WO2010119537A1 - レーザ加工方法およびレーザ加工装置 - Google Patents

レーザ加工方法およびレーザ加工装置 Download PDF

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Publication number
WO2010119537A1
WO2010119537A1 PCT/JP2009/057618 JP2009057618W WO2010119537A1 WO 2010119537 A1 WO2010119537 A1 WO 2010119537A1 JP 2009057618 W JP2009057618 W JP 2009057618W WO 2010119537 A1 WO2010119537 A1 WO 2010119537A1
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WO
WIPO (PCT)
Prior art keywords
processing
hole
machining
area
information recording
Prior art date
Application number
PCT/JP2009/057618
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English (en)
French (fr)
Japanese (ja)
Inventor
浩一 印藤
充弘 金田
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to KR1020117015688A priority Critical patent/KR101282490B1/ko
Priority to CN200980157936.2A priority patent/CN102348527B/zh
Priority to PCT/JP2009/057618 priority patent/WO2010119537A1/ja
Priority to JP2011509136A priority patent/JP5165107B2/ja
Priority to TW098118677A priority patent/TWI359056B/zh
Publication of WO2010119537A1 publication Critical patent/WO2010119537A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Definitions

  • the present invention relates to a laser processing method and a laser processing apparatus for forming a processing hole for a product and a processing hole for information recording by laser processing.
  • a laser processing device that forms a processing hole on a workpiece by irradiating the workpiece (workpiece) with laser light
  • information on the processing of the workpiece such as the processing date and time (processing holes for information recording)
  • This stamp is formed so as to represent a character, a symbol, or the like by arranging a plurality of processed holes other than the product.
  • Such a machining program for machining product machining holes and markings treats the product machining hole group and the marking machining hole group as a sequence of points on the same XY coordinates, and the machining program as a group of holes in the same area. It was formed (for example, refer to Patent Document 1).
  • unique information such as a lot number may be stamped on each workpiece.
  • a processing area for the product and a processing area for the marking are provided, and each piece of work has its own information set in the processing area for the marking. Yes.
  • a product processing hole and a stamp are formed (for example, refer to patent documents 2).
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing method and a laser processing apparatus that efficiently form a processing hole for a product and a processing hole for information recording by laser processing.
  • the present invention provides a program for creating a machining program corresponding to a workpiece in a laser machining method for forming a machining hole in the workpiece by irradiating the workpiece with laser light.
  • a machining area setting step for setting and setting the machining area in the machining hole for the product and the information recording area; and
  • the information processing apparatus uses the processing hole arrangement position for the product, the arrangement position of the information recording area, and the processing hole and information recording area for the product in which the processing area is set.
  • a program creation step for creating a machining program in which a machining area is set in a recording area, and a control device that controls laser machining on the workpiece using the machining program, the machining hole for recording information according to the workpiece
  • a correction step of correcting the machining program by setting the position of the information in the information recording area, and the control device uses the corrected machining program to process the information recording machining holes and the information recording holes for each machining area.
  • An instruction step for outputting an instruction for forming a machining hole for a product, and laser processing for performing laser processing on the workpiece under the control of the control device Location characterized in that it comprises a machined hole formation step of forming a machined hole and machining holes for the products for the information recorded in each of the processing area based on the formation instruction.
  • the laser processing method corrects a processing program by setting a position of a processing hole for information recording corresponding to a workpiece in an information recording area, and uses the corrected processing program to process information recording Since the hole and the processed hole for the product are formed, there is an effect that the processed hole for the product and the processed hole for recording information can be efficiently laser processed.
  • FIG. 1 is a diagram illustrating a configuration of a laser processing system according to an embodiment.
  • FIG. 2 is a block diagram showing a configuration of the machining control device.
  • FIG. 3 is a diagram showing the configuration of the laser processing mechanism.
  • FIG. 4 is a flowchart showing a processing procedure of laser processing.
  • FIG. 5 is a diagram illustrating a configuration example of the marking hole area.
  • FIG. 6 is a diagram for explaining the configuration of the processing area.
  • FIG. 7 is a diagram showing the configuration of the marking position information.
  • FIG. 8 is a diagram showing the configuration of the stamp position information after correction.
  • FIG. 9 is a diagram illustrating an example of a marking hole set with the marking position information after correction.
  • FIG. 10 is a diagram illustrating a configuration example of a laser processing mechanism in which laser beams are multi-axial.
  • FIG. 1 is a diagram showing a configuration of a laser processing system according to an embodiment.
  • the laser processing system 100 is a system that forms a processing hole on the workpiece W by irradiating a workpiece (a workpiece W described later) with laser light.
  • the laser processing system 100 of the present embodiment forms a processing hole for a product (a product processing hole H described later) and a processing hole for information recording (a marking hole h described later) on the workpiece W by laser processing.
  • the marking hole h is formed (marked) so as to indicate information (product information) (a lot number, a processing date and the like) related to workpiece processing on each workpiece W, for example.
  • the marking hole h is formed so as to represent a character, a symbol, a figure, or the like by arranging one to a plurality of processed holes (processed holes that are not products).
  • the laser processing system 100 includes a laser processing device 1 and a program creation device 3.
  • the laser processing device 1 and the program creation device 3 are connected by a LAN (Local Area Network) or the like.
  • the program creation device 3 is a computer or the like that creates a machining program for the workpiece W.
  • the program creation device 3 of the present embodiment creates a machining program for each product type.
  • the arrangement of the product processing holes H to be processed into the workpiece W is the same. Therefore, even if the lot number of the workpiece W is different, if the product type is the same, the workpiece W is machined using the same machining program.
  • the program creation device 3 creates a machining program using the product machining hole information 5 and the marking setting information 7.
  • the product processing hole information 5 is information regarding the arrangement position of the product processing hole H on the workpiece W and the like.
  • the marking setting information 7 is information relating to an arrangement position or the like on the workpiece W of an area (a marking hole area s described later) in which the marking hole h is arranged. Therefore, the machining program created by the program creation device 3 has information (position information) on the position of the product machining hole H formed on the workpiece W and position information on the marking hole area s.
  • the program creation device 3 sends the created machining program to the laser machining device 1 via a LAN or the like.
  • the laser processing apparatus 1 is an apparatus that forms a processing hole on the workpiece W using a processing program and product information P1 to Pn (n is a natural number).
  • the product information P1 to Pn is information related to the arrangement position of the marking hole h (the hole to be actually processed) for marking the product information of each workpiece W, and is set for each workpiece W.
  • the laser processing apparatus 1 has a processing control device 10 and a laser processing mechanism 20A.
  • the machining control device 10 is connected to the laser machining mechanism 20 ⁇ / b> A and the program creation device 3.
  • the machining control device 10 uses the position information of the marking hole area s in the machining program and the product information P1 to Pn to determine the position of the marking hole h for machining in the marking hole area s for each workpiece W.
  • the position of the marking hole h set in the marking hole area s is the arrangement position of the marking hole h set in the product information P1 to Pn, and is different for each workpiece W.
  • the machining control device 10 modifies the machining program by setting the marking hole h in the marking hole area s. In other words, in the machining program created by the program creation device 3, the position of the marking hole area s is set, but the position of the marking hole h is not set.
  • the processing control apparatus 10 sends processing instructions for the marking hole h and the product processing hole H to the laser processing mechanism 20A based on the corrected processing program, and controls the laser processing mechanism 20A.
  • the laser processing mechanism 20 ⁇ / b> A performs laser processing on each workpiece W based on a processing instruction from the processing control device 10.
  • FIG. 2 is a block diagram showing the configuration of the machining control device 10.
  • the processing control apparatus 10 includes an input unit 11, a processing program storage unit 12, a product information storage unit 13, a marking setting unit (processing hole setting unit) 14, a processing instruction unit 15, and a control unit 19.
  • the input unit 11 inputs the machining program created by the program creation device 3, product information P1 to Pn, and various instruction information from the user.
  • the input unit 11 sends the inputted machining program to the machining program storage unit 12, and sends the inputted product information P1 to Pn to the product information storage unit 13. Further, the input unit 11 sends the input instruction information to the control unit 19.
  • the machining program storage unit 12 is a memory or the like that stores machining programs
  • the product information storage unit 13 is a memory or the like that stores product information P1 to Pn.
  • the marking setting unit 14 uses the position information of the marking hole area s in the machining program and the product information P1 to Pn to determine the position of the marking hole h to be actually processed in the marking hole area s from the product information P1 to Set for each Pn.
  • the marking setting unit 14 sets the position of the marking hole h as a position (coordinates) on the workpiece W.
  • the machining instruction unit 15 uses the position of the product machining hole H set in the machining program, the position of the marking hole h set by the marking setting unit 14, and the position of the product machining hole H and the marking hole h.
  • the designated processing instruction is output to the laser processing mechanism 20A.
  • the control unit 19 controls the input unit 11, the processing program storage unit 12, the product information storage unit 13, the marking setting unit 14, and the processing instruction unit 15.
  • FIG. 3 is a diagram showing a configuration of the laser processing mechanism according to the first embodiment.
  • the laser processing mechanism 20A includes galvano scan mirrors 22a and 22b, galvano scanners 23a and 23b, an f ⁇ lens 24, and a processing table 25 on which a workpiece W is placed.
  • the galvano scan mirror 22a is a first galvano scan mirror that receives a laser beam L output from a laser oscillator (not shown).
  • the galvano scan mirror 22a is connected to the drive shaft of the galvano scanner 23a, and the drive shaft of the galvano scanner 23a faces the Z-axis direction.
  • the mirror surface of the galvano scan mirror 22a is displaced along with the rotation of the drive shaft of the galvano scanner 23a, and deflects and scans the optical axis of the incident laser beam L in the first direction (for example, the X-axis direction). Send to the mirror 22b.
  • the galvano scan mirror 22b is a second galvano scan mirror that receives the laser light L from the galvano scan mirror 22a.
  • the galvano scan mirror 22b is connected to the drive shaft of the galvano scanner 23b, and the drive shaft of the galvano scanner 23b faces the Y-axis direction.
  • the mirror surface of the galvano scan mirror 22b is displaced in accordance with the rotation of the drive shaft of the galvano scanner 23b, and the second direction (for example, the Y-axis direction) is substantially perpendicular to the optical axis of the incident laser beam L.
  • the second direction for example, the Y-axis direction
  • the f ⁇ lens 24 collects and irradiates the work W with the laser light L that is two-dimensionally scanned in the XY plane.
  • a workpiece W such as a printed board material or a ceramic green sheet has a planar shape, and the processing table 25 places the workpiece W in the XY plane.
  • the processing table 25 is moved in the XY plane, and the laser light L is two-dimensionally scanned by the galvano scanners 23a and 23b.
  • the product machining hole H and the marking hole h are formed in the workpiece W within the scan area (the machining areas E1 to Em (m is a natural number)) within the range in which the laser light L can be two-dimensionally scanned by the galvano scanners 23a and 23b. Is done.
  • FIG. 4 is a flowchart showing a processing procedure of laser processing.
  • the marking setting information 7 indicating the position of the marking hole area s where the marking hole h is arranged is input to the program creation device 3 (step S10), and the product processing indicating the position of the product processing hole H on the workpiece W, etc.
  • the hole information 5 is input to the program creation device 3 (step S20).
  • the program creation device 3 uses the marking setting information 7 to set a marking hole area s and a marking hole candidate (a marking hole candidate c described later) in the marking hole area s.
  • the marking hole candidate c is a machining hole that may be set as the marking hole h, and the position of the machining hole is set at the stage of the marking hole candidate c.
  • the program creation device 3 sets the marking hole area s so that all the machining holes that can be set in the marking hole area s become the marking hole candidates c (step S30).
  • the configuration of the marking hole area s will be described.
  • FIG. 5 is a diagram showing a configuration example of the marking hole area.
  • the marking hole area s is composed of one to a plurality of rectangular areas.
  • FIG. 5 shows a case where the rectangular areas are rectangular areas e1 to e6.
  • each of the rectangular areas e1 to e6 is engraved with one character or symbol.
  • a plurality of marking hole candidates c are arranged at predetermined intervals in the vertical direction and the horizontal direction, respectively.
  • marking hole candidates c a part of the marking hole candidates c are set as the marking holes h, and the remaining marking hole candidates c are set as non-marking holes i to be described later. Characters and symbols will be represented.
  • the marking hole area s and the marking hole candidate c are set based on the marking setting information 7.
  • the program creation device 3 divides the workpiece W into machining areas E1 to Em (m is a natural number). In other words, the program creation device 3 sets the machining areas E1 to Em by dividing the workpiece W (step S40).
  • the configuration of the processing areas E1 to Em will be described. Since the processing areas E1 to Em have the same configuration, the configuration of the processing areas E1 and E2 will be described as an example of the processing areas E1 to Em.
  • FIG. 6 is a diagram for explaining the configuration of the processing area.
  • the processing area E1 and the processing area E2 are ranges in which the laser light L can be two-dimensionally scanned by the galvano scanners 23a and 23b, respectively. Accordingly, when machining the machining areas E1 and E2, after the laser machining in the machining area E1 is finished, the machining position is moved from the machining area E1 to the machining area E2 by moving the machining table 25 in the XY plane. Moved to. In the processing areas E1 and E2, the position of the product processing hole H and the position of the marking hole h are set, and laser processing of the workpiece W is performed based on this setting.
  • laser processing is actually performed, laser processing is performed on the product processing hole H and the marking hole h in the processing area E1, and then laser processing is performed on the product processing hole H and the marking hole h in the processing area E2. Is done. In addition, after performing the laser processing in the processing area E2, the laser processing in the processing area E1 may be performed.
  • the program creation device 3 sets the machining areas E1 to Em, and then sets all the marking hole candidates c to the marking holes h to be processed. Specifically, the program creation device 3 creates in the machining program the marking position information 101A in which all holes of the marking hole candidate c are set to “with machining” (step S50). Here, the configuration of the marking position information 101A will be described.
  • FIG. 7 is a diagram showing the configuration of the stamp position information.
  • the marking position information 101A is information (processing presence / absence information) indicating the position (XY coordinate) of the marking hole candidate c, the machining area to which the marking hole candidate c belongs, and whether or not the marking hole candidate c is set to the marking hole h.
  • the position of the marking hole candidate c in the marking position information 101A is set using the marking setting information 7. Further, any of the processing areas E1 to Em is set in the processing area to which the marking hole candidate c belongs. Further, the processing presence / absence information is all set to “processing present”. In FIG.
  • each marking hole candidate c is indicated by coordinates (x1, y2) to (xq, yq). Further, the processing areas E1 to Em are indicated by (1) to (m), respectively, and “processing” in the processing presence / absence information is indicated by “present”.
  • the stamp position information 101A created in the machining program is not limited to the configuration shown in FIG.
  • the program creation device 3 After creating the marking position information 101A, the program creation device 3 creates a machining program using the set information regarding the machining areas E1 to Em, the product machining hole information 5, and the marking position information 101A (step S60).
  • the machining program created by the program creation device 3 includes information such as the position information of the product machining hole H, the position information of the marking hole h, the machining area to which the product machining hole H belongs, and the machining area to which the marking hole h belongs. Yes.
  • the program creation device 3 creates a machining program associated with the marking position information 101A.
  • the machining program is created for each product type, even if the workpiece W is different, the same machining program is created if the product type is the same.
  • the program creation device 3 sends the created machining program to the machining control device 10 of the laser machining device 1.
  • the machining program from the program creation device 3 is sent to the machining program storage unit 12 via the input unit 11 and stored in the machining program storage unit 12.
  • product information (any of product information P1 to Pn) corresponding to the workpiece W is input from the input unit 11 (step S70).
  • the product information is sent to the product information storage unit 13 via the input unit 11 and stored in the product information storage unit 13.
  • FIG. 4 illustrates a case where the product information of the workpiece W is product information P1.
  • the laser processing apparatus 1 stores the product information P1 in the product information storage unit 13, and then starts laser processing on the workpiece W (step S80).
  • the marking setting unit 14 of the machining control device 10 corrects the machining presence / absence information in the marking position information 101A using the product information P1 (step S90). Specifically, the marking setting unit 14 sets the processing presence / absence information of the marking hole candidate c (the marking hole h not specified in the product information P1) that is not set to the marking hole h among the marking hole candidates c as “with processing”. To “no processing”.
  • FIG. 8 is a diagram showing the configuration of the stamp position information after correction.
  • the corrected marking position information 101B is an information table in which the machining area and coordinates of the marking hole h corresponding to the product information P1 are set, and is created using the marking position information 101A and the product information P1.
  • the processing presence / absence information is corrected from “processing” to “not processing”.
  • “no processing” in the processing presence / absence information is indicated as “none”.
  • FIG. 9 is a diagram showing an example of a marking hole set by the marking position information after correction.
  • the marking hole candidates c among the marking hole candidates c, the marking hole candidates c that are not set to the marking holes h in the product information P1 are set to non-marking holes i that are not subjected to laser processing.
  • the marking hole candidate c “with machining” is set as the marking hole h.
  • the combination of the stamped hole candidate c (marked hole h) with “processing” and the stamped hole candidate c (non-marked hole i) with “not processed” allows each rectangular area e1 to e6 to Each character or symbol is engraved.
  • FIG. 9 shows a case where “A”, “B”, “C”, “D”, “E”, and “F” are set as the characters (lot numbers) in the rectangular areas e1 to e6, respectively. .
  • the processing instruction unit 15 After correcting the marking position information 101A to the marking position information 101B, the processing instruction unit 15 sends a processing instruction to the laser processing mechanism 20A using a processing program. Specifically, the machining instruction unit 15 uses the position of the product machining hole H set in the machining program, the marking position information 101B set by the marking setting unit 14, and the position of the product machining hole H. A processing instruction specifying the position of the marking hole h is sent to the laser processing mechanism 20A.
  • the laser processing mechanism 20 ⁇ / b> A performs laser processing on the workpiece W in accordance with an instruction from the processing instruction unit 15. For example, when laser processing is performed on the processing areas E1 and E2 shown in FIG. 6, after the laser processing on the product processing hole H and the marking hole h in the processing area E1 is finished, the processing table 25 is moved in the XY plane. By moving, the irradiation position of the laser beam L is moved from the processing area E1 to the processing area E2.
  • each marking hole h in the marking hole area s information indicating in which processing area each marking hole h is located is associated.
  • each marking hole h in the marking hole area s is associated with a processing area such as the processing area E1 or the processing area E2. Therefore, when machining the machining area E1, the laser machining apparatus 100 uses the machining program and the marking position information 101B in the machining program to use the product machining hole H and the marking hole h in the machining area E1. Is laser processed (step S100).
  • the control unit 19 of the machining control device 10 confirms whether or not the machining area E1 is the last machining area (step S110). If the machining area E1 is not the last machining area (No at Step S110), the control unit 19 instructs the machining instruction unit 15 to move the machining area. Thereby, the process instruction
  • the laser processing mechanism 20A performs laser processing in the next processing area in accordance with an instruction from the processing instruction unit 15. Specifically, the laser processing mechanism 20A moves the processing position to the next processing area by moving the processing table 25 in the XY plane. Then, the laser processing mechanism 20A irradiates the product processing hole H and the marking hole h with laser light in the next processing area.
  • step S100 and step S110 are repeated until the processing area becomes the last processing area.
  • the laser processing apparatus 100 repeats the movement to the processing area and the irradiation of the laser beam to the product processing hole H and the marking hole h in the processing area.
  • the laser processing apparatus 100 performs laser processing of the product processing hole H and the marking hole h using the marking position information 101B in all the processing areas.
  • the laser machining apparatus 100 completes the laser machining of the workpiece W.
  • the laser processing apparatus 1 and the program creation apparatus 3 were connected was demonstrated in this Embodiment, the laser processing apparatus 1 and the program creation apparatus 3 do not need to be connected.
  • the machining program is sent from the program creation device 3 to the laser machining device 1 via, for example, a portable recording medium.
  • the case where the product machining hole information 5 is input after the marking setting information 7 is input to the program creation device 3 has been described. However, the product machining hole information 5 is input to the program creation device 3. Thereafter, the stamp setting information 7 may be input. Further, in the present embodiment, the case has been described where the stamped hole area s is set after the product drilling hole information 5 is input to the program creation device 3. However, after the stamped hole area s is set, the product drilling hole information 5 is set. May be input to the program creation device 3.
  • the marking hole area s is configured by the rectangular areas e1 to e6 having a rectangular shape has been described, but the marking hole area s may be configured by a shape area other than the rectangular shape. In the marking hole area s, two or more characters and symbols may be stamped in one rectangular area.
  • the machining program has the marking position information 101A and 101B
  • the machining program and the marking position information 101A and 101B may be configured separately.
  • the machining program is associated with the marking position information 101A and 101B, and laser machining is performed using the machining program and the marking position information 101B.
  • the laser processing mechanism 20A drills the workpiece W using one laser beam L.
  • a laser capable of processing the workpiece W using a plurality of laser beams L may be applied to the processing mechanism.
  • FIG. 10 is a diagram showing a configuration example of a laser processing mechanism in which laser beams are multi-axial.
  • the laser processing mechanism 20B includes a spectroscope 28 and two sets of laser heads 29a and 29b.
  • the laser heads 29a and 29b have galvano scan mirrors 22a and 22b, galvano scanners 23a and 23b, and an f ⁇ lens 24, respectively.
  • the laser beam L output from the laser oscillator is split by the spectroscope 28, and the split laser beam L is simultaneously supplied to the laser heads 29a and 29b. Then, the laser light L irradiated from the laser heads 29a and 29b simultaneously drills each workpiece W.
  • the two-head laser processing mechanism 20B has been described, but the laser processing mechanism 20B may have four or more heads.
  • the laser processing mechanism 20B When the position of the marking hole h set in the marking hole area s is different between the laser head 29a side and the laser head 29b (when product information such as a lot number is different), the laser processing mechanism 20B The same operation cannot be performed with the head 29b. For this reason, when the marking hole h is set in one workpiece W and the marking hole h is not set in the other workpiece W, the laser beam L is not irradiated to the other workpiece W. When the laser beam L is not irradiated to the marking hole candidate c of the other workpiece W (when processing is skipped), for example, an openable / closable shutter (not shown) that blocks the laser beam L is provided on the laser heads 29a and 29b. The laser beam L is blocked by closing this shutter.
  • the laser processing mechanism 20B splits the laser light L with the spectrometer 28 and supplies the split laser light L to the laser heads 29a and 29b at the same time.
  • the supplied laser beams L need not be supplied simultaneously.
  • the laser processing mechanism 20B may alternately distribute the laser light L to the laser heads 29a and 29b.
  • the laser beam L is divided into two optical paths in order by dividing the laser beam L into laser heads 29a and 29b.
  • the laser head 29a and the laser head 29b alternately irradiate laser light to one processing table 25 (left work W) and the other processing table 25 (right work W).
  • the marking hole area s is set in the machining program, and the marking hole h in the marking hole area s is set for each workpiece W. Therefore, if the product type is the same, the same machining is performed.
  • the product processing hole H and the marking hole h can be processed by the program. Therefore, the product processing hole H and the marking hole h can be efficiently laser processed.
  • the laser processing method and the laser processing apparatus according to the present invention are suitable for laser processing of product processing holes and information recording processing holes.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
PCT/JP2009/057618 2009-04-15 2009-04-15 レーザ加工方法およびレーザ加工装置 WO2010119537A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020117015688A KR101282490B1 (ko) 2009-04-15 2009-04-15 레이저 가공 방법 및 레이저 가공 장치
CN200980157936.2A CN102348527B (zh) 2009-04-15 2009-04-15 激光加工方法以及激光加工装置
PCT/JP2009/057618 WO2010119537A1 (ja) 2009-04-15 2009-04-15 レーザ加工方法およびレーザ加工装置
JP2011509136A JP5165107B2 (ja) 2009-04-15 2009-04-15 レーザ加工方法およびレーザ加工装置
TW098118677A TWI359056B (en) 2009-04-15 2009-06-05 Laser processing method and laser processing appar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/057618 WO2010119537A1 (ja) 2009-04-15 2009-04-15 レーザ加工方法およびレーザ加工装置

Publications (1)

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WO2010119537A1 true WO2010119537A1 (ja) 2010-10-21

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JP2004327922A (ja) * 2003-04-28 2004-11-18 Sumitomo Heavy Ind Ltd 加工位置補正方法
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KR101282490B1 (ko) 2013-07-04
TW201036743A (en) 2010-10-16
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JP5165107B2 (ja) 2013-03-21
JPWO2010119537A1 (ja) 2012-10-22

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