TW201000625A - Water-soluble cutting fluid composition, water-soluble cutting fluid, and method of cutting with the water-soluble cutting fluid - Google Patents

Water-soluble cutting fluid composition, water-soluble cutting fluid, and method of cutting with the water-soluble cutting fluid Download PDF

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Publication number
TW201000625A
TW201000625A TW098114346A TW98114346A TW201000625A TW 201000625 A TW201000625 A TW 201000625A TW 098114346 A TW098114346 A TW 098114346A TW 98114346 A TW98114346 A TW 98114346A TW 201000625 A TW201000625 A TW 201000625A
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Taiwan
Prior art keywords
water
cutting fluid
soluble cutting
soluble
fluid composition
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TW098114346A
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Chinese (zh)
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TWI439542B (en
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Tenejiro Yoshida
Kiyofumi Suzuki
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Palace Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/10—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M105/14—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms polyhydroxy
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/18—Ethers, e.g. epoxides
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/20—Lubricating compositions characterised by the base-material being a macromolecular compound containing oxygen
    • C10M107/30—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M107/32—Condensation polymers of aldehydes or ketones; Polyesters; Polyethers
    • C10M107/34—Polyoxyalkylenes
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
    • C10M169/04—Mixtures of base-materials and additives
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/08—Inorganic acids or salts thereof
    • C10M2201/082—Inorganic acids or salts thereof containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/08—Inorganic acids or salts thereof
    • C10M2201/082—Inorganic acids or salts thereof containing nitrogen
    • C10M2201/083—Inorganic acids or salts thereof containing nitrogen nitrites
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/1033—Polyethers, i.e. containing di- or higher polyoxyalkylene groups used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/108—Polyethers, i.e. containing di- or higher polyoxyalkylene groups etherified
    • C10M2209/1085—Polyethers, i.e. containing di- or higher polyoxyalkylene groups etherified used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
    • C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
    • C10M2215/04—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
    • C—CHEMISTRY; METALLURGY
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    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/02—Groups 1 or 11
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    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/04—Groups 2 or 12
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    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/06—Groups 3 or 13
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/08—Groups 4 or 14
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/10—Groups 5 or 15
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/12—Groups 6 or 16
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    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
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    • C10N2010/14—Group 7
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    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/16—Groups 8, 9, or 10
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/02—Pour-point; Viscosity index
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/20—Metal working
    • C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling

Abstract

A water-soluble cutting fluid composition which is inhibited from catching fire or generating a gas, is highly safe, and changes little in viscosity; a water-soluble cutting fluid; and a method of cutting with the water-soluble cutting fluid. The water-soluble cutting fluid composition is characterized by comprising at least one glycol compound selected among glycols, glycol ethers, polyalkylene glycols, and polyalkylene glycol ethers, water, and at least one of nitrous-acid-based volatile corrosion inhibitors and mixtures of an amine and a nitrite.

Description

201000625 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於利用鋼絲鋸（wire saw)或帶鋸 (band saw)等將鑄錠（ing〇t)等加以切削的水溶性切削液組成 物，含有該水溶性切削液組成物之水溶性切削液，及使用 該水溶性切削液之切削方法。 【先前技術】 使用鋼絲鋸或帶鋸等切削工具將鑄錠等被切削物加以 切削時，為了實現切削工具與被切削物間之潤滑、摩擦熱 之去除、及切削屬之清洗等，一般使用切削液。例如，使 用以礦物油為主成分之非水溶性切削液（專利文獻ι)〇但 是’此種非水溶性切削液存在下述問冑：由於切削後非水 溶性切削液會附著於被切削物上，因而必須使用有機溶劑 等特殊清洗劑來清洗被切削物。 為了解決上述問顚，允/占田 ^亦使用可利用水清洗附著於被切 削物上之切削液的水溶性切削液（專利文獻2至5)。但是，201000625 VI. Description of the Invention: [Technical Field] The present invention relates to a water-soluble cutting for cutting an ingot or the like using a wire saw or a band saw. The liquid composition contains a water-soluble cutting fluid of the water-soluble cutting fluid composition, and a cutting method using the water-soluble cutting fluid. [Prior Art] When cutting objects such as ingots are cut with a cutting tool such as a wire saw or a band saw, it is generally used to remove lubrication between the cutting tool and the workpiece, remove friction heat, and clean the cutting. Cutting fluid. For example, a water-insoluble cutting fluid containing mineral oil as a main component (Patent Document 1) is used, but 'the water-insoluble cutting fluid has the following problem: the non-water-soluble cutting fluid adheres to the workpiece after cutting Therefore, it is necessary to use a special cleaning agent such as an organic solvent to clean the object to be cut. In order to solve the above problem, the water-soluble cutting fluid which can clean the cutting fluid adhering to the workpiece by using water is also used (Patent Documents 2 to 5). but,

此種水溶性切削液存在i卩卩Bg · 1 H — 隹h述問碭.由於不含有水，因而易 ^ 处忧用含有水、小浴性t刀削液 利文獻6纟8)。但是，此種水溶性切削液存在下述問題. t切削時，水會與被切削物⑼所生成之彻體反庫，， 產生氣體，又’水溶性切削液之黏度會發生變化， 為了解決上述問題，提出了含有過氧化氯等 201000625 切削加工用水溶性油劑改質劑（專利文獻9)、或含有二醇醚 類之水性研磨粒分散媒組成物（專利文獻1〇)。 專利文獻1 :曰本專利特開平1 〇_丨〗0 i 8〇號公報 專利文獻2 :日本專利特開平1 〇_ i丨〇丨8〇號公報 專利文獻3 :曰本專利特開平丨^86693號公報 專利文獻4 :日本專利特表2〇〇2_53744〇號公報 專利文獻5 :日本專利特開2002-80883號公報 專利文獻6 :曰本專利特開平1 〇_8丨872號公報 專利文獻7 :曰本專利特開平1〇_259396號公報 專利文獻8 :日本專利特開平丨^02681號公報 專利文獻9 :日本專利特開20061 829〇1號公報 專利文獻10 :曰本專利特開2〇〇7_3 15〇2號公報 【發明内容】 然而，含有過氧化氫等氧化劑者由於過氧化氫之反應 !·生幸乂内，因而欠佳。又，在含有二醇醚類時，有抑制氣體 產生或抑制黏度變化之效果並不足之問題。因此，本發= j目的在於提供一種可抑制著火或氣體產生而安全性較 南、且I占度變化較少之水溶性切削液組成物，水溶性切削 液及使用該水溶性切削液之切削方法。 义為T達成以上目的，本發明人等反覆潛心研究之結果 龟，藉由含有二醇、二醇醚、聚烷二醇及聚烷二醇醚之 :少：種二醇類與水，此以外含有作為第三成分的亞硝 系札化性防銹劑、以及胺類與亞4酸鹽之混合物之至少 4 201000625 黏度變化：:::者二氣體產生而安全性較高’且可減少 特徵在於含：即’本發明係一種水溶性切削液組成物，其 — 二㈣、聚院二醇及聚貌二醇醚之 ^ —醇類、與水、與亞硝酸系氣化性 胺類與亞錢鹽之混 _以及 水溶性切削液，乂 。又’本發明係一種 及研磨粒。又進而，本發明係_種切财法，其特徵^ 使用上述水溶性切削液進行切削。 、 —、上所不，本發明可提供一種抑制著火或氣體產生 而女王阿、且黏度變化較少之水溶性切削液組成物， + ] 生t刀削液’及使用該水溶性切削液之切削方法。 【實施方式】 ;至於本發明之水溶性切削液組成物中所使用之二醇 ;員例如—知可列舉乙二醇及丙二醇；二醇醚可列舉：乙 醇單甲醚、丙二醇單甲醚、乙二醇單丁醚及丙二醇單丁 _聚燒—醇可列舉：聚乙二醇、聚丙二醇及聚氧丙烯-聚 氧乙烯嵌段聚合物；聚烷二醇醚可列舉：聚乙二醇單曱醚、 聚丙-醇單甲&|、聚院二醇單甲醚、聚乙二醇單丁鍵、聚 丙二醇單丁醚、及聚烷二醇單丁醚。 本發明之水溶性切削液組成物中所使用之亞硝酸系氣 化性防銹劑例如可列舉：亞硝酸二環己基銨、亞硝酸二異 丙基銨、及亞硝酸硝基萘銨。 本餐明之水溶性切削液組成物中所使用之胺類例如可 201000625 列舉：甲基胺、二乙基胺 胺、癸基胺、十二烧基胺 六燒基胺、十八烧基胺、 、異丙基胺、丁基胺、2-乙基己基 、十三烧基胺、十四燒基胺、十 油基胺、乙二胺、二乙三胺、己 二胺、娘嗪、1-(2-胺基乙基）0底嗪、N_曱基哌嗪、環己基胺、 卞基胺、乙醇胺、異丙醇胺、N_f基二乙醇胺、n,n_二甲 基乙醇胺、N-乙基二乙醇胺、N-丁基二乙醇胺、胺基 乙基）乙醇胺、N-環己基二乙醇胺、N，N，N，，N,_四（2_羥基乙 基）乙二胺、N，N,N，，N，_四（2_羥基丙基）乙二胺、油基胺、來 源於椰子油之烧基胺、來源於牛油之烧基胺、來源於硬化 牛油之烷基胺、及來源於大豆油之烷基胺、以及使該等與 氧化烯（alkylene oxide)進行反應而得之反應物。 本發明之水溶性切削液組成物中所使用之亞硝酸鹽例 如可列舉：亞硝酸鈉、及亞硝酸鉀。 本發明之水溶性切削液組成物亦可含有添加助劑。添 加助劑例如可列舉：濕潤劑、防銹劑、非鐵金屬防蝕劑、 分散劑、消泡劑及增稠劑。 二醇類與水之重量比較佳為5 : 95〜95 : 5 ^若二醇類少 於上述範圍，則切削時水易於蒸發。若水蒸發’則由於乾 燥而導致被切削物彼此之間貼附，因而剝離時產生裂縫， 弓丨起良率變差，並且由於被切削物上會貼附碎屑，因而亦 難以清洗。若二醇類多於上述範圍，則著火之危險性變高。 至於亞硝酸系氣化性防銹劑’在水溶性切削液組成物 中較佳為含有0.01〜5重量％，更佳為含有〇 〇5〜1重量％。 若少於上述範圍，則被切削物（矽）與水之反應的抑制效果較 6 201000625 低 口而易於產生氣體，又，水溶性切削液之黏度變化較 大右夕於上述範圍，則水溶性切削液中之研磨粒的分散 性較差’水溶性切削液穩定性較低。 王价妝頰及亞硝酸鹽，在水溶性切削液組成物中較佳 為3有〇 ·01〜5重量％的胺類，含有0 · 0 1〜5重量％的亞硝酸 孤更仫為含有〇.05〜1重量％的胺類，含有0.05〜1重量％ 的亞硝酸鹽。若少於上述範圍，則被切削物（石夕）與水之反應 的抑制效果較低，因而易於產生氣體，又，水溶性切削液 之黏度變化較大。若多於上述範圍，則水溶性切削液中之 研磨粒的分散性較差’水溶性切削液穩定性較低。 .本心明之水溶性切削液中所含有之研磨粒例如可列 牛由金屬、金屬或半金屬之碳化物、金屬 化物、金屬或半金屬之氧化物、 鸯之鼠 ;兔屬或丰金屬之硼化物、 =石：成之研磨材料。金屬或半金屬係來源 =舉氧化5:、3!，，，、… 錐、膠體-氧化V反化石夕、鑽石、氧化鎮、氧化鈽、氧化 可設為。.。一”。—氧切。研磨粒之平均粒徑 本發明之水溶性切削液中較佳為含有30 水溶性切削液、30〜70重量％之研磨 W/〇之 鉻囹a, ^德粒。右研磨粒少於汁 把圍，則切削速度變慢，缺二上迷 則水溶性切削液之黏产蠻& 右夕於上述範圍， J液之黏度變局，加工性能降低。 ::明之水溶性切削液可較佳地用 疋丰導體元件之材料即發势日 彳_耗、尤其 夕“圓。該等之切削時可使用鋼 201000625 絲鑛加工機或帶鋸加工機。 實施例 繼而，列舉實施例及比較例來說明本發明，但本發明 並不限定於此。This kind of water-soluble cutting fluid exists in the presence of i卩卩Bg · 1 H — 隹h. Since it does not contain water, it is easy to use water containing water and small bathing t-cutting liquid. 6) However, such a water-soluble cutting fluid has the following problems: When cutting, water will be generated by the object (9), and the gas will be generated, and the viscosity of the water-soluble cutting fluid will change. In the above-mentioned problem, 201000625 water-soluble oil agent modification agent for cutting processing such as chlorine peroxide (Patent Document 9) or an aqueous abrasive grain dispersion medium composition containing a glycol ether has been proposed (Patent Document 1). Patent Document 1: Japanese Patent Laid-Open No. 1 丨 丨 0 0 i i i i i i i i i i i i i i i i i i i i i i i i 专利 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 丨 丨 丨 丨 丨 丨 丨Japanese Patent Application Publication No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No.曰 259 259 259 259 259 259 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 026 〇〇7_3 15〇2 [Invention] However, those who contain an oxidant such as hydrogen peroxide are less likely to react due to the reaction of hydrogen peroxide. Further, when glycol ethers are contained, there is a problem that the effect of suppressing the generation of gas or suppressing the change in viscosity is insufficient. Therefore, the purpose of the present invention is to provide a water-soluble cutting fluid composition which can suppress ignition or gas generation and has a relatively safe safety and a small change in I. The water-soluble cutting fluid and the cutting using the water-soluble cutting fluid method. For the purpose of achieving the above objective, the present inventors have repeatedly studied the results of the turtle, including diols, glycol ethers, polyalkylene glycols, and polyalkylene glycol ethers: less: glycols and water, Other than the nitrite-based rust inhibitor as the third component, and at least 4 of the mixture of the amine and the tetra- 4 acid salt. 201000625 Viscosity change:::: The second gas is produced and the safety is higher' and can be reduced The invention is characterized in that: the invention is a water-soluble cutting fluid composition, which is - two (four), a polyphenol and a polyglycol ether, an alcohol, a water, and a nitrous acid gasification amine Mixed with Yaqian salt _ and water-soluble cutting fluid, 乂. Further, the present invention is a type and abrasive grains. Further, the present invention is a method of cutting money, and the method is characterized in that the water-soluble cutting fluid is used for cutting. The present invention can provide a water-soluble cutting fluid composition which inhibits ignition or gas generation and which has little change in viscosity, + ] raw t-shaving liquid 'and using the water-soluble cutting fluid Cutting method. [Embodiment] The diol used in the composition of the water-soluble cutting fluid of the present invention is exemplified by ethylene glycol and propylene glycol, and examples of the glycol ether include ethanol monomethyl ether and propylene glycol monomethyl ether. Examples of the ethylene glycol monobutyl ether and the propylene glycol monobutylene-polyalkylene alcohol include polyethylene glycol, polypropylene glycol, and polyoxypropylene-polyoxyethylene block polymer; and polyalkyl glycol ethers include polyethylene glycol. Monoterpene ether, poly-propanol monomethyl &|, polyglycol diol monomethyl ether, polyethylene glycol monobutyl bond, polypropylene glycol monobutyl ether, and polyalkylene glycol monobutyl ether. The nitrous acid-based vaporizing rust preventive agent used in the water-soluble cutting fluid composition of the present invention may, for example, be dicyclohexylammonium nitrite, diisopropylammonium nitrite or nitronaphthyl nitrite. The amines used in the composition of the water-soluble cutting fluid of the present invention can be, for example, 201000625: methylamine, diethylamine, mercaptoamine, dodecylamine hexahydroamine, octadecylamine, , isopropylamine, butylamine, 2-ethylhexyl, tridecylamine, tetradecylamine, decylamine, ethylenediamine, diethylenetriamine, hexamethylenediamine, oxazide, 1 -(2-Aminoethyl)oxazine, N_mercaptopiperazine, cyclohexylamine, mercaptoamine, ethanolamine, isopropanolamine, N_f-diethanolamine, n, n-dimethylethanolamine, N -ethyldiethanolamine, N-butyldiethanolamine, aminoethyl)ethanolamine, N-cyclohexyldiethanolamine, N,N,N,,N,_tetrakis(2-hydroxyethyl)ethylenediamine, N ,N,N,,N,_tetrakis(2-hydroxypropyl)ethylenediamine, oleylamine, alkylamine derived from coconut oil, alkylamine derived from tallow, alkane derived from hardened tallow A base amine, an alkylamine derived from soybean oil, and a reactant obtained by reacting the same with an alkylene oxide. Examples of the nitrite used in the water-soluble cutting fluid composition of the present invention include sodium nitrite and potassium nitrite. The water-soluble cutting fluid composition of the present invention may also contain an additive. Examples of the additive to be added include a wetting agent, a rust preventive, a non-ferrous metal corrosion inhibitor, a dispersant, an antifoaming agent, and a thickener. The weight of the diol and water is preferably 5: 95 to 95: 5 ^ If the diol is less than the above range, the water is easily evaporated during cutting. If the water evaporates, the objects to be cut adhere to each other due to drying, and cracks are generated at the time of peeling, the yield of the bow is deteriorated, and the chips are attached with debris, so that it is difficult to clean. If the diol is more than the above range, the risk of ignition becomes high. The nitrous acid gasification rust inhibitor is preferably contained in the water-soluble cutting fluid composition in an amount of 0.01 to 5% by weight, more preferably 5 to 1% by weight. If it is less than the above range, the effect of suppressing the reaction between the workpiece (矽) and water is lower than that of 6 201000625, and the gas is liable to generate gas. Further, the viscosity of the water-soluble cutting fluid changes greatly. The dispersibility of the abrasive grains in the cutting fluid is poor. The stability of the water-soluble cutting fluid is low. The price of the chewing gum and the nitrite is preferably 3 〇·01~5 wt% of the amine in the water-soluble cutting fluid composition, and contains 0·0 1 to 5 wt% of nitrous acid. 〇.05 to 1% by weight of the amine, containing 0.05 to 1% by weight of nitrite. If it is less than the above range, the effect of suppressing the reaction between the workpiece (Shi Xi) and water is low, so that gas is easily generated, and the viscosity of the water-soluble cutting fluid changes greatly. If it is more than the above range, the dispersibility of the abrasive grains in the water-soluble cutting fluid is poor, and the stability of the water-soluble cutting fluid is low. The abrasive particles contained in the water-soluble cutting fluid of the present invention can be, for example, a metal, a metal or a semi-metal carbide, a metal compound, a metal or a semi-metal oxide, a scorpion rat; a rabbit or a rich metal. Boride, = stone: into the abrasive material. Metal or semi-metal source = oxidize 5:, 3!,,,,... Cone, colloid-oxidation V-reverse fossil, diamond, oxidized town, cerium oxide, oxidation can be set. . . . 1."-Oxygen cutting. Average particle diameter of the abrasive particles The water-soluble cutting fluid of the present invention preferably contains 30 water-soluble cutting fluid, 30 to 70% by weight of the pulverized W/〇 chrome a, granules. If the right abrasive grain is less than the juice inner circumference, the cutting speed will be slower, and the second water-soluble cutting fluid will be sticky and the right side will be in the above range, the viscosity of the J liquid will change, and the processing performance will be lowered. The cutting fluid can be preferably used as the material of the abundance conductor element, that is, the enthalpy, especially the circumstance. Steel 201000625 wire processing machines or band saw machines can be used for these cuttings. EXAMPLES Hereinafter, the present invention will be described by way of examples and comparative examples, but the present invention is not limited thereto.

至ίο、比鲂例1 I 按照表1至表4之調配量，利用通常之方法將該等成 为進行混合’藉此可獲得實施例1至1 0之水溶性切削液組 成物、及比較例丨至7之切削液組成物。 【表1] 實施例1 實施例2 實施例3 實施例4 實施例5 二乙二醇 94.95 4.8 — • 81.6 二乙二醇單曱_ _ - 39.7 10.7 _ 聚乙二醇11 一 _ 50.0 • - 聚烧二醇單丁 • _ - 10.0 丙二醇 • - _ 78.5 - 水 5.00 90.1 10.0 10.0 8.0 亞硝酸二環己某铵 0.05 5.0 0.1 0.5 0.3 亞硝酸二異丙某銨 - • 0.2 - - 聚羧酸鈉13 0.1 - 0.3 - 矽系消泡劑14 - - - - 0.1 1 1:(聚乙二醇200，曰油公司製造） *2 : (UNILUB 50MB-5，日油公司製造） *3 : (Nopcosant RFA，SAN NOPC◦公司製造） *4 : (X-50-1041，信越化學工業公司製造） 201000625 [表2] 成分(重量％) 實施例6 實施例7 實施例8 實施例9 實施例10 二乙二醇 94.90 4.9 - - 81.4 二乙二醇單曱醚 - - 39.7 - - 聚乙二醇*1 - - 50.0 - - 聚烷二醇單丁醚*2 - - - - 10.0 丙二醇 - - 89.4 - 水 5.00 85.0 10.0 10.0 8.0 三乙醇胺 0.05 5.0 - 一 0.3 N-環己基二乙醇胺 - - 0.2 0.4 - 亞硝酸鈉 0.05 5.0 0.1 0.1 0.1 聚羧酸鈉*3 - 0.1 - — 0.1 矽系消泡劑*4 - - - 0.1 0.1 *1 :(聚乙二醇200，曰油公司製造） *2 : (UNILUBE 50MB-5，日油公司製造） *3 : (Nopcosant RFA，SAN NOPCO 公司製造） *4 : (Χ-5〇-1〇41，信越化學工業公司製造） [表3】 成分(重量％) 比較例1 比較例2 比較例3 比較例4 比較例5 礦物油* 5 95.0 - 腦 - - 有機膨潤土 *6 4.0 - - - - 碳酸丙二酉旨 1.0 - - - - 二乙二醇 - 80.0 - - 18.0 二乙二醇單曱醚 - 10.0 - 40.0 - 丙二醇 - - 75.0 51.3 - 水 - 10.0 15.0 8.0 82.0 膠體二氧化矽*7 - - 10.0 - - 擰檬酸 - - - 0.2 - 三乙醇胺 - - - 0.5 - *5 : (ISO VG10，COSMO OIL LUBRICANTS 公司製造） *6 : (S-BEN，HOJUN 公司製造） *7 : (ADELITE AT-30，ADEKA 公司製造） 9 201000625 [表4】 成分(重量％) 比較例6 比較例7 二乙二醇 89.5 89.5 水 10 — 10 胺基曱酸環己基胺 0.5 亞硝酸鈉 0.5 實施例1 1至2 0、及比較例8至1 4 以重量比1 : 1之比例混合實施例1至10之水溶性切 削液組成物、及研磨粒（綠色碳化矽# i000)，而獲得實施例 11至20之水溶性切削液。除了使用比較例i至7之切削液 組成物代替實施例1至10之水溶性切削液組成物以外，以 與貫施例11至2 0相同之方式獲得比較例8至14之切削液。 (清洗試驗） 將實施例11至1 5之水溶性切削液、以及比較例8之 切削液塗佈於單晶矽晶圓上後，利用流水加以清洗，並目 視觀察清洗後之單晶矽晶圓的狀態。評價由本公司評價員 進行，以可完全去除水溶性切削液等污潰（〇）、去除不完全 (△)、無法去除（X)的3個等級進行評價。結果示於表5。 [表5]To the ο ο 鲂 1 1 1 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照 按照The cutting fluid composition of 丨7. [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Diethylene glycol 94.95 4.8 — • 81.6 Diethylene glycol monoterpene _ _ - 39.7 10.7 _ Polyethylene glycol 11 _ 50.0 • - Polyglycol diol monobutane _ - 10.0 propylene glycol • - _ 78.5 - water 5.00 90.1 10.0 10.0 8.0 Dicyclohexyl ammonium nitrite 0.05 5.0 0.1 0.5 0.3 Diisopropylammonium nitrite - • 0.2 - - Polycarboxylate 13 0.1 - 0.3 - Antimony defoamer 14 - - - - 0.1 1 1: (Polyethylene glycol 200, manufactured by Oyster Company) *2 : (UNILUB 50MB-5, manufactured by Nippon Oil Co., Ltd.) *3 : (Nopcosant RFA, manufactured by SAN NOPC Co., Ltd.) *4 : (X-50-1041, manufactured by Shin-Etsu Chemical Co., Ltd.) 201000625 [Table 2] Ingredient (% by weight) Example 6 Example 7 Example 8 Example 9 Example 10 Ethylene glycol 94.90 4.9 - - 81.4 Diethylene glycol monoterpene ether - 39.7 - - Polyethylene glycol *1 - - 50.0 - - Polyalkylene glycol monobutyl ether *2 - - - - 10.0 Propylene glycol - - 89.4 - Water 5.00 85.0 10.0 10.0 8.0 Triethanolamine 0.05 5.0 - A 0.3 N-cyclohexyldiethanolamine - - 0.2 0.4 - Sodium nitrite 0.05 5.0 0.1 0.1 0.1 Sodium polycarboxylate *3 - 0.1 - - 0.1 矽 消 defoamer *4 - - - 0.1 0.1 *1 : (polyethylene glycol 200, manufactured by Oyster Company) *2 : (UNILUBE 50MB-5, manufactured by Nippon Oil Co., Ltd.) *3 : (Nopcosant RFA, manufactured by SAN NOPCO Co., Ltd. *4 : (Χ-5〇-1〇41, manufactured by Shin-Etsu Chemical Co., Ltd.) [Table 3] Component (% by weight) Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Mineral oil* 5 95.0 - brain - - organic bentonite *6 4.0 - - - - propylene carbonate - 1.0 - - - - diethylene glycol - 80.0 - - 18.0 diethylene glycol monoterpene ether - 10.0 - 40.0 - propylene glycol - - 75.0 51.3 - Water - 10.0 15.0 8.0 82.0 Colloidal cerium oxide *7 - - 10.0 - - citric acid - - - 0.2 - triethanolamine - - - 0.5 - *5 : (ISO VG10, manufactured by COSMO OIL LUBRICANTS) *6 : (S-BEN, manufactured by HOJUN Co., Ltd.) *7 : (ADELITE AT-30, manufactured by ADEKA) 9 201000625 [Table 4] Ingredient (% by weight) Comparative Example 6 Comparative Example 7 Diethylene glycol 89.5 89.5 Water 10 — 10 Amino decanoic acid cyclohexylamine 0.5 Sodium nitrite 0.5 Examples 1 1 to 2 0, and Comparative Examples 8 to 1 4 Examples 1 to 10 were mixed at a weight ratio of 1:1. Soluble cutting fluid composition, and abrasive grains (green silicon carbide # i000), obtained in Example 11 to 20 of the water-soluble cutting fluid. The cutting fluids of Comparative Examples 8 to 14 were obtained in the same manner as in Examples 11 to 20 except that the cutting fluid compositions of Comparative Examples i to 7 were used instead of the water-soluble cutting fluid compositions of Examples 1 to 10. (Cleaning test) The water-soluble cutting liquids of Examples 11 to 15 and the cutting liquid of Comparative Example 8 were applied onto a single crystal germanium wafer, and then washed with running water, and the cleaned single crystal twin crystals were visually observed. The state of the circle. The evaluation was carried out by the evaluator of the company, and the evaluation was carried out in such a manner that the three levels of the water-soluble cutting fluid such as the stain (〇), the incomplete removal (Δ), and the inability to remove (X) were completely removed. The results are shown in Table 5. [table 5]

切削液 實施例11 切削液組成物 實施例1 清洗評價 〇 實施例12 實施例2 〇 實施例13 實施例3 〇 實施例14 實施例4 〇 實施例15 實施例5 〇 比較例8 比較例1 X 10 201000625 根據表5可知，本發明之水溶性切削液在使用水進行 清洗時，可自被切削物上完全去除研磨粒或水溶性切削 液，清洗容易。 (黏度及氣體產生試驗） 假設存在利用鋼絲鋸切削單晶矽之鑄錠時所混入的活 性Si碎屑，而在實施例1 1至20之水溶性切削液、及比較 例2至7之切削液中添加1 0 wt%之Si粉（粒徑約5 // m)，利 用行星型球磨機加以粗粉碎，利用BL型旋轉黏度計測定25 °(：下之黏度（黏度1)。其後，放入可密封之聚乙烯袋中，進 行脫氣，對在60°C下保管24小時後之Si反應氣體量進行 測定。測定Si反應氣體量後，對以1200 rpm攪拌10分鐘 後於25°C下之黏度進行測定（黏度2)。結果示於表6。 [表6] 切削液 切削液組成物 Si反應氣體 黏度 l(mPa-s) 黏度 2(mPa-s) 實施例11 實施例1 N.D. 170 190 實施例12 實施例2 N.D. 80 100 實施例Π 實施例3 N.D. 160 195 實施例14 實施例4 N.D. 80 90 實施例15 實施例5 N.D. 180 200 實施例16 實施例6 N.D. 170 190 實施例17 實施例7 N.D. 170 190 實施例18 實施例8 N.D. 100 110 實施例19 實施例9 N.D. 120 140 實施例20 實施例10 N.D. 90 105 比較例9 比較例2 產生 200 2000 < 比較例10 比較例3 產生 130 2000 < 比較例11 比較例4 產生 150 2000 < 比較例12 比較例5 產生 300 2000 < 比較例13 比較例6 產生 170 2000 < 比較例14 比較例7 產生 170 2000 < 11 201000625 根據表6可知，本發明之水溶性切削液之Si反應氣體 量無限少，黏度變化亦較小。又，由於含有水，因而著火 之危險亦較少。 【圖式簡單說明】 無 【主要元件符號說明】 12Cutting Fluid Example 11 Cutting Fluid Composition Example 1 Cleaning Evaluation Example 12 Example 2 〇 Example 13 Example 3 〇 Example 14 Example 4 〇 Example 15 Example 5 〇 Comparative Example 8 Comparative Example 1 X 10 201000625 According to Table 5, when the water-soluble cutting fluid of the present invention is washed with water, the abrasive grains or the water-soluble cutting liquid can be completely removed from the workpiece, and the cleaning is easy. (Viscosity and Gas Generation Test) It is assumed that there is active Si crumb mixed in the ingot of the single crystal crucible by the wire saw, and the water-soluble cutting fluids of Examples 1 to 20 and the cutting of Comparative Examples 2 to 7 10% by weight of Si powder (having a particle size of about 5 // m) was added to the solution, and coarsely pulverized by a planetary ball mill, and a viscosity of 25 ° (viscosity 1) was measured by a BL type rotational viscometer. Thereafter, The sample was placed in a sealable polyethylene bag, degassed, and the amount of Si reaction gas after storage at 60 ° C for 24 hours was measured. After measuring the amount of Si reaction gas, the mixture was stirred at 1200 rpm for 10 minutes and then at 25 °. The viscosity under C was measured (viscosity 2). The results are shown in Table 6. [Table 6] Cutting fluid cutting fluid composition Si reaction gas viscosity l (mPa-s) Viscosity 2 (mPa-s) Example 11 Example 1 ND 170 190 Example 12 Example 2 ND 80 100 Example 实施 Example 3 ND 160 195 Example 14 Example 4 ND 80 90 Example 15 Example 5 ND 180 200 Example 16 Example 6 ND 170 190 Example 17 Example 7 ND 170 190 Example 18 Example 8 ND 100 110 Example 19 Implementation 9 ND 120 140 Example 20 Example 10 ND 90 105 Comparative Example 9 Comparative Example 2 Production 200 2000 < Comparative Example 10 Comparative Example 3 Production 130 2000 < Comparative Example 11 Comparative Example 4 Production 150 2000 < Comparative Example 12 Comparison Example 5 Production 300 2000 < Comparative Example 13 Comparative Example 6 Production 170 2000 < Comparative Example 14 Comparative Example 7 Production 170 2000 < 11 201000625 According to Table 6, the water-soluble cutting fluid of the present invention has an infinite amount of Si reaction gas. The viscosity change is also small. Moreover, because it contains water, there is less risk of fire. [Simple description of the diagram] No [Main component symbol description] 12

Claims (1)

201000625 七、申請專利範圍： 一種水溶性切削液組成物，其特徵在於含有： 二醇、二醇醚、聚烷二醇及聚烷二醇醚之至少一種二 醇類、水、與亞硝酸系氣化性防銹劑、以及胺類與亞硝酸 鹽之混合物之至少一者。 2·如申凊專利範圍第1項之水溶性切削液組成物，其中 該二醇類與該水之重量比為5 : 95〜95 : 5。 • 3.如申請專利範圍第1或2項之水溶性切削液組成物， V、έ有0·01〜5重量％的該亞硝酸系氣化性防銹劑。 4. 如申請專利範圍第1或2項之水溶性切削液組成物， 其含有(ΜΗ〜5重量％的該胺類，及〇〇1〜5 ^ 酸鹽。 5. :種水溶性切削液，其特徵在於含有：申請專利範圍 項中任一項之水溶性切削液組成物及研磨粒。 /· 一種切肖彳方法，其特徵在於使时請專利範 之水溶性切削液進行切削。 胃 八、圖式： Ml 13201000625 VII. Patent application scope: A water-soluble cutting fluid composition characterized by comprising: at least one glycol, diol, glycol ether, polyalkylene glycol and polyalkylene glycol ether, water, and nitrous acid At least one of a gasifying rust inhibitor and a mixture of an amine and a nitrite. 2. The water-soluble cutting fluid composition of claim 1, wherein the weight ratio of the glycol to the water is 5: 95 to 95:5. 3. The water-soluble cutting fluid composition according to claim 1 or 2, wherein V and έ have 0. 01 to 5% by weight of the nitrous acid gasification rust inhibitor. 4. The water-soluble cutting fluid composition according to claim 1 or 2, which comprises (ΜΗ~5 wt% of the amine, and 〇〇1~5 ^ acid salt. 5. : a water-soluble cutting fluid And characterized in that it comprises: a water-soluble cutting fluid composition and abrasive grains according to any one of the scopes of the patent application. The method of cutting a water-soluble cutting fluid by a patent. , pattern: Ml 13
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112980558A (en) * 2021-03-01 2021-06-18 南宁珀源能源材料有限公司 Sapphire cutting fluid and preparation method thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058929A1 (en) * 2009-11-12 2011-05-19 パレス化学株式会社 Water-soluble cutting solution for fixed abrasive wire saw, method for cutting ingot using same, method for recycling the solution, and wafer produced by cutting
KR101680383B1 (en) * 2010-08-16 2016-11-28 동우 화인켐 주식회사 Aqueous sawing fluid composition for wire saw
JP5207498B1 (en) 2011-10-24 2013-06-12 パレス化学株式会社 Water-soluble cutting liquid for fixed abrasive wire saw, cutting method using the same, and recycling method thereof
JP6084534B2 (en) * 2012-08-08 2017-02-22 コスモ石油ルブリカンツ株式会社 Hydrous hydraulic fluid
TWI632041B (en) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 Ingot slicing method and slicing abrasive kit
CN108559602B (en) * 2018-04-18 2020-12-11 三峡大学 Water-based diamond wire silicon wafer cutting fluid

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4976188A (en) * 1972-11-24 1974-07-23
JPS55119178A (en) * 1979-03-03 1980-09-12 Yoshio Yoneda Rust preventive composition of water-soluble metal processing liquid
JPS56147894A (en) * 1980-04-18 1981-11-17 Mitsubishi Heavy Ind Ltd Lubricant for plastic processing of metal
JP2875916B2 (en) * 1991-08-06 1999-03-31 ユシロ化学工業株式会社 Grinding oil for electrolytic dressing
JP3949200B2 (en) 1996-08-12 2007-07-25 エヌ・エス ルブリカンツ株式会社 Cutting oil for cutting with a wire saw, cutting oil composition, and method of cutting an article using the same
JP3508970B2 (en) 1996-09-05 2004-03-22 東芝セラミックス株式会社 Aqueous dispersion medium composition of abrasive grains and method for cutting ingot using the cutting fluid
JP3869520B2 (en) 1997-03-21 2007-01-17 株式会社ネオス Water-soluble cutting fluid for wire saw
JP4237291B2 (en) 1998-04-03 2009-03-11 花王株式会社 Cutting fluid for wire saw
JP3296781B2 (en) 1998-04-21 2002-07-02 信越半導体株式会社 Aqueous cutting fluid, method for producing the same, and cutting method using this aqueous cutting fluid
US6054422A (en) 1999-02-19 2000-04-25 Ppt Research, Inc. Cutting and lubricating composition for use with a wire cutting apparatus
JP2002080883A (en) 2000-06-20 2002-03-22 Neos Co Ltd Water soluble processing liquid for wire saw
JP3953793B2 (en) * 2000-11-30 2007-08-08 三洋化成工業株式会社 lubricant
JP2002338987A (en) * 2001-05-15 2002-11-27 Sanyo Chem Ind Ltd Water-soluble grinding/polishing liquid for metal and/or hard brittle material
JP2005179630A (en) * 2003-03-24 2005-07-07 Sanyo Chem Ind Ltd Aqueous lubricant for metal-processing oil
JP2006182901A (en) 2004-12-27 2006-07-13 Yushiro Chem Ind Co Ltd Water-soluble oil finish modifier for cutting and water-soluble oil finish for cutting
JP4566045B2 (en) * 2005-03-29 2010-10-20 ユシロ化学工業株式会社 Water-based abrasive dispersion medium composition
JP4421521B2 (en) 2005-06-13 2010-02-24 三洋化成工業株式会社 Antibacterial rust inhibitor
JP4481898B2 (en) 2005-07-25 2010-06-16 ユシロ化学工業株式会社 Water-based abrasive dispersion medium composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112980558A (en) * 2021-03-01 2021-06-18 南宁珀源能源材料有限公司 Sapphire cutting fluid and preparation method thereof

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