WO2011059094A1 - コンタクト - Google Patents
コンタクト Download PDFInfo
- Publication number
- WO2011059094A1 WO2011059094A1 PCT/JP2010/070374 JP2010070374W WO2011059094A1 WO 2011059094 A1 WO2011059094 A1 WO 2011059094A1 JP 2010070374 W JP2010070374 W JP 2010070374W WO 2011059094 A1 WO2011059094 A1 WO 2011059094A1
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- WO
- WIPO (PCT)
- Prior art keywords
- solder joint
- contact
- elastic contact
- view
- elastic
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
- H05K9/0016—Gaskets or seals having a spring contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/245—Contacts for co-operating by abutting resilient; resiliently-mounted by stamped-out resilient contact arm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention provides a conductor pattern provided on the printed wiring board by being surface-mounted on a surface to be attached to the printed wiring board and sandwiched between the printed wiring board and a conductive member different from the printed wiring board. And a contact for electrically connecting the conductive member to the conductive member.
- solder joint portion whose lower surface is a solder joint surface soldered to the conductor pattern, and one end of the solder joint portion are joined and folded back above the solder joint portion.
- An elastic contact portion that is brought into a state of being pressed against the conductive member with elastic deformation when being brought into contact with the conductive member has been proposed.
- the contact configured as described above is configured such that the lower surface of the solder joint portion (solder joint surface) is soldered to the conductor pattern of the printed wiring board, and the ground conductor from above is connected to the elastic contact portion connected to one end of the solder joint portion.
- the elastic contact portion is elastically deformed by contacting a conductive member such as the like. Then, the elastic contact portion is brought into pressure contact with the conductive member by elastic deformation thereof, and the conductive pattern of the printed wiring board and the conductive member can be electrically connected.
- the present invention has been made for the purpose of providing a contact that can be automatically mounted by a suction nozzle without changing product characteristics, and that can secure a good stroke.
- a first aspect of the present invention is a contact formed by bending a thin metal plate.
- the contact is mounted on the surface to be attached to the printed wiring board when in use, and is sandwiched between the printed wiring board and a conductive member different from the printed wiring board, thereby providing the printed wiring board.
- the conductor pattern and the conductive member are electrically connected.
- the contact is connected to one end of the solder joint, the solder joint having a lower surface solder-bonded to the conductor pattern, and folded back above the solder joint.
- An elastic contact portion that comes into pressure contact with the conductive member with elastic deformation upon contact, and the elastic contact portion is connected to the solder joint portion independently of the elastic contact portion, and the tip is the conductive portion of the elastic contact portion.
- a suction portion that is arranged in parallel with the lower surface of the solder joint portion on the side of the adhesive member and serves as a suction surface for a suction nozzle of an automatic mounting machine.
- the present invention configured as described above is formed by bending a metal thin plate, and the lower surface (solder bonding surface) of the solder bonding portion is solder bonded to the conductor pattern of the printed wiring board. Further, the elastic contact portion connected to one end of the solder joint portion and folded back above the solder joint portion comes into a state of being pressed against the conductive member with elastic deformation when contacting the conductive member. . Therefore, the contact of the present invention is used by contacting the conductive member (for example, a ground conductor, a shield plate, etc.) from above the elastic contact portion and elastically deforming the elastic contact portion. Then, the elastic contact portion is brought into pressure contact with the conductive member by elastic deformation thereof, and the conductive pattern of the printed wiring board and the conductive member can be electrically connected.
- the conductive member for example, a ground conductor, a shield plate, etc.
- the suction part has a tip disposed parallel to the lower surface of the solder joint on the conductive member side of the elastic contact part, and the tip is a suction surface for a suction nozzle of an automatic mounting machine.
- suction part is connected with the said solder joint part independently of the said elastic contact part. For this reason, even if the suction nozzle is pushed into the suction surface, the suction surface is independent of the elastic contact portion, so that the elastic contact portion can be prevented from being distorted, and the product characteristics can be stabilized. Can be maintained.
- the suction surface at the tip of the suction portion is disposed on the conductive member side of the elastic contact portion, the stroke of the elastic contact portion is not reduced to provide the suction portion. Therefore, by ensuring the stroke of the elastic contact portion, the elastic contact portion can be pressed against the conductive member satisfactorily, and as a result, the conductor pattern of the printed wiring board and the conductive member are excellent. Can be electrically connected.
- the suction portion passes through a hole formed in the elastic contact portion, and the hole portion has a size that does not hinder the elastic deformation of the elastic contact portion. May be.
- the elastic contact portion is prevented from falling due to the inner wall surface of the hole contacting the suction portion. be able to.
- the hole portion since the hole portion has a size that does not prevent the suction portion from preventing the elastic deformation of the elastic contact portion, the product characteristics may change when the suction portion penetrates the hole portion. Absent.
- a second aspect of the present invention is a contact formed by bending a metal thin plate, and includes a defining portion to be described later.
- the contact of the second aspect is surface-mounted on the surface to be attached to the printed wiring board in use, and is sandwiched between the printed wiring board and a conductive member different from the printed wiring board, whereby the printed wiring
- the conductive pattern provided on the substrate is electrically connected to the conductive member.
- the contact includes a solder joint portion whose lower surface is a solder joint surface solder-bonded to the conductor pattern, and is connected to one end of the solder joint portion and folded back above the solder joint portion. Between the elastic contact portion that comes into pressure contact with the conductive member when elastically deformed, and between the folded back portion of the elastic contact portion and the contact portion that contacts the conductive member.
- a suction portion that is connected to the conductive member side of the elastic contact portion and parallel to the lower surface of the solder joint portion to be a suction surface for a suction nozzle of an automatic mounting machine; and When the elastic contact portion is not elastically deformed, it is disposed at a position where the distance between the adsorption portion and the solder joint portion can be defined.
- a specified portion which is disposed at a position that does not interfere with the elastic deformation of the elastic contact portion by displacement.
- the present invention configured as described above is formed by bending a metal thin plate, and the lower surface (solder bonding surface) of the solder bonding portion is solder bonded to the conductor pattern of the printed wiring board. Further, the elastic contact portion connected to one end of the solder joint portion and folded back above the solder joint portion comes into a state of being pressed against the conductive member with elastic deformation when contacting the conductive member. . Therefore, the contact of the present invention is used by contacting the conductive member (for example, a ground conductor, a shield plate, etc.) from above the elastic contact portion and elastically deforming the elastic contact portion. Then, the elastic contact portion is brought into pressure contact with the conductive member by elastic deformation thereof, and the conductive pattern of the printed wiring board and the conductive member can be electrically connected.
- the conductive member for example, a ground conductor, a shield plate, etc.
- suction part of this invention is connected between the said folding
- the suction surface for the suction nozzle of the automatic mounting machine is provided by being arranged in parallel with the lower surface of the solder joint.
- the following defining portion is connected to the suction portion. That is, when the elastic contact portion is not elastically deformed, the defining portion is disposed at a position where the distance between the adsorption portion and the solder joint portion can be defined in a rod shape, and the elastic contact portion is elastically deformed. In some cases, the elastic contact portion is disposed at a position that does not hinder the elastic deformation of the elastic contact portion by changing in accordance with the elastic deformation.
- the elastic contact portion Since the elastic contact portion is not elastically deformed during automatic mounting by the suction nozzle of the automatic mounting machine, the distance between the suction portion and the solder joint portion is defined by the defining portion. For this reason, even if the suction nozzle is pushed into the suction surface of the suction portion, it is possible to suppress the displacement of the suction portion by the defining portion and suppress distortion in the elastic contact portion. Product characteristics can be maintained stably.
- the suction portion is disposed on the conductive member side of the elastic contact portion, the stroke of the elastic contact portion is not reduced to provide the suction portion. Therefore, by ensuring the stroke of the elastic contact portion, the elastic contact portion can be pressed against the conductive member satisfactorily, and as a result, the conductor pattern of the printed wiring board and the conductive member are excellent. Can be electrically connected.
- the defining portion is moved along with the elastic deformation, so that the defining portion does not hinder the elastic deformation of the elastic contact portion. Arranged in position. For this reason, the product characteristics are not changed by providing the defining portion.
- the lower end of the defining portion is bent in a direction along the lower surface of the solder joint portion, and the solder joint portion includes a portion of the defining portion when the elastic contact portion is not elastically deformed.
- a frame portion surrounding the lower end from the periphery may be formed, and the lower end of the defining portion may come out of the frame portion along with the elastic deformation of the elastic contact portion.
- the lower end of the defining portion bent in the direction along the lower surface of the solder joint portion is surrounded by a frame portion formed in the solder joint portion.
- the shape of the elastic contact portion projected onto the solder joint surface may be the same as or include the solder joint surface.
- the area of the outer shape of the elastic contact portion can be made larger than that of the solder joint surface, and the stroke is secured by arranging the suction surface of the suction portion on the conductive member side of the elastic contact portion. This effect is more noticeable.
- a length from the one end of the solder joint to the tip of the elastic contact portion is longer than a length from the one end of the solder joint to the other end of the solder joint. May be. Also in this case, the effect of securing the stroke by arranging the suction surface of the suction portion on the conductive member side of the elastic contact portion is more prominent.
- a further feature may be that one metal thin plate is bent.
- the manufacturing process of the contact can be simplified and the manufacturing cost can be further reduced.
- FIG. 1A is a top view
- FIG. 1B is a left view
- FIG. 1C is a front view
- FIG. 1D is a right view
- FIG. 1F is an upper left perspective view
- FIG. 1G is an upper right perspective view.
- FIG. 3A is a plan view
- FIG. 3B is a left side view
- FIG. 3C is a front view
- FIG. 3D is a right side view
- FIG. 3E is a bottom view
- FIG. 3F is an upper left perspective view
- FIG. 3G is an upper right perspective view.
- FIG. 5A is a plan view
- FIG. 5B is a left side view
- FIG. 5C is a front view
- FIG. 5D is a right side view
- FIG. 5E is a bottom view
- 5F is an upper left perspective view
- FIG. 5G is an upper right perspective view.
- FIG. 7A is a plan view
- FIG. 7B is a left side view
- FIG. 7C is a front view
- FIG. 7D is a right side view
- FIG. 7E is a bottom view
- 7F is an upper left perspective view
- FIG. 7G is an upper right perspective view.
- FIG. 9A is a plan view
- FIG. 9B is a left side view
- FIG. 9C is a front view
- FIG. 9D is a right side view
- FIG. 9E is a bottom view
- 9F is an upper left perspective view
- FIG. 9G is an upper right perspective view
- FIG. 10A is a plan view
- FIG. 10B is a left side view
- FIG. 10C is a front view
- FIG. 10D is a right side view
- FIG. 10E is a bottom view
- 10F is an upper left perspective view
- FIG. 10G is an upper right perspective view
- FIG. 11A is a plan view
- FIG. 11B is a left side view
- FIG. 11B is a left side view
- FIG. 11B is a left side view
- FIG. 11C is a front view
- FIG. 11D is a right side view
- FIG. 11E is a bottom view
- 11F is an upper left perspective view
- FIG. 11G is an upper right perspective view
- FIG. 11H is a lower left perspective view
- FIG. 11I is a lower right perspective view.
- FIG. 12A is a top view
- FIG. 12B is a left view
- FIG. 12C is a front view
- FIG. 12D is a right view
- FIG. 12F is an upper left perspective view
- FIG. 12G is an upper right perspective view
- FIG. 12H is a lower left perspective view
- FIG. 12I is a lower right perspective view.
- FIG. 12A is a top view
- FIG. 12B is a left view
- FIG. 12C is a front view
- FIG. 12D is a right view
- FIG. 12F is an upper left perspective view
- FIG. 12G is an upper right perspective view
- FIG. 12H is a lower
- FIG. 13A is a plan view
- FIG. 13B is a left side view
- FIG. 13C is a front view
- FIG. 13D is a right side view
- FIG. 13E is a bottom view, illustrating a configuration of a contact 91 according to a ninth embodiment of the present invention.
- 13F is an upper left perspective view
- FIG. 13G is an upper right perspective view
- FIG. 13H is a lower left perspective view
- FIG. 13I is a lower right perspective view.
- FIG. 14A is a plan view
- FIG. 14B is a left side view
- FIG. 14C is a front view
- FIG. 14D is a right side view
- FIG. 14E is a bottom view.
- 14F is an upper left perspective view
- FIG. 14B is a left side view
- FIG. 14C is a front view
- FIG. 14D is a right side view
- FIG. 14E is a bottom view
- 14F is an upper left perspective view
- FIG. 14G is an upper right perspective view
- FIG. 14H is a lower left perspective view
- FIG. 14I is a lower right perspective view
- FIG. 15A is a plan view
- FIG. 15B is a left side view
- FIG. 15C is a front view
- FIG. 15D is a right side view
- FIG. 15E is a bottom view
- 15F is an upper left perspective view
- FIG. 15G is an upper right perspective view
- FIG. 15H is a lower left perspective view
- FIG. 15I is a lower right perspective view
- FIG. 16A is a plan view
- FIG. 16B is a left side view
- FIG. 16C is a front view
- FIG. 16D is a right side view
- FIG. 16A is a plan view
- FIG. 16B is a left side view
- FIG. 16C is a front view
- FIG. 16D is a right side view
- FIG. 16E is a bottom view, illustrating a configuration of a contact 121 according to a twelfth embodiment of the present invention.
- 16F is an upper left perspective view
- FIG. 16G is an upper right perspective view
- FIG. 16H is a lower left perspective view
- FIG. 16I is a lower right perspective view.
- FIG. 17A is a plan view
- FIG. 17B is a left side view
- FIG. 17C is a front view
- FIG. 17D is a right side view
- FIG. 17E is a bottom view, illustrating a configuration of a contact 131 according to a thirteenth embodiment of the present invention.
- 17F is an upper left perspective view
- FIG. 17G is an upper right perspective view
- FIG. 17H is a lower left perspective view
- FIG. 17I is a lower right perspective view.
- FIG. 1A to 1G are views showing the configuration of the contact 1 according to the first embodiment of the present invention.
- FIG. 1A is a plan view
- FIG. 1B is a left side view
- FIG. 1C is a front view
- FIG. 1D is a right side view
- FIG. 1F is an upper left perspective view
- FIG. 1G is an upper right perspective view.
- the contact 1 is formed by punching a single thin plate made of a spring metal (for example, phosphor bronze, beryllium copper, SUS, etc.) into a predetermined shape and bending it.
- a spring metal for example, phosphor bronze, beryllium copper, SUS, etc.
- the contact 1 includes a substantially rectangular solder joint 2 whose lower surface 2A is a solder joint surface to be described later, and one end 2B of the solder joint 2 has an elastic contact. Part 3 is connected.
- the elastic contact portion 3 is connected to one end 2B of the solder joint portion 2 via a folded portion 3A curved in a front arch shape, and the tip 3B is also curled downward in a front arch shape.
- the elastic contact portion 3 is elastically deformed around the folded portion 3A and comes into pressure contact with the object.
- a rectangular hole 3C having two sides parallel to the one end 2B and two sides orthogonal to the two sides is formed between the folded portion 3A and the tip 3B of the elastic contact portion 3. .
- the other end 2C of the solder joint portion 2 is thin in a convex shape, and the suction portion 4 is connected to the thin other end 2C.
- the suction part 4 is also connected to the other end 2C of the solder joint part 2 via a folded part 4A that is curved in an arch shape when viewed from the front.
- the tip 4 ⁇ / b> B of the suction portion 4 is bent in a direction parallel to the solder joint portion 2, and is exposed to the upper surface side of the elastic contact portion 3 through the hole portion 3 ⁇ / b> C of the elastic contact portion 3.
- suction part 4 is comprised by the strip
- the contact 1 of the present embodiment configured as described above includes a printed wiring board 910 and a ground conductor 920 as an example of a conductive member (e.g., a shield plate or a housing) as illustrated by a solid line in FIG. 2B. Used).
- a conductive member e.g., a shield plate or a housing
- the tip 4B of the suction portion 4 of the contact 1 accommodated in an embossed tape or the like not shown is brought into contact with the suction nozzle 930 of the automatic mounting machine as shown by a dotted line in FIG. To be adsorbed.
- the contact 1 sucked by the suction nozzle 930 is arranged on the surface of the conductor pattern (not shown) of the printed wiring board 910, and the lower surface 2A of the solder joint 2 is soldered to the conductor pattern of the printed wiring board 910. Be joined.
- the soldered state is shown by a one-dot chain line in FIG. 2B. From this state, the contact 1 is used in a state where the ground conductor 920 is brought into contact with the tip 3B of the elastic contact portion 3 from above and the elastic contact portion 3 is elastically deformed as shown by a solid line in FIG. 2B.
- the elastic contact portion 3 is pressed into contact with the ground conductor 920 due to its elastic deformation, and the conductor pattern of the printed wiring board 910 and the ground conductor 920 can be electrically connected.
- suction part 4 is connected with the solder joint part 2 independently of the elastic contact part 3 as mentioned above. For this reason, even if the suction nozzle 930 is pushed into the upper surface of the suction portion 4, distortion of the elastic contact portion 3 can be suppressed, and the contact 1 product such as the pressure contact force of the elastic contact portion 3 with respect to the ground conductor 920. The characteristics can be maintained stably. Normally, even when the suction nozzle 930 is pushed too much, the tip 4B of the suction part 4 does not contact the lower side of the hole 3C.
- the stroke of the elastic contact portion 3 is reduced to provide the suction portion 4.
- the shape of the elastic contact portion 3 projected on the lower surface 2A of the solder joint portion 2 includes the lower surface 2A (solder joint surface) of the solder joint portion 2. Therefore, by ensuring the stroke of the elastic contact portion 3, the elastic contact portion 3 can be pressed against the ground conductor 920 satisfactorily, and as a result, the conductor pattern of the printed wiring board 910 and the ground conductor 920 can be improved. Can be electrically connected.
- the contact 1 of this embodiment be used by elastically deforming the elastic contact portion 3 to the extent that the ground conductor 920 does not contact the tip 4B of the adsorption portion 4.
- the attracting portion 4 functions as a stopper, and the contact 1 can be prevented from being crushed too much.
- the impedance between the conductor pattern and the ground conductor 920 changes when the attracting portion 4 comes into contact with the ground conductor 920, it is possible to detect that the contact 1 has been crushed by measuring the impedance.
- the contact 1 may be used in a state where it is crushed too much as described above.
- the tip 4B of the suction portion 4 is not in contact with any side of the hole 3C when no external force is applied, and the elastic deformation of the elastic contact portion 3 is applied to the upper and lower sides of the suction portion 4. Has an interval that does not hinder. For this reason, it can suppress that the adsorption
- the deformation of the elastic contact portion 3 can be suppressed by the inner wall surface of the hole portion 3 ⁇ / b> C coming into contact with the suction portion 4.
- the contact 1 can be made by combining a plurality of parts by welding or the like.
- the contact 1 of this embodiment is formed by bending a single metal thin plate, the manufacturing process is simplified. The manufacturing cost can be further reduced.
- FIG. 3A to 3G are views showing the configuration of the contact 21 of the second embodiment.
- FIG. 3A is a plan view
- FIG. 3B is a left side view
- FIG. 3C is a front view
- FIG. 3D is a right side view
- FIG. 3F is an upper left perspective view
- FIG. 3G is an upper right perspective view. Since this contact 21 is configured in the same manner as the contact 1 except for the parts described below, 20 is added to the reference numerals used in FIGS. 1A-1G and 2A-2B for some configurations. Detailed description of the configuration is omitted by using the added reference numerals.
- the hole 23 ⁇ / b> C reaches the lower end of the elastic contact portion 23, and further extends to the solder joint portion 22, and one end 22 ⁇ / b> B of the solder joint portion 22 is configured in a concave shape. Then, the concave portion of the solder joint portion 22 is cut upward and constitutes the suction portion 24. The tip 24A of the suction portion 24 is also bent in a direction parallel to the solder joint portion 22 and penetrates the hole portion 23C.
- the contact 21 of the second embodiment configured as described above can be sucked by the suction nozzle 930 as shown in FIG. 4A and mounted as shown in FIG. . Moreover, in this contact 21, since the adsorption
- FIGS. 1A-1G and 2A-2B are views showing the configuration of the contact 31 of the third embodiment.
- FIG. 5A is a plan view
- FIG. 5B is a left side view
- FIG. 5C is a front view
- FIG. 5D is a right side view
- FIG. 5F is an upper left perspective view
- FIG. 5G is an upper right perspective view. Since this contact 31 is configured in the same manner as the contact 1 except for the parts described below, the reference numerals used in FIGS. 1A-1G and 2A-2B are set to 30 for some configurations. Detailed description of the configuration is omitted by using the added reference numerals.
- the hole 33C reaches the lower end of the elastic contact portion 33, and further extends to the solder joint 32, and one end 32B of the solder joint 32 is formed in a concave shape.
- the amount of the hole portion 33C extending to the solder joint portion 32 is smaller than that of the contact 21, and the portion punched out as the hole portion 33C is cut upward from the solder joint portion 32 to constitute the suction portion 34.
- the tip 34A of the suction portion 34 is also bent in a direction parallel to the solder joint portion 32 and penetrates the hole portion 33C.
- this front end 34A penetrates the hole 33C from the upper surface side of the elastic contact portion 33, and the front part of the front end 34A that penetrates the hole 33C is the suction surface by the suction nozzle 930 as shown in FIG. 6A. .
- the contact 31 of the third embodiment configured as described above can be sucked by the suction nozzle 930 as shown in FIG. 6A and mounted as shown in FIG. .
- suction part 34 is formed by raising a part of the elastic contact part 33, Therefore A metal loss can be reduced.
- FIGS. 7A-7G are diagrams showing the configuration of the contact 41 of the fourth embodiment.
- FIG. 7A is a plan view
- FIG. 7B is a left side view
- FIG. 7C is a front view
- FIG. 7D is a right side view
- FIG. 7F is an upper left perspective view
- FIG. 7G is an upper right perspective view. Since this contact 41 is configured in the same manner as the contact 1 except for the parts described below, the reference numerals used in FIGS. 1A-1G and 2A-2B are set to 40 for some configurations. Detailed description of the configuration is omitted by using the added reference numerals.
- the hole 43C reaches the lower end of the elastic contact portion 43, and further extends to the solder joint portion 42 so that one end 42B of the solder joint portion 42 is formed in a concave shape.
- the portion punched out as the hole portion 43C constitutes the following suction portion 44, defining portion 46, and frame portion 47.
- the adsorption part 44 is connected to the upper side of the hole 43C and arranged in parallel with the solder joint part 42.
- the defining portion 46 is arranged so as to be connected to the tip of the suction portion 44 and to be orthogonal to the solder joint portion 42.
- the frame portion 47 is connected to the solder joint portion 42 and is cut and raised from the solder joint portion 42 so as to be orthogonal to the solder joint portion 42 and parallel to the defining portion 46. Further, the frame portion 47 is formed with a rectangular hole portion 47A.
- the lower end 46A of the defining portion 46 is bent in a direction along the lower surface 42A of the solder joint portion 42, and the lower end 46A is inserted into the aforementioned hole portion 47A.
- the lower end 46A inserted into the hole 47A is in contact with or very close to the upper side of the hole 47A, but has a gap with the other three sides.
- the suction portion 44 is attracted to the suction nozzle 930 by being brought into contact with the suction nozzle 930 of the automatic mounting machine as indicated by a dotted line in FIG. 8A. Even when the suction nozzle 930 is pushed into the upper surface of the suction portion 44, the lower end 46A of the defining portion 46 comes into contact with the lower side of the hole 47A of the frame portion 47 so that the defining portion 46 acts like a stick. Thus, the distance between the suction portion 44 and the solder joint portion 42 is defined.
- the lower end 46A of the defining portion 46 is attached to the frame portion 47 along with the elastic deformation. It is displaced so as to come out from the hole 47A. For this reason, it becomes the state which the stick was removed, and the definition part 46 does not prevent the said elastic deformation, and it can also suppress that the definition part 46 affects the said product characteristic.
- the adsorbing portion 44 is disposed on the ground conductor 920 side of the elastic contact portion 43, the stroke of the elastic contact portion 43 is not reduced because the adsorbing portion 44 is provided, and the solder joint portion 42
- the shape of the elastic contact portion 43 projected on the lower surface 42 ⁇ / b> A includes the lower surface 42 ⁇ / b> A of the solder joint portion 42. Therefore, by ensuring the stroke of the elastic contact portion 43, the elastic contact portion 43 can be pressed against the ground conductor 920 satisfactorily. As a result, the conductor pattern of the printed wiring board 910 and the ground conductor 920 can be improved. Can be electrically connected.
- the contact 41 of this embodiment it is recommended to use the contact 41 of this embodiment by elastically deforming the elastic contact portion 3 to the extent that the grounding conductor 920 does not contact the attracting portion 44.
- the contact 41 may be used in a state where it is crushed too much so that the attracting portion 44 contacts the ground conductor 920.
- the elastic contact portion 43 may be deformed and bent.
- the elastic contact portion 43 is deformed by the lower end 46A of the defining portion 46 coming into contact with the inner wall surface of the hole portion 47A of the frame portion 47. Can be suppressed.
- the contact 41 can also be made by combining a plurality of parts by welding or the like, but the contact 41 of this embodiment is formed by bending a single metal thin plate, thus simplifying the manufacturing process. Thus, the manufacturing cost can be further reduced. Also in this contact 41, since the adsorbing portion 44, the defining portion 46, and the frame portion 47 are formed by cutting and raising part of the elastic contact portion 43 and the solder joint portion 42, metal loss can be reduced. it can.
- FIGS. 9A to 9G are views showing the configuration of the contact 51 of the fifth embodiment, FIG. 9A is a plan view, FIG. 9B is a left side view, FIG. 9C is a front view, FIG. 9D is a right side view, and FIG. 9F is an upper left perspective view, and FIG. 9G is an upper right perspective view.
- the contact 51 is different from the contact 1 only in the configuration of the elastic contact portion 53, and the solder joint portion 52 and the suction portion 54 are configured in substantially the same manner as the contact 1.
- a detailed description of the configuration is omitted by using a code obtained by adding 50 to the codes used in 1A-1G and FIGS. 2A-2B.
- the tip 53B of the elastic contact portion 53 is bent upward on the tip side with respect to the hole 53C, and is further folded back in an arch shape toward the tip 54B of the suction portion 54 exposed from the hole 53C. ing.
- the tip 53 ⁇ / b> B of the elastic contact portion 53 is disposed inside the other end 52 ⁇ / b> C of the solder joint 52, that is, above the solder joint 52.
- the tip 54B of the suction portion 54 can be sucked by the suction nozzle 930 (see FIGS. 2A-2B), and the same operation and effect as the contact 1 occur.
- FIG. 10A to 10G are views showing the configuration of the contact 61 of the sixth embodiment.
- FIG. 10A is a plan view
- FIG. 10B is a left side view
- FIG. 10C is a front view
- FIG. 10D is a right side view
- FIG. 10F is an upper left perspective view
- FIG. 10G is an upper right perspective view.
- the contact 61 is different from the contact 1 only in the configuration of the elastic contact portion 63, and the solder joint portion 62 and the suction portion 64 are configured in substantially the same manner as the contact 1.
- a detailed description of the configuration is omitted by using a reference numeral obtained by adding 60 to the reference numerals used in 1A-1G and FIGS. 2A-2B.
- the elastic contact portion 63 of the contact 61 is folded back via a folded portion 63E that is curved in the shape of an arch in the front view in the middle, and is configured in a generally U shape as viewed from the front. Further, the tip 63B of the elastic contact portion 63 is curled in an arch shape when viewed from the front. With this configuration, the tip 63 ⁇ / b> B of the elastic contact portion 63 is disposed inside the one end 62 ⁇ / b> B of the solder joint portion 62, that is, above the solder joint portion 62. Further, the hole 63C is formed across the folded portion 63E.
- the tip 61B of the suction portion 64 can be sucked by the suction nozzle 930 (see FIGS. 2A-2B) even in the contact 61 of the sixth embodiment configured as described above, and the same operations and effects as the contact 1 occur. Further, in this contact 61, since the elastic contact portion 63 is folded in the middle as described above, it is preferable that the elastic contact portion 63 jumps out from the upper side of the solder joint portion 62 when pressed by the ground conductor 920 or the like. And a large stroke can be secured.
- FIGS. 11A-11I are views showing the structure of the contact 71 of the seventh embodiment.
- FIG. 11A is a plan view
- FIG. 11B is a left side view
- FIG. 11C is a front view
- FIG. 11D is a right side view
- FIG. 11F is an upper left perspective view
- FIG. 11G is an upper right perspective view
- FIG. 11H is a lower left perspective view
- FIG. 11I is a lower right perspective view.
- this contact 71 is configured in the same manner as the contact 1 except for the parts described below, the reference numerals used in FIGS. 1A-1G and 2A-2B are set to 70 for some configurations. Detailed description of the configuration is omitted by using the added reference numerals.
- the hole 73 ⁇ / b> C reaches the lower end of the elastic contact portion 73, and the connecting portion between the solder joint portion 72 and the suction portion 74 is convex between the connecting portions with the solder joint portion 72. It is arranged.
- the suction part 74 is formed by cutting a portion punched out as the hole part 73 ⁇ / b> C upward from the solder joint part 72 and penetrates the hole part 73 ⁇ / b> C, and the tip 74 ⁇ / b> B of the suction part 74 is also parallel to the solder joint part 72. It is bent in the direction.
- the folded portion 73A of the elastic contact portion 73 is greatly curved in a U shape when viewed from the front, and further, the elastic contact portion 73 is also bent and folded greatly by a U shape when viewed from the front via the folded portion 73E. As a whole, it is configured in an S shape when viewed from the front. Further, the distal end 73B of the elastic contact portion 73 is bent upward and then curled in an approximately 270 ° arch shape when viewed from the front. Furthermore, the hole 73C is formed across the folded portion 73E.
- the tip 74B of the suction portion 74 can be sucked by the suction nozzle 930 (see FIGS. 2A-2B), and the same actions and effects as the contact 1 are produced. Moreover, also in this contact 71, since the adsorption
- the spring constant of the elastic contact part 73 can be easily designed to a desired value.
- FIGS. 1A-1G and 2A-2B are views showing the configuration of the contact 81 of the eighth embodiment, FIG. 12A is a plan view, FIG. 12B is a left side view, FIG. 12C is a front view, FIG. 12D is a right side view, and FIG. 12F is an upper left perspective view, FIG. 12G is an upper right perspective view, FIG. 12H is a lower left perspective view, and FIG. 12I is a lower right perspective view. Since this contact 81 is configured in the same manner as the contact 1 except for the parts described below, the reference numerals used in FIGS. 1A-1G and 2A-2B are set to 80 for some configurations. Detailed description of the configuration is omitted by using the added reference numerals.
- the solder joint portion 82 is formed in a rectangular parallelepiped shape, and an elastic contact portion 83 is connected to one end 82B, and a suction portion 84 is connected to the center of the other end 82C.
- a further tip portion of the tip 84B of the suction portion 84 arranged in parallel with the solder joint portion 82 constitutes a folded piece 84C that is folded downward toward the folded portion 84A.
- the lower end edge 83F of the hole 83C of the elastic contact portion 83 faces the folded piece 84C in the vertical direction above the solder joint portion 82.
- the folded portion 83A of the elastic contact portion 83 is once bent vertically and then greatly bent, and the elastic contact portion 83 is also bent and bent greatly through the folded portion 83E even in the middle. Further, the tip 83B of the elastic contact portion 83 is curled in an arch shape downward. Further, the hole 83C is formed across the folded portion 83E.
- the tip 84B of the suction portion 84 can be sucked by the suction nozzle 930 (see FIGS. 2A-2B), and the same operation and effect as the contact 1 occur.
- the R (curvature radius) of the folded portions 83A and 83E is also increased in the contact 81, the projected area of the elastic contact portion 83 with respect to the solder joint portion 82 is suppressed and the elastic contact portion 83 is compressed. It is possible to easily design the spring constant of the elastic contact portion 83 to a desired value while suppressing the protrusion of the solder joint portion 82 from above.
- FIG. 13A-13I are views showing the structure of the contact 91 of the ninth embodiment.
- FIG. 13A is a plan view
- FIG. 13B is a left side view
- FIG. 13C is a front view
- FIG. 13D is a right side view
- FIG. 13F is an upper left perspective view
- FIG. 13G is an upper right perspective view
- FIG. 13H is a lower left perspective view
- FIG. 13I is a lower right perspective view.
- the contact 91 is different from the contact 81 only in the configuration of the attracting portion 94, and the solder joint portion 92 and the elastic contact portion 93 are configured in substantially the same manner as the contact 81. A detailed description of the configuration is omitted by using a code obtained by adding 10 to the code used in 12A-12I.
- the suction portion 94 is folded back at an acute angle by the folded portion 94A, and the tip 94B is folded in the direction opposite to the folded direction and arranged in parallel with the solder joint portion 92. For this reason, the intermediate portion 94D of the suction portion 94 faces the lower end edge 93F of the hole portion 93C of the elastic contact portion 93 in the vertical direction.
- the tip 94B of the suction portion 94 can be sucked by the suction nozzle 930 (see FIGS. 2A-2B), and the same actions and effects as the contact 1 are produced.
- the R (curvature radius) of the folded portions 93A and 93E is also increased in this contact 91, the projected area of the elastic contact portion 93 with respect to the solder joint portion 92 is suppressed and the elastic contact portion 93 is compressed.
- the spring constant of the elastic contact portion 93 can be easily designed to a desired value while suppressing jumping out of the solder joint portion 92 from above.
- the intermediate portion 94D of the suction portion 94 comes into contact with the lower end edge 93F of the hole portion 93C. Displacement can be suppressed.
- FIGS. 14A-14I are views showing the structure of the contact 101 of the tenth embodiment, FIG. 14A is a plan view, FIG. 14B is a left side view, FIG. 14C is a front view, FIG. 14D is a right side view, and FIG. 14F is an upper left perspective view, FIG. 14G is an upper right perspective view, FIG. 14H is a lower left perspective view, and FIG. 14I is a lower right perspective view. Since this contact 101 is configured in the same manner as the contact 1 except for the parts described below, the reference numerals used in FIGS. 1A-1G and 2A-2B are set to 100 for some configurations. Detailed description of the configuration is omitted by using the added reference numerals.
- the solder joint portion 102 is formed in a rectangular parallelepiped shape, and an elastic contact portion 103 is connected to one end 102B, and an adsorption portion 104 is connected to the center of the other end 102C. Similar to the elastic contact portion 73 shown in FIGS. 11A-11I, the elastic contact portion 103 is bent into a U shape through the turn-back portions 103A and 103E and folded back to form an S-shape as viewed from the front. The tip 103B is bent upward and curled further.
- the tip 104B of the suction portion 104 is disposed at a higher position than the suction portion 4, and the hole portion 103C has a size that does not contact the suction portion 104 although it does not reach the lower end of the elastic contact portion 103. .
- the tip 104B of the suction portion 104 can be sucked by the suction nozzle 930 (see FIGS. 2A-2B), and the same actions and effects as the contact 1 are produced.
- the R (curvature radius) of the folded-back portions 103A and 103E is increased, and the elastic contact portion 103 is formed in an S shape when viewed from the front. For this reason, while suppressing the projection area of the elastic contact part 103 with respect to the solder joint part 102, suppressing the jumping out from the upper part of the solder joint part 102 at the time of compression of the elastic contact part 103, the spring constant of the elastic contact part 103 Can be easily designed to a desired value.
- FIG. 15A-15I are views showing the structure of the contact 111 of the eleventh embodiment, FIG. 15A is a plan view, FIG. 15B is a left side view, FIG. 15C is a front view, FIG. 15D is a right side view, and FIG. 15F is an upper left perspective view, FIG. 15G is an upper right perspective view, FIG. 15H is a lower left perspective view, and FIG. 15I is a lower right perspective view.
- the contact 111 is different from the contact 81 in that the hole 113C of the elastic contact portion 113 is opened to the tip of the elastic contact portion 113, and the tip 113B is divided into two, and the other configuration is substantially the same. ing.
- a reference numeral obtained by adding 30 to the reference numerals used in FIGS. 12A to 12I is used and detailed description of the configuration is omitted.
- the contact 111 configured as described above in addition to the effect similar to that of the contact 81, an effect that a contact point with the ground conductor 920 can be a multi-contact point occurs.
- FIG. 16A-16I are views showing the structure of the contact 121 of the twelfth embodiment, FIG. 16A is a plan view, FIG. 16B is a left side view, FIG. 16C is a front view, FIG. 16D is a right side view, and FIG. 16F is an upper left perspective view, FIG. 16G is an upper right perspective view, FIG. 16H is a lower left perspective view, and FIG. 16I is a lower right perspective view.
- the contact 121 differs from the contact 91 in that the R (curvature radius) of the folded portions 123A and 123E of the elastic contact portion 123 is further increased and the height of the elastic contact portion 123 and the suction portion 124 is further increased. Others are configured in a similar manner.
- the contact 121 configured as described above has an effect that it becomes easier to design the spring constant of the elastic contact portion 123 to a desired value.
- FIG. 17A-17I are views showing the configuration of the contact 131 of the thirteenth embodiment, FIG. 17A is a plan view, FIG. 17B is a left side view, FIG. 17C is a front view, FIG. 17D is a right side view, and FIG. 17F is an upper left perspective view, FIG. 17G is an upper right perspective view, FIG. 17H is a lower left perspective view, and FIG. 17I is a lower right perspective view. Since this contact 131 is configured in the same manner as the contact 51 except for the parts described below, the reference numerals obtained by adding 80 to the reference numerals used in FIGS. 9A-9G are used for some configurations. Therefore, detailed description of the configuration is omitted.
- a pair of protrusions 133H are provided on the upper end portion of the tip 133B of the elastic contact portion 133 from the vicinity of both side edges toward the upper side. Even in the contact 131 of the thirteenth embodiment configured as described above, the tip 134B of the suction portion 134 can be sucked by the suction nozzle 930 (see FIGS. 2A-2B), and the same actions and effects as the contact 51 are produced.
- the suction portion may be connected to the side adjacent to the one end 2 ⁇ / b> B of the solder joint portion 2.
- the tip of the adsorbing portion is disposed above the elastic contact portion 3 and below the tip 3B of the elastic contact portion 3 in parallel with the solder joint portion 2, the first embodiment is used. The same actions and effects as the above occur.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
このコンタクトは、使用時にはプリント配線基板の取付対象面に表面実装されて、上記プリント配線基板と上記プリント配線基板とは別の導電性部材との間に挟み込まれることにより、上記プリント配線基板が備える導体パターンと上記導電性部材とを電気的に接続するものである。
第2局面のコンタクトは、使用時にはプリント配線基板の取付対象面に表面実装されて、上記プリント配線基板と上記プリント配線基板とは別の導電性部材との間に挟み込まれることにより、上記プリント配線基板が備える導体パターンと上記導電性部材とを電気的に接続するものである。
2,22,32,42,52,62…はんだ接合部
3,23,33,43,53,63…弾性接触部
3C,23C,33C,52C,62C…穴部
4,24,34,44,54,64…吸着部
46…規定部
47…枠部
910…プリント配線基板
920…接地導体
930…吸着ノズル
図1A-1Gは本発明の第1実施例のコンタクト1の構成を表す図で、図1Aは平面図、図1Bは左側面図、図1Cは正面図、図1Dは右側面図、図1Eは底面図、図1Fは左上斜視図、図1Gは右上斜視図である。なお、このコンタクト1は、バネ性金属(例えばリン青銅,ベリリウム銅,SUS等)からなる1枚の薄板を、所定形状に打ち抜くと共に折り曲げて形成されている。
図3A-3Gは第2実施例のコンタクト21の構成を表す図で、図3Aは平面図、図3Bは左側面図、図3Cは正面図、図3Dは右側面図、図3Eは底面図、図3Fは左上斜視図、図3Gは右上斜視図である。なお、このコンタクト21は、以下に説明する部分を除いてコンタクト1と同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に20を加えた符号を使用して構成の詳細な説明を省略する。
図5A-5Gは第3実施例のコンタクト31の構成を表す図で、図5Aは平面図、図5Bは左側面図、図5Cは正面図、図5Dは右側面図、図5Eは底面図、図5Fは左上斜視図、図5Gは右上斜視図である。なお、このコンタクト31は、以下に説明する部分を除いてコンタクト1と同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に30を加えた符号を使用して構成の詳細な説明を省略する。
図7A-7Gは第4実施例のコンタクト41の構成を表す図で、図7Aは平面図、図7Bは左側面図、図7Cは正面図、図7Dは右側面図、図7Eは底面図、図7Fは左上斜視図、図7Gは右上斜視図である。なお、このコンタクト41は、以下に説明する部分を除いてコンタクト1と同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に40を加えた符号を使用して構成の詳細な説明を省略する。
図9A-9Gは第5実施例のコンタクト51の構成を表す図で、図9Aは平面図、図9Bは左側面図、図9Cは正面図、図9Dは右側面図、図9Eは底面図、図9Fは左上斜視図、図9Gは右上斜視図である。なお、このコンタクト51は、弾性接触部53の構成のみがコンタクト1と異なり、はんだ接合部52,吸着部54はコンタクト1とほぼ同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に50を加えた符号を使用して構成の詳細な説明を省略する。
図10A-10Gは第6実施例のコンタクト61の構成を表す図で、図10Aは平面図、図10Bは左側面図、図10Cは正面図、図10Dは右側面図、図10Eは底面図、図10Fは左上斜視図、図10Gは右上斜視図である。なお、このコンタクト61は、弾性接触部63の構成のみがコンタクト1と異なり、はんだ接合部62,吸着部64はコンタクト1とほぼ同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に60を加えた符号を使用して構成の詳細な説明を省略する。
図11A-11Iは第7実施例のコンタクト71の構成を表す図で、図11Aは平面図、図11Bは左側面図、図11Cは正面図、図11Dは右側面図、図11Eは底面図、図11Fは左上斜視図、図11Gは右上斜視図、図11Hは左下斜視図、図11Iは右下斜視図である。なお、このコンタクト71は、以下に説明する部分を除いてコンタクト1と同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に70を加えた符号を使用して構成の詳細な説明を省略する。
図12A-12Iは第8実施例のコンタクト81の構成を表す図で、図12Aは平面図、図12Bは左側面図、図12Cは正面図、図12Dは右側面図、図12Eは底面図、図12Fは左上斜視図、図12Gは右上斜視図、図12Hは左下斜視図、図12Iは右下斜視図である。なお、このコンタクト81は、以下に説明する部分を除いてコンタクト1と同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に80を加えた符号を使用して構成の詳細な説明を省略する。
図13A-13Iは第9実施例のコンタクト91の構成を表す図で、図13Aは平面図、図13Bは左側面図、図13Cは正面図、図13Dは右側面図、図13Eは底面図、図13Fは左上斜視図、図13Gは右上斜視図、図13Hは左下斜視図、図13Iは右下斜視図である。なお、このコンタクト91は、吸着部94の構成のみがコンタクト81と異なり、はんだ接合部92,弾性接触部93はコンタクト81とほぼ同様に構成されているので、一部の構成に対しては図12A-12Iで使用した符号に10を加えた符号を使用して構成の詳細な説明を省略する。
図14A-14Iは第10実施例のコンタクト101の構成を表す図で、図14Aは平面図、図14Bは左側面図、図14Cは正面図、図14Dは右側面図、図14Eは底面図、図14Fは左上斜視図、図14Gは右上斜視図、図14Hは左下斜視図、図14Iは右下斜視図である。なお、このコンタクト101は、以下に説明する部分を除いてコンタクト1と同様に構成されているので、一部の構成に対しては図1A-1G,図2A-2Bで使用した符号に100を加えた符号を使用して構成の詳細な説明を省略する。
図15A-15Iは第11実施例のコンタクト111の構成を表す図で、図15Aは平面図、図15Bは左側面図、図15Cは正面図、図15Dは右側面図、図15Eは底面図、図15Fは左上斜視図、図15Gは右上斜視図、図15Hは左下斜視図、図15Iは右下斜視図である。なお、このコンタクト111は、弾性接触部113の穴部113Cをその弾性接触部113の先端まで開口させ、先端113Bが2つに分かれている点においてコンタクト81と異なり、他はほぼ同様に構成されている。そこで、一部の構成に対しては図12A-12Iで使用した符号に30を加えた符号を使用して構成の詳細な説明を省略する。このように構成されたコンタクト111では、コンタクト81と同様の効果に加えて、接地導体920との接点を多接点とすることができるといった効果が生じる。
図16A-16Iは第12実施例のコンタクト121の構成を表す図で、図16Aは平面図、図16Bは左側面図、図16Cは正面図、図16Dは右側面図、図16Eは底面図、図16Fは左上斜視図、図16Gは右上斜視図、図16Hは左下斜視図、図16Iは右下斜視図である。なお、このコンタクト121は、弾性接触部123の折り返し部123A,123EのR(曲率半径)を更に大きくし、弾性接触部123,吸着部124の高さをより高くした点においてコンタクト91と異なり、他はほぼ同様に構成されている。そこで、一部の構成に対しては図13A-13Iで使用した符号に30を加えた符号を使用して構成の詳細な説明を省略する。このように構成されたコンタクト121では、コンタクト91と同様の効果に加えて、弾性接触部123のバネ定数を所望の値に設計するのが一層容易になるといった効果が生じる。
図17A-17Iは第13実施例のコンタクト131の構成を表す図で、図17Aは平面図、図17Bは左側面図、図17Cは正面図、図17Dは右側面図、図17Eは底面図、図17Fは左上斜視図、図17Gは右上斜視図、図17Hは左下斜視図、図17Iは右下斜視図である。なお、このコンタクト131は、以下に説明する部分を除いてコンタクト51と同様に構成されているので、一部の構成に対しては図9A-9Gで使用した符号に80を加えた符号を使用して構成の詳細な説明を省略する。
Claims (7)
- 金属の薄板を折り曲げて形成されたコンタクトであって、
使用時にはプリント配線基板の取付対象面に表面実装されて、上記プリント配線基板と上記プリント配線基板とは別の導電性部材との間に挟み込まれることにより、上記プリント配線基板が備える導体パターンと上記導電性部材とを電気的に接続するものであり、前記コンタクトは、
下面が上記導体パターンにはんだ接合されるはんだ接合面となっているはんだ接合部と、
上記はんだ接合部の一端に連接されて当該はんだ接合部の上方に折り返され、上記導電性部材に接触した際に弾性変形を伴って上記導電性部材に圧接する状態になる弾性接触部と、
上記はんだ接合部に上記弾性接触部とは独立して連接され、先端が上記弾性接触部の上記導電性部材側で上記はんだ接合部の下面と平行に配設されることにより自動実装機の吸着ノズルのための吸着面とされる吸着部と、
を備えたコンタクト。 - 上記吸着部は上記弾性接触部に形成された穴部を貫通しており、
上記弾性接触部の上記穴部は、上記弾性接触部の弾性変形を上記吸着部が妨げない大きさを有する請求項1記載のコンタクト。 - 金属の薄板を折り曲げて形成されたコンタクトであって、
使用時にはプリント配線基板の取付対象面に表面実装されて、上記プリント配線基板と上記プリント配線基板とは別の導電性部材との間に挟み込まれることにより、上記プリント配線基板が備える導体パターンと上記導電性部材とを電気的に接続するものであり、前記コンタクトは、
下面が上記導体パターンにはんだ接合されるはんだ接合面となっているはんだ接合部と、
上記はんだ接合部の一端に連接されて当該はんだ接合部の上方に折り返され、上記導電性部材に接触した際に弾性変形を伴って上記導電性部材に圧接する状態になる弾性接触部と、
上記弾性接触部の、上記折り返された折り返し部と上記導電性部材に接触する接触部との間に連接され、上記弾性接触部の上記導電性部材側で上記はんだ接合部の下面と平行に配設されることにより自動実装機の吸着ノズルのための吸着面とされる吸着部と、
上記吸着部に連接され、上記弾性接触部が弾性変形していないときは上記吸着部と上記はんだ接合部との距離を規定可能な位置に配設され、上記弾性接触部の弾性変形時にはその弾性変形に伴って変移することにより上記弾性接触部の弾性変形を妨げない位置に配設される規定部と、
を備えたコンタクト。 - 上記規定部の下端は上記はんだ接合部の下面に沿う方向に屈曲しており、
上記はんだ接合部には、上記弾性接触部が弾性変形していないときに上記規定部の下端を周囲から囲む枠部が形成され、
上記規定部の下端は、上記弾性接触部の弾性変形時にはその弾性変形に伴って上記枠部から抜け出す、請求項3記載のコンタクト。 - 上記はんだ接合面に投影された上記弾性接触部の形状が、上記はんだ接合面と同一またはそのはんだ接合面を包含する、請求項1~4のいずれか1項に記載のコンタクト。
- 上記はんだ接合部の上記一端から上記弾性接触部の先端に至る長さが、上記はんだ接合部の上記一端から上記はんだ接合部の他端に至る長さよりも長い、請求項1~5のいずれか1項に記載のコンタクト。
- 1枚の金属の薄板を折り曲げて形成された請求項1~6のいずれか1項に記載のコンタクト。
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EP10830050.0A EP2352207B1 (en) | 2009-11-16 | 2010-11-16 | Connecting element |
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