WO2010119537A1 - Laser machining method and laser machining device - Google Patents

Laser machining method and laser machining device Download PDF

Info

Publication number
WO2010119537A1
WO2010119537A1 PCT/JP2009/057618 JP2009057618W WO2010119537A1 WO 2010119537 A1 WO2010119537 A1 WO 2010119537A1 JP 2009057618 W JP2009057618 W JP 2009057618W WO 2010119537 A1 WO2010119537 A1 WO 2010119537A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
hole
machining
area
information recording
Prior art date
Application number
PCT/JP2009/057618
Other languages
French (fr)
Japanese (ja)
Inventor
浩一 印藤
充弘 金田
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2009/057618 priority Critical patent/WO2010119537A1/en
Priority to CN200980157936.2A priority patent/CN102348527B/en
Priority to JP2011509136A priority patent/JP5165107B2/en
Priority to KR1020117015688A priority patent/KR101282490B1/en
Priority to TW098118677A priority patent/TWI359056B/en
Publication of WO2010119537A1 publication Critical patent/WO2010119537A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Definitions

  • the present invention relates to a laser processing method and a laser processing apparatus for forming a processing hole for a product and a processing hole for information recording by laser processing.
  • a laser processing device that forms a processing hole on a workpiece by irradiating the workpiece (workpiece) with laser light
  • information on the processing of the workpiece such as the processing date and time (processing holes for information recording)
  • This stamp is formed so as to represent a character, a symbol, or the like by arranging a plurality of processed holes other than the product.
  • Such a machining program for machining product machining holes and markings treats the product machining hole group and the marking machining hole group as a sequence of points on the same XY coordinates, and the machining program as a group of holes in the same area. It was formed (for example, refer to Patent Document 1).
  • unique information such as a lot number may be stamped on each workpiece.
  • a processing area for the product and a processing area for the marking are provided, and each piece of work has its own information set in the processing area for the marking. Yes.
  • a product processing hole and a stamp are formed (for example, refer to patent documents 2).
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing method and a laser processing apparatus that efficiently form a processing hole for a product and a processing hole for information recording by laser processing.
  • the present invention provides a program for creating a machining program corresponding to a workpiece in a laser machining method for forming a machining hole in the workpiece by irradiating the workpiece with laser light.
  • a machining area setting step for setting and setting the machining area in the machining hole for the product and the information recording area; and
  • the information processing apparatus uses the processing hole arrangement position for the product, the arrangement position of the information recording area, and the processing hole and information recording area for the product in which the processing area is set.
  • a program creation step for creating a machining program in which a machining area is set in a recording area, and a control device that controls laser machining on the workpiece using the machining program, the machining hole for recording information according to the workpiece
  • a correction step of correcting the machining program by setting the position of the information in the information recording area, and the control device uses the corrected machining program to process the information recording machining holes and the information recording holes for each machining area.
  • An instruction step for outputting an instruction for forming a machining hole for a product, and laser processing for performing laser processing on the workpiece under the control of the control device Location characterized in that it comprises a machined hole formation step of forming a machined hole and machining holes for the products for the information recorded in each of the processing area based on the formation instruction.
  • the laser processing method corrects a processing program by setting a position of a processing hole for information recording corresponding to a workpiece in an information recording area, and uses the corrected processing program to process information recording Since the hole and the processed hole for the product are formed, there is an effect that the processed hole for the product and the processed hole for recording information can be efficiently laser processed.
  • FIG. 1 is a diagram illustrating a configuration of a laser processing system according to an embodiment.
  • FIG. 2 is a block diagram showing a configuration of the machining control device.
  • FIG. 3 is a diagram showing the configuration of the laser processing mechanism.
  • FIG. 4 is a flowchart showing a processing procedure of laser processing.
  • FIG. 5 is a diagram illustrating a configuration example of the marking hole area.
  • FIG. 6 is a diagram for explaining the configuration of the processing area.
  • FIG. 7 is a diagram showing the configuration of the marking position information.
  • FIG. 8 is a diagram showing the configuration of the stamp position information after correction.
  • FIG. 9 is a diagram illustrating an example of a marking hole set with the marking position information after correction.
  • FIG. 10 is a diagram illustrating a configuration example of a laser processing mechanism in which laser beams are multi-axial.
  • FIG. 1 is a diagram showing a configuration of a laser processing system according to an embodiment.
  • the laser processing system 100 is a system that forms a processing hole on the workpiece W by irradiating a workpiece (a workpiece W described later) with laser light.
  • the laser processing system 100 of the present embodiment forms a processing hole for a product (a product processing hole H described later) and a processing hole for information recording (a marking hole h described later) on the workpiece W by laser processing.
  • the marking hole h is formed (marked) so as to indicate information (product information) (a lot number, a processing date and the like) related to workpiece processing on each workpiece W, for example.
  • the marking hole h is formed so as to represent a character, a symbol, a figure, or the like by arranging one to a plurality of processed holes (processed holes that are not products).
  • the laser processing system 100 includes a laser processing device 1 and a program creation device 3.
  • the laser processing device 1 and the program creation device 3 are connected by a LAN (Local Area Network) or the like.
  • the program creation device 3 is a computer or the like that creates a machining program for the workpiece W.
  • the program creation device 3 of the present embodiment creates a machining program for each product type.
  • the arrangement of the product processing holes H to be processed into the workpiece W is the same. Therefore, even if the lot number of the workpiece W is different, if the product type is the same, the workpiece W is machined using the same machining program.
  • the program creation device 3 creates a machining program using the product machining hole information 5 and the marking setting information 7.
  • the product processing hole information 5 is information regarding the arrangement position of the product processing hole H on the workpiece W and the like.
  • the marking setting information 7 is information relating to an arrangement position or the like on the workpiece W of an area (a marking hole area s described later) in which the marking hole h is arranged. Therefore, the machining program created by the program creation device 3 has information (position information) on the position of the product machining hole H formed on the workpiece W and position information on the marking hole area s.
  • the program creation device 3 sends the created machining program to the laser machining device 1 via a LAN or the like.
  • the laser processing apparatus 1 is an apparatus that forms a processing hole on the workpiece W using a processing program and product information P1 to Pn (n is a natural number).
  • the product information P1 to Pn is information related to the arrangement position of the marking hole h (the hole to be actually processed) for marking the product information of each workpiece W, and is set for each workpiece W.
  • the laser processing apparatus 1 has a processing control device 10 and a laser processing mechanism 20A.
  • the machining control device 10 is connected to the laser machining mechanism 20 ⁇ / b> A and the program creation device 3.
  • the machining control device 10 uses the position information of the marking hole area s in the machining program and the product information P1 to Pn to determine the position of the marking hole h for machining in the marking hole area s for each workpiece W.
  • the position of the marking hole h set in the marking hole area s is the arrangement position of the marking hole h set in the product information P1 to Pn, and is different for each workpiece W.
  • the machining control device 10 modifies the machining program by setting the marking hole h in the marking hole area s. In other words, in the machining program created by the program creation device 3, the position of the marking hole area s is set, but the position of the marking hole h is not set.
  • the processing control apparatus 10 sends processing instructions for the marking hole h and the product processing hole H to the laser processing mechanism 20A based on the corrected processing program, and controls the laser processing mechanism 20A.
  • the laser processing mechanism 20 ⁇ / b> A performs laser processing on each workpiece W based on a processing instruction from the processing control device 10.
  • FIG. 2 is a block diagram showing the configuration of the machining control device 10.
  • the processing control apparatus 10 includes an input unit 11, a processing program storage unit 12, a product information storage unit 13, a marking setting unit (processing hole setting unit) 14, a processing instruction unit 15, and a control unit 19.
  • the input unit 11 inputs the machining program created by the program creation device 3, product information P1 to Pn, and various instruction information from the user.
  • the input unit 11 sends the inputted machining program to the machining program storage unit 12, and sends the inputted product information P1 to Pn to the product information storage unit 13. Further, the input unit 11 sends the input instruction information to the control unit 19.
  • the machining program storage unit 12 is a memory or the like that stores machining programs
  • the product information storage unit 13 is a memory or the like that stores product information P1 to Pn.
  • the marking setting unit 14 uses the position information of the marking hole area s in the machining program and the product information P1 to Pn to determine the position of the marking hole h to be actually processed in the marking hole area s from the product information P1 to Set for each Pn.
  • the marking setting unit 14 sets the position of the marking hole h as a position (coordinates) on the workpiece W.
  • the machining instruction unit 15 uses the position of the product machining hole H set in the machining program, the position of the marking hole h set by the marking setting unit 14, and the position of the product machining hole H and the marking hole h.
  • the designated processing instruction is output to the laser processing mechanism 20A.
  • the control unit 19 controls the input unit 11, the processing program storage unit 12, the product information storage unit 13, the marking setting unit 14, and the processing instruction unit 15.
  • FIG. 3 is a diagram showing a configuration of the laser processing mechanism according to the first embodiment.
  • the laser processing mechanism 20A includes galvano scan mirrors 22a and 22b, galvano scanners 23a and 23b, an f ⁇ lens 24, and a processing table 25 on which a workpiece W is placed.
  • the galvano scan mirror 22a is a first galvano scan mirror that receives a laser beam L output from a laser oscillator (not shown).
  • the galvano scan mirror 22a is connected to the drive shaft of the galvano scanner 23a, and the drive shaft of the galvano scanner 23a faces the Z-axis direction.
  • the mirror surface of the galvano scan mirror 22a is displaced along with the rotation of the drive shaft of the galvano scanner 23a, and deflects and scans the optical axis of the incident laser beam L in the first direction (for example, the X-axis direction). Send to the mirror 22b.
  • the galvano scan mirror 22b is a second galvano scan mirror that receives the laser light L from the galvano scan mirror 22a.
  • the galvano scan mirror 22b is connected to the drive shaft of the galvano scanner 23b, and the drive shaft of the galvano scanner 23b faces the Y-axis direction.
  • the mirror surface of the galvano scan mirror 22b is displaced in accordance with the rotation of the drive shaft of the galvano scanner 23b, and the second direction (for example, the Y-axis direction) is substantially perpendicular to the optical axis of the incident laser beam L.
  • the second direction for example, the Y-axis direction
  • the f ⁇ lens 24 collects and irradiates the work W with the laser light L that is two-dimensionally scanned in the XY plane.
  • a workpiece W such as a printed board material or a ceramic green sheet has a planar shape, and the processing table 25 places the workpiece W in the XY plane.
  • the processing table 25 is moved in the XY plane, and the laser light L is two-dimensionally scanned by the galvano scanners 23a and 23b.
  • the product machining hole H and the marking hole h are formed in the workpiece W within the scan area (the machining areas E1 to Em (m is a natural number)) within the range in which the laser light L can be two-dimensionally scanned by the galvano scanners 23a and 23b. Is done.
  • FIG. 4 is a flowchart showing a processing procedure of laser processing.
  • the marking setting information 7 indicating the position of the marking hole area s where the marking hole h is arranged is input to the program creation device 3 (step S10), and the product processing indicating the position of the product processing hole H on the workpiece W, etc.
  • the hole information 5 is input to the program creation device 3 (step S20).
  • the program creation device 3 uses the marking setting information 7 to set a marking hole area s and a marking hole candidate (a marking hole candidate c described later) in the marking hole area s.
  • the marking hole candidate c is a machining hole that may be set as the marking hole h, and the position of the machining hole is set at the stage of the marking hole candidate c.
  • the program creation device 3 sets the marking hole area s so that all the machining holes that can be set in the marking hole area s become the marking hole candidates c (step S30).
  • the configuration of the marking hole area s will be described.
  • FIG. 5 is a diagram showing a configuration example of the marking hole area.
  • the marking hole area s is composed of one to a plurality of rectangular areas.
  • FIG. 5 shows a case where the rectangular areas are rectangular areas e1 to e6.
  • each of the rectangular areas e1 to e6 is engraved with one character or symbol.
  • a plurality of marking hole candidates c are arranged at predetermined intervals in the vertical direction and the horizontal direction, respectively.
  • marking hole candidates c a part of the marking hole candidates c are set as the marking holes h, and the remaining marking hole candidates c are set as non-marking holes i to be described later. Characters and symbols will be represented.
  • the marking hole area s and the marking hole candidate c are set based on the marking setting information 7.
  • the program creation device 3 divides the workpiece W into machining areas E1 to Em (m is a natural number). In other words, the program creation device 3 sets the machining areas E1 to Em by dividing the workpiece W (step S40).
  • the configuration of the processing areas E1 to Em will be described. Since the processing areas E1 to Em have the same configuration, the configuration of the processing areas E1 and E2 will be described as an example of the processing areas E1 to Em.
  • FIG. 6 is a diagram for explaining the configuration of the processing area.
  • the processing area E1 and the processing area E2 are ranges in which the laser light L can be two-dimensionally scanned by the galvano scanners 23a and 23b, respectively. Accordingly, when machining the machining areas E1 and E2, after the laser machining in the machining area E1 is finished, the machining position is moved from the machining area E1 to the machining area E2 by moving the machining table 25 in the XY plane. Moved to. In the processing areas E1 and E2, the position of the product processing hole H and the position of the marking hole h are set, and laser processing of the workpiece W is performed based on this setting.
  • laser processing is actually performed, laser processing is performed on the product processing hole H and the marking hole h in the processing area E1, and then laser processing is performed on the product processing hole H and the marking hole h in the processing area E2. Is done. In addition, after performing the laser processing in the processing area E2, the laser processing in the processing area E1 may be performed.
  • the program creation device 3 sets the machining areas E1 to Em, and then sets all the marking hole candidates c to the marking holes h to be processed. Specifically, the program creation device 3 creates in the machining program the marking position information 101A in which all holes of the marking hole candidate c are set to “with machining” (step S50). Here, the configuration of the marking position information 101A will be described.
  • FIG. 7 is a diagram showing the configuration of the stamp position information.
  • the marking position information 101A is information (processing presence / absence information) indicating the position (XY coordinate) of the marking hole candidate c, the machining area to which the marking hole candidate c belongs, and whether or not the marking hole candidate c is set to the marking hole h.
  • the position of the marking hole candidate c in the marking position information 101A is set using the marking setting information 7. Further, any of the processing areas E1 to Em is set in the processing area to which the marking hole candidate c belongs. Further, the processing presence / absence information is all set to “processing present”. In FIG.
  • each marking hole candidate c is indicated by coordinates (x1, y2) to (xq, yq). Further, the processing areas E1 to Em are indicated by (1) to (m), respectively, and “processing” in the processing presence / absence information is indicated by “present”.
  • the stamp position information 101A created in the machining program is not limited to the configuration shown in FIG.
  • the program creation device 3 After creating the marking position information 101A, the program creation device 3 creates a machining program using the set information regarding the machining areas E1 to Em, the product machining hole information 5, and the marking position information 101A (step S60).
  • the machining program created by the program creation device 3 includes information such as the position information of the product machining hole H, the position information of the marking hole h, the machining area to which the product machining hole H belongs, and the machining area to which the marking hole h belongs. Yes.
  • the program creation device 3 creates a machining program associated with the marking position information 101A.
  • the machining program is created for each product type, even if the workpiece W is different, the same machining program is created if the product type is the same.
  • the program creation device 3 sends the created machining program to the machining control device 10 of the laser machining device 1.
  • the machining program from the program creation device 3 is sent to the machining program storage unit 12 via the input unit 11 and stored in the machining program storage unit 12.
  • product information (any of product information P1 to Pn) corresponding to the workpiece W is input from the input unit 11 (step S70).
  • the product information is sent to the product information storage unit 13 via the input unit 11 and stored in the product information storage unit 13.
  • FIG. 4 illustrates a case where the product information of the workpiece W is product information P1.
  • the laser processing apparatus 1 stores the product information P1 in the product information storage unit 13, and then starts laser processing on the workpiece W (step S80).
  • the marking setting unit 14 of the machining control device 10 corrects the machining presence / absence information in the marking position information 101A using the product information P1 (step S90). Specifically, the marking setting unit 14 sets the processing presence / absence information of the marking hole candidate c (the marking hole h not specified in the product information P1) that is not set to the marking hole h among the marking hole candidates c as “with processing”. To “no processing”.
  • FIG. 8 is a diagram showing the configuration of the stamp position information after correction.
  • the corrected marking position information 101B is an information table in which the machining area and coordinates of the marking hole h corresponding to the product information P1 are set, and is created using the marking position information 101A and the product information P1.
  • the processing presence / absence information is corrected from “processing” to “not processing”.
  • “no processing” in the processing presence / absence information is indicated as “none”.
  • FIG. 9 is a diagram showing an example of a marking hole set by the marking position information after correction.
  • the marking hole candidates c among the marking hole candidates c, the marking hole candidates c that are not set to the marking holes h in the product information P1 are set to non-marking holes i that are not subjected to laser processing.
  • the marking hole candidate c “with machining” is set as the marking hole h.
  • the combination of the stamped hole candidate c (marked hole h) with “processing” and the stamped hole candidate c (non-marked hole i) with “not processed” allows each rectangular area e1 to e6 to Each character or symbol is engraved.
  • FIG. 9 shows a case where “A”, “B”, “C”, “D”, “E”, and “F” are set as the characters (lot numbers) in the rectangular areas e1 to e6, respectively. .
  • the processing instruction unit 15 After correcting the marking position information 101A to the marking position information 101B, the processing instruction unit 15 sends a processing instruction to the laser processing mechanism 20A using a processing program. Specifically, the machining instruction unit 15 uses the position of the product machining hole H set in the machining program, the marking position information 101B set by the marking setting unit 14, and the position of the product machining hole H. A processing instruction specifying the position of the marking hole h is sent to the laser processing mechanism 20A.
  • the laser processing mechanism 20 ⁇ / b> A performs laser processing on the workpiece W in accordance with an instruction from the processing instruction unit 15. For example, when laser processing is performed on the processing areas E1 and E2 shown in FIG. 6, after the laser processing on the product processing hole H and the marking hole h in the processing area E1 is finished, the processing table 25 is moved in the XY plane. By moving, the irradiation position of the laser beam L is moved from the processing area E1 to the processing area E2.
  • each marking hole h in the marking hole area s information indicating in which processing area each marking hole h is located is associated.
  • each marking hole h in the marking hole area s is associated with a processing area such as the processing area E1 or the processing area E2. Therefore, when machining the machining area E1, the laser machining apparatus 100 uses the machining program and the marking position information 101B in the machining program to use the product machining hole H and the marking hole h in the machining area E1. Is laser processed (step S100).
  • the control unit 19 of the machining control device 10 confirms whether or not the machining area E1 is the last machining area (step S110). If the machining area E1 is not the last machining area (No at Step S110), the control unit 19 instructs the machining instruction unit 15 to move the machining area. Thereby, the process instruction
  • the laser processing mechanism 20A performs laser processing in the next processing area in accordance with an instruction from the processing instruction unit 15. Specifically, the laser processing mechanism 20A moves the processing position to the next processing area by moving the processing table 25 in the XY plane. Then, the laser processing mechanism 20A irradiates the product processing hole H and the marking hole h with laser light in the next processing area.
  • step S100 and step S110 are repeated until the processing area becomes the last processing area.
  • the laser processing apparatus 100 repeats the movement to the processing area and the irradiation of the laser beam to the product processing hole H and the marking hole h in the processing area.
  • the laser processing apparatus 100 performs laser processing of the product processing hole H and the marking hole h using the marking position information 101B in all the processing areas.
  • the laser machining apparatus 100 completes the laser machining of the workpiece W.
  • the laser processing apparatus 1 and the program creation apparatus 3 were connected was demonstrated in this Embodiment, the laser processing apparatus 1 and the program creation apparatus 3 do not need to be connected.
  • the machining program is sent from the program creation device 3 to the laser machining device 1 via, for example, a portable recording medium.
  • the case where the product machining hole information 5 is input after the marking setting information 7 is input to the program creation device 3 has been described. However, the product machining hole information 5 is input to the program creation device 3. Thereafter, the stamp setting information 7 may be input. Further, in the present embodiment, the case has been described where the stamped hole area s is set after the product drilling hole information 5 is input to the program creation device 3. However, after the stamped hole area s is set, the product drilling hole information 5 is set. May be input to the program creation device 3.
  • the marking hole area s is configured by the rectangular areas e1 to e6 having a rectangular shape has been described, but the marking hole area s may be configured by a shape area other than the rectangular shape. In the marking hole area s, two or more characters and symbols may be stamped in one rectangular area.
  • the machining program has the marking position information 101A and 101B
  • the machining program and the marking position information 101A and 101B may be configured separately.
  • the machining program is associated with the marking position information 101A and 101B, and laser machining is performed using the machining program and the marking position information 101B.
  • the laser processing mechanism 20A drills the workpiece W using one laser beam L.
  • a laser capable of processing the workpiece W using a plurality of laser beams L may be applied to the processing mechanism.
  • FIG. 10 is a diagram showing a configuration example of a laser processing mechanism in which laser beams are multi-axial.
  • the laser processing mechanism 20B includes a spectroscope 28 and two sets of laser heads 29a and 29b.
  • the laser heads 29a and 29b have galvano scan mirrors 22a and 22b, galvano scanners 23a and 23b, and an f ⁇ lens 24, respectively.
  • the laser beam L output from the laser oscillator is split by the spectroscope 28, and the split laser beam L is simultaneously supplied to the laser heads 29a and 29b. Then, the laser light L irradiated from the laser heads 29a and 29b simultaneously drills each workpiece W.
  • the two-head laser processing mechanism 20B has been described, but the laser processing mechanism 20B may have four or more heads.
  • the laser processing mechanism 20B When the position of the marking hole h set in the marking hole area s is different between the laser head 29a side and the laser head 29b (when product information such as a lot number is different), the laser processing mechanism 20B The same operation cannot be performed with the head 29b. For this reason, when the marking hole h is set in one workpiece W and the marking hole h is not set in the other workpiece W, the laser beam L is not irradiated to the other workpiece W. When the laser beam L is not irradiated to the marking hole candidate c of the other workpiece W (when processing is skipped), for example, an openable / closable shutter (not shown) that blocks the laser beam L is provided on the laser heads 29a and 29b. The laser beam L is blocked by closing this shutter.
  • the laser processing mechanism 20B splits the laser light L with the spectrometer 28 and supplies the split laser light L to the laser heads 29a and 29b at the same time.
  • the supplied laser beams L need not be supplied simultaneously.
  • the laser processing mechanism 20B may alternately distribute the laser light L to the laser heads 29a and 29b.
  • the laser beam L is divided into two optical paths in order by dividing the laser beam L into laser heads 29a and 29b.
  • the laser head 29a and the laser head 29b alternately irradiate laser light to one processing table 25 (left work W) and the other processing table 25 (right work W).
  • the marking hole area s is set in the machining program, and the marking hole h in the marking hole area s is set for each workpiece W. Therefore, if the product type is the same, the same machining is performed.
  • the product processing hole H and the marking hole h can be processed by the program. Therefore, the product processing hole H and the marking hole h can be efficiently laser processed.
  • the laser processing method and the laser processing apparatus according to the present invention are suitable for laser processing of product processing holes and information recording processing holes.

Abstract

In a method of laser-machining a work, a machining program is produced by using the arrangement position of a machining hole for the product, the arrangement position of an information recording area in which machining holes for information recording are arranged, and the machining hole for the product and the information recording area in which machining areas two-dimensionally scannable with a laser beam by a galvanoscanner are set. The machining program in which the machining area is set in the information recording area is modified by setting the position of the machining hole for information recording in accordance with the work in the information recording area. By using the modified machining program, the machining hole for information recording and the machining hole for the product are formed for each machining area.

Description

レーザ加工方法およびレーザ加工装置Laser processing method and laser processing apparatus
　本発明は、製品用の加工穴と情報記録用の加工穴をレーザ加工で形成するレーザ加工方法およびレーザ加工装置に関する。 The present invention relates to a laser processing method and a laser processing apparatus for forming a processing hole for a product and a processing hole for information recording by laser processing.
　ワーク（被加工物）にレーザ光を照射してワーク上に加工穴を形成するレーザ加工装置では、製品用の加工穴とは別に加工日時などのワーク加工に関する情報（情報記録用の加工穴）をワーク上に刻印（形成）している。この刻印は、製品以外の複数の加工穴を並べることによって文字や記号などを表すよう形成されている。このような、製品加工穴と刻印とを加工する加工プログラムは、製品加工穴群と刻印加工穴群とを、同一のＸＹ座標上の点列として扱い、同一エリア内の穴群として加工プログラムが形成されていた（例えば特許文献１参照）。 In a laser processing device that forms a processing hole on a workpiece by irradiating the workpiece (workpiece) with laser light, information on the processing of the workpiece, such as the processing date and time (processing holes for information recording), in addition to the processing holes for products Is stamped (formed) on the workpiece. This stamp is formed so as to represent a character, a symbol, or the like by arranging a plurality of processed holes other than the product. Such a machining program for machining product machining holes and markings treats the product machining hole group and the marking machining hole group as a sequence of points on the same XY coordinates, and the machining program as a group of holes in the same area. It was formed (for example, refer to Patent Document 1).
　また、各ワークに刻印する情報としてロット番号などの各ワークに独自の情報を刻印する場合がある。この場合は、製品加工穴と刻印とを別々に加工するために、製品用の加工エリアと、刻印用の加工エリアとを設け、各ワークに独自の情報を刻印用の加工エリアに設定している。そして、各加工エリアに移動しながら製品加工穴と刻印とを形成している（例えば特許文献２参照）。 In addition, as information to be stamped on each workpiece, unique information such as a lot number may be stamped on each workpiece. In this case, in order to process the product processing hole and the marking separately, a processing area for the product and a processing area for the marking are provided, and each piece of work has its own information set in the processing area for the marking. Yes. And while moving to each processing area, a product processing hole and a stamp are formed (for example, refer to patent documents 2).
特開２００８－２２１３０１号公報JP 2008-221301 A 特開昭５８－５３４４４号公報JP 58-53444 A
　しかしながら、上記前者の従来技術では、刻印する情報が変わるたびに新たな加工プログラムを作成する必要があり、加工プログラムの作成に手間がかかるという問題があった。このため、刻印する情報の変更に長時間を要していた。 However, in the former prior art, there is a problem that it is necessary to create a new machining program every time the information to be engraved changes, and it takes time to create the machining program. For this reason, it takes a long time to change the information to be stamped.
　また、上記後者の従来技術では、製品用の加工エリアとは別に刻印用の加工エリアを設ける必要があったので、レーザ加工する際の加工位置の移動（加工エリア間の移動）が増大するという問題があった。このため、各ワークのレーザ加工に長時間を要し、生産性が低下していた。 In the latter prior art, since it is necessary to provide a processing area for engraving separately from the processing area for products, the movement of the processing position (movement between processing areas) during laser processing increases. There was a problem. For this reason, the laser processing of each workpiece took a long time, and the productivity was reduced.
　本発明は、上記に鑑みてなされたものであって、効率良く製品用の加工穴と情報記録用の加工穴をレーザ加工で形成するレーザ加工方法およびレーザ加工装置を得ることを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing method and a laser processing apparatus that efficiently form a processing hole for a product and a processing hole for information recording by laser processing.
　上述した課題を解決し、目的を達成するために、本発明は、ワークにレーザ光を照射して前記ワークに加工穴を形成するレーザ加工方法において、前記ワークに応じた加工プログラムを作成するプログラム作成装置が、製品用の加工穴の配置位置と、前記製品用の加工穴とは異なる加工穴を所定の位置に並べることによって情報記録用の加工穴が配置される情報記録エリアの配置位置と、を前記ワーク上に設定する配置位置設定ステップと、前記プログラム作成装置が、ガルバノスキャナによってレーザ光を２次元走査できる加工エリアで前記ワーク上のエリアを分割することによって前記ワーク上に加工エリアを設定し、前記製品用の加工穴および前記情報記録エリアに前記加工エリアを設定する加工エリア設定ステップと、前記プログラム作成装置が、前記製品用の加工穴の配置位置と、前記情報記録エリアの配置位置と、前記加工エリアが設定された前記製品用の加工穴および情報記録エリアと、を用いて、前記情報記録エリアに加工エリアが設定された加工プログラムを作成するプログラム作成ステップと、前記加工プログラムを用いて前記ワークへのレーザ加工を制御する制御装置が、前記ワークに応じた前記情報記録用の加工穴の位置を前記情報記録エリア内に設定することによって前記加工プログラムを修正する修正ステップと、前記制御装置が、修正後の加工プログラムを用いて前記加工エリア毎に前記情報記録用の加工穴および前記製品用の加工穴の形成指示を出力する指示ステップと、前記制御装置に制御されて前記ワークへのレーザ加工を行うレーザ加工装置が、前記形成指示に基づいて前記加工エリア毎に前記情報記録用の加工穴および前記製品用の加工穴を形成する加工穴形成ステップと、を含むことを特徴とする。 In order to solve the above-described problems and achieve the object, the present invention provides a program for creating a machining program corresponding to a workpiece in a laser machining method for forming a machining hole in the workpiece by irradiating the workpiece with laser light. An arrangement position of a processing hole for a product and an information recording area where a processing hole for information recording is arranged by arranging processing holes different from the processing hole for the product at a predetermined position; , Setting the position on the workpiece, and dividing the area on the workpiece by the processing area in which the program creation device can two-dimensionally scan the laser beam with a galvano scanner. A machining area setting step for setting and setting the machining area in the machining hole for the product and the information recording area; and The information processing apparatus uses the processing hole arrangement position for the product, the arrangement position of the information recording area, and the processing hole and information recording area for the product in which the processing area is set. A program creation step for creating a machining program in which a machining area is set in a recording area, and a control device that controls laser machining on the workpiece using the machining program, the machining hole for recording information according to the workpiece A correction step of correcting the machining program by setting the position of the information in the information recording area, and the control device uses the corrected machining program to process the information recording machining holes and the information recording holes for each machining area. An instruction step for outputting an instruction for forming a machining hole for a product, and laser processing for performing laser processing on the workpiece under the control of the control device Location, characterized in that it comprises a machined hole formation step of forming a machined hole and machining holes for the products for the information recorded in each of the processing area based on the formation instruction.
　本発明にかかるレーザ加工方法は、ワークに応じた情報記録用の加工穴の位置を情報記録エリア内に設定することによって加工プログラムを修正し、修正後の加工プログラムを用いて情報記録用の加工穴および製品用の加工穴を形成するので、効率良く製品用の加工穴と情報記録用の加工穴をレーザ加工することが可能になるという効果を奏する。 The laser processing method according to the present invention corrects a processing program by setting a position of a processing hole for information recording corresponding to a workpiece in an information recording area, and uses the corrected processing program to process information recording Since the hole and the processed hole for the product are formed, there is an effect that the processed hole for the product and the processed hole for recording information can be efficiently laser processed.
図１は、実施の形態に係るレーザ加工システムの構成を示す図である。FIG. 1 is a diagram illustrating a configuration of a laser processing system according to an embodiment. 図２は、加工制御装置の構成を示すブロック図である。FIG. 2 is a block diagram showing a configuration of the machining control device. 図３は、レーザ加工機構の構成を示す図である。FIG. 3 is a diagram showing the configuration of the laser processing mechanism. 図４は、レーザ加工の加工処理手順を示すフローチャートである。FIG. 4 is a flowchart showing a processing procedure of laser processing. 図５は、刻印穴エリアの構成例を示す図である。FIG. 5 is a diagram illustrating a configuration example of the marking hole area. 図６は、加工エリアの構成を説明するための図である。FIG. 6 is a diagram for explaining the configuration of the processing area. 図７は、刻印位置情報の構成を示す図である。FIG. 7 is a diagram showing the configuration of the marking position information. 図８は、修正後の刻印位置情報の構成を示す図である。FIG. 8 is a diagram showing the configuration of the stamp position information after correction. 図９は、修正後の刻印位置情報で設定される刻印穴の一例を示す図である。FIG. 9 is a diagram illustrating an example of a marking hole set with the marking position information after correction. 図１０は、レーザ光を多軸化したレーザ加工機構の構成例を示す図である。FIG. 10 is a diagram illustrating a configuration example of a laser processing mechanism in which laser beams are multi-axial.
　以下に、本発明の実施の形態に係るレーザ加工方法およびレーザ加工装置を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。 Hereinafter, a laser processing method and a laser processing apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.
実施の形態
　図１は、実施の形態に係るレーザ加工システムの構成を示す図である。レーザ加工システム１００は、ワーク（後述のワークＷ）にレーザ光を照射してワークＷ上に加工穴を形成するシステムである。本実施の形態のレーザ加工システム１００は、ワークＷ上に製品用の加工穴（後述の製品加工穴Ｈ）と、情報記録用の加工穴（後述の刻印穴ｈ）と、をレーザ加工によって形成する。刻印穴ｈは、例えば各ワークＷへのワーク加工に関する情報（製品情報）（ロット番号や加工日時など）を示すよう形成（刻印）される。具体的には、刻印穴ｈは、１～複数の加工穴（製品とならない加工穴）を並べることによって文字、記号、図形などを表すよう形成される。 Embodiment FIG. 1 is a diagram showing a configuration of a laser processing system according to an embodiment. The laser processing system 100 is a system that forms a processing hole on the workpiece W by irradiating a workpiece (a workpiece W described later) with laser light. The laser processing system 100 of the present embodiment forms a processing hole for a product (a product processing hole H described later) and a processing hole for information recording (a marking hole h described later) on the workpiece W by laser processing. To do. The marking hole h is formed (marked) so as to indicate information (product information) (a lot number, a processing date and the like) related to workpiece processing on each workpiece W, for example. Specifically, the marking hole h is formed so as to represent a character, a symbol, a figure, or the like by arranging one to a plurality of processed holes (processed holes that are not products).
　レーザ加工システム１００は、レーザ加工装置１とプログラム作成装置３とを含んで構成されている。レーザ加工装置１とプログラム作成装置３とは、ＬＡＮ（Local　Area　Network）などによって接続されている。 The laser processing system 100 includes a laser processing device 1 and a program creation device 3. The laser processing device 1 and the program creation device 3 are connected by a LAN (Local Area Network) or the like.
　プログラム作成装置３は、ワークＷの加工プログラムを作成するコンピュータなどである。本実施の形態のプログラム作成装置３は、製品種別毎に加工プログラムを作成する。製品種別が同じ場合、ワークＷに加工する製品加工穴Ｈの配置が同じになる。したがって、ワークＷのロットナンバーが異なる場合であっても製品種別が同じであれば、ワークＷは同じ加工プログラムを用いて加工される。 The program creation device 3 is a computer or the like that creates a machining program for the workpiece W. The program creation device 3 of the present embodiment creates a machining program for each product type. When the product type is the same, the arrangement of the product processing holes H to be processed into the workpiece W is the same. Therefore, even if the lot number of the workpiece W is different, if the product type is the same, the workpiece W is machined using the same machining program.
　プログラム作成装置３は、製品加工穴情報５、刻印設定情報７を用いて加工プログラムを作成する。製品加工穴情報５は、製品加工穴ＨのワークＷ上での配置位置などに関する情報である。刻印設定情報７は、刻印穴ｈを配置するエリア（後述の刻印穴エリアｓ）のワークＷ上での配置位置などに関する情報である。したがって、プログラム作成装置３が作成する加工プログラムは、ワークＷ上に形成する製品加工穴Ｈの位置に関する情報（位置情報）と刻印穴エリアｓの位置情報とを有している。プログラム作成装置３は、作成した加工プログラムを、ＬＡＮなどを介してレーザ加工装置１に送る。 The program creation device 3 creates a machining program using the product machining hole information 5 and the marking setting information 7. The product processing hole information 5 is information regarding the arrangement position of the product processing hole H on the workpiece W and the like. The marking setting information 7 is information relating to an arrangement position or the like on the workpiece W of an area (a marking hole area s described later) in which the marking hole h is arranged. Therefore, the machining program created by the program creation device 3 has information (position information) on the position of the product machining hole H formed on the workpiece W and position information on the marking hole area s. The program creation device 3 sends the created machining program to the laser machining device 1 via a LAN or the like.
　レーザ加工装置１は、加工プログラムと製品情報Ｐ１～Ｐｎ（ｎは自然数）を用いてワークＷ上に加工穴を形成する装置である。製品情報Ｐ１～Ｐｎは、各ワークＷの製品情報を刻印するための刻印穴ｈ（実際に加工する穴）の配置位置に関する情報であり、ワークＷ毎に設定される。 The laser processing apparatus 1 is an apparatus that forms a processing hole on the workpiece W using a processing program and product information P1 to Pn (n is a natural number). The product information P1 to Pn is information related to the arrangement position of the marking hole h (the hole to be actually processed) for marking the product information of each workpiece W, and is set for each workpiece W.
　レーザ加工装置１は、加工制御装置１０とレーザ加工機構２０Ａとを有している。加工制御装置１０は、レーザ加工機構２０Ａとプログラム作成装置３に接続されている。加工制御装置１０は、加工プログラム内の刻印穴エリアｓの位置情報と、製品情報Ｐ１～Ｐｎと、を用いて、刻印穴エリアｓ内で加工を実施する刻印穴ｈの位置をワークＷ毎に設定する。刻印穴エリアｓ内に設定する刻印穴ｈの位置は、製品情報Ｐ１～Ｐｎにそれぞれ設定されている刻印穴ｈの配置位置であり、ワークＷ毎に異なる。 The laser processing apparatus 1 has a processing control device 10 and a laser processing mechanism 20A. The machining control device 10 is connected to the laser machining mechanism 20 </ b> A and the program creation device 3. The machining control device 10 uses the position information of the marking hole area s in the machining program and the product information P1 to Pn to determine the position of the marking hole h for machining in the marking hole area s for each workpiece W. Set. The position of the marking hole h set in the marking hole area s is the arrangement position of the marking hole h set in the product information P1 to Pn, and is different for each workpiece W.
　加工制御装置１０は、刻印穴エリアｓ内に刻印穴ｈを設定することによって加工プログラムを修正する。換言すると、プログラム作成装置３が作成する加工プログラムは、刻印穴エリアｓの位置は設定されているが刻印穴ｈの位置は設定されていない。加工制御装置１０は、修正後の加工プログラムに基づいて、刻印穴ｈと製品加工穴Ｈの加工指示をレーザ加工機構２０Ａに送り、レーザ加工機構２０Ａを制御する。レーザ加工機構２０Ａは、加工制御装置１０からの加工指示に基づいて、各ワークＷのレーザ加工を行う。 The machining control device 10 modifies the machining program by setting the marking hole h in the marking hole area s. In other words, in the machining program created by the program creation device 3, the position of the marking hole area s is set, but the position of the marking hole h is not set. The processing control apparatus 10 sends processing instructions for the marking hole h and the product processing hole H to the laser processing mechanism 20A based on the corrected processing program, and controls the laser processing mechanism 20A. The laser processing mechanism 20 </ b> A performs laser processing on each workpiece W based on a processing instruction from the processing control device 10.
　つぎに、加工制御装置１０の構成について説明する。図２は、加工制御装置１０の構成を示すブロック図である。加工制御装置１０は、入力部１１、加工プログラム記憶部１２、製品情報記憶部１３、刻印設定部（加工穴設定部）１４、加工指示部１５、制御部１９を有している。 Next, the configuration of the machining control device 10 will be described. FIG. 2 is a block diagram showing the configuration of the machining control device 10. The processing control apparatus 10 includes an input unit 11, a processing program storage unit 12, a product information storage unit 13, a marking setting unit (processing hole setting unit) 14, a processing instruction unit 15, and a control unit 19.
　入力部１１は、プログラム作成装置３が作成した加工プログラム、製品情報Ｐ１～Ｐｎ、使用者からの種々の指示情報を入力する。入力部１１は、入力した加工プログラムを加工プログラム記憶部１２に送り、入力した製品情報Ｐ１～Ｐｎを製品情報記憶部１３に送る。また、入力部１１は、入力した指示情報を制御部１９に送る。加工プログラム記憶部１２は、加工プログラムを記憶するメモリなどであり、製品情報記憶部１３は、製品情報Ｐ１～Ｐｎを記憶するメモリなどである。 The input unit 11 inputs the machining program created by the program creation device 3, product information P1 to Pn, and various instruction information from the user. The input unit 11 sends the inputted machining program to the machining program storage unit 12, and sends the inputted product information P1 to Pn to the product information storage unit 13. Further, the input unit 11 sends the input instruction information to the control unit 19. The machining program storage unit 12 is a memory or the like that stores machining programs, and the product information storage unit 13 is a memory or the like that stores product information P1 to Pn.
　刻印設定部１４は、加工プログラム内の刻印穴エリアｓの位置情報と、製品情報Ｐ１～Ｐｎと、を用いて、刻印穴エリアｓ内で実際に加工する刻印穴ｈの位置を製品情報Ｐ１～Ｐｎ毎に設定する。刻印設定部１４は、刻印穴ｈの位置を、ワークＷ上での位置（座標）として設定する。 The marking setting unit 14 uses the position information of the marking hole area s in the machining program and the product information P1 to Pn to determine the position of the marking hole h to be actually processed in the marking hole area s from the product information P1 to Set for each Pn. The marking setting unit 14 sets the position of the marking hole h as a position (coordinates) on the workpiece W.
　加工指示部１５は、加工プログラム内に設定されている製品加工穴Ｈの位置と、刻印設定部１４が設定した刻印穴ｈの位置と、用いて、製品加工穴Ｈと刻印穴ｈの位置を指定した加工指示をレーザ加工機構２０Ａに出力する。制御部１９は、入力部１１、加工プログラム記憶部１２、製品情報記憶部１３、刻印設定部１４、加工指示部１５を制御する。 The machining instruction unit 15 uses the position of the product machining hole H set in the machining program, the position of the marking hole h set by the marking setting unit 14, and the position of the product machining hole H and the marking hole h. The designated processing instruction is output to the laser processing mechanism 20A. The control unit 19 controls the input unit 11, the processing program storage unit 12, the product information storage unit 13, the marking setting unit 14, and the processing instruction unit 15.
　つぎに、レーザ加工機構２０Ａの構成について説明する。図３は、実施の形態１に係るレーザ加工機構の構成を示す図である。レーザ加工機構２０Ａは、ガルバノスキャンミラー２２ａ，２２ｂと、ガルバノスキャナ２３ａ，２３ｂと、ｆθレンズ２４と、ワークＷを載置する加工テーブル２５とを備えている。 Next, the configuration of the laser processing mechanism 20A will be described. FIG. 3 is a diagram showing a configuration of the laser processing mechanism according to the first embodiment. The laser processing mechanism 20A includes galvano scan mirrors 22a and 22b, galvano scanners 23a and 23b, an fθ lens 24, and a processing table 25 on which a workpiece W is placed.
　ガルバノスキャンミラー２２ａは、図示省略したレーザ発振器が出力するレーザ光Ｌを受ける第１のガルバノスキャンミラーである。ガルバノスキャンミラー２２ａは、ガルバノスキャナ２３ａの駆動軸に接続されており、ガルバノスキャナ２３ａの駆動軸は、Ｚ軸方向を向いている。ガルバノスキャンミラー２２ａのミラー面は、ガルバノスキャナ２３ａの駆動軸の回転に伴って変位し、入射するレーザ光Ｌの光軸を第１の方向（例えばＸ軸方向）に偏向走査して、ガルバノスキャンミラー２２ｂに送出する。 The galvano scan mirror 22a is a first galvano scan mirror that receives a laser beam L output from a laser oscillator (not shown). The galvano scan mirror 22a is connected to the drive shaft of the galvano scanner 23a, and the drive shaft of the galvano scanner 23a faces the Z-axis direction. The mirror surface of the galvano scan mirror 22a is displaced along with the rotation of the drive shaft of the galvano scanner 23a, and deflects and scans the optical axis of the incident laser beam L in the first direction (for example, the X-axis direction). Send to the mirror 22b.
　ガルバノスキャンミラー２２ｂは、ガルバノスキャンミラー２２ａからのレーザ光Ｌを受ける第２のガルバノスキャンミラーである。ガルバノスキャンミラー２２ｂは、ガルバノスキャナ２３ｂの駆動軸に接続されており、ガルバノスキャナ２３ｂの駆動軸は、Ｙ軸方向を向いている。ガルバノスキャンミラー２２ｂのミラー面は、ガルバノスキャナ２３ｂの駆動軸の回転に伴って変位し、入射するレーザ光Ｌの光軸を第１の方向にほぼ直交する第２の方向（例えばＹ軸方向）に偏向走査してｆθレンズ２４に送出する。 The galvano scan mirror 22b is a second galvano scan mirror that receives the laser light L from the galvano scan mirror 22a. The galvano scan mirror 22b is connected to the drive shaft of the galvano scanner 23b, and the drive shaft of the galvano scanner 23b faces the Y-axis direction. The mirror surface of the galvano scan mirror 22b is displaced in accordance with the rotation of the drive shaft of the galvano scanner 23b, and the second direction (for example, the Y-axis direction) is substantially perpendicular to the optical axis of the incident laser beam L. Are deflected and scanned and sent to the fθ lens 24.
　ｆθレンズ２４は、ＸＹ面内で２次元走査されたレーザ光ＬをワークＷ上に集光照射する。プリント基板材料やセラミックグリーンシートなどのワークＷは平面形状を有しており、加工テーブル２５は、ワークＷをＸＹ平面内に載置する。 The fθ lens 24 collects and irradiates the work W with the laser light L that is two-dimensionally scanned in the XY plane. A workpiece W such as a printed board material or a ceramic green sheet has a planar shape, and the processing table 25 places the workpiece W in the XY plane.
　レーザ加工機構２０Ａでは、加工テーブル２５をＸＹ平面内で移動させるとともに、ガルバノスキャナ２３ａ，２３ｂによってレーザ光Ｌを２次元走査する。これにより、ガルバノスキャナ２３ａ，２３ｂによってレーザ光Ｌを２次元走査できる範囲内であるスキャンエリア（加工エリアＥ１～Ｅｍ（ｍは自然数））内のワークＷに製品加工穴Ｈや刻印穴ｈが形成される。 In the laser processing mechanism 20A, the processing table 25 is moved in the XY plane, and the laser light L is two-dimensionally scanned by the galvano scanners 23a and 23b. As a result, the product machining hole H and the marking hole h are formed in the workpiece W within the scan area (the machining areas E1 to Em (m is a natural number)) within the range in which the laser light L can be two-dimensionally scanned by the galvano scanners 23a and 23b. Is done.
　つぎに、レーザ加工の加工処理手順について説明する。図４は、レーザ加工の加工処理手順を示すフローチャートである。刻印穴ｈが配置される刻印穴エリアｓの位置などを示す刻印設定情報７をプログラム作成装置３に入力するとともに（ステップＳ１０）、製品加工穴ＨのワークＷ上での位置などを示す製品加工穴情報５をプログラム作成装置３に入力する（ステップＳ２０）。 Next, the processing procedure of laser processing will be described. FIG. 4 is a flowchart showing a processing procedure of laser processing. The marking setting information 7 indicating the position of the marking hole area s where the marking hole h is arranged is input to the program creation device 3 (step S10), and the product processing indicating the position of the product processing hole H on the workpiece W, etc. The hole information 5 is input to the program creation device 3 (step S20).
　プログラム作成装置３は、刻印設定情報７を用いて刻印穴エリアｓと、刻印穴エリアｓ内での刻印穴候補（後述の刻印穴候補ｃ）を設定する。刻印穴候補ｃは、刻印穴ｈに設定される可能性のある加工穴であり、刻印穴候補ｃの段階では加工穴の位置が設定されている。プログラム作成装置３は、刻印穴エリアｓ内に設定可能な全加工穴が刻印穴候補ｃとなるよう、刻印穴エリアｓを設定する（ステップＳ３０）。ここで、刻印穴エリアｓの構成に付いて説明する。 The program creation device 3 uses the marking setting information 7 to set a marking hole area s and a marking hole candidate (a marking hole candidate c described later) in the marking hole area s. The marking hole candidate c is a machining hole that may be set as the marking hole h, and the position of the machining hole is set at the stage of the marking hole candidate c. The program creation device 3 sets the marking hole area s so that all the machining holes that can be set in the marking hole area s become the marking hole candidates c (step S30). Here, the configuration of the marking hole area s will be described.
　図５は、刻印穴エリアの構成例を示す図である。刻印穴エリアｓは、１～複数の矩形状のエリアで構成されている。図５では、矩形状のエリアが矩形エリアｅ１～ｅ６である場合を示している。例えば、各矩形エリアｅ１～ｅ６には、１つずつの文字や記号などが刻印される。矩形エリアｅ１～ｅ６には、それぞれ縦方向および横方向に所定の間隔をもって複数の刻印穴候補ｃが並べられている。図５では、各矩形エリアｅ１～ｅ６内に（横４個）×（縦７個）＝２８個の刻印穴候補ｃが並べられている場合を示している。刻印穴候補ｃのうち、一部の刻印穴候補ｃが刻印穴ｈに設定され、残りの刻印穴候補ｃが後述の非刻印穴ｉに設定されることにより、１つの矩形エリア内で１つの文字や記号などが表されることとなる。刻印穴エリアｓや刻印穴候補ｃは、刻印設定情報７に基づいて設定される。 FIG. 5 is a diagram showing a configuration example of the marking hole area. The marking hole area s is composed of one to a plurality of rectangular areas. FIG. 5 shows a case where the rectangular areas are rectangular areas e1 to e6. For example, each of the rectangular areas e1 to e6 is engraved with one character or symbol. In the rectangular areas e1 to e6, a plurality of marking hole candidates c are arranged at predetermined intervals in the vertical direction and the horizontal direction, respectively. FIG. 5 shows a case in which (4 horizontal) × (7 vertical) = 28 marking hole candidates c are arranged in each of the rectangular areas e1 to e6. Among the marking hole candidates c, a part of the marking hole candidates c are set as the marking holes h, and the remaining marking hole candidates c are set as non-marking holes i to be described later. Characters and symbols will be represented. The marking hole area s and the marking hole candidate c are set based on the marking setting information 7.
　刻印穴エリアｓを設定した後、プログラム作成装置３は、ワークＷを加工エリアＥ１～Ｅｍ（ｍは自然数）に分割する。換言すると、プログラム作成装置３は、ワークＷを分割することによって加工エリアＥ１～Ｅｍを設定する（ステップＳ４０）。ここで、加工エリアＥ１～Ｅｍの構成について説明する。なお、加工エリアＥ１～Ｅｍは、同様の構成を有しているので、加工エリアＥ１～Ｅｍの一例として加工エリアＥ１，Ｅ２の構成について説明する。 After setting the marking hole area s, the program creation device 3 divides the workpiece W into machining areas E1 to Em (m is a natural number). In other words, the program creation device 3 sets the machining areas E1 to Em by dividing the workpiece W (step S40). Here, the configuration of the processing areas E1 to Em will be described. Since the processing areas E1 to Em have the same configuration, the configuration of the processing areas E1 and E2 will be described as an example of the processing areas E1 to Em.
　図６は、加工エリアの構成を説明するための図である。加工エリアＥ１と加工エリアＥ２とは、それぞれガルバノスキャナ２３ａ，２３ｂによってレーザ光Ｌを２次元走査できる範囲である。したがって、加工エリアＥ１，Ｅ２を加工する際には、加工エリアＥ１内のレーザ加工が終わった後、加工テーブル２５をＸＹ平面内で移動させることによって、加工位置が加工エリアＥ１から加工エリアＥ２内に移動させられる。加工エリアＥ１，Ｅ２には、製品加工穴Ｈの位置や刻印穴ｈの位置が設定されており、この設定に基づいてワークＷのレーザ加工が行われる。実際にレーザ加工を行う際には、加工エリアＥ１内の製品加工穴Ｈと刻印穴ｈへのレーザ加工が行なわれ、その後、加工エリアＥ２内の製品加工穴Ｈと刻印穴ｈへのレーザ加工が行なわれる。なお、加工エリアＥ２内のレーザ加工を行った後、加工エリアＥ１内のレーザ加工を行ってもよい。 FIG. 6 is a diagram for explaining the configuration of the processing area. The processing area E1 and the processing area E2 are ranges in which the laser light L can be two-dimensionally scanned by the galvano scanners 23a and 23b, respectively. Accordingly, when machining the machining areas E1 and E2, after the laser machining in the machining area E1 is finished, the machining position is moved from the machining area E1 to the machining area E2 by moving the machining table 25 in the XY plane. Moved to. In the processing areas E1 and E2, the position of the product processing hole H and the position of the marking hole h are set, and laser processing of the workpiece W is performed based on this setting. When laser processing is actually performed, laser processing is performed on the product processing hole H and the marking hole h in the processing area E1, and then laser processing is performed on the product processing hole H and the marking hole h in the processing area E2. Is done. In addition, after performing the laser processing in the processing area E2, the laser processing in the processing area E1 may be performed.
　プログラム作成装置３は、加工エリアＥ１～Ｅｍを設定した後、全ての刻印穴候補ｃを加工対象の刻印穴ｈに設定する。具体的には、プログラム作成装置３は、刻印穴候補ｃの全穴を「加工有り」に設定した刻印位置情報１０１Ａを加工プログラム内に作成する（ステップＳ５０）。ここで刻印位置情報１０１Ａの構成について説明する。 The program creation device 3 sets the machining areas E1 to Em, and then sets all the marking hole candidates c to the marking holes h to be processed. Specifically, the program creation device 3 creates in the machining program the marking position information 101A in which all holes of the marking hole candidate c are set to “with machining” (step S50). Here, the configuration of the marking position information 101A will be described.
　図７は、刻印位置情報の構成を示す図である。刻印位置情報１０１Ａは、刻印穴候補ｃの位置（ＸＹ座標）と、刻印穴候補ｃが属する加工エリアと、刻印穴候補ｃが刻印穴ｈに設定されるか否かを示す情報（加工有無情報）と、がそれぞれ刻印穴候補ｃ毎に対応付けされた情報テーブルである。刻印位置情報１０１Ａ内の刻印穴候補ｃの位置は、刻印設定情報７を用いて設定される。また、刻印穴候補ｃが属する加工エリアには、加工エリアＥ１～Ｅｍの何れかが設定される。また、加工有無情報は、全て「加工有り」に設定される。図７では、各刻印穴候補ｃの位置を座標（ｘ１，ｙ２）～（ｘｑ，ｙｑ）で示している。また、加工エリアＥ１～Ｅｍをそれぞれ（１）～（ｍ）で示し、加工有無情報の「加工有り」を「有」で示している。なお、加工プログラム内に作成する刻印位置情報１０１Ａは、図７に示した構成に限らず他の構成であってもよい。 FIG. 7 is a diagram showing the configuration of the stamp position information. The marking position information 101A is information (processing presence / absence information) indicating the position (XY coordinate) of the marking hole candidate c, the machining area to which the marking hole candidate c belongs, and whether or not the marking hole candidate c is set to the marking hole h. Are information tables associated with each of the marking hole candidates c. The position of the marking hole candidate c in the marking position information 101A is set using the marking setting information 7. Further, any of the processing areas E1 to Em is set in the processing area to which the marking hole candidate c belongs. Further, the processing presence / absence information is all set to “processing present”. In FIG. 7, the position of each marking hole candidate c is indicated by coordinates (x1, y2) to (xq, yq). Further, the processing areas E1 to Em are indicated by (1) to (m), respectively, and “processing” in the processing presence / absence information is indicated by “present”. The stamp position information 101A created in the machining program is not limited to the configuration shown in FIG.
　刻印位置情報１０１Ａを作成した後、プログラム作成装置３は、設定した加工エリアＥ１～Ｅｍに関する情報、製品加工穴情報５、刻印位置情報１０１Ａを用いて加工プログラムを作成する（ステップＳ６０）。プログラム作成装置３が作成する加工プログラムには、製品加工穴Ｈの位置情報、刻印穴ｈの位置情報、製品加工穴Ｈの属する加工エリア、刻印穴ｈの属する加工エリアなどの情報が含まれている。換言すると、プログラム作成装置３は、刻印位置情報１０１Ａに対応付けられた加工プログラムを作成しておく。本実施の形態では、製品種別毎に加工プログラムを作成するので、ワークＷが異なる場合であっても製品種別が同じであれば同じ加工プログラムが作成される。 After creating the marking position information 101A, the program creation device 3 creates a machining program using the set information regarding the machining areas E1 to Em, the product machining hole information 5, and the marking position information 101A (step S60). The machining program created by the program creation device 3 includes information such as the position information of the product machining hole H, the position information of the marking hole h, the machining area to which the product machining hole H belongs, and the machining area to which the marking hole h belongs. Yes. In other words, the program creation device 3 creates a machining program associated with the marking position information 101A. In the present embodiment, since the machining program is created for each product type, even if the workpiece W is different, the same machining program is created if the product type is the same.
　プログラム作成装置３は、作成した加工プログラムをレーザ加工装置１の加工制御装置１０に送る。プログラム作成装置３からの加工プログラムは、入力部１１を介して加工プログラム記憶部１２に送られ、加工プログラム記憶部１２内に格納される。ワークＷのレーザ加工を開始する際には、ワークＷに対応する製品情報（製品情報Ｐ１～Ｐｎの何れか）が入力部１１から入力される（ステップＳ７０）。製品情報は、入力部１１を介して製品情報記憶部１３に送られ、製品情報記憶部１３内に格納される。図４では、ワークＷの製品情報が製品情報Ｐ１である場合について説明する。 The program creation device 3 sends the created machining program to the machining control device 10 of the laser machining device 1. The machining program from the program creation device 3 is sent to the machining program storage unit 12 via the input unit 11 and stored in the machining program storage unit 12. When laser processing of the workpiece W is started, product information (any of product information P1 to Pn) corresponding to the workpiece W is input from the input unit 11 (step S70). The product information is sent to the product information storage unit 13 via the input unit 11 and stored in the product information storage unit 13. FIG. 4 illustrates a case where the product information of the workpiece W is product information P1.
　レーザ加工装置１は、製品情報Ｐ１を製品情報記憶部１３内に格納した後、ワークＷへのレーザ加工を開始する（ステップＳ８０）。加工制御装置１０の刻印設定部１４は、製品情報Ｐ１を用いて刻印位置情報１０１Ａの加工有無情報を修正する（ステップＳ９０）。具体的には、刻印設定部１４は、刻印穴候補ｃのうち、刻印穴ｈに設定しない刻印穴候補ｃ（製品情報Ｐ１で指定されていない刻印穴ｈ）の加工有無情報を「加工有り」から「加工無し」に修正する。 The laser processing apparatus 1 stores the product information P1 in the product information storage unit 13, and then starts laser processing on the workpiece W (step S80). The marking setting unit 14 of the machining control device 10 corrects the machining presence / absence information in the marking position information 101A using the product information P1 (step S90). Specifically, the marking setting unit 14 sets the processing presence / absence information of the marking hole candidate c (the marking hole h not specified in the product information P1) that is not set to the marking hole h among the marking hole candidates c as “with processing”. To “no processing”.
　図８は、修正後の刻印位置情報の構成を示す図である。修正後の刻印位置情報１０１Ｂは、製品情報Ｐ１に対応する刻印穴ｈの加工エリアと座標が設定された情報テーブルであり、刻印位置情報１０１Ａと製品情報Ｐ１を用いて作成される。製品情報Ｐ１で刻印穴ｈに設定されていない刻印穴候補ｃは、加工有無情報が「加工有り」から「加工無し」に修正される。図８では、加工有無情報の「加工無し」を「無」で示している。 FIG. 8 is a diagram showing the configuration of the stamp position information after correction. The corrected marking position information 101B is an information table in which the machining area and coordinates of the marking hole h corresponding to the product information P1 are set, and is created using the marking position information 101A and the product information P1. For the marking hole candidate c that is not set to the marking hole h in the product information P1, the processing presence / absence information is corrected from “processing” to “not processing”. In FIG. 8, “no processing” in the processing presence / absence information is indicated as “none”.
　図９は、修正後の刻印位置情報で設定される刻印穴の一例を示す図である。同図に示すように、刻印穴候補ｃのうち製品情報Ｐ１で刻印穴ｈに設定されていない刻印穴候補ｃはレーザ加工を行わない非刻印穴ｉに設定される。これにより、「加工有り」の刻印穴候補ｃのみが刻印穴ｈに設定される。このように、「加工有り」の刻印穴候補ｃ（刻印穴ｈ）と「加工無し」の刻印穴候補ｃ（非刻印穴ｉ）とが組み合わされることによって、各矩形エリアｅ１～ｅ６では、それぞれ１つずつの文字や記号などが刻印される。図９では、矩形エリアｅ１～ｅ６に、それぞれ文字（ロット番号）として「Ａ」、「Ｂ」、「Ｃ」、「Ｄ」、「Ｅ」、「Ｆ」が設定された場合を示している。 FIG. 9 is a diagram showing an example of a marking hole set by the marking position information after correction. As shown in the figure, among the marking hole candidates c, the marking hole candidates c that are not set to the marking holes h in the product information P1 are set to non-marking holes i that are not subjected to laser processing. As a result, only the marking hole candidate c “with machining” is set as the marking hole h. As described above, the combination of the stamped hole candidate c (marked hole h) with “processing” and the stamped hole candidate c (non-marked hole i) with “not processed” allows each rectangular area e1 to e6 to Each character or symbol is engraved. FIG. 9 shows a case where “A”, “B”, “C”, “D”, “E”, and “F” are set as the characters (lot numbers) in the rectangular areas e1 to e6, respectively. .
　刻印位置情報１０１Ａを刻印位置情報１０１Ｂに修正した後、加工指示部１５は、加工プログラムを用いてレーザ加工機構２０Ａに加工指示を送る。具体的には、加工指示部１５は、加工プログラム内に設定されている製品加工穴Ｈの位置と、刻印設定部１４が設定した刻印位置情報１０１Ｂと、用いて、製品加工穴Ｈの位置と刻印穴ｈの位置を指定した加工指示をレーザ加工機構２０Ａに送る。 After correcting the marking position information 101A to the marking position information 101B, the processing instruction unit 15 sends a processing instruction to the laser processing mechanism 20A using a processing program. Specifically, the machining instruction unit 15 uses the position of the product machining hole H set in the machining program, the marking position information 101B set by the marking setting unit 14, and the position of the product machining hole H. A processing instruction specifying the position of the marking hole h is sent to the laser processing mechanism 20A.
　レーザ加工機構２０Ａは、加工指示部１５からの指示に従ってワークＷのレーザ加工を行う。例えば、図６に示した加工エリアＥ１，Ｅ２をレーザ加工する際には、加工エリアＥ１内の製品加工穴Ｈと刻印穴ｈへのレーザ加工が終わった後、加工テーブル２５をＸＹ平面内で移動させることによって、レーザ光Ｌの照射位置が加工エリアＥ１内から加工エリアＥ２内に移動させられる。 The laser processing mechanism 20 </ b> A performs laser processing on the workpiece W in accordance with an instruction from the processing instruction unit 15. For example, when laser processing is performed on the processing areas E1 and E2 shown in FIG. 6, after the laser processing on the product processing hole H and the marking hole h in the processing area E1 is finished, the processing table 25 is moved in the XY plane. By moving, the irradiation position of the laser beam L is moved from the processing area E1 to the processing area E2.
　本実施の形態では、刻印位置情報１０１Ｂ内で、刻印穴エリアｓ内の刻印穴ｈ毎に、各刻印穴ｈが何れの加工エリア内に位置しているかの情報が対応付けられている。例えば、刻印穴エリアｓ内の各刻印穴ｈに、加工エリアＥ１や加工エリアＥ２などの加工エリアが対応付けられている。したがって、レーザ加工装置１００は、加工エリアＥ１を加工する際には、加工プログラムと、この加工プログラム内の刻印位置情報１０１Ｂと、を用いて、加工エリアＥ１内の製品加工穴Ｈおよび刻印穴ｈをレーザ加工する（ステップＳ１００）。 In the present embodiment, in the marking position information 101B, for each marking hole h in the marking hole area s, information indicating in which processing area each marking hole h is located is associated. For example, each marking hole h in the marking hole area s is associated with a processing area such as the processing area E1 or the processing area E2. Therefore, when machining the machining area E1, the laser machining apparatus 100 uses the machining program and the marking position information 101B in the machining program to use the product machining hole H and the marking hole h in the machining area E1. Is laser processed (step S100).
　この後、加工制御装置１０の制御部１９は、加工エリアＥ１が最後の加工エリアであったか否かを確認する（ステップＳ１１０）。制御部１９は、加工エリアＥ１が最後の加工エリアでなければ（ステップＳ１１０、Ｎｏ）、加工指示部１５に加工エリアの移動を指示する。これにより、加工指示部１５は、加工プログラムに基づいて、レーザ光の照射位置を次の加工エリア（例えば加工エリアＥ２）に移動させる指示をレーザ加工機構２０Ａに送る。 Thereafter, the control unit 19 of the machining control device 10 confirms whether or not the machining area E1 is the last machining area (step S110). If the machining area E1 is not the last machining area (No at Step S110), the control unit 19 instructs the machining instruction unit 15 to move the machining area. Thereby, the process instruction | indication part 15 sends the instruction | indication which moves the irradiation position of a laser beam to the next process area (for example, process area E2) to the laser processing mechanism 20A based on a process program.
　レーザ加工機構２０Ａは、加工指示部１５からの指示に従って次の加工エリアでのレーザ加工を行う。具体的には、レーザ加工機構２０Ａは、加工テーブル２５をＸＹ平面内で移動させることによって、加工位置を次の加工エリアに移動させる。そして、レーザ加工機構２０Ａは、次の加工エリアで製品加工穴Ｈおよび刻印穴ｈにレーザ光を照射する。 The laser processing mechanism 20A performs laser processing in the next processing area in accordance with an instruction from the processing instruction unit 15. Specifically, the laser processing mechanism 20A moves the processing position to the next processing area by moving the processing table 25 in the XY plane. Then, the laser processing mechanism 20A irradiates the product processing hole H and the marking hole h with laser light in the next processing area.
　レーザ加工装置１００では、加工エリアが最後の加工エリアとなるまでステップＳ１００とステップＳ１１０の処理が繰り返される。換言すると、レーザ加工装置１００は、加工エリアへの移動と、加工エリア内での製品加工穴Ｈと刻印穴ｈへのレーザ光の照射を繰り返す。これにより、レーザ加工装置１００は、刻印位置情報１０１Ｂを用いた製品加工穴Ｈと刻印穴ｈのレーザ加工を全ての加工エリア内で行う。レーザ加工装置１００は、加工エリアが最後の加工エリアとなると（ステップＳ１１０、Ｙｅｓ）、ワークＷのレーザ加工を完了する。 In the laser processing apparatus 100, the processes of step S100 and step S110 are repeated until the processing area becomes the last processing area. In other words, the laser processing apparatus 100 repeats the movement to the processing area and the irradiation of the laser beam to the product processing hole H and the marking hole h in the processing area. Thereby, the laser processing apparatus 100 performs laser processing of the product processing hole H and the marking hole h using the marking position information 101B in all the processing areas. When the machining area is the last machining area (step S110, Yes), the laser machining apparatus 100 completes the laser machining of the workpiece W.
　なお、本実施の形態では、レーザ加工装置１とプログラム作成装置３が接続されている場合について説明したが、レーザ加工装置１とプログラム作成装置３とは、接続されていなくてもよい。この場合、加工プログラムは、例えば可搬性の記録媒体などを介してプログラム作成装置３からレーザ加工装置１に送られる。 In addition, although the case where the laser processing apparatus 1 and the program creation apparatus 3 were connected was demonstrated in this Embodiment, the laser processing apparatus 1 and the program creation apparatus 3 do not need to be connected. In this case, the machining program is sent from the program creation device 3 to the laser machining device 1 via, for example, a portable recording medium.
　また、本実施の形態では、プログラム作成装置３に刻印設定情報７を入力した後、製品加工穴情報５を入力する場合について説明したが、プログラム作成装置３へは製品加工穴情報５を入力した後、刻印設定情報７を入力してもよい。また、本実施の形態では、製品加工穴情報５をプログラム作成装置３に入力した後、刻印穴エリアｓを設定する場合について説明したが、刻印穴エリアｓを設定した後、製品加工穴情報５をプログラム作成装置３に入力してもよい。 Further, in the present embodiment, the case where the product machining hole information 5 is input after the marking setting information 7 is input to the program creation device 3 has been described. However, the product machining hole information 5 is input to the program creation device 3. Thereafter, the stamp setting information 7 may be input. Further, in the present embodiment, the case has been described where the stamped hole area s is set after the product drilling hole information 5 is input to the program creation device 3. However, after the stamped hole area s is set, the product drilling hole information 5 is set. May be input to the program creation device 3.
　また、本実施の形態では、刻印穴エリアｓを矩形状の矩形エリアｅ１～ｅ６で構成した場合について説明したが、刻印穴エリアｓを矩形状以外の形状領域によって構成してもよい。また、刻印穴エリアｓでは、１つの矩形エリア内に２つ以上の文字や記号を刻印してもよい。 In the present embodiment, the case where the marking hole area s is configured by the rectangular areas e1 to e6 having a rectangular shape has been described, but the marking hole area s may be configured by a shape area other than the rectangular shape. In the marking hole area s, two or more characters and symbols may be stamped in one rectangular area.
　また、本実施の形態では、加工プログラムが刻印位置情報１０１Ａ，１０１Ｂを有する場合について説明したが、加工プログラムと刻印位置情報１０１Ａ，１０１Ｂを別々の構成としてもよい。この場合、加工プログラムを、刻印位置情報１０１Ａ，１０１Ｂに対応付けておき、加工プログラムと刻印位置情報１０１Ｂを用いてレーザ加工を行う。 In this embodiment, the case where the machining program has the marking position information 101A and 101B has been described. However, the machining program and the marking position information 101A and 101B may be configured separately. In this case, the machining program is associated with the marking position information 101A and 101B, and laser machining is performed using the machining program and the marking position information 101B.
　また、本実施の形態では、レーザ加工機構２０Ａが１本のレーザ光Ｌを用いてワークＷを穴あけ加工する場合について説明したが、複数本のレーザ光Ｌを用いてワークＷを加工可能なレーザ加工機構に本実施の形態のレーザ加工方法を適用してもよい。 In this embodiment, the case where the laser processing mechanism 20A drills the workpiece W using one laser beam L has been described. However, a laser capable of processing the workpiece W using a plurality of laser beams L. The laser processing method of the present embodiment may be applied to the processing mechanism.
　図１０は、レーザ光を多軸化したレーザ加工機構の構成例を示す図である。レーザ加工機構２０Ｂは、分光器２８と２組のレーザヘッド２９ａ，２９ｂを備えて構成されている。レーザヘッド２９ａ，２９ｂは、それぞれ、ガルバノスキャンミラー２２ａ，２２ｂと、ガルバノスキャナ２３ａ，２３ｂと、ｆθレンズ２４と、有している。レーザ発振器が出力するレーザ光Ｌは、分光器２８によって分光され、分光されたレーザ光Ｌがレーザヘッド２９ａ，２９ｂに同時に供給される。そして、レーザヘッド２９ａ，２９ｂから照射されるレーザ光Ｌが、それぞれのワークＷに穴あけ加工を同時に施す。なお、図１０では、２ヘッドのレーザ加工機構２０Ｂについて説明したが、レーザ加工機構２０Ｂは、４ヘッド以上であってもよい。 FIG. 10 is a diagram showing a configuration example of a laser processing mechanism in which laser beams are multi-axial. The laser processing mechanism 20B includes a spectroscope 28 and two sets of laser heads 29a and 29b. The laser heads 29a and 29b have galvano scan mirrors 22a and 22b, galvano scanners 23a and 23b, and an fθ lens 24, respectively. The laser beam L output from the laser oscillator is split by the spectroscope 28, and the split laser beam L is simultaneously supplied to the laser heads 29a and 29b. Then, the laser light L irradiated from the laser heads 29a and 29b simultaneously drills each workpiece W. In FIG. 10, the two-head laser processing mechanism 20B has been described, but the laser processing mechanism 20B may have four or more heads.
　レーザヘッド２９ａ側とレーザヘッド２９ｂとで刻印穴エリアｓに設定される刻印穴ｈの位置が異なる場合（ロット番号などの製品情報が異なる場合）、レーザ加工機構２０Ｂは、レーザヘッド２９ａ側とレーザヘッド２９ｂとで同じ動作を行うことができない。このため、一方のワークＷでは刻印穴ｈが設定され、かつ他方のワークＷでは刻印穴ｈが設定されていない場合、他方のワークＷへはレーザ光Ｌを照射しない。他方のワークＷの刻印穴候補ｃへレーザ光Ｌを照射させない場合（加工をスキップする場合）、例えばレーザヘッド２９ａ，２９ｂにレーザ光Ｌを遮る開閉自在なシャッタ（図示せず）などを設けておき、このシャッタを閉めることによってレーザ光Ｌを遮る。 When the position of the marking hole h set in the marking hole area s is different between the laser head 29a side and the laser head 29b (when product information such as a lot number is different), the laser processing mechanism 20B The same operation cannot be performed with the head 29b. For this reason, when the marking hole h is set in one workpiece W and the marking hole h is not set in the other workpiece W, the laser beam L is not irradiated to the other workpiece W. When the laser beam L is not irradiated to the marking hole candidate c of the other workpiece W (when processing is skipped), for example, an openable / closable shutter (not shown) that blocks the laser beam L is provided on the laser heads 29a and 29b. The laser beam L is blocked by closing this shutter.
　なお、図１０では、レーザ加工機構２０Ｂが、レーザ光Ｌを分光器２８によって分光し、分光したレーザ光Ｌをレーザヘッド２９ａ，２９ｂに同時に供給する場合について説明したが、レーザヘッド２９ａ，２９ｂへ供給するレーザ光Ｌは同時に供給する必要はない。レーザ加工機構２０Ｂは、例えばレーザ光Ｌをレーザヘッド２９ａ，２９ｂに交互に振り分けてもよい。具体的には、レーザ光Ｌをレーザヘッド２９ａ，２９ｂに時間分割することによって、レーザ光Ｌを２つの光路に順番に分岐させる。そして、レーザヘッド２９ａとレーザヘッド２９ｂとによって、一方の加工テーブル２５（左側のワークＷ）と他方の加工テーブル２５（右側のワークＷ）とに交互にレーザ光を照射する。 In FIG. 10, the case where the laser processing mechanism 20B splits the laser light L with the spectrometer 28 and supplies the split laser light L to the laser heads 29a and 29b at the same time has been described. The supplied laser beams L need not be supplied simultaneously. For example, the laser processing mechanism 20B may alternately distribute the laser light L to the laser heads 29a and 29b. Specifically, the laser beam L is divided into two optical paths in order by dividing the laser beam L into laser heads 29a and 29b. Then, the laser head 29a and the laser head 29b alternately irradiate laser light to one processing table 25 (left work W) and the other processing table 25 (right work W).
　このように実施の形態によれば、加工プログラムに刻印穴エリアｓを設定しておき、ワークＷ毎に刻印穴エリアｓ内の刻印穴ｈを設定するので、製品種別が同じであれば同じ加工プログラムで製品加工穴Ｈと刻印穴ｈを加工できる。したがって、効率良く製品加工穴Ｈと刻印穴ｈをレーザ加工することが可能になる。 As described above, according to the embodiment, the marking hole area s is set in the machining program, and the marking hole h in the marking hole area s is set for each workpiece W. Therefore, if the product type is the same, the same machining is performed. The product processing hole H and the marking hole h can be processed by the program. Therefore, the product processing hole H and the marking hole h can be efficiently laser processed.
　以上のように、本発明に係るレーザ加工方法およびレーザ加工装置は、製品用の加工穴と情報記録用の加工穴のレーザ加工に適している。 As described above, the laser processing method and the laser processing apparatus according to the present invention are suitable for laser processing of product processing holes and information recording processing holes.
　１　レーザ加工装置
　３　プログラム作成装置
　５　製品加工穴情報
　７　刻印設定情報
　１０　加工制御装置
　１１　入力部
　１２　加工プログラム記憶部
　１３　製品情報記憶部
　１４　刻印設定部
　１５　加工指示部
　１９　制御部
　２０Ａ，２０Ｂ　レーザ加工機構
　２２ａ，２２ｂ　ガルバノスキャンミラー
　２３ａ，２３ｂ　ガルバノスキャナ
　２４　ｆθレンズ
　２５　加工テーブル
　２８　分光器
　２９ａ，２９ｂ　レーザヘッド
　１００　レーザ加工システム
　１０１Ａ，１０１Ｂ　刻印位置情報
　ｃ　刻印穴候補
　Ｅ１～Ｅｍ　加工エリア
　ｈ　刻印穴
　Ｈ　製品加工穴
　Ｌ　レーザ光
　Ｐ１～Ｐｎ　製品情報
　ｓ　刻印穴エリア
　Ｗ　ワーク DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 3 Program creation apparatus 5 Product processing hole information 7 Marking setting information 10 Processing control apparatus 11 Input part 12 Processing program memory | storage part 13 Product information memory | storage part 14 Marking setting part 15 Process instruction | indication part 19 Control part 20A, 20B Laser processing Mechanism 22a, 22b Galvano scan mirror 23a, 23b Galvano scanner 24 fθ lens 25 Processing table 28 Spectroscope 29a, 29b Laser head 100 Laser processing system 101A, 101B Marking position information c Marking hole candidates E1-Em Processing area h Marking hole H Product Processing hole L Laser light P1-Pn Product information s Stamping hole area W Workpiece

Claims (5)

  1. 　ワークにレーザ光を照射して前記ワークに加工穴を形成するレーザ加工方法において、
    　前記ワークに応じた加工プログラムを作成するプログラム作成装置が、製品用の加工穴の配置位置と、前記製品用の加工穴とは異なる加工穴を所定の位置に並べることによって情報記録用の加工穴が配置される情報記録エリアの配置位置と、を前記ワーク上に設定する配置位置設定ステップと、
    　前記プログラム作成装置が、ガルバノスキャナによってレーザ光を２次元走査できる加工エリアで前記ワーク上のエリアを分割することによって前記ワーク上に加工エリアを設定し、前記製品用の加工穴および前記情報記録エリアに前記加工エリアを設定する加工エリア設定ステップと、
    　前記プログラム作成装置が、前記製品用の加工穴の配置位置と、前記情報記録エリアの配置位置と、前記加工エリアが設定された前記製品用の加工穴および情報記録エリアと、を用いて、前記情報記録エリアに加工エリアが設定された加工プログラムを作成するプログラム作成ステップと、
    　前記加工プログラムを用いて前記ワークへのレーザ加工を制御する制御装置が、前記ワークに応じた前記情報記録用の加工穴の位置を前記情報記録エリア内に設定することによって前記加工プログラムを修正する修正ステップと、
    　前記制御装置が、修正後の加工プログラムを用いて前記加工エリア毎に前記情報記録用の加工穴および前記製品用の加工穴の形成指示を出力する指示ステップと、
    　前記制御装置に制御されて前記ワークへのレーザ加工を行うレーザ加工装置が、前記形成指示に基づいて前記加工エリア毎に前記情報記録用の加工穴および前記製品用の加工穴を形成する加工穴形成ステップと、
    　を含むことを特徴とするレーザ加工方法。     In a laser processing method for forming a processing hole in the work by irradiating the work with laser light,
    A program creation device for creating a machining program corresponding to the workpiece arranges a processing hole for a product at a predetermined position and a processing hole for information recording by arranging a processing hole different from the processing hole for the product. An arrangement position setting step for setting an arrangement position of the information recording area on which the object is arranged on the workpiece,
    The program creation device sets a machining area on the workpiece by dividing an area on the workpiece by a machining area in which laser light can be two-dimensionally scanned by a galvano scanner, and a machining hole for the product and the information recording area A machining area setting step for setting the machining area to
    The program creation device uses the product machining hole arrangement position, the information recording area arrangement position, and the product machining hole and information recording area in which the machining area is set, A program creation step for creating a machining program in which a machining area is set in the information recording area;
    A control device that controls laser machining on the workpiece using the machining program corrects the machining program by setting the position of the information recording machining hole corresponding to the workpiece in the information recording area. Correction steps;
    An instruction step in which the control device outputs an instruction to form the processing hole for information recording and the processing hole for the product for each processing area using a corrected processing program;
    A laser processing device that performs laser processing on the workpiece under the control of the control device forms a processing hole for information recording and a processing hole for the product for each processing area based on the forming instruction. Forming step;
    A laser processing method comprising:
  2. 　前記配置位置設定ステップでは、前記情報記録エリアに前記情報記録用の加工穴の候補となる候補穴が設定され、
    　前記プログラム作成ステップでは、前記候補穴が全て前記情報記録用の加工穴に設定された加工プログラムが作成され、
    　前記修正ステップでは、前記ワークに応じた前記情報記録用の加工穴以外の候補穴が前記候補穴の中から除外されることによって前記加工プログラムが修正されることを特徴とする請求項１に記載のレーザ加工方法。     In the arrangement position setting step, a candidate hole that is a candidate for the information recording processing hole is set in the information recording area,
    In the program creation step, a machining program is created in which all the candidate holes are set as machining holes for recording information,
    2. The modification program according to claim 1, wherein in the modification step, the machining program is modified by excluding candidate holes other than the machining hole for information recording corresponding to the workpiece from the candidate holes. Laser processing method.
  3. 　前記プログラム作成ステップでは、前記候補穴の位置と、前記候補穴の属する加工エリアと、前記候補穴が前記情報記録用の加工穴であるか否かを示す候補穴情報と、が対応付けられた対応情報が前記加工プログラム内で作成され、
    　前記修正ステップでは、前記候補情報が修正されることを特徴とする請求項１に記載のレーザ加工方法。     In the program creation step, the position of the candidate hole, the machining area to which the candidate hole belongs, and candidate hole information indicating whether or not the candidate hole is the machining hole for information recording are associated with each other. Correspondence information is created in the machining program,
    The laser processing method according to claim 1, wherein in the correction step, the candidate information is corrected.
  4. 　前記修正ステップでは、前記候補穴情報が変更されることによって前記加工プログラムが修正されることを特徴とする請求項３に記載のレーザ加工方法。 4. The laser processing method according to claim 3, wherein in the correction step, the processing program is corrected by changing the candidate hole information.
  5. 　ワークにレーザ光を照射して前記ワークに加工穴を形成するレーザ加工装置において、
    　前記ワーク上での製品用の加工穴の配置位置と、前記製品用の加工穴とは異なる加工穴を所定の位置に並べることによって情報記録用の加工穴が配置される情報記録エリアの前記ワーク上での配置位置と、ガルバノスキャナによってレーザ光を２次元走査できる加工エリアが設定された前記製品用の加工穴および前記情報記録エリアと、を用いて作成されるとともに前記情報記録エリアに前記加工エリアが設定された加工プログラムを入力する入力部と、
    　前記ワークに応じた前記情報記録用の加工穴の位置を前記情報記録エリア内に設定することによって前記加工プログラムを修正する加工穴設定部と、
    　修正後の加工プログラムを用いて前記加工エリア毎に前記情報記録用の加工穴および前記製品用の加工穴の形成指示を出力する加工指示部と、
    　前記形成指示に基づいて前記加工エリア毎に前記情報記録用の加工穴および前記製品用の加工穴を形成するレーザ加工部と、
    　を備えることを特徴とするレーザ加工装置。     In a laser processing apparatus for forming a processing hole in the work by irradiating the work with laser light,
    The workpiece in the information recording area in which the processing hole for information recording is arranged by arranging the processing hole arrangement position for the product on the workpiece and the processing hole different from the processing hole for the product at a predetermined position. The product is formed using the above-described arrangement position, the processing hole for the product in which a processing area capable of two-dimensional scanning with a galvano scanner is set, and the information recording area, and the processing is performed in the information recording area. An input unit for inputting a machining program with an area set;
    A machining hole setting unit for correcting the machining program by setting a position of the machining hole for information recording according to the workpiece in the information recording area;
    A processing instruction unit for outputting a processing hole for information recording and a processing hole for the product for each processing area using a modified processing program;
    A laser processing section for forming the information recording processing hole and the product processing hole for each processing area based on the formation instruction;
    A laser processing apparatus comprising:
PCT/JP2009/057618 2009-04-15 2009-04-15 Laser machining method and laser machining device WO2010119537A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2009/057618 WO2010119537A1 (en) 2009-04-15 2009-04-15 Laser machining method and laser machining device
CN200980157936.2A CN102348527B (en) 2009-04-15 2009-04-15 Laser machining method and laser machining device
JP2011509136A JP5165107B2 (en) 2009-04-15 2009-04-15 Laser processing method and laser processing apparatus
KR1020117015688A KR101282490B1 (en) 2009-04-15 2009-04-15 Laser machining method and laser machining device
TW098118677A TWI359056B (en) 2009-04-15 2009-06-05 Laser processing method and laser processing appar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/057618 WO2010119537A1 (en) 2009-04-15 2009-04-15 Laser machining method and laser machining device

Publications (1)

Publication Number Publication Date
WO2010119537A1 true WO2010119537A1 (en) 2010-10-21

Family

ID=42982220

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/057618 WO2010119537A1 (en) 2009-04-15 2009-04-15 Laser machining method and laser machining device

Country Status (5)

Country Link
JP (1) JP5165107B2 (en)
KR (1) KR101282490B1 (en)
CN (1) CN102348527B (en)
TW (1) TWI359056B (en)
WO (1) WO2010119537A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615281B (en) * 2012-04-09 2013-10-16 西安交通大学 Regional mobile light source scanning system for laser rapid prototyping technology
WO2021161367A1 (en) * 2020-02-10 2021-08-19 三菱電機株式会社 Laser processing method and laser processing device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478771A (en) * 1987-08-27 1989-03-24 Daimler Benz Ag Mark of industrial product or discrete part thereof
JP2004145597A (en) * 2002-10-24 2004-05-20 Sumitomo Heavy Ind Ltd Working planing method and device
JP2004141953A (en) * 2002-10-25 2004-05-20 Sumitomo Heavy Ind Ltd Machining plan method and system for processing machine
JP2004327922A (en) * 2003-04-28 2004-11-18 Sumitomo Heavy Ind Ltd Working position correction method
JP2005268423A (en) * 2004-03-17 2005-09-29 Kansai Tlo Kk Method for manufacturing wiring board using laser
JP2006289415A (en) * 2005-04-08 2006-10-26 Matsushita Electric Ind Co Ltd Laser beam machining apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3162255B2 (en) * 1994-02-24 2001-04-25 三菱電機株式会社 Laser processing method and apparatus
JP3185580B2 (en) * 1995-01-31 2001-07-11 三菱電機株式会社 Laser processing apparatus and processing method
JP5043480B2 (en) 2007-03-14 2012-10-10 日立ビアメカニクス株式会社 Printed circuit board processing machine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478771A (en) * 1987-08-27 1989-03-24 Daimler Benz Ag Mark of industrial product or discrete part thereof
JP2004145597A (en) * 2002-10-24 2004-05-20 Sumitomo Heavy Ind Ltd Working planing method and device
JP2004141953A (en) * 2002-10-25 2004-05-20 Sumitomo Heavy Ind Ltd Machining plan method and system for processing machine
JP2004327922A (en) * 2003-04-28 2004-11-18 Sumitomo Heavy Ind Ltd Working position correction method
JP2005268423A (en) * 2004-03-17 2005-09-29 Kansai Tlo Kk Method for manufacturing wiring board using laser
JP2006289415A (en) * 2005-04-08 2006-10-26 Matsushita Electric Ind Co Ltd Laser beam machining apparatus

Also Published As

Publication number Publication date
TW201036743A (en) 2010-10-16
JP5165107B2 (en) 2013-03-21
TWI359056B (en) 2012-03-01
JPWO2010119537A1 (en) 2012-10-22
CN102348527B (en) 2014-07-09
KR101282490B1 (en) 2013-07-04
KR20110102429A (en) 2011-09-16
CN102348527A (en) 2012-02-08

Similar Documents

Publication Publication Date Title
JP4765378B2 (en) Laser processing equipment
JP5236071B2 (en) LASER PROCESSING METHOD, LASER PROCESSING DEVICE, AND PROCESSING CONTROL DEVICE
JP5062838B2 (en) Laser marking device
JP5808267B2 (en) Laser processing apparatus and laser processing method
JP6365666B2 (en) Laser processing method and laser processing apparatus
JPWO2007077630A1 (en) Laser processing apparatus, program creation apparatus, and laser processing method
KR20170102250A (en) Adaptive part profile creation via independent side measurement with alignment features
JP5165107B2 (en) Laser processing method and laser processing apparatus
KR100738872B1 (en) Laser marking apparatus
JP2008006466A5 (en)
JP5043480B2 (en) Printed circuit board processing machine
JP2003285177A (en) Laser beam machining method and machining device
JP5100917B1 (en) Laser processing method
CN108500447B (en) Laser processing apparatus and laser processing method
JPH11314188A (en) Laser beam machining device and laser drilling method
JP2008132514A (en) Laser beam machining method and microcell manufactured by the method
JP2001071167A (en) Method for laser beam machining and device therefor
JP2007083249A (en) Laser beam machining device and laser beam machining method
JP2004098116A (en) Mask transfer laser pattern machining method
KR200414733Y1 (en) Laser marking apparatus
JP7283982B2 (en) LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
JPS5853444A (en) Laser marking device
JP4271969B2 (en) Method and apparatus for dividing data between multiple axes of laser beam machine
JP2017189788A (en) Laser marking device
JP2018164915A (en) Laser processing device and laser processing method

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980157936.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09843318

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2011509136

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20117015688

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09843318

Country of ref document: EP

Kind code of ref document: A1