JP2003124159A - Aqueous lapping liquid and aqueous lapping compound - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide aqueous lapping liquid and aqueous lapping compound which are free from anxieties about the problem of biodegradability when alkylphenol compound is used as dispersing agent and endocrine problem that chemical substance disrupts endocrine system of organisms, and have good abrasive dispersion, cutting workability and polishing workability which are equivalent to those of lapping liquid and lapping compound using alkyphenol abrasive dispersion agent. SOLUTION: The aqueous lapping liquid and aqueous lapping compound formed by incorporating abrasive in the lapping liquid contain abrasive dispersing agent expressed by RIO-(AIO)m -H (1) (wherein RI is alkyl group or alkenyl group, (AIO)m expresses polyoxyalkylene group constituted of copolymerization of ethylene oxide and 3 or more C alkylene oxide, and m expresses a number of 2 or more) as an (A) element, lubricating base oil as a (B) element and water as a (C) element.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a water-based lapping liquid used for cutting or polishing brittle materials such as semiconductors, ceramics, quartz, glass and cemented carbide tools by utilizing dispersed abrasive grains. Or, it relates to an aqueous wrapping agent.

[0002]

2. Description of the Related Art A slurry-like working agent in which abrasive grains are dispersed is placed between a work piece and a tool and subjected to relative motion while applying pressure to both, thereby cutting or polishing the work piece. There is a processing method. Such processing methods are mainly used for processing brittle materials that cannot be processed by shear deformation, such as semiconductors, crystals, glass, and cemented carbide tools. A processing liquid in which abrasive grains are dispersed, which is used in such processing, is called a lapping agent.

In such a processing method, the abrasive grains may be supplied to the user in the form of being dispersed in a liquid in advance, but due to problems such as transportation and storage places, the user can concentrate the abrasive grains on the work site in a concentrated manner. In many cases, the working fluid is diluted with water or the like and then the abrasive grains are dispersed before use. In the present invention, a thick working liquid before the abrasive grains are dispersed is referred to as a lapping liquid, and a liquid in which the abrasive grains are dispersed after the lapping liquid is diluted with water or the like as needed is referred to as a lapping agent. The polishing process using the lapping agent is called lapping, and the precision polishing process using the lapping agent in which the abrasive grains are fine particles such as colloidal silica may be particularly called polishing.

The lapping agent is usually a dispersion of fine powdery abrasive grains in a liquid such as water, mineral oil, synthetic oil, oil and fat. In order to maintain the processing accuracy, the lapping agent is contained in the lapping agent. It is necessary to stably disperse for a long time. When the dispersion of the abrasive grains is unstable, sedimentation or uneven dispersion of the abrasive grains occurs, and the machining efficiency and the machining accuracy are significantly reduced. In particular, in a water-based lapping agent, since the abrasive grains tend to settle, dispersion stabilization of the abrasive grains in the lapping agent is a major problem.

Conventionally, ethylene oxide adducts of alkylphenols have been used as dispersants for abrasive grains. Alkylphenol ethylene oxide adducts have excellent effects on abrasive grain dispersibility, etc., but since they are hardly biodegradable, they do not undergo long-term decomposition when released into the environment and may pollute the environment. there were. Moreover, in recent years, nonylphenol may exert a pseudohormonal effect on organisms and disrupt the endocrine system.
There is also concern about the so-called endocrine problem, and alternatives were being sought for the ethylene oxide adducts of alkylphenols.

As an aqueous lapping agent which does not use an ethylene oxide adduct of alkylphenol, for example, a lapping agent using a polyalkylene glycol derivative or a polymeric saccharide as a thickening agent in JP-A-3-181598 is
In Japanese Patent Laid-Open No. 9-36074, a Pluronic type or P type
A wrapping agent using an O / EO random polyether surfactant as an abrasive grain dispersant, and in JP-A-10-204419, a wrapping agent using a polyalkylene glycol terminal diether as an abrasive grain dispersant is disclosed. 2000-1412
10 publication contains an aliphatic dicarboxylic acid, an ethylene oxide adduct of alcohol, a polyoxyethylene fatty acid ester, a sorbitan fatty acid ester, an ethylene oxide adduct of a sorbitan fatty acid ester, a polyoxyethylene polyoxypropylene block polymer or a fatty acid diethanolamide. The wrapping agent used is disclosed in
In 000-345145 gazette, a lapping agent and the like using an ethylene oxide adduct of an alcohol having 6 to 24 carbon atoms as an abrasive grain dispersant is proposed. However, these lapping agents have a drawback that the abrasive grains are likely to settle because the dispersibility of the abrasive grains is insufficient as compared with the lapping agent in which an ethylene oxide adduct of alkylphenol is used as the abrasive grain dispersant. .

[0007]

SUMMARY OF THE INVENTION Accordingly, the object of the present invention is to provide a biodegradability, which is a problem when an alkylphenol compound is used as a dispersant, and an end point that a chemical substance disturbs the endocrine system of a living organism. A water-based lapping liquid and a water-based lapping that have no fear of a cleansing problem and further have excellent abrasive dispersibility, cutting workability and polishing workability equivalent to a lapping liquid and a lapping liquid using an alkylphenol-based abrasive grain dispersant. To provide the agent.

[0008]

The inventors of the present invention have made intensive studies and found that an abrasive dispersant having a specific structure does not adversely affect the polishing performance and that the dispersion stability of the abrasive is ethylene oxide of alkylphenol. The present invention has been completed by finding that a wrapping agent which is equivalent to an adduct and has almost no adverse effect on the environment can be obtained. That is, the present invention is
As the component (A), the following general formula (1) (In the formula, R ¹ represents an alkyl group or an alkenyl group,
(A ¹ O) _m represents a polyoxyalkylene group formed by copolymerization of ethylene oxide and an alkylene oxide having 3 or more carbon atoms, and m represents a number of 2 or more. ) An abrasive dispersant; a water-based lapping liquid containing a lubricating base oil as the (B) component; and water as the (C) component; and an abrasive grain added to the lapping liquid. It is a water-based wrapping agent.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION First, the component (A) of the present invention will be described. The component (A) of the present invention is an abrasive dispersant represented by the general formula (1). In the general formula (1), R
¹ represents an alkyl group or an alkenyl group. Examples of the alkyl group include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, hexadecyl, octadecyl, eicosyl,
Linear alkyl groups such as docosyl, tetracosyl and triacontyl; isopropyl, secondary butyl, secondary pentyl, 2
Secondary hexyl, secondary heptyl, secondary octyl, secondary nonyl, secondary decyl, secondary undecyl, secondary dodecyl, secondary tridecyl, secondary tetradecyl, secondary hexadecyl, 2
Secondary alkyl groups such as secondary hexadecyl; isobutyl, tert-butyl, isopentyl, neopentyl, tert-pentyl, isohexyl, isooctyl, 2-ethylhexyl, isononyl, isodecyl, isoundecyl,
2-methyldecyl, isotridecyl, 2-methyldodecyl, 2-butyloctyl, 2-butyldecyl, 2-methyltetradecyl, 2-hexyloctyl, 2-hexyldecyl, 2-octyldecyl, 2-hexyldecyl,
2-octyldodecyl, 2-decyltetradecyl, 2-
Dodecyl hexadecyl, 2-hexadecyl octadecyl, 2-tetradecyl octadecyl, monomethyl branch-
Examples include branched alkyl groups such as isostearyl.

Examples of the alkenyl group include vinyl, allyl, isopropenyl, butenyl, isobutenyl, pentenyl, isopentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, dodecenyl, tetradecenyl, oleyl and the like.

Among these alkyl groups or alkenyl groups, alkyl groups or alkenyl groups having 4 to 22 carbon atoms are preferable, alkyl groups or alkenyl groups having 5 to 18 carbon atoms are more preferable, and alkyl groups having 6 to 11 carbon atoms. Is most preferred.

Further, in the general formula (1), (A ¹ O)
_m represents a polyoxyalkylene group formed by copolymerization of ethylene oxide and an alkylene oxide having 3 or more carbon atoms. Examples of the alkylene oxide having 3 or more carbon atoms include propylene oxide, butylene oxide, α-olefin oxide and styrene oxide. As the alkylene oxide having 3 or more carbon atoms, propylene oxide or butylene oxide is preferable. When the (A ¹ O) _m portion is formed by adding alkylene oxide or the like, A ¹ O is determined by the alkylene oxide or the like to be added. Polymerization form of alkylene oxide or the like to be added is not particularly limited, and may be random copolymerization, block copolymerization or random / block copolymerization of two or more kinds of alkylene oxides, etc., but particularly preferable polymerization form is block copolymerization. Polymerization. The proportion of oxyethylene groups in (A ¹ O) _m is preferably 30 to 90% by mass, more preferably 40 to 85% by mass, and most preferably 50 to 80% by mass.
This is because if the proportion of oxyethylene groups is outside this range, the dispersion stability of the abrasive grains may deteriorate.

In the general formula (1), m represents a number of 2 or more, preferably 4 to 20, more preferably 5
-16, most preferably 6-11. This is because when m is outside this range, the dispersion stability of the abrasive grains may deteriorate.

Among the abrasive dispersants represented by the general formula (1) which is the component (A) of the present invention, the abrasive dispersants represented by the general formula (2) are particularly excellent in the dispersibility of the abrasive grains. preferable. In the general formula (2), R ¹ represents an alkyl group or an alkenyl group as in the general formula (1), EO represents an oxyethylene group, and A ² O represents an oxyalkylene group having 3 or more carbon atoms. Further, n represents 0 or a number of 1 or more, and p and q represent a number of 1 or more.

The abrasive dispersant represented by the general formula (1), which is the component (A) of the present invention, is excellent in biodegradability as compared with the conventional nonylphenol-based abrasive dispersants, so that it can be used in the environment. Little remains in. Further, since it does not have a nonylphenyl group, the so-called endoclin problem derived from nonylphenol is eliminated. Therefore, even if the lapping agent of the present invention is discharged into the environment, the adverse effect on the environment is extremely small. Further, the abrasive dispersant of the present invention,
The dispersion of abrasive grains is stable, equal to or higher than nonylphenol-based abrasive grain dispersants, and superior to other conventional abrasive grain dispersants. Further, the ethylene oxide adduct of alkylphenol has an effect of an emulsifier, a dispersant, a solubilizer, etc. on water of such a component when adding a water-insoluble component to the wrapping agent, but in the general formula (1), The abrasive dispersant represented is equal to or higher than the nonylphenol-based abrasive dispersant even in these effects.

Next, the lubricating base oil which is the component (B) of the present invention will be explained. As the lubricating base oil which is the component (B) of the present invention, known ones can be used. Examples of such lubricating base oils include mineral oils, synthetic oils, fats and oils. here,
The mineral oil refers to one that is separated, distilled and refined from natural crude oil, and examples thereof include paraffinic and naphthenic oils, and those obtained by hydrotreating and solvent refining these. Among these, mineral oils called so-called spindle oils, machine oils, turbine oils, and cylinder oils are included. Further, the synthetic oil is a chemically synthesized lubricating oil,
Examples thereof include poly-α-olefin, polyisobutylene (polybutene), diester, polyol ester, phosphoric acid ester, silicic acid ester, polyalkylene glycol, polyphenyl ether, silicone, fluorinated compound, alkylbenzene and alkylnaphthalene. Examples of fats and oils include beef tallow, lard, rapeseed oil, coconut oil, palm oil, bran oil, soybean oil, and hydrogenated products thereof. Of these, paraffinic or naphthenic mineral oils or polyethers represented by the general formula (3) are preferred.

[0017] As paraffinic or naphthenic mineral oil is kinematic viscosity is preferably from 0.5 to 100 mm ² / s at 40 ℃, 1~60mm ² / s is more preferable. If the kinematic viscosity at 40 ° C. is lower than 0.5 mm ² / s, the processing efficiency and the surface roughness of the workpiece deteriorate, and if it is higher than 100 mm ² / s, the workpiece after cleaning is cleaned. This is because the sex may deteriorate.

In the polyether represented by the general formula (3), R ² represents a residue obtained by removing a hydroxyl group from a divalent or higher valent polyol. Examples of such polyols include ethylene glycol, propylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, isoprene glycol (3- Methyl-1,3-butanediol), 1,2-hexanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,2-octanediol, octanediol (2-ethyl-1) , 3-hexanediol), 2-butyl-2-ethyl-1,3-propanediol, 1,2-decanediol, 1,2-dodecanediol, 1,2-tetradecanediol, 1,2.
-Hexadecanediol, 1,2-octadecanediol, 1,12-octadecanediol, 1,2-cyclohexanediol, 1,4-cyclohexanediol,
Dihydric alcohols such as 1,4-cyclohexanedimethanol, hydrogenated bisphenol A, sorbide, and methyldiethanolamine; glycerin, 1,2,3-butanetriol, 1,2,4-butanetriol, 2-methyl-
1,2,3-propanetriol, 1,2,3-pentanetriol, 1,2,4-pentanetriol, 1,
3,5-pentanetriol, 2,3,4-pentanetriol, 2-methyl-2,3,4-butanetriol, trimethylolethane, 2,3,4-hexanetriol, 2-ethyl-1,2,2. 3-butanetriol,
Trimethylolpropane, 4-propyl-3,4,5-
Heptanetriol, pentamethylglycerin (2,4
-Dimethyl-2,3,4-pentanetriol), triethanolamine, triisopropanolamine, etc.
Polyhydric alcohol; pentaerythritol, 1,2,3,4
-Pentane tetrol, 2,3,4,5-hexane tetrol, 1,2,4,5-pentane tetrol, 1,
3,4,5-hexanetetrol, diglycerin, ditrimethylolpropane, sorbitan, N, N, N ',
Tetrahydric alcohols such as N'-tetrakis (2-hydroxyethyl) ethylenediamine and N, N, N ', N'-tetrakis (2-hydroxypropyl) ethylenediamine;
Pentahydric alcohols such as adonitol, arabitol, xylitol, triglycerin; dipentaerythritol,
Examples thereof include hexavalent alcohols such as sorbitol, mannitol, iditol, inositol, dulcitol, talose, and allose; octavalent alcohols such as sucrose. Among these polyols, a polyol having 2 to 20 carbon atoms is preferable, and a dihydric to tetrahydric alcohol having 2 to 14 carbon atoms is more preferable.

In the general formula (3), A ³ O represents an oxyalkylene group. The oxyalkylene group is preferably an oxyalkylene group having 2 to 4 carbon atoms. The portion of (A ³ O) _{a in} the general formula (3) includes ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran (1,4-butylene oxide), long-chain α-olefin oxide, alkylene oxide such as styrene oxide, and the like. It can be obtained by addition polymerization. The polymerization form of the alkylene oxide or the like to be added is not particularly limited and may be homopolymerization of one kind of alkylene oxide or the like, random copolymerization of two or more kinds of alkylene oxide or the like, block copolymerization or random / block copolymerization. However, the block copolymerization is preferable because the processing accuracy of the workpiece is improved. (A ³
When the portion O) _a is _a polyoxyalkylene group composed of two or more kinds of oxyalkylene groups, one kind is preferably an oxyethylene group, and more preferably an oxyethylene group and an oxypropylene group.

[0020] (A ³ O) preferable range of content of oxyethylene groups contained in the portion of _a varies by polymerization forms part of _(A ³ O) _a. That is, when the (A ³ O) _a part is a random copolymer, the content of the oxyethylene group contained in the (A ³ O) _a part is preferably 5 to 95 mol%,
More preferably, it is 20 to 80 mol%. In addition, (A
^{When the 3} O) _a part is a block copolymer, (A ³ O) _a
The content of the oxyethylene group contained in the portion is preferably 5 to 70 mol%, more preferably 10 to 50 mol%.
Is. The content of (A ³ O) _a is oxyethylene group content 7
When the block copolymerization is 0 mol% or more, foaming may be large and workability may be deteriorated.

The degree of polymerization a is a number of 2 or more, and the number average molecular weight of the polyether represented by the general formula (3) is preferably 500 to 50,000, more preferably 700.
~ 20,000, more preferably 800-10,000
The degree of polymerization a is preferably such that b is a number of 2 or more, which is the same as the number of hydroxyl groups of the polyol.

Among the polyethers represented by the general formula (3), the polyethers represented by the following general formulas (4) to (7) are preferable.

[0023]

In the general formulas (4) to (7), EO represents an oxyethylene group and PO represents an oxypropylene group. The degree of polymerization c, e, g and i of the oxyethylene group or the degree of polymerization d, f, h and j of the oxypropylene group is 1 or more.

C to j are the same as in the case of the polyether represented by the general formula (3), the number average molecular weight of the polyether of the general formulas (4) to (7) is preferably 500 to 50,
000, more preferably 700 to 20,000, and further preferably 800 to 10,000. The content of the oxyethylene group in the polyoxyalkylene chain is 5 to 20 mol% in the general formula (4) or the general formula (6), the general formula (5) or the general formula (7).
Is preferably 5 to 50 mol%. The water-based wrap solution of the present invention contains water as the component (C) in addition to the components (A) and (B).

In the lapping liquid of the present invention, the content of the component (A) is preferably 3 to 70% by mass, and more preferably 5 to 50% by mass based on the total amount of the lapping liquid. If the content of the component (A) is less than 3% by mass, the dispersibility and dispersion stability of the abrasive grains may decrease, and 70
When the content is more than mass%, the relative content of the component (B) may decrease and the processing accuracy may decrease. The content of the component (B) is preferably 10 to 50% by mass, and 15 to 4
It is more preferably 0% by mass. When the content of the component (B) is less than 10% by mass, the processing accuracy may decrease. Further, the content of water as the component (C) is preferably 10 to 80% by mass, and more preferably 15 to 50% by mass based on the total amount of the lapping liquid.
When the content of water as the component (C) is less than 10% by mass,
(A) component and (B) component may cause separation,
If it exceeds 0% by mass, the significance of supplying it in the form of a concentrated liquid called a lapping liquid is diminished, and problems such as transportation, handling, and storage place of the lapping liquid occur.

The water-based lapping liquid of the present invention preferably further contains a rust preventive agent as the component (D) in order to prevent rust on tools and machines. Examples of the rust preventive agent include organic carboxylic acid salts, sulfonic acid salts, acidic phosphoric acid ester salts, phosphonic acid salts, inorganic acid salts, ethylene oxide adducts of alkylamines, polyhydric alcohol partial esters, and carboxylic acid amides.

Examples of the organic carboxylic acid of the organic carboxylic acid salt include octanoic acid (caprylic acid), decanoic acid (capric acid), 2-ethylhexanoic acid, nonanoic acid (pelargonic acid), isononanoic acid, lauric acid, and isodecane. acid,
Aliphatic monobasic acids such as dodecanoic acid, myristic acid, palmitic acid, stearic acid, isostearic acid, undecenoic acid, oleic acid, linoleic acid, arachidic acid, 12-hydroxystearic acid, ricinoleic acid; malonic acid, succinic acid, glutaric acid Acids, adipic acid, pimelic acid, speric acid, azelaic acid, sebacic acid, dodecanedioic acid, brassic acid, alkenylsuccinic acid and other aliphatic dibasic acids; salicylic acid, alkylsalicylic acid, phthalic acid, isophthalic acid,
Aromatic carboxylic acids such as terephthalic acid, hemimellitic acid, trimellitic acid, trimesic acid, pyromellitic acid and naphthalenecarboxylic acid; dimer acid, trimer acid, naphthenic acid, 9 (or 10)-(4-hydroxyphenyl) octadecane Acid etc. are mentioned. Among these are dispersants,
Some act as emulsifiers, oils or preservatives.

As the sulfonic acid of the sulfonate, for example, petroleum sulfonic acid, alkylbenzene sulfonic acid, α
-Olefin sulfonic acid, naphthalene sulfonic acid and the like. Some of these also act as dispersants and emulsifiers. Examples of the acidic phosphoric acid ester of the acidic phosphoric acid ester salt include (mono- or di) phosphoric acid ester of octanol, (mono- or di) phosphoric acid ester of lauryl alcohol, (mono- or di) phosphoric acid ester of oleyl alcohol, Examples thereof include (mono- or di) phosphoric acid ester of butyl alcohol ethoxylate and (mono- or di) phosphoric acid ester of oleyl alcohol ethoxylate. Some of these also act as dispersants and emulsifiers.

Examples of the phosphonic acid of the phosphonate include aminotrimethylenephosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid and the like. Further, examples of the inorganic acid include (poly) phosphoric acid, silicic acid, boric acid and the like. Examples of the base component that forms a salt with these acids include inorganic alkalis and amines. Examples of the inorganic alkali include alkali metal hydroxides or carbonates such as potassium hydroxide, sodium hydroxide, cesium hydroxide, potassium carbonate, sodium carbonate; calcium hydroxide, magnesium hydroxide, calcium oxide, magnesium oxide. Examples thereof include alkaline earth metal hydroxides and alkaline earth metal oxides.

As the amine, for example, ammonia;
(Mono-, di-, or tri) methylamine, (mono-, di-, or tri) ethylamine, (mono-, di-, or tri) propylamine, (mono-, di-, or tri) isopropylamine, (mono-, di-, or tri) ) Butylamine, (mono,
Di- or tri) octylamine, (mono-, di-, or tri) 2-ethylhexylamine, (mono-, di-, or tri) decylamine, (mono- or di) dodecylamine,
(Mono or di) tridecylamine, (mono or di) tetradecylamine, (mono or di) hexadecylamine,
(Mono or di) octadecylamine, (Mono or di) oleylamine, ethylenediamine, diethylenetriamine, hexamethylenediamine, piperazine, 1- (2-
Alkylamines such as aminoethyl) piperazine, N-methylpiperazine, cyclohexylamine, benzylamine, morpholine; (mono-, di-, or tri) ethanolamine, (mono-, di-, or tri) isopropanolamine, N-methyldiethanolamine, N -Methyl-N,
N-dimethylethanolamine, N-ethyldiethanolamine, N-butyldiethanolamine, N-octyldiethanolamine, N-2-ethylhexyldiethanolamine, N-decyldiethanolamine, N-dodecyldiethanolamine, N-tridecyldiethanolamine, N-tetradecyldiethanolamine, N-
Hexadecyldiethanolamine, N-octadecyldiethanolamine, N-oleyldiethanolamine,
N- (β-aminoethyl) ethanolamine, N-cyclohexyldiethanolamine, N, N, N ′, N′-
Examples thereof include alkanolamines such as tetrakis (2-hydroxyethyl) ethylenediamine and N, N, N ′, N′-tetrakis (2-hydroxypropyl) ethylenediamine.

The polyhydric alcohol partial ester is, for example, glycerin ester such as glycerin laurate, glycerin myristate, glycerin palmitate, glycerin stearate, glycerin oleate, diglycerin stearate; diglycerin laurate, diglycerin. Diglycerin ester such as oleate; sorbitan laurate, sorbitan myristate, sorbitan palmitate, sorbitan stearate, sorbitan ester such as sorbitan oleate, and the like. Some of these act as dispersants, emulsifiers or oily agents.

Examples of the carboxylic acid amide include alkenyl succinic acid amide, lauric acid monoethanolamide, lauric acid diethanolamide, myristic acid monoethanolamide, myristic acid diethanolamide,
Palmitic acid monoethanolamide, palmitic acid diethanolamide, stearic acid monoethanolamide,
Examples thereof include stearic acid diethanolamide. Some of these act as dispersants, emulsifiers, and oiliness agents.

Among these rust preventives, organic carboxylic acid salts are preferable, and aliphatic dibasic acid salts are particularly preferable. Further, as the base component forming a salt with the organic carboxylic acid of the organic carboxylic acid salt, alkanolamine is preferable.
The content of the rust inhibitor which is the component (D) is preferably 0.3 to 30 mass% with respect to the total amount of the lapping liquid, and is 0.5.
It is more preferably from 10 to 10% by mass. If the content of the rust preventive agent as the component (D) is less than 0.3% by mass, the rust preventive effect may not be sufficient, and if it exceeds 30% by mass, relatively (A Since the contents of the) component and the component (B) decrease, the processing accuracy may decrease.

In the lapping solution of the present invention, a thickener, an emulsifier, an antifoaming agent, a solvent, a preservative, a metal deactivator and the like can be added, if necessary. Further, these may be added at the stage of dispersing abrasive grains in the lapping liquid of the present invention or a water dilution thereof to form a lapping agent.

Examples of the thickener include xanthan gum, methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, carboxymethyl cellulose, polyvinyl alcohol, polyacrylic acid, polyacrylamide, polypyrrolidone,
Examples thereof include polyethylene oxide and water-soluble urethane compounds.

Examples of the emulsifier include long-chain alcohol ethoxylates, long-chain alcohol ethoxylate sulfuric acid ester salts, long-chain alcohol sulfuric acid ester salts, alkyl sulfonates, alkylbenzene sulfonates, and the like. Examples of the defoaming agent include polyoxypropylene alkyl ether, silicone oil, fluorosilicone oil and the like.

Examples of the solvent include ethylene glycol, diethylene glycol, triethylene glycol,
Examples thereof include propylene glycol, dipropylene glycol, tripropylene glycol, glycerin, butyl cellosolve, butyl carbitol, propylene glycol methyl ether, dipropylene glycol methyl ether, tripropylene glycol methyl ether, and dipropylene glycol butyl ether.

Preservatives include, for example, 2-methyl-4.
-Isothiazolin-3-one, 5-chloro-2-methyl-4-isothiazolin-3-one, benz-4-isothiazolin-3-one, 2-octyl-4-isothiazolin-3-one, dehydroacetic acid, pyridine- 2-thiol-1-oxide salt, N, N ′, N ″ -tris (2-hydroxyethyl) hexahydro-S-triazine, 2,
2-dibromo-2-nitrotriethanol, parachlorometacresol, 2-bromo-2-nitro-1,3-propanediol, paraoxybenzoic acid ester, benzalkonium chloride, 1,2-dibromo-2,4- Examples include dicyanobutane and the like. Examples of the metal deactivator include mercaptobenzothiazole, benzotriazole, tolyltriazole, benzimidazole and the like.

The aqueous lapping solution of the present invention is diluted with water and then added and dispersed with abrasive grains to be used as a lapping agent for cutting, polishing and the like. The dilution ratio with water varies depending on the processing method, processing conditions, type of work piece, shape of work piece, etc., but is preferably 5 to 150 times by mass, more preferably 10 to 100 times by mass. This is because when the dilution ratio with water exceeds 150 times by mass, the dispersion stability of the abrasive grains may decrease.

The abrasive grains (polishing agent for lapping) to be added / dispersed in the water-based lapping agent of the present invention may be those commonly used. Examples thereof include alumina, silica, titanium oxide, iron oxide, emery, chromium oxide, cerium oxide, zirconium oxide, boron nitride, silicon carbide, boron carbide, tungsten carbide, titanium carbide, zirconium carbide, titanium carbide and diamond. Normal,
The particle size is about 3 to 16 μm.

The amount of abrasive grains added to the water-based lapping liquid of the present invention is such that the content of the abrasive grains in the water-based lapping agent after the addition of the abrasive grains is 10 to 60 mass% with respect to the total amount of the water-based lapping agent. Is preferred. If the compounding amount of the abrasive grains is less than 10% by mass, the processing efficiency may decrease, and if it exceeds 60% by mass, the viscosity of the abrasive increases, the workability deteriorates, and the dispersion stability of the abrasive grains deteriorates. This is because it may happen.

The water-based lapping liquid or the water-based lapping agent of the present invention is used in the processing field in which the water-based lapping agent has been conventionally used, that is, for cutting brittle materials such as semiconductors, crystals, cemented carbide tools, metal parts, glass and ceramics. It can be used in the field of processing or the field of polishing.

In the field of cutting, it can be used in various cutting methods such as a cutting method with an outer peripheral blade, a cutting method with an inner peripheral blade, a cutting method with a wire saw, and a cutting method with a blade saw. Also, in the polishing process, the shape of the work piece is not limited to the flat shape like a wafer, but also the curved shape like a lens and the complicated shape like a gear or a gear. Can also be used, and can be used for polishing, which is an ultra-precision finishing of the surface.

Particularly, in the polishing process of semiconductor wafers, the cleanliness of the wafer after polishing process is required, and therefore, the polyether represented by the general formula (3) is preferable as the component (B). Polyethers represented by 4) to (7) are more preferable. Examples of such semiconductor wafers include silicon, gallium arsenide,
Wafers of gallium phosphide, indium phosphide and the like can be mentioned.

[0046]

The present invention will be described in more detail with reference to the following examples. In the following examples, parts and% are based on mass unless otherwise specified. In the table below, "EO" represents an oxyethylene group, "PO" represents an oxypropylene group,
“BO” is an abbreviation for oxybutylene group. Example 1 was prepared using the compounds shown below at the compounding ratios shown in Table 1.
-11 and the lapping solutions of Comparative Examples 1-8 were blended.

<Component (A): Abrasive dispersant> (A-1): Polyoxyethylene (4) Polyoxypropylene (3) decyl ether (block polymerization) C ₁₀ H ₂₁ O (PO) ₃ (EO) ₄ H (A-2): polyoxyethylene (4) polyoxypropylene (6) hexyl ether (block polymerization) C ₆ H ₁₃ O (PO) ₆ (EO) ₄ H (A-3): polyoxyethylene ( 10) Polyoxybutylene (4) 2-ethylhexyl ether (block polymerization) C ₈ H ₁₇ O (BO) ₄ (EO) ₁₀ H (A-4): polyoxyethylene (6) polyoxypropylene (3) dodecyl ether (Block Polymerization) C ₁₂ H ₂₅ O (EO) ₂ (PO) ₃ (EO) ₄ H (A-5): Polyoxyethylene (6) Polyoxypropylene (3) Dodecyl Ether (Random Polymerization) C ₁₂ H ₂₅ O {(EO) ₆ / ( _{O) 3} H (A-} 6): Polyoxyethylene (10) polyoxypropylene (3) oleyl ether (block _{polymers) C 18 H 35 O (PO} ) 3 (EO) 10 H

<Abrasive dispersant for comparison>(A'-1): polyoxyethylene (8) nonylphenyl ether (A'-2): polyoxyethylene (7) C12-C1
4-Saturated Synthetic Secondary Alkyl Ether (A'-3): Polyoxyethylene (8) C12-C1
4 linear oxoalkyl ether (A'-4): polyoxyethylene (8) lauryl ether (A'-5): polyoxyethylene (8) oleyl ether

<Component (B): Lubricating base oil> (B-1): HO- (EO) ₁₂ (PO) ₃₀ (EO) ₁₂ -H (B-2): HO- (EO) ₃ (PO ) ₄₀ (EO) ₃ -H (B-3): HO- (PO) ₂₀ (EO) ₂₀ (PO) ₂₀ -H (B-4): (B-5): HO- (EO) ₇₅ -H (B-6): Polyoxyethylene / polyoxypropylene random copolymerization polymer of glycerin (EO content 55
Mol%, number average molecular weight 2,500) (B-7): paraffin-based distilled and refined mineral oil (40 ° C. kinematic viscosity; 1.7 mm ² / s, boiling point; 220 to 250 ° C.) (B-8): paraffinic solvent Refined mineral oil (40 ° C. kinematic viscosity; 32 mm ² / s) (B-9): bis (dodecyl) benzene

<Component (C): Water> Ion-exchanged water <(D) component: Anticorrosive> (D-1): Triethanolamine oleate (D-2): N-cyclohexyldiethanolamine dodecanedioate <Other ingredients: Solvent> Propylene glycol

[0051]

(Abrasive Grain Dispersibility Evaluation Test) 100 mL of the lapping solution shown in Table 1 diluted 50 times with ion-exchanged water was placed in a 100 mL graduated cylinder with a stopper, and alumina abrasive particles (Fujimi Incorporated FO # 1200) were used. ) Was added. This graduated cylinder with stopper is 100
The components containing alumina abrasive grains mixed in the lapping solution were dispersed and suspended by shaking and shaking up and down to prepare a lapping agent. Then, the graduated cylinder was allowed to stand, and the dispersibility of abrasive grains was evaluated by the time required for the precipitated solid phase to reach the maximum height. The evaluation of the dispersibility of abrasive grains was made according to the following criteria. The results are shown in Table 2. A: Complete sedimentation did not occur even after 60 minutes of standing. ◯: Sedimentation occurred 41 to 60 minutes after standing. Δ: Sedimentation occurred 21 to 40 minutes after standing. X: Settled within 20 minutes after standing.

(Abrasive Grain Redispersibility Evaluation Test) After the abrasive grain dispersibility evaluation test, the graduated cylinder was allowed to stand still for 24 hours. After a predetermined time, the graduated cylinder was placed upside down 100 times to evaluate the redispersibility of the abrasive grains. The evaluation of the redispersibility of the abrasive grains was made according to the following criteria. The results are shown in Table 2. ◯: Abrasive grains were completely redispersed. Δ: Some precipitate remained. X: Almost no dispersion.

[0054]

As is clear from the results shown in Table 2, the lapping agent of the present invention is similar to the lapping agents using the nonylphenyl ethoxylate type abrasive dispersants (Comparative Example 1 and Comparative Example 6), Lapping agent using abrasive dispersant (Comparative Example 2
5, 7, and 8), showing superior abrasive grain dispersibility and abrasive grain redispersibility.

(Cutting processing test) Using a lapping agent having the same composition as the above-mentioned abrasive grain dispersibility evaluation test and abrasive grain redispersibility evaluation test, an artificial crystal (width 65 mm,
A height of 20 mm and a length of 170 mm) and a silicon single crystal (diameter 102 mm, length 190 mm) were cut (sliced) under the following conditions. The results are shown in Table 3. Wire type: SWP brass-plated wire Wire diameter: 0.16φmm Wire tension: 1.5 kg Number of wires: 106 Wire feed rate: 20 m / min Lapping agent temperature: 20 ° C

[0057]

As is clear from the results shown in Table 3, the processing time (time required for cutting) of the lapping agent of the present invention was the lapping agent using the nonylphenyl ethoxylate type abrasive dispersant (Comparative Examples 1 and 1). The lapping agent of the present invention has the same performance as that of Comparative Example 6) and a shorter time than the lapping agents using other abrasive dispersants (Comparative Examples 2 to 5, 7 and 8). It indicates that

(Polishing Processing Test) Silicon having a diameter of 102 mm was sliced by a lapping machine for silicon wafers, using a lapping agent having the same composition as the above-mentioned abrasive grain dispersibility evaluation test and abrasive grain redispersibility evaluation test. Polishing (lapping) was performed on the wafer. About 200 wafers were polished for each lapping solution, and the occurrence rate of scratches, cracks, and minute cracks on the surface of the wafer was determined for the polished silicon wafer. The results are shown in Table 4.

[0060]

From the results shown in Table 4, the defective product occurrence rate of the lapping agent of the present invention is equal to or lower than that of the lapping agent using the nonylphenyl ethoxylate type abrasive dispersant (Comparative Example 1). With the lapping agents using other abrasive dispersants (Comparative Examples 2 to 5), the defective product occurrence rate is very high.

(Biodegradability test) In accordance with the method for measuring the biochemical oxygen consumption (BOD) of JIS K0102 (Factory wastewater test method), the abrasive grain dispersant of component (A) 0.1%
BOD was measured on the aqueous solution. However, JIS K0
Although the number of days left to set 102 is 5 days, the number of days left to stand was set to 14 days in this test. The results are shown in Table 5.

[0063]

As is clear from the results shown in Table 5, the BODs of the components (A) to A-6 of the component (A) of the present invention are A'-1.
It is higher than that of A'-2 and A'-5. This indicates that A′-1 (nonylphenyl ethoxylate) is hardly biodegraded, whereas A-1 to A-6 are easily biodegraded.

[0065]

EFFECTS OF THE INVENTION Since the water-based lapping solution and the water-based lapping agent of the present invention do not use an alkylphenol-based compound, they have good biodegradability, and an end point that chemical substances disturb the endocrine system of living organisms. It has excellent abrasive dispersibility, cutting workability, and polishing workability equivalent to a lapping solution and a lapping agent using an alkylphenol-based abrasive dispersant, even though there is no concern about the cleansing problem.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C10M 129/16 C10M 129/16 145/30 145/30 173/00 173/00 // C10N 40:22 C10N 40:22 F-term (reference) 3C058 AA07 CB03 4D077 AA02 AC05 DC08Z DC12Z DC15Z DC19X DC43Z DC45X DD08X DD09X DD32X DD33X DD35X DD43X DE07X DE08X DE20X 4H104 AA01Z BB46C CB16C DA02A EB10 PA22 RA22

Claims (11)

[Claims] 1. The following general formula (1) as the component (A): (In the formula, R ¹ represents an alkyl group or an alkenyl group,
(A ¹ O) _m represents a polyoxyalkylene group formed by copolymerization of ethylene oxide and an alkylene oxide having 3 or more carbon atoms, and m represents a number of 2 or more. ) An abrasive dispersant represented by the formula (4); a lubricating base oil as the component (B); and water as the component (C). 2. The component (A) has the following general formula (2): (In the formula, EO represents an oxyethylene group, (A ² O) _p represents an oxyalkylene group having 3 or more carbon atoms, n represents 0 or a number of 1 or more, and p and q represent a number of 1 or more. Wherein R ¹ has the same meaning as in formula (1).) The water-based lapping liquid according to claim 1, wherein R ¹ is an abrasive dispersant represented by the general formula (1). 3. The water-based lapping liquid according to claim 1, wherein the alkylene oxide having 3 or more carbon atoms in the general formula (1) or (2) is propylene oxide or butylene oxide. 4. The water-based lapping liquid according to claim 1, wherein the lubricating base oil as the component (B) is a paraffin-based or naphthene-based mineral oil. 5. The lubricating base oil as the component (B) has the following general formula (3): (In the formula, R ² represents a residue obtained by removing a hydroxyl group from a divalent or higher valent polyol, A ³ O represents an oxyalkylene group, a represents a number of 2 or more, and b represents the same number as the number of hydroxyl groups of the polyol. Is a number greater than or equal to 2), and the aqueous wrap solution according to any one of claims 1 to 3. 6. A lubricating base oil as the component (B) has the following general formulas (4) to (7). (In the formula, EO represents an oxyethylene group, PO represents an oxypropylene group, and c and d represent a number of 1 or more.) (In the formula, EO and PO have the same meanings as in the general formula (4), and e
And f represent a number of 1 or more. ) (In the formula, EO and PO have the same meanings as in the general formula (4), and g
And h represent a number of 1 or more. ) (In the formula, EO and PO have the same meanings as in the general formula (4), and i
And j represent a number of 1 or more. 7. The aqueous wrap solution according to any one of claims 1, 2, 3 and 5, which is any one kind or a mixture of two or more kinds of the polyether compound represented by the formula (1). 7. The water-based lapping liquid according to claim 1, further comprising a rust preventive agent as the component (D). 8. A water-based lapping agent, wherein the water-based lapping liquid according to any one of claims 1 to 7 or a diluted liquid thereof further contains abrasive grains. 9. A cutting method for cutting a material to be cut using the water-based lapping liquid or the water-based lapping agent according to any one of claims 1 to 8. 10. A polishing method for polishing a material to be polished by using the water-based lapping liquid or the water-based lapping agent according to any one of claims 1 to 8. 11. A polishing method for polishing a semiconductor by using the water-based lapping liquid or the water-based lapping agent according to any one of claims 1 to 8.