WO2010123004A1 - 真空蒸着システム及び真空蒸着方法 - Google Patents
真空蒸着システム及び真空蒸着方法 Download PDFInfo
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- WO2010123004A1 WO2010123004A1 PCT/JP2010/057011 JP2010057011W WO2010123004A1 WO 2010123004 A1 WO2010123004 A1 WO 2010123004A1 JP 2010057011 W JP2010057011 W JP 2010057011W WO 2010123004 A1 WO2010123004 A1 WO 2010123004A1
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- Prior art keywords
- evaporation
- chamber
- vacuum deposition
- substrate
- vacuum
- Prior art date
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- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims abstract description 201
- 238000001704 evaporation Methods 0.000 claims abstract description 152
- 230000008020 evaporation Effects 0.000 claims abstract description 132
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 238000007740 vapor deposition Methods 0.000 claims abstract description 37
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 238000000151 deposition Methods 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 238000002360 preparation method Methods 0.000 claims description 13
- 238000007738 vacuum evaporation Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 1
- 239000012080 ambient air Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 21
- 238000005019 vapor deposition process Methods 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002001 electrolyte material Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011244 liquid electrolyte Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1395—Processes of manufacture of electrodes based on metals, Si or alloys
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present invention relates to a technique for manufacturing a lithium secondary battery using a solid electrolyte, and more particularly to a technique for forming a negative electrode layer by vacuum deposition.
- lithium ion secondary batteries have been widely known as power sources for mobile phones and personal computers.
- a lithium ion secondary battery uses a liquid electrolyte, liquid leakage, ignition, etc. may occur, and there are safety issues.
- an all-solid-state lithium secondary battery using a solid material as an electrolyte material has been proposed, and its development is progressing.
- an all-solid-state lithium secondary battery using a solid material an all-solid-type lithium secondary battery including a thin film is expected as a power source for a card-type electronic component or the like.
- an all-solid-state lithium secondary battery made of a thin film forms a negative electrode made of lithium (Li) by vacuum vapor deposition.
- lithium is a material that reacts very easily with water and air, When bringing the evaporating material into the vapor deposition chamber, it is necessary to pay sufficient attention to the atmosphere of the transfer path.
- the present invention has been made in view of the problems of the prior art as described above.
- the object of the present invention is to improve the film thickness and film quality when highly reactive lithium is continuously formed by vacuum deposition.
- An object of the present invention is to provide a technique capable of efficiently forming a uniform film with an apparatus having a simple configuration.
- the present invention has been made to solve the above problems, a vacuum vapor deposition chamber for depositing an evaporation material on a substrate by vapor deposition, a substrate connected to the vacuum vapor deposition chamber, the substrate being supplied between the vacuum vapor deposition chamber, and A substrate supply exchange system for exchanging, and a material supply exchange system for supplying and exchanging the evaporation material to and from the vacuum deposition chamber.
- a material preparation area in which the evaporation material is disposed in the evaporation container and an evaporation container transfer area in which the evaporation container is transferred between the vacuum evaporation chamber are provided in an atmosphere blocked against the vacuum evaporation.
- the material supply exchange system is connected to the material charging chamber for disposing the evaporation material in the evaporation container in a dry atmosphere cut off from the atmosphere, and connected to the material charging chamber, and This is also effective in the case of having a material supply exchange chamber for supplying and exchanging the evaporating material with a vacuum deposition chamber.
- the heating means is also effective when it is a lamp heating type heater.
- the present invention is a vacuum deposition method using any one of the above vacuum deposition systems, the step of arranging a predetermined amount of evaporation material in the evaporation container in the material charging region, and from the material charging region A step of conveying the evaporation container and carrying it into the vacuum deposition chamber and supplying the evaporation material; a step of heating the evaporation container in the vacuum deposition chamber to perform vacuum deposition on the substrate; and the end of the vacuum deposition And a step of discharging the evaporation container from the vacuum deposition chamber and returning it to the material charging region of the material supply exchange system.
- the present invention is also effective when supplying and exchanging the evaporating material by transporting the container transport member using a container transport member to which a plurality of the evaporation containers can be detachably attached.
- the present invention is most effective when the evaporating material is made of lithium.
- the substrate is connected to the vacuum deposition chamber, the substrate is supplied to and exchanged with the vacuum deposition chamber, and the evaporation material is supplied between the vacuum deposition chamber.
- a material supply exchange system for exchanging and the material supply exchange system has a material charging region for arranging the evaporation material in the evaporation container in a dry atmosphere cut off from the atmosphere. Since an evaporation container transport mechanism is provided for transporting the evaporation container to and from the vacuum deposition chamber, when the highly reactive lithium evaporation material is carried into the vacuum deposition chamber, the evaporation container is evacuated after completion of the deposition. When returning from the vapor deposition chamber to the material supply exchange system, it is possible to prevent moisture or the like from adhering to the evaporation material or the evaporation container and deteriorating the evaporation material.
- heating means for heating the evaporation container supplied from the material supply exchange system is provided in the vacuum evaporation chamber, and the evaporation container is heated to perform vacuum evaporation on the substrate.
- the evaporation material can be heated rapidly, and the evaporation container can be rapidly cooled after the deposition is completed.
- the evaporation material can be used up in the evaporation, so a shutter or a film thickness monitor is used. Therefore, a film having a desired film thickness can be formed with an apparatus having a simple configuration. In addition, it is possible to reliably prevent deterioration of the lithium evaporating material due to change with time and change in atmosphere.
- a plurality of evaporating containers can be provided by using a container transporting member to which a plurality of evaporating containers can be detachably attached and transporting the container transporting member to supply and replace the evaporating material Since the evaporation material can be supplied and exchanged in a batch, the efficiency of each process can be greatly improved.
- a film having a uniform film thickness and film quality can be efficiently formed with an apparatus having a simple configuration.
- FIG. ) Schematic configuration front view of an embodiment of a vacuum deposition system according to the present invention
- A Plan view of a tray body showing an example of a material transport tray used in the embodiment
- FIG. 1 is a schematic front view of an embodiment of a vacuum deposition system according to the present invention.
- the vacuum vapor deposition system 1 of this Embodiment has the vacuum vapor deposition chamber 2 connected to the vacuum exhaust system which is not shown in figure.
- the vacuum vapor deposition chamber 2 is configured to introduce, for example, an argon (Ar) gas that is a rare gas.
- a substrate holder 20 that holds the substrate 50 is provided in the upper portion of the vacuum deposition chamber 2.
- the substrate holder 20 is configured to rotate in a state in which the substrate 50 is directed in the horizontal direction by a drive motor 21 provided at the upper part of the vacuum vapor deposition chamber 2, for example.
- a heater (heating means) 22 for heating the evaporation material 10 accommodated in the evaporation container 7 described later is disposed in the lower part of the vacuum vapor deposition chamber 2.
- the evaporating container 7 containing the evaporating material 10 is configured to be indirectly heated at a predetermined distance.
- the substrate 50 is supplied to and exchanged with the substrate 50 in the vacuum deposition chamber 2, and the evaporation material 10 is supplied to the vacuum deposition chamber 2.
- the material supply exchange system 4 for supplying and exchanging them is connected.
- the substrate supply exchange system 3 has a substrate transfer chamber 31 connected to the vacuum deposition chamber 2 via a gate valve 30.
- the substrate transfer chamber 31 is formed in a vertically long shape, for example, and is connected to a vacuum exhaust system (not shown).
- a substrate transfer robot 32 that can place the substrate 50 and move up and down is disposed.
- the substrate preparation chamber 34 is connected to the upper portion of the substrate transfer chamber 31 via the gate valve 33, and further, for example, the substrate take-out chamber is connected to the lower portion of the substrate transfer chamber 31 via the gate valve 35. 36 is connected.
- the substrate preparation chamber 34 and the substrate take-out chamber 36 are each connected to a vacuum exhaust system (not shown).
- the material supply exchange system 4 has a material exchange chamber 43 connected to the vacuum deposition chamber 2 via a gate valve 40.
- the material exchange chamber 43 is connected to a vacuum exhaust system (not shown) and is divided into a first material exchange chamber 41 and a second material exchange chamber 42.
- the material exchange chamber 43 is configured to introduce, for example, argon (Ar) gas.
- a tray transfer robot 44 for supplying and exchanging the material transfer tray (container transfer member) 6 is provided in the first material exchange chamber 41 adjacent to the vacuum deposition chamber 2.
- the second material exchange chamber 42 is connected to a material charging chamber (material charging region) 45 described later via a gate valve 46.
- FIG. 2 (a) to 2 (c) show examples of the material transport tray used in the present embodiment.
- FIG. 2 (a) is a plan view of the tray body
- FIG. 2 (b) is a view of the tray body.
- FIG. 2C is a plan view showing a state in which the evaporation container is mounted
- FIG. 2C is a cross-sectional view taken along line AA in FIG.
- the material carrying tray 6 of the present embodiment has a tray body 60 made of, for example, a flat plate member.
- the tray body 60 As a material of the tray body 60, for example, an inorganic material such as quartz glass, a metal material such as stainless steel, a carbon material, or the like can be used.
- the tray main body 60 is provided with a plurality of circular mounting holes 61 for mounting the evaporation container (boat) 7 so as to penetrate the tray main body 60.
- the evaporation container 7 is made of a metal material such as stainless steel, and has a substantially cup-shaped (bottomed cylindrical shape) body portion 70, and at the edge of the opening portion of the body portion 70.
- a ring-shaped flange portion 71 is provided.
- the body portion 70 of the evaporation container 7 has an outer diameter slightly smaller than the mounting hole 61 of the tray main body 60, and the flange portion 71 is formed to have an outer diameter slightly larger than the mounting hole 61 of the tray main body 60. Has been.
- each evaporation container 7 is positioned at a predetermined position.
- the evaporating material 10 is inserted and arranged in a state where each evaporating container 7 is mounted on the tray main body 60. The material 10 is conveyed together with the tray main body 60 in a state of being accommodated in each evaporation container 7.
- the supply of the evaporation material 10 to the material transport tray 6 is performed in the material preparation chamber 45 described above (see FIG. 1).
- the material charging chamber 45 is composed of a glove box that can be manually operated. By introducing, for example, argon (Ar) gas into the material charging chamber 45, the dew point temperature in the chamber is maintained at about ⁇ 50 ° C. to ⁇ 60 ° C., and a dry atmosphere cut off from the atmosphere is maintained. It is like that.
- the evaporation material 10 made of lithium having a predetermined size and shape (for example, particle shape) is inserted into the evaporation container 7 attached to the tray body 60 by hand, for example, one by one. .
- the amount of the evaporating material 10 accommodated in each evaporating container 7 is not particularly limited, but from the viewpoint of preventing the film thickness and film quality from changing due to changes over time, etc., once. It is preferable to set the amount to be evaporated by the vapor deposition step.
- the amount of the evaporation material 10 accommodated in each evaporation container 7 can be appropriately changed depending on the size of the substrate, the position of the evaporation container 7 in the tray body 60, and the like.
- a plurality of material transport trays 6 in which the evaporation material 10 is accommodated in each evaporation container 7 are mounted in the material supply cassette 8 and stored in the material charging chamber 45.
- a material cassette raising / lowering mechanism 47 for raising and lowering the material supply cassette 8 is provided in the lower part of the second material exchange chamber 42.
- the material cassette raising / lowering mechanism 47 has a stage 47a that is driven in the vertical direction by a drive motor 48 provided at the lower part of the second material exchange chamber 42, for example, and supports, for example, one material supply cassette 8 placed thereon. In this state, the stage 47a is moved up and down.
- 3 to 6 are explanatory diagrams showing an example of the vapor deposition process in the present embodiment.
- the substrate 50 carried into the substrate transfer chamber 31 via the substrate preparation chamber 34, The substrate is transferred into the vacuum deposition chamber 2 by the substrate transfer robot 32 and mounted on the substrate holder 20.
- the material supply cassette 8 in which the evaporation material 10 is previously mounted on the material transport tray 6 is manually carried into the second material exchange chamber 42. Then, using the tray transfer robot 44, one material transfer tray 6 at a predetermined position (here, the uppermost stage) is carried into the vacuum vapor deposition chamber 2 via the first material exchange chamber 41, and this material transfer tray 6 Is positioned at a predetermined film formation position in the vacuum vapor deposition chamber 2, for example, a position above the heater 22 and away from the heater.
- the pressure in the vacuum vapor deposition chamber 2 is adjusted to a predetermined value, and the heater 22 is operated to heat the evaporation material 10 through the evaporation container 7 as shown in FIG. All of the evaporation material 10 in the evaporation container 7 is evaporated to form a lithium layer on the substrate 50.
- vapor deposition is performed while operating the drive motor 21 and rotating the substrate 50 in the horizontal direction.
- the substrate 50 to be vapor-deposited next is carried into the substrate preparation chamber 34 in advance during vapor deposition.
- the evaporating material 10 is inserted into the evaporating container 7 attached to the tray body 60 in the material charging chamber 45. It is preferable to perform the work as necessary.
- the substrate 50 detached from the substrate holder 20 is carried into the substrate transfer chamber 31 by the substrate transfer robot 32 as shown in FIG. Further, the substrate transfer robot 32 is lowered, the substrate 50 is carried into the substrate take-out chamber 36 via the gate valve 35, and the substrate 50 is discharged from the substrate take-out chamber 36 using a substrate transfer robot (not shown).
- the material transport tray 6 that has used up the evaporated material 10 is carried into the second material exchange chamber 42 from the vacuum vapor deposition chamber 2 via the first material exchange chamber 41 by the tray transport robot 44, and the material supply cassette.
- the substrate transfer robot 32 is raised in the substrate transfer chamber 31, and the substrate 50 in the substrate preparation chamber 34 is transferred into the vacuum deposition chamber 2 by the substrate transfer robot 32, and the substrate holder Attach to 20.
- the drive motor 48 is operated to raise the cassette lifting / lowering mechanism 47 in the second material exchange chamber 42, and for example, the middle material transport tray 6 of the material supply cassette 8 is moved to the first material transport cassette 6 using the tray transport robot 44.
- the material is transferred into the vacuum vapor deposition chamber 2 through the material exchange chamber 41, and the material transport tray 6 is positioned at a film formation position in the vacuum vapor deposition chamber 2, for example, a film formation position above the heater 22.
- the heater 22 is operated to heat the evaporation material 10 through the evaporation container 7, and all the evaporation material 10 in each evaporation container 7 is evaporated to be on the substrate 50. Li layer is formed.
- the above-described steps are repeated. That is, the substrate 50 that has been deposited is carried into the substrate take-out chamber 36 by the substrate carrying robot 32 through the substrate carrying chamber 31, and the substrate 50 is discharged from the substrate take-out chamber 36.
- the material transport tray 6 after the vapor deposition is carried into the second material exchange chamber 42 from the vacuum vapor deposition chamber 2 via the first material exchange chamber 41 by the tray transport robot 44, and the material supply cassette 8 is loaded. Attach to the position. Thereafter, when all of the evaporation material 10 in the material transport tray 6 of the material supply cassette 8 in the second material exchange chamber 42 is used up, the material supply cassette 8 is manually returned to the material preparation chamber 45 to supply a new material. The cassette 8 is manually carried into the second material exchange chamber 42.
- the substrate 50 is connected to the vacuum deposition chamber 2, the substrate 50 is supplied to and exchanged with the vacuum deposition chamber 2, and the evaporation material 10 is supplied to the vacuum deposition chamber 2.
- a material supply exchange system 4 for supplying and exchanging the material to and from the material, and the material supply exchange system 4 is an evaporation material in the evaporation container 7 in a dry atmosphere cut off from the atmosphere.
- a material preparation area material preparation chamber 45
- a tray transfer robot 44 for transferring the evaporation container 7 to and from the vacuum deposition chamber 2 is provided.
- the vacuum deposition chamber 2 is provided with the heater 22 for heating the evaporation container 7 supplied from the material supply exchange system 4.
- the evaporation material 10 can be rapidly heated, and the evaporation container 7 can be rapidly cooled after the evaporation is completed.
- the evaporation material 10 can be used up in the evaporation, so that the shutter or the film A film having a desired film thickness can be formed with an apparatus having a simple configuration without using a thickness monitor.
- the process of returning the evaporation container 7 to the material charging chamber 45 is repeated, whereby the inside of the vacuum deposition chamber 2 is changed.
- the evaporation material 10 can be supplied in a high vacuum state.
- a material transport tray 6 to which a plurality of evaporation containers 7 can be detachably attached is used, and the evaporation material 10 is supplied and exchanged by transporting the material transport tray 6.
- the evaporating container 7 can be transported collectively to supply and replace the evaporating material 10, and the efficiency of each process can be greatly improved.
- the present invention is not limited to the above-described embodiment, and various changes can be made.
- the evaporating container 7 is mounted on the material transport tray 6 to supply and replace the evaporating material 10, but the present invention is not limited to this.
- a transport robot or the like is used. It is also possible to supply and exchange a plurality of evaporation containers 7.
- each chamber in the above embodiment is an example, and can be appropriately changed according to a required process.
- the material supply exchange system can be configured as one large chamber.
- the present invention can be applied to substrates of various materials, shapes, and sizes, such as silicon substrates, ceramic substrates, heat resistant resin substrates, mica substrates, and the like. Furthermore, although the present invention can be applied to materials other than lithium, it is most effective for a technique for manufacturing a lithium secondary battery using lithium for the negative electrode.
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Abstract
Description
しかし、リチウムイオン二次電池は、液体電解質を用いているため、液漏れや発火等が発生する場合があり、安全性についての課題がある。
特に、固体材料を用いた全固体型のリチウム二次電池として、薄膜からなる全固体型のリチウム二次電池は、カード型の電子部品等の電源用として期待されている。
なお、本発明に関連する先行技術文献としては、例えば以下のようなものがある。
本発明において、前記材料供給交換系は、大気に対して遮断された乾燥雰囲気中で前記蒸発容器内に前記蒸発材料を配置する材料仕込み室と、当該材料仕込み室に接続され、真空中で前記真空蒸着室との間で前記蒸発材料の供給及び交換を行う材料供給交換室とを有する場合にも効果的である。
本発明において、前記加熱手段は、ランプ加熱方式のヒータである場合にも効果的である。
また、本発明は、前記いずれかの真空蒸着システムを用いた真空蒸着方法であって、前記材料仕込み領域において前記蒸発容器内に所定量の蒸発材料を配置する工程と、前記材料仕込み領域から前記蒸発容器を搬送して前記真空蒸着室内に搬入し前記蒸発材料を供給する工程と、前記真空蒸着室内において、前記蒸発容器を加熱して前記基板上に真空蒸着を行う工程と、前記真空蒸着終了後、前記真空蒸着室から前記蒸発容器を排出して前記材料供給交換系の前記材料仕込み領域に戻す工程とを有するものである。
本発明では、複数の前記蒸発容器を着脱自在に装着可能な容器搬送部材を用い、当該容器搬送部材を搬送することにより、前記蒸発材料の供給及び交換を行う場合にも効果的である。
本発明では、前記蒸発材料がリチウムからなる場合に最も効果的である。
本発明方法において、複数の蒸発容器を着脱自在に装着可能な容器搬送部材を用い、当該容器搬送部材を搬送することにより、前記蒸発材料の供給及び交換を行うようにすれば、複数の蒸発容器を一括して搬送して蒸発材料の供給及び交換が可能になるため、各工程の効率を大幅に向上させることができる。
図1は、本発明に係る真空蒸着システムの実施の形態の概略構成正面図である。
図1に示すように、本実施の形態の真空蒸着システム1は、図示しない真空排気系に接続された真空蒸着室2を有している。また、真空蒸着室2は、希ガスである例えばアルゴン(Ar)ガスを導入するように構成されている。
一方、真空蒸着室2内の下部には、後述する蒸発容器7内に収容された蒸発材料10を加熱するためのヒータ(加熱手段)22が配置されている。
基板供給交換系3は、ゲートバルブ30を介して真空蒸着室2に接続された基板搬送室31を有している。
この基板搬送室31は、例えば縦長形状に形成され、図示しない真空排気系に接続されている。そして、基板搬送室31内には、基板50を載置して昇降可能な基板搬送ロボット32が配置されている。
これら基板仕込み室34、基板取り出し室36は、それぞれ図示しない真空排気系に接続されている。
また、材料交換室43は、例えばアルゴン(Ar)ガスを導入するように構成されている。
また、第2の材料交換室42は、後述する材料仕込み室(材料仕込み領域)45が、ゲートバルブ46を介して接続されている。
図2(a)に示すように、本実施の形態の材料搬送トレイ6は、例えば平板状の部材からなるトレイ本体60を有している。
また、トレイ本体60には、蒸発容器(ボート)7を装着するための例えば円形の装着孔61が、トレイ本体60を貫通するように複数個設けられている。
本例では、トレイ本体60に、3×3=9個の装着孔61が行列状に設けられている。
ここで、蒸発容器7の胴体部70は、トレイ本体60の装着孔61より若干小さい外径を有し、フランジ部71は、トレイ本体60の装着孔61より若干大きい外径を有するように形成されている。
そして、本実施の形態の材料搬送トレイ6は、図2(c)に示すように、各蒸発容器7が、トレイ本体60に装着された状態で蒸発材料10が挿入配置され、これにより各蒸発材料10が、各蒸発容器7に収容された状態でトレイ本体60と共に搬送されることになる。
この材料仕込み室45は、人手で作業が可能なグローブボックスから構成されている。
材料仕込み室45内には、例えばアルゴン(Ar)ガスを導入することにより、室内の露点温度が-50℃~-60℃程度に保たれ、大気に対して遮断された乾燥雰囲気が保たれるようになっている。
本発明の場合、各蒸発容器7内に収容される蒸発材料10の量は特に限定されることはないが、経時変化等によって膜厚や膜質が変化することを防止する観点からは、1回の蒸着工程によって全て蒸発する量に設定することが好ましい。
ここで、各蒸発容器7内に蒸発材料10が収容された材料搬送トレイ6は、材料供給カセット8に複数個装着され、材料仕込み室45内に保管される。
第2の材料交換室42内の下部には、材料供給カセット8を昇降させるための材料カセット昇降機構47が設けられている。
この材料カセット昇降機構47は、例えば第2の材料交換室42の下部に設けられた駆動モータ48によって上下方向に駆動されるステージ47aを有し、例えば一つの材料供給カセット8を載置支持した状態で、このステージ47aを昇降させるように構成されている。
本実施の形態において、基板50上にリチウムからなる蒸発材料10の蒸着を行う場合には、図3に示すように、基板仕込み室34を介して基板搬送室31内に搬入した基板50を、基板搬送ロボット32によって真空蒸着室2内に搬入し、基板ホルダー20に装着する。
本工程では、駆動モータ21を動作させ、基板50を水平方向に向けて回転させながら蒸着を行う。
また、同様に効率良く連続的に蒸着を行う観点からは、例えば、図4に示すように、材料仕込み室45内において、トレイ本体60に装着された蒸発容器7内への蒸発材料10の挿入作業を適宜必要に応じて行うことが好ましい。
さらに基板搬送ロボット32を下降させ、ゲートバルブ35を介して基板取り出し室36内に基板50を搬入し、さらに、図示しない基板搬送ロボットを用いて基板取り出し室36から基板50を排出する。
その後、図6に示すように、基板搬送室31内において、基板搬送ロボット32を上昇させ、基板仕込み室34内の基板50を、基板搬送ロボット32によって真空蒸着室2内に搬入し、基板ホルダー20に装着する。
蒸着終了後は、上述した工程を繰り返す。すなわち、蒸着が終了した基板50を、基板搬送ロボット32によって基板搬送室31を介して基板取り出し室36内に搬入し、さらに基板取り出し室36から基板50を排出する。
その後、第2の材料交換室42内における材料供給カセット8の材料搬送トレイ6の蒸発材料10を全て使い切った場合には、人手によって材料供給カセット8を材料仕込み室45に戻し、新たな材料供給カセット8を人手によって第2の材料交換室42内に搬入する。
なお、蒸着が終了した蒸発容器7については、純水を用いて洗浄するとよい。
純水を用いれば、リチウムを効率良くほぼ完全に除去することができる。
本実施の形態の場合、真空蒸着室2に接続され、真空蒸着室2との間で基板50を供給し、かつ、交換するための基板供給交換系3と、蒸発材料10を真空蒸着室2との間で供給し、かつ、交換するための材料供給交換系4とを有しており、材料供給交換系4は、大気に対して遮断された乾燥雰囲気中で蒸発容器7内に蒸発材料10を配置する材料仕込み領域(材料仕込み室45)を有するとともに、真空蒸着室2との間で蒸発容器7を搬送するトレイ搬送ロボット44が設けられていることから、反応性の高いリチウムからなる蒸発材料10を真空蒸着室2に搬入する際、また、蒸着終了後に蒸発容器7を真空蒸着室2から材料供給交換系4に戻す際において、水分等が蒸発材料10や蒸発容器7に付着して蒸発材料10が劣化することを阻止できる。
一方、本実施の形態では、複数の蒸発容器7を着脱自在に装着可能な材料搬送トレイ6を用い、この材料搬送トレイ6を搬送することにより蒸発材料10の供給及び交換を行うことから、複数の蒸発容器7を一括して搬送して蒸発材料10の供給及び交換ができ、各工程の効率を大幅に向上させることができる。
例えば、上述の実施の形態においては、蒸発容器7を材料搬送トレイ6に装着して蒸発材料10の供給及び交換を行うようにしたが、本発明はこれに限られず、例えば搬送ロボット等を用いて複数の蒸発容器7の供給及び交換を行うことも可能である。
また、上記実施の形態における各室の配置構成は一例であり、必要とするプロセスに応じて適宜変更することができる。例えば、材料供給交換系を一つの大きな室として構成することもできる。
さらにまた、本発明はリチウム以外の材料にも適用することができるが、負極にリチウムを用いるリチウム二次電池を製造する技術に最も有効となるものである。
Claims (6)
- 基板上に蒸発材料を蒸着によって蒸着する真空蒸着室と、
前記真空蒸着室に接続され、当該真空蒸着室との間で基板を供給し、かつ、交換するための基板供給交換系と、前記蒸発材料を前記真空蒸着室との間で供給し、かつ、交換するための材料供給交換系とを有し、
前記材料供給交換系は、大気に対して遮断された雰囲気中で、蒸発容器内に前記蒸発材料を配置する材料仕込み領域と、前記真空蒸着室との間で前記蒸発容器を搬送する蒸発容器搬送領域とが設けられ、
前記真空蒸着室内には、前記材料供給交換系から供給された前記蒸発容器を加熱するための加熱手段が設けられている真空蒸着システム。 - 前記材料供給交換系は、大気に対して遮断された乾燥雰囲気中で前記蒸発容器内に前記蒸発材料を配置する材料仕込み室と、当該材料仕込み室に接続され、真空中で前記真空蒸着室との間で前記蒸発材料の供給及び交換を行う材料供給交換室とを有する請求項1記載の真空蒸着システム。
- 前記加熱手段は、ランプ加熱方式のヒータである請求項1又は2のいずれか1項記載の真空蒸着システム。
- 基板上に蒸発材料を蒸着によって蒸着する真空蒸着室と、前記真空蒸着室に接続され、当該真空蒸着室との間で基板を供給し、かつ、交換するための基板供給交換系と、前記蒸発材料を前記真空蒸着室との間で供給し、かつ、交換するための材料供給交換系とを有し、前記材料供給交換系は、大気に対して遮断された雰囲気中で、蒸発容器内に前記蒸発材料を配置する材料仕込み領域と、前記真空蒸着室との間で前記蒸発容器を搬送する蒸発容器搬送領域とが設けられ、前記真空蒸着室内には、前記材料供給交換系から供給された前記蒸発容器を加熱するための加熱手段が設けられている真空蒸着システムを用いた真空蒸着方法であって、
前記材料仕込み領域において前記蒸発容器内に所定量の蒸発材料を配置する工程と、
前記材料仕込み領域から前記蒸発容器を搬送して前記真空蒸着室内に搬入し前記蒸発材料を供給する工程と、
前記真空蒸着室内において、前記蒸発容器を加熱して前記基板上に真空蒸着を行う工程と、
前記真空蒸着終了後、前記真空蒸着室から前記蒸発容器を排出して前記材料供給交換系の前記材料仕込み領域に戻す工程とを有する真空蒸着方法。 - 複数の前記蒸発容器を着脱自在に装着可能な容器搬送部材を用い、当該容器搬送部材を搬送することにより、前記蒸発材料の供給及び交換を行う請求項4記載の真空蒸着方法。
- 前記蒸発材料は、リチウムからなる請求項4又は5のいずれか1項記載の真空蒸着方法。
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US20160281212A1 (en) | 2015-03-24 | 2016-09-29 | Siva Power, Inc. | Thermal management of evaporation sources |
CN104789930B (zh) * | 2015-04-24 | 2016-05-11 | 京东方科技集团股份有限公司 | 蒸镀设备及采用该蒸镀设备的操作方法 |
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