JP6365666B2 - Laser processing method and laser processing apparatus - Google Patents

Description

The present invention relates to a method and apparatus for performing processing such as drilling, grooving, scribing, trimming, cutting, and marking on a workpiece using a laser. The workpiece includes a flat plate material such as a ceramic green sheet, a wafer, an organic film, a printed board, and a metal plate, and a sheet material.

Patent Document 1 discloses a laser processing apparatus in which laser light emitted from a laser light source is reflected by a galvano scanner, condensed by a condensing lens, and irradiated onto a workpiece. When a hole is machined with a laser beam on a large sheet placed on an XY table, the area that can be machined at a time is limited, so this machining apparatus divides the area to carry out the hole machining. In the case of performing hole machining by dividing, an allowable range is set as one machining area from the relationship between pincushion distortion by a galvano scanner, aberration characteristics by a condenser lens, and hole position accuracy.

However, since processing is performed for each area, it is necessary to repeat the steps of irradiating a predetermined area with laser once the table is stopped, and then moving the table, resulting in many time loss and longer processing time. There's a problem.

On the other hand, in Patent Document 2, when a plurality of processing holes formed on a workpiece are sequentially laser processed, an XY table is moved in the X direction or Y direction while moving the irradiation position of the laser beam in the galvano area. There has been proposed a laser processing method for moving at a predetermined speed without stopping in at least one direction. Unlike this method, it is not necessary to stop the table for each processing area, and this method may reduce the processing time.

However, in Patent Document 2, it is necessary to coordinately control the XY table and the galvano scanner so that both the processing hole to be laser processed and the next processing hole to be laser processed fit within the galvano area. In other words, since it is necessary to set so that the current processing hole and the next processing hole fit within the galvano area, when processing a plurality of holes arranged in a direction perpendicular to the scanning direction, the processing of each column For the final point, it is necessary to provide a waiting time so that the processing start point of the next row is within the galvano area or to enlarge the galvano processing area. As a result, a wasteful waiting time is generated or processing is performed at the lens end portion having a large aberration, so that there is a possibility that ability, position accuracy, and processing quality are deteriorated.

JP-A-8-174256 Japanese Patent Application Laid-Open No. 2011-140057

An object of the present invention is to propose a laser processing method and a processing apparatus capable of continuing laser processing with high accuracy and permanently while continuously moving a workpiece at a constant speed.

The present invention provides a conveying means capable of moving the workpiece in the X direction along an XY plane parallel to the main surface of the workpiece, and reflects the laser beam emitted from the laser light source onto the workpiece. This is a laser processing method for controlling a galvano scanner for irradiation. While moving the conveying means in the X direction at a constant speed, the galvano scanner scans the laser beam aiming in the X direction and Y direction so as to draw a constant locus in the galvano area, and the laser beam at a predetermined position on the scanning line. Including the step of irradiating the workpiece with the condition and range shown by the following formula.
Px / V ≧ Σ (Lt + Gt) (1)
Gx = Px × α (2)
Px: X-direction reference machining pitch of the workpiece
V: X direction moving speed of workpiece (constant)
Lt: Laser irradiation time
Gt: Galvano operating time (sighting time and settling time)
Gx: Distance in the X direction of the galvano area α: Constant (0 <α <1)

The left side of equation (1) represents the time for the workpiece to move at the reference machining pitch in the X direction of the workpiece, and the right side represents the laser irradiation time (laser oscillator operating time) and the galvano operating time (galvano scanner's operating time). Total travel time and settling time). That is, it represents the time from the start of laser processing in the first row to the start of laser processing in the second row. Equation (1) indicates a condition under which laser processing can be continued permanently because the time during which the workpiece moves in the X-direction processing pitch of the workpiece is longer than the sum of the laser irradiation time and the galvano operation time. ing. Since the formula (2) satisfies α <1, it means that the distance between the sides in the X direction of the galvano area is smaller than the reference processing pitch in the X direction of the workpiece. That is, the condition for making the galvano area constant is shown. If α> 1, the galvano aim is shifted in the movement direction (X direction) of the workpiece, and exceeds the galvano area. If over, a post-alignment operation occurs once and a time loss occurs. By setting α <1, laser processing can be performed permanently with the same galvano area.

Instead of the expression (1), it can also be expressed as follows.
Px / V = Ta + Tb (4)
Here, Ta is the total machining time in the Y direction, and Tb is the machining time for returning in the X direction.

In general, since a galvano scanner scans a laser beam by moving a lightweight mirror, high-speed and high-accuracy scanning is possible, but the operation range is small. On the other hand, the workpiece can take a large range of movement, but it is difficult to move at high speed / stop instantaneously. Taking these characteristics into consideration, the galvano scanner, the laser oscillator, and the movement of the workpiece are controlled synchronously under the conditions that satisfy the expressions (1) and (2), so that the continuous object in the X direction can be obtained. The processing area of the workpiece can be laser processed continuously (non-stop), and the processing efficiency can be improved. Since the workpiece is simply moved continuously at a constant speed, control is simplified, the time during which the workpiece is stopped can be eliminated, and the total machining time can be shortened. Since the galvano area can be set at the central portion of the condenser lens with relatively small aberration, high-precision processing can be performed.

In this specification, “scanning so as to draw a constant locus” means scanning in a so-called “single stroke”. In other words, the trajectory starts from a coordinate point with an aim and returns to the first coordinate point via another point. The trajectory may be, for example, a linear reciprocating movement, a triangular shape or an 8-shaped shape, and is arbitrary as long as it is a scanning trajectory that returns to the original coordinate point in the galvano area. . The galvano area is an allowable range in the XY region that can be scanned by the galvano scanner, and from the relationship between pin cushion distortion by the galvano scanner and aberration characteristics by the condenser lens and processing position accuracy. The trajectory is included. The galvano scanner is intermittently operated, that is, usually point-to-point controlled. In this control, the aim is quickly moved from the current processing point to the next processing point, and laser light is emitted from the laser oscillator while stopping at the next processing point. Note that the galvano scanner may be continuously operated instead of the intermittent operation method. The conveying means in the present invention may be any means that can move the workpiece in the X direction along the XY plane parallel to the main surface of the workpiece. For example, an XY table or a table that moves only in the X direction. The belt conveyor moving in the X direction is arbitrary. Further, when the workpiece is a continuous roll sheet, a transport roll may be used as the transport means.

It is desirable that the scanning path of the sighting by the galvano scanner is a figure eight. That is, the following first to eighth steps are repeated while moving the conveying means in the X plus direction at a constant speed. That is, the first step of irradiating the first point on the XY plane with the laser beam, the second step of scanning the laser beam aiming from the first point in the X plus direction and the Y plus direction as a whole by the galvano scanner, the first point The third step of irradiating the second point displaced in the X plus direction and the Y plus direction with respect to the laser beam, the fourth step of scanning the laser beam aiming from the second point in the X minus direction by the galvano scanner, the second step A fifth step of irradiating a laser beam to a third point displaced in the X minus direction with respect to the point, a sixth step of scanning the laser beam aiming as a whole from the third point in the X plus direction and the Y minus direction by a galvano scanner , A seventh step of irradiating the fourth point displaced in the X plus direction and the Y minus direction with respect to the third point with a laser beam; Scanning the quasi from the fourth point in the X minus direction, a eighth step of returning the aiming of the laser beam to the first point. In the second step, “scan in the X plus direction and Y plus direction as a whole” means that the second step is comprehensive even if there is a portion that is not locally “X plus direction and Y plus direction”. Then, it means that scanning is performed in “X plus direction and Y plus direction”. “As a whole” in the sixth step has the same meaning. In this way, if the aim is scanned in the shape of a figure 8, two rows of processing can be performed in the Y direction in one cycle. Since unnecessary scanning such as post-alignment is not required, a large number of holes and grooves can be processed efficiently.

As processing conditions for tracing the figure 8 scanning path, it is desirable to satisfy the conditions and ranges represented by the following equations.
Px / V ≧ Gy / Py × (Lt + Gyt) + Gxt + Lt (3)
Gx: Distance of the side in the X direction of the galvano area
Gy: Y direction distance of galvano area
Py: Y-direction reference machining pitch of the workpiece
Lt: Laser irradiation time
Gyt: Y direction galvano operation time
Gxt: X direction galvo operating time

The left side of the equation (3) represents the time for the workpiece to move the reference machining pitch in the X direction of the workpiece, and the first term on the right side is the number of machinings between the Y direction distances of the galvano area, It is the product of the laser irradiation time and the sum of the Y-direction galvano operation time and represents a row of processing time for scanning the laser light in the Y-direction. The second term is the X direction galvano operation time, and the third term is the laser irradiation time. By satisfying this conditional expression, it is possible to perform permanent processing when following an 8-shaped scanning path.

The above-mentioned 8-shaped path is an example in which laser irradiation is performed four times in total from the first step to the eighth step, but during the scanning of the second step, that is, from the first point to the second point. A ninth step of irradiating the laser beam during the shift may be provided, and a tenth step of irradiating the laser beam during the scan of the sixth step, that is, while moving from the third point to the fourth point may be provided. The number of times of laser light irradiation in the ninth step and the tenth step is not limited to one and is arbitrary. In this way, a large number of holes can be machined when moving in the Y direction.

As described above, according to the present invention, while moving the workpiece at a constant speed in the X direction, the galvano scanner scans the laser beam aiming in the X and Y directions so as to draw a constant locus in the galvano area. The workpiece is irradiated with laser light at a predetermined position. Then, the time during which the workpiece moves in the X-direction machining pitch of the workpiece is made longer than the sum of the laser irradiation time and the galvano operation time, and the distance between the sides in the X direction of the galvano area is set in the X direction of the workpiece. Since it is smaller than the reference processing pitch, laser processing can be continued continuously without stopping the workpiece while keeping the galvano area constant. As a result, it is possible to realize laser processing that achieves both accuracy and mass productivity.

1 is an overall view of an example of a laser processing apparatus according to the present invention. It is a block diagram of a control apparatus. An example of the galvano area in the present invention, the hole position of the workpiece, and the scanning order of the aim is shown. It is a figure which shows 1st Example of a laser processing. The sighting scanning example (a) in the second embodiment and the position (b) of the hole machined in the workpiece W are shown. The sighting scanning example (a) in the third embodiment and the position (b) of the hole processed in the workpiece W are shown. The sighting scanning example (a) in the fourth embodiment and the position (b) of the hole machined in the workpiece W are shown. The sighting scanning example (a) of the fifth embodiment and the position (b) of the hole machined in the workpiece W are shown. The sighting scanning example (a) of the sixth embodiment and the position (b) of the hole machined in the workpiece W are shown. It is a figure which shows 7th Example of a laser processing.

FIG. 1 shows an overall view of an example of a laser processing apparatus according to the present invention. The laser processing apparatus 1 of the present embodiment is an apparatus for processing a via hole or the like in a ceramic green sheet W that is an example of a workpiece. The laser processing apparatus 1 includes a laser oscillator 10 that is a laser light source, a galvano scanner 20 that scans the aim (or optical axis) of the laser light L in the XY directions, and a condenser lens 30. Specifically, the galvano scanner 20 includes a mirror 21 and an actuator 22 that scan the aim in the X direction, and a mirror 23 and an actuator 24 that scan the aim in the Y direction. Further, an XY table 40 that is movable along the XY plane is provided below the condenser lens 30, and the workpiece W is placed on the table. The XY table 40 includes a motor 41 that drives the table 40 in the X direction and a motor 42 that drives the table 40 in the Y direction. The control device 50 is connected to the laser oscillator 10, the actuators 22 and 24 of the galvano scanner 20, and the motors 41 and 42 by wiring, and synchronously controls the laser oscillator 10, the galvano scanner 20 and the XY table 40 by a method described later. be able to.

As shown by a broken line in FIG. 1, the area S <b> 1 extending in a strip shape in the X direction of the workpiece W can be non-stop laser processed while the table 40 is continuously moved in the X direction. After finishing the processing of the area S1, the adjacent area S2 can be laser processed non-stop while moving the table 40 by one pitch in the Y direction and moving the table 40 again in the X direction at a constant speed. . Therefore, the entire area of the workpiece W can be efficiently drilled.

FIG. 2 shows a block diagram of the control device 50. Position information is sent to the control device 50 from the galvano scanner 20 and the motors 41 and 42. The control device 50 synchronously controls the laser oscillator 10, the galvano scanner 20, and the table 40 based on the input position information. Specifically, when the movement of the table 40 in the Y direction is completed, a positioning completion signal is sent from the motor 42 to the control device 50, and the aim is moved to the initial position by the galvano scanner 20. While moving the table 40 at a constant speed in the X direction, the galvano scanner 20 scans the sight in the galvano area in a predetermined order, and irradiates the laser beam from the laser oscillator 10 at a predetermined position to form a hole in the workpiece W. Process.

FIG. 3 shows an example of the galvano area GA, the hole position of the workpiece W, and the scanning sequence of the aim. Here, the sight is scanned in a single stroke so as to draw a figure of 8 in the galvano area GA, and a, b, c, d, e (same as b), f, g (same as a) on the scanning line ) Laser is irradiated at each point. The workpiece W moves at a constant speed V in the X direction, but the galvano area GA is held at a fixed position. By repeating the points a → b → c → d → e → f → g as one cycle, non-stop drilling can be performed. A plurality (three in this case) of holes H arranged in a line in the Y direction are formed in the workpiece W at a predetermined pitch in the X direction. Here, the processing pitch in the X direction of the hole is Px, the moving speed of the workpiece W in the X direction is V, the laser irradiation time (one shot) is Lt, the galvano operation time is Gt, and the distance in the X direction side of the galvano area Let Gx be
Px / V ≧ Σ (Lt + Gt) (1)
Gx = Px × α (0 <α <1) (2)
The relationship is set. The laser irradiation time Lt includes a rise time and a fall time necessary for laser irradiation.

The left side of equation (1) represents the time for the workpiece W to move by the reference machining pitch in the X direction of the workpiece, and the right side represents the irradiation time Lt between the points a to d and the operation time Gt of the galvano scanner. That is, the time from the start of laser processing in the first row to the start of laser processing in the second row. Since (2) is α <1, Gx <Px is indicated. That is, the distance Gx between the sides in the X direction of the galvano area is smaller than the X-direction machining pitch Px of the holes.

Next, an example of laser processing in the present invention will be described with reference to FIG. FIG. 4A shows the moment when the aim of the laser beam is positioned at the first point a and the point a is irradiated (shot) with the laser beam. A black circle indicates the current irradiation position of the laser beam (the latest hole processed at the present time), and a white circle indicates a processed hole.

FIG. 4B shows the moment when the laser beam is scanned from the point a in an acute angle direction with respect to the X plus direction and the Y plus direction, and the second point b is irradiated with the laser beam. If the angle formed by the movement direction of the aim and the X plus direction is θ (<90 °), the angle formed by the movement direction of the aim and the Y plus direction is 90 ° −θ. Since the workpiece W also moves in the X direction for a time corresponding to the sum of the scanning time (galvano operation time) for aiming from the point a to the point b and the laser irradiation time, the hole a1 and the second point b Are aligned at the same position in the X direction.

FIG. 4C shows the moment when the laser beam is scanned from the point b in an acute angle direction with respect to the X plus direction and the Y plus direction, and the third point c is irradiated with the laser beam. Similarly to the above, since the workpiece W also moves in the X direction for a time corresponding to the sum of the scanning time (galvano operation time) for aiming from the point b to the point c and the laser irradiation time, the holes a1, b1 And the third point hole c1 are arranged at the same position in the X direction. In other words, the holes a1, b1, and c1 are arranged in a line in the Y direction. A hole d to be processed next (indicated by a broken circle) is outside the galvano area GA.

FIG. 4D shows the moment when the laser beam is scanned from the point c in the X minus direction and the fourth point d is irradiated with the laser beam. Since the workpiece W moves in the X direction for a time corresponding to the sum of the scanning time (galvano operation time) for aiming from the point c to the point d and the laser irradiation time, the hole c1 and the hole d1 at the fourth point The X direction pitch Px is larger than the distance Gx of the X direction side of the galvano area.

FIG. 4E shows the moment when the laser beam is scanned from the point d in an acute angle direction with respect to the X plus direction and the Y minus direction, and the fifth point e is irradiated with the laser beam. Since the workpiece W moves in the X direction for a time corresponding to the sum of the scanning time (galvano operation time) for aiming from the point d to the point e and the laser irradiation time, the hole d1 and the fifth point hole e1 Are aligned at the same position in the X direction.

FIG. 4F shows the moment when the laser beam is scanned from the point e in an acute angle direction with respect to the X plus direction and the Y minus direction, and the sixth point f is irradiated with the laser beam. Since the workpiece W moves in the X direction for a time corresponding to the sum of the scanning time (galvano operation time) for aiming from the point e to the point f and the laser irradiation time, the holes d1, e1 and the sixth point The holes f1 are arranged at the same position in the X direction. In this state, the hole g to be processed next (indicated by a broken-line circle) is outside the galvano area GA.

FIG. 4G shows the moment when the laser beam aim is scanned from the point f in the X minus direction, and the laser beam aim is returned to the first point g (same as a). Since the workpiece W moves in the X direction for a time corresponding to the sum of the scanning time (galvano operation time) for aiming from the point f to the point g and the laser irradiation time, the aim is set at the same position as the first point a. By returning to g, the pitch Px between the hole f1 and the hole g1 becomes larger than the distance Gx of the side in the X direction of the galvano area. Thereafter, the steps (A) to (G) are repeated as described above.

As a method of conveying the workpiece W, the workpiece W can be conveyed in the X direction by using a plurality of conveyance rolls in addition to the table 40. When the workpiece W is a continuous roll-shaped sheet, the sighting is scanned in a single stroke so as to draw an 8-character shape as described above, so that the sheet is permanently stopped in the length direction without stopping the sheet. Can be processed. Moreover, since two rows of holes can be processed by one cycle of scanning, mass productivity is high. Since scanning such as post-alignment is not required, useless time can be reduced. Since the workpiece W only moves at a constant speed and the galvano scanner 20 only needs to be scanned at a predetermined cycle, the control is simple. Since the galvano area GA can be set at the center of the condenser lens 30 where the influence of aberration is relatively small, high-precision processing can be performed.

3 and 4 show an example in which three holes are machined in the Y direction on one workpiece W, but the number of holes can be arbitrarily set. Moreover, although the example which processes a hole by the fixed pitch in the Y direction of the to-be-processed object W was shown, the hole processing by which the pitch of the Y direction is not constant is also possible. Further, a large number of holes can be simultaneously processed as a group by using a mask or a beam splitter having a large number of pin holes. In that case, a group of holes is regarded as an aggregate figure, and the interval between the aggregate figures becomes the reference processing pitch.

-Second Example-
5A shows a scanning example of the second embodiment of the aiming, and FIG. 5B shows the position of the hole processed in the workpiece W. FIG. In FIG. 5, scanning is performed so as to draw a figure of 8 as a whole as indicated by a broken line in (a), and there are 6 holes each in the scanning line from the upper left to the lower right and the scanning line from the lower left to the upper right. Is processed. Therefore, as in FIG. 3, the holes are aligned in the Y direction and the pitch in the Y direction is constant. A square mark indicates a shot (or hole position) in the first row and a diamond mark indicates a second row. Thus, by increasing the number of shots on the scanning line, the number of holes per row can be increased.

-Third Example-
6A shows a scanning example of the third embodiment of the aim, and FIG. 6B shows the position of the hole processed in the workpiece W. FIG. In FIG. 6, scanning is performed so as to draw a figure of 8 as a whole as indicated by a broken line in FIG. 6A, but the scanning line is not a straight line in a diagonal direction as shown in FIG. The scanning line from the upper left to the lower right and the scanning line from the lower left to the upper right are symmetrical. Therefore, the holes are arranged in a line in the Y direction, but the Y direction pitch is not constant. The number of processed holes arranged in the Y direction is 7 per row. A square mark indicates a shot (or hole position) in the first row and a diamond mark indicates a second row.

-Fourth embodiment-
FIG. 7A shows a scanning example of the fourth embodiment of the aim, and FIG. 7B shows the position of the hole processed in the workpiece W. FIG. In FIG. 7, scanning is performed so as to draw a figure of 8 as a whole as indicated by a broken line in FIG. 7A, but the scanning line is further bent in a polygonal line as compared with FIG. 6, and from the upper left to the lower right. The scan line and the scan line from the lower left to the upper right are asymmetrical. Although the galvano area GA of the first to third embodiments is rectangular, the galvano area GA of this embodiment is a parallelogram. For this reason, the holes are not arranged in a line in the Y direction, but have a zigzag or staggered arrangement. The number of processed holes arranged in the Y direction is six per row. A square mark indicates a shot (or hole position) in the first row and a diamond mark indicates a second row.

-Fifth embodiment-
8A shows a scanning example of the fifth embodiment of the aim, and FIG. 8B shows the position of the hole processed in the workpiece W. FIG. In FIG. 8, scanning is performed so as to draw a figure 8 as a whole as shown by a broken line in FIG. 8A, but the scanning line from the upper left to the lower right and the scanning line from the lower left to the upper right are asymmetrical. The scanning line is similar to the embodiment of FIG. 7, but the bending angle of the broken line is larger than that. For this reason, the pitch in the Y direction of the holes is constant, but they are not arranged in a line in the Y direction. Specifically, it is a zigzag or staggered arrangement. The number of processed holes arranged in the Y direction is six per row. A square mark indicates a shot (or hole position) in the first row and a diamond mark indicates a second row. The series 1 moves to points ab to c to d to e to f, and laser irradiation is performed at the points of the square marks in the meantime. After returning to the point f to g in the X minus direction, the series 2 moves to the points g to h to i to j to k to l, during which laser irradiation is performed at the point of the diamond mark. Unlike the other embodiments, in this embodiment, scanning between points ab, cd, ef, hi, and jk is in the X minus direction.

-Sixth Example-
FIG. 9A shows a scanning example of the sixth embodiment of the aim, and FIG. 9B shows the position of the hole processed in the workpiece W. FIG. In the case of FIG. 9 as well, scanning is performed so as to draw a figure of 8 as a whole, but a plurality of shots are performed in the vicinity of each point. Therefore, a plurality of small holes arranged close to each other in the Y direction can be formed at one place.

-Seventh Example-
FIG. 10 shows a modification of the galvano area GA, the hole position of the workpiece W, and the aiming scanning order. Here, the sight is scanned so as to reciprocate in the oblique direction in the galvano area GA, the laser is irradiated at points a, b, c, d, and e on the scanning line, and then returned to the point a. Irradiation is not performed during the return from point e to point a. By repeating the points a.fwdarw.c.fwdarw.c.fwdarw.d.fwdarw.e.fwdarw.a as one cycle, holes arranged in a line in the Y direction can be machined, and non-stop drilling can be performed. In the workpiece W, a plurality of (here, five) holes H arranged in a line in the Y direction are formed at a predetermined pitch Px in the X direction. Also in this case, the distance Gx of the galvano area GA in the X direction is smaller than the pitch Px, so if the aim is returned from point e to point a during time (Px−Gx) / V, the machining is continued continuously. can do.

Although FIG. 10 shows an example in which the scanning path of points a → b → c → d → e is linear, it may be a polygonal line as shown in FIGS. The holes to be processed in this case have a non-uniform Y-direction pitch as shown in FIG. 6 or a zigzag shape as shown in FIG. It should be noted that the return operation from the point e to the point a is preferably linear so that it can return in the shortest time.

The above-described embodiments are merely a few examples of the present invention, and the movement trajectory of the aim can be arbitrarily selected according to the position of the hole to be processed. That is, it is not limited to an 8-shaped, Z-shaped, or diagonally reciprocating shape. Moreover, although the example which performs a hole process on a sheet | seat was demonstrated in the said Example, other processes, such as a groove process, a scribe, a trimming, a cutting | disconnection, and a marking, can also be performed. As a workpiece, any ceramic wafer, semiconductor wafer, resin film, printed board, metal plate, or the like that can be laser-processed can be used.

W Workpiece 1 Laser processing apparatus 10 Laser oscillator 20 Galvano scanner 30 Condensing lens 40 XY table (conveying means)
50 Control device

Claims (4)

Conveying means capable of moving the workpiece in the X direction along an XY plane parallel to the main surface of the workpiece, and a galvano for reflecting the laser beam emitted from the laser light source and irradiating the workpiece on the workpiece In a laser processing method for controlling a scanner,
While moving the conveying means at a constant speed in the X direction, the galvano scanner scans the laser beam in the X and Y directions so as to draw an 8-shaped locus in the galvano area. Including the following first to eighth steps of irradiating the workpiece with laser light at a predetermined position;
A first step of irradiating a first point on the XY plane with the laser beam;
A second step of scanning the aim of the laser beam by the galvano scanner in the X plus direction and the Y plus direction as a whole from the first point;
A third step of irradiating the laser beam to a second point displaced in the X plus direction and the Y plus direction with respect to the first point;
A fourth step of scanning the aim of the laser beam in the X minus direction from the second point by the galvano scanner;
A fifth step of irradiating the third point displaced in the X-minus direction with respect to the second point with the laser beam;
A sixth step of scanning the aim of the laser beam by the galvano scanner in the X plus direction and the Y minus direction as a whole from the third point;
A seventh step of irradiating the laser beam to a fourth point displaced in the X plus direction and the Y minus direction with respect to the third point;
An eighth step of scanning the aim of the laser beam from the fourth point in the X minus direction by the galvano scanner and returning the aim of the laser beam to the first point;
A laser processing method characterized by processing under the conditions and ranges shown by the following formulas.
Px / V ≧ Σ (Lt + Gt) (1)
Gx = Px × α (2)
Px: Reference machining pitch in the X direction of the workpiece
V: X-direction moving speed of workpiece
Lt: Laser irradiation time
Gt: Galvano operating time (sighting time and settling time)
Gx: Distance between sides in the X direction of the galvano area α: Constant (0 <α <1) The laser processing method according to claim 1, wherein the processing is performed under conditions and ranges represented by the following equations.
Px / V ≧ Gy / Py × (Lt + Gyt) + Gxt + Lt (3)
Gy: Y direction distance of galvano area
Py: Y-direction reference machining pitch of the workpiece
Lt: Laser irradiation time
Gyt: Y direction galvano operation time
Gxt: X direction galvo operating time A ninth step of irradiating the laser beam during the transition from the first point to the second point during the scanning of the second step;
During the scanning of the sixth step, and having a tenth step of irradiating the laser beam while moving the fourth point from the third point, the laser processing method according to claim 1 or 2 . Conveying means for moving the workpiece in the X direction at a constant speed in an XY plane parallel to the main surface of the workpiece;
A galvano scanner that reflects laser light emitted from a laser light source and irradiates the workpiece with an X -shaped locus so that the galvano scanner draws an 8-shaped locus in the galvano area. A galvano scanner that scans in the direction and the Y direction;
A laser oscillator that generates laser light when the aim of the laser light reaches a predetermined position on the scanning line;
E Bei a control means for synchronously controlling so as to conditions and scope of the laser oscillator said carrier means and galvanometer scanners, given by the following equation,
Px / V ≧ Σ (Lt + Gt) (1)
Gx = Px × α (2)
Px: Reference machining pitch in the X direction of the workpiece
V: X-direction moving speed of workpiece
Lt: Laser irradiation time
Gt: Galvano operating time (sighting time and settling time)
Gx: Distance in the X direction of the galvano area α: Constant (0 <α <1)
The control means includes
A first step of irradiating a first point on the XY plane with the laser beam;
A second step of scanning the aim of the laser beam by the galvano scanner in the X plus direction and the Y plus direction as a whole from the first point;
A third step of irradiating the laser beam to a second point displaced in the X plus direction and the Y plus direction with respect to the first point;
A fourth step of scanning the aim of the laser beam in the X minus direction from the second point by the galvano scanner;
A fifth step of irradiating the third point displaced in the X-minus direction with respect to the second point with the laser beam;
A sixth step of scanning the aim of the laser beam by the galvano scanner in the X plus direction and the Y minus direction as a whole from the third point;
A seventh step of irradiating the laser beam to a fourth point displaced in the X plus direction and the Y minus direction with respect to the third point;
An eighth step of scanning the aim of the laser beam from the fourth point in the X minus direction by the galvano scanner and returning the aim of the laser beam to the first point;
Control to include,
Laser processing equipment.

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