WO2011007590A1 - 固定砥粒ワイヤソー用水溶性加工液 - Google Patents

固定砥粒ワイヤソー用水溶性加工液 Download PDF

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Publication number
WO2011007590A1
WO2011007590A1 PCT/JP2010/052095 JP2010052095W WO2011007590A1 WO 2011007590 A1 WO2011007590 A1 WO 2011007590A1 JP 2010052095 W JP2010052095 W JP 2010052095W WO 2011007590 A1 WO2011007590 A1 WO 2011007590A1
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WO
WIPO (PCT)
Prior art keywords
water
mass
processing liquid
silicon
carboxylic acid
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Application number
PCT/JP2010/052095
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English (en)
French (fr)
Japanese (ja)
Inventor
直樹 丸尾
康徳 沼田
宏明 高橋
Original Assignee
ユシロ化学工業株式会社
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Application filed by ユシロ化学工業株式会社 filed Critical ユシロ化学工業株式会社
Priority to SG2011095171A priority Critical patent/SG177321A1/en
Priority to CN201080030425.7A priority patent/CN102471723B/zh
Publication of WO2011007590A1 publication Critical patent/WO2011007590A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02—Hydroxy compounds
    • C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
    • C10M2207/0225—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C10M2209/1045—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/02—Pour-point; Viscosity index
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/20—Metal working
    • C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling

Definitions

  • the present invention relates to a water-soluble machining fluid for a fixed abrasive wire saw.
  • the wire saw cutting method includes a free abrasive grain method and a fixed abrasive grain method.
  • a slurry in which abrasive particles are dispersed in an oil is used as a processing liquid.
  • Patent Document 1 discloses a fixed abrasive wire saw in which abrasive grains of 30 to 60 ⁇ m or less are fixed by resin bonding, and this is run at a linear speed of 1000 to 2500 m / min to cut a brittle material. This enables cutting with high efficiency.
  • Patent Document 2 proposes a water-soluble processing liquid composition for a fixed abrasive wire saw containing (A) glycols. JP 2001-045450 A JP 2003-082334 A
  • Patent Document 2 by incorporating glycols and optionally other components in the water-soluble processing liquid composition for fixed abrasive wire saws, it is suitable for cutting processing materials other than rare earth magnets and also for cutting silicon. It is said that it is suitable and the reaction with silicon can be suppressed.
  • the stability of the processing liquid when silicon cutting waste is mixed which affects the silicon processability. It was found that there are cases where
  • the present invention has been made in view of the above, and an object of the present invention is to provide a water-soluble processing liquid for a fixed abrasive wire saw that is excellent in silicon processability.
  • the present inventors have obtained the following knowledge.
  • the machining fluid has an appropriate viscosity. That is, when the viscosity is too low, the wire is cut, and when the viscosity is too high, the wire slips, and the processability of silicon becomes insufficient.
  • the liquid property of the machining liquid becomes unstable and the liquid viscosity may increase.
  • the present invention is a water-soluble processing liquid for a fixed abrasive wire saw, which contains (A) a glycol and water and has a viscosity at 25 ° C. of 3 mPa ⁇ s to 50 mPa ⁇ s.
  • the viscosity at 25 ° C. is preferably 5 mPa ⁇ s or more and 25 mPa ⁇ s or less.
  • viscosity means a viscosity measured by a B-type rotational viscometer.
  • Contains glycols and water is a concept that the water-soluble processing liquid for a fixed abrasive wire saw of the present invention may be composed only of glycols and water, or may contain other components. .
  • the pH of the working fluid is preferably adjusted to 5.0 or more and 7.5 or less, more preferably 5.5 or more and 6.5 or less.
  • the (B) carboxylic acid preferably has 7 or less carbon atoms.
  • the total of (A) glycols, (B) carboxylic acid, and (C) a compound that exhibits basicity when dissolved in water is 100% by mass. % By mass to 95% by mass, (B) 0.01% by mass to 60% by mass of carboxylic acid, and (C) 0.01% by mass to 60% by mass of a compound that is dissolved in water and exhibits basicity.
  • (B) carboxylic acid and (C) a compound which is dissolved in water and exhibits basicity be contained in a total amount of 0.02% by mass to 60% by mass.
  • the water-soluble working fluid for fixed abrasive wire saw of the present invention is suitably used for cutting of silicon material.
  • the processing time is shortened and the cutting accuracy of the silicon wafer can be improved. Therefore, in the cutting process using a fixed abrasive wire saw, it is possible to provide a water-soluble processing liquid for a fixed abrasive wire saw that is particularly excellent in silicon processability.
  • water-soluble processing liquid for fixed abrasive wire saw of the present invention contains (A) glycols and water, and optionally, (B) carboxylic acid and (C ) Compounds that are basic when dissolved in water and other components may be included. Hereinafter, each component will be described in detail.
  • the water-soluble processing liquid of the present invention contains (A) glycols.
  • glycols include ethylene glycol, propylene glycol, 1,4-butanediol, hexamethylene glycol, neopentyl glycol, diethylene glycol, triethylene glycol, dipropylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol, polyethylene glycol And polypropylene glycol copolymers, and glycols such as polyoxyethylene and polyoxypropylene copolymers, glycol monoalkyls such as triethylene glycol monobutyl ether, triethylene glycol monomethyl ether, diethylene glycol monobutyl ether and tripropylene glycol monomethyl ether Ether, polyoxyethylene and polyoxypropylene Water-soluble glycols such as monoalkyl ethers of polymerization thereof.
  • glycols exemplified above it is preferable to use propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol or polypropylene glycol, and it is particularly preferable to use propylene glycol or polyethylene glycol. These can be used alone or in combination of two or more. Moreover, you may use as a copolymer which consists of said 2 or more types of component.
  • the molecular weight of the glycols is preferably 70 to 100,000, more preferably 76 to 10,000. If the molecular weight is within this range, silicon processability can be further improved.
  • the lower limit of (A) glycols is preferably 1% by mass or more, more preferably 5% by mass or more, further preferably 15% by mass or more, and further preferably 20%, based on the total processing liquid.
  • the upper limit is preferably 95% by mass or less, more preferably 89% by mass or less, and still more preferably 85% by mass or less.
  • the water-soluble processing liquid of the present invention contains the (A) glycols and water as long as the (A) glycols and the balance are composed of only water, but other additives and the like. These components may be contained. Moreover, it is preferable to further contain (B) a carboxylic acid or (C) a compound which is dissolved in water and exhibits basicity.
  • the water-soluble processing liquid of the present invention preferably further contains (B) a carboxylic acid in addition to (A) glycols and water.
  • a carboxylic acid having 7 or less carbon atoms is preferably used, a carboxylic acid having 2 to 6 carbon atoms is more preferably used, and a carboxylic acid having 6 carbon atoms is used. Particularly preferred.
  • citric acid, succinic acid, lactic acid, malic acid, adipic acid, succinic acid, and acetic acid are preferably used, and citric acid and succinic acid are more preferably used, and citric acid is used. Is particularly preferred.
  • the liquid stability can be suitably maintained when silicon cutting waste is mixed during the cutting process, and a water-soluble processing liquid having excellent silicon processability is obtained. be able to.
  • the (B) carboxylic acid is preferably contained in an amount of 0.01% by mass or more and 60% by mass or less, and 0.05% by mass or more and 10% by mass or less based on the entire processing liquid. It is more preferable that the content is 0.1% by mass or more and 5% by mass or less.
  • (C) Compound that exhibits basic properties when dissolved in water
  • a basic compound hereinafter referred to as “(C) basic compound”
  • (C) basic compound the compound containing an alkali metal element, an alkanolamine, an alkylamine, ammonia, etc. are mentioned, for example, These can be used individually by 1 type or in combination of 2 or more types. Among these, it is preferable to use a compound containing an alkali metal element.
  • Examples of the compound containing an alkali metal element include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate and potassium hydrogen carbonate, and potassium hydroxide is particularly preferably used.
  • the basic compound (C) is preferably contained in an amount of 0.01% by mass or more and 60% by mass or less, and 0.05% by mass or more and 10% by mass or less, based on the entire processing liquid. It is more preferably contained, and particularly preferably 0.1 to 5% by mass.
  • (C) By making the content of the basic compound in this way, when silicon cutting waste is mixed, the liquid stability can be suitably maintained, and further, a water-soluble processing liquid having excellent silicon processability is obtained. Can do.
  • (D) salt a salt formed from (B) carboxylic acid and (C) basic compound
  • (D) salt a salt formed from (B) carboxylic acid and (C) basic compound
  • (D) salts include alkali metal salts of carboxylic acids and amine salts of carboxylic acids.
  • the total content of the (B) carboxylic acid and the (C) basic compound is 0.02% by mass or more and 60% by mass or less based on the entire processing liquid.
  • it is more preferably 0.1% by mass or more and 20% by mass or less, and particularly preferably 0.2% by mass or more and 10% by mass or less. If it does in this way, the silicon reactivity of a processing liquid can be suppressed, and it can be set as the processing liquid which is excellent in silicon stability while being excellent in liquid stability.
  • the total of (A) glycols, (B) carboxylic acid, and (C) basic compound is 100% by mass
  • the (A) glycols, (B) carboxylic acid, and (C) basic The proportion of the compound is (A) glycols of 30% by mass to 95% by mass, (B) carboxylic acid of 0.1% by mass to 5% by mass, and (C) basic compound of 0.1% by mass or more. It is preferable to mix so that 5 mass% or less and the remainder may be water.
  • the amount of the (A) glycols, (B) carboxylic acid, and (C) basic compound is adjusted, and the pH of the processing liquid is preferably adjusted to 5.0 or more and 7.5 or less, In this way, when silicon cutting waste is mixed during the cutting process, the liquid stability can be suitably maintained, and it is particularly effective to obtain a water-soluble processing liquid that is excellent in silicon processability. .
  • (E) Other components in addition to the above (A) glycols and water, and optionally included (B) carboxylic acid and (C) basic compound or (D) salt, (E) Other components may be contained.
  • various additives that do not adversely affect the processed material such as corrosion and discoloration and do not affect the stability of the system after mixing are added within a range that does not affect the processing performance. be able to.
  • a viscosity adjusting agent, a pH adjusting agent, an antifoaming agent, an antioxidant and the like can be added.
  • known viscosity modifiers can be used without particular limitation, but those that are soluble in water are preferred.
  • pH adjusters examples include inorganic bases (such as sodium hydroxide, potassium hydroxide and ammonia), organic bases (such as alkanolamine and alkylamine), inorganic acids (hydrochloric acid, sulfuric acid, etc.), organic acids ( The above carboxylic acids and the like can be used.
  • inorganic bases such as sodium hydroxide, potassium hydroxide and ammonia
  • organic bases such as alkanolamine and alkylamine
  • inorganic acids hydroochloric acid, sulfuric acid, etc.
  • organic acids organic acids
  • the above carboxylic acids and the like can be used.
  • antifoaming agent, antioxidant and the like known ones can be used without particular limitation, but these are also preferably soluble in water.
  • the water-soluble processing liquid of the present invention contains the above components.
  • the water-soluble working fluid of the present invention may be diluted with water as necessary according to the working environment of the cutting process. That is, a concentrated composition composed of the above-mentioned component (A) excluding water is mixed and prepared, and appropriately diluted with water at the time of on-site cutting processing work, to an appropriate water-soluble processing liquid according to the working environment and situation. It can also be used after adjusting. Further, a concentrated composition composed of the above-mentioned component (A) containing a certain amount of water may be mixed and prepared, and further diluted with water during the on-site cutting process.
  • the water-soluble processing liquid of the present invention has a viscosity at the time of use in cutting (that is, when the processing liquid is used for cutting without being diluted, the viscosity of the processing liquid before dilution, or after the dilution is performed)
  • the viscosity of the diluted working fluid is adjusted to be 3 mPa ⁇ s or more and 50 mPa ⁇ s or less at 25 ° C.
  • “Viscosity” refers to the viscosity measured by a B-type rotary viscometer. The viscosity at 25 ° C.
  • the water-soluble processing liquid is preferably 3 mPa ⁇ s to 50 mPa ⁇ s, more preferably 5 mPa ⁇ s to 30 mPa ⁇ s, and more preferably 5 mPa ⁇ s to 25 mPa ⁇ s. It is particularly preferred.
  • the viscosity of the water-soluble processing liquid is within this range, when used for cutting with a fixed abrasive wire saw, a water-soluble processing liquid having particularly excellent silicon processability can be obtained.
  • a viscosity it can adjust suitably with content of said (A) glycols, content of (B) carboxylic acid and (C) basic compound, and other additives (viscosity modifier) etc. .
  • the water-soluble processing liquid of the present invention is preferably used so that the pH is adjusted to 5.0 or more and 7.5 or less.
  • the pH is preferably 5.5 or more and 6.5 or less. If the pH is within this range, the reaction between silicon and the processing liquid can be suppressed and the processing liquid can be stabilized even when silicon is mixed in the processing liquid as cutting waste after cutting. Can do. Therefore, an increase in the viscosity of the working fluid and a decrease in the life of the working fluid can be suppressed, and a water-soluble working fluid that is further excellent in silicon processability can be obtained.
  • About adjustment of pH it can adjust suitably with content of said (A) glycols, content of (B) carboxylic acid and (C) basic compound, and other additives (pH adjuster) etc. .
  • the material to be cut was processed using the multi-cutting machine. Specifically, as shown in FIG. 1, 10 grooves are formed in the material to be cut by the working fluid according to Examples 1 to 5, Comparative Examples 1 and 2 or Reference Examples 1 and 2, and the single wire saw cutting machine. The total depth of cut in the 10 grooves was used as an evaluation index. The working fluid was discharged toward the wire before and after the cut portion of the material to be cut. The results are shown in Table 3.
  • the present invention can be suitably used as a water-soluble processing liquid for a fixed abrasive wire saw that can accurately cut a silicon material using a fixed abrasive wire saw during the manufacture of a silicon wafer.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Lubricants (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
PCT/JP2010/052095 2009-07-15 2010-02-12 固定砥粒ワイヤソー用水溶性加工液 WO2011007590A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG2011095171A SG177321A1 (en) 2009-07-15 2010-02-12 Water-soluble working fluid for fixed abrasive grain wire saw
CN201080030425.7A CN102471723B (zh) 2009-07-15 2010-02-12 固结磨料线锯用水溶性加工液

Applications Claiming Priority (2)

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JP2009-166962 2009-07-15
JP2009166962A JP5679642B2 (ja) 2009-07-15 2009-07-15 固定砥粒ワイヤソー用水溶性加工液

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WO2011007590A1 true WO2011007590A1 (ja) 2011-01-20

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JP (1) JP5679642B2 (zh)
KR (1) KR20120049216A (zh)
CN (1) CN102471723B (zh)
SG (1) SG177321A1 (zh)
WO (1) WO2011007590A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012158670A (ja) * 2011-01-31 2012-08-23 Sanyo Chem Ind Ltd シリコンインゴット用水溶性切削液
WO2012115099A1 (ja) * 2011-02-23 2012-08-30 ユシロ化学工業株式会社 固定砥粒ワイヤソー用水溶性加工液
CN103013638A (zh) * 2011-09-20 2013-04-03 浙江瑞翌新材料科技有限公司 一种用于固定磨料线切割的水溶性冷却液及其制备方法
WO2014003157A1 (ja) * 2012-06-29 2014-01-03 出光興産株式会社 水性加工液

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TWI432568B (zh) 2009-08-31 2014-04-01 Sanyo Chemical Ind Ltd 矽錠切片用水溶性切削液
JP5755479B2 (ja) * 2011-03-31 2015-07-29 三洋化成工業株式会社 含水切削液組成物およびその製造方法
JP6204029B2 (ja) 2013-03-06 2017-09-27 出光興産株式会社 水性加工液
TWI640619B (zh) * 2015-02-10 2018-11-11 達興材料股份有限公司 一種切割製程用的水性切割液的添加劑及其製備方法
JP6232480B2 (ja) * 2016-08-31 2017-11-15 出光興産株式会社 水性加工液
JP6819619B2 (ja) * 2018-01-22 2021-01-27 信越半導体株式会社 ワーク切断方法及びワイヤソー

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JP2003082334A (ja) * 2001-09-06 2003-03-19 Yushiro Chem Ind Co Ltd 固定砥粒ワイヤソー用水溶性加工液組成物
JP2004042241A (ja) * 2001-10-17 2004-02-12 Sumitomo Special Metals Co Ltd ワイヤソーを用いる切断方法およびワイヤソー装置ならびに希土類磁石の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012158670A (ja) * 2011-01-31 2012-08-23 Sanyo Chem Ind Ltd シリコンインゴット用水溶性切削液
WO2012115099A1 (ja) * 2011-02-23 2012-08-30 ユシロ化学工業株式会社 固定砥粒ワイヤソー用水溶性加工液
JP2012172117A (ja) * 2011-02-23 2012-09-10 Yushiro Chemical Industry Co Ltd 固定砥粒ワイヤソー用水溶性加工液
CN103391992A (zh) * 2011-02-23 2013-11-13 尤希路化学工业有限公司 固结磨料线锯用水溶性加工液
CN103391992B (zh) * 2011-02-23 2016-03-02 尤希路化学工业有限公司 固结磨料线锯用水溶性加工液
CN103013638A (zh) * 2011-09-20 2013-04-03 浙江瑞翌新材料科技有限公司 一种用于固定磨料线切割的水溶性冷却液及其制备方法
WO2014003157A1 (ja) * 2012-06-29 2014-01-03 出光興産株式会社 水性加工液
JP2014009313A (ja) * 2012-06-29 2014-01-20 Idemitsu Kosan Co Ltd 水性加工液

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SG177321A1 (en) 2012-02-28
JP5679642B2 (ja) 2015-03-04
CN102471723B (zh) 2015-06-03
JP2011021096A (ja) 2011-02-03
CN102471723A (zh) 2012-05-23
KR20120049216A (ko) 2012-05-16

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