WO2011001911A1 - Composition de résine époxy durcissable par des rayons énergétiques, ayant d'excellentes propriétés de durcissage rapide - Google Patents

Composition de résine époxy durcissable par des rayons énergétiques, ayant d'excellentes propriétés de durcissage rapide Download PDF

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Publication number
WO2011001911A1
WO2011001911A1 PCT/JP2010/060832 JP2010060832W WO2011001911A1 WO 2011001911 A1 WO2011001911 A1 WO 2011001911A1 JP 2010060832 W JP2010060832 W JP 2010060832W WO 2011001911 A1 WO2011001911 A1 WO 2011001911A1
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Prior art keywords
epoxy resin
energy ray
resin composition
silicate
curable epoxy
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PCT/JP2010/060832
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English (en)
Japanese (ja)
Inventor
茂樹 遠山
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協立化学産業株式会社
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Application filed by 協立化学産業株式会社 filed Critical 協立化学産業株式会社
Priority to KR1020117031477A priority Critical patent/KR101671047B1/ko
Priority to JP2011520897A priority patent/JP5736568B2/ja
Priority to CN201080027559.3A priority patent/CN102471456B/zh
Publication of WO2011001911A1 publication Critical patent/WO2011001911A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Definitions

  • the present invention relates to an energy beam curable epoxy resin composition, and more particularly to an energy beam curable epoxy resin composition that has excellent fast curability while maintaining high fixing accuracy and is suitable for fixing optical components.
  • a photo-curing adhesive is used to fix the photodetector to the housing (Patent Documents 1 and 2).
  • This adhesive is required to have high fixing accuracy and good curability (fast curability).
  • the fixing accuracy is an accuracy indicating that the light detector does not move from a predetermined position when the light detector is fixed to the housing. If the fixing accuracy is low, the photodetector moves from a predetermined position at the time of manufacturing the optical pickup device or after the durability test, and light detection cannot be performed. Therefore, high fixing accuracy is required.
  • Fast curability means that the curing speed is high and the curing is quicker, that is, the curability is good.
  • tact-up there has been a demand for tact-up, and there is an increasing demand for fast curability.
  • a cationic curable epoxy resin adhesive is superior to a photocurable acrylic resin adhesive as a photocurable adhesive. Furthermore, the cationic curable epoxy resin adhesive does not inhibit the curing by oxygen unlike the acrylic resin adhesive, and is excellent in thin film curability (Non-Patent Document 1). However, the cationic curable epoxy resin has a problem that the curing rate is slow.
  • An object of the present invention is to solve the problem that the curing rate is slow while maintaining high fixation accuracy in the energy ray curable epoxy resin composition.
  • the present invention is an energy ray curable epoxy resin composition
  • an epoxy resin a silicate compound having a cationic curable functional group, and a photoacid generator.
  • the low cure shrinkage is important to prevent the position-adjusted photodetector from moving due to cure shrinkage when curing the photocurable adhesive, and the elastic modulus during heat. It is important to prevent the photodetector from moving due to its own weight or the tension of the FPC (polyimide wiring) attached to the photodetector when heated, and the photo-curing adhesive softens even when heated. It shows that it is hard without.
  • the epoxy resin composition has a curing shrinkage of 3% or less and elasticity when heated (durability test temperature of 100 ° C.) in order to obtain high fixing accuracy. It has been found that the rate needs to be 50 MPa or more.
  • the inventors of the present invention need to set the curing time of 15 to 20 seconds to 5 to 10 seconds in order to satisfy the recent tact-up requirement. I found out.
  • the curing rate of the resin composition can be remarkably improved while maintaining high fixing accuracy.
  • the energy beam curable epoxy resin composition of the present invention includes an epoxy resin, a silicate compound having a cationic curable functional group, and a photoacid generator.
  • epoxy resin Although it does not specifically limit as an epoxy resin, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, hydrogenated bisphenol A Examples thereof include a type epoxy resin, a hydrogenated bisphenol F type epoxy resin, a polybutadiene type epoxy resin, a polyisoprene type epoxy resin, an alicyclic epoxy resin, and an aliphatic epoxy resin. These resins may be used alone or in combination of two or more.
  • alicyclic epoxy resins examples include vinylcyclohexene monooxide ⁇ ⁇ ⁇ 1,2-epoxy-4-vinylcyclohexane (CEL2000), 1,2: 8,9 diepoxy limonene (CEL3000), 3,4-epoxycyclohexenylmethyl- 3 ′, 4′-epoxycyclohexenecarboxylate (CEL2021P), 1,2-epoxy-4- (2-oxiranyl) cyclosoxane adduct of 2,2-bis (hydroxymethyl) -1-butanol (EHPE3150), 3 , 4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, hydrogenated biphenyl type alicyclic epoxy resin, and the like. Each may be used alone or in combination of two or more.
  • Examples of the aliphatic epoxy resin include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1 , 6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyethylene glycol diglycidyl ether, and the like. Each may be used alone or in combination of two or more.
  • epoxy resin bisphenol A type epoxy resin (for example, Epicron 850 or Epicron 860 manufactured by DIC) and hydrogenated bisphenol A type epoxy resin (for example, YX8034 manufactured by jER) are particularly preferable.
  • bisphenol A type epoxy resin for example, Epicron 850 or Epicron 860 manufactured by DIC
  • hydrogenated bisphenol A type epoxy resin for example, YX8034 manufactured by jER
  • a purified epoxy resin such as a bisphenol A epoxy resin may be used.
  • phenol type epoxy resin epichlorohydrin used for the synthesis and halogen-containing intermediates not ring-closed to the epoxy group are present as impurities. These impurities are not cured even when irradiated with energy rays in the presence of a cationic curing catalyst. Therefore, by using a phenol type epoxy resin from which these impurities are removed, an uncured component in the cured product after curing with energy rays can be reduced, and an energy ray curable epoxy resin composition containing a low halogen content can be obtained. Obtainable.
  • Examples of the purification of the phenol type epoxy resin include purification by distillation, purification by chromatography using silica gel, alumina, etc., purification by hydrolyzing a halogen bonded by a covalent bond with an alkaline aqueous solution such as an aqueous sodium hydroxide solution, etc. Can be mentioned.
  • EXA-850CRP can be obtained from DIC as a purified product by distillation of bisphenol A type epoxy resin.
  • EXA-8067 is available from DIC as a high molecular weight epoxy resin obtained by reacting EXA-850CRP with bisphenol A.
  • the halogen content is preferably 500 ppm or less from the viewpoint of the problem of electric corrosion (electro-corrosion) and the problem of the global environment.
  • EXA-850CRP or EXA-8067 is used as the epoxy resin, low halogenation can be achieved in addition to the effects of the present invention described above.
  • silicate compounds with cationic curable functional groups The silicate compound having a cationic curable functional group is not particularly limited as long as it is a cation curable silicate compound.
  • examples of the silicate compound having a cationic curable functional group include glycidyl silicate, alicyclic epoxy silicate, vinyl silicate, and oxetanyl silicate.
  • Examples of the alicyclic epoxy silicate include a condensate of tetra (3,4-epoxycyclohexenylmethyl) silicate.
  • X-40-2670 (Shin-Etsu Chemical Co., Ltd.) is an example of such a commercial product.
  • oxetanyl silicate examples include a condensate of tetra [(3-ethyloxetane-3-yl) methyl)] silicate.
  • Aron Oxetane OXT-191 can be mentioned.
  • the silicate compound having a cationic curable functional group is preferably one or more silicate compounds selected from the group consisting of oxetanyl silicate and alicyclic epoxy silicate, and in particular, oxetanyl silicate OXT-191 and / or Toagosei Co., Ltd. Or X-40-2670 (alicyclic epoxy silicate) manufactured by Shin-Etsu Chemical Co., Ltd.
  • the range of the amount of the silicate compound having a cationic curable functional group is preferably 2.5 to 10 parts by weight, particularly preferably 5 to 10 parts by weight with respect to 45 parts by weight of the epoxy resin. If the amount of the silicate compound having a cationic curable functional group is too small relative to 45 parts by weight of the epoxy resin, the resulting energy beam curable epoxy resin composition is insufficiently improved in its curability. Even if exceeding, improvement of curability of the obtained energy ray-curable epoxy resin composition cannot be expected.
  • the photoacid generator is not limited as long as it is a compound that generates a Lewis acid or a Bronsted acid upon irradiation with energy rays, and examples thereof include a sulfonium salt and an iodonium salt.
  • the range of use amount of the photoacid generator is preferably 0.5 to 10 parts by weight, more preferably 1 to 4 parts by weight with respect to 45 parts by weight of the epoxy resin.
  • the photoacid generator can also be added after being dissolved or dispersed in a solvent such as 4-butyrolactone.
  • sulfonium salt examples include triphenylsulfonium ⁇ ⁇ ⁇ hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, 4,4'-bis [diphenylsulfonio] diphenyl sulfide bishexafluorophosphate, 4,4'-bis [di ( ⁇ -hydroxyethoxy) phenylsulfonio] diphenyl sulfide bishexafluoroantimonate, 4,4'-bis [di ( ⁇ -hydroxyethoxy) phenylsulfonio] diphenyl sulfide bishexafluorophosphate 7- [di (p-toluyl) sulfonio] -2-isopropylthioxanthone hexafluor
  • SP-172, SP-150, SP-152, CPI-210S manufactured by Sun Apro, and the like can be mentioned.
  • Preferred as the sulfonium salt is SP-170, SP-172 manufactured by Asahi Denka Co., Ltd. or CPI-210S manufactured by San Apro. These salts may be used alone or in combination of two or more.
  • iodonium salt examples include diphenyliodonium tetrakis (pentafluorophenyl) borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, di (4-nonylphenyl) iodonium hexafluorophosphate, and PI2074 manufactured by Rhodia.
  • Preferable iodonium salt is Rho20's PI2074. These salts may be used alone or in combination of two or more.
  • the energy ray curable epoxy resin composition of the present invention contains other additives such as oxetane compounds (excluding oxetanyl silicate), fillers, photosensitizers, and silane coupling agents within the scope of the effects of the present invention. Can be included.
  • Oxetane compound is added for the purpose of reducing viscosity and reducing shrinkage in order to improve coating workability.
  • oxetane compounds include 3-ethyl-3-hydroxymethyloxetane (OXA), 1,4-bis [ ⁇ (3-ethyl-3-oxetanyl) methoxy ⁇ methyl] benzene (XDO), 3-ethyl-3- (phenoxy Methyl) oxetane (OXT-211 (POX)), 2-ethylhexyloxetane (OXT-212 (EHOX)), xylylene bisoxetane (OXT-121 (XDO)), bis (3-ethyl-3-oxetanylmethyl) ether (OXT-221 (DOX)), 3-ethyl-[ ⁇ (3-triethoxysilylpropoxy) methyl) oxetane, oxetanylsilsesquio
  • the number in parentheses indicates the product number of Toagosei Co., Ltd.
  • the addition amount of the oxetane compound is preferably 5 to 100 parts by weight, more preferably 10 to 50 parts by weight with respect to 45 parts by weight of the epoxy resin.
  • Each oxetane compound may be used alone or in combination of two or more.
  • Filler is added for the purpose of reducing the cure shrinkage during curing.
  • the filler include acrylic filler, styrene filler, acrylic / styrene copolymer filler, fluorine resin filler, polyethylene filler, polypropylene filler, silicone filler, silica filler, mica, talc, and glass filler. . Each may be used alone or in combination of two or more.
  • a preferred filler is an acrylic / styrene copolymer filler.
  • the addition amount of the filler is preferably 5 to 100 parts by weight, more preferably 15 to 60 parts by weight with respect to 45 parts by weight of the epoxy resin.
  • the photosensitizer is not particularly limited, and examples thereof include carbonyl compounds, organic sulfur compounds, persulfides, redox compounds, azo and diazo compounds, halogen compounds, and photoreductive dyes.
  • Specific examples of photosensitizers include benzoin derivatives such as benzoin methyl ether, benzoin isopropyl ether, ⁇ , ⁇ -dimethoxy- ⁇ -phenylacetophenone; benzophenone, 2,4-dichlorobenzophenone, methyl o-benzoylbenzoate.
  • Benzophenone derivatives such as 4,4′-bis (diethylamino) benzophenone; thioxanthone derivatives such as 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone; 2-chloroanthraquinone, 2-methylanthraquinone, etc.
  • Anthraquinone derivatives; acridone derivatives such as N-methylacridone and N-butylacridone; other ⁇ , ⁇ -diethoxyacetophenone, benzyl, fluorenone, xanthone, uranyl compounds Etc.
  • photosensitizers may be used alone or in combination of two or more.
  • a preferred photosensitizer is 2,4-diethylthioxanthone (DETX-S manufactured by Nippon Kayaku).
  • the addition amount of the photosensitizer is 0.001 to 1 part by weight, preferably 0.005 to 0.1 part by weight with respect to 45 parts by weight of the epoxy resin.
  • iodonium salt-based PI2074 it is preferable to use the photosensitizer DETX-S, and the addition amount is preferably 0.005 to 45 parts by weight of the epoxy resin. 0.1 parts by weight, particularly preferably 0.01 parts by weight.
  • sulfonium salt-based CPI-210S is used as the photoacid generator, the curability is excellent without adding a photosensitizer.
  • ⁇ Silane coupling agent is added for the purpose of imparting adhesion.
  • silane coupling agents include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, tetrabutoxysilane, dimethoxydiethoxysilane, dimethoxydiisopropoxysilane, diethoxydiisopropoxysilane, diethoxydi Tetraalkoxysilanes such as butoxysilane; trialkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, ethyltriethoxysilane, ethyltributoxysilane, cyclohexyltriethoxysilane, and phenyltriisopropoxysilane Dimethyldimethoxysilane, dimethyldiethoxysilane,
  • the energy ray curable epoxy resin composition of the present invention includes, for example, an LD (laser diode), a photodetector (PD: photodetector), an optical component such as a lens and a prism, and an optical module on which an optical component such as a lens is mounted. Since it can be quickly fixed with high fixing accuracy, it is useful as an adhesive for assembling an optical device.
  • an optical device for example, in the optical pickup device described in Patent Documents 1 and 2 and paragraph 0023 of Japanese Patent Application Laid-Open No. 2007-311006, it can be used for fixing after adjusting the tilt of the actuator with a skew screw. In addition, it can also be used for fixing optical components such as mirrors and suspension wires.
  • Example 7 to 11 and Comparative Example 3 Based on the formulation shown in Table 3, the energy ray curable epoxy resin compositions of Examples 7 to 11 and Comparative Example 3 were prepared.
  • Example 12 to 14 Based on the formulation shown in Table 6, energy ray curable epoxy resin compositions of Examples 12 to 14 were prepared.
  • Test Example 4 The curability of each of the energy beam curable epoxy resin compositions of Examples 12 to 14 was tested in the same manner as in Test Example 1. The test results are shown in Table 6.
  • Example 15 to 18 Based on the formulation shown in Table 7, energy ray curable epoxy resin compositions of Examples 15 to 18 were prepared.
  • EXA-850CRP Bisphenol A type epoxy resin (manufactured by DIC: purified product by distillation)
  • EXA-8067 Bisphenol A type epoxy resin (manufactured by DIC: reaction product of EXA-850CRP and bisphenol A)
  • I-651 2,2-dimethoxy-1,2-diphenylethane (sensitizer manufactured by Ciba)
  • Example 5 Each of the energy ray curable epoxy resin compositions of Examples 15 and 16 was tested for LED curability.
  • the LED curability is obtained by dropping one drop of an energy ray curable epoxy resin composition on an aluminum plate and irradiating it with an irradiance of 500 mW / cm 2 (illuminance meter C6080-13 manufactured by Hamamatsu Photonics) for 10 seconds using an LED irradiator with a wavelength of 365 nm.
  • the cured state was confirmed by touch with a finger.
  • the criteria for LED curability were ⁇ : cured (solid) and x: uncured (liquid). The test results are shown in Table 8.
  • the deep curability of the LED is such that an energy beam curing type epoxy resin composition is filled in a black tube having an inner diameter of 5 mm ⁇ and a length of 5 mm, and an illuminance of 500 mW / cm 2 from above by an LED irradiator with a wavelength of 365 nm (illuminance meter: C6080 made by Hamamatsu Photonics)
  • the length of the energy ray-curable epoxy resin composition which was irradiated for 10 seconds at ⁇ 13) and was cured was measured. Table 10 shows the measurement results.
  • Test Example 8 The hardness, cure shrinkage, and elastic modulus of each of the energy beam curable epoxy resin compositions of Examples 15 and 17 were measured. Hardness (D) was measured with a durometer described in JIS K 7215. The cure shrinkage rate was measured according to the cup method described in JIS K 6833. Tan ⁇ and storage elastic modulus were measured by a flat plate tension method using EXSTAR6000 manufactured by SII.
  • optical components such as LDs, photodetectors, lenses and prisms, and optical modules on which optical components such as lenses are mounted can be quickly and accurately fixed. Since it can be fixed, it is useful as an adhesive for assembling an optical device.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Cette invention concerne une composition de résine époxy durcissable par des rayons énergétiques qui résout le problème du durcissage lent, tout en conservant une précision de fixation élevée. Plus spécifiquement, une composition de résine époxy durcissable par des rayons énergétiques qui contient une résine époxy, un composé de silicate ayant un groupe fonctionnel durcissable par un procédé cationique, et un photogénérateur d'acide est décrite.
PCT/JP2010/060832 2009-07-01 2010-06-25 Composition de résine époxy durcissable par des rayons énergétiques, ayant d'excellentes propriétés de durcissage rapide WO2011001911A1 (fr)

Priority Applications (3)

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KR1020117031477A KR101671047B1 (ko) 2009-07-01 2010-06-25 속경화성이 우수한 에너지선 경화형 에폭시 수지 조성물
JP2011520897A JP5736568B2 (ja) 2009-07-01 2010-06-25 速硬化性に優れたエネルギー線硬化型エポキシ樹脂組成物
CN201080027559.3A CN102471456B (zh) 2009-07-01 2010-06-25 快速固化性优异的能量射线固化型环氧树脂组合物

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JP2009156853 2009-07-01
JP2009-156853 2009-07-01

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JP2013067732A (ja) * 2011-09-22 2013-04-18 Kyoritsu Kagaku Sangyo Kk カチオン硬化型樹脂組成物
JP2015034227A (ja) * 2013-08-08 2015-02-19 株式会社Adeka エネルギー線感受性組成物
CN108140452A (zh) * 2015-09-30 2018-06-08 三星Sdi株式会社 各向异性导电膜和使用其的显示设备
JP2018127507A (ja) * 2017-02-06 2018-08-16 アイカ工業株式会社 光学部品固定用接着剤
JP2020164881A (ja) * 2018-12-27 2020-10-08 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置

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CN103666320B (zh) * 2012-09-20 2016-07-06 广东恒大新材料科技有限公司 一种用于加成型硅胶的增粘剂组合物及其应用
CN105504686B (zh) * 2015-12-30 2018-01-05 广东生益科技股份有限公司 一种热固性树脂组合物以及含有它的预浸料、层压板和电路载体
RU2744431C2 (ru) 2016-05-19 2021-03-09 Сикпа Холдинг Са Адгезивы для сборки компонентов инертного материала

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