecular weight in terms of polystyrene by GPC (gel permeation chromatography).
- moderate viscosity can be provided to a composition by adding (B) component as the weight average molecular weight of (B) component exists in the said range.
- the component (B) is not particularly limited as long as it is a compound having the structure represented by the general formula (2).
- the component (B) is not particularly limited as long as it is a compound having the structure represented by the general formula (2).
- diphenyl t-butylhydrosilane, tribenzylsilane, etc. Is mentioned.
- the composition can be made solvent-free by using the component (B). Since the component (B) can be arbitrarily mixed with the component (A), a solvent for dissolving the component (A) becomes unnecessary. Thereby, the bad effect by a solvent remaining in the hardening body as mentioned above can be prevented.
- the component (B) can suppress the thermal fluidity of the cured body.
- the (A) component reacts with the (B) component, whereby the (A) component becomes the (B) component.
- a cured product fixed to the substrate can be formed.
- Such a cured product can suppress thermal fluidity while maintaining the hygroscopicity of the component (A) described above.
- the component (B) can be arbitrarily mixed with the component (A), the transparency of the cured product obtained by curing the composition can be improved.
- the content of the component (B) in the composition according to the present embodiment is preferably 10% by mass or more and 90% by mass or less, more preferably 20% by mass when the total mass of the composition is 100% by mass. % Or more and 50% by mass or less. When the content of the component (B) is within the above range, a good cured product can be formed without impairing each function described above.
- the composition according to the present embodiment contains a catalyst (C) (hereinafter also simply referred to as “component (C)”) in order to promote the hydrosilylation reaction between the component (A) and the component (B). May be.
- the catalyst (C) is preferably a platinum complex or a rhodium complex.
- the platinum complex include a carbonylcyclovinylmethylsiloxane platinum complex, a platinum-octal / octanol complex, a cyclovinylmethylsiloxane platinum complex, a carbonyldivinylmethylplatinum complex, a divinyltetramethyldisiloxane platinum complex, and the like.
- the rhodium complex include tris (dibutyl sulfide) rhodium trichloride.
- the content of the component (C) in the composition according to the present embodiment is preferably 0.0001% by mass or more and 1% by mass or less, more preferably 100% by mass when the total mass of the composition is 100% by mass. It is 0.001 mass% or more and 0.1 mass% or less.
- the content of component (C) is within the above range, not only can the hydrosilylation reaction between component (A) and component (B) be promoted, but also the moisture absorption of the cured product obtained by curing the composition. It is preferable in that basic performance such as property and transparency is not impaired.
- the content ratio (W A / W B ) between the content (W A ) of the component ( A ) and the content (W B ) of the component ( B ) is preferably It is 0.18 or more and 5 or less, more preferably 1 or more and 5 or less, and particularly preferably 1 or more and 4 or less.
- the content ratio (W A / W B ) is within the above range, the obtained cured body can ensure a sufficient water absorption capacity and have excellent heat resistance and glass adhesion.
- a hygroscopic agent other than the component (A) may be further added.
- the hygroscopic agent other than the component (A) is not particularly limited as long as it has compatibility with the component (B).
- the moisture absorbent other than the component (A) for example, trihexyloxyaluminum, trioctyloxyaluminum, tridecyloxyaluminum, tridodecyloxyaluminum, trioctadecyloxyaluminum, tridecyloxyborane, tridodecyloxyborane, triocta Examples include decyloxyborane, tridecyl aluminum, and tridodecyl aluminum.
- a polymerizable compound other than the component (B) may be further added.
- the polymerizable compound other than the component (B) include (meth) acrylic acid, methyl methacrylate (MMA), ethyl methacrylate (EMA), propyl methacrylate (PMA), butyl methacrylate (BMA), and methacrylic acid.
- EHMA Ethylhexyl
- TMSPMA trimethoxysilylpropyl methacrylate
- t-BMA tertiary butyl methacrylate
- methacrylic acid hydrogenated butadiene trade name “L1253” manufactured by Kuraray Co., Ltd.
- methyl acrylate acrylic acid
- Polymerizable compounds having an acrylic group such as ethyl and benzyl acrylate Polymerizable compounds having a vinyl ether group such as triethylene glycol divinyl ether; Polymerizable compounds having a vinyl group such as vinylcyclohexene monooxide; Oxetanyl groups and oxirani Polymerizable compound having a cyclic ether group such as and the like.
- These polymerizable compounds may be used singly or in combination of two or more.
- a stabilizer may be further added to the composition according to the present embodiment.
- a stabilizer By adding a stabilizer, the gelation of the composition according to the present embodiment can be suppressed, and the storage stability is improved.
- the stabilizer include sulfur compounds, phosphorus compounds, alkyne compounds, maleic acid derivatives, nitrogen-containing compounds, and the like.
- benzothiazole tris (2,4-di-t-butylphenyl) phosphite, 1-ethynyl-1-cyclohexanol, diethyl malate, N-methylpyrrolidone, 1,3-dimethyl-2- And imidazolidone, N-vinyl- ⁇ -caprolactam (all available from Tokyo Chemical Industry Co., Ltd.), and the like.
- These stabilizers may be used alone or in combination of two or more. By using these stabilizers, the gelation time can be appropriately controlled, so that a composition having excellent storage stability can be obtained, and a good cured product can be produced.
- the content of the stabilizer is preferably 0.01 parts by weight or more and 5 parts by weight or less, more preferably 0.05 parts by weight or more when the total weight of the composition excluding the stabilizer is 100 parts by weight. It is 0.05 parts by mass or less and particularly preferably 1 part by mass or less. When the content of the stabilizer is in the above range, the storage stability of the composition is improved, so that a sufficient pot life can be obtained and the curability of the composition is not impaired.
- the composition according to the present embodiment may be mixed with a heat conductive filler as necessary in order to enhance the heat transfer. Since an organic EL lighting device using a plurality of organic EL elements in which the composition according to this embodiment is used generates heat, the temperature in the vicinity of the element increases, resulting in luminance characteristics such as luminance and luminous efficiency. There may be inconvenience of adverse effects. However, it is preferable to mix a heat-conducting filler because heat dissipation can be improved and the element can be protected from moisture, and at the same time, the element can be protected from adverse effects due to heat generation.
- the heat conductive filler known fillers such as inorganic particles can be used.
- inorganic particles When inorganic particles are used as the heat conductive filler, not only the thermal conductivity of the cured product formed using the composition according to the present embodiment is improved, but the component (A) is decomposed by moisture absorption.
- the components (decomposition products) generated in this manner can be adsorbed to capture the decomposition products inside the cured body. Thereby, it can prevent that the said decomposition product acts as a plasticizer of a hardening body. That is, the cured body formed using the composition according to the present embodiment is not deformed by heat flow even in a use environment exceeding 80 ° C., for example.
- other functions of the inorganic particles include improving the mechanical strength of a cured product formed using the composition according to the present embodiment, increasing the hygroscopic capacity of the cured product, and the like.
- inorganic particles refers to particles formed from compounds other than organic compounds having carbon atoms in the basic skeleton of the structure, but particles formed from allotropes of carbon are included.
- the material of the inorganic particles is preferably a metal oxide or a metal nitride.
- the metal oxide include silica (including silica gel), smectite, zeolite, alumina, titanium oxide, zirconia, magnesia, and various glass powders used for heat dissipation materials.
- the metal nitride include boron nitride, aluminum nitride, and silicon nitride.
- silicon carbide boron carbide, and activated carbon can also be used as inorganic particles.
- alumina silica, boron nitride, aluminum nitride, silicon nitride, magnesia, silicon carbide, boron carbide and smectite
- alumina and / or boron nitride particles are particularly preferable. These inorganic particles may be used alone or in combination of two or more.
- the method for producing the silica particles used in the present embodiment is not particularly limited, and a conventionally known method can be applied. For example, it can be produced according to the method for producing a silica particle dispersion described in JP-A No. 2003-109921 and JP-A No. 2006-80406. Further, as a conventionally known method, there is a method of producing silica particles by removing alkali from an alkali silicate aqueous solution.
- the alkali silicate aqueous solution include a sodium silicate aqueous solution, an ammonium silicate aqueous solution, a lithium silicate aqueous solution, and a potassium silicate aqueous solution that are generally known as water glass.
- ammonium silicate include silicates made of ammonium hydroxide and tetramethylammonium hydroxide.
- the silica particles used in the present embodiment are preferably hydrophobically modified.
- “Hydrophobic modification” means that a hydrogen atom of a silanol group (—SiOH) present in a silica particle is substituted with a hydrophobic group (—R) such as an alkyl group.
- Silanol groups present on the surface of the silica particles tend to reduce the water absorption capacity of the cured product formed from the composition according to the present embodiment by reacting with the component (A). Therefore, it is possible to suppress a decrease in water absorption ability of the cured body by hydrophobically modifying the silanol group present on the surface of the silica particles.
- the dispersibility of the silica particle at the time of mixing improves by performing the hydrophobic modification of the silica particle.
- the shape of the inorganic particles is not particularly limited, and may be spherical or elliptical, or polygonal.
- the inorganic particles may be porous particles, or core / shell particles having a hollow inside.
- the average particle size of the inorganic particles is preferably 5 to 5,000 nm, more preferably 5 to 2,000 nm, still more preferably 5 to 500 nm, and particularly preferably 5 to 100 nm.
- an average particle diameter of 5 to 100 nm is advantageous in that a cured product having excellent transparency can be formed.
- the average particle size is within the above range, it becomes easy to impart an appropriate viscosity as described later to the composition, and workability (applicability, etc.) when forming a cured product is improved.
- the inorganic particles have a surface area sufficient to capture the decomposition products, thereby suppressing deformation due to heat flow of the cured body. preferable.
- the average particle size of the inorganic particles is preferably calculated from the specific surface area measured using the BET method, but is not limited thereto, and can be measured by other known methods.
- the average particle size of the inorganic particles is measured by collecting the cured body formed from the composition according to the present embodiment, cutting the cured body, and observing the cut surface with an electron microscope or the like. You can also. By measuring by this method, the average particle diameter of the inorganic particles can be measured even after the cured body is formed.
- the content of the inorganic particles in the composition according to the present embodiment is preferably 0.1% by mass or more from the viewpoint of improving the thermal conductivity of the cured body when the total mass of the composition is 100% by mass. It is 80 mass% or less, More preferably, it is 20 mass% or more and 60 mass% or less. Furthermore, from the viewpoint of ensuring the transparency of the cured body, it is preferably 0.1% by mass or more and 20% by mass or less, and more preferably 0.1% by mass or more and 10% by mass or less. In addition, if content of an inorganic particle is 0.1 mass% or more, the hardening body which does not deform
- composition concerning this Embodiment can be manufactured by mixing (A) component and (B) component, and (C) component and another additive as needed.
- the method of mixing these components is not particularly limited, but the component (A) is added little by little while stirring the component (B) (added with the component (C) and other additives as necessary).
- the composition concerning this Embodiment can be obtained by making it melt
- the composition according to this embodiment preferably has a viscosity at 20 ° C. of 50 to 500,000 cP.
- the composition can be directly applied to the element substrate and cured by the ODF method or the dispensing method. This eliminates the need to prepare the composition according to the present embodiment in the form of a film or the like in advance and incorporate it into the element, thereby simplifying the process. Further, if a photoacid generator or the like is added to the composition according to the present embodiment to impart photosensitivity, fine patterning becomes possible. In addition, the said viscosity shows the value measured by the falling needle method.
- composition concerning this Embodiment can form the hardening body containing (A) component, it can be used for the use which capture
- the composition according to the present embodiment can be used as a moisture scavenger for organic EL elements, organic TFTs, organic solar cells, organic CMOS sensors and the like, and is particularly suitably used as a moisture scavenger for organic EL elements.
- the “cured body” means a film whose viscosity or hardness has increased from that of the original composition by forming or molding the above composition into a shape suitable for use and further heating or irradiating with light.
- the cured body according to the present embodiment can be obtained, for example, by applying the above composition onto a substrate such as a glass substrate to form a film, and then curing it by heating or light irradiation.
- the cured body contains a component (A) having an R 1 -M bond.
- This R 1 -M bond reacts with moisture to capture moisture, and the effects of the present invention can be achieved. Therefore, in order to use the cured body for the purpose of capturing moisture, it is necessary that the R 1 -M bond is substantially present in the cured body.
- Examples of the coating method include a spin coater, a roll coater, a spray coater, a dispenser, and a method using an inkjet device.
- the temperature at the time of curing is, for example, preferably 40 ° C to 250 ° C, and more preferably 50 ° C to 150 ° C.
- a good cured product can be produced by heating to a temperature in the above range.
- the shape of the obtained cured body is not particularly limited, but has, for example, a film shape.
- the film thickness is preferably 5 to 100 ⁇ m, for example.
- the content of the component (A) in the cured product according to the present embodiment is preferably 10% by mass or more and 90% by mass or less, more preferably 50% by mass or more when the total mass of the cured product is 100% by mass. 80% by mass or less. It is preferable that the content of the component (A) is in the above range because a function of capturing moisture can be sufficiently expressed. Furthermore, it is preferable that the content of the component (A) is in the above-mentioned range because the film formability is improved and the cured body is easily imparted with transparency.
- the electronic device according to the present embodiment includes the cured body inside the electronic device.
- the cured body can be mounted on any electronic device as long as it is an electronic device that dislikes moisture.
- an example of an organic EL element which is a typical sealed electronic device, will be described with reference to the drawings.
- FIG. 1 is a diagram schematically showing a cross section of the organic EL element 100 according to the first embodiment.
- the organic EL element 100 includes an organic EL layer 10, a structure 20 that houses the organic EL layer and blocks it from the outside air, and a trapping agent layer 30 formed in the structure 20. It consists of.
- the organic EL layer 10 may have a structure in which an organic light emitting material layer made of an organic material is sandwiched between a pair of electrodes facing each other.
- anode / charge (hole) transport agent / light emitting layer / cathode A known structure such as the above can be adopted.
- the scavenger layer 30 is a cured product of the above composition. As shown in FIG. 1, the scavenger layer 30 is formed away from the organic EL layer 10.
- the structure 20 includes a substrate 22, a sealing cap 24, and an adhesive 26.
- the substrate 22 include a glass substrate
- examples of the sealing cap 24 include a structure made of glass.
- the structure of the structure 20 is not particularly limited as long as the organic EL layer 10 can be accommodated.
- FIG. 2 is a diagram schematically showing a cross section of the organic EL element 200 according to the second embodiment.
- the organic EL element 200 is different from the organic EL element 100 in that the capturing agent layer 30 formed in the structure 20 is formed in close contact with the organic EL layer 10. Since the scavenger layer 30 is a cured body with little residual or generated volatile components, the display characteristics of the organic EL layer 10 are not impaired.
- the trapping agent layer 30 can protect the organic EL layer 10 while preventing moisture from entering the organic EL layer 10.
- TMDE-3 tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum
- FIG. 3 is a 1 H-NMR spectrum of the obtained TMDE-3.
- toluene-d8 near peak ⁇ 2.1
- FIG. 3 shows that the obtained compound has a chemical structure represented by the above formula (5).
- TMDE-3B a mixture containing allyloxymethyl) -1-butoxy) aluminum
- TMDE-3C a mixture containing allyloxymethyl) -1-butoxy) aluminum
- FIG. 4 is a 1 H-NMR spectrum diagram of the obtained DEGV-3.
- toluene-d8 near peak ⁇ 2.1
- FIG. 4 shows that the obtained compound has a chemical structure represented by the above formula (6).
- the tri (2- (2-vinyloxyethoxy) ethoxy) aluminum (DEVV-3) thus obtained was used as the component (A) in the following examples.
- Catalyst (C) In the following Examples and Comparative Examples, the following commercially available compounds were used as the catalyst (C). ⁇ Cyclovinylmethylsiloxane platinum complex (manufactured by Amax Co., Ltd., trade name “SIP6832.0”, 3 mass% methylvinylsiloxane-containing product) ⁇ Carbonyldivinylmethylplatinum complex (manufactured by Amax Co., Ltd., trade name “SIP6832.0”, 3 mass% vinylmethyl cyclic siloxane-containing product)
- a predetermined amount of the component corresponding to the compound (A) and the component corresponding to the compound (B) are mixed and sufficiently stirred to obtain a uniform solution. did.
- a predetermined amount of stabilizer was added thereto and further stirred until a uniform solution was obtained.
- a predetermined amount of catalyst (C) was added to obtain compositions A to V described in Table 1 or Table 2.
- compositions of Compositions A to V are shown in Table 1 and Table 2.
- TMDE-3 tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum (synthesized in the above “4.1.1.”)
- TMDE-3B tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum
- TMDE-3C mixture containing tri (2,2-bis (allyloxymethyl) -1-butoxy) aluminum (synthesized in the above section "4.1.1.”)
- DEVV-3 tri (2- (2-vinyloxyethoxy) ethoxy) aluminum (synthesized in the above “4.1.2.”) ⁇ “TD-3”; tridodecylaluminum ⁇ “(i-PrO) 3Al”: aluminum isopropoxide ⁇ “PMHS”; polymethylhydrogensiloxane ⁇ “PEHS”; polyeth
- Hygroscopicity A glass petri dish having an inner diameter of 3 cm, each of the films of Examples and Comparative Examples having a thickness of 0.6 mm were prepared, and a desiccator with an internal volume of 800 cm 3 equipped with a hygrometer and a thermometer. The prepared film was put together with the glass petri dish, and the changes in humidity and temperature inside the desiccator were measured.
- the absolute humidity (Ha,%) was determined from the relative humidity (Hr,%) and the temperature in degrees Celsius (Tc, ° C) obtained by the measurement according to the following formula (7).
- the reduction rate of absolute humidity Ha (2h) 2 hours after absolute humidity Ha (0h) at the time of a measurement start was made into water absorption, and the water absorption was computed and evaluated by following formula (8).
- Water absorption rate (%) 100 ⁇ (Ha (0h) ⁇ Ha (2h)) / Ha (0h) (8)
- the water absorption rate (%) is preferably 20% or more, more preferably 30% or more, and particularly preferably 40% or more.
- Example 13 where no stabilizer was added, gelation took about 15 minutes, whereas in Examples 7 to 12 where a stabilizer was added, gelation did not occur for more than one week. From this result, it was found that the storage stability was dramatically improved by adding a stabilizer.
- Example 2 In the composition of Example 2, not only TMDE-3 but also the moisture absorbent TD-3 was added, but the addition of TD-3 did not affect the performance of the film.
- the content ratio (W A / W B ) of the composition of Example 3 is 0.18.
- the water absorption was 30%, and a tendency to decrease as compared with the compositions of Example 1 and Example 2 was recognized, but the product was in the category of non-defective products.
- Example 5 the compound (B) was changed to PPMHS having a Si—H group at the end. This did not affect the performance of the film.
- Example 6 the catalyst (C) was changed to a carbonyldivinylmethylplatinum complex. This did not affect the performance of the film.
- Example 14 and Example 15 a mixture containing TMDE-3 as the compound (A) was used. In these examples, almost the same result as in Example 12 was obtained, and the performance of the film was not affected by using a mixture containing TMDE-3 as the compound (A).
- Example 16 and Example 17 DEGV-3 was used instead of TMDE-3.
- the curing time was longer than when TMDE-3 was used, the use of DEGV-3 as the compound (A) did not affect the performance of the film.
- Comparative Example 1 is an example using calcium oxide (CaO) generally used as a hygroscopic agent instead of the compound (A). This calcium oxide was in a state of being dispersed without being dissolved in the compound (B). In Comparative Example 1, since the solution was not cured and did not become a film, the water absorption rate could not be measured.
- CaO calcium oxide
- Comparative Example 2 is an example in which barium oxide (BaO), which is generally used as a hygroscopic agent, is used instead of the compound (A). This barium oxide was not dissolved in the compound (B) but was dispersed. In Comparative Example 2, the water absorption rate could not be measured because the solution did not cure and became a film as in Comparative Example 1.
- BaO barium oxide
- Comparative Example 3 is an example in which PMS having no Si—H group was used in place of the compound (B).
- the PMS having no Si—H group could not react with the compound (A), and the molecular weight of the component in the film did not increase, so that the fluidity could not be suppressed. For this reason, a film could not be formed, and the water absorption rate could not be measured. Similarly, transparency, film formability, and glass adhesion could not be evaluated.
- Comparative Example 4 is an example using TD-3 as a hygroscopic agent instead of the compound (A).
- the organic group in TD-3 did not have an unsaturated bond, the hydrosilylation reaction with compound (B) could not be performed. Therefore, since the molecular weight of the component in the cured body does not increase, the fluidity cannot be suppressed, and deformation of the film was observed. Furthermore, in the heat fluidity test, deformation of the film due to the generation of low molecular weight alkanes and alcohols was also observed. Water absorption, transparency, film formability, and glass adhesion could not be evaluated because a film could not be formed.
- Comparative Example 5 is an example using (i-PrO) 3Al as a hygroscopic agent instead of the compound (A).
- the organic group in (i-PrO) 3Al did not have an unsaturated bond, the hydrosilylation reaction with compound (B) could not be performed. Therefore, since the molecular weight of the component in the cured body does not increase, the fluidity cannot be suppressed, and deformation of the film was observed. Furthermore, in the heat fluidity test, deformation of the film due to the generation of low molecular weight alcohol was also observed. Water absorption, transparency, film formability, and glass adhesion could not be evaluated because a film could not be formed.
- the film formed from the composition containing the compound (A) and the compound (B) is excellent in water absorption and heat resistance, as well as transparency, film formability, and glass adhesion. I understood that.
- the present invention includes substantially the same configuration (for example, a configuration having the same function, method, and result, or a configuration having the same purpose and effect) as the configuration described in the embodiment.
- the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced.
- the present invention includes a configuration that achieves the same effect as the configuration described in the embodiment or a configuration that can achieve the same object.
- the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
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Abstract
Description
本発明にかかる組成物の一態様は、
下記一般式(1)で示される化合物(A)と、
下記一般式(2)で示される構造を有する化合物(B)と、
を含有する。
(上記式(1)中、R1は、置換もしくは非置換の、アルキル基、アルケニル基、アルキニル基、環式アルキル基、アリール基、カルボキシル基およびR3O-で表される基から選択される1種である。複数存在するR1は同一または異なってもよいが、複数存在するR1のうち少なくとも1個は1以上の不飽和結合を有する基である。R3は、置換もしくは非置換の、アルキル基、アルケニル基、アルキニル基、環式アルキル基およびアリール基から選択される1種である。nは2~4の整数であり、Mの原子価に等しい。Mは2~4価の原子である。)
適用例1において、
前記化合物(A)は、炭素-炭素不飽和結合を有することができる。
適用例1または適用例2において、
前記一般式(1)の前記Mは、アルミニウム、ホウ素、マグネシウム、カルシウム、チタン、ジルコニウムおよび亜鉛から選択される少なくとも1種であることができる。
適用例1ないし適用例3のいずれか一例において、
前記化合物(B)は、下記一般式(3)で示される繰り返し単位を有するポリシロキサンであることができる。
適用例1ないし適用例4のいずれか一例において、
前記化合物(A)は、下記一般式(4)で示される化合物であることができる。
適用例1ないし適用例5のいずれか一例において、
前記化合物(A)と前記化合物(B)とのヒドロシリル化反応を促進させるための触媒(C)をさらに含有することができる。
適用例1ないし適用例6のいずれか一例において、
ベンゾチアゾール、トリス(2,4-ジ-t-ブチルフェニル)フォスファイト、1-エチニル-1-シクロヘキサノール、ジエチルマレート、N-メチルピロリドン、1,3-ジメチル-2-イミダゾリドンおよびN-ビニル-ε-カプロラクタムから選択される少なくとも1種の安定化剤をさらに含有することができる。
適用例1ないし適用例7のいずれか一例に記載の組成物は、水分を捕捉する用途に使用することができる。
本発明にかかる硬化体の一態様は、
適用例8に記載の水分捕捉用組成物を用いて形成されたことを特徴とする。
本発明にかかる電子デバイスの一態様は、
適用例9に記載の硬化体を備えたことを特徴とする。
本実施の形態にかかる組成物は、
下記一般式(1)で示される化合物(A)(以下、単に「(A)成分」ともいう。)と、下記一般式(2)で示される構造を有する化合物(B)(以下、単に「(B)成分」ともいう。)と、を含有する。
(上記式(1)中、R1は、置換もしくは非置換の、アルキル基、アルケニル基、アルキニル基、環式アルキル基、アリール基、カルボキシル基およびR3O-で表される基から選択される1種である。複数存在するR1は同一または異なってもよいが、複数存在するR1のうち少なくとも1個は1以上の不飽和結合を有する基である。R3は、置換もしくは非置換の、アルキル基、アルケニル基、アルキニル基、環式アルキル基およびアリール基から選択される1種である。nは2~4の整数であり、Mの原子価に等しい。Mは2~4価の原子である。)
本実施の形態にかかる組成物は、上記一般式(1)で示される化合物(A)を含有する。(A)成分の機能の一つとしては、(A)成分中に存在するR1-M結合が水分と反応することにより、水分を捕捉することが挙げられる。このような(A)成分を用いることにより、吸湿性に優れた硬化体を得ることができる。すなわち、本実施の形態にかかる組成物から形成される硬化体を水分を捕捉する用途に用いるためには、該硬化体中に実質的にR1-M結合が存在している必要がある。そのためには、本実施の形態にかかる組成物中においても、実質的にR1-M結合が存在している必要がある。
本実施の形態にかかる組成物は、上記一般式(2)で示される構造を有する化合物(B)を含有する。かかる化合物(B)は、上記一般式(2)で示される構造を有するポリマーであってもよいし、モノマーであってもよい。
本実施の形態にかかる組成物は、(A)成分と(B)成分とのヒドロシリル化反応を促進させるために、触媒(C)(以下、単に「(C)成分」ともいう。)を含有してもよい。触媒(C)としては、白金錯体またはロジウム錯体が好ましい。白金錯体としては、例えば、カルボニルシクロビニルメチルシロキサン白金錯体、白金-オクタナル/オクタノール錯体、シクロビニルメチルシロキサン白金錯体、カルボニルジビニルメチル白金錯体、ジビニルテトラメチルジシロキサン白金錯体等が挙げられる。ロジウム錯体としては、例えば、トリス(ジブチルスルフィド)ロジウムトリクロライド等が挙げられる。
本実施の形態にかかる組成物において、前記(A)成分の含有量(WA)と前記(B)成分の含有量(WB)との含有比率(WA/WB)は、好ましくは0.18以上5以下であり、より好ましくは1以上5以下であり、特に好ましくは1以上4以下である。含有比率(WA/WB)が前記範囲内であることにより、得られる硬化体は、十分な吸水容量を確保できると共に、優れた耐熱性およびガラス密着性を有することができる。含有比率(WA/WB)が0.18未満であると、得られる硬化体の吸水容量が小さくなり水分捕捉剤としての機能が十分に発揮されず、成膜性、ガラス密着性の点で劣る傾向がある。一方、含有比率(WA/WB)が5を超えると、得られる硬化体の吸水容量については十分であるが、耐熱性、成膜性、ガラス密着性の点で劣る傾向がある。
本実施の形態にかかる組成物には、上記(A)成分以外の吸湿剤をさらに添加してもよい。(A)成分以外の吸湿剤は、(B)成分と相溶性を有するものであれば特に制限されない。(A)成分以外の吸湿剤としては、例えばトリヘキシロキシアルミニウム、トリオクチロキシアルミニウム、トリデシロキシアルミニウム、トリドデシロキシアルミニウム、トリオクタデシロキシアルミニウム、トリデシロキシボラン、トリドデシロキシボラン、トリオクタデシロキシボラン、トリデシルアルミニウム、トリドデシルアルミニウム等が挙げられる。
本実施の形態にかかる組成物は、(A)成分および(B)成分、必要に応じて(C)成分、その他の添加剤を混合することにより製造することができる。これらの成分を混合する方法は、特に制限されないが、(B)成分(必要に応じて(C)成分、その他の添加剤を加えたもの)を撹拌しながら(A)成分を少量ずつ添加して溶解させることで本実施の形態にかかる組成物を得ることができる。
本実施の形態にかかる組成物は、20℃における粘度が50~500,000cPであることが好ましい。粘度が前記範囲内であることにより、組成物をODF法やディスペンス法により直接、素子基板へ塗布し、硬化させることができる。これにより、本実施の形態にかかる組成物をフィルム状等の成形体としてあらかじめ作製しておき、それを素子へ組み込む工程を経る必要がなくなるので、工程を簡略化することができる。また、本実施の形態にかかる組成物に光酸発生剤等を添加して、感光性を付与すれば、微細なパターニングが可能となる。なお、上記粘度は、フォーリング・ニードル法により測定される値を示す。
本発明において「硬化体」とは、上記組成物を使用に適する形状に成膜もしくは成形し、さらに加熱または光照射することにより、もとの組成物よりも粘度または硬度が上昇したものをいう。
本実施の形態にかかる電子デバイスは、上記硬化体を電子デバイスの内部に備えている。水分を嫌う電子デバイスであれば、いかなる電子デバイスにも上記硬化体を搭載することができる。以下、代表的な密閉型電子デバイスである有機EL素子の一例について図面を参照しながら説明する。
以下、本発明に関して実施例を挙げて説明するが、本発明はこれらの実施例により何ら制限されるものではない。
4.1.1.トリ(2,2-ビス(アリロキシメチル)-1-ブトキシ)アルミニウムの合成
500mLの三口フラスコに、トリメチロールプロパンジアリルエーテル(ダイソー株式会社製、商品名「ネオアリルT-20」)162.0g[756mmol]を仕込み、撹拌しながら少量ずつトリイソブチルアルミニウム50.0g[252.7mmol]をグローボックス中で滴下した。1時間そのまま撹拌した後、120℃で90分間撹拌した。温度を120℃に保ちつつ、真空ポンプによって減圧しながら未反応の原料を留去し、室温まで冷却してトリ(2,2-ビス(アリロキシメチル)-1-ブトキシ)アルミニウム(以下、「TMDE-3」という)164.0gを無色透明油状物として得た。収率は、定量的であった。
200mLの三口フラスコに、トリイソプロポキシアルミニウム15.0g[73.4mmol]および乾燥トルエン45mLを仕込み、乾燥窒素雰囲気下で攪拌しながらトリイソプロポキシアルミニウムを溶解した。そこへ、2-(2-ビニロキシエトキシ)エタノール33.0mL[257mmol]加え、90℃で10分間保った後、温度をそのまま13.3kPaにて反応で出てくる2-プロパノールを留去し、133Paにて未反応の2-(2-ビニロキシエトキシ)エタノールを留去した。このようにして、トリ(2-(2-ビニロキシエトキシ)エトキシ)アルミニウム(以下、「DEGV-3」という)32gを無色透明油状物として得た。収率は、定量的であった。
以下に示す実施例および比較例において、市販されている下記の化合物を化合物(B)として使用した。
・ポリメチルハイドロジェンシロキサン(アヅマックス株式会社製、商品名「HMS-991」)
・ポリエチルハイドロジェンシロキサン(アヅマックス株式会社製、商品名「HES-992」)
・ポリフェニル(ジメチルハイドロジェンシロキシ)シロキサン(アヅマックス株式会社製、商品名「HDP-111」)
以下に示す実施例および比較例において、市販されている下記の化合物を触媒(C)として使用した。
・シクロビニルメチルシロキサン白金錯体(アヅマックス株式会社製、商品名「SIP6832.0」、3質量%メチルビニルシロキサン含有品)
・カルボニルジビニルメチル白金錯体(アヅマックス株式会社製、商品名「SIP6832.0」、3質量%ビニルメチル環状シロキサン含有品)
以下に示す実施例および比較例において、市販されている下記の化合物を安定化剤として使用した。
・ベンゾチアゾール(東京化成工業株式会社製)
・トリス(2,4-ジ-t-ブチルフェニル)フォスファイト(東京化成工業株式会社製)
・1-エチニル-1-シクロヘキサノール(東京化成工業株式会社製)
・ジエチルマレート(東京化成工業株式会社製)
・N-メチルピロリドン(東京化成工業株式会社製)
・N-ビニル-ε-カプロラクタム(東京化成工業株式会社製)
以下に示す実施例および比較例において、市販されている下記の化合物を添加剤として使用した。
・トリドデシルアルミニウム(ケムチュラ株式会社製、商品名「TA0365」)
・ポリジメチルシロキサン(アヅマックス株式会社製、商品名「DMS-T21」)
・アルミニウムイソプロポキシド(シグマ アルドリッチ ジャパン株式会社製)
4.6.1.フィルムの作製
下記のようにして、実施例1~18および比較例1~5において評価するフィルムを作製した。
・「TMDE-3」;トリ(2,2-ビス(アリロキシメチル)-1-ブトキシ)アルミニウム(前記「4.1.1.」項で合成したもの)
・「TMDE-3B」;トリ(2,2-ビス(アリロキシメチル)-1-ブトキシ)アルミニウムを含有する混合物(前記「4.1.1.」項で合成したもの)
・「TMDE-3C」;トリ(2,2-ビス(アリロキシメチル)-1-ブトキシ)アルミニウムを含有する混合物(前記「4.1.1.」項で合成したもの)
・「DEGV-3」;トリ(2-(2-ビニロキシエトキシ)エトキシ)アルミニウム(前記「4.1.2.」項で合成したもの)
・「TD-3」;トリドデシルアルミニウム
・「(i-PrO)3Al」:アルミニウムイソプロポキシド
・「PMHS」;ポリメチルハイドロジェンシロキサン
・「PEHS」;ポリエチルハイドロジェンシロキサン
・「PPMHS」;ポリフェニル(ジメチルハイドロジェンシロキシ)シロキサン
・「PMS」;ポリジメチルシロキサン
・「BT」;ベンゾチアゾール
・「TDBPP」;トリス(2,4-ジ-t-ブチルフェニル)フォスファイト
・「ECHO」;1-エチニル-1-シクロヘキサノール
・「DEM」;ジエチルマレート
・「NMP」;N-メチルピロリドン
・「VC」;N-ビニル-ε-カプロラクタム
上記「4.6.1.フィルムの作製」で得られた各フィルムについて、吸湿性、透明性、成膜性、ガラス密着性および貯蔵安定性(ゲル化時間)を下記の方法により評価した。なお、熱流動性は、下記の方法により別途フィルムを作製して評価した。その結果を表1および表2に併せて示す。
内径3cmのガラスシャーレに、実施例、比較例の各フィルムで厚さが0.6mmのものを作製し、湿度計と温度計を装着した内容積800cm3のデシケーターに、先に作製したフィルムをガラスシャーレごと入れ、デシケーター内部の湿度と温度の変化を測定した。測定により得られた相対湿度(Hr、%)、摂氏温度(Tc、℃)の値から下記式(7)により絶対湿度(Ha、%)を求めた。そして、測定開始時の絶対湿度Ha(0h)から2時間後の絶対湿度Ha(2h)の減少割合を吸水率とし、吸水率を下記式(8)により算出して評価した。
吸水率(%)=100×(Ha(0h)-Ha(2h))/Ha(0h) …(8)
吸水率(%)は、20%以上が好ましく、30%以上がより好ましく、40%以上が特に好ましい。
まず、組成物A~Vのいずれか1種をサンプル管中に適量入れて、80℃で60分間加熱することにより、膜厚2mmのフィルムを前記サンプル管の底部に作製した。次に、大気中で前記フィルムを十分に吸湿させた後、さらに蓋を閉めシールし、サンプル管の底部が上(成膜面が上)となるように固定した状態で85℃の環境下に静置した。その後336時間経過した時点のフィルムの状態を観察した。なお、熱流動性の評価基準は、フィルムに変化が認められなかった場合を「○」、フィルムが下方へ垂れて変形が認められた場合を「×」とした。
上記「4.6.1.フィルムの作製」で得られたフィルムについて、目視により白濁が生じないものを「○」、白濁するものを「×」とした。なお、透明性の要求されるトップエミッション型の有機EL等の用途に適用する場合には、透明性が良好なものが好ましい。
上記「4.6.1.フィルムの作製」で得られたフィルムについて、目視によりフィルムにクラックおよび凹凸が発生していないものを「○」、フィルムにクラックまたは凹凸が認められた場合を「×」とした。なお、有機EL等の用途に適用する場合には、クラックおよび凹凸の発生が抑制されているものが好ましい。
上記「4.6.1.フィルムの作製」で得られたフィルムについて、大気中でガラスから剥離しないものを「○」、剥離するものを「×」とした。なお、ガラス基板への密着性が要求される表示材料等の用途に適用する場合は、ガラス密着性が良好なものが好ましい。
組成物の調製後、すぐに得られた組成物を透明ガラス容器に少量加え、密閉して保管した。組成物をガラス容器に加えてから組成物に流動性が認められなくなった時点までの経過時間をゲル化時間として評価した。流動性の確認は、ガラス容器を傾けて、そのときの組成物の状態を目視で観察することにより行った。
表1および表2の結果から、実施例1~18の組成物から形成されたフィルムによれば、いずれの組成物も化合物(A)および化合物(B)を含有するため、優れた吸湿性および耐熱性を有していることが分かった。また、実施例1~18の組成物によれば、透明性、成膜性、ガラス密着性にも優れているフィルムが得られることが分かった。
Claims (10)
- 下記一般式(1)で示される化合物(A)と、
下記一般式(2)で示される構造を有する化合物(B)と、
を含有する、組成物。
(R1)nM …(1)
(上記式(1)中、R1は、置換もしくは非置換の、アルキル基、アルケニル基、アルキニル基、環式アルキル基、アリール基、カルボキシル基およびR3O-で表される基から選択される1種である。複数存在するR1は同一または異なってもよいが、複数存在するR1のうち少なくとも1個は1以上の不飽和結合を有する基である。R3は、置換もしくは非置換の、アルキル基、アルケニル基、アルキニル基、環式アルキル基およびアリール基から選択される1種である。nは2~4の整数であり、Mの原子価に等しい。Mは2~4価の原子である。)
- 請求項1において、
前記化合物(A)は、炭素-炭素不飽和結合を有する、組成物。 - 請求項1または請求項2において、
前記一般式(1)の前記Mは、アルミニウム、ホウ素、マグネシウム、カルシウム、チタン、ジルコニウムおよび亜鉛から選択される少なくとも1種である、組成物。 - 請求項1ないし請求項5のいずれか一項において、
前記化合物(A)と前記化合物(B)とのヒドロシリル化反応を促進させるための触媒(C)をさらに含有する、組成物。 - 請求項1ないし請求項6のいずれか一項において、
ベンゾチアゾール、トリス(2,4-ジ-t-ブチルフェニル)フォスファイト、1-エチニル-1-シクロヘキサノール、ジエチルマレート、N-メチルピロリドン、1,3-ジメチル-2-イミダゾリドンおよびN-ビニル-ε-カプロラクタムから選択される少なくとも1種の安定化剤をさらに含有する、組成物。 - 請求項1ないし請求項7のいずれか一項に記載の水分捕捉用組成物。
- 請求項8に記載の水分捕捉用組成物を用いて形成された、硬化体。
- 請求項9に記載の硬化体を備えた、電子デバイス。
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WO2011158719A1 (ja) * | 2010-06-18 | 2011-12-22 | 東ソー株式会社 | 典型金属含有ポリシロキサン組成物、その製造方法、及びその用途 |
JP2012006991A (ja) * | 2010-06-22 | 2012-01-12 | Jsr Corp | 重合体、組成物、硬化体および電子デバイス |
JP2012246359A (ja) * | 2011-05-26 | 2012-12-13 | Shin-Etsu Chemical Co Ltd | 剥離紙又は剥離フィルム用シリコーン組成物 |
WO2014069488A1 (ja) * | 2012-10-30 | 2014-05-08 | 東ソー株式会社 | ポリメタロキサン組成物、その製造方法、及びその用途 |
JP2019509638A (ja) * | 2016-03-31 | 2019-04-04 | ダウ グローバル テクノロジーズ エルエルシー | 不動態化薄膜トランジスタコンポーネント |
JP2019085369A (ja) * | 2017-11-07 | 2019-06-06 | 双葉電子工業株式会社 | アルコキシド化合物、乾燥剤、乾燥剤層、封止構造体及び有機el素子 |
WO2023013443A1 (ja) * | 2021-08-02 | 2023-02-09 | 信越化学工業株式会社 | 白金-亜リン酸エステル錯体含有ヒドロシリル化触媒、その製造方法、白金-亜リン酸エステル錯体含有ヒドロシリル化触媒の結晶化を抑制する方法及び硬化性オルガノポリシロキサン組成物並びに物品 |
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CN107565052B (zh) * | 2017-08-25 | 2020-04-17 | 京东方科技集团股份有限公司 | 封装结构及其制造方法、显示装置 |
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- 2010-10-15 KR KR1020127010818A patent/KR20120101635A/ko not_active Application Discontinuation
- 2010-10-15 CN CN201080053173.XA patent/CN102639642B/zh not_active Expired - Fee Related
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JP2019509638A (ja) * | 2016-03-31 | 2019-04-04 | ダウ グローバル テクノロジーズ エルエルシー | 不動態化薄膜トランジスタコンポーネント |
JP2019085369A (ja) * | 2017-11-07 | 2019-06-06 | 双葉電子工業株式会社 | アルコキシド化合物、乾燥剤、乾燥剤層、封止構造体及び有機el素子 |
WO2023013443A1 (ja) * | 2021-08-02 | 2023-02-09 | 信越化学工業株式会社 | 白金-亜リン酸エステル錯体含有ヒドロシリル化触媒、その製造方法、白金-亜リン酸エステル錯体含有ヒドロシリル化触媒の結晶化を抑制する方法及び硬化性オルガノポリシロキサン組成物並びに物品 |
Also Published As
Publication number | Publication date |
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CN102639642B (zh) | 2014-06-18 |
JP5664874B2 (ja) | 2015-02-04 |
CN102639642A (zh) | 2012-08-15 |
TWI476231B (zh) | 2015-03-11 |
KR20120101635A (ko) | 2012-09-14 |
EP2505613A4 (en) | 2012-12-12 |
TW201132681A (en) | 2011-10-01 |
EP2505613A1 (en) | 2012-10-03 |
JPWO2011065144A1 (ja) | 2013-04-11 |
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