WO2011021363A1 - 光硬化性組成物 - Google Patents
光硬化性組成物 Download PDFInfo
- Publication number
- WO2011021363A1 WO2011021363A1 PCT/JP2010/005006 JP2010005006W WO2011021363A1 WO 2011021363 A1 WO2011021363 A1 WO 2011021363A1 JP 2010005006 W JP2010005006 W JP 2010005006W WO 2011021363 A1 WO2011021363 A1 WO 2011021363A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photocurable composition
- polythiol
- urethane
- vinyl ether
- urethane oligomer
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 39
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 50
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229920006295 polythiol Polymers 0.000 claims abstract description 29
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 14
- 239000000178 monomer Substances 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 16
- 229920005862 polyol Polymers 0.000 claims description 10
- 150000003077 polyols Chemical class 0.000 claims description 10
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 5
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- HDFRDWFLWVCOGP-UHFFFAOYSA-N carbonothioic O,S-acid Chemical compound OC(S)=O HDFRDWFLWVCOGP-UHFFFAOYSA-N 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- -1 gold) Chemical class 0.000 abstract description 16
- 239000010931 gold Substances 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052737 gold Inorganic materials 0.000 abstract description 8
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 8
- 150000004706 metal oxides Chemical class 0.000 abstract description 8
- 239000004642 Polyimide Substances 0.000 abstract description 7
- 229920001721 polyimide Polymers 0.000 abstract description 7
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 7
- 150000002739 metals Chemical class 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 239000003999 initiator Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 229960000834 vinyl ether Drugs 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 150000003606 tin compounds Chemical class 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 2
- DLYDGDHLODCOQF-UHFFFAOYSA-N 1-ethenoxyethenylcyclohexane Chemical compound C=COC(=C)C1CCCCC1 DLYDGDHLODCOQF-UHFFFAOYSA-N 0.000 description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- XRBWKWGATZNBFW-UHFFFAOYSA-N 2-[2-(2-ethenoxyethoxy)ethoxy]ethanol Chemical compound OCCOCCOCCOC=C XRBWKWGATZNBFW-UHFFFAOYSA-N 0.000 description 2
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 2
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical class NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- ZWVHTXAYIKBMEE-UHFFFAOYSA-N 2-hydroxyacetophenone Chemical class OCC(=O)C1=CC=CC=C1 ZWVHTXAYIKBMEE-UHFFFAOYSA-N 0.000 description 2
- FYRWKWGEFZTOQI-UHFFFAOYSA-N 3-prop-2-enoxy-2,2-bis(prop-2-enoxymethyl)propan-1-ol Chemical compound C=CCOCC(CO)(COCC=C)COCC=C FYRWKWGEFZTOQI-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 150000008366 benzophenones Chemical class 0.000 description 2
- JQRRFDWXQOQICD-UHFFFAOYSA-N biphenylen-1-ylboronic acid Chemical compound C12=CC=CC=C2C2=C1C=CC=C2B(O)O JQRRFDWXQOQICD-UHFFFAOYSA-N 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical class C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000006356 dehydrogenation reaction Methods 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- BXFLIOWWAUDZFN-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane;ethenoxyethene Chemical compound C=COC=C.C=COCCCCOC=C BXFLIOWWAUDZFN-UHFFFAOYSA-N 0.000 description 1
- UEIPWOFSKAZYJO-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-[2-(2-ethenoxyethoxy)ethoxy]ethane Chemical compound C=COCCOCCOCCOCCOC=C UEIPWOFSKAZYJO-UHFFFAOYSA-N 0.000 description 1
- WQQZMYRVHZZOEW-UHFFFAOYSA-N 1-benzyl-4-(2-methylphenyl)sulfanylbenzene Chemical compound CC1=CC=CC=C1SC(C=C1)=CC=C1CC1=CC=CC=C1 WQQZMYRVHZZOEW-UHFFFAOYSA-N 0.000 description 1
- CZAVRNDQSIORTH-UHFFFAOYSA-N 1-ethenoxy-2,2-bis(ethenoxymethyl)butane Chemical compound C=COCC(CC)(COC=C)COC=C CZAVRNDQSIORTH-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- JHSWSKVODYPNDV-UHFFFAOYSA-N 2,2-bis(prop-2-enoxymethyl)propane-1,3-diol Chemical compound C=CCOCC(CO)(CO)COCC=C JHSWSKVODYPNDV-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- BAWPQHHUILXQGW-UHFFFAOYSA-N 2-methyl-1-(4-prop-1-en-2-ylphenyl)propane-1,2-diol Chemical compound CC(=C)C1=CC=C(C(O)C(C)(C)O)C=C1 BAWPQHHUILXQGW-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- OJXVWULQHYTXRF-UHFFFAOYSA-N 3-ethenoxypropan-1-ol Chemical compound OCCCOC=C OJXVWULQHYTXRF-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- SXNICUVVDOTUPD-UHFFFAOYSA-N CC1=CC(C)=CC(C)=C1C(=O)P(=O)C1=CC=CC=C1 Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)C1=CC=CC=C1 SXNICUVVDOTUPD-UHFFFAOYSA-N 0.000 description 1
- 101150065749 Churc1 gene Proteins 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- FEXQDZTYJVXMOS-UHFFFAOYSA-N Isopropyl benzoate Chemical compound CC(C)OC(=O)C1=CC=CC=C1 FEXQDZTYJVXMOS-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 102100038239 Protein Churchill Human genes 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229930183415 Suberin Natural products 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- PUBHXVDBFXCFSL-UHFFFAOYSA-N [phenyl(2-phenylethoxy)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)OCCC1=CC=CC=C1 PUBHXVDBFXCFSL-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- UXWSUTBOOHDZIL-UHFFFAOYSA-N bis(1-hydroxycyclohexyl)methanone Chemical compound C1CCCCC1(O)C(=O)C1(O)CCCCC1 UXWSUTBOOHDZIL-UHFFFAOYSA-N 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- XSIFPSYPOVKYCO-UHFFFAOYSA-N butyl benzoate Chemical compound CCCCOC(=O)C1=CC=CC=C1 XSIFPSYPOVKYCO-UHFFFAOYSA-N 0.000 description 1
- BVFSYZFXJYAPQJ-UHFFFAOYSA-N butyl(oxo)tin Chemical compound CCCC[Sn]=O BVFSYZFXJYAPQJ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- WCRDXYSYPCEIAK-UHFFFAOYSA-N dibutylstannane Chemical compound CCCC[SnH2]CCCC WCRDXYSYPCEIAK-UHFFFAOYSA-N 0.000 description 1
- RWHJATFJJVMKGR-UHFFFAOYSA-L dibutyltin(2+);methanethioate Chemical compound [O-]C=S.[O-]C=S.CCCC[Sn+2]CCCC RWHJATFJJVMKGR-UHFFFAOYSA-L 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- HNYIUBKOOFMIBM-UHFFFAOYSA-L dioctyltin(2+);methanethioate Chemical compound [O-]C=S.[O-]C=S.CCCCCCCC[Sn+2]CCCCCCCC HNYIUBKOOFMIBM-UHFFFAOYSA-L 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910001922 gold oxide Inorganic materials 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- IEZWOVIWXFLQTP-UHFFFAOYSA-N hydroperoxyethene Chemical group OOC=C IEZWOVIWXFLQTP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JUYONNFUNDDKBE-UHFFFAOYSA-J tri(oct-2-enoyloxy)stannyl oct-2-enoate Chemical compound [Sn+4].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O JUYONNFUNDDKBE-UHFFFAOYSA-J 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/12—Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/6715—Unsaturated monofunctional alcohols or amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
- C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
Definitions
- the present invention relates to a photocurable composition, and more specifically, various adherends such as thermoplastic resins, metal oxides, metals, etc., in particular, adhesion to PET (especially untreated PET), polyimide, Au or IZO.
- the present invention relates to a photocurable composition excellent in the above.
- thermosetting adhesive material is known as an adhesive material for bonding electronic parts, machine parts, and the like.
- adhesive materials such as anisotropic conductive film (ACF), anisotropic conductive paste (ACP), non-conductive film (NCF), and non-conductive paste (NCP) are used for bonding electronic components.
- ACF anisotropic conductive film
- ACP anisotropic conductive paste
- NCF non-conductive film
- NCP non-conductive paste
- a photo-curable adhesive material has been developed for bonding electronic parts and the like, and the photo-curable adhesive material is completed in a very short time by light irradiation at a low temperature. It is possible to improve.
- Patent Document 1 discloses a photocurable adhesive material comprising an acrylate oligomer, an acrylate monomer diluent, and a thiol compound.
- the present invention covers not only thermoplastic resins such as PET (in particular, so-called non-treated PET that has not been subjected to adhesive coating treatment) and polyimide, but also metal oxides such as IZO and metals such as gold. It aims at providing the photocurable composition excellent also in the adhesiveness with respect to a bonded body.
- the present inventors have found a photocurable composition containing a specific urethane oligomer and thiol, and have completed the present invention.
- the photocurable composition of the present invention is It is a photocurable composition containing a urethane oligomer (A) having two or more allyl ether groups and / or vinyl ether groups and a polythiol (B) having two or more thiol groups.
- the ratio of the total number of thiol groups of the polythiol (B) to the total number of allyl ether groups and / or vinyl ether groups of the urethane oligomer (A) is 0.7: 1 to 1: 0. 7 is desirable.
- the photocurable composition of the present invention may contain a monomer (C).
- the urethane oligomer (A) is preferably a urethane oligomer derived from a urethane prepolymer synthesized from polypropylene glycol and isophorone diisocyanate. Furthermore, it is desirable that the urethane oligomer (A) is a urethane oligomer derived from a urethane prepolymer synthesized from a polyether polyol and isophorone diisocyanate.
- the urethane oligomer (A) is preferably a urethane oligomer synthesized from the urethane prepolymer and allyl ether glycol and / or hydroxybutyl vinyl ether.
- the polythiol (B) is desirably a polythiol derived from mercaptocarboxylic acid.
- metal oxide such as IZO or metal such as gold is deposited while maintaining good adhesion to a thermoplastic resin such as PET (particularly untreated PET) or polyimide.
- a thermoplastic resin such as PET (particularly untreated PET) or polyimide.
- the adhesion to the body can also be improved, and it is possible to sufficiently cope with the recent assembly of electronic parts that are being diversified.
- the photocurable composition of the present invention is It is characterized by containing a urethane oligomer (A) having two or more allyl ether groups and / or vinyl ether groups and a polythiol (B) having two or more thiol groups.
- A urethane oligomer
- B polythiol
- the urethane oligomer (A) has two or more allyl ether groups and / or vinyl ether groups [CH 2 ⁇ CHCH 2 O— and / or CH 2 ⁇ CHO—] and a plurality of urethane bonds (—NHCOO—).
- the urethane oligomer (A) is produced, for example, by synthesizing a urethane prepolymer from a polyol and a polyisocyanate, and adding a compound having a hydroxyl group and an allyl ether glycol group and / or a hydroxy vinyl ether group to the urethane prepolymer. be able to.
- the urethane oligomer (A) preferably has a weight average molecular weight (Mw) of 1,000 to 50,000, more preferably 1,500 to 40,000. If the weight average molecular weight (Mw) is less than 1,000, there is a possibility that sufficient adhesive force cannot be exhibited, and if it exceeds 50,000, the viscosity becomes remarkably high, which may cause adverse effects from the production and processing aspects.
- a weight average molecular weight (Mw) means the value calculated
- the polyol used for the synthesis of the urethane prepolymer is a compound having a plurality of hydroxyl groups.
- Specific examples of the polyol include polypropylene glycol, polyether polyol, polyester polyol, polytetramethylene glycol, polybutadiene polyol, and alkylene oxide-modified polybutadiene. Examples include polyol and polyisoprene polyol.
- the polyether polyol is obtained, for example, by adding an alkylene oxide such as ethylene oxide or propylene oxide to a polyhydric alcohol such as ethylene glycol, propylene glycol, or glycerin.
- the polyester polyol is, for example, ethylene glycol.
- the polyisocyanate is a compound having a plurality of isocyanate groups (NCO groups).
- the polyisocyanate includes tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), crude diphenylmethane diisocyanate (crude MDI), Examples include isophorone diisocyanate (IPDI), hydrogenated diphenylmethane diisocyanate, hydrogenated tolylene diisocyanate, hexamethylene diisocyanate (HDI), these isocyanurate-modified products, carbodiimide-modified products, and glycol-modified products.
- TDI tolylene diisocyanate
- MDI diphenylmethane diisocyanate
- CAde MDI crude diphenylmethane diisocyanate
- IPDI isophorone diisocyanate
- HDI hexamethylene diisocyanate
- a catalyst for urethanization reaction is preferably used.
- the catalyst for urethanization reaction include organic tin compounds, inorganic tin compounds, organic lead compounds, monoamines, diamines, triamines, cyclic amines, alcohol amines, ether amines, organic sulfonic acids, inorganic acids, titanium A compound, a bismuth compound, a quaternary ammonium salt, etc. are mentioned, Among these, an organotin compound is preferable.
- Suitable organic tin compounds include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin thiocarboxylate, dibutyltin dimaleate, dioctyltin thiocarboxylate, tin octenoate, monobutyltin oxide, and the like.
- the compound having a hydroxyl group and an allyl ether group and / or vinyl ether group to be added to the urethane prepolymer is a compound having one or more hydroxyl groups and one or more allyl ether groups and / or vinyl ether groups, It can be added to the isocyanate group of the urethane prepolymer.
- examples of the compound having a hydroxyl group and an allyl ether group and / or a vinyl ether group include allyl ether glycol, hydroxypropyl vinyl ether, and hydroxybutyl vinyl ether.
- the photocurable composition of the present invention contains polythiol (B). Since the polythiol (B) has a thiol group, a thiol group is present in the photocurable composition. Moreover, since the said urethane oligomer (A) has an allyl ether group and / or a vinyl ether group, the allyl ether group and / or the vinyl ether group also exist in the said photocurable composition.
- the amount of the thiol group possessed by the polythiol (B) is not particularly limited, but the thiol group possessed by the polythiol (B) relative to the total number of allyl ether groups and / or vinyl ether groups possessed by the urethane oligomer (A).
- the ratio of the total number of equivalents is preferably 0.7: 1 to 1: 0.7, more preferably 0.9: 1 to 1: 0.9.
- a metal such as IZO can be obtained without inhibiting the function of expressing the adhesion derived from the allyl ether group and / or the vinyl ether group. It becomes possible to improve the adhesiveness to the adherend of a metal such as oxide or gold.
- the polythiol (B) is not particularly limited, but is preferably a polythiol derived from mercaptocarboxylic acid, and more preferably a polythiol derived from 3-mercaptopropionic acid.
- the polythiol (B) preferably has a plurality of mercaptoacyloxy groups in the molecule, more preferably 2-6.
- the mercaptoacyloxy group specifically, 3-mercaptopropionyloxy group [HS— (CH 2 ) 2 —COO—], 3-mercaptobutyloxy group [HS—CH (CH 3 ) —CH 2- COO-] and the like, and a 3-mercaptopropionyloxy group is preferable.
- a thiyl radical is generated by a radical derived from the photopolymerization initiator, and the thiyl radical is unsaturated of an allyl ether group and / or vinyl ether.
- the curing (crosslinking) reaction will be accelerated.
- polythiol (B) examples include tetraethylene glycol bis (3-mercaptopropionate) represented by the following chemical formula (I) and trimethylolpropane tris (3-mercaptoprote represented by the following chemical formula (II).
- Pionate tris [(3-mercaptopropionyloxy) -ethyl] isocyanurate represented by the following chemical formula (III), pentaerythritol tetrakis (3-mercaptopropionate) represented by the following chemical formula (IV), Dipentaerythritol hexakis (3-mercaptopropionate) represented by (V), 1,4-bis (3-mercaptobutyryloxy) butane represented by the following chemical formula (VI), represented by the following chemical formula (VII) Pentaerythritol tetrakis (3-mercaptobutyrate) and 1,3,5-tris (3- Mercaptoethyloleates butyloxyethyl) -1,3,5-triazine -2,4,6 (1H, 3H, 5H) - trione is preferred.
- III pentaerythritol tetrakis (3-mercaptopropionate) represented by the following chemical formula (IV
- the polythiol (B) has good compatibility with the urethane oligomer (A), and forms a cross-linked polymer in an appropriate manner with the allyl ether group and / or vinyl ether group of the polythiol (B).
- these polythiol (B) may be used individually by 1 type, and may be used in combination of 2 or more type.
- the photocurable composition of the present invention may contain a monomer (C).
- the monomer (C) preferably has an allyl ether group and / or a vinyl ether group.
- the number of functional groups of the monomer (C) may be one or two or more.
- Specific examples of the monomer having an allyl ether group include trimethylolpropane diallyl ether, pentaerythritol triallyl ether, glycerin diallyl ether, pentaerythritol diallyl ether, sorbitol diallyl ether, and the like.
- the monomer having a vinyl ether group Specifically, cyclohexyl divinyl ether, triethylene glycol vinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, tetraethylene glycol divinyl ether, trimethylolpropane trivinyl ether, cyclohexane-1,4-dimethylol divinyl ether 1,4-butanediol divinyl ether and the like, and allyl ether group and vinyl ether
- the monomer having a specifically allyl ether, methyl vinyl ether-allyl ether, ethyl vinyl ether, allyl ether and the like As said monomer (C), it may be used independently and 2 or more types may be used together. In the photocurable composition of the present invention, a monomer (C) may be added for viscosity adjustment and the like.
- the photocurable composition of the present invention further contains a photopolymerization initiator (D).
- a photopolymerization initiator (D) include intramolecular cleavage types such as benzoin derivatives and benzyl ketals [for example, trade name: Irgacure 651, manufactured by Ciba Specialty Chemicals Co., Ltd.], ⁇ - Hydroxyacetophenones [for example, Ciba Specialty Chemicals Co., Ltd., trade names: Darocur 1173, Irgacure 184, Irgacure 127], ⁇ -aminoacetophenones [eg, Ciba Specialty Chemicals Co., Ltd., trade name: Irgacure 907, Irgacure 369], ⁇ -aminoacetophenones and thioxanthones (for example, isopropylthioxanthone, diethyl
- an intramolecular cleavage type and a hydrogen abstraction type may be used in combination.
- oligomerized ⁇ -hydroxyacetophenone and acrylated benzophenones are preferred. More specifically, oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone] [for example, Lamberti S. et al. p. A product, trade name: ESACURE KIP150, etc.], acrylated benzophenone [for example, trade name: Ebecryl P136, etc., manufactured by Daicel UCB Co., Ltd.], imide acrylate, and the like.
- the blending amount of the photopolymerization initiator (D) is not particularly limited, but is 0.01 to 10 parts by mass with respect to 100 parts by mass in total of the urethane oligomer (A), polythiol (B) and monomer (C).
- the range is preferably 0.05 to 7 parts by mass, and more preferably 0.1 to 5 parts by mass.
- the blending amount of the photopolymerization initiator (D) is less than 0.01 parts by mass, the effect of initiating photocuring of the photocurable composition is small, and when it exceeds 10 parts by mass, the effect of initiating photocuring is saturated.
- the raw material cost of the photocurable composition increases, and there is a possibility that discoloration, deterioration, etc. may occur due to the residual initiator.
- additives In the photocurable composition of the present invention, in addition to the urethane oligomer (A), polythiol (B), monomer (C), and photopolymerization initiator (D), an amount within the range not impairing the effects of the present invention.
- other additives may be included. Examples of these additives include inorganic substances such as calcium carbonate, aluminum hydroxide, silica, clay, talc, and titanium oxide; inorganic hollow bodies such as crow balloons, shirasu balloons, and ceramic balloons; nylon beads, acrylic beads, and silicon beads.
- Organic materials such as: a filler selected from organic hollow bodies such as vinylidene chloride balloons and acrylic balloons; foaming agents; dyes; pigments; silane coupling agents; polymerization inhibitors;
- the photocurable composition of the present invention is excellent not only in thermoplastic resins such as PET (particularly untreated PET) and polyimide, but also in adhesion to metal oxides such as IZO and metals such as gold. . Therefore, the photocurable composition of the present invention can be suitably used for adhesion of these various adherends, and more specifically, anisotropic conductive film (ACF), anisotropic conductive paste ( ACP), non-conductive film (NCF), non-conductive paste (NCP) and the like are very useful as adhesive materials for electronic members.
- ACF anisotropic conductive film
- ACP anisotropic conductive paste
- NCF non-conductive film
- NCP non-conductive paste
- Examples 1 and 2 containing 100 equivalent parts of polythiol (B), for example, are better cured than Comparative Examples 1 and 2 containing urethane oligomer (A). It can be seen that it exhibits excellent adhesion performance to all types of adherends. Further, the ratio of the number of equivalents of thiol groups to allyl ether groups and / or vinyl ether groups is less than 1: 0.7 in Examples 15 and 17, the ratio of the number of equivalents of thiol groups to allyl ether groups and / or vinyl ether groups is It can be seen that Examples 1-6 show equivalent or better results compared to Examples 16 and 18 above 0.7: 1.
- Examples 19 to 20 containing the monomer (C) have the same or more remarkable effects.
- Examples 1 to 20 have the same or more remarkable effects as compared with Comparative Examples 3 to 19 in which the monomer (C) is blended in place of the urethane oligomer (A).
- the photocurable composition of the present invention is excellent not only in thermoplastic resins such as PET (particularly untreated PET) and polyimide, but also in adhesion to metal oxides such as IZO and metals such as gold. . Therefore, the photocurable composition of the present invention can be suitably used for adhesion of these various adherends, and more specifically, anisotropic conductive film (ACF), anisotropic conductive paste ( ACP), non-conductive film (NCF), non-conductive paste (NCP) and the like are very useful as adhesive materials for electronic members.
- ACF anisotropic conductive film
- ACP anisotropic conductive paste
- NCF non-conductive film
- NCP non-conductive paste
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- Polymers & Plastics (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
アリルエーテル基及び/又はビニルエーテル基を2個以上有するウレタンオリゴマー(A)と、チオール基を2個以上有するポリチオール(B)を含有する光硬化性組成物である。
また、前記ウレタンオリゴマー(A)が有するアリルエーテル基及び/又はビニルエーテル基の全当量数に対する前記ポリチオール(B)が有するチオール基の全当量数の比が、0.7:1~1:0.7であることが望ましい。
更に、本発明の光硬化性組成物は、モノマー(C)を含有してもよい。
また、前記ウレタンオリゴマー(A)が、ポリプロピレングリコールとイソホロンジイソシアネートから合成されたウレタンプレポリマー由来のウレタンオリゴマーであることが望ましい。
さらに、前記ウレタンオリゴマー(A)が、ポリエーテルポリオールとイソホロンジイソシアネートから合成されたウレタンプレポリマー由来のウレタンオリゴマーであることが望ましい。
また、前記ウレタンオリゴマー(A)が、前記ウレタンプレポリマーとアリルエーテルグリコール及び/又はヒドロキシブチルビニルエーテルから合成されたウレタンオリゴマーであることが望ましい。
さらに、前記ポリチオール(B)が、メルカプトカルボン酸由来のポリチオールであることが望ましい。
本発明の光硬化性組成物は、
アリルエーテル基及び/又はビニルエーテル基を2個以上有するウレタンオリゴマー(A)と、チオール基を2個以上有するポリチオール(B)を含有することを特徴としている。
上記ウレタンオリゴマー(A)は、アリルエーテル基及び/又はビニルエーテル基[CH2=CHCH2O-及び/又はCH2=CHO-]を2個以上有し、ウレタン結合(-NHCOO-)を複数有する化合物である。該ウレタンオリゴマー(A)は、例えば、ポリオールとポリイソシアネートとからウレタンプレポリマーを合成し、該ウレタンプレポリマーに水酸基とアリルエーテルグリコール基及び/又はヒドロキシビニルエーテル基を有する化合物を付加させることによって製造することができる。
上記ウレタンオリゴマー(A)は、重量平均分子量(Mw)が好ましくは1,000~50,000、より好ましくは1,500~40,000である。重量平均分子量(Mw)が1,000未満であると充分な接着力を発揮できないおそれがあり、50,000を超えると粘度が著しく高くなり、製造面、加工面から弊害が生じるおそれがある。
なお、本明細書において、重量平均分子量(Mw)とは、GPCにより測定されたポリスチレン換算で求められる値を意味する。
本発明の光硬化性組成物には、ポリチオール(B)が含まれる。該ポリチオール(B)はチオール基を有することから、上記光硬化性組成物中には、チオール基が存在する。また、上記ウレタンオリゴマー(A)はアリルエーテル基及び/又はビニルエーテル基を有することから、上記光硬化性組成物中にはアリルエーテル基及び/又はビニルエーテル基も存在している。そして、上記ポリチオール(B)が有するチオール基の量は、特に限定されないが、前記ウレタンオリゴマー(A)が有するアリルエーテル基及び/又はビニルエーテル基の全当量数に対する前記ポリチオール(B)が有するチオール基の全当量数の比が、好ましくは0.7:1~1:0.7、より好ましくは0.9:1~1:0.9である。このように、チオール基がアリルエーテル基及び/又はビニルエーテル基に対して特定の量で存在することにより、アリルエーテル基及び/又はビニルエーテル基由来の接着発現機能を阻害することなく、IZO等の金属酸化物や金等の金属の被着体に対する接着性を向上させることが可能となる。
本発明の光硬化性組成物は、モノマー(C)を含んでもよい。該モノマー(C)は、アリルエーテル基及び/又はビニルエーテル基を有することが好ましい。また、該モノマー(C)の官能基数は1つでも2つ以上でもよい。
アリルエーテル基を有するモノマーとしては、具体的に、トリメチロールプロパンジアリルエーテル、ペンタエリスリトールトリアリルエーテル、グリセリンジアリルエーテル、ペンタエリスリトールジアリルエーテル、ソルビトールジアリルエーテル等が挙げられ、ビニルエーテル基を有するモノマーとしては、具体的に、シクロヘキシルジビニルエーテル、トリエチレングリコールビニルエーテル、トリエチレングリコールジビニルエーテル、1,4-ブタンジオールジビニルエーテル、テトラエチレングリコールジビニルエーテル、トリメチロールプロパントリビニルエーテル、シクロヘキサン-1,4-ジメチロールジビニルエーテル、1,4-ブタンジオールジビニルエーテル等が挙げられ、アリルエーテル基及びビニルエーテル基を有するモノマーとしては、具体的に、アリルビニルエーテル、メチルビニルエーテル・アリルエーテル、エチルビニルエーテル・アリルエーテル等が挙げられる。上記モノマー(C)としては、単独で用いられてもよいし、2種以上が併用されてもよい。
本発明の光硬化性組成物において、粘度調整などのためにモノマー(C)を添加してもよい。
本発明の光硬化性組成物には、さらに光重合開始剤(D)を含むことが好ましい。光重合開始剤(D)としては、具体的には、分子内開裂型として、ベンゾイン誘導体類、ベンジルケタール類[例えば、チバ・スペシャルティ・ケミカルズ(株)製、商品名:イルガキュア651]、α-ヒドロキシアセトフェノン類[例えば、チバ・スペシャルティ・ケミカルズ(株)製、商品名:ダロキュア1173、イルガキュア184、イルガキュア127]、α-アミノアセトフェノン類[例えば、チバ・スペシャルティ・ケミカルズ(株)製、商品名:イルガキュア907、イルガキュア369]、α-アミノアセトフェノン類とチオキサントン類(例えば、イソプロピルチオキサントン、ジエチルチオキサントン)との併用、アシルホスフィンオキサイド類[例えば、チバ・スペシャルティ・ケミカルズ(株)製、商品名:イルガキュア819]等が挙げられ、水素引き抜き型として、ベンゾフェノン類とアミンの併用、チオキサントンとアミンの併用等が挙げられる。また、分子内開裂型と水素引き抜き型を併用してもよい。中でもオリゴマー化したα-ヒドロキシアセトフェノン及びアクリレート化したベンゾフェノン類が好ましい。より具体的には、オリゴ[2-ヒドロキシ-2-メチル-1-[4-(1-メチルビニル)フェニル]プロパノン][例えば、Lamberti S.p.A製、商品名:ESACURE KIP150等]、アクリル化ベンゾフェノン[例えば、ダイセル・ユー・シー・ビー(株)製、商品名:Ebecryl P136等]、イミドアクリレート等が挙げられる。
本発明の光硬化性組成物には、上記ウレタンオリゴマー(A)、ポリチオール(B)、モノマー(C)、および光重合開始剤(D)のほか、本発明の効果を損なわない範囲内の量で、その他の添加物を含んでいてもよい。これら添加物としては、例えば、炭酸カルシウム、水酸化アルミニウム、シリカ、クレー、タルク、酸化チタンなどの無機物;カラスバルーン、シラスバルーン、セラミックバルーンなどの無機中空体;ナイロンビーズ、アクリルビーズ、シリコンビーズなどの有機物;塩化ビニリデンバルーン、アクリルバルーンなどの有機中空体から選ばれる充填剤;発泡剤;染料;顔料;シランカップリング剤;重合禁止剤;安定剤等が挙げられる。
2官能の数平均分子量400のポリプロピレングリコール100.0重量部、イソホロンジイソシアネート(分子量222.29)69.09重量部、ジブチル錫ジラウレート0.01重量部を1リットル3つ口フラスコにはかり取り、撹拌混合しながら80℃で4時間反応させて、分子鎖の両末端にイソシアネート基を有するウレタンプレポリマーAを合成した。
前記ウレタンプレポリマーA 100重量部にアリルエーテルグリコール7.7重量部を加え、撹拌混合しながら80℃で4時間反応させ、両末端変性ウレタンアリルエーテルオリゴマーA(重量平均分子量(Mw):3,000)を合成した。
前記ウレタンプレポリマーA 100重量部にヒドロキシブチルビニルエーテル8.7重量部を加え、撹拌混合しながら80℃で4時間反応させ、両末端変性ウレタンビニルエーテルオリゴマーA(重量平均分子量(Mw):3,100)を合成した。
表1~4に示す配合の光硬化性組成物を調製し、下記の方法で各被着体(PET:東レ製「ルミラーT60」、PI:東レ製「カプトン200EN-508X100-K3CAA」、IZO:帝人製「HP125CC-B200」、Au:丸和製作所製FPC用金蒸着フィルム)に対する接着強度を測定した。また、下記の方法で、硬化物表面に対するC=Cコンバージョン率を測定した。結果を表1~4に示す。
(1)各対照基材に50μmの厚みになるように光硬化性組成物を塗布し、(2)その上に、易接着PET:03LF8を裏打ち材として挟み込み、(3)易接着PETの上から、大気中において水銀高圧ランプを用いて波長365nmにおける照射強度が100mW/cm2の照射強度で積算光量が500mJとなるように紫外線を照射して、サンプルを作製し、その後、(4)JIS K6854-2に則って、剥離試験を行った。
(1)硬化物表面をFT-IR(ATR)で測定し、(2)その赤外線吸収スペクトルを解析して算出した。
*2:オリゴマー、ポリチオールおよびモノマーの合計100質量部に対する光開始剤の質量部
*3:合成品、ウレタンアリルエーテルオリゴマーA
*4:合成品、ウレタンビニルエーテルオリゴマーA
*5:テトラエチレングリコールビス(3-メルカプトプロピオネート)
*6:トリメチロールプロパントリス(3-メルカプトプロピオネート)
*7:トリス[(3-メルカプトプロピオニロキシ)-エチル]イソシアヌレート
*8:ペンタエリスリトールテトラキス(3-メルカプトプロピオネート)
*9:ジペンタエリスリトールヘキサキス(3-メルカプトプロピオネート)
*10:トリメチロールプロパンジアリルエーテル
*11:ペンタエリスリトールトリアリルエーテル
*12:シクロヘキシルジビニルエーテル
*13:トリエチレングリコールビニルエーテル
*14:1,4-ブタンジオールジビニルエーテル
*15:チバスペシャルティーケミカルズ社製、商品名「イルガキュア184D」、1-ヒドロキシシクロヘキシルフェニルケトン
*16:C=Cコンバージョン
また、アリルエーテル基及び/又はビニルエーテル基に対するチオール基の当量数の比が1:0.7に満たない実施例15及び17、アリルエーテル基及び/又はビニルエーテル基に対するチオール基の当量数の比が0.7:1を超える実施例16及び18と比較して、実施例1~6が同等もしくはより良好な結果を示すことがわかる。
更にモノマー(C)を配合した実施例19~20も、同等もしくはより顕著な効果を奏することもわかる。
ここで、ウレタンオリゴマー(A)に換えてモノマー(C)を配合した比較例3~19と比較しても、実施例1~20は同等もしくはより顕著な効果を奏することもわかる。
Claims (7)
- アリルエーテル基及び/又はビニルエーテル基を2個以上有するウレタンオリゴマー(A)と、チオール基を2個以上有するポリチオール(B)を含有する光硬化性組成物。
- 前記ウレタンオリゴマー(A)が有するアリルエーテル基及び/又はビニルエーテル基の全当量数に対する前記ポリチオール(B)が有するチオール基の全当量数の比が、0.7:1~1:0.7であることを特徴とする請求項1に記載の光硬化性組成物。
- 更にモノマー(C)を含有することを特徴とする請求項1又は2に記載の光硬化性組成物。
- 前記ウレタンオリゴマー(A)が、ポリプロピレングリコールとイソホロンジイソシアネートから合成されたウレタンプレポリマー由来のウレタンオリゴマーであることを特徴とする請求項1又は2に記載の光硬化性組成物。
- 前記ウレタンオリゴマー(A)が、ポリエーテルポリオールとイソホロンジイソシアネートから合成されたウレタンプレポリマー由来のウレタンオリゴマーであることを特徴とする請求項1又は2に記載の光硬化性組成物。
- 前記ウレタンオリゴマー(A)が、前記ウレタンプレポリマーとアリルエーテルグリコール及び/又はヒドロキシブチルビニルエーテルから合成されたウレタンオリゴマーであることを特徴とする請求項4又は5に記載の光硬化性組成物。
- 前記ポリチオール(B)が、メルカプトカルボン酸由来のポリチオールであることを特徴とする請求項1~6のいずれか記載の光硬化性組成物。
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- 2010-08-09 EP EP10809710.6A patent/EP2468797B1/en not_active Not-in-force
- 2010-08-09 US US13/390,761 patent/US8476333B2/en not_active Expired - Fee Related
- 2010-08-09 KR KR1020127006857A patent/KR101388708B1/ko active IP Right Grant
- 2010-08-09 CN CN201080047293.9A patent/CN102575009B/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
US20120165498A1 (en) | 2012-06-28 |
EP2468797B1 (en) | 2016-11-02 |
CN102575009B (zh) | 2014-04-30 |
KR101388708B1 (ko) | 2014-04-24 |
US8476333B2 (en) | 2013-07-02 |
JP5836123B2 (ja) | 2015-12-24 |
EP2468797A1 (en) | 2012-06-27 |
JPWO2011021363A1 (ja) | 2013-01-17 |
CN102575009A (zh) | 2012-07-11 |
KR20120061889A (ko) | 2012-06-13 |
EP2468797A4 (en) | 2015-08-05 |
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