HK1166403A1 - Antenna sheet, data carrier with non-contact ic, and method for producing antenna sheet ic - Google Patents
Antenna sheet, data carrier with non-contact ic, and method for producing antenna sheet icInfo
- Publication number
- HK1166403A1 HK1166403A1 HK12106936.0A HK12106936A HK1166403A1 HK 1166403 A1 HK1166403 A1 HK 1166403A1 HK 12106936 A HK12106936 A HK 12106936A HK 1166403 A1 HK1166403 A1 HK 1166403A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- antenna sheet
- contact
- data carrier
- producing
- sheet
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009109859 | 2009-04-28 | ||
PCT/JP2010/003060 WO2010125818A1 (ja) | 2009-04-28 | 2010-04-28 | アンテナシート、非接触型ic付データキャリア及びアンテナシートの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1166403A1 true HK1166403A1 (en) | 2012-10-26 |
Family
ID=43031974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12106936.0A HK1166403A1 (en) | 2009-04-28 | 2012-07-16 | Antenna sheet, data carrier with non-contact ic, and method for producing antenna sheet ic |
Country Status (11)
Country | Link |
---|---|
US (2) | US9183488B2 (ja) |
EP (2) | EP2426626B1 (ja) |
JP (2) | JP5605358B2 (ja) |
KR (2) | KR101320145B1 (ja) |
CN (1) | CN102414700B (ja) |
AU (1) | AU2010243050B2 (ja) |
CA (1) | CA2759688C (ja) |
ES (2) | ES2538101T3 (ja) |
HK (1) | HK1166403A1 (ja) |
TW (1) | TWI463737B (ja) |
WO (1) | WO2010125818A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010271804A (ja) * | 2009-05-20 | 2010-12-02 | Toyo Aluminium Kk | Icカード・タグ用アンテナ回路構成体とその製造方法 |
JP2010271803A (ja) * | 2009-05-20 | 2010-12-02 | Toyo Aluminium Kk | Icカード・タグ用アンテナ回路構成体とその製造方法 |
DE102009023715A1 (de) * | 2009-06-03 | 2010-12-09 | Leonhard Kurz Stiftung & Co. Kg | Sicherheitsdokument |
JP5397423B2 (ja) * | 2011-07-01 | 2014-01-22 | コニカミノルタ株式会社 | 非接触情報記録媒体の製造方法 |
DE102012001345A1 (de) * | 2012-01-24 | 2013-07-25 | Giesecke & Devrient Gmbh | Verfahren zum Herstellen eines Datenträgers |
FR3013152A1 (fr) * | 2013-11-14 | 2015-05-15 | Smart Packaging Solutions | Antenne double face pour carte a puce |
JP6643213B2 (ja) * | 2016-09-16 | 2020-02-12 | 新光電気工業株式会社 | リードフレーム及びその製造方法と電子部品装置 |
JP6998513B2 (ja) * | 2017-01-31 | 2022-01-18 | パナソニックIpマネジメント株式会社 | 接合構造 |
CN108629393A (zh) * | 2017-03-17 | 2018-10-09 | 苏州昭舜物联科技有限公司 | Rfid高频铝天线低温软钎焊接搭桥工艺 |
FR3065663B1 (fr) * | 2017-04-28 | 2019-06-28 | Faurecia Automotive Composites | Procede d'assemblage de deux pieces de materiaux differents et ensemble issu du procede d'assemblage |
CN107658117A (zh) * | 2017-09-30 | 2018-02-02 | 麦格磁电科技(珠海)有限公司 | 一种无线充电线圈及其制作方法 |
DE102018105383B4 (de) | 2018-03-08 | 2021-12-30 | Infineon Technologies Ag | Antennenmodul, Antennenvorrichtung und Verfahren zum Herstellen eines Antennenmoduls |
KR102426955B1 (ko) * | 2018-03-14 | 2022-08-01 | 도판 인사츠 가부시키가이샤 | 루프 안테나, 루프 안테나 유닛, 및 전자 기기 |
CN109216266B (zh) * | 2018-09-10 | 2020-09-01 | 华南理工大学 | 过孔的制作方法、阵列基板的制作方法及阵列基板 |
KR102129590B1 (ko) * | 2019-06-13 | 2020-07-02 | 신혜중 | 하이브리드형 무선충전용 수신안테나 장치 및 그 제조방법 |
KR102512387B1 (ko) * | 2019-06-13 | 2023-03-22 | 신혜중 | 하이브리드형 무선충전용 수신안테나 장치 및 그 제조방법 |
CN112530928B (zh) * | 2019-12-12 | 2024-01-19 | 友达光电股份有限公司 | 天线装置及其制造方法 |
KR20210099464A (ko) * | 2020-02-04 | 2021-08-12 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 코일 조립체 및 코일을 기판에 접속시키는 방법 |
JP7539311B2 (ja) | 2020-12-22 | 2024-08-23 | 富士フイルム株式会社 | 非接触式通信媒体 |
DE102021134004B3 (de) * | 2021-12-21 | 2023-01-12 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung eines Folienverbunds, Folienverbund und leistungselektronische Schalteinrichtung hiermit |
WO2024167194A1 (ko) * | 2023-02-09 | 2024-08-15 | 주식회사 아모텍 | 안테나 모듈 및 이의 제조 방법 |
WO2024167192A1 (ko) * | 2023-02-09 | 2024-08-15 | 주식회사 아모텍 | 안테나 모듈 및 이의 제조 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4627565A (en) * | 1982-03-18 | 1986-12-09 | Lomerson Robert B | Mechanical bonding of surface conductive layers |
DE19522338B4 (de) * | 1995-06-20 | 2006-12-07 | Pac Tech-Packaging Technologies Gmbh | Chipträgeranordnung mit einer Durchkontaktierung |
DE19618100A1 (de) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen |
US6073856A (en) * | 1997-09-05 | 2000-06-13 | Dai Nippon Printing Co., Ltd. | Noncontact IC device |
US6841419B2 (en) | 2000-04-04 | 2005-01-11 | Toray Engineering Company, Limited | Method of fabricating a COF utilizing a tapered IC chip and chip mounting hole |
JP3634774B2 (ja) | 2001-06-08 | 2005-03-30 | 東洋アルミニウム株式会社 | Icカード用アンテナコイル |
JP2003044810A (ja) | 2001-07-30 | 2003-02-14 | Oji Paper Co Ltd | Ic実装体 |
JP2003069294A (ja) * | 2001-08-24 | 2003-03-07 | Oji Paper Co Ltd | Icチップの実装装置 |
KR20030076274A (ko) * | 2002-03-18 | 2003-09-26 | 도레 엔지니아린구 가부시키가이샤 | 비접촉 아이디 카드류 및 그 제조방법 |
US20040201525A1 (en) * | 2003-04-08 | 2004-10-14 | Bateman Blaine R. | Antenna arrays and methods of making the same |
WO2007055142A1 (en) * | 2005-11-11 | 2007-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device |
JP4728861B2 (ja) * | 2006-02-09 | 2011-07-20 | 財団法人電力中央研究所 | 磁気粘性流体ダンパ |
JP3883565B1 (ja) * | 2006-02-28 | 2007-02-21 | Tdk株式会社 | チップアンテナ |
JP2007323386A (ja) * | 2006-06-01 | 2007-12-13 | Canon Inc | 非接触タグ |
JP2008015968A (ja) * | 2006-07-10 | 2008-01-24 | Dainippon Printing Co Ltd | 非接触型データキャリア用導電部材とその製造方法及び装置 |
JP2008269161A (ja) | 2007-04-18 | 2008-11-06 | Toyo Aluminium Kk | Icカード・タグ用アンテナ回路構成体とその製造方法 |
KR101237107B1 (ko) * | 2007-09-14 | 2013-02-25 | 도판 인사츠 가부시키가이샤 | 안테나 시트, 트랜스폰더 및 책자체 |
JP5035537B2 (ja) | 2007-10-31 | 2012-09-26 | 大日本印刷株式会社 | 階調マスクの欠陥修正方法および階調マスク |
-
2010
- 2010-04-28 ES ES10769518.1T patent/ES2538101T3/es active Active
- 2010-04-28 KR KR1020137003902A patent/KR101320145B1/ko active IP Right Grant
- 2010-04-28 CA CA2759688A patent/CA2759688C/en active Active
- 2010-04-28 ES ES15151657T patent/ES2805059T3/es active Active
- 2010-04-28 KR KR1020117025684A patent/KR101283727B1/ko active IP Right Grant
- 2010-04-28 EP EP10769518.1A patent/EP2426626B1/en active Active
- 2010-04-28 CN CN201080018548.9A patent/CN102414700B/zh not_active Expired - Fee Related
- 2010-04-28 JP JP2011511320A patent/JP5605358B2/ja active Active
- 2010-04-28 US US13/138,918 patent/US9183488B2/en active Active
- 2010-04-28 TW TW099113408A patent/TWI463737B/zh not_active IP Right Cessation
- 2010-04-28 WO PCT/JP2010/003060 patent/WO2010125818A1/ja active Application Filing
- 2010-04-28 EP EP15151657.2A patent/EP2889811B1/en active Active
- 2010-04-28 AU AU2010243050A patent/AU2010243050B2/en active Active
-
2012
- 2012-07-16 HK HK12106936.0A patent/HK1166403A1/xx not_active IP Right Cessation
-
2014
- 2014-08-28 JP JP2014174471A patent/JP5804163B2/ja active Active
-
2015
- 2015-06-29 US US14/753,843 patent/US9436905B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2889811B1 (en) | 2020-04-15 |
WO2010125818A1 (ja) | 2010-11-04 |
JPWO2010125818A1 (ja) | 2012-10-25 |
JP5605358B2 (ja) | 2014-10-15 |
US9436905B2 (en) | 2016-09-06 |
ES2538101T3 (es) | 2015-06-17 |
TWI463737B (zh) | 2014-12-01 |
US9183488B2 (en) | 2015-11-10 |
CA2759688C (en) | 2016-01-19 |
KR101283727B1 (ko) | 2013-07-08 |
CA2759688A1 (en) | 2010-11-04 |
EP2426626A1 (en) | 2012-03-07 |
JP5804163B2 (ja) | 2015-11-04 |
KR20120003476A (ko) | 2012-01-10 |
CN102414700A (zh) | 2012-04-11 |
EP2426626A4 (en) | 2012-12-05 |
EP2889811A1 (en) | 2015-07-01 |
US20150302291A1 (en) | 2015-10-22 |
CN102414700B (zh) | 2014-10-15 |
AU2010243050B2 (en) | 2014-09-11 |
TW201101582A (en) | 2011-01-01 |
US20120043386A1 (en) | 2012-02-23 |
EP2426626B1 (en) | 2015-03-04 |
AU2010243050A1 (en) | 2011-12-01 |
ES2805059T3 (es) | 2021-02-10 |
KR20130025443A (ko) | 2013-03-11 |
KR101320145B1 (ko) | 2013-10-23 |
JP2014220016A (ja) | 2014-11-20 |
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