WO2011059084A1 - 回路接続材料及びそれを用いた回路部材の接続構造 - Google Patents

回路接続材料及びそれを用いた回路部材の接続構造 Download PDF

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WO2011059084A1
WO2011059084A1 PCT/JP2010/070286 JP2010070286W WO2011059084A1 WO 2011059084 A1 WO2011059084 A1 WO 2011059084A1 JP 2010070286 W JP2010070286 W JP 2010070286W WO 2011059084 A1 WO2011059084 A1 WO 2011059084A1
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Prior art keywords
circuit
conductive particles
connection
resin
electrode
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PCT/JP2010/070286
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English (en)
French (fr)
Japanese (ja)
Inventor
孝 中澤
小林　宏治
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日立化成工業株式会社
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Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to CN201080051290.2A priority Critical patent/CN102598419B/zh
Priority to BR112012011692-4A priority patent/BR112012011692B1/pt
Priority to KR1020127013954A priority patent/KR101342255B1/ko
Priority to JP2010548315A priority patent/JP5518747B2/ja
Publication of WO2011059084A1 publication Critical patent/WO2011059084A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1065—Esters of polycondensation macromers of alcohol terminated (poly)urethanes, e.g. urethane(meth)acrylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances

Definitions

  • the present invention relates to a circuit connecting material and a circuit member connecting structure using the same.
  • thermosetting resin such as an epoxy resin having excellent adhesiveness and high reliability is used (for example, see Patent Document 1).
  • a curing agent such as an epoxy resin, a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst for promoting the reaction between the epoxy resin and the curing agent are generally used.
  • the heat latent catalyst is an important factor for determining the curing temperature and curing rate of the adhesive, and various compounds are used from the viewpoint of storage stability at room temperature and curing rate during heating.
  • a radical curable adhesive composed of a radical polymerizable compound such as an acrylate derivative or a methacrylate derivative and a peroxide as a radical polymerization initiator has attracted attention.
  • the radical curable adhesive can be cured at a low temperature in a short time (see, for example, Patent Documents 2 to 4).
  • FPD liquid crystal panels
  • PWB printed wiring boards
  • TCP tape carrier package
  • COF chip-on-flex
  • a circuit connection material is used for connection between a flexible printed wiring board (Flexible Printed Circuits, hereinafter referred to as “FPC” in some cases) in the field of FPD and PWB, and the circuit is generally subjected to gold plating.
  • An anionic polymerization type adhesive using an epoxy resin can give good adhesion and connection reliability even to an OSP-treated substrate.
  • the structure of the circuit board is mainly a multilayer structure, and via holes, through holes, and the like are provided in the vicinity of the connection portions in order to release heat at the time of connection. Due to the via holes and through holes, it is not possible to give a sufficient amount of heat to cure the anionic polymerization adhesive. If a sufficient amount of heat is applied for a sufficient amount of time, a long-time connection is required, and using an anionic polymerization adhesive is not practical in terms of production efficiency.
  • radical curable adhesives are used to connect FPC and PWB in the FPD field and can be cured in a short time of less than 10 seconds, but when applied to OSP-treated substrates, they are gold-plated. There is a problem that the connection resistance is likely to increase as compared with the case of applying to a different substrate. This is because the OSP film itself is non-conductive.
  • the present invention provides a circuit connection material that can be cured at a low temperature in a short time and that provides sufficiently high connection reliability when applied to an OSP-treated substrate, and connection of circuit members using the circuit connection material
  • the purpose is to provide a structure.
  • the present invention is a circuit connecting material for electrically connecting opposing circuit electrodes, and contains an adhesive composition and conductive particles, and the conductive particles are made of a metal having a Vickers hardness of 300 to 1000.
  • a circuit connecting material having a core and an outermost layer made of a noble metal covering the surface of the core, and having an average particle diameter of 5 to 20 ⁇ m.
  • the present invention is also a circuit connection material for electrically connecting opposing circuit electrodes, containing an adhesive composition and conductive particles, the conductive particles comprising a core made of nickel, There is provided a circuit connecting material having an outermost layer made of a noble metal covering the surface of a core and having an average particle diameter of 5 to 20 ⁇ m.
  • the circuit connection material of the present invention can be cured at a low temperature in a short time by containing the conductive particles as described above together with the adhesive composition, and can be connected well to a substrate subjected to OSP treatment. Reliability can be shown.
  • the adhesive composition preferably includes a radical polymerizable substance and a curing agent that generates free radicals upon heating.
  • the adhesive composition contains an epoxy resin and a latent curing agent, the connection reliability of the circuit member connection structure using the circuit connection material can be further improved.
  • the present invention includes a first circuit member having a first circuit electrode formed on a main surface of a first circuit board, a second circuit electrode formed on a main surface of a second circuit board, A second circuit member disposed so that the second circuit electrode is opposed to the first circuit electrode; and the first circuit board and the second circuit board, A circuit connecting portion for connecting the first circuit member and the second circuit member so that the circuit electrodes are electrically connected to each other.
  • the circuit member connection structure using the conventional short-curing circuit connection material when the circuit electrode has an OSP film, it tends to be difficult to improve the connectivity in a short time of less than 10 seconds. .
  • the circuit member connection structure of the present invention can obtain good connectivity even with a connection time of less than 10 seconds, because the circuit connection portion is a cured product of the circuit connection material of the present invention. .
  • connection structure of the present invention since the surface of the circuit electrode is formed by a film made of a material containing an organic resin, the circuit electrode is protected from oxidation and good solderability can be obtained.
  • the connection structure of the present invention has sufficiently high adhesive strength and connection reliability because the circuit members are connected by the circuit connection material of the present invention.
  • a circuit connection material that can be cured at a low temperature in a short time and that provides sufficiently high connection reliability when applied to an OSP-treated substrate, and connection of circuit members using the circuit connection material Structure can be provided.
  • FIG. 1 is a cross-sectional view showing an embodiment of a circuit connecting material.
  • a circuit connecting material 1 shown in FIG. 1 is composed of a resin layer 3 and a plurality of conductive particles 5 dispersed in the resin layer 3 and has a film shape.
  • the conductive particles 5 have a core made of a metal having a Vickers hardness of 300 to 1000 and an outermost layer made of a noble metal covering the surface of the core, and have an average particle diameter of 5 to 20 ⁇ m.
  • the conductive particles 5 have a core made of nickel and an outermost layer made of a noble metal covering the surface of the core, and have an average particle diameter of 5 to 20 ⁇ m.
  • Such conductive particles tend to penetrate the non-conductive coating of the circuit electrode and easily suppress an increase in connection resistance. Therefore, a circuit member connection structure having excellent connection reliability can be produced using the circuit connection material containing the conductive particles.
  • the core of the conductive particles 5 is at least one selected from transition metals such as nickel, chromium, molybdenum, manganese, cobalt, iron, manganese, vanadium, titanium, platinum, iridium, osmium, tungsten, tantalum, niobium, zirconium, and palladium. It is preferable that it is comprised with the metal of this, and it is more preferable that it is comprised with nickel.
  • transition metals such as nickel, chromium, molybdenum, manganese, cobalt, iron, manganese, vanadium, titanium, platinum, iridium, osmium, tungsten, tantalum, niobium, zirconium, and palladium. It is preferable that it is comprised with the metal of this, and it is more preferable that it is comprised with nickel.
  • the Vickers hardness of the metal constituting the core is 300 to 1000, more preferably 400 to 800, and still more preferably 500 to 700. If the core has a Vickers hardness of less than 300, the conductive particles are likely to be deformed, and the OSP film on the electrode tends to be excluded, and if it exceeds 1000, the particles are difficult to deform and give good connection reliability. It is difficult to secure a sufficient contact area.
  • the outermost layer of the conductive particles 5 is preferably composed of at least one metal selected from noble metals such as gold, silver, platinum, palladium, rhodium, iridium, ruthenium, osmium, and is composed of gold or platinum. It is more preferable that it is made of gold.
  • the thickness of the outermost layer of the conductive particles 5 is preferably 0.03 to 0.4 ⁇ m, more preferably 0.08 to 0.2 ⁇ m. If the thickness of the outermost layer is less than 0.03, the conductivity of the conductive particles tends to decrease and the connection resistance tends to increase. If the thickness exceeds 0.4 ⁇ m, the cost for forming the outermost layer on the core increases. , Tend to be inferior in price. In addition, although it is preferable that the whole nucleus is covered with the outermost layer which consists of noble metals, a part of nucleus may be exposed in the range which does not deviate from the effect of this invention.
  • the average particle diameter of the conductive particles is 5 to 20 ⁇ m, preferably 8 to 20 ⁇ m, and more preferably 8 to 15 ⁇ m.
  • the resin layer 3 cures before the conductive particles come into contact with the electrode.
  • the average particle diameter exceeds 20 ⁇ m, the radius of curvature of the conductive particles is large. In any case, it becomes difficult to obtain electrical continuity.
  • the average particle diameter of the conductive particles defined in the present application is a value measured by a laser diffraction method measured using “SALD-1000” (manufactured by Shimadzu Corporation, trade name).
  • the blending amount of the conductive particles 5 is appropriately set depending on the application, but usually 0.1 to 30 parts by volume with respect to 100 parts by volume of the adhesive layer 3 (that is, the part other than the conductive particles 5 in the circuit connecting material 1). Is within the range. Further, from the viewpoint of preventing short circuit between adjacent circuit electrodes on the same circuit board, the blending amount of the conductive particles is more preferably 0.1 to 10 parts by volume.
  • the resin layer 3 preferably contains a curing agent that generates free radicals and a radical polymerizable substance.
  • the circuit connecting material 1 preferably contains an adhesive composition containing a curing agent that generates free radicals, a radical polymerizable substance, and the conductive particles 5.
  • the circuit connecting material 1 is heated, a crosslinked structure is formed in the resin layer 3 by polymerization of the radical polymerizable substance, and a cured product of the circuit connecting material 1 is formed.
  • the circuit connection material 1 functions as a radical curable adhesive.
  • the curing agent that generates free radicals used in the circuit connection material 1 is a substance that decomposes by heating a peroxide compound, an azo compound, or the like to generate free radicals.
  • the target connection temperature, connection time, pot life It is selected as appropriate.
  • the blending amount is preferably 0.05 to 10% by mass, based on the total mass of the circuit connecting material 1, and 0.1 to 5% by mass (0.05 to 10 Part by mass, preferably 0.1 to 5 parts by mass).
  • the curing agent that generates free radicals can be selected from diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, and the like.
  • it is preferably selected from peroxyesters, dialkyl peroxides, and hydroperoxides, and more preferably selected from peroxyesters that provide high reactivity. .
  • diacyl peroxides examples include 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, and benzoyl peroxide.
  • diacyl peroxides examples include 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, and benzoyl peroxide.
  • peroxydicarbonates examples include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, and di-2-ethoxymethoxyperoxydicarbonate. Di (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate and di (3-methyl-3-methoxybutylperoxy) dicarbonate.
  • peroxyesters examples include 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxynodecanoate, and t-hexylperoxyneodecanoate.
  • t-butylperoxypivalate 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di (2-ethylhexanoylperoxy) ) Hexane, 1-cyclohexyl-1-methylethylperoxy 2-ethylhexanate, t-hexylperoxy-2-ethylhexanate, t-butylperoxy-2-ethylhexanoate, t-butylper Oxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxy Propyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di (m-toluoylperoxy) hexane
  • peroxyketals examples include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis. (T-Butylperoxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane and 2,2-bis- (t-butylperoxy) decane.
  • dialkyl peroxides examples include ⁇ , ⁇ ′bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane and t -Butylcumyl peroxide.
  • hydroperoxides examples include diisopropylbenzene hydroperoxide and cumene hydroperoxide.
  • curing agents that generate free radicals can be used alone or in combination, and may be used in combination with a decomposition accelerator, an inhibitor, and the like.
  • a decomposition accelerator an inhibitor
  • the radical polymerizable substance used for the circuit connecting material 1 is a substance having a functional group that is polymerized by radicals, and examples thereof include acrylates, methacrylates, maleimide compounds, citraconic imide resins, and nadiimide resins.
  • the blending amount of the radical polymerizable substance is preferably 20 to 50 parts by mass, more preferably 30 to 40 parts by mass, with the total mass of the circuit connecting material 1 being 100 parts by mass.
  • the radical polymerizable substance can be used in any state of a monomer and an oligomer, and a monomer and an oligomer can be used in combination.
  • Examples of the acrylate include, for example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol propane triacrylate, tetramethylol methane tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclo Examples include pentenyl acrylate, tricyclodecanyl acrylate, tris (acryloyloxyethyl) isocyanurate, and urethane acrylate.
  • a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be used as necessary.
  • a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be used as necessary.
  • it has a dicyclopentenyl group and / or a tricyclodecanyl group and / or a triazine ring, since heat resistance improves, it is preferable.
  • maleimide compound examples include those containing at least two maleimide groups in the molecule, such as 1-methyl-2,4-bismaleimidebenzene, N, N′-m-phenylenebismaleimide, N, N ′.
  • -P-phenylene bismaleimide N, N'-m-toluylene bismaleimide, N, N'-4,4-biphenylene bismaleimide, N, N'-4,4- (3,3'-dimethylbiphenylene) Bismaleimide, N, N′-4,4- (3,3′-dimethyldiphenylmethane) bismaleimide, N, N′-4,4- (3,3′-diethyldiphenylmethane) bismaleimide, N, N′- 4,4-diphenylmethane bismaleimide, N, N′-4,4-diphenylpropane bismaleimide, N, N′-3,3′-diphenylsulfone bismale N, N
  • the citraconic imide resin is obtained by polymerizing a citraconic imide compound having at least one citraconic imide group in the molecule.
  • the citraconic imide compound include phenyl citraconic imide, 1-methyl-2,4 -Biscitraconimide benzene, N, N'-m-phenylene biscitraconimide, N, N'-p-phenylene biscitraconimide, N, N'-4,4-biphenylenebiscitraconimide, N, N'-4 , 4- (3,3-Dimethylbiphenylene) biscitraconimide, N, N′-4,4- (3,3-dimethyldiphenylmethane) biscitraconimide, N, N′-4,4- (3,3- Diethyldiphenylmethane) biscitraconimide, N, N′-4,4-diphenylmethanebiscitraconimide, N'-4,4-
  • the nadiimide resin is obtained by polymerizing a nadiimide compound having at least one nadiimide group in the molecule.
  • the nadiimide compound include phenyl nadiimide, 1-methyl-2,4-bisnadiimidebenzene, N, N′-m-phenylenebisnadiimide, N, N′-p-phenylenebisnadiimide, N, N′-4,4-biphenylenebisnadiimide, N, N′-4,4- (3,3-dimethyl Biphenylene) bisnadiimide, N, N′-4,4- (3,3-dimethyldiphenylmethane) bisnadiimide, N, N′-4,4- (3,3-diethyldiphenylmethane) bisnadiimide, N, N′-4,4 -Diphenylmethane bisnadiimi
  • the circuit connection material 1 may contain other components in addition to the curing agent that generates free radicals and the radical polymerizable substance.
  • a thermoplastic resin and a thermosetting resin can be contained.
  • thermoplastic resin polyethylene resin, polyimide resin, polyvinyl chloride resin, polyphenylene oxide resin, polyvinyl butyral resin, polyvinyl formal resin, polyamide resin, polyester resin, phenoxy resin, polystyrene resin, xylene resin, polyurethane resin, etc. can be used. .
  • thermoplastic resin a hydroxyl group-containing resin having a Tg (glass transition temperature) of 40 ° C. or higher and a molecular weight of 10,000 or more can be preferably used.
  • a phenoxy resin can be preferably used.
  • the phenoxy resin can be obtained by reacting a bifunctional phenol with epihalohydrin until it has a high molecular weight or by polyaddition reaction of a bifunctional epoxy resin with a bifunctional phenol.
  • thermosetting resin examples include urea resin, melamine resin, phenol resin, xylene resin, epoxy resin, and polyisocyanate resin.
  • thermoplastic resin When the above thermoplastic resin is contained, it is preferable because it is easy to handle and is excellent in stress relaxation during curing. Further, the thermoplastic resin and the thermosetting resin are more preferable when having a functional group such as a hydroxyl group because the adhesiveness is improved, and may be modified with an epoxy group-containing elastomer or a radical polymerizable functional group. Those modified with a radically polymerizable functional group are preferred because the heat resistance is improved.
  • the weight average molecular weight of the thermoplastic resin is preferably 10,000 or more from the viewpoint of film forming property and the like, but when it becomes 1000000 or more, the mixing property tends to deteriorate.
  • regulated by this application means what was measured using the analytical curve by a standard polystyrene by the gel permeation chromatography method (GPC) according to the following conditions.
  • the resin layer 3 can also contain an epoxy resin and a latent curing agent in place of the curing agent that generates free radicals and the radical polymerizable substance. That is, the circuit connection material 1 can contain an adhesive composition containing an epoxy resin and a latent curing agent and the conductive particles 5. When the circuit connection material 1 is heated, a crosslinked structure is formed in the resin layer 3 by curing of the epoxy resin, and a cured product of the circuit connection material 1 is formed. In this case, the circuit connecting material 1 functions as an epoxy curable adhesive.
  • Typical epoxy resins include bisphenol type epoxy resins that are glycidyl ethers of bisphenols such as bisphenol A, F, and AD, and epoxy novolac resins derived from phenol novolac or cresol novolac.
  • Other examples include naphthalene type epoxy resins having a naphthalene skeleton, glycidylamine type epoxy resins, glycidyl ester type epoxy resins, alicyclic epoxy resins and heterocyclic epoxy resins. These are used individually or in mixture of 2 or more types.
  • bisphenol type epoxy resins are preferred because they are widely available in grades with different molecular weights, and adhesiveness and reactivity can be arbitrarily set.
  • bisphenol type epoxy resins bisphenol F type epoxy resins are particularly preferable.
  • the viscosity of the bisphenol F type epoxy resin is low, and the fluidity of the circuit connecting material can be easily set in a wide range by using it in combination with the phenoxy resin.
  • the bisphenol F type epoxy resin has an advantage that it is easy to impart good adhesiveness to the circuit connecting material.
  • an epoxy resin having an impurity ion (Na + , Cl ⁇ etc.) concentration or hydrolyzable chlorine of 300 ppm or less to prevent electron migration.
  • the latent curing agent may be a compound that reacts with the epoxy resin and is incorporated into the crosslinked structure, or may be a catalytic curing agent that accelerates the curing reaction of the epoxy resin. Both can be used in combination.
  • catalytic curing agent examples include an anionic polymerization latent curing agent that promotes anionic polymerization of an epoxy resin and a cationic polymerization latent curing agent that promotes cationic polymerization of an epoxy resin.
  • anionic polymerization type latent curing agent examples include imidazole series, hydrazide series, trifluoroboron-amine complex, amine imide, polyamine salt, dicyandiamide, and modified products thereof.
  • the imidazole-based anionic polymerization latent curing agent is formed, for example, by adding imidazole or a derivative thereof to an epoxy resin.
  • a photosensitive onium salt an aromatic diazonium salt, an aromatic sulfonium salt or the like is mainly used
  • an aromatic diazonium salt an aromatic sulfonium salt or the like is mainly used
  • an aromatic sulfonium salt that is activated by heating to cure the epoxy resin.
  • This type of curing agent is preferable because it has a feature of fast curing.
  • the blending amount of the latent curing agent is preferably 30 to 60 parts by mass and more preferably 40 to 55 parts by mass with respect to 100 parts by mass of the epoxy resin.
  • the blending amount of the latent curing agent is less than 30 parts by mass, the tightening force on the adherend due to curing shrinkage of the circuit connecting material is reduced. As a result, the contact between the conductive particles 5 and the circuit electrode is not maintained, and the connection resistance after the reliability test tends to increase.
  • the blending amount of the latent curing agent exceeds 60 parts by mass, the tightening force becomes too strong, so that the internal stress in the cured product of the circuit connection material tends to increase, and the adhesive strength tends to decrease.
  • the circuit connecting material is an epoxy resin adhesive
  • the film-forming material when the liquid is solidified and the constituent composition is made into a film shape, facilitates the handling of the film and imparts mechanical properties that do not easily tear, crack, or stick.
  • the film can be handled in a normal state (normal temperature and pressure).
  • thermoplastic resin As the film forming material, the above-described thermoplastic resin can be used, and it is preferable to use a phenoxy resin because of excellent adhesiveness, compatibility, heat resistance, and mechanical strength.
  • the phenoxy resin is a resin obtained by reacting a bifunctional phenol and epihalohydrin until they are polymerized, or by polyaddition of a bifunctional epoxy resin and a bifunctional phenol.
  • the phenoxy resin contains 1 mol of a bifunctional phenol and 0.985 to 1.015 mol of epihalohydrin in the presence of a catalyst such as an alkali metal hydroxide at a temperature of 40 to 120 ° C. in a non-reactive solvent. It can be obtained by reacting.
  • a catalyst such as an alkali metal compound, an organophosphorus compound, or a cyclic amine compound, an amide, ether, ketone, lactone, alcohol, or the like having a boiling point of 120 ° C. or higher.
  • a product obtained by polyaddition reaction by heating to 50 to 200 ° C. in an organic solvent under a reaction solid content of 50% by mass or less is preferable.
  • Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, and bisphenol S type epoxy resin can be used as the bifunctional epoxy resin.
  • Bifunctional phenols have two phenolic hydroxyl groups, and examples thereof include bisphenol compounds such as hydroquinones, bisphenol A, bisphenol F, bisphenol AD, and bisphenol S.
  • the phenoxy resin may be modified with a radical polymerizable functional group.
  • a phenoxy resin can be used individually by 1 type or in mixture of 2 or more types.
  • the circuit connection material 1 may contain a filler, a softening material, an accelerator, an anti-aging agent, a colorant, a flame retardant, a thixotropic agent, a coupling agent, and isocyanates. it can.
  • a filler When a filler is contained, it is preferable because connection reliability and the like can be improved. If the maximum diameter of the filler is less than the particle diameter of the conductive particles 5, it can be used, and the blending amount is preferably in the range of 5 to 60% by volume. If it exceeds 60% by volume, the effect of improving reliability is saturated.
  • a compound having a vinyl group, an acrylic group, an amino group, an epoxy group or an isocyanate group is preferable from the viewpoint of improving the adhesiveness.
  • a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be used as necessary.
  • the circuit connection material 1 is a connection structure in which circuit components having one or more circuit electrodes (connection terminals) such as chip parts such as semiconductor chips, resistor chips and capacitor chips, and printed wiring boards are connected to each other. It is suitably used to form
  • FIG. 2 is a cross-sectional view showing an embodiment of a circuit member connection structure.
  • a circuit member connection structure 100 shown in FIG. 2 includes a first circuit board 11 and a first circuit member 10 having a first circuit electrode 13 formed on the main surface thereof, and a second circuit board 21. And a second circuit member 20 having a second circuit electrode 23 formed on the main surface thereof and disposed so that the second circuit electrode 23 and the first circuit electrode 13 face each other.
  • the circuit connection part 1a interposed between the first circuit member 10 and the second circuit member 20 is provided.
  • connection part 1a is a cured product formed by curing the circuit connection material 1, and is composed of a cured resin layer 3a and conductive particles 5.
  • the connection portion 1a bonds the first circuit member 10 and the second circuit member 20 so that the first circuit electrode 13 and the second circuit electrode 23 facing each other are electrically connected. .
  • the first circuit electrode 13 and the second circuit electrode 23 facing each other are electrically connected via the conductive particles 5. Even when the connection portion does not contain the conductive particles 5, the first circuit electrode 13 and the second circuit electrode 23 can be electrically connected via the circuit connection material 1.
  • the first substrate 11 is a resin film containing at least one resin selected from the group consisting of polyester terephthalate, polyethersulfone, epoxy resin, acrylic resin and polyimide resin.
  • the first circuit electrode 13 is formed of a material having conductivity that can function as an electrode (preferably at least one selected from the group consisting of gold, silver, tin, platinum group metals, and indium-tin oxide). Has been.
  • the second substrate 21 is a multilayer wiring board formed of an insulating substrate such as silicon, gallium / arsenic, etc. of semiconductor chips, glass, ceramics, glass / epoxy composite, plastic, or the like.
  • the second circuit electrode 23 includes a conductor portion 23 a and a coating 23 b that forms a portion of the surface of the circuit electrode 23 that contacts the connection portion 1 a.
  • the conductor portion 23a is formed of a material having conductivity that allows the circuit electrode 23 to function as an electrode (preferably at least one selected from the group consisting of gold, silver, tin, platinum group metals, and indium-tin oxide). Has been.
  • the coating 23b is a coating made of a material containing an organic resin, and preferably contains an organic resin such as an imidazole compound.
  • the coating 23b is formed by subjecting the second substrate 21 to an OSP (Organic Solderability Preservative) treatment.
  • OSP treatment is a method for treating a substrate, also called a water-soluble preflux, and generally an OSP film is formed by treating a substrate with a solution containing an imidazole compound.
  • a film containing an imidazole compound is a film formed by bonding complexes formed from an imidazole derivative and a metal to each other on the electrode surface.
  • the film containing the imidazole compound can be formed by subjecting the substrate on which the circuit electrode is formed to an OSP treatment with a solution containing the imidazole compound.
  • a benzimidazole derivative is preferably used from the viewpoint of heat resistance.
  • the OSP treatment commercially available product names “Tough Ace F2”, “Tough Ace F2 (LX)” manufactured by Shikoku Kasei Co., Ltd., and “DoCoat GVII” manufactured by Sanwa Laboratory Co., Ltd.
  • Endone Use the product names “Entek106A”, “Entek106A (X)” manufactured by Inc, or the product names “MECSEAL CL-5824S”, “MECSEAL CL-5018”, and “MECSEAL CL-5018S” manufactured by MEC Co., Ltd. Can be done. These can be used alone or in combination of two or more.
  • the circuit connection material according to the present invention can be used for connection of a circuit member in which at least one of the first and second circuit electrodes has a film made of a material containing an organic resin.
  • a circuit member connection structure shown in FIG. 3 not only the second circuit electrode 23 but also the first circuit electrode 13 includes the conductor portion 13 a and the surface of the circuit electrode 13.
  • a film 13b that forms a portion in contact with the connecting portion 1a may be included.
  • the coating 13b is formed by the same method as the coating 23b.
  • the circuit member connection structure 100 includes, for example, a first circuit member 10, the above-described film-like circuit connection material 1, and a second circuit member 20, and a first circuit electrode 13 and a second circuit electrode.
  • the first and second circuit electrodes 13 and 23 are electrically connected to each other by heating, pressurizing, or irradiating light with the laminate laminated in this order so as to oppose each other.
  • the circuit member 10 and the second circuit member 20 are connected to each other.
  • the circuit-connecting material 1 formed on the support film is temporarily bonded to the second circuit member 20 by heating and pressurizing the circuit-connecting material 1 while being bonded together, After peeling off the support film, the first circuit member 10 can be placed while being aligned so that the circuit electrodes face each other to prepare a laminate.
  • the conditions for heating and pressurizing the laminate are appropriately adjusted so that the circuit connecting material is cured and sufficient adhesive strength is obtained according to the curability of the composition in the circuit connecting material.
  • the substrate included in the circuit member constituting the connection structure may be a semiconductor chip such as silicon and gallium / arsenic, and an insulating substrate such as glass, ceramics, glass / epoxy composite, and plastic.
  • circuit connection material (1-1) Preparation of each component constituting adhesive composition “Perhexa25O”: 2,5-dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane (Nippon Yushi, product name) “UN5500”: Urethane acrylate oligomer (trade name, manufactured by Negami Kogyo) “DCP-A”: dicyclopentadiene type diacrylate (product name, manufactured by Toagosei Co., Ltd.) “M-215”: Isocyanuric acid EO-modified diacrylate (product name) “P-2M”: 2-methacryloyloxyethyl acid phosphate (trade name, manufactured by Kyoeisha Chemical Co., Ltd.) “HX3941HP-SS”: An anionic polymerization type latent curing agent-containing epoxy resin (containing 35% by mass of an imidazole microcapsule type curing agent, trade name, manufactured by Asah
  • Conductive Particle A a conductive material having a core made of Ni particles having an average particle diameter of 9 ⁇ m and a top layer made of gold formed by plating the core with gold. Particles were prepared.
  • conductive particles B conductive particles made of Ni particles having an average particle size of 9 ⁇ m were prepared as “conductive particles B”.
  • conductive particles C conductive particles made of Ni particles having an average particle diameter of 4 ⁇ m and having a large number of protrusions on the surface were prepared.
  • Example 2 A film-like circuit connection material was obtained in the same manner as in Example 1 except that the blending amount of the conductive particles A was changed to 5 parts by mass.
  • compositions of the circuit connection materials of Examples 1 to 3 are shown in Table 1 in parts by mass (in terms of nonvolatile content), and the compositions of the circuit connection materials in Comparative Examples 1 to 5 are shown in Table 2 in terms of parts by mass (in terms of nonvolatile content).
  • connection resistance value between circuits including the circuit connection part of the produced connection structure was measured by a two-terminal method using a digital multimeter.
  • the connection resistance is measured immediately after the connection, after performing a high temperature and high humidity treatment for 1000 hours in a constant temperature and humidity chamber of 85 ° C. and 85% RH, and a thermal shock test of 1000 cycles of ⁇ 40 ° C. to + 100 ° C. Measurements were made after each. The results are shown in Table 3.
  • circuit connection materials of Examples 1 to 3 had a small increase in connection resistance and excellent connection reliability both after the high temperature and high humidity treatment and after the thermal shock test.
  • the contact resistance after each test greatly increased in the circuit connection materials of Comparative Examples 1 and 4 using conductive particles made of only Ni particles.
  • the circuit connection materials of Comparative Examples 2, 3 and 5 using conductive particles made of Ni particles having protrusions on the surface showed a relatively small increase in connection resistance in the high temperature and high humidity test, but after the thermal shock test. The connection resistance increased significantly.
  • SYMBOLS 1 Circuit connection material, 1a ... Connection part, 3 ... Resin layer, 3a ... Hardened resin layer, 5 ... Conductive particle, 10 ... 1st circuit member, 11 ... 1st board
PCT/JP2010/070286 2009-11-16 2010-11-15 回路接続材料及びそれを用いた回路部材の接続構造 WO2011059084A1 (ja)

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BR112012011692-4A BR112012011692B1 (pt) 2009-11-16 2010-11-15 material de conexão de circuito e estrutura de conexão para membro de circuito usando o mesmo
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JPWO2011059084A1 (ja) 2013-04-04
BR112012011692B1 (pt) 2020-11-17
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JP2013138013A (ja) 2013-07-11
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CN102598419A (zh) 2012-07-18
TW201134904A (en) 2011-10-16

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