SG177321A1 - Water-soluble working fluid for fixed abrasive grain wire saw - Google Patents
Water-soluble working fluid for fixed abrasive grain wire saw Download PDFInfo
- Publication number
- SG177321A1 SG177321A1 SG2011095171A SG2011095171A SG177321A1 SG 177321 A1 SG177321 A1 SG 177321A1 SG 2011095171 A SG2011095171 A SG 2011095171A SG 2011095171 A SG2011095171 A SG 2011095171A SG 177321 A1 SG177321 A1 SG 177321A1
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- Singapore
- Prior art keywords
- water
- working fluid
- mass
- abrasive grain
- wire saw
- Prior art date
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- 239000012530 fluid Substances 0.000 title claims abstract description 113
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 150000002334 glycols Chemical class 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims description 43
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 40
- 150000001875 compounds Chemical class 0.000 claims description 14
- 238000004090 dissolution Methods 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 239000002210 silicon-based material Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 51
- 239000010703 silicon Substances 0.000 abstract description 51
- 238000012545 processing Methods 0.000 abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 50
- 150000007514 bases Chemical class 0.000 description 16
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 8
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000004034 viscosity adjusting agent Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 239000001384 succinic acid Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229940113115 polyethylene glycol 200 Drugs 0.000 description 2
- 229940068886 polyethylene glycol 300 Drugs 0.000 description 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- 101100491335 Caenorhabditis elegans mat-2 gene Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
- 229920002556 Polyethylene Glycol 300 Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
- C10M2207/0225—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups used as base material
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
- C10M2209/1045—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only used as base material
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/02—Pour-point; Viscosity index
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2040/00—Specified use or application for which the lubricating composition is intended
- C10N2040/20—Metal working
- C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling
Abstract
The present invention provides a water-soluble working fluid for a fixed abrasive grain wire saw which is excellent in processing silicon, wherein the water-soluble working fluid for a fixed abrasive grain wire saw comprises (A)glycols and water; and the viscosity of the working fluid at a temperature of 25[err]C is 3 mPa[err]s or more and 50 mPa[err]s or less.
Description
WATER-SOLUBLE WORKING FLUID FOR FIXED ABRASIVE GRAIN WIRE SAW
Technical Field [ooo1] The present invention relates to a water-soluble working fluid for a fixed abrasive grain wire saw.
[0002] In recent years, silicon wafers have rapidly had larger diameters in an attempt to reduce manufacturing costs of semiconductor devices, and thus it has become important to improve a technique for performing a cutting process on a silicon wafer.
As the technique for performing a cutting process on a silicon wafer, there is a cutting method using a wire tool (i.e. wire saw) with less cutting loss and a good working efficiency. There are two types of cutting method: a loose abrasive grain type, and a fixed abrasive grain type. As for the loose abrasive grain type, the following problems have been pointed out: (1) since a slurry in which abrasive grains are dispersed in fluid is used as a working fluid, a cut workpiece and its surrounding environment are severely contaminated; (2) it is necessary to dispose of the slurry containing a large amount of cut debris which is produced during cutting; (3) it is difficult to separate the loose abrasive grains from the cut debris; and (4) there is a limitation in improving the working efficiency due to a limitation to a running speed of a wire. In order to solve these problems, there has been studied a fixed abrasive grain type wire saw in which abrasive grains are fixed onto a surface of a piano wire or the like by electrodeposition, resin bond, or some other means. For example, Patent Document 1 discloses a fixed abrasive grain wire saw in which abrasive grains having 30 to 60 um or less are fixed by resin bond. This wire saw is moved at a speed of 1000 to 2500 m/min to cut a brittle material, thereby enabling highly efficient cutting.
[0003] On the other hand, when performing a cutting process on a brittle material with a fixed abrasive grain wire saw, a working fluid is used concurrently for the purposes of lubrication, cooling, dispersion of cut debris, and the like. As tothe working fluid, it is preferable to use a water-soluble one, in consideration of: a problem of flammability, improvement of working environment, simplification of cleaning steps after the cutting process, waste disposal, and the like. Further, when a material tobe cut is silicon, the following problem arises. That ig, silicon is highly reactive, in some cases reacting with an acid or an alkali during a cutting process to produce hydrogen gas. And, when a water-soluble fluid is used, ignition is likely to occur at a time of processing. Therefore, a working fluid which is prevented from reacting with silicon is preferred. From these viewpoints, Patent Document 2 suggests a water-soluble working fluid composition for a fixed abrasive grain wire saw which containg (A) glycols.
Patent Document 1: Japanese Patent Application Laid-Open (JP-A)
No. 2001-054850
Patent Document 2: JP-A No. 2003-082334
Problems to be Solved by the Invention
[0004] In Patent Document 2, a water-soluble working fluid composition for a fixed abrasive grain wire saw contains glycols, and optionally contains other components, thereby being suited for cutting workpiece materials other than rare-earth magnets and for cutting silicon. Also, it can be prevented from reacting with silicon. However, in view of the recent demands, a working fluid which is capable of processing a silicon wafer with higher precision is preferred. Further, it is found that the water-soluble working fluid composition for a fixed abrasive grain wire saw disclosed in Patent Document 2, does not have sufficient fluid stability when the cut debris of silicon is mixed thereinto, in some cases affecting the processability of silicon.
[0005] The present invention has been made in view of the above; and an object of the present invention is to provide a water-soluble working fluid for a fixed abrasive grain wire saw which ig excellent in processing silicon.
Means for Solving the Problems
[0006] The inventors conducted an intensive study to solve the above problems, and obtained the following findings. (1) It is seen that the processability of silicon can be improved by appropriately regulating a load and the like imposed on a wire during a cutting process to prevent breaking and slipping of the wire. In the light of preventing breaking and slipping of a wire, various parameters of a working fluid were examined.
As a result, it was found that there existed an appropriate viscosity in the working fluid.
That is, when the viscosity is too low, breaking of a wire is caused; and when the viscosity is too high, slipping of a wire is caused, resulting in insufficient processing of silicon.
(2) It was found that when the cut debris of silicon was mixed in, the state of a working fluid sometimes became unstable, causing rise in the fluid viscosity.
When the fluid viscosity rises, slipping of a wire is caused as described above.
And, there is fear that the processability (of silicon) is degraded and also that the life of the fluid is reduced.
(3) In order to stabilize the state of a working fluid in a case when the cut debris of silicon is mixed therein, it is seen to be effective to prevent the reaction of the silicon and the working fluid.
In light of preventing the reaction of a working fluid with silicon, various parameters of a working fluid were examined.
As a result, it was found that there existed an appropriate pH level in the working fluid.
That is, by setting the pH of a working fluid within a predetermined range, it is possible to further prevent the reaction (of the working fluid) with silicon.
This enables stabilization of the state of the working fluid and maintenance of an appropriate viscosity of the working fluid.
Accordingly, the processability of silicon can be improved and the reduction of the fluid life can be suppressed.
(4) As a result of the studies on adjustment of the viscosity and the pH of a working fluid, it was found to be preferable to add an acid and a base to the working fluid.
Especially, by adding as an acid component, a carboxylic acid, or preferably a carboxylic acid having 7 or less carbon atoms, the processability of gilicon can be further improved.
[0007] The present invention has been made based on the above findings, and takes the following composition.
Specifically, the present invention is a water-soluble working fluid for a fixed abrasive grain wire saw, comprising (AYglycols and water, wherein a viscosity of the working fluid at a temperature of 25°C is 3 mPa's or more and 50 mPa-s or less.
In the present invention, it is preferable that the above mentioned viscosity at a temperature of 25°C be 5 mPa‘s or more and 25 mPa-s or less. [oc008] In the present invention, the “viscosity” refers to a viscosity measured by a B type viscometer.
The phrase “comprising glycols and water” encompasses the idea that the water-soluble working fluid for a fixed abrasive grain wire saw may consist only of glycols and water, and the idea that it may also contain other components.
[0009] In the present invention, a pH of the working fluid is preferably adjusted to be 5.0 or more and 7.5 or less, and more preferably 5.5 or more and 6.5 or less.
[0010] Additionally, in the present invention, it is preferable to further comprise a (B)carboxylic acid, and a (C) compound showing basicity on dissolution in water.
[0011] In the present invention comprising a (B)carboxylic acid, the (B)carboxylic acid preferably has 7 or less carbon atoms.
[0012] Further, in the present invention, on a basis that the total amount of the (A)glycols, the (B)carboxylic acid, and the (C) compound showing basicity on dissolution in water, is 100%
by mass, it is preferable to contain: 5% by mass or more and 95% by mass or less of the(A)glycols; 0.01% by mass or more and 60% by mass or less of the (B)carboxylic acid; and 0.01% by mass or more and 60% by mass or less of the (C} compound showing basicity on dissolution in water. And it is preferable to contain 0.02% by mass or more and 60% by mass or less in total, of the (B) carboxylic acid and the (C)compound showing basicity on dissolution in water.
[0012] Furthermore, the water-soluble working fluid for a fixed abrasive grain wire saw of the present invention is suitable for use in performing a cutting process on silicon materials.
[0014] According to the present invention, the processing time in a cutting process can be reduced, and cutting precision of a silicon wafer can be improved. Thus, it is possible to provide a water-soluble working fluid for a fixed abrasive grain wire saw which is especially excellent in processing silicon, in performing a cutting process with a fixed abrasive grain wire saw.
[0015]
Fig. 1 is an illustration of one of the evaluation methods of
Modes for Carrying Out the Invention
[0016] A water-soluble working fluid for a fixed abrasive grain wire saw of the present invention (simply referred to as a “water-soluble working fluid”, hereinafter) can comprise (A)glycols and water; and can optionally further comprise (B)a carboxylic acid and (C)a compound showing basicity on dissolution in water, or other components. Hereinafter, each of the components will be described in detail.
[0017] (A) Glycols
The water-soluble working fluid of the present invention comprises (A)glycols. Examples of the glycols are water-soluble glycols such as: ethylene glycol; propylene glycol; 1,4-Butanedicl; hexamethylene glycol; neopentyl glycol; diethylene glycol; triethylene glycol; dipropylene glycol; tripropylene glycol; polyethylene glycol; polypropylene glycol; a polyethylene glycol-pelypropylene glycol copolymer; a polyoxyethylene-polyoxypropylene copolymer; glycol monoalkyl ethers such as triethylene glycol moncbutyl ether, triethylene glycol monomethyl ether, diethylene glycol monobutyl ether, and tripropylene glycol monomethyl ether; and a monocalkyl ether of polyoxyethylene polyoxypropylene copolymer. Among the above examples of the glycols, it is preferable to use: propylene glycol; dipropylene glycol; diethylene glycol; triethylene glycol; polyethylene glycol; or polypropylene glycol. And it is especially preferable to use propylene glycol or polyethylene glycol. These glycols may be used singularly or in combination.
Further, it may be a copolymer consisting of two or more of the above described components. A molecular weight of the above glycols 1s preferably 70 to 100,000, and more preferably 76 to 10,000. If the molecular weight is within this range, it is possible to further improve the processability of silicon.
[0018] In the water-soluble working fluid of the present invention, on a basis of the working fluid as a whole, the lower limit of the (A)glycols is preferably 1% by mass or more; more preferably 5% by mass or more; still more preferably 15% by mass or more; even more preferably 20% by mass or more; and in especial preferably 30% by mass or more. The upper limit is preferably 95% by mass or less; more preferably 89% by mass or less; and still more preferably 85% by mass or less. By setting the content of the (Alglycols as above, it is possible to prevent rise in the viscosity during processing.
[0019] The water-soluble working fluid of the present invention comprises the above (A)glycols and water. It may consist only of the (A)glycols, with the rest being water ; however, it may further contain other components such as additives.
Additionally, it is preferable to still further contain a (B) carboxylic acid and a (C)compound showing basicity on dissolution in water.
[0020] (B) Carboxylic acid
The water-soluble working fluid of the present invention preferably further comprises a (B)carboxylic acid, in addition to the (A)glycols and water. As to the (B)carboxylic acid, it is preferable to use a carboxylic acid having 7 or less carbon atoms; more preferable to use a carboxylic acid having 2 or more and 6 or less carbon atoms; and especially preferable to use a carboxylic acid having 6 carbon atoms. Specific examples of the carboxylic acid to be preferably used include: citric acid; succinic acid; lactic acid; malic acid; adipic acid; oxalic acid;
and acetic acid. Citric acid and succinic acid are more preferable; and citric acid is especially preferable. These carboxylic acids may be used singularly or in combination. By using a carboxylic acid having 7 or less carbon atoms, it is possible to suitably maintain the fluid stability even when the cut debris of silicon is mixed in during a cutting process; and also to make the water-soluble working fluid excellent in processing silicon. [oo21] In the water-soluble working fluid of the present invention, on a basis of the working fluid as a whole, the {(B) carboxylic acid is preferably contained in an amount of 0.01% by masse or more and 60% by mass or less; more preferably in an amount of 0.05% by mass or more and 10% by mass or less; and in especial preferably in an amount of 0.1% by mass or more and 5% by mass or less. By setting the content of the (B)carboxylic acid as above, it is possible to suitably maintain the fluid stability even when the cut debris of silicon is mixed in; and also to make the water-soluble working fluid excellent in processing silicon.
[06022] (C) Compound showing basicity on dissolution in water
In a composition that the water-soluble working fluid of the present invention comprises the (B)carboxylic acid as well as the (A)glycols, the water-soluble working fluid preferably still further comprises a (C)compound showing basicity on dissolution in water (hereinafter referred to as a “(C)basic compound”). Examples of the (C)basic compound include: a compound containing alkali metal elements; alkanolamine; alkylamine; and ammonia. These basic compounds may be use singularly or in combination. Among these, it is preferable to use the compound containing alkali metal elements. Examples of the compound containing alkali metal elements include: sodium hydroxide; potassium hydroxide; sodium carbonate; potassium carbonate; sodium hydrogen carbonate; and potassium hydrogen carbonate. And potassium hydroxide is in especial preferably used.
[0023] In the water-soluble working fluid of the present invention, on a basis of the working fluid as a whole, the (C) basic compound is preferably contained in an amount of 0.01% by mass or more and 60% by mass or less; more preferably in an amount of 0.05% by mass or more and 10% by mass or less; and in especial preferably in an amount of 0.1% by mass or more and 5% by mass or less. Especially, the pH level (of the working fluid} is preferably adjusted to be within an appropriate range by adding the (B)carboxylic acid and the (C)basic compound, with the content of the (B)carboxylic acid set as an index. By setting the content of the basic compound as above, it is possible to suitably maintain the fluid stability even when the cut debris of silicon is mixed in; and also to make the water-soluble working fluid excellent in processing silicon.
[0024] Further, instead of the above (B)carboxylic acid and {C)basic compound, a salt formed of the (B)carboxylic acid and the (C)basic compound (, hereinafter sometimes referred to as a “(D)salt”) may be contained. The content of the (D)salt is preferably set to be equivalent to the above described content when converted into the content of the (B)carboxylic acid and (C)basic compound. Examples of the (D)salt include an alkali metal salt of a carboxylic acid; and an amine salt of a carboxylic acid.
[0025] In the water-soluble working fluid of the present invention, on a basis of the working fluid as a whole, the total content of the (B)carboxylic acid and (C)basic compound is preferably 0.02% by mass or more and 60% by mass or less; more preferably 0.1% by mass or more and 20% by mass or less; and in especial preferably 0.2% by mass or more and 10% by mass or less.
By setting the content in this way, it is possible to prevent the reaction of the working fluid with silicon, and thereby to make the working fluid which is excellent in both fluid stability and processability of silicon.
[0026] Further, when the total amount of the (A)glycols, the (B) carboxylic acid and the (C)basic compound is set at 100% by mass, the mixed proportion thereof is preferably 30% by mass or more and 95% by mass or less of the (A)glycols; 0.1% by mass or more and 5% by mass or less of the (B)carboxylic acid; 0.1% by mass or more and 5% by mass or less of the (C)basic compound; the rest being water. In addition, it is preferable to adjust the pH of the working fluid to be 5.0 or more and 7.5 or less, by adjusting the amounts of the (A)glycols, (B)carboxylic acid; and (C)basic compound. Andbydoing so, it is possible to suitably maintain the fluid stability even when the cut debris of silicon is mixed in during a cutting process; and is especially effective in making the water-soluble working fluid excellent in processing silicon.
[0027] (E) Other components
In the water-soluble working £1luid of the present invention, in addition to the above (A)glycols and water; and the optionally contained (B}carboxylic acid and (C)basic compound, or (D)salt, (E) other components may be contained. For example, various kinds of additives may be added to an extent that does not affect working performance, the additives not causing bad effects such as corrosion and discoloration on a workpiece material, and not affecting the stability of the mixed systems. For example, a viscosity modifier, pH adjuster, antifocaming agent, antioxidant and the like may be added. As to the viscosity modifier, a known viscosity modifier may be used without special restrictions; however, the viscosity modifier is preferably soluble in water.
Further, as to the pH adjuster, the following may be used: an inorganic base (e.g. the above mentioned sodium hydroxide, potassium hydroxide, and ammonia) ; an organic base (e.g. the above mentioned alkanolamine and alkylamine); an inorganic acid (e.g. hydrochloric acid and sulfuric acid); and an organic acid (e.g. the above mentioned carboxylic acid). As to the antifoaming agent, antioxidant and the like, known ones may be used without special restrictions; however, they are preferably soluble in water.
[0028] The water-soluble working fluid of the present invention comprises the above described components. Further, the water-soluble working fluid of the present invention may be adequately diluted with water depending on the working environment in the cutting process. Specifically, the following may be carried out: a concentrated composition composed of the above described (A)components and the like, excluding water, is mixed to be produced; is adequately diluted with water at a time of performing cutting operations on site; thereby preparing an appropriate water-soluble working fluid to be used, in accordance with the working environment and conditions. Further, the following may also be carried out: a concentrated composition composed of the above (A)components and the like, including a certain amount of water, is mixed to be produced; and is further diluted with water at a time of performing cutting operations i on site.
[0029] In the water-soluble working fluid of the present invention, its viscosity at a time of performing cutting operations (i.e. referring to the viscosity of the working fluid before the dilution when the working fluid is used for cutting without being diluted; and referring to the viscosity of the working fluid after the dilution when the working £luid is used for cutting after being diluted) is adjusted to be 3 mPa-s or more and 50 mPa:s or less at a temperature of 25°C. The “wigcosity” refers to a viscosity measured by a B type viscometer.
The viscosity of the water-soluble working fluid at a temperature of 25°C is preferably 3 mPa:s or more and 50 mPa-s or less; more preferably 5 mPa‘:s or more and 30 mPa:s or less; and in especial preferably 5 mPa-s or more and 25 mPa-*s or less. By setting the viscosity of the water-soluble working fluid within this range, it is possible to make the water-soluble working fluid especially excellent in processing silicon when used for cutting with a fixed abrasive grain wire saw. The viscosity can be adequately adjusted by the content of the (A)glycols; ox the content of the (B)carboxylic acid and (C)basic compound, or other additives (i.e. a viscosity modifier).
[0030] Further, in addition to the above described viscosity,
the pH of the water-soluble working fluid of the present invention is preferably adjusted to be 5.0 or more and 7.5 or less. The
PH level of 5.5 or more and 6.5 ox less is especially preferable.
By setting the pH level within this range, it is possible to prevent the reaction of the silicon and the working fluid even when the silicon as cut debris is mixed into the working fluid after the cutting process, and to stabilize the working fluid.
Accordingly, rise in the viscosity of the working fluid and reduction of the fluid life can be suppressed, and it is possible to make the water-soluble working fluid more excellent in processing silicon. The pH level can be adequately adjusted by the content of the {(A)glycols; or the content of the (B) carboxylic acid and (C)basic compound, or other additives (i.e. a pH adjuster) .
[0031] By using the water-soluble working fluid of the present invention when cutting with a fixed abrasive grain wire saw, it becomes possible to carry out a cutting process which is egpecially excellent in cutting silicon.
[0032] Hereinafter, the water-soluble working fluid for a fixed abrasive grain wire saw of the present invention will be explained in more detail by Examples.
[0033] (Production of a water-soluble working fluid for a fixed abrasive grain wire saw)
The following were mixed so as to form a composition shown in Table 1, thereby producing a working fluid: propylene glycol (PG, propylene glycol produced by Wako Pure Chemical Industries,
Ltd.) ; polyethylene glycol 200 (PEG 200, polyethylene glycol 200 produced by Wako Pure Chemical Industries, Ltd., average molecular weight: 180 to 200); polyethylene glycol 300 (PEG 300, polyethylene glycol 300 produced by Wako Pure Chemical Industries,
Ltd., average molecular weight: 300); water; citric acid (citric acid produced by Wako Pure Chemical Industries, Ltd.}; succinic acid (succinic acid produced by Wako Pure Chemical Industries,
Ltd.) ; and potassium hydroxide (potassium hydroxide produced by
Wako Pure Chemical Industries, Ltd.). Additionally, the viscosity at a temperature of 25°C and the pH of each of the working fluids were measured. The viscosity shown in Table 1 was measured by using a B type viscometer made by Tokyo Keiki Inc. (at 60 rpm}.
[Table 1] en em earn en : h
ET : ; ©) b =z on fl | oi ! a o . =H ~~ |: 1% 8 ©
WS i ; © — : ! 9 w : wn o |i : y = o o =” =H «© - 1: i — on . r~ e 8 lel =| |: i a : ! © . ds ; 12 a ; e 2 o laf w] 2]; : I= — cleof we] Bl
Hl a= ; = MH ; il © = : = 2 oe : 5 we : 1g = i] 6 M
RS i Ln o ! : a Ln oO o ~ ~ . i ; © o~ ™ Ol all wl! 31 > re 12 : : o © =f ™ ocleflwe]| 2 ose ca] . © : : o |. 1 E = <= <= EE - © =~ aL o | © “1: = : ml e . Ln o |} : 2 | = os | ™M ~ | |: : © ~~ on Oo - Ly = : o — ba : : Mm ; 14 : un 12-9 s| = S21] = a ™ o fl nn | oe . o 4 i : ; © ~ a : 3 — < nl os | - w - Sat A 28] | E
U = =] . mo O = 4 = i are oo = oO o w wm oo = -— -— wn O [nl oo HH 0 o O [= 0 Oo 43 oO L wm
WM = a © = j=} oO us} =r [=1 0 on m [= wv | | >
[0035] (Evaluation of performance: cutting process of polycrystalline silicon)
A polycrystalline silicon ingot having a square shape of mm was used as a material to be cut. Further, a single wire saw cutting machine (made by TOKO MACHINERY Co., Ltd.) was used as a fixed abrasive grain wire saw. The operating conditions of the multi-cutting machine were set as shown in Table 2.
[0036] [Table 2]
Number of times at which }
[0037] The above multi-cutting machine was used to process the material to be cut. Specifically, the material was grooved at ten locations as shown in Fig.l, by using the working fluids of Examples 1 to 5, Comparative Examples 1 and 2, or Reference
Examples 1 and 2, and the above single wire saw cutting machine.
The total cutting depth of the grooves at the ten locations was used as an index for the evaluation. The working fluid was poured toward the wire to run along back and forth of the areas to be cut on the material. The results are shown in Table 3.
[0038] Further, just as 5% by mass of silicon as cut debris was mixed in the working fluids during processing of the material to be cut using a fixed abrasive grain, each of the working fluids with 5% by mass of the silicon mixed therein was allowed to stand for 24 hours, after which the viscosity of the working fluids was measured and used as an index for the evaluation. The results are shown in Table 3.
[0039]
[Table 3] ’ iT nS — la « i
NE i ; = a I & =| = 5 14s [= = la = ; o i 1& = & S 18 BE j
Ia 1 o= ma 2 ns = { dE Lo = wo : l= = = ~ we : le = i i oO = 1g ~ ‘e : = = = [=] = @ oo i 1a 2 - -— JM . i . \
Bowl C8 = 3 & a
A tn ! = 2 = = & ; Ie! i . 3 i ==]
I= & - wo mw i
Pe 1
EH i on : I] £ 3 k: 1 =| = = od i ) 25 i — } 9 g = [] : ad : ed oI : “= Ee] qu i
Bl 8 3 5
S| 8 SED gg _| a=} 8 J8 El 2% 2 wf = a oug AN !
Pod 3 oO a o = : = 2 [2 E |i
El gS a ~~ = wm a 5 o 0 i = I
[0040] As shown in Table 3, in all of Examples 1 to 5 of the present invention, the cutting depth was large, showing a satisfactory cutting ability and excellent processability of ig silicon. Further, even after gilicon was mixed in, it was possible to maintain an appropriate viscosity, thereby enabling prevention of reduction of the fluid life and enabling improvement of the processability of silicon.
In comparative Examples 1 and 2, the wire was broken or the cutting depth was insufficient, therefore resulting in insufficient processability of silicon. In addition, in
Comparative Examples 1 and 2, the viscosity of the working fluids remained outside an appropriate range after silicon (Si) was mixed therein.
On the other hand, in Reference Example 1, the cutting depth was sufficient; however, by raising the pH of the working fluid to 7.8, the reaction of the working fluid with the silicon was brought about after the silicon was mixed therein, degrading the fluid stability; and thereby the viscosity resulted in outside an appropriate range. Further in Reference Example 2, an appropriate viscosity was maintained even after the silicon was mixed in and the fluid stability was achieved; however, by lowering the pH of the working fluid to 4.3, a sufficient cutting depth was hindered and the wire was broken after processing. It was found from this, that the pH of the working fluid, as well as the viscosity thereof, becomes an important factor for maintaining the processability of silicon.
[0041] The invention has been described above as to the embodiment which is supposed to be practical as well as preferable at present. However, it should be understood that the invention is not limited to the embodiment disclosed in the specification and carn be appropriately modified within the range that does not depart from the gist or spirit of the invention, which can be read from the appended claims and the overall specification, and a water-soluble working fluid for a fixed abrasive grain wire saw with such modifications are also encompassed within the technical range of the invention.
[0042] The present invention can be suitably used as a water-soluble working £luid for a fixed abrasive grain wire saw, which is capable of cutting a silicon material with precision by using a fixed abrasive grain wire saw inmanufacturinga silicon wafer.
Claims (6)
1. A water-soluble working fluid for a fixed abrasive grain wire saw comprising (A)glycols and water, wherein a viscosity of the working fluid at a temperature of 25°C is 3 mPa's or more and 50 mPa:s or less.
2. The water-soluble working fluid for a fixed abrasive grain wire saw according to claim 1, wherein a pH of the working fluid is adjusted to be 5.0 or more and 7.5 or less.
3. The water-soluble working fluid for a fixed abrasive grain wire saw according to claim 1 or 2, further comprising a (B) carboxylic acid, and a (C)compound showing basicity on dissolution in water.
4. The water-soluble working fluid for a fixed abrasive grain wire saw according to claim 3, wherein the (B)carboxylic acid preferably has 7 or less carbon atoms.
5. The water-soluble working fluid for a fixed abrasive grain wire saw according to claim 3 or 4, wherein on a basis that the total amount of the (A)glycols, the (B)carboxylic acid, and the (C) compound showing basicity on dissolution in water, is 100% by mass, 5% by mass or more and 95% by mass or less of the (A) glycols;
0.01% by mass or more and 60% by mass or less of the (B)carboxylic acid; and 0.01% by mass or more and 60% by mass or less of the (C) compound showing basicity on dissolution in water, are contained;
0.02% by mass or more and 60% by mass or less in total, of the (B)carboxylic acid and the (C)compound showing basicity on dissolution in water is contained; and the rest is water.
6. The water-soluble working £luid for a fixed abrasive grain wire saw according to any one of claims 1 to 5, which is used in performing a cutting process on a silicon material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009166962A JP5679642B2 (en) | 2009-07-15 | 2009-07-15 | Water-soluble machining fluid for fixed abrasive wire saws |
| PCT/JP2010/052095 WO2011007590A1 (en) | 2009-07-15 | 2010-02-12 | Water-soluble working fluid for fixed-abrasive wire saw |
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| Publication Number | Publication Date |
|---|---|
| SG177321A1 true SG177321A1 (en) | 2012-02-28 |
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| SG2011095171A SG177321A1 (en) | 2009-07-15 | 2010-02-12 | Water-soluble working fluid for fixed abrasive grain wire saw |
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| JP (1) | JP5679642B2 (en) |
| KR (1) | KR20120049216A (en) |
| CN (1) | CN102471723B (en) |
| SG (1) | SG177321A1 (en) |
| WO (1) | WO2011007590A1 (en) |
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| KR20120061821A (en) | 2009-08-31 | 2012-06-13 | 산요가세이고교 가부시키가이샤 | Water-soluble cutting fluid for slicing silicon ingots |
| JP5624904B2 (en) * | 2011-01-31 | 2014-11-12 | 三洋化成工業株式会社 | Water-soluble cutting fluid for silicon ingot |
| JP2012172117A (en) * | 2011-02-23 | 2012-09-10 | Yushiro Chemical Industry Co Ltd | Water-soluble working fluid for fixed abrasive grain wire saw |
| JP5755479B2 (en) * | 2011-03-31 | 2015-07-29 | 三洋化成工業株式会社 | Hydrous cutting fluid composition and method for producing the same |
| CN103013638B (en) * | 2011-09-20 | 2014-09-17 | 浙江瑞翌新材料科技有限公司 | Water-soluble cooling liquid for fixed abrasive material line cutting, and preparation method thereof |
| JP6039935B2 (en) * | 2012-06-29 | 2016-12-07 | 出光興産株式会社 | Aqueous processing fluid |
| JP6204029B2 (en) * | 2013-03-06 | 2017-09-27 | 出光興産株式会社 | Aqueous processing fluid |
| TWI640619B (en) * | 2015-02-10 | 2018-11-11 | 達興材料股份有限公司 | An additive for an aqueous cutting fluid for a cutting process and a manufacturign method thereof |
| JP6232480B2 (en) * | 2016-08-31 | 2017-11-15 | 出光興産株式会社 | Aqueous processing fluid |
| JP6819619B2 (en) * | 2018-01-22 | 2021-01-27 | 信越半導体株式会社 | Work cutting method and wire saw |
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| JPH04218594A (en) * | 1990-12-19 | 1992-08-10 | Nippon Steel Corp | Cutting method with wire thaw and processing fluid therefor |
| JPH04216897A (en) * | 1990-12-19 | 1992-08-06 | Nippon Steel Corp | Method and working fluid for cutting with wire saw |
| JP2000160185A (en) * | 1998-12-02 | 2000-06-13 | Kyodo Yushi Co Ltd | Water soluble oil agent for cut processing |
| JP2002096251A (en) * | 1999-09-17 | 2002-04-02 | Sumitomo Special Metals Co Ltd | Cutting method and cutting apparatus for rare earth alloys |
| JP4601220B2 (en) * | 2001-09-06 | 2010-12-22 | ユシロ化学工業株式会社 | Water-insoluble processing oil composition for fixed abrasive wire saw |
| JP4601221B2 (en) * | 2001-09-06 | 2010-12-22 | ユシロ化学工業株式会社 | Water-insoluble processing oil composition for fixed abrasive wire saw |
| JP4497768B2 (en) * | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | Water-soluble machining fluid composition for fixed abrasive wire saw |
| JP4497767B2 (en) * | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | Water-soluble machining fluid composition for fixed abrasive wire saw |
| JP4656804B2 (en) * | 2001-10-17 | 2011-03-23 | 日立金属株式会社 | Cutting method using wire saw and method for producing rare earth magnet |
| JP2006096951A (en) * | 2004-09-30 | 2006-04-13 | Kyodo Yushi Co Ltd | Water-soluble machining oil, slurry, and machining method |
| JP4481898B2 (en) * | 2005-07-25 | 2010-06-16 | ユシロ化学工業株式会社 | Water-based abrasive dispersion medium composition |
| CN102369268A (en) * | 2009-03-31 | 2012-03-07 | 出光兴产株式会社 | Machining fluid for brittle material and machining fluid for hard material |
| JP2010275537A (en) * | 2009-04-28 | 2010-12-09 | Sanyo Chem Ind Ltd | Water-soluble cutting liquid |
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| KR20120049216A (en) | 2012-05-16 |
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| CN102471723A (en) | 2012-05-23 |
| CN102471723B (en) | 2015-06-03 |
| JP2011021096A (en) | 2011-02-03 |
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