JP5165107B2 - レーザ加工方法およびレーザ加工装置 - Google Patents

レーザ加工方法およびレーザ加工装置 Download PDF

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Publication number
JP5165107B2
JP5165107B2 JP2011509136A JP2011509136A JP5165107B2 JP 5165107 B2 JP5165107 B2 JP 5165107B2 JP 2011509136 A JP2011509136 A JP 2011509136A JP 2011509136 A JP2011509136 A JP 2011509136A JP 5165107 B2 JP5165107 B2 JP 5165107B2
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Japan
Prior art keywords
processing
hole
machining
area
product
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JP2011509136A
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English (en)
Japanese (ja)
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JPWO2010119537A1 (ja
Inventor
浩一 印藤
充弘 金田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2010119537A1 publication Critical patent/JPWO2010119537A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
JP2011509136A 2009-04-15 2009-04-15 レーザ加工方法およびレーザ加工装置 Active JP5165107B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/057618 WO2010119537A1 (ja) 2009-04-15 2009-04-15 レーザ加工方法およびレーザ加工装置

Publications (2)

Publication Number Publication Date
JPWO2010119537A1 JPWO2010119537A1 (ja) 2012-10-22
JP5165107B2 true JP5165107B2 (ja) 2013-03-21

Family

ID=42982220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011509136A Active JP5165107B2 (ja) 2009-04-15 2009-04-15 レーザ加工方法およびレーザ加工装置

Country Status (5)

Country Link
JP (1) JP5165107B2 (ko)
KR (1) KR101282490B1 (ko)
CN (1) CN102348527B (ko)
TW (1) TWI359056B (ko)
WO (1) WO2010119537A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615281B (zh) * 2012-04-09 2013-10-16 西安交通大学 一种用于激光快速成形技术的分区域移动式光源扫描系统
WO2021161367A1 (ja) * 2020-02-10 2021-08-19 三菱電機株式会社 レーザ加工方法およびレーザ加工装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478771A (en) * 1987-08-27 1989-03-24 Daimler Benz Ag Mark of industrial product or discrete part thereof
JP2004145597A (ja) * 2002-10-24 2004-05-20 Sumitomo Heavy Ind Ltd 加工計画方法及び装置
JP2004141953A (ja) * 2002-10-25 2004-05-20 Sumitomo Heavy Ind Ltd 加工機の加工計画方法及び装置
JP2004327922A (ja) * 2003-04-28 2004-11-18 Sumitomo Heavy Ind Ltd 加工位置補正方法
JP2005268423A (ja) * 2004-03-17 2005-09-29 Kansai Tlo Kk レーザを用いた配線基板の製造方法
JP2006289415A (ja) * 2005-04-08 2006-10-26 Matsushita Electric Ind Co Ltd レーザ加工装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3162255B2 (ja) * 1994-02-24 2001-04-25 三菱電機株式会社 レーザ加工方法及びその装置
JP3185580B2 (ja) * 1995-01-31 2001-07-11 三菱電機株式会社 レーザ加工装置および加工方法
JP5043480B2 (ja) 2007-03-14 2012-10-10 日立ビアメカニクス株式会社 プリント基板加工機

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478771A (en) * 1987-08-27 1989-03-24 Daimler Benz Ag Mark of industrial product or discrete part thereof
JP2004145597A (ja) * 2002-10-24 2004-05-20 Sumitomo Heavy Ind Ltd 加工計画方法及び装置
JP2004141953A (ja) * 2002-10-25 2004-05-20 Sumitomo Heavy Ind Ltd 加工機の加工計画方法及び装置
JP2004327922A (ja) * 2003-04-28 2004-11-18 Sumitomo Heavy Ind Ltd 加工位置補正方法
JP2005268423A (ja) * 2004-03-17 2005-09-29 Kansai Tlo Kk レーザを用いた配線基板の製造方法
JP2006289415A (ja) * 2005-04-08 2006-10-26 Matsushita Electric Ind Co Ltd レーザ加工装置

Also Published As

Publication number Publication date
CN102348527B (zh) 2014-07-09
CN102348527A (zh) 2012-02-08
KR20110102429A (ko) 2011-09-16
KR101282490B1 (ko) 2013-07-04
TW201036743A (en) 2010-10-16
TWI359056B (en) 2012-03-01
WO2010119537A1 (ja) 2010-10-21
JPWO2010119537A1 (ja) 2012-10-22

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