KR20120021748A - Aqueous sawing fluid composition for wire saw - Google Patents

Abstract

PURPOSE: An aqueous cutting fluid composition for a wire saw is provided to avoid using water and a glycol monomer for improving viscosity stability by the content of abrasive particle. CONSTITUTION: An aqueous cutting fluid composition for a wire saw contains a glycol ether based compound, a glycol based compound, acid, aliphatic amine, aromatic amine, and or inorganic base. The glycol ether based compound is marked with chemical formula 1: HO-(CH2R1CH2O)m-R2. The glycol based compound is marked with chemical formula 2: HO-(CH2R3CH2O)x-(CH2R4CH2O)y-H. The acid is selected from aliphatic group organic acid or aromatic group organic acid.

Description

Aqueous sawing fluid composition for wire saw

The present invention relates to an aqueous cutting fluid composition for wire saws.

In general, when cutting a workpiece using cutting tools such as wire saws or band saws, cutting fluids are widely used for the purpose of lubricating the cutting tools with the workpieces, removing frictional heat, and cleaning cutting chips. . For example, in the case of manufacturing a wafer by slicing a silicon single crystal ingot as a workpiece, a slurry-like non-aqueous cutting liquid in which a glass abrasive grain composed of SiC or the like is dispersed in a dispersion medium mainly containing mineral oil or high-grade hydrocarbons is widely used. It is used. It is a slurry form which disperse | distributed abrasive grains, such as SiC, in 1: 1 weight ratio in this non-aqueous cutting liquid, and this slurry is continuously supplied to a cutting process surface. For cleaning the cut wafer, a chlorine-based organic solvent such as trichloromethane or methylene chloride or a high concentration of nonionic surfactant is used as the cleaning liquid.

As described above, in a system in which cutting is performed by the dynamic contact between the cutting tool, the workpiece, and the abrasive grain, it is important to improve the dispersibility of the abrasive grain in the cutting fluid at all times to keep the cutting performance constant. As a method for improving dispersibility, there are a method of adding a dispersant and a method of adding a thickener.

The method of adding a dispersing agent improves the dispersibility of the abrasive grain. As a result, the settling speed of the dispersing abrasive particles is surely lowered, but in the process of deposition, they are intimately contacted with each other and are compressed to a load exceeding the repulsive force to form hard cakes. Once the hard cake is processed, it is difficult to redistribute it to its original state. Therefore, even if the cutting liquid which produced such a deposit is stirred for a long time and recycled, it will be used in the state of low abrasive grain concentration, and cutting performance will fall. In addition, there is a problem that the pipe of the cutting fluid supply system is blocked, or the wear of the tool for crushing the hard cake is accelerated.

In addition, the method of adding a thickener ensures a certain effect on the assumption that the viscosity of the cutting liquid is unchanged, but in reality, the viscosity of the cutting liquid changes in various factors. First, the viscosity of cutting fluid generally increases when cutting chips are mixed. If the viscosity is increased, it is not possible to supply homogeneous abrasive grains to the cutting surface of the workpiece at a constant ratio at all times. Therefore, when the amount of cutting debris reaches 3 to 4% by weight of the cutting liquid, it is necessary to replace the cutting liquid. There is. This increases the waste volume of the cutting fluid, and further increases the amount of carbon dioxide generated by the incineration. In addition, even if moisture is mixed, the viscosity of the non-aqueous cutting liquid increases. Therefore, in order to prevent water mixing, there has been a large restriction on the cleaning operation of the wafer and the ingot-attached base, for example, in the apparatus of the wire saw. That is, in a system using a non-aqueous cutting liquid, the cleaning liquid must also be an organic solvent. Therefore, it is necessary to fill the cleaning liquid into a cleaning tank provided separately from the cutting liquid tank to perform cleaning. As a result, the occupied area of the apparatus increases, and moreover, the amount of organic solvent used increases, which causes the working environment and the global environment to worsen.

In addition, there are many problems to be solved in the non-aqueous cutting fluid. First, the organic solvent widely used as a dispersion medium of the conventional non-aqueous cutting liquid has a bad smell, and in some cases, especially in the case of mineral oil, has a cause of deteriorating the working environment. In addition, the work cut | disconnected using what is called an oily cutting liquid needs to be wash | cleaned using the organic solvent which can melt | dissolve and remove this. However, since dichloroethane, which is used for cleaning semiconductor wafers, is designated as an ozone depleting substance, it is necessary to reduce the amount used in the future for total abolition. In addition, the waste treatment method remaining after the slurry is used for cutting the ingot is generally incinerated, and this incineration also causes air pollution. However, the economics and cleaning power of alternative materials are still insufficient at present.

As described above, in the non-aqueous cutting liquid, it is necessary to suppress the impact on the working environment and the global environment, to achieve high dispersibility of the abrasive grains necessary for maintaining cutting performance, and to improve the reusability and the water-retainability of the equipment. It is extremely difficult to attain both prevention of hard cake formation.

SUMMARY OF THE INVENTION An object of the present invention is to provide an aqueous cutting fluid composition which is excellent in viscosity stability according to the content of abrasive particles, and can prevent hard cake formation of precipitates by using inorganic acids, organic acids, amines, inorganic bases, and the like. will be.

It is an object of the present invention to provide an aqueous cutting fluid composition which minimizes environmental problems and has good adhesion of the cutting fluid to the wire saw.

It is an object of the present invention to provide an aqueous cutting fluid composition which can reduce the consumption of cutting fluid since the viscosity does not increase rapidly even when the viscosity increases when the cutting particles of the cutting material are contained during cutting.

It is also an object of the present invention to provide an aqueous cutting liquid composition in which abrasive grains that exhibit excellent ability in slicing with a wire saw are stably dispersed.

It is also an object of the present invention to provide an aqueous cutting liquid composition which can easily remove the abrasives or cutting residues of the workpiece after the cutting process, and has corrosion protection properties.

The present invention is a glycol ether compound represented by the formula (1); Glycol compounds represented by the following formula (2); One or two or more acids selected from the group consisting of aliphatic inorganic acids, aromatic inorganic acids, aliphatic organic acids and aromatic organic acids; And it provides an aqueous cutting liquid composition comprising one or two or more selected from the group consisting of aliphatic amines, aromatic amines and inorganic bases.

<Formula 1>

HO- (CH ₂ R ₁ CH ₂ O) _m -R ₂

<Formula 2>

HO- (CH ₂ R ₃ CH ₂ O) _x- (CH ₂ R ₄ CH ₂ O) _y -H

In Chemical Formula 1 and Chemical Formula 2,

R ₁ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,

R ₂ is a linear or branched alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, or an aryl group having 6 to 20 carbon atoms,

m is 1-20,

R ₃ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,

R ₄ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,

x is 0-20, y is 0-20, and x + y≥4.

The aqueous cutting fluid composition of the present invention does not use glycol monomers and water, and uses inorganic acids, organic acids, amines, inorganic bases, and the like, so that the viscosity stability according to the content of the abrasive particles is high, so that the content of the abrasive grains according to the process is controlled. It is easy. In addition, the aqueous cutting liquid composition of the present invention is excellent in processing accuracy, can prevent hard cake formation of precipitates, and the aqueous cutting liquid slurry can be regenerated. Since the aqueous cutting liquid composition of the present invention can be recycled, the processing cost can be reduced in size and environmental problems caused by the disposal of the aqueous cutting liquid slurry can be improved. The aqueous cutting fluid composition of the present invention minimizes environmental problems and has good adhesion to the wire saw of the cutting fluid. The water-soluble cutting fluid composition for wire saws of the present invention does not sharply increase the viscosity even when the viscosity increases when the cutting particles are contained during cutting, so that the consumption of the cutting liquid can be reduced. The water-soluble cutting liquid composition for wire saws of the present invention can stably disperse abrasive grains that exhibit excellent ability in slicing with a wire saw. The water-soluble cutting fluid composition for wire saws of the present invention can be easily removed from the abrasives and cutting residues of the workpiece after the cutting process, and has an anti-corrosion property. The water-soluble cutting liquid composition for wire saws of this invention can be used for the cutting liquid used for cutting ingots, such as a silicon single crystal and a polycrystal, and other compound semiconductors and a ceramic.

Hereinafter, the present invention will be described in detail.

The aqueous cutting fluid composition of this invention is a glycol ether compound; Glycol compounds; One or two or more acids selected from the group consisting of inorganic acids, aliphatic organic acids and aromatic organic acids; And one or two or more selected from the group consisting of aliphatic amines, aromatic amines, and inorganic bases.

The glycol ether compounds contained in the aqueous cutting fluid composition of the present invention are represented by the following general formula (1).

<Formula 1>

HO- (CH ₂ R ₁ CH ₂ O) _m -R ₂

In Chemical Formula 1,

R ₁ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,

R ₂ is a linear or branched alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, or an aryl group having 6 to 20 carbon atoms,

m is 1-20.

The glycol ether compound represented by Chemical Formula 1 has one hydroxyl group and thus has low surface tension. Due to the low surface tension, the abrasive particles can be uniformly dispersed, and thus the viscosity stability according to the content of the abrasive particles is excellent. In addition, hard cake formation of precipitates of abrasive particles can be prevented.

The glycol ether compounds represented by the formula (1) include ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, polyethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, Triethylene glycol monoethyl ether, polyethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, polyethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl Ether, tripropylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoisobutyl ether, diethylene glycol monoisobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol No 2-ethylhexyl ether, diethylene glycol mono 2-ethylhexyl ether, ethylene glycol monoallyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, propylene glycol monobutyl ether and dipropylene glycol monobutyl ether It is preferable that it is 1 type, or 2 or more types selected from the group. Of these, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, polyethylene glycol monomethyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether having a flash point of 100 ° C. or higher, and ethylene Glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol mono 2-ethylhexyl ether, diethylene glycol mono 2-ethylhexyl ether, ethylene glycol monophenyl ether, and propylene glycol monobutyl ether are more preferable.

It is preferable that the glycol ether compound represented by the said Formula (1) is 4.9 to 90 weight% with respect to the total weight of an aqueous cutting liquid composition. If the above range is satisfied, the viscosity stability of the aqueous cutting liquid slurry according to the content of the abrasive particles is maintained, and there is an advantage in preventing hard cake formation.

The glycol compounds contained in the aqueous cutting fluid composition of the present invention are represented by the following formula (2).

<Formula 2>

HO- (CH ₂ R ₃ CH ₂ O) _x- (CH ₂ R ₄ CH ₂ O) _y -H

In Chemical Formula 2,

R ₃ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,

R ₄ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,

x is 0-20, y is 0-20, and x + y≥4.

Although the glycol compound represented by the formula (2) has two hydroxyl groups, the surface tension is lower than that of the glycol monomers, thereby uniformly dispersing the abrasive particles, thus exhibiting viscosity stability according to the content of the abrasive particles, hard cake for the precipitate of the abrasive particles Prevents anger

The glycol compounds represented by the formula (2) is preferably one or two or more selected from the group consisting of polyethylene glycol, polypropylene glycol, and ethylene oxide fluorene oxide copolymers. It is preferable that they are polypropylene glycol and ethylene oxide propylene oxide copolymer whose surface tension is 30 mN / m or less.

It is preferable that the glycol compounds represented by the said Formula (2) are contained in 9.9 to 95 weight% with respect to the total weight of the aqueous cutting fluid composition. When the content is satisfied, the viscosity stability of the aqueous cutting liquid slurry according to the content of the abrasive grains is maintained, and there is an advantage in preventing hard cake formation.

One or two or more acids selected from the group consisting of inorganic acids, aliphatic organic acids and aromatic organic acids included in the aqueous cutting fluid composition of the present invention are arranged around the abrasive particles to cause electrical repulsion. Due to the electrical repulsive force, the dispersibility of the abrasive particles can be improved and hard cake formation of the precipitates of the abrasive particles can be prevented. In addition, the aliphatic or aromatic organic acid shows excellent viscosity stability according to the content of the abrasive particles.

The inorganic acid is preferably one or two or more selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid and carbonic acid.

The aliphatic organic acids include humic acid, acetic acid, propionic acid, butyric acid, palmitic acid, stearic acid, oleic acid, oxalic acid, malonic acid, succinic acid, tartaric acid, maleic acid, glycolic acid, glutaric acid, adipic acid, loric acid, valeric acid The acid, sulfosuccinic acid, valeric acid, caproic acid, caprylic acid, capric acid, loric acid, myristic acid, lactic acid, malic acid, citric acid and tartaric acid are preferably one or two or more selected from the group.

The aromatic organic acid is preferably one or two or more selected from the group consisting of benzoic acid, salicylic acid, paratoluenesulfonic acid, naphthoic acid, nicotinic acid, toluic acid, aniseic acid, cuminic acid and phthalic acid.

Among them, fume acid, acetic acid, propionic acid, butyric acid, oxalic acid, malonic acid, succinic acid, maleic acid, glutaric acid, fumaric acid, salicylic acid, glycolic acid and benzoic acid, which have excellent solubility in the aqueous cutting fluid composition of the present invention, It is more preferable. Moreover, it is more preferable to use the inorganic acid which does not react with the aqueous cutting fluid composition of this invention.

The aliphatic inorganic acid, aromatic inorganic acid, aliphatic organic acid, and one or two or more acids selected from the group consisting of aromatic organic acids are preferably contained in 0.01 to 5% by weight. If it is contained below the above-mentioned range, sufficient electrical repulsive force cannot be caused around the abrasive grain, and if it exceeds the above-mentioned range, the dispersibility of the abrasive grain is deteriorated.

One or two or more selected from the group consisting of aliphatic amines, aromatic amines and inorganic bases included in the aqueous cutting fluid composition of the present invention are arranged around the abrasive grains to cause electrical repulsion. Due to the electrical repulsive force, the dispersibility of the abrasive particles can be improved and hard cake formation of the precipitates of the abrasive particles can be prevented. In addition, the aliphatic or aromatic organic acid shows excellent viscosity stability according to the content of the abrasive particles.

The aliphatic amines include alkanolamines such as monoethanolamine, diethanolamine, triethanolamine, dimethylethanolamine, N-methyldiethanolamine, monomethylethanolamine, diglycolamine; Cyclic amines such as morpholine; One or two or more selected from the group consisting of N-aminoethylpiperazine, dimethylaminopropylamine, N, N-dimethylcyclohexylamine, ethylenediamine, diethylenetriamine, triethylenetetraamine and tetraethylenepentaamine It is preferable. The aromatic amine is preferably one or two selected from the group consisting of aniline and pyridine. The inorganic base is preferably one or two selected from the group consisting of sodium hydroxide and potassium hydroxide. Of these, ethylenediamine, diethylenetriamine, triethylenetetraamine, tetraethylenepentaamine, nitric acid and phosphoric acid which are excellent in solubility in the aqueous cutting liquid composition of the present invention are more preferable. It is most preferable to use inorganic bases which do not react with the aqueous cutting fluid of the present invention.

One or two or more selected from the group consisting of aliphatic amines, aromatic amines and inorganic bases included in the aqueous cutting fluid composition of the present invention is preferably included in an amount of 0.01 to 5% by weight based on the total weight of the aqueous cutting fluid composition. Do. If it is contained below the above-mentioned range, sufficient electrical repulsive force cannot be caused around the abrasive grain, and if it exceeds the above-mentioned range, the dispersibility of the abrasive grain is deteriorated.

It is preferable that pH of the aqueous cutting fluid composition of this invention is 5-8. If the above range is satisfied, it is possible to improve the working environment of workers and environmental problems that can occur using acidic or alkaline.

The present invention provides a water-soluble slurry for processing comprising the above-mentioned aqueous colorant composition and abrasive grains.

The abrasive grain is not particularly limited, but is preferably one or two selected from the group consisting of silicon carbide, aluminum oxide, zirconium oxide, silicon dioxide, cesium dioxide, and diamond. It is preferable that the average particle diameter of the said abrasive grain is 0.5-50 micrometers. It is preferable that the water-soluble cutting fluid composition for wire saws and abrasive grains are mixed by the weight ratio of 1: 0.5-1: 1.2.

The water-soluble slurry for processing may be performed by cutting, grinding, polishing or cutting. In the processing using the water-soluble slurry for processing, the workpiece is preferably one or two or more selected from the group consisting of single crystal silicon, polycrystalline silicon, quartz, quartz, compound semiconductor, ceramic, glass, metal oxide, cemented carbide and sintered alloy. Do.

Examples of the cutting device in which the effect of the water-soluble cutting liquid composition of the present invention and the aqueous slurry for processing using the same are particularly remarkable include a wire saw, a band saw, a multi-wire saw multiplexed these, a multi-band saw, and the like.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are intended to further illustrate the present invention, and the scope of the present invention is not limited by the following examples. The following examples can be appropriately modified and changed by those skilled in the art within the scope of the present invention.

Examples 1-8, Comparative Examples 1-5: Preparation of Aqueous Cutting Fluid Composition

To prepare the composition of Tables 1 and 2 below. Further, the aqueous cutting fluid slurry for processing was obtained by adding GC particles (# 1000) to 40, 50, and 60% by weight with respect to each aqueous cutting fluid composition, and stirring at 150 rpm for 1 hour with a stirrer. In addition, the numerical value corresponding to each component of Table 1, 2 is weight%.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 a1 8 53 a2 12 60 a3 7 56 a4 20 a5 35 b1 91.9 87.8 92.8 79.9 64.9 b2 46.9 38.8 43.8 c1 0.015 0.015 0.015 0.015 c2 0.015 0.015 c3 0.01 0.01 d1 0.01 0.01 d2 d3 0.01 0.01 0.01 0.01 0.01 0.01

Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 a1 20 20 e1 95 e2 94.9 79.9 74.9 99.9 water 5 5 5 c1 0.02 c3 0.01 d1 0.02 d3 0.01

A): diethylene glycol monomethyl ether

a2: triethylene glycol monomethyl ether

a3: diethylene glycol monobutyl ether

a4: triethylene glycol monobutyl ether

a5: ethylene glycol monophenyl ether

b1: Polypropylene glycol 400 (brand name-Koremul PPG400A, manufacturer-Hannong-seong)

b2: Ethylene oxide propylene oxide random copolymer (trade name-Koremul EPR300, manufacturer-Hannong-seong)

c1: malonic acid c2: glycolic acid

c3: nitric acid d1: diethylenetriamine

d2: tetraethylenepentaamine d3: potassium hydroxide

e1: diethylene glycol e2: propylene glycol

Test Example: Evaluation of Characteristics of Aqueous Cutting Fluid Composition

<Dispersion Measurement>

50% by weight of the prepared aqueous cutting fluid slurry for processing was placed in a 200 ml beaker immediately after preparation to measure the dispersion degree according to the sedimentation of GC particles in units of 2, 4, 8, 12, 24, 48, 72 hours, Dispersion is expressed in%. The results are shown in Table 3 below.

Time (hr) 2 4 8 12 24 48 72 Example 1 96.54 93.08 85.00 78.08 70.38 69.62 68.46 Example 2 93.28 87.69 79.48 73.13 68.28 64.55 64.18 Example 3 96.15 93.08 84.62 77.69 70.00 69.23 67.69 Example 4 93.28 88.06 79.85 73.88 68.66 64.93 64.93 Example 5 96.54 93.08 85.00 78.08 70.38 69.62 68.46 Example 6 93.28 87.69 79.48 73.13 68.66 64.55 64.18 Example 7 96.15 93.08 84.62 77.69 70.00 69.23 67.69 Example 8 96.54 93.08 84.62 78.08 70.38 69.23 67.69 Comparative Example 1 81.25 75.42 70.42 60.83 51.67 48.75 48.75 Comparative Example 2 80.83 75.42 70.00 58.75 51.25 47.50 47.50 Comparative Example 3 80.83 75.42 68.75 56.67 50.42 46.67 46.67 Comparative Example 4 80.83 75.00 66.67 56.25 50.42 46.67 46.67 Comparative Example 5 80.83 75.00 70.42 61.25 51.25 49.58 49.58

From Table 3, the dispersion degree of the processing aqueous cutting fluid slurry of the comparative example was low, whereas the dispersion degree of the processing aqueous cutting fluid slurry of the present invention was high for each time.

<Viscosity measurement>

The viscosity of each of the prepared aqueous cutting fluid slurry for processing was measured using a Brookfield Rheometer DV-III. In addition, 50 wt% of the slurry was placed in a 200 ml beaker immediately after the preparation, and allowed to stand for 72 hours. The results are shown in Table 4 below.

Slurry Viscosity @ 25 ° C / CPE-51 / 190rpm (cP) Hard cake 40 wt% 50 wt% 60 wt% Example 1 135 215 575 none Example 2 141 221 568 none Example 3 138 223 548 none Example 4 134 216 577 none Example 5 136 215 584 none Example 6 138 221 585 none Example 7 140 220 585 none Example 8 142 223 576 none Comparative Example 1 108 203 895 has exist Comparative Example 2 85 158 635 has exist Comparative Example 3 81 145 532 has exist Comparative Example 4 97 195 858 has exist Comparative Example 5 104 204 1232 has exist

When the aqueous cutting fluid slurry for processing according to the comparative example was made from Table 4, the viscosity increased significantly, whereas the viscosity did not change significantly even at 60% by weight of the aqueous cutting fluid slurry for processing according to the present invention and the content of GC (Green Carbite) particles. The viscosity stability was excellent. Further, the aqueous cutting fluid slurry for processing of the present invention was excellent in dispersion stability without hard cake formation.

Claims (12)

A glycol ether compound represented by Formula 1 below;
Glycol compounds represented by the following formula (2);
One or two or more acids selected from the group consisting of inorganic acids, aliphatic organic acids and aromatic organic acids; And
An aqueous cutting fluid composition comprising one or two or more selected from the group consisting of aliphatic amines, aromatic amines and inorganic bases:
<Formula 1>
HO- (CH ₂ R ₁ CH ₂ O) _m -R ₂
<Formula 2>
HO- (CH ₂ R ₃ CH ₂ O) _x- (CH ₂ R ₄ CH ₂ O) _y -H
In Chemical Formula 1 and Chemical Formula 2,
R ₁ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,
R ₂ is a linear or branched alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, or an aryl group having 6 to 20 carbon atoms,
m is 1-20,
R ₃ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,
R ₄ is a direct bond or a straight or branched chain alkylene group having 1 to 6 carbon atoms,
x is 0-20, y is 0-20, and x + y≥4. The method according to claim 1,
With respect to the total weight of the aqueous cutting fluid composition,
4.9 to 90% by weight of a glycol ether compound represented by Formula 1;
9.9 to 95% by weight of a glycol compound represented by Formula 2;
0.01 to 5% by weight of one or two or more acids selected from the group consisting of the inorganic acids, aliphatic organic acids and aromatic organic acids; And
An aqueous cutting fluid composition comprising 0.01 to 5% by weight of one or two or more selected from the group consisting of aliphatic amines, aromatic amines and inorganic bases. The method according to claim 1,
The glycol ether compounds represented by the formula (1) include ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, polyethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, Triethylene glycol monoethyl ether, polyethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, polyethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl Ether, tripropylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoisobutyl ether, diethylene glycol monoisobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol No 2-ethylhexyl ether, diethylene glycol mono 2-ethylhexyl ether, ethylene glycol monoallyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, propylene glycol monobutyl ether and dipropylene glycol monobutyl ether An aqueous cutting liquid composition, characterized in that one or two or more selected from the group. The method according to claim 1,
The glycol compound represented by Formula 2 is an aqueous cutting fluid composition, characterized in that one or two or more selected from the group consisting of polyethylene glycol, polypropylene glycol and ethylene oxide propylene oxide copolymer. The method according to claim 1,
The inorganic acid is an aqueous cutting liquid composition, characterized in that one or two or more selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid and carbonic acid. The method according to claim 1,
The aliphatic organic acids include humic acid, acetic acid, propionic acid, butyric acid, palmitic acid, stearic acid, oleic acid, oxalic acid, malonic acid, succinic acid, tartaric acid, maleic acid, glycolic acid, glutaric acid, adipic acid, loric acid, valeric acid Aqueous, characterized in that one or more selected from the group consisting of acid, sulfosuccinic acid, valeric acid, caproic acid, caprylic acid, capric acid, loric acid, myristic acid, lactic acid, malic acid, citric acid and tartaric acid Cutting fluid composition. The method according to claim 1,
The aromatic organic acid is one or two or more selected from the group consisting of benzoic acid, salicylic acid, paratoluenesulfonic acid, naphthoic acid, nicotinic acid, toluic acid, aniseic acid, cuminic acid and phthalic acid. The method according to claim 1,
The aliphatic amines are monoethanolamine, diethanolamine, triethanolamine, dimethylethanolamine, N-methyldiethanolamine, monomethylethanolamine, diglycolamine, morpholine, N-aminoethylpiperazine, dimethylaminopropylamine, An aqueous cutting liquid composition, characterized in that one or two or more selected from the group consisting of N, N-dimethylcyclohexylamine, ethylenediamine, diethylenetriamine, triethylenetetraamine, and tetraethylenepentaamine. The method according to claim 1,
The aromatic amine is an aqueous cutting liquid composition, characterized in that one or two selected from the group consisting of aniline and pyridine. Claim 1
The inorganic base is an aqueous cutting fluid composition, characterized in that one or two or more selected from the group consisting of sodium hydroxide and potassium hydroxide. A water-soluble slurry for processing, comprising the water-soluble cutting liquid composition according to claim 1 and abrasive grains. A processing method comprising cutting, grinding, polishing or cutting using a water-soluble slurry for processing according to claim 11.