WO2010125818A1 - アンテナシート、非接触型ic付データキャリア及びアンテナシートの製造方法 - Google Patents
アンテナシート、非接触型ic付データキャリア及びアンテナシートの製造方法 Download PDFInfo
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- WO2010125818A1 WO2010125818A1 PCT/JP2010/003060 JP2010003060W WO2010125818A1 WO 2010125818 A1 WO2010125818 A1 WO 2010125818A1 JP 2010003060 W JP2010003060 W JP 2010003060W WO 2010125818 A1 WO2010125818 A1 WO 2010125818A1
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- antenna coil
- antenna
- substrate
- conductive member
- antenna sheet
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Definitions
- the present invention relates to an antenna sheet, a data carrier with a non-contact type IC, and a method for manufacturing the antenna sheet.
- a non-contact information medium provided with an IC inlet capable of entering electronic data in a booklet such as a passport or a deposit and saving passbook is used.
- the non-contact information medium has a tear strength higher than that of fine paper or coated paper on both sides of an antenna sheet having an integrated circuit (IC chip) and an antenna connected to the integrated circuit, and is flexible. Excellent substrate is attached.
- an antenna included in an antenna sheet has a function as a coil that generates power for driving an integrated circuit by electromagnetic induction, in addition to a function as an antenna for information communication. Therefore, in the antenna sheet, a band-shaped antenna is formed by being wound in a coil shape (spiral shape) on the surface of the antenna sheet. Because of such a configuration, both ends of the antenna are respectively disposed inside and outside the coil.
- a conductive member (bridge pattern) for internal / external connection is provided on the surface opposite to the antenna formation surface of the sheet base material, and the bridge pattern is connected to the antenna end and / or connection pattern.
- connection portion between the bridge pattern and the antenna after the bridge pattern and the antenna are formed on both surfaces of the sheet base material, electrical conduction is performed by mechanically contacting the two by crimping (for example, Patent Documents). 1).
- electrical conduction is achieved by providing a through hole (through hole) in the sheet base material and then plating the inside of the through hole with a conductive member or filling the conductive member. .
- the above method has the following problems. That is, in the connection by crimping, since the connection is merely mechanically pressed, the bonding strength of the connection portion is low and the reliability with respect to the electrical connection is low. For this reason, for example, when heat treatment is performed after the connection by crimping, there is a possibility that the connection portion is detached due to the warp caused by the difference in thermal expansion coefficient between the sheet base material and the antenna and the electrical connection cannot be sufficiently obtained. In addition, in the connection by crimping, since the connection portion is only in contact, a stable contact resistance cannot be maintained without a certain amount of pressure. Further, in the connection by crimping, there arises a problem that the contact surface is oxidized or corroded. Furthermore, the conduction through the through hole is not efficient because the process is complicated.
- the present invention has been made in view of such circumstances, and provides an antenna sheet that can prevent disconnection of an antenna, improve reliability, lower electrical resistance, and further improve productivity. With the goal. Another object of the present invention is to provide a data carrier with a non-contact type IC provided with such an antenna sheet. Another object of the present invention is to provide a method for manufacturing an antenna sheet that can prevent disconnection of the antenna, improve reliability, and improve productivity.
- the antenna sheet manufacturing method is an antenna that is provided on one surface of a substrate that uses a thermoplastic resin as a forming material and that uses a metal material as a forming material. Press that presses an overlapping portion of a coil and / or connection pattern and a conductive member made of a metal material provided on the other surface of the substrate from at least one surface of the substrate using a pressing means And a welding step of welding an overlapping portion between the antenna coil and / or the connection pattern and the conductive member.
- the pressing step in the pressing step, the overlapping portion of the antenna coil and / or the connection pattern and the conductive member is heated to a temperature equal to or higher than the softening temperature of the substrate forming material. It is desirable to press using means. According to this method, in the pressing step, the substrate sandwiched between the antenna coil and the conductive member is pressed while being heated to the softening temperature or higher by the pressing means. Therefore, the molten substrate is pushed away.
- the pressing portion by the pressing means is irradiated with laser light to weld the antenna coil and / or the connection pattern and the conductive member.
- this method by performing welding in a welding process using laser light, the antenna coil and / or the connection pattern and the conductive member are welded and firmly connected. Since laser welding is non-contact processing, unlike contact processing in which the influence of dirt and wear on the processing jig affects the bonding quality, it is possible to realize a bonded state with stable quality. Moreover, since it is not necessary to replace the processing jig, high production efficiency can be realized.
- the welding step it is desirable to form a hole at a position where the laser beam is irradiated.
- the antenna coil and / or the connection pattern and the conductive member are in contact with each other on the inner wall of the through hole.
- the strength of the joint portion between the antenna coil and / or the connection pattern joined by the through hole and the conductive member can be increased after lamination.
- the first aspect of the present invention further includes a mounting step of connecting the antenna coil and the integrated circuit. Thereby, an antenna coil and an integrated circuit are connected and an IC inlet can be manufactured.
- an integrated circuit such as an IC chip is more expensive than other members. Therefore, after connecting the antenna coil and / or connection pattern and the conductive member, mounting an integrated circuit causes a defective product due to poor connection between the antenna coil and / or connection pattern and the conductive member. Damage can be reduced.
- integrated circuit means not only an IC chip but also an IC module in which a resin sealing portion for sealing the IC chip, a lead frame on which the IC chip is mounted, and the like are formed together with the IC chip. Including.
- the antenna sheet according to the second aspect of the present invention includes a substrate, a strip-shaped antenna coil formed in a spiral shape on one surface of the substrate, and the antenna coil on the other surface of the substrate.
- a conductive member that extends in a crossing direction and is provided so as to overlap with one of the two ends of the antenna coil in a plan view, the conductive member, one end of the antenna coil, and At least a part of the contact portion with the connection pattern is welded. According to this configuration, the antenna coil and / or the connection pattern disposed on both surfaces of the substrate and the conductive member are physically and firmly connected, and an electrically reliable and stable antenna sheet can be obtained. it can.
- the conductive member, one end of the antenna coil and / or the connection pattern are in contact with each other on the inner wall of the through hole covering the through hole provided in the substrate. It is desirable that According to this configuration, a highly reliable antenna sheet can be provided.
- a hole penetrating each other is formed in a welded portion between the conductive member and one end of the antenna coil and / or the connection pattern. It is desirable that the conductive member and the antenna coil and / or the connection pattern are melted. According to this configuration, since the antenna coil and / or the connection pattern and the conductive member are firmly connected, the reliability of electrical connection can be ensured.
- the integrated circuit is connected to the antenna coil and / or the connection pattern on the surface of the antenna sheet on which the antenna coil is provided. According to this configuration, the antenna coil and / or the connection pattern and the integrated circuit are connected, and an IC inlet can be manufactured. Further, according to this configuration, it is possible to provide an IC inlet having a highly reliable antenna sheet.
- the data carrier with non-contact type IC includes a substrate, a strip-shaped antenna coil spirally formed on one surface of the substrate, and the other surface of the substrate.
- a conductive member that extends in a direction intersecting the antenna coil and is provided so as to overlap one of the two ends of the antenna coil in a plan view, and the antenna coil of the antenna sheet.
- an antenna sheet that can prevent disconnection of an antenna, improve reliability, reduce electrical resistance, and improve productivity. Furthermore, by providing this antenna sheet, it is possible to provide a data carrier with a non-contact type IC in which disconnection of the antenna is prevented, reliability is improved, and productivity is improved, and a method for manufacturing the antenna sheet.
- FIG. 3A It is a figure which shows the state after FIG. 3B.
- FIG. 4A It is sectional drawing which shows the manufacturing process of the antenna sheet which concerns on another embodiment of this invention. It is sectional drawing which shows the manufacturing process of the antenna sheet which concerns on another embodiment of this invention. It is sectional drawing which shows the manufacturing process of the antenna sheet which concerns on another embodiment of this invention, Comprising: It is a figure which shows the state after FIG. 5A.
- 1 is a plan view of an information recording medium according to an embodiment of the present invention.
- FIG. 6B is a cross-sectional view taken along line BB in FIG. 6A. It is explanatory drawing of the data carrier with a non-contact type IC which concerns on embodiment of this invention.
- FIGS. 1A to 4B an antenna sheet and an IC inlet according to an embodiment of the present invention will be described with reference to FIGS. 1A to 4B.
- the film thicknesses and dimensional ratios of the constituent elements are appropriately changed in order to make the drawings easy to see.
- FIG. 1A and 1B are plan views showing the antenna sheet 1 and the IC inlet 10 of the present embodiment.
- FIG. 1A is a plan view showing one surface of the antenna sheet 1 and the IC inlet 10.
- FIG. 1B is a plan view showing the other surface of the antenna sheet 1 and the IC inlet 10.
- the IC inlet 10 of the present embodiment includes an antenna sheet 1 and an integrated circuit (IC chip) 20.
- the integrated circuit 20 is mounted on the antenna sheet 1.
- the surface of the antenna sheet 1 on which the integrated circuit 20 is mounted is referred to as a main surface
- the surface opposite to the surface on which the integrated circuit 20 is mounted is referred to as a back surface.
- the antenna sheet 1 includes a substrate 2, an antenna coil 4, connection terminals 5, and a bridge pattern 6.
- the substrate 2 has a substantially rectangular shape in plan view.
- the antenna coil 4 is provided on one surface of the substrate 2 and has a strip shape.
- the connection terminal 5 is provided inside the antenna coil 4 and is electrically connected to the outer end of the antenna coil 4.
- the bridge pattern 6 connects the antenna coil 4 and the connection terminal 5 on the other surface of the substrate 2 through a through hole 8 provided in the substrate 2.
- the surface on which the antenna coil 4 is provided is the main surface of the substrate 2 and the main surface of the antenna sheet 1.
- the substrate 2 is made of an insulating thermoplastic resin. If it has insulation and thermoplasticity, it can be used regardless of transparent resin or opaque resin as a forming material of the substrate 2.
- a polyester resin such as PEN (polyethylene naphthalate) or PET (polyethylene terephthalate), polycarbonate, polyethylene, polypropylene, polystyrene, or the like can be used as the material for forming the substrate 2.
- a composite material formed by laminating or mixing the materials can be used as a material for forming the substrate 2.
- PET is used in consideration of the workability and adhesiveness when bonding to other members using an adhesive.
- the thickness of the substrate 2 is 38 ⁇ m.
- the thickness of the substrate 2 is preferably 0.01 to 0.5 mm.
- the antenna coil 4 is provided in a strip shape by patterning a metal thin film provided on the main surface of the substrate 2 by etching, and is formed in a spiral shape having a substantially rectangular shape in plan view along the peripheral edge of the substrate 2.
- the antenna coil 4 is made of a metal material having good conductivity such as aluminum or copper.
- the antenna coil 4 of the present embodiment is made of aluminum and has a thickness of 30 ⁇ m.
- connection terminal 5 is formed using the same forming material as that of the antenna coil 4 and is provided in a region inside the antenna coil 4 that is a region surrounded by the antenna coil 4 in a plan view direction.
- the thickness of the connection terminal 5 of the present embodiment is 30 ⁇ m, similar to the antenna coil 4.
- the bridge pattern 6 is formed using the same forming material as the antenna coil 4 and is provided on the back surface of the substrate 2. Both ends of the bridge pattern 6 are electrically connected to one end 3 a on the outside of the antenna coil 4 and the connection terminal 5 through a through hole 8 provided in the substrate 2. By connecting the one end 3 a of the antenna coil 4 and the connection terminal 5 via the bridge pattern 6, the inside and outside of the antenna coil 4 can be bridged without interfering with the antenna coil 4.
- the thickness of the bridge pattern 6 of this embodiment is 20 ⁇ m.
- the antenna coil 4 and the bridge pattern 6 are formed by etching the same kind of metal foil made of aluminum foil or copper foil on the front and back of the substrate 2 with an adhesive, and then etching. Although it is possible to form the metal foil on the front and back of the substrate 2 with different metals, it is desirable to form them with the same metal. By forming the front and back metal foils of the substrate 2 with the same metal, the front and back of the substrate 2 can be simultaneously etched under the same conditions. Also, when dissimilar metals are welded, the number of dissimilar metals that can be welded is limited, and even when welding is possible, there is a possibility of causing electrolytic corrosion. It is desirable to form with.
- the thickness of the antenna coil 4 and the bridge pattern 6 is preferably set to 0.01 to 0.05 mm.
- the bridge pattern 6 may be cut by cutting a metal foil into a required size, positioned on the substrate 2, and welded. That is, the antenna sheet 1 may be manufactured by forming only the antenna coil 4 by etching without forming the bridge pattern 6 by etching.
- the integrated circuit 20 is disposed in an area inside the antenna coil 4.
- One end 4 b of the antenna coil 4 and the connection terminal 5 are connected to the integrated circuit 20.
- the one end 4 b of the antenna coil and the connection terminal 5 are connected via the antenna coil 4, the other end 4 a of the antenna coil, and the bridge pattern 6.
- FIG. 2 is a perspective cross-sectional view of the antenna sheet 1 and the IC inlet 10, and includes a cross-sectional view corresponding to the line AA in FIG. 1A.
- the one end 4 a of the antenna coil 4 that overlaps the through hole 8 in a plane, the connection terminal 5, and the bridge pattern 6 are respectively formed with recesses 4 x, 5 x, 6 x that are recessed toward the substrate 2.
- the connection terminal 5 (connection pattern) and the one end 4 b of the antenna coil 4 are electrically connected to the integrated circuit 20.
- the connection terminal 5 is electrically connected to a bridge pattern 6 formed on the opposite side across the substrate 2.
- the antenna coil 4 and the bridge pattern 6, and the connection terminal 5 and the bridge pattern 6 are joined by melting each other at the inner wall of the through hole 8.
- the antenna sheet 1 and the IC inlet 10 of the present embodiment are configured as described above.
- FIG. 4A and FIG. 4B are process diagrams showing a method for manufacturing the antenna sheet 1A which is one form of the antenna sheet 1.
- FIG. 4A and FIG. 4B are process diagrams showing a method for manufacturing the antenna sheet 1A which is one form of the antenna sheet 1.
- the manufacturing method of the present invention is characterized by the step of connecting the antenna coil 4 and the connection terminal 5 provided on both surfaces of the substrate 2 and the bridge pattern 6 to each other, and the other manufacturing steps are generally known manufacturing steps.
- the method can be used. Therefore, in the following description, the process of connecting the antenna coil 4 and the bridge pattern 6 will be described as an example, and the process of connecting the antenna coil 4 and the bridge pattern 6 will be mainly described. Needless to say, the step of connecting the connection terminal 5 and the bridge pattern 6 can be performed in the same manner.
- the antenna coil 4 is formed on one surface of the substrate 2 and the bridge pattern 6 is formed on the other surface of the substrate 2.
- the antenna coil 4 and the bridge pattern 6 are formed, for example, by attaching an aluminum thin film to the substrate 2 with an adhesive and then etching to remove the aluminum thin film other than the desired pattern.
- an aluminum thin film may be formed on the substrate 2 using a method such as vapor deposition or sputtering.
- the antenna coil 4, the connection terminal, and the bridge pattern 6 of a desired pattern can be formed, it is not restricted to this.
- a heat press head 30 heated from both sides of the substrate 2 is applied to a portion where the antenna coil 4 and the bridge pattern 6 are connected, and pressing is performed from both sides.
- the heat press head 30 one using a pulse heat method can be suitably used.
- the pulse heat method is adopted, the temperature can be maintained after the temperature of the head is instantaneously increased.
- the heat press head 30 is provided with a cooling means by an air cooling method or a water cooling method, and the head temperature can be lowered in a short time.
- the pressing is performed, for example, under the conditions of a head temperature of 300 ° C. to 600 ° C., a pressing time of 0.5 second to 2 seconds, and a pressing pressure of 10N to 60N.
- the substrate 2 made of a thermoplastic resin is melted in a region overlapping with the heat press head 30 indicated by symbol AR in FIG. 3A.
- the heat press head 30 applies a pressure F to the substrate 2. Therefore, the molten forming material of the substrate 2 flows so as to be displaced in the direction of the symbol X.
- the heat press head 30 is used as the pressing means for pushing the substrate 2 in the direction of the symbol X.
- the present invention is not limited to this.
- a device that pushes the substrate 2 in the direction of the symbol X using ultrasonic waves may be used as the pressing means.
- the substrate 2 can be processed in a short time by applying the heat press head 30 from both sides of the substrate 2 and performing the heat press. Further, it is possible to prevent the substrate 2 from being deformed unevenly as compared with the case where the substrate 2 is processed by applying the heat press head 30 only from one side of the substrate 2.
- the antenna coil 4 and the bridge pattern 6 made of a metal material are not melted under the above-mentioned pressing conditions, and only deformation occurs due to the pressing pressure.
- the antenna coil 4 and the bridge pattern 6 are provided with the recesses 4x and 6x by pressing with the heat press head 30, and the substrate 2 is melted and flows to form through holes. 8 is formed.
- the antenna coil 4 and the bridge pattern 6 are in contact with each other on the inner wall of the through hole 8.
- the antenna coil 4 and the bridge pattern 6 are in close contact with the substrate 2 on the inner wall of the through hole 8.
- a cylindrical heat press head 30 is used.
- symbol X (FIG. 3A) by heat press may use the thing where the front-end
- the tip of the heat press head 30 is a spherical surface, a region where the substrate 2 is pushed away (contact portion between the heat press head 30 and the substrate 2) becomes a point, and the substrate 2 remains thickly at a place welded with the laser beam L, There is a possibility that the antenna coil 4 and the bridge pattern 6 cannot be joined stably.
- the substrate 2 can be easily pushed in the direction of the symbol X (FIG. 3A). Further, when the heat press head 30 is separated from the substrate 2, the force generated by the substrate 2 being caught on the edge of the tip of the heat press head 30, which is the force applied in the direction of separating the antenna coil 4 and the bridge pattern 6. Can be reduced. Therefore, the adhesion by laser welding between the antenna coil 4 and the bridge pattern 6 can be improved.
- the head diameter of the heat press head 30 is preferably 1.0 times or more the diameter of the laser beam L. More preferably, the diameter of the head 30 of the heat press head 30 is 1.0 to 10 times the diameter of the laser beam L.
- the head diameter of the heat press head 30 is 5 to 7 times the diameter of the laser beam L.
- the diameter of the laser beam L is 0.3 mm
- the head diameter of the heat press head 30 is 2.0 mm.
- the physical strength can be increased by bringing the head diameter of the heat press head 30 close to the diameter of the laser beam L.
- the vicinity of the processed portion of the substrate 2 may be blown with air to cool the vicinity of the processed portion and prevent the surrounding substrate 2 from being excessively melted.
- dissolves too much it can prevent that the antenna coil 4 and the bridge
- strength of the antenna sheet 1 falls by not having the board
- FIG. 4A shows a state in which the laser beam L is irradiated from the antenna coil 4 side, it is of course possible to irradiate from the bridge pattern 6 side.
- the laser beam L is a YAG (Yttrium Aluminum Garnet) laser with an oscillation wavelength of 1064 nm when the forming material of the member to be welded is aluminum, and a YAG laser with an oscillation wavelength of 532 nm when the forming material is copper. It is preferable to use it.
- the energy of the laser beam L is preferably 1J to 10J.
- the molten state of the metal material is suppressed, and the antenna coil 4 and the bridge pattern 6 are welded.
- the laser condition at this time is to irradiate the surface of the antenna coil 4 with the laser beam L at a position 5 mm away from the focal point BW, and the energy is 2.2 J.
- the antenna coil 4 and the bridge pattern 6 can be welded through the fusion
- the antenna sheet 1A of the present embodiment is manufactured.
- the antenna coil 4 and the bridge pattern 6 arranged on both surfaces of the substrate 2 are melt-bonded. Therefore, the antenna coil 4 and the bridge pattern 6 are physically firmly connected, and the electrical resistance is lowered, so that a stable antenna sheet having high electrical reliability can be obtained.
- the purpose of lowering the resistance value between the antenna coil 4 and the bridge pattern 6 is to eliminate the resistance component at the contact portion between the antenna coil 4 and the bridge pattern 6 and to provide only the metal conductor resistance including the welded portion. It is. Thereby, the unstable element that the antenna coil 4 and the bridge pattern 6 are electrically connected only by contact is eliminated, and reliability can be ensured.
- a stable contact resistance cannot be maintained without a certain amount of pressure, and there is a possibility that problems such as oxidation and corrosion of the contact surface may occur.
- the antenna coil 4 and the bridge pattern 6 can be joined in a non-contact manner by laser welding. Therefore, unlike contact processing in which the influence of dirt and wear on the processing jig affects the bonding quality, it is possible to realize a bonding state with stable quality. Moreover, since it is not necessary to replace the processing jig, high production efficiency can be realized.
- laser welding the resistance component of the connecting portion is eliminated, and only the metal conductor resistance including the welded portion is eliminated, thereby eliminating the unstable element of contact and ensuring reliability.
- the antenna sheet 1A that welds the antenna coil 4 and the bridge pattern 6 without penetrating the antenna coil 4 has been described.
- the antenna sheet 1 of another embodiment is used by using the same manufacturing process.
- 5A and 5B are process diagrams showing a method for manufacturing an antenna sheet 1B, which is another embodiment of the antenna sheet 1, and correspond to FIGS. 4A and 4B.
- the laser beam L is irradiated so that the focal point BW is located on the surface of the antenna coil 4 or in the vicinity of the contact portion between the antenna coil 4 and the bridge pattern 6. Thereby, the laser beam L penetrates the antenna coil 4 and the bridge pattern 6.
- the size of the hole H is about 0.2 mm to 2 mm in diameter.
- the material for forming the antenna coil 4 and the bridge pattern 6 is melted on the inner wall of the hole H. Thereby, since the antenna coil 4 and the bridge pattern 6 are firmly held, the reliability of electrical connection can be ensured.
- the antenna coil 4 and the bridge pattern 6 are welded by penetrating the laser beam L, it is possible to confirm whether or not the antenna coil 4 and the bridge pattern 6 are welded, so that it is easy to check a connection failure. It becomes.
- the IC inlet 10 mounts the integrated circuit 20 shown in FIGS. 1A and 1B after electrically connecting the antenna coil 4 and the connection terminal 5 and the bridge pattern 6 by the above-described method. It is desirable. In general, the integrated circuit 20 is more expensive than other members. Therefore, if the antenna coil 4 and the bridge pattern 6 are connected after the integrated circuit 20 is mounted, damage caused when a defective product due to poor connection occurs increases.
- FIG. 6A and 6B are explanatory diagrams of the information recording medium 100 having the IC inlet 10 described above.
- FIG. 6A is a plan view of the information recording medium 100.
- 6B is a cross-sectional view taken along line BB in FIG. 6A.
- the information recording medium 100 is formed by sandwiching the IC inlet 10 with protective members 110 and 120 and joining the protective members 110 and 120 in a laminated state.
- Examples of the protective members 110 and 120 include an insulating plastic film, or an insulating synthetic paper (polyolefin-based synthetic paper manufactured by PPG, trade name “Teslin” (registered trademark), or a polypropylene-based synthetic resin manufactured by YUPO Corporation). Paper trade name “YUPO” (registered trademark)) or the like is used.
- a polyester resin such as PET-G (non-crystalline PET copolymer) or a thermoplastic resin such as PVC (polyvinyl chloride) can be used.
- plastic film when used as the protective members 110 and 120, it is preferable to use a flexible plastic film. Moreover, it is preferable to use a plastic film forming material having a softening temperature lower than that of the substrate 11 forming the IC inlet 10.
- the thickness of the protective members 110 and 120 can be about 100 ⁇ m to about 1000 ⁇ m, for example.
- the thickness of the protective members 110 and 120 is more preferably in the range of about 100 ⁇ m to about 500 ⁇ m. Thereby, not only the function as a base material such as strength can be sufficiently exhibited, but also the protective members 110 and 120 can have sufficient flexibility and can be applied to a booklet-shaped application.
- the IC inlet 10 is sandwiched between the pair of protective members 110 and 120, and the IC inlet 10 and the protective members 110 and 120 are joined.
- one protective member 110 that is in contact with the integrated circuit mounting surface of the IC inlet 10 is formed with an opening that is one size larger than the outer shape of the integrated circuit at a position corresponding to the integrated circuit 20 included in the IC inlet 10 in advance. You may do it.
- an adhesive is used as the antenna sheet 1 of the IC inlet 10 or the antenna of the protective members 110 and 120. It is applied to the surface in contact with the sheet 1.
- an adhesive laminating method for bonding at a relatively low temperature of about 70 ° C. to 140 ° C. is used.
- EVA ethylene vinyl acetate resin
- EAA ethylene acrylic acid copolymer resin
- polyester type polyurethane type, or the like
- an adhesive sheet using a resin used for the above-described adhesive can be used by being sandwiched between the antenna sheet 1 and the protection members 110 and 120.
- the softening temperature of the protective members 110 and 120 is set as a joining method between the IC inlet 10 and the protective members 110 and 120 while applying pressure to both.
- a heat laminating method is used in which melt bonding is performed by heating to a temperature exceeding (eg, about 130 ° C. to 170 ° C.).
- the above-described adhesive may be used in combination in order to ensure fusion bonding.
- the softening temperature of the forming material is lower than the softening temperature of the forming material of the substrate 2. Therefore, when the protective members 110 and 120 and the IC inlet 10 are heated to about 130 ° C. to 170 ° C., the protective members 110 and 120 are softened, but the substrate 2 of the antenna sheet 1 is not softened. Accordingly, even when the IC inlet 10 provided with the antenna sheet 1 and the protective members 110 and 120 are laminated and bonded by the thermal laminating method, even if heat is applied to the substrate 2 of the antenna sheet 1, 2 can be prevented from plasticizing and flowing. Therefore, the movement of the antenna coil 4 due to the flow of the substrate 2 can be prevented, and the reliability of data communication can be improved.
- the antenna coil 4 is formed in a band shape (film shape) as described above. Is done. Therefore, the contact area between the antenna coil 4 and the substrate 2 is increased and the flow resistance of the antenna coil 4 can be increased as compared with the conventional wound antenna coil. Therefore, it is possible to prevent the antenna coil 4 from moving with the flow of the substrate 2 and improve the reliability of data communication.
- pressing is performed from one or both of the protective members 110 and 120 as necessary, and the IC inlet 10 and the protective members 110 and 120 are reliably bonded.
- the integrated protection members 110 and 120 and the IC inlet 10 are trimmed into a desired shape.
- the information recording medium 100 shown in FIGS. 6A and 6B can be manufactured.
- FIG. 7 is an explanatory diagram of a booklet that is an example of a data carrier with a non-contact type IC including the information recording medium 100 described above.
- an electronic passport will be described as an example of a booklet.
- the electronic passport 200 includes the information recording medium 100 described above as a cover.
- a cover material 201 serving as a cover of the electronic passport 200 is bonded to one surface.
- the appearance and texture of the electronic passport 200 provided with the information recording medium 100 can be made equivalent to those of a conventional passport.
- the information recording medium 100 can provide the electronic passport 200 with high productivity, which prevents the antenna coil from being disconnected.
- the shape of an antenna coil may not be a rectangle.
- the number of turns of the antenna coil is not limited to the above-described embodiment.
- the integrated circuit is arranged inside the antenna coil.
- the present invention is not limited to this, and the integrated circuit may be arranged outside the antenna coil.
- the press is performed so as to be sandwiched from both sides by the two heat press heads 30 (FIGS. 3A and 3B). It is good to do.
- the electronic passport has been described as an example of the non-contact type IC data carrier including the information recording medium 100.
- the present invention is not limited to this.
- electronic identification documents various activity history electronic confirmation documents Etc. can also be used.
- the information recording medium 100 can be applied to, for example, a card-type non-contact type IC data carrier such as an IC commuter pass or an electronic money card.
- a card-type non-contact type IC data carrier such as an IC commuter pass or an electronic money card.
- the antenna sheet provided in the IC inlet can prevent disconnection of an antenna coil such as a commuter pass with an IC or an electronic money card, improve the reliability of data communication, and improve the productivity.
- the resistance value between the antenna coil 4 and the bridge pattern 6 in the antenna sheet shown in FIG. As a comparative example, the resistance between the antenna coil 4 and the bridge pattern 6 in the antenna sheet 1 in the state where the antenna coil 4 and the bridge pattern 6 are only in contact without performing welding as shown in FIG. The value was measured. In this example, resistance values were measured for a plurality of test specimens, and an average value was adopted.
- the resistance value of the antenna sheet 1 according to the example of the present invention in which the antenna coil 4 and the bridge pattern 6 were laser-welded was 15.6 m ⁇ on average.
- the resistance value in the antenna sheet 1 in which the antenna coil 4 and the bridge pattern 6 are only in contact without performing laser welding was 18.6 m ⁇ on average.
- the antenna sheet 1 having the configuration according to the embodiment of the present invention it can be confirmed that the electrical resistance is lowered, and it is confirmed that the configuration according to the embodiment of the present invention is effective for solving the problem. It was.
- the present invention can be applied to an antenna sheet or the like that can prevent disconnection of the antenna to improve reliability, reduce electric resistance, and improve productivity.
- antenna sheet 1, 1A, 1B ... antenna sheet, 2 ... substrate, 4 ... antenna coil, 4a, 4b ... end of antenna coil, 6 ... bridge pattern, conductive member, 8 ... penetration Hole 10, IC inlet 20, integrated circuit (IC chip) 30 heat press head (pressing means) 110, 120 protection member 100 information recording medium 200 ... Electronic passport (data carrier with non-contact IC), H ... hole, L ... laser light
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Abstract
Description
本願は、2009年4月28日に、日本に出願された特願2009-109859号に基づき優先権を主張し、その内容をここに援用する。
この方法によれば、プレス工程において、アンテナコイルと導電部材とが挟持する基板は、押圧手段によって軟化温度以上に加熱されつつ押圧される。そのため、溶融した基板が押しのけられる。
この方法によれば、レーザー光を用いた溶接工程にて溶接を行うことにより、アンテナコイル及び/又は接続パターンと、導電部材とが溶接され強固に接続される。レーザー溶接は非接触加工であるために、加工治具の汚れや摩耗の影響が接合品質に影響する接触加工と異なり、品質の安定した接合状態を実現することができる。また、加工治具の交換が不要となるため、高い生産効率を実現することができる。
これにより、アンテナコイルと集積回路とが接続され、ICインレットを製造することができる。
この構成によれば、基板の両面に配置されたアンテナコイル及び/又は接続パターンと、導電部材とが物理的に強固に接続され、電気的にも信頼性の高い安定したアンテナシートとすることができる。
この構成によれば、信頼性の高いアンテナシートを提供することができる。
この構成によれば、アンテナコイル及び/又は前記接続パターンと、導電部材とが強固に接続されるため、電気的な接続の信頼性を確保することができる。
この構成によれば、アンテナコイル及び/又は前記接続パターンと、集積回路とが接続され、ICインレットを製造することができる。また、この構成によれば、信頼性の高いアンテナシートを有するICインレットを提供することができる。
この構成によれば、信頼性の高いアンテナシートを有する情報記録媒体を提供することができる。
この構成によれば、信頼性の高い非接触型IC付データキャリアを提供することができる。
図1A及び図1Bは、本実施形態のアンテナシート1およびICインレット10を示す平面図である。図1Aは、アンテナシート1およびICインレット10の一方の面を示す平面図である。図1Bは、アンテナシート1およびICインレット10の他方の面を示す平面図である。本実施形態のICインレット10は、アンテナシート1と、集積回路(ICチップ)20を有している。集積回路20は、アンテナシート1に実装されている。
以下の説明においては、アンテナシート1の集積回路20が実装された面を主面と称し、集積回路20が実装された面と反対の面を裏面と称する。
基板2は、平面視略矩形の形状をしている。
アンテナコイル4は、基板2の一方の面に設けられ、帯状の形状をしている。
接続端子5は、アンテナコイル4の内側に設けられアンテナコイル4の外側の端部と電気的に導通している。
ブリッジパターン6は、基板2に設けられた貫通孔8を介して、アンテナコイル4と接続端子5とを、基板2の他方の面で接続する。
基板2において、アンテナコイル4が設けられている面が、基板2の主面であり、アンテナシート1の主面である。
アンテナコイル4およびブリッジパターン6の厚みは、0.01~0.05mmとすることが望ましい。
本実施形態のアンテナシート1およびICインレット10は、以上のような構成となっている。
ヒートプレスヘッド30の先端が球面であると、基板2を押しのける領域(ヒートプレスヘッド30と基板2との接触部分)が点になり、レーザ光Lで溶接される箇所に厚く基板2が残り、アンテナコイル4とブリッジパターン6との接合が安定して行うことができない可能性がある。
ヒートプレスヘッド30の側面にテーパーが形成されているものを用いることによって、符号X(図3A)の方向に基板2を、押しのけ易くなる。また、ヒートプレスヘッド30を基板2から引き離す際に、ヒートプレスヘッド30の先端のエッジに基板2が引っ掛かることによって生じる力であって、アンテナコイル4とブリッジパターン6とを引き離す方向に掛かる力を軽減することができる。そのため、アンテナコイル4とブリッジパターン6との間のレーザー溶接による密着性を向上させることができる。
なお、ヒートプレスヘッド30のヘッドの径は、レーザー光Lの径に対して、1.0倍以上とすると良い。より好ましくは、ヒートプレスヘッド30のヘッド30の径は、レーザー光Lの径に対して、1.0~10倍とすると良い。更に好ましくは、ヒートプレスヘッド30のヘッドの径は、レーザー光Lの径に対して、5~7倍とすると良い。
本実施形態では、レーザー光Lの径を、0.3mmとし、ヒートプレスヘッド30のヘッドの径を、2.0mmとしている。なお、ヒートプレスヘッド30のヘッドの径と、レーザー光Lの径とを近づけることにより、物理的な強度を高めることができる。
以上のようにして、本実施形態のアンテナシート1Aを製造する。
アンテナコイル4とブリッジパターン6とを接触のみによって電気的に接続すると、ある程度の加圧がないと安定した接触抵抗は維持できず、接触面の酸化、腐食という問題が発生する可能性がある。
レーザー溶接を用いることにより、接続部分の抵抗値成分を無くし、溶接部分も含めた金属の導体抵抗のみとすることにより、接触という不安定要素を無くして、信頼性を確保することができる。
図6A及び図6Bは、上述のICインレット10を有する情報記録媒体100の説明図である。図6Aは、情報記録媒体100の平面図である。図6Bは、図6Aの線分B-Bにおける矢視断面図である。
次に、本実施形態の情報記録媒体(インレイ)100の製造方法について説明する。
まず、ICインレット10を一対の保護部材110,120の間に挟み込み、ICインレット10と保護部材110,120とを接合する。このとき、ICインレット10の集積回路実装面と接触する一方の保護部材110には、予めICインレット10が備える集積回路20に対応する位置に、集積回路の外形よりも一回り大きい開口部を形成しても良い。
以上により、図6Aおよび図6Bに示す情報記録媒体100を製造することができる。
図7は、上述の情報記録媒体100を備える非接触型IC付データキャリアの一例である冊子体の説明図である。ここでは、冊子体として電子パスポートを例に挙げて説明する。
また、上述した実施形態では、アンテナコイルの内側に、集積回路が配置された例を示しているが、これに限るものではなく、集積回路をアンテナコイルの外側に配置してもよい。
Claims (11)
- 熱可塑性樹脂を形成材料とする基板の一方の面に設けられ金属材料を形成材料とするアンテナコイル及び/又は接続パターンと、前記基板の他方の面に設けられた金属材料を形成材料とする導電部材との重なり部分を、押圧手段を用いて、前記基板の少なくとも一方の面から押圧するプレス工程と、
前記アンテナコイル及び/又は前記接続パターンと、前記導電部材との重なり部分を溶接する溶接工程と、
を有するアンテナシートの製造方法。 - 前記プレス工程において、前記アンテナコイル及び/又は前記接続パターンと、前記導電部材との重なり部分を、前記基板の形成材料の軟化温度以上に加熱した押圧手段を用いて、押圧する請求項1に記載のアンテナシートの製造方法。
- 前記溶接工程において、前記押圧手段による押圧部分にレーザー光を照射し、前記アンテナコイル及び/又は前記接続パターンと前記導電部材とを溶接する請求項1に記載のアンテナシートの製造方法。
- 前記溶接工程において、前記レーザー光を照射する箇所に孔を形成する請求項3に記載のアンテナシートの製造方法。
- 前記アンテナコイルと集積回路とを接続する実装工程を更に有する請求項1に記載のアンテナシートの製造方法。
- 基板と、
前記基板の一方の面にらせん状に形成された帯状のアンテナコイルと、
前記基板の他方の面において前記アンテナコイルと交差する方向に延在し、前記アンテナコイルの両端部のうちいずれか一方の端部と平面的に重なって設けられた導電部材と、を有し、
前記導電部材と、前記アンテナコイルの一端及び/又は接続パターンとの接触部分の少なくとも一部は、溶接されているアンテナシート。 - 前記導電部材と、前記アンテナコイルの一端及び/又は前記接続パターンは、前記基板に設けられた貫通孔を覆って前記貫通孔の内壁で互いに接触している請求項6に記載のアンテナシート。
- 前記導電部材と、前記アンテナコイルの一端及び/又は前記接続パターンとの溶接部分には、互いを貫通する孔が形成され、
前記孔の内壁で前記導電部材と、前記アンテナコイル及び/又は前記接続パターンとが溶融している請求項6に記載のアンテナシート。 - 前記アンテナシートの前記アンテナコイルが設けられた面において、集積回路は、前記アンテナコイル及び/又は前記接続パターンに接続される請求項6に記載のアンテナシート。
- 前記アンテナコイル及び前記集積回路を覆う保護部材を更に有する請求項9に記載のアンテナシート。
- 基板と、
前記基板の一方の面にらせん状に形成された帯状のアンテナコイルと、
前記基板の他方の面において前記アンテナコイルと交差する方向に延在し、前記アンテナコイルの両端部のうちいずれか一方の端部と平面的に重なって設けられた導電部材と、
前記アンテナシートの前記アンテナコイルが設けられた面において、前記アンテナコイルに接続される集積回路と、
前記アンテナコイル及び前記集積回路を覆う保護部材とを有し、
前記導電部材と、前記アンテナコイルの一端及び/又は接続パターンとの接触部分の少なくとも一部は、溶接されている非接触型IC付データキャリア。
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
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CN201080018548.9A CN102414700B (zh) | 2009-04-28 | 2010-04-28 | 天线片、带非接触式ic的数据载体及天线片的制造方法 |
KR1020137003902A KR101320145B1 (ko) | 2009-04-28 | 2010-04-28 | 안테나 시트의 제조 방법 |
ES10769518.1T ES2538101T3 (es) | 2009-04-28 | 2010-04-28 | Hoja de antena, soporte de datos con CI sin contacto, y método para producir una hoja de antena |
EP10769518.1A EP2426626B1 (en) | 2009-04-28 | 2010-04-28 | Antenna sheet, data carrier with non-contact ic, and method for producing antenna sheet |
AU2010243050A AU2010243050B2 (en) | 2009-04-28 | 2010-04-28 | Antenna sheet, data carrier with non-contact IC, and method for manufacturing antenna sheet |
EP15151657.2A EP2889811B1 (en) | 2009-04-28 | 2010-04-28 | Antenna sheet, data carrier with non-contact IC, and method for manufacturing antenna sheet |
CA2759688A CA2759688C (en) | 2009-04-28 | 2010-04-28 | Antenna sheet, data carrier with non-contact ic, and method for manufacturing antenna sheet |
US13/138,918 US9183488B2 (en) | 2009-04-28 | 2010-04-28 | Antenna sheet, data carrier with non-contact IC, and method for manufacturing antenna sheet |
JP2011511320A JP5605358B2 (ja) | 2009-04-28 | 2010-04-28 | アンテナシート、非接触型ic付データキャリア |
KR1020117025684A KR101283727B1 (ko) | 2009-04-28 | 2010-04-28 | 안테나 시트, 비접촉형 ic가 부착된 데이터 캐리어 및 안테나 시트의 제조 방법 |
HK12106936.0A HK1166403A1 (en) | 2009-04-28 | 2012-07-16 | Antenna sheet, data carrier with non-contact ic, and method for producing antenna sheet ic |
US14/753,843 US9436905B2 (en) | 2009-04-28 | 2015-06-29 | Method for manufacturing antenna sheet |
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US13/138,918 A-371-Of-International US9183488B2 (en) | 2009-04-28 | 2010-04-28 | Antenna sheet, data carrier with non-contact IC, and method for manufacturing antenna sheet |
US14/753,843 Division US9436905B2 (en) | 2009-04-28 | 2015-06-29 | Method for manufacturing antenna sheet |
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PCT/JP2010/003060 WO2010125818A1 (ja) | 2009-04-28 | 2010-04-28 | アンテナシート、非接触型ic付データキャリア及びアンテナシートの製造方法 |
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EP (2) | EP2426626B1 (ja) |
JP (2) | JP5605358B2 (ja) |
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CN (1) | CN102414700B (ja) |
AU (1) | AU2010243050B2 (ja) |
CA (1) | CA2759688C (ja) |
ES (2) | ES2538101T3 (ja) |
HK (1) | HK1166403A1 (ja) |
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WO2019175995A1 (ja) * | 2018-03-14 | 2019-09-19 | 凸版印刷株式会社 | ループアンテナ、ループアンテナユニット、及び電子機器 |
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JP2010271804A (ja) * | 2009-05-20 | 2010-12-02 | Toyo Aluminium Kk | Icカード・タグ用アンテナ回路構成体とその製造方法 |
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WO2019175995A1 (ja) * | 2018-03-14 | 2019-09-19 | 凸版印刷株式会社 | ループアンテナ、ループアンテナユニット、及び電子機器 |
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Also Published As
Publication number | Publication date |
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CN102414700A (zh) | 2012-04-11 |
AU2010243050B2 (en) | 2014-09-11 |
JP2014220016A (ja) | 2014-11-20 |
CA2759688C (en) | 2016-01-19 |
KR20120003476A (ko) | 2012-01-10 |
CA2759688A1 (en) | 2010-11-04 |
KR20130025443A (ko) | 2013-03-11 |
JP5804163B2 (ja) | 2015-11-04 |
ES2538101T3 (es) | 2015-06-17 |
TWI463737B (zh) | 2014-12-01 |
CN102414700B (zh) | 2014-10-15 |
EP2426626A1 (en) | 2012-03-07 |
EP2889811A1 (en) | 2015-07-01 |
EP2889811B1 (en) | 2020-04-15 |
KR101283727B1 (ko) | 2013-07-08 |
US20150302291A1 (en) | 2015-10-22 |
ES2805059T3 (es) | 2021-02-10 |
AU2010243050A1 (en) | 2011-12-01 |
KR101320145B1 (ko) | 2013-10-23 |
JP5605358B2 (ja) | 2014-10-15 |
US9436905B2 (en) | 2016-09-06 |
US9183488B2 (en) | 2015-11-10 |
EP2426626A4 (en) | 2012-12-05 |
EP2426626B1 (en) | 2015-03-04 |
US20120043386A1 (en) | 2012-02-23 |
JPWO2010125818A1 (ja) | 2012-10-25 |
TW201101582A (en) | 2011-01-01 |
HK1166403A1 (en) | 2012-10-26 |
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