201036743 ' 六、發明說明： 4 ' 【發明所屬之技術領域】 本發明係關於一種雷射加工方法及雷射加工裝置，其 係藉由雷射加工形成製品用之加工孔與資訊記錄用之加工 【先前技術】 藉由於被加工物（work)照射雷射光而於被加工物上形 成加工孔的雷射加工裝置，而與製品用之加工孔分開地於 0 被加工物上刻印（形成）加工日期時間等與被加工物加工相 關的資訊（資訊記錄用之加工孔）。該刻印係藉由排列製品 以外之複數個加工孔的方式而以表示文字和記號等的方式 形成。如上所述，將製品加工孔和刻印進行加工的加工程 式係將製品加工孔群和刻印加工孔群視為同一 XY座標上 的點列，作為同一區域（area)内之孔群而形成加工程式（例 如參照專利文獻1)。 Q 另外，就於各被加工物刻印的資訊而言，有刻印批量 (lot)編號等各被加工物獨特之資訊的情形。此時，為了將 製品加工孔與刻印分開進行加工，必須設置製品用之加工 區域、和刻印用之加工區域’且於刻印用之加工區域設定 各被加工物獨特之資訊。之後，一邊移動至各加工區域一 邊形成製品加工孔與刻印（例如參照專利文獻2)。 [先前技術文獻] 專利文獻 (專利文獻1)日本特開2008-221301號公報 4 321300 201036743 '(專利文獻2)日本特開昭58-53444號公報 【發明内容】 (發明所欲解決的課題） 然而，上述之前者的習知技術中，每當欲刻印的資訊 變更就必須重新作成加工程式，而有加工程式之作成費時 費力的問題存在。因此，進行刻印資訊的變更需要花費長 時間。 另外，於前述後者之習知技術中，由於必須與製品用 © 之加工區域分開地設置刻印用之加工區域，故有進行雷射 加工時之加工位置的移動（加工區域之間的移動）增大的問 題。因此，各被加工物之雷射加工需要花費長時間，而使 生產性降低。 本發明係有鑑於上述課題而研發者，其目的為獲致一 種可以有效率地以雷射加工形成製品用加工孔和資訊記錄 用加工孔的雷射加工方法以及雷射加工裝置。 Q (解決課題的手段） 為了解決上述課題並達成目的，本發明之雷射加工方 法係將雷射光照射於被加工物而於前述被加工物形成加工 孔之方法，該雷射加工方法之特徵為具有··配置位置設定 步驟，用以作成對應於前述被加工物之加工程式的程式作 成裝置係將製品用之加工孔之配置位置、及藉由將與前述 製品用之加工孔不同的加工孔排列於預定位置而配置記錄 資訊用的加工孔的資訊記錄區域之配置位置設定於前述被 加工物上；加工區域設定步驟，前述程式作成裝置係藉由 5 321300 201036743 在可利用電流掃描器對雷射光進行2維掃描的加工區域分 « 割前述被加工物上之區域，而於前述被加工物上設定加工 區域，且將前述加工區域設定為前述製品用加工孔及前述 資訊記錄區域；程式作成步驟，前述程式作成裝置係利用 前述製品用加工孔之配置位置、前述資訊記錄區域之配置 位置、及設定有前述加工區域的前述製品用加工孔及資訊 記錄區域，而作成於前述資訊記錄區域設定有加工區域的 加工程式；修正步驟，利用前述加工程式而控制對於前述 〇 被加工物之雷射加工的控制裝置，係藉由將對應於前述被 加工物的前述資訊記錄用加工孔位置設定於前述資訊記錄 區域内而修正前述加工程式；指示步驟，前述控制裝置係 利用修正後之加工程式而對於每個前述加工區域輸出前述 資訊記錄用之加工孔及前述製品用之加工孔的形成指示； 以及加工孔形成步驟，由前述控制裝置所控制而進行對於 前述被加工物之雷射加工的雷射加工裝置係依據前述形成 Q 指示而於每個前述加工區域形成前述資訊記錄用之加工孔 以及前述製品用之加工孔。 (發明之效果） 本發明之雷射加工方法係藉由將因應於被加工物的 資訊記錄用加工孔之位置設定於資訊記錄區域内而修正加 工程式，利用修正後之加工程式而形成資訊記錄用之加工 孔以及製品用之加工孔，故可達到有效率地對製品用之加 工孔和資訊記錄用之加工孔進行雷射加工的效果。 【實施方式】 6 321300 201036743 ^ 以下，依據圖式詳細説明本發明實施形態之雷射加工 ' 方法及雷射加工裝置。又，本發明並不被此實施形態所限 定。 實施形態 第1圖為表示實施形態之雷射加工系統之構成的圖。 雷射加工系統100為於被加工物（後述之被加工物w)照射 雷射光而於被加工物w上形成加工孔的系統。本實施形態 之雷射加工系統1 〇〇係藉由雷射加工而於被加工物w上形 〇 成製品用加工孔（後述之製品加工孔H)、及資訊記錄用加 工孔(後述之刻印孔h)。刻印孔h係例如形成（刻印）為表示 與對各被加工物w之被加工物所進行之加工相關的資訊 (製品資訊）（批量編號和加工曰時等）。具體而言，刻印孔h 係形成為藉由排列1至複數個加工孔（不成為製品的加工 孔）而表示文字、記號、圖形等。 雷射加工糸統100係構成為含有雷射加工裝置1與程 〇 式作成裝置3。雷射加工裝置〗與程式作成裝置3係藉由 LAN(Local Area Network，區域網路）等而連接。 程式作成裝置3為作成被加工物w之加工程式的電 腦等。本實施形態之程式作成裝置3係就每種製品作成加 工程式。當製品種類相同時’於被加工物w進行加工的製 品加工孔Η之配置會相同。從而，即使被加工物w之批 量編號(lot immber)不同，但只要製品種類相同即可使用相 同的加工程式對於被加工物w進行加工。 釭式作成裝置3係使用製品加工孔資訊5、刻印設定 321300 7 201036743 • #訊7而作成加工程式。製品加工孔資訊5為關於製品加 工孔Η在被加工物w上之配置位置等的資訊。刻印設定 資訊7為關於配置刻印孔h的區域（後述的刻印孔區域〇 在被加工物W上之配置位置等的資訊。從而，程式作成裝 置3所作成的力σ工程式係具有與形成在被加工物^上的製 品加工孔Η相關的資訊(位置資訊）、及刻印孔區域s之位 置身机。程式作成裝置3係將所作成的加工程式經由[颜 等而送至雷射加工裝置！。 ^ #射加工裝置1係利用加工程式及製品資訊P1至201036743 ' VI. Description of the invention: 4 ' [Technical field of invention] The present invention relates to a laser processing method and a laser processing apparatus which are processed by laser processing to form a processing hole for a product and for processing information [Prior Art] A laser processing apparatus that forms a machined hole in a workpiece by irradiating laser light with a work, and is formed (formed) on the workpiece by 0 separately from the machined hole for the product. Information related to the processing of the workpiece such as the date and time (processing hole for information recording). This imprinting is formed by means of arranging a plurality of processing holes other than the product, such as characters and symbols. As described above, the processing program for processing the product processing hole and the engraving is to treat the product processing hole group and the imprinting processing hole group as a dot row on the same XY coordinate, and form a processing program as a hole group in the same area (area). (For example, refer to Patent Document 1). In addition, in the case of the information to be printed on each workpiece, there is a case where the unique information such as the lot number is printed. At this time, in order to separate the product processing hole from the marking, it is necessary to provide a processing area for the product and a processing area for marking, and set a unique information for each workpiece in the processing area for marking. Thereafter, the product processing hole and the imprint are formed while moving to each of the processing regions (see, for example, Patent Document 2). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2008-221301 No. 4, No. SHO-58-53444 (Patent Document 2) JP-A-58-53444 (Summary of the Invention) However, in the prior art of the former, whenever the information to be printed is changed, it is necessary to re-create the processing program, and there is a problem that the processing of the processing program takes time and effort. Therefore, it takes a long time to change the imprint information. Further, in the latter conventional technique, since it is necessary to provide a processing region for marking separately from the processing region of the product, there is a possibility that the movement of the processing position (movement between the processing regions) during laser processing is increased. Big problem. Therefore, the laser processing of each workpiece takes a long time, and the productivity is lowered. The present invention has been made in view of the above problems, and an object thereof is to provide a laser processing method and a laser processing apparatus which can efficiently form a processing hole for a product and a processing hole for information recording by laser processing. Q (Means for Solving the Problem) In order to solve the above problems and achieve the object, the laser processing method of the present invention is a method in which laser light is irradiated onto a workpiece to form a processing hole in the workpiece, and the laser processing method is characterized. In order to provide a position setting step, a program forming device for creating a processing program corresponding to the workpiece is a processing position for processing holes for the product, and a processing different from the processing hole for the product. The arrangement position of the information recording area in which the hole is arranged at a predetermined position and the processing hole for recording information is set is set on the workpiece; and the processing area setting step is performed by the current scanner pair 5 321300 201036743 a processing area in which the laser light is scanned in two dimensions is divided into regions on the workpiece, and a processing region is set on the workpiece, and the processing region is set as the processing hole for the product and the information recording region; In the forming step, the program forming device uses the arrangement position of the processing hole for the product, and the front a processing position of the information recording area, and a processing hole and an information recording area for the product in which the processing area is set, and a processing program for setting a processing area in the information recording area; and a correction step of controlling the processing program by using the processing program The control device for laser processing of the workpiece is modified by setting the position of the processing hole for information recording corresponding to the workpiece in the information recording area; the instruction step, the control device And an instruction to form the processing hole for the information recording and the processing hole for the product for each of the processing regions by using the modified processing program; and the processing hole forming step is performed by the control device to perform the The laser processing apparatus for laser processing of the processed product forms the processing hole for information recording and the processing hole for the product in each of the processing regions in accordance with the formation of the Q instruction. (Effects of the Invention) The laser processing method of the present invention corrects a processing program by setting a position of a processing hole for information recording in accordance with a workpiece in an information recording area, and forms an information recording by using the corrected processing program. The processing hole and the processing hole for the product are used, so that the effect of laser processing on the processing hole for the product and the processing hole for information recording can be efficiently performed. [Embodiment] 6 321300 201036743 ^ Hereinafter, a laser processing method and a laser processing apparatus according to an embodiment of the present invention will be described in detail based on the drawings. Further, the present invention is not limited by the embodiment. Embodiment Fig. 1 is a view showing the configuration of a laser processing system according to an embodiment. The laser processing system 100 is a system in which a workpiece (a workpiece w to be described later) is irradiated with laser light to form a machined hole in the workpiece w. The laser processing system 1 of the present embodiment is formed into a processing hole for a product (a product processing hole H to be described later) on a workpiece w by laser processing, and a processing hole for information recording (printing described later) Hole h). The marking hole h is formed (marked), for example, to indicate information related to the processing of the workpiece to be processed (product information) (when the batch number and the processing time, etc.). Specifically, the marking holes h are formed to represent characters, symbols, figures, and the like by arranging 1 to a plurality of processing holes (processing holes not to be products). The laser processing system 100 is configured to include a laser processing apparatus 1 and a process unit 3. The laser processing apparatus and the program creation apparatus 3 are connected by a LAN (Local Area Network) or the like. The program creation device 3 is a computer or the like that creates a processing program for the workpiece w. The program creating device 3 of the present embodiment is an engineering type for each product. When the product types are the same, the arrangement of the processing holes for processing the workpiece w will be the same. Therefore, even if the lot immber of the workpiece w is different, the workpiece w can be processed using the same machining program as long as the product type is the same.釭Forming device 3 is the use of product processing hole information 5, engraving settings 321300 7 201036743 • #讯7 to create a processing program. The product processing hole information 5 is information on the arrangement position of the product processing hole 被 on the workpiece w and the like. The engraving setting information 7 is information on a region in which the engraving hole h is disposed (an arrangement position of the engraved hole region 后 to be described later on the workpiece W, etc.), and the force σ engineering system formed by the program creating device 3 is formed and formed. The information related to the processing of the product on the workpiece (position information) and the position of the marking hole area s. The program making device 3 sends the created processing program to the laser processing device via [Yan et al. ^ #射加工装置1 uses processing program and product information P1 to
Pn(n為自然數）而於被加工物w上形成加工孔的裝置。製 品資訊P1至Pn係與用以刻印各被加工物w之製品資訊的 ^印孔h(實際進行加工的孔）之配置位置相關的資訊，係依 每一被加工物W而設定。 雷射加工裝置1係具有加工控制裝置ίο與雷射加工 機構20A。加工控制裝置10係連接於雷射加工機構 〇與程式作成裝置3。加工控制裝置1〇係使用加工程式内的 刻印孔區域s之位置資訊、及製品資訊？1至pn，而依每 個被加工物W设定在刻印孔區域s内實施加工的刻印孔卜 之位置。設定於刻印孔區域s内的刻印孔h之位置係於製 品資訊！> 1至P n分別設定的刻印孔h之配置位置而依每個 被加工物W相異。 ， 加工控制裝置10係藉由於刻印孔區域s内設定刻印 孔h而修正加工程式。換言之，程式作成裝置3所作成的 加工程式雖設定有刻印孔區域s之位置，但未設定刻印孔 321300 8 201036743 :h之位置。加卫控制裝置1Q係依據修正後之加工程式而將 刻印孔h與製品加工孔H之加工指示送至雷射加工機構 胤，而控制雷射加工機構撤。雷射加工機構2〇a係依 據來自加工控制袭置1Q的加工指示而進行各被加工物w 之雷射加工。 接著，對於加工控制裝置10之構成進行說明。第2 圖為表示加工控制裝置10之構成的方塊圖。加工控制裝置 10係具有輸人部u、加工程式記憶部12、製品資訊記憶 〇部13、刻印設定部(加工孔設定部）14、加工指示部15、控 制部19。 、輸入部11係輸入：程式作成裝置3所作成的加工程 式、製品資訊P1至Pn、來自使用者的種種指示資訊。輪 入部11係將所輸入的加工程式送至加工程式記憶部12， 亚將所輸入的製品資訊P1至Pn送至製品資訊記憶部13。 另外，輸入部11係將所輸入的指示資訊送至控制部19。 Ο加工私式έ己憶部12為§己憶有加工程式的記憶體等，繁品資 訊記憶部13為記憶有製品資訊P1至Pn的記憶體等。 刻印設定部14係利用加工程式内之刻印孔區域s之 位置資訊、與製品資訊P1至Pn，而依每個製品資訊ρι 至Ρ η設定於刻印孔區域s内實際進行加工的刻印孔h之位 置。刻印設定部14係將刻印孔h之位置設定為被加工物 W上之位置（座標）。 加工指示部15係利用设定於加工程式内之製品加工 孔Η之位置、和刻印設定部14所設定的刻印孔h之位置 321300 9 201036743 • 而將指定製品加工孔Η與刻印孔h之位置的加工指示輪出 至雷射加工機構20A。控制部19係控制輸入部11、加工 私式§己憶部12、製品資訊記憶部13、刻印設定部14、力口 工指示部15。 接著’對於雷射加工機構20A進行說明。第3圖為表 不第1貫施形態之雷射加工機構之構成的圖。雷射加工機 構 2〇A 係具有電流掃描鏡（galvano-scan mirror)22a、22b、 〇 及電流掃插器（galvano-scanner)23a、23b、及 f (9 透鏡 (lens)24、以及載置被加工物w的加工工作台（tabie)25。 ^ 電仙·掃描鏡22a為接收從未圖示的雷射振盪器輸出的 f射光L的第1電流掃描鏡。電流掃描鏡22a係連接於電 流掃描器' 23a之驅動軸，電流掃描器仏之驅動轴係朝向 =轴方向。。電流掃描鏡瓜之鏡㈣謝)面係隨著電流掃插 器”a之驅動軸的旋轉而位移’使入射的雷射光L之光： :第1方向(例如χ軸方向)偏向掃描且送出至電流掃插鏡 々電L掃描鏡22b為接收來自電流掃描鏡22a之雷射光 電流掃插鏡。電流掃描鏡创係連接於電流择插 =3b之驅動軸，電流掃描器现之驅動轴係朝向γ轴方 二艟電流掃描鏡22b之鏡面係隨著掃瞒器挪之驅動軸的 轉而：移’使入射的雷射光L之光軸朝與第U向大致 ^的弟2方向（例如γ軸方向）偏向掃描岐出至 鏡24。 心 Μ透鏡24係於灯面内將經2維掃描的雷射光匕聚 3213〇〇 10 201036743 . 光照射於被加工物W上。印刷電路板(printed board)材料 或陶瓷生胚薄片（ceramic green sheet)等被加工物W係具有 平面形狀，加工工作台25係將被加工物W載置於XY平 面内。 雷射加工機構20A係藉由使加工工作台25於XY平 面内移動，且藉由電流掃描器23a、23b而使雷射光L進 行2維掃描。藉此，在屬於可藉由電流掃描器23a、23b 對雷射光L進行2維掃描的範圍内的掃描區域（scan ❹ area)(加工區域E1至Em(m為自然數))的被力口工物W开；成 製品加工孔Η或刻印孔h。 接著，說明雷射加工之加工處理程序。第4圖係表示 雷射加工之加工處理程序的流程圖。將表示配置有刻印孔 li的刻印孔區域s之位置等的刻印設定資訊7輸入程式作 成裝置3(步驟S10)，且將表示製品加工孔Η在被加工物W 上之位置等的製品加工孔資訊5輸入程式作成裝置3(步驟 〇 S20)。 程式作成裝置3係利用刻印設定資訊7而設定刻印孔 區域s、及刻印孔區域s内的刻印孔候補（後述之刻印孔候 補c)。刻印孔候補c為可設定於刻印孔h的加工孔，於刻 印孔候補c之階段中係設定加工孔之位置。程式作成裝置 3係以使可設定於刻印孔區域s内的全加工孔皆成為刻印 孔候補c的方式設定刻印孔區域s(步驟S30)。在此，對於 刻印孔區域s之構成進行說明。 第5圖係表示刻印孔區域之構成例的圖。刻印孔區域 11 321300 201036743 :S一係由ι個至複數個矩形狀區域所構成。於第5圖 不矩形狀區域為矩形區域el至e6時的情形。例如，於各 矩形區域el至e6係一個一個地刻印有文字和記號等。於 矩形區域el至e6係分別於縱方向及橫方向相隔預定之間 隔而排列複數個刻印孔候補c。於第5圖係表示當在各矩 形區域el至e6内排列有（橫4個）χ(縱7個卜^ 4固刻印孔 ο 3補c時的情形。於刻印孔候·之中，_部分的刻印孔 候補c設定為刻印孔h，其餘的刻印孔候補 物到印孔丨，藉此而於，個矩形區域内表示為 Γ f己號#。刻印孔區域s或騎孔候補^據刻印設 疋資訊7而設定。 〇 物wt設U印孔區域S後，程式作錢置3係將被加工 /刀割為加工區域E1至Em(m為自然數)。換言之，程 式作成裝置3係藉由分割被加工物w而設定加工區域以 至Em(步驟S4〇)。在此，對於加工區域至此 id;又=加工區咖至Μ具有相同的構成， 區域E1、E2之構成作為加工區域E1至Em 之一例。 第6圖為用以說明加工區域之構成的圖。加工區域 ^加工區域£2係分別為可藉由電流掃描器仏 二對雷射光L進行2維掃描的範圍。從而，於對加工區域 後:Γ加進行加工之際’於加工區域Ei内之雷射加工結束 位置^工工作台25於ΧΥ^面内移動’藉此即可將加工 從加工區域E1移動至加工區域E2内。於加工區域 321300 12 201036743Pn (n is a natural number) and means for forming a machined hole in the workpiece w. The information on the arrangement positions of the product information P1 to Pn and the printing hole h (the hole actually processed) for printing the product information of each workpiece w is set for each workpiece W. The laser processing apparatus 1 has a processing control unit ίο and a laser processing mechanism 20A. The machining control device 10 is connected to the laser machining mechanism 程式 and the program creation device 3. The machining control device 1 uses the position information and product information of the marking hole area s in the processing program. 1 to pn, and the position of the imprinted hole which is processed in the imprinted hole area s is set for each workpiece W. The position of the marking hole h set in the marking hole area s is attached to the product information! > The arrangement position of the marking holes h set by 1 to P n is different for each workpiece W. The machining control device 10 corrects the machining program by setting the marking hole h in the marking hole region s. In other words, the processing program created by the program creating device 3 sets the position of the marking hole region s, but the position of the marking hole 321300 8 201036743 :h is not set. The defensive control device 1Q sends the processing instruction of the marking hole h and the product processing hole H to the laser processing mechanism 依据 according to the modified processing program, and controls the laser processing mechanism to withdraw. The laser processing mechanism 2〇a performs laser processing of each workpiece w in accordance with a processing instruction from the machining control set 1Q. Next, the configuration of the processing control device 10 will be described. Fig. 2 is a block diagram showing the configuration of the processing control device 10. The machining control device 10 includes an input unit u, a machining program storage unit 12, a product information memory unit 13, an engraving setting unit (machining hole setting unit) 14, a machining instructing unit 15, and a control unit 19. The input unit 11 inputs: an addition type created by the program creation unit 3, product information P1 to Pn, and various kinds of instruction information from the user. The wheel entering unit 11 sends the input machining program to the machining program storage unit 12, and sends the input product information P1 to Pn to the product information storage unit 13. Further, the input unit 11 sends the input instruction information to the control unit 19. The processing unit 12 is a memory having a processing program, and the memory unit 13 is a memory for storing product information P1 to Pn. The marking setting unit 14 uses the position information of the marking hole area s in the processing program, and the product information P1 to Pn, and sets the marking hole h actually processed in the marking hole area s according to each product information ρι to η η. position. The marking setting portion 14 sets the position of the marking hole h to the position (coordinate) on the workpiece W. The processing instructing unit 15 uses the position of the product processing hole set in the machining program and the position of the marking hole h set by the marking setting unit 14 321300 9 201036743 • The position of the designated product hole and the marking hole h The processing indication is taken out to the laser processing mechanism 20A. The control unit 19 controls the input unit 11, the processing private § memory unit 13, the product information storage unit 13, the imprint setting unit 14, and the power instruction unit 15. Next, the laser processing mechanism 20A will be described. Fig. 3 is a view showing the configuration of a laser processing mechanism in a first embodiment. The laser processing mechanism 2A has a galvano-scan mirror 22a, 22b, a galvano-scanner 23a, 23b, and f (9 lens), and mounting A processing table (tabie) 25 of the workpiece w. ^ The electric picking mirror 22a is a first current scanning mirror that receives the f-light L outputted from a laser oscillator (not shown). The current scanning mirror 22a is connected to The drive shaft of the current scanner '23a, the drive shaft of the current scanner 朝向 is oriented toward the = axis direction. The mirror of the current scanning mirror (4) Xie) the surface is displaced with the rotation of the drive shaft of the current sweeper "a" Light of the incident laser light L: : The first direction (for example, the x-axis direction) is deflected and sent to the current sweeping mirror. The L-scan mirror 22b receives the laser light current sweeping mirror from the current scanning mirror 22a. The scanning mirror is connected to the drive shaft of current interpolation = 3b, and the current scanning shaft of the current scanner is oriented toward the γ axis. The mirror of the current scanning mirror 22b is rotated with the drive shaft of the sweeper: 'Making the optical axis of the incident laser light L toward the second direction of the U-direction (for example The axial direction is deflected and scanned out to the mirror 24. The palpebral lens 24 is attached to the surface of the lamp to condense the 2D scanned laser light 3213〇〇10 201036743. The light is irradiated onto the workpiece W. Printed circuit board (printed The workpiece W such as a material or a ceramic green sheet has a planar shape, and the processing table 25 mounts the workpiece W in the XY plane. The laser processing mechanism 20A is processed by The stage 25 is moved in the XY plane, and the laser light L is scanned in two dimensions by the current scanners 23a, 23b. Thereby, the laser light L can be scanned in two dimensions by the current scanners 23a, 23b. The scanning area (scan area ) area) (the processing area E1 to Em (m is a natural number)) is opened by the workpiece W; the finished product is machined or the hole h is marked. Next, the laser processing is explained. Fig. 4 is a flow chart showing a processing procedure for laser processing. The marking setting information 7 indicating the position of the marking hole region s in which the marking hole li is placed is input to the program creating device 3 (step S10). And will indicate that the product is machined in the workpiece W The product processing hole information 5 such as the upper position is input to the program creation device 3 (step S20). The program creation device 3 sets the marking hole region s and the marking hole candidate in the marking hole region s by using the marking setting information 7 (described later) The printing hole candidate c). The marking hole candidate c is a processing hole which can be set in the marking hole h, and the position of the processing hole is set in the stage of marking the hole candidate c. The program making device 3 is set so as to be set in the marking hole area The imprinted hole area s is set in such a manner that all of the processed holes in s become the imprinting holes candidate c (step S30). Here, the configuration of the marking hole region s will be described. Fig. 5 is a view showing a configuration example of an imprinted hole region. Marking hole area 11 321300 201036743 : S series consists of ι to a plurality of rectangular areas. In Fig. 5, the case where the rectangular region is the rectangular region el to e6. For example, characters, symbols, and the like are imprinted one by one in each of the rectangular areas el to e6. In the rectangular regions el to e6, a plurality of imprinting hole candidates c are arranged at predetermined intervals in the longitudinal direction and the lateral direction, respectively. Fig. 5 shows a case where (horizontal 4) χ (longitudinal 7 卜^4 solid marking holes ο3 complement c) are arranged in each of the rectangular regions el to e6. Part of the marking hole candidate c is set as the marking hole h, and the remaining marking hole candidates are added to the printing aperture 丨, thereby representing Γf己# in the rectangular area. The marking hole area s or the riding hole candidate Set and set the information 7 to set. After the weight wt is set to the U-printing area S, the program will be processed/cut into the processing area E1 to Em (m is a natural number). In other words, the program making device 3 The processing region is set to Em by dividing the workpiece w (step S4 〇). Here, the processing region is id; the processing region has the same configuration, and the regions E1 and E2 are configured as processing regions. An example of E1 to Em. Fig. 6 is a view for explaining the configuration of the processing area. The processing area ^ processing area is a range in which the laser beam L can be scanned in two dimensions by the current scanner. After the processing area: at the time of processing, the laser processing end position in the processing area Ei The work table 25 is moved in the plane of the ’^, thereby moving the machining from the processing area E1 to the processing area E2. In the processing area 321300 12 201036743
El、E2係設定有製品加工孔Η之位置和刻印孔h之位置， ' 依據此設定而進行被加工物W之雷射加工。於實際進行雷 射加工時，係先進行對於加工區域E1内之製品加工孔Η 與刻印孔h的雷射加工，之後進行對於加工區域Ε2内之 製品加工孔Η與刻印孔h的雷射加工。又，亦可在進行加 工區域E2内之雷射加工後才進行加工區域E1内之雷射加 工。 程式作成裝置3係於設定加工區域E1至Em後，將 ❹所有的刻印孔候補c設定於加工對象之刻印孔h。具體而 言，程式作成裝置3係於加工程式内作成將刻印孔候補c 之全部孔設定為「有加工」的刻印位置資訊101A(步驟 S50)。在此，對於刻印位置資訊101A之構成進行說明。 弟7圖為表不刻印位置貢訊之構成的圖。刻印位置貢 訊101A係使刻印孔候補C之位置(XY座標）、刻印孔候補 c所屬的加工區域、表示刻印孔候補c是否被設定於刻印 Q 孔h的資訊（有無加工資訊）分別與每個刻印孔候補c相對 應而成的資訊表。刻印位置資訊101A内之刻印孔候補c 之位置係利用刻印設定資訊7加以設定。另外，於刻印孔 候補c所屬的加工區域係設定有加工區域E1至Em之中的 任一者。另外，有無加工資訊係皆設定為「有加工」。於第 7圖中係以座標（xl,y2)至(xq,yq)表示各刻印孔候補c之位 置。另外，將加工區域E1至Em分別表示為（1)至（m)，將 有無加工資訊之「有加工」表示為「有」。又，於加工程式 内作成的刻印位置資訊101A不限於第7圖所示之構成， 13 321300 201036743 亦可為其他構成。 ' 在作成刻印位置資訊101A之後，程式作成裝置3係 利用所設定的關於加工區域E1至Em的資訊、製品加工孔 資訊5、刻印位置資訊101A而作成加工程式（步驟S60)。 於程式作成裝置3所作成的加工程式中係含有：製品加工 孔Η之位置資訊、刻印孔h之位置資訊、製品加工孔Η所 屬的加工區域、刻印孔h所屬的加工區域等資訊。換言之， 程式作成裝置3係預先作成對應於刻印位置資訊101A的 〇 加工程式。於本實施形態中，由於係依每個製品種類作成 加工程式，故即使被加工物W不同時，只要製品種類相同 即會作成相同的加工程式。 程式作成裝置3係將所作成的加工程式送至雷射加工 裝置1之加工控制裝置10。來自程式作成裝置3的加工程 式係經由輸入部11而送至加工程式記憶部12，且儲存於 加工程式記憶部12内。於開始進行被加工物W之雷射加 Q 工時，對應於被加工物W的製品資訊（製品資訊P1至Pn 之任一者）係從輸入部11輸入(步驟S70)。製品資訊係經由 輸入部11而送至製品資訊記憶部13，且儲存於製品資訊 記憶部13内。於第4圖中係對於當被加工物W之製品資 訊為製品資訊P1時的情形進行說明。 雷射加工裝置1係於將製品資訊P1儲存於製品資訊 記憶部13内後，開始對被加工物W進行雷射加工（步驟 S80)。加工控制裝置10之刻印設定部14係利用製品資訊 • P1修正刻印位置資訊101A之有無加工資訊（步驟S90)。具 14 321300 201036743 .體而言，刻印設定部14係將刻印孔候補C之中未設定為刻 印孔h的刻印孔候補c(於製品資訊P1未被指定的刻印孔 h)之有無加工資訊從「有加工」修正為「無加工」。 第8圖為表不修正後之刻印位置資訊之構成的圖。修 正後之刻印位置資訊1〇1B係設定有對應於製品資訊？1的 刻印孔h之加工區域與座標的資訊表，其係利用刻印位置 貝Λ 101A與製品資訊ρι而作成。未以製品資訊η設定 ο 為刻印孔h的刻印孔候補^之有無加工資_從「有加 被修正為「無加工」。於第8圖巾，係將有無加工資訊的「無 加工」以「無」表示。 〇El and E2 are set with the position of the machined hole and the position of the mark hole h, and the laser processing of the workpiece W is performed according to this setting. In the actual laser processing, the laser processing of the product processing hole and the marking hole h in the processing area E1 is performed first, and then the laser processing of the product processing hole and the marking hole h in the processing area Ε2 is performed. . Further, the laser processing in the processing area E1 can be performed only after the laser processing in the processing area E2. After the program creation unit 3 is set to the processing areas E1 to Em, all the marking hole candidates c are set to the marking holes h of the processing target. Specifically, the program creating device 3 creates the marking position information 101A in which all the holes of the marking hole candidate c are set to "processed" in the processing program (step S50). Here, the configuration of the imprint position information 101A will be described. The picture of Brother 7 is a picture showing the composition of the location of Gongxun. Marking position: The position of the marking hole candidate C (XY coordinate), the processing area to which the marking hole candidate c belongs, and the information indicating whether the marking hole candidate c is set to the marking Q hole h (with or without processing information) respectively and each A message table corresponding to the candidate hole candidate c. The position of the imprinting hole candidate c in the engraved position information 101A is set by the imprint setting information 7. Further, any one of the processing regions E1 to Em is set in the processing region to which the imprinting hole candidate c belongs. In addition, the processing information system is set to "Processing". In Fig. 7, the coordinates (xl, y2) to (xq, yq) are used to indicate the position of each imprinting hole candidate c. Further, the processing areas E1 to Em are represented as (1) to (m), respectively, and the "processed" having or without processing information is indicated as "present". Further, the imprint position information 101A created in the processing program is not limited to the configuration shown in Fig. 7, and 13 321300 201036743 may have other configurations. After the engraving position information 101A is created, the program creation device 3 creates a machining program using the set information about the machining areas E1 to Em, the product machining hole information 5, and the engraving position information 101A (step S60). The processing program created by the program creation device 3 includes information such as the position information of the product processing hole, the position information of the marking hole h, the processing area to which the product processing hole belongs, and the processing area to which the marking hole h belongs. In other words, the program creation device 3 is preliminarily created as a processing program corresponding to the imprint position information 101A. In the present embodiment, since the processing program is created for each product type, even if the workpiece W is different, the same processing program is created as long as the product type is the same. The program creation device 3 sends the created machining program to the machining control device 10 of the laser machining device 1. The addition program from the program creation device 3 is sent to the machining program storage unit 12 via the input unit 11, and stored in the machining program storage unit 12. When the laser processing of the workpiece W is started, the product information (any one of the product information P1 to Pn) corresponding to the workpiece W is input from the input unit 11 (step S70). The product information is sent to the product information storage unit 13 via the input unit 11, and stored in the product information storage unit 13. In Fig. 4, the case where the product information of the workpiece W is the product information P1 will be described. The laser processing apparatus 1 starts laser processing of the workpiece W after storing the product information P1 in the product information storage unit 13 (step S80). The imprint setting unit 14 of the processing control device 10 corrects the presence or absence of the processing information of the imprint position information 101A by using the product information • P1 (step S90). In the case of the engraving setting unit 14 , the engraving hole candidate c (the engraving hole h which is not designated in the product information P1) which is not set as the engraving hole h among the imprinting holes candidate C is processed or not. "Processing" was corrected to "No Processing". Figure 8 is a diagram showing the composition of the inscription position information after the correction. After the correction, the position information 1〇1B is set to correspond to the product information? The information table of the processing area and coordinate of the engraved hole h of 1 is made by using the engraving position Bessie 101A and the product information ρι. It is not set with the product information η. ο The engraved hole candidate for the engraved hole h has the processing capital _ from the "additional correction to "no processing". In the 8th figure, "No processing" with or without processing information is indicated by "None". 〇
J 第圖為表不以修正後之刻印位置資訊設定的刻印孔 的二如/ 9圖所示’刻印孔候補C中之未以製品 又疋為刻印孔h的刻印孔候補c係被設定為不進行 =力了非刻印孔卜藉此，只有「有加I」的刻印孔 候補c被設定為刻印^。如上所述，藉由組合「有加工_ 之刻印孔候補C(刻印孔 刻印孔。，即可I各=二無,加玉」之刻印孔候補c(非 或纪Μ。^ 至e6分別刻印1個文字 1 . Γ 、第9圖中係表示於矩形區域el至e6分別設 疋文子（批量編號）「A 「B 「 情形。 L」d」、「e」、「f」之 ::印：置資訊1〇1A修正為刻印位置資訊麵 才…15係利用加工程式而將加工指示送至爺射 加工機構具體而言，加工指示部15係利用= 加工程式内的製品加工孔H之位置、和到印設定 = 321300 15 201036743 設定的刻印位置資訊101B而將指定了製品加工孔Η之位 置和刻印孔h之位置的加工指示送至雷射加工機構20Α。 雷射加工機構20A係依據來自加工指示部15的指示 而進行被加工物W的雷射加工。例如，對第6圖所示的加 工區域E卜E2進行加工之際，係在結束對加工區域E1内 之製品加工孔Η和刻印孔h的雷射加工後’措由使加工工 作台25於XY平面内移動，即可使雷射光L之照射位置從 加工區域E1内朝加工區域E2内移動。 〇 於本實施之形態中，在刻印位置資訊101B内係對於 刻印孔區域s内之每個刻印孔h附加對應有各刻印孔h係 位於哪一個加工區域内的資訊。例如，使加工區域E1、或 加工區域E2等加工區域對應於刻印孔區域s内之各刻印孔 h。從而，雷射加工裝置100係於對加工區域E1進行加工 之際，利用加工程式、與該加工程式内之刻印位置資訊 101B而對加工區域E1内之製品加工孔Η及刻印孔h進行 ❹ 雷射加工（步驟S100)。 之後，加工控制裝置10之控制部19係確認加工區域 E1是否為最後的加工區域（步驟S110)。若控制部19並非 加工區域E1最後的加工區域（步驟S110的否）則指示加工 指示部15進行加工區域之移動。藉此，加工指示部15係 依據加工程式而對於雷射加工機構20A送出將雷射光之照 射位置移動至下一個加工區域（例如加工區域E2)的指示。 雷射加工機構20A係依據來自加工指示部15的指示 而進行下一個加工區域之雷射加工。具體而言，雷射加工 16 321300 201036743 機構20A係藉由使加工工作台25於XY平面内移動而將 ' 加工位置移動至下一個加工區域。接著，雷射加工機構20Α 係於下一個加工區域將雷射光照射於製品加工孔Η以及刻 印孔h。 雷射加工裝置100係重複步驟S100與步驟S110之處 理直到加工區域成為最後加工區域為止。換言之，雷射加 工裝置100係重複往加工區域之移動、和對於加工區域内 之製品加工孔Η和刻印孔h的雷射光之照射。藉此，雷射 ❹ 加工裝置100係利用刻印位置資訊101B而於所有的加工 區域内進行製品加工孔Η與刻印孔h的雷射加工。雷射加 工裝置100係當加工區域成為最後之加工區域時（步驟 S110之是）即完全被加工物W之雷射加工。 又，本實施形態中雖以雷射加工裝置1與程式作成裝 置3連接時為例進行說明，但雷射加工裝置1與程式作成 裝置3亦可不連接。此時，加工程式係例如經由可攜性之 Q 記錄媒體等而從程式作成裝置3送至雷射加工裝置1。 另外，本實施形態中雖以當將刻印設定資訊7輸入至 程式作成裝置3後輸入製品加工孔資訊5之情形為例進行 說明，但亦可於將製品加工孔資訊5輸入程式作成裝置3 後輸入刻印設定資訊7。另外，本實施形態中雖以將製品 加工孔資訊5輸入程式作成裝置3後設定刻印孔區域s之 情形為例進行說明，但亦可於設定刻印孔區域s後將製品 加工孔資訊5輸入至程式作成裝置3。 另外，本實施形態中雖以由矩形狀的矩形區域el至 17 321300 201036743 e6來構成刻印孔區域s之情形為例進行說明，但刻印孔區 " 域s亦可由矩形狀以外之形狀的區域來構成。另外，刻印 孔區域s亦可於1個矩形區域内刻印2個以上的文字和記 號。 另外，本實施形態中雖以加工程式具有刻印位置資訊 101A、101B之情形為例進行說明，但亦可使加工程式、 與刻印位置資訊101A、101B為各別之構成。此時，係使 加工程式對應於刻印位置資訊101A、101B，而利用加工 〇 程式與刻印位置資訊101B進行雷射加工。 另外，本實施形態雖以雷射加工機構20A係採用1 束雷射光L對被加工物W進行穿孔加工的情形為例進行說 明，但亦可將本實施形態之雷射加工方法應用於可利用複 數束雷射光L對被加工物W進行加工的雷射加工機構。 第10圖為表示將雷射光多軸化之雷射加工機構之構 成例的圖。雷射加工機構20B係構成為具有分光器28、與 q 2組雷射光源（laser head)29a、29b。雷射光源29a、29b係 分別具有：電流掃描鏡22a、22b、及電流掃描器23a、23b、 及ίθ透鏡24。雷射振盪器所輸出的雷射光L係由分光器 28分光，分光後的雷射光L係同時供給至雷射光源29a、 29b。接著，從雷射光源29a、29b照射出的雷射光L係對 各個被加工物W同時實施穿孔加工。又，於第10圖中雖 以2光源之雷射加工機構20B為例進行說明，但雷射加工 機構20B亦可為4光源以上。 當在雷射光源29a側與雷射光源29b側，設定於刻印 18 321300 201036743 孔區域s的刻印孔h之位置不同時(批量編號等製品資訊不 ' 同時），雷射加工機構20B係無法在雷射光源29a側與雷射 光源29b側進行相同動作。因此，當於一方之被加工物W 設定刻印孔h且於另一方之被加工物W並未設定刻印孔h 時，不會對另一方之被加工物W照射雷射光L。當使其不 對另一方之被加工物W之刻印孔候補c照射雷射光L時 (省略加工時），例如係預先於雷射光源29a、29b設置可自 由開關而遮蔽雷射光L的光閘（slmtter)(未圖示）等，藉由關 〇 閉該光閘即可遮蔽雷射光L。 又，於第10圖中雖以雷射加工機構20B係以分光器 28將雷射光L分光，且將分光後的雷射光同時供給至雷射 光源29a、29b之情形為例進行說明，但無須同時將雷射光 L供給至雷射光源29a、29b。雷射加工機構20B亦可例如 將雷射光L交互分配至雷射光源29a、29b。具體而言，藉 由將雷射光L於雷射光源29a、29b進行時間分割，而使 Q 雷射光L依序分割為2個光路。接著，藉由雷射光源29a 和雷射光源29b而交互地將雷射光照射於一側之加工工作 台25(左側之被加工物W)與另一側之加工工作台25(右側 之被加工物W)。 如上所述，依據實施形態，可預先於加工程式内設定 刻印孔區域s，且依每個被加工物W設定刻印孔區域s内 之刻印孔h，因此，只要製品種類相同即可以相同加工程 式加工製品加工孔Η與刻印孔h。從而，亦可有效率地對 製品加工孔Η與刻印孔h進行雷射加工。 19 321300 201036743 (產業上的可利用性) 如上所述，本發明之蛩私 適合於製品用之加工孔和及雷射加工裝置係 工。 、°己錄用之加工孔的雷射加 【圖式簡單說明】J is the same as the engraved hole set by the corrected engraved position information. The engraved hole candidate c is set as the engraved hole h in the engraving hole candidate C. If no force is applied, the imprinting hole candidate c is set to be imprinted. As described above, by combining the "printing hole candidate C with the processing _ (engraving hole engraving hole, I can be I = two no, add jade) engraved hole candidate c (not or Μ Μ. ^ to e6 separately imprinted 1 text 1 . Γ , Fig. 9 shows that the rectangular areas el to e6 are respectively set to the text (lot number) "A "B " situation. L"d", "e", "f":: : : : : : : : : : : : : : : : : : : : : : : : 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 And the setting of the printing position = 321300 15 201036743 The setting of the marking position information 101B and the processing instruction specifying the position of the product processing hole and the position of the marking hole h are sent to the laser processing mechanism 20A. The laser processing mechanism 20A is based on The laser processing of the workpiece W is performed by the instruction of the processing instruction unit 15. For example, when the processing region Eb E2 shown in Fig. 6 is processed, the processing of the product in the processing region E1 is completed. After the laser processing of the marking hole h, the processing table is made When moving in the XY plane, the irradiation position of the laser light L can be moved from the inside of the processing area E1 toward the processing area E2. In the embodiment of the present embodiment, the marking position information 101B is in the marking hole area s. Each of the marking holes h is provided with information corresponding to which processing region the respective marking holes h are located in. For example, the processing regions such as the processing region E1 or the processing region E2 are made to correspond to the respective marking holes h in the marking hole region s. The laser processing apparatus 100 performs laser processing on the processing hole and the marking hole h in the processing area E1 by using the processing program and the imprint position information 101B in the processing program while processing the processing area E1. After the processing (step S100), the control unit 19 of the processing control device 10 confirms whether or not the processing region E1 is the last processing region (step S110). If the control portion 19 is not the last processing region of the processing region E1 (NO in step S110) Then, the processing instruction unit 15 instructs the movement of the processing area. Thereby, the processing instruction unit 15 sends the irradiation position of the laser light to the laser processing unit 20A in accordance with the processing program. An instruction to move to the next processing area (for example, processing area E2). The laser processing mechanism 20A performs laser processing of the next processing area in accordance with an instruction from the processing instruction unit 15. Specifically, laser processing 16 321300 201036743 The mechanism 20A moves the 'machining position to the next processing area by moving the processing table 25 in the XY plane. Then, the laser processing mechanism 20 is attached to the next processing area to irradiate the laser beam to the product processing hole and The hole processing hole 100. The laser processing apparatus 100 repeats the processes of step S100 and step S110 until the processing area becomes the final processing area. In other words, the laser processing apparatus 100 repeats the movement of the processing area and the laser light for the product processing apertures and marking holes h in the processing area. Thereby, the laser beam processing apparatus 100 performs laser processing of the product processing hole and the marking hole h in all the processing areas by using the marking position information 101B. The laser processing apparatus 100 is a laser processing of the completely workpiece W when the processing area becomes the final processing area (YES in step S110). Further, in the present embodiment, the laser processing apparatus 1 and the program preparation apparatus 3 are connected as an example. However, the laser processing apparatus 1 and the program creation apparatus 3 may not be connected. At this time, the processing program is sent from the program creation device 3 to the laser processing device 1 via, for example, a portable Q recording medium or the like. In the present embodiment, the case where the product setting hole information 5 is input after the marking setting information 7 is input to the program creating device 3 will be described as an example. However, after the product processing hole information 5 is input into the device 3, Enter the engraving setting information 7. Further, in the present embodiment, the case where the product hole information 5 is input into the apparatus 3 and the marking hole area s is set as an example will be described. However, the product processing hole information 5 may be input after the marking hole area s is set. The program is made into the device 3. Further, in the present embodiment, the case where the marking hole region s is formed by the rectangular rectangular region el to 17 321300 201036743 e6 will be described as an example, but the marking hole region " the domain s may also be a region other than the rectangular shape. Come to form. Further, the imprinted hole area s can also engrave two or more characters and symbols in one rectangular area. Further, in the present embodiment, the case where the processing program has the imprint position information 101A, 101B is described as an example. However, the processing program and the imprint position information 101A, 101B may be configured separately. At this time, the machining program is subjected to laser processing using the machining program and the marking position information 101B in correspondence with the marking position information 101A, 101B. Further, in the present embodiment, the laser processing mechanism 20A is described by taking a case where the workpiece W is punched by one laser light L. However, the laser processing method of the present embodiment can be applied to the use. A laser processing mechanism that processes a workpiece W by a plurality of beams of laser light L. Fig. 10 is a view showing an example of a configuration of a laser processing mechanism for multi-axisizing laser light. The laser processing mechanism 20B is configured to have a beam splitter 28 and a q 2 group of laser heads 29a and 29b. The laser light sources 29a, 29b have current scanning mirrors 22a, 22b, and current scanners 23a, 23b, and ίθ lenses 24, respectively. The laser light L output from the laser oscillator is split by the beam splitter 28, and the split laser light L is simultaneously supplied to the laser light sources 29a and 29b. Next, the laser light L emitted from the laser light sources 29a and 29b is simultaneously subjected to piercing processing for each workpiece W. Further, in the tenth diagram, the laser processing mechanism 20B of two light sources will be described as an example, but the laser processing mechanism 20B may be four or more light sources. When the position of the marking hole h of the hole area s is different on the side of the laser light source 29a and the laser light source 29b, the laser processing mechanism 20B cannot be in the position where the marking information of the hole area s is different. The laser light source 29a side performs the same operation as the laser light source 29b side. Therefore, when the marking hole h is set in one of the workpieces W and the marking hole h is not set in the other workpiece W, the laser beam L is not irradiated to the other workpiece W. When the laser light L is irradiated to the printing hole candidate c of the other workpiece W (when the processing is omitted), for example, a shutter that can freely switch and shield the laser light L is provided in advance in the laser light sources 29a and 29b ( Slmtter) (not shown), etc., can block the laser light L by closing the shutter. In addition, in the case of the laser processing mechanism 20B, the laser beam is split by the laser beam splitter 28, and the laser light after the splitting is simultaneously supplied to the laser light sources 29a and 29b is described as an example, but it is not necessary. At the same time, the laser light L is supplied to the laser light sources 29a, 29b. The laser processing mechanism 20B can also, for example, interactively distribute the laser light L to the laser light sources 29a, 29b. Specifically, by dividing the laser light L into the laser light sources 29a and 29b for time division, the Q laser light L is sequentially divided into two optical paths. Next, the laser light 29a and the laser light source 29b are alternately irradiated with the laser light on one side of the processing table 25 (the workpiece W on the left side) and the processing table 25 on the other side (the right side is processed W). As described above, according to the embodiment, the marking hole region s can be set in advance in the processing program, and the marking hole h in the marking hole region s can be set for each workpiece W, so that the same processing program can be used as long as the product type is the same. The processed product is processed with holes and marking holes h. Therefore, it is also possible to efficiently perform laser processing on the product processing hole and the marking hole h. 19 321300 201036743 (Industrial Applicability) As described above, the present invention is suitable for processing holes for products and laser processing equipment. , the laser of the processed hole that has been hired [Simplified illustration]
第1圖係表示實施形離之泰私 / 田射加工系統之構成的圖 弟2圖係表不加工控制裝置之構成的方塊圖。 第3圖係表示雷射加工機構之構成的圖。 第4圖為表示雷射加工之加卫處理程序的流程圖。 第5圖為表示刻印孔區域之構成例的圖。 第6圖為用以說明加工區域之構成的圖。 第7圖為表示刻印位置資訊之構成的圖。 第8圖為表示修正後之刻印位置資訊之構成的圖。 第9圖為表示以修正後之刻印位置資訊所設定 孔之一例的圖。Fig. 1 is a block diagram showing the configuration of a processing control device which is a configuration of a remote processing/field processing system. Fig. 3 is a view showing the configuration of a laser processing mechanism. Fig. 4 is a flow chart showing the processing procedure of the laser processing. Fig. 5 is a view showing an example of the configuration of the marking hole region. Fig. 6 is a view for explaining the configuration of a processing region. Fig. 7 is a view showing the constitution of the imprinted position information. Fig. 8 is a view showing the configuration of the corrected position information after the correction. Fig. 9 is a view showing an example of a hole set by the corrected inscription position information.
、第1〇圖為表示將雷射光多軸化的雷射加工機構之構 成例的圖。 再 【主要元件符 10 號說明】 雷射加工裝置 程式作成裝置 製品加工孔資訊 刻印設定資訊 加工控制裝置 輸入部 321300 20 11 201036743The first diagram is a diagram showing an example of a configuration of a laser processing mechanism that multi-axially lasers light. [Main component No. 10 description] Laser processing device Program creation device Product processing hole information Engraving setting information Processing control device Input unit 321300 20 11 201036743
12 加工程式記憶部 13 製品資訊記憶部 14 刻印設定部 15 加工指示部 19 控制部 20A、20B 雷射加工機構 22a > 22b 電流掃描鏡 23a、23b 電流掃描器 24 f0透鏡 25 加工工作台 28 分光器 29a、29b 雷射光源 100 雷射加工系統 101A ' 101B 刻印位置貧訊 c 刻印孔候補 el 至 e6 矩形區域 El 至 Em 加工區域 h 刻印孔 H 製品加工孔 L 雷射光 PI 至 Pn 製品資訊 s 刻印孔區域 W 被加工物 21 32130012 Machining program memory unit 13 Product information storage unit 14 Engraving setting unit 15 Machining instruction unit 19 Control unit 20A, 20B Laser processing mechanism 22a > 22b Current scanning mirror 23a, 23b Current scanner 24 f0 Lens 25 Machining table 28 Splitting 29a, 29b laser light source 100 laser processing system 101A '101B imprinting position poor c engraving hole candidate el to e6 rectangular area El to Em processing area h engraving hole H product processing hole L laser light PI to Pn product information s imprint Hole area W workpiece 21 321300