WO2008133228A1 - Composé à teneur en silicium, composition durcissable et produit durci - Google Patents

Composé à teneur en silicium, composition durcissable et produit durci Download PDF

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Publication number
WO2008133228A1
WO2008133228A1 PCT/JP2008/057664 JP2008057664W WO2008133228A1 WO 2008133228 A1 WO2008133228 A1 WO 2008133228A1 JP 2008057664 W JP2008057664 W JP 2008057664W WO 2008133228 A1 WO2008133228 A1 WO 2008133228A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
silicon
curable composition
containing compound
cured product
Prior art date
Application number
PCT/JP2008/057664
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Sueyoshi
Kenji Hara
Seiichi Saito
Original Assignee
Adeka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corporation filed Critical Adeka Corporation
Priority to KR1020097017297A priority Critical patent/KR101526862B1/ko
Publication of WO2008133228A1 publication Critical patent/WO2008133228A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

L'invention porte sur un composé à teneur en silicium représenté par la formule générale (0) ci-après. L'invention porte également sur une composition durcissable contenant 0,01-20 parties en masse d'un composé durcissable époxyde pour 100 parties en masse du composé à teneur en silicium. Cette composition durcissable permet d'obtenir un produit durci ayant une excellente résistance thermique et une excellente flexibilité. (Dans la formule générale (0), Ra-Rg représentent chacun un groupe hydrocarboné aliphatique saturé en C1-12 ou un groupe hydrocarboné aromatique en C1-12; Y représente un groupe alkylène en C2-4; Z représente un groupe représenté par l'une des formules (2)-(6) représentées ci-dessus; K représente un nombre de 2-7; T représente un nombre de 1-7; P représente un nombre de 0-3; et M et N représentent des nombres satisfaisant la relation suivante: N:M = 1:1-1:100, avec le total de tous les M et de tous les N qui n'est pas inférieur à 15, ce qui fait que la masse moléculaire moyenne en poids du composé est de 3000-1000000. Dans les formules (2)-(6), Xa-Xc représentent chacun un groupe alkanédiyle en C1-8, un groupe -COO- ou une simple liaison; Rh-Rj représentent chacun un atome d'hydrogène ou un groupe méthyle; et r représente 0 ou 1.)
PCT/JP2008/057664 2007-04-23 2008-04-21 Composé à teneur en silicium, composition durcissable et produit durci WO2008133228A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020097017297A KR101526862B1 (ko) 2007-04-23 2008-04-21 규소 함유 화합물, 경화성 조성물 및 경화물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-112742 2007-04-23
JP2007112742A JP5248034B2 (ja) 2007-04-23 2007-04-23 ケイ素含有化合物、硬化性組成物及び硬化物

Publications (1)

Publication Number Publication Date
WO2008133228A1 true WO2008133228A1 (fr) 2008-11-06

Family

ID=39925679

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057664 WO2008133228A1 (fr) 2007-04-23 2008-04-21 Composé à teneur en silicium, composition durcissable et produit durci

Country Status (5)

Country Link
JP (1) JP5248034B2 (fr)
KR (1) KR101526862B1 (fr)
CN (2) CN103936999B (fr)
TW (1) TWI425028B (fr)
WO (1) WO2008133228A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (fr) * 2009-07-01 2011-01-06 協立化学産業株式会社 Composition de résine époxy durcissable par des rayons énergétiques, ayant d'excellentes propriétés de durcissage rapide
JP2012144678A (ja) * 2011-01-14 2012-08-02 Adeka Corp ケイ素含有硬化性樹脂組成物
WO2012153821A1 (fr) * 2011-05-10 2012-11-15 住友電気工業株式会社 Fibre optique
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
WO2013140601A1 (fr) * 2012-03-23 2013-09-26 株式会社Adeka Composition de résine durcissable contenant du silicium
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
WO2015012141A1 (fr) * 2013-07-24 2015-01-29 株式会社Adeka Composition de résine durcissable
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
US10493723B2 (en) 2015-11-05 2019-12-03 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses, and devices

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* Cited by examiner, † Cited by third party
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CN102361891A (zh) 2009-03-23 2012-02-22 富士胶片株式会社 接合型透镜用固化性树脂组合物、成像透镜和用于制造成像透镜的方法
JP5762876B2 (ja) * 2011-08-03 2015-08-12 株式会社Adeka エポキシ樹脂用硬化剤、及び該エポキシ樹脂用硬化剤を含有するエポキシ樹脂組成物
JP6135675B2 (ja) * 2012-09-18 2017-05-31 Jnc株式会社 エポキシおよびアルコキシシリル基含有シルセスキオキサンおよびその組成物
KR101768310B1 (ko) * 2015-04-30 2017-08-16 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
WO2019244531A1 (fr) * 2018-06-21 2019-12-26 株式会社Adeka Procédé de production de nitrure d'aluminium traité en surface, nitrure d'aluminium traité en surface, composition de résine et produit durci
JP7021046B2 (ja) * 2018-10-22 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
CN117777455B (zh) * 2024-02-28 2024-05-10 山东同益光刻胶材料科技有限公司 一种含氟聚硅氧烷及其制备方法、光刻胶组合物及其应用

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JPH04226525A (ja) * 1990-07-05 1992-08-17 General Electric Co <Ge> 熱変形温度が高いエポキシシロキサン／有機エポキシ組成物
JP2005133073A (ja) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd 硬化性組成物
JP2005523980A (ja) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション オルガノハイドロジェンシリコン化合物
JP2005529989A (ja) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション 向上したバス・ライフを持つ組成物
JP2006511645A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物由来の分岐ポリマー
JP2006213762A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物、発光部品及び該発光部品を用いた表示機器
WO2007105556A1 (fr) * 2006-03-10 2007-09-20 Adeka Corporation Composition durcissable destinee a un materiau optique et guide d'ondes optiques

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JP3737279B2 (ja) * 1998-05-20 2006-01-18 株式会社カネカ 硬化性組成物
JP3633802B2 (ja) * 1998-11-02 2005-03-30 株式会社カネカ 発光表示体封止材用硬化性組成物及び発光表示体の製造方法
JP3797527B2 (ja) * 1999-02-15 2006-07-19 株式会社カネカ 接着性組成物
JP5225528B2 (ja) * 2001-05-30 2013-07-03 株式会社Ａｄｅｋａ ケイ素含有重合体の製造方法
JP5132027B2 (ja) * 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH04226525A (ja) * 1990-07-05 1992-08-17 General Electric Co <Ge> 熱変形温度が高いエポキシシロキサン／有機エポキシ組成物
JP2005523980A (ja) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション オルガノハイドロジェンシリコン化合物
JP2005529989A (ja) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション 向上したバス・ライフを持つ組成物
JP2006511645A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物由来の分岐ポリマー
JP2005133073A (ja) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd 硬化性組成物
JP2006213762A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物、発光部品及び該発光部品を用いた表示機器
WO2007105556A1 (fr) * 2006-03-10 2007-09-20 Adeka Corporation Composition durcissable destinee a un materiau optique et guide d'ondes optiques

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (fr) * 2009-07-01 2011-01-06 協立化学産業株式会社 Composition de résine époxy durcissable par des rayons énergétiques, ayant d'excellentes propriétés de durcissage rapide
KR101671047B1 (ko) * 2009-07-01 2016-10-31 교리쯔 가가꾸 산교 가부시키가이샤 속경화성이 우수한 에너지선 경화형 에폭시 수지 조성물
JP5736568B2 (ja) * 2009-07-01 2015-06-17 協立化学産業株式会社 速硬化性に優れたエネルギー線硬化型エポキシ樹脂組成物
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
JP2016153512A (ja) * 2009-11-09 2016-08-25 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JP2012144678A (ja) * 2011-01-14 2012-08-02 Adeka Corp ケイ素含有硬化性樹脂組成物
WO2012153821A1 (fr) * 2011-05-10 2012-11-15 住友電気工業株式会社 Fibre optique
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
US9297950B2 (en) 2011-05-10 2016-03-29 Sumitomo Electric Industries, Ltd. Optical fiber
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
WO2013140601A1 (fr) * 2012-03-23 2013-09-26 株式会社Adeka Composition de résine durcissable contenant du silicium
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
WO2015012141A1 (fr) * 2013-07-24 2015-01-29 株式会社Adeka Composition de résine durcissable
JPWO2015012141A1 (ja) * 2013-07-24 2017-03-02 株式会社Adeka 硬化性樹脂組成物
US10493723B2 (en) 2015-11-05 2019-12-03 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses, and devices

Also Published As

Publication number Publication date
TWI425028B (zh) 2014-02-01
KR20090129990A (ko) 2009-12-17
CN103936999A (zh) 2014-07-23
JP2008266485A (ja) 2008-11-06
CN101616962A (zh) 2009-12-30
CN103936999B (zh) 2016-08-17
JP5248034B2 (ja) 2013-07-31
KR101526862B1 (ko) 2015-06-08
TW200911886A (en) 2009-03-16

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