CN106457470A - Laser machining method and laser machining device - Google Patents
Laser machining method and laser machining device Download PDFInfo
- Publication number
- CN106457470A CN106457470A CN201580034997.5A CN201580034997A CN106457470A CN 106457470 A CN106457470 A CN 106457470A CN 201580034997 A CN201580034997 A CN 201580034997A CN 106457470 A CN106457470 A CN 106457470A
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- laser
- point
- machined object
- galvano scanner
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Proposed is a laser machining method, in which laser machining is continued in an uninterrupted manner and with high accuracy while a workpiece is continuously moved at a fixed speed. Also proposed is a laser machining device. The laser machining method comprises a step in which, while a workpiece W is moved at a fixed speed in the X direction, the aim of a laser beam is made to scan, by means of a galvano scanner, in the X direction and the Y direction so that the laser beam draws a fixed trajectory within a galvano area, and the workpiece is irradiated by the laser beam at a prescribed position on the scanning line. The machining is carried out under the conditions and scope indicated by the formulas (1)Px/V>=Sigmate (Lt+Gt)and (2) Gx=PxXAlpha, where Px is the reference machining pitch of the workpiece in the X direction, V is the movement speed of the workpiece in the X direction, Lt is the laser irradiation time, Gt is the galvano operation time (the aim movement time and settling time),Gx is the length of the galvano area in the X direction, and Alpha is a constant (0<Alpha<1).
Description
Technical field
The present invention relates to laser machined object implements that hole processing, groove processs, rule, cut out, cut-out, mark etc. are processed method and device. as machined object, comprise tabular material, the sheet materials such as ceramic green sheet, wafer, organic film, printed base plate, metallic plate.
Japan capital mansion
In patent documentation 1, disclose the galvano scanner for laser penetrating from LASER Light Source (galvano scanner) reflect and carry out light harvesting by light collecting lens and be radiated at the laser processing device on machined object. utilizing laser to carrying the large-scale sheet material being placed on XY worktable carries out in the situation of hole processing, because the region that once can process is limited, therefore this adds frock is put cut zone and is implemented hole processing. by cut apart to carry out hole processing in the situation that, according to being caused by galvano scanner pincushion distortion, the relations such as the distortion performance being caused by light collecting lens and the positional precision in hole, using allowed band as once adding its result, produce the useless stand-by period, or enter in the larger lens end of distortion.
But, owing to processing in each region, therefore there is following problem: the then such step of travelling table of area illumination laser to regulation under the state that need to repeat temporarily to stop at workbench, the loss of time is more, and process time is elongated.
On the other hand, in patent documentation 2, following laser processing is proposed: when being formed at multiple machining holes on machined object and carrying out Laser Processing successively, make the irradiation position of laser mobile in electric scanning region (galvano area) on one side, make on one side XY worktable ceaselessly move at least one direction in directions X or Y-direction with the speed of regulation. the method is different from patent documentation 1, owing to need to workbench not being stopped at each machining area, therefore may shorten process time.
But, in patent documentation 2, need to coordinate to control to XY worktable and galvano scanner, make to become laser the machining hole of processing object and the machining hole both sides that become next Laser Processing object are positioned at electric scanning region., by in setting current machining hole for and next machining hole is all positioned at electric scanning region, therefore to being configured in and scanning carry out in the situation of multiple row processing in multiple holes in the vertical direction of direction, processing ending point for each row need to arrange wait time, make the processing starting point of next column be positioned at electric scanning region, or need to expand electric scanning machining area (galvano operation area). territory, work area is set row processing, therefore may make ability, positional precision, and processing quality declines.
Prior art document
Patent documentation
Patent documentation 1: Japanese patent laid-open 8-174256 communique patent documentation 2: Japanese Patent Laid-Open 2011-140057 communique
Summary of the invention
Invent technical problem to be solved
The object of the invention is to propose a kind of can be when machined object be with fixed speed continuous moving high accuracy and continue incessantly laser processing and the processing unit (plant) of Laser Processing.
The technical scheme of technical solution problem
The present invention is a kind of laser processing, it is for controlling: along with the XY plane of the main surface parallel of machined object the delivery unit that described machined object can be moved on directions X, and make the laser reflection penetrating from LASER Light Source and shine penetrate the galvano scanner on machined object. comprise following step: delivery unit is carried out on directions X with fixed speed on one side mobile, utilize on one side aiming point that galvano scanner makes laser in electric scanning region in the mode of describing fixation locus at directions X and scan in Y-direction, and assigned position on scan line irradiates laser to machined object, thereby formula is below shown condition and scope in process.
Px/V≥Σ(Lt+Gt)···(1)
Gx＝Px×α???(2)
Px: the directions X benchmark processing spacing of machined object
V: the directions X translational speed (fixing) of machined object
Lt: laser irradiation time
Gt: electric scanning actuation time (traveling time of aiming point and stabilization time)
Gx: the distance on the limit of the directions X in electric scanning region
α: constant (0 < α < 1)
(1) left side of formula represents machined object time mobile used in the benchmark processing spacing of the directions X of machined object, the right represents the total of laser irradiation time (actuation time of laser oscillator) and electric scanning actuation time (traveling time of the aiming point of galvano scanner and stabilization time)., represent to start till the time that the Laser Processing of secondary series starts from the Laser Processing of first row. (1) formula, it is longer than laser irradiation time and electric scanning sum actuation time that machined object moves the time used in the directions X processing spacing of machined object, therefore showing the condition that can continue incessantly Laser Processing. (2) formula refers to due to α < 1, therefore the distance on the limit of the directions X in electric scanning region is less than the benchmark processing spacing of the directions X of machined object., the condition that electric scanning region is fixing is shown. suppose α > 1, electric scanning aiming point is upper skew of moving direction (directions X) of machined object, if will exceed electric scanning region. exceed, the action once align afterwards, will generation time loss. by being made as α < 1, thereby can in same electric scanning region, carry out incessantly Laser Processing.
Also can represent as follows to replace (1) formula.
Px/V＝Ta+Tb???(4)
Herein, Ta is the total of the process time of Y-direction, and Tb is the process time of returning of directions X.
Generally, galvano scanner makes the reflective mirror that weight is lighter move scan laser, although therefore can carry out high speed and high-precision scanning, but actuating range is less. on the other hand, although the moving range of machined object is larger, but be difficult to height speed movement/moment stops. considering above-mentioned characteristic, by in satisfied (1) formula, (2) Synchronization Control electric scanning under the condition of formula instrument, laser oscillator, and the movement of machined object, thereby can hold the machining area of machined object continuous on directions X continuous ground (incessantly) carries out Laser Processing, thereby can improve working (machining) efficiency. only need make machined object move continuously with fixed speed moving, therefore control and become simple, and can eliminate the time that machined object stops, and can shorten total elapsed time. electric scanning region can be set in the central portion of the less light collecting lens of distortion, therefore can carry out high-precision processing.
In this manual, the scanning that " to describe the mode of fixation locus " carries out refers to that what is called sweeps " unicursal one-tenth " retouch., be back to the track of initial coordinate points via other points according to the coordinate points from aiming point place. this track example as being moving back and forth of straight line, also can be triangle, 8 word shapes, original as long as being back in electric scanning region the track while scan that coordinate points is such, can be track at random. electric scanning region refers to that galvano scanner can scan XY district in territory and according to the pincushion distortion of galvano scanner, the model that the relation of the distortion performance of light collecting lens and Working position precision allows enclose, wherein comprising described track. galvano scanner is carried out action intermittently and is conventionally carried out point-to-point control. in this control, from current processing stand till next processing stand moves aiming point rapidly, during next processing stand stops from laser oscillator irradiates laser. in addition, can make galvano scanner continuous action replace the method that makes galvano scanner intermitten. delivery unit of the present invention is as long as can be along making machined object on directions X with the XY plane of the main surface parallel of machined object mobile unit, for example XY worktable, the workbench only moving on directions X, the belt conveyor moving on directions X Etc. arbitrary delivery unit.And, in the case that machined object is continuous rolled sheet material, it is also possible to use transfer roller conduct delivery unit.
Preferably the scanning pattern of the aiming point of galvano scanner is set to 8 shape., make delivery unit in X pros on one side Moved with fixed speed upwards, repeat the first～the 8th following step.That is, laser is radiated on X/Y plane The first step of first; By galvano scanner, the aiming point of laser is scanned from first point of entirety to X positive direction and Y positive direction Second step; Irradiate the 3rd of laser at the second point that has carried out displacement with respect to first in X positive direction and Y positive direction Step; The four steps that the aiming point of laser scanned from second point to X negative direction is made by galvano scanner; With respect to second point In X negative direction, carry out the 5th step of thirdly irradiating laser of displacement; By galvano scanner make the aiming point of laser from The 6th step that thirdly entirety is scanned to X positive direction and Y negative direction; With respect to thirdly in X positive direction and Y negative direction The 7th step of the 4th point of irradiating laser of displacement is carried out; Make the aiming point of laser negative to X from the 4th point by galvano scanner Scanning direction also makes the aiming point of laser be back to the 8th step of first. and in addition, in second step, " entirety is to X pros To and the scanning of Y positive direction " even if it is not the part of " X positive direction and Y positive direction " to refer to locally lie in, if comprehensive second step comes Saying, is also " to X positive direction and Y positive direction " scanning. " entirety " in 6th step is also the identical meaning.If as described above Make aiming point in 8 shape be scanned, then can 1 circulation in the Y direction on carry out 2 row processing.Due to need not be as it Useless scanning as aliging afterwards, therefore, it is possible to efficiently process multiple holes, groove.
Condition and scope preferably shown by satisfaction following formula is used as the processing bar of the scanning pattern according to 8 shape
Part.
Px/V≥Gy/Py×(Lt+Gyt)+Gxt+Lt···(3)
Gx：The distance on the side of the X-direction in electric scanning region
Gy：The Y-direction distance in electric scanning region
Py：The benchmark processing spacing of the Y-direction of machined object
Lt：Laser irradiation time
Gyt：Y-direction electric scanning movement time
Gxt：X-direction electric scanning movement time
(3) left side of formula represents machined object in the benchmark processing spacing movement of the X-direction of the machined object time used,
The Section 1 on the right represents the Y-direction distance of laser irradiation time and Y-direction electric scanning sum movement time and electric scanning region
Between product, the i.e. laser of processing number of times scan process time of string in the Y direction.Section 2 is X-direction electric scanning action
Time, Section 3 is laser irradiation time.By meeting the condition formula such that it is able in the scanning pattern according to 8 shape
In the case of, processed incessantly.
Although 8 above-mentioned shape paths are to carry out 4 laser irradiations from first step to total the 8th step
Example, but can in the way of the scanning of second step i.e. from first point be moved to second point during irradiating laser is set
9th step, it is also possible to which irradiating laser is set in the way of the scanning of the 6th step i.e. during be thirdly moved at the 4th point
The tenth step.Laser in 9th step and the tenth step irradiates the arbitrary number of times that number of times is not limited to 1 time.Thereby, it is possible to
Multiple holes are processed to Y-direction when moving.
Invention effect
As described above, according to the present invention, can make machined object in the X direction with fixed speed continuous moving, on one side
Which is caused to depict fixation locus in electric scanning region using the aiming point of galvano scanner scanning laser in x and y directions,
Assigned position is to machined object irradiating laser.And, machined object is when used by the X-direction processing spacing of machined object is moved
Between longer with electric scanning sum movement time than laser irradiation time, the distance on the side of the X-direction in electric scanning region is than processed
The benchmark processing spacing of the X-direction of thing is less, therefore, it is possible to make machined object not in the state of keeping electric scanning region to fix
Lasting Laser Processing is carried out with stopping.As a result, can realize taking into account the Laser Processing of precision and production.
Description of the drawings
Fig. 1 is the overall diagram of an example of laser processing device involved in the present invention.
Fig. 2 is the block diagram of control device.
Fig. 3 shows that of the scanning sequency in the electric scanning region, the hole site of machined object and aiming point of the present invention shows
Example.
Fig. 4 is the figure of the 1st embodiment for illustrating Laser Processing.
Fig. 5 illustrates the position (b) in scanning example (a) of the aiming point of the 2nd embodiment and the hole for processing on machined object W.
Fig. 6 illustrates the position (b) in scanning example (a) of the aiming point of the 3rd embodiment and the hole for processing on machined object W.
Fig. 7 illustrates the position (b) in scanning example (a) of the aiming point of the 4th embodiment and the hole for processing on machined object W.
Fig. 8 illustrates the position (b) in scanning example (a) of the aiming point of the 5th embodiment and the hole for processing on machined object W.
Fig. 9 illustrates the position (b) in scanning example (a) of the aiming point of the 6th embodiment and the hole for processing on machined object W.
Figure 10 is the figure of the 7th embodiment for illustrating Laser Processing.
Specific embodiment
Fig. 1 illustrates the overall diagram of an example of laser processing device involved in the present invention.The laser of the present embodiment adds
Frock put 1 be for processing via etc. on an example i.e. ceramic green sheet W of machined object device.Laser processing device 1
It is laser oscillator 10, makes the galvano scanner that the aiming point (or optical axis) of laser L scanned up in XY side including LASER Light Source
20 and light collecting lenss 30.Specifically, galvano scanner 20 includes the illuminator 21 for making aiming point scan in the X direction and causes
Dynamic device 22, make illuminator 23 and actuator 24 that aiming point scanned in the Y direction.Also, arrange in the lower section of light collecting lenss 30
Machined object W can be loaded on the workbench along the XY worktable 40 of X/Y plane movement.XY worktable 40 possesses in X-direction
The upper motor 41 for driving the workbench 40 and the in the Y direction motor 42 of driving workbench 40.Control device 50 passes through cloth
Line is connected with laser oscillator 10, the actuator 22,24 of galvano scanner 20 and motor 41,42, can be in method described later
Synchronization Control laser oscillator 10, galvano scanner 20 and XY worktable 40.
As with shown in dotted line in Fig. 1, the continuous moving in the X direction of workbench 40 can be made, while to machined object W
The region S1 for zonally extending in the X direction laser machined incessantly.After the processing for completing region S1, work is made
Platform 40 moves 1 spacing along Y-direction, so that workbench 40 is moved with fixed speed in the X direction again, while to adjacent
Region S2 is laser machined incessantly.Thus, it is possible to efficiently carry out hole machined to the whole region of machined object W.
Fig. 2 illustrates the block diagram of control device 50.Position is sent from galvano scanner 20 and motor 41,42 to control device 50
Information.Positional information of the control device 50 based on input, synchronizes to laser oscillator 10, galvano scanner 20 and workbench 40
Control.Specifically, if the Y-direction movement of workbench 40 is completed, positioning is sent from motor 42 to control device 50 and is completed
Signal, makes aiming point move to initial position by galvano scanner 20.While making workbench 40 move with fixed speed in the X direction
Dynamic, pass through sequential scan aiming point of the galvano scanner 20 in electric scanning region to specify, and in assigned position from laser
10 irradiating laser of agitator is so as to process hole on machined object W.
Fig. 3 shows that of the scanning sequency of electric scanning region GA, the hole site of machined object W and aiming point shows
Example.Herein, in the GA of electric scanning region, aiming point is scanned in the way of describing 8 words unicursal, and in scan line
A, b, c, d, e (identical with b), each point irradiating laser of f, g (identical with a).Although machined object W is in the X direction with fixation
Speed V is moved, but electric scanning region GA is maintained at fixed position.By point a → b → c → d → e → f → g is followed as 1
Ring is repeated, so as to carry out continual perforate processing.On machined object W, multiple (these for forming a line in the Y direction
Locating as 3) hole H separates the spacing of regulation in the X direction and formed.Herein, if the processing spacing of the X-direction in hole is set to Px, incites somebody to action
The X-direction translational speed of machined object W be set to V, laser irradiation time (single fraction irradiation) is set to Lt, by electric scanning movement time
It is set to Gt and the distance on the side of the X-direction in electric scanning region is set to Gx, then following relation is obtained：
Px/V≥Σ(Lt+Gt)···(1)
Gx=Px × α (0 ＜ α ＜ 1) (2).
In addition, also including rise time and the fall time required for irradiating for laser in laser irradiation time Lt.
(1) left side of formula represents machined object W when used by the benchmark processing spacing of the X-direction of machined object is moved
Between, the right represent irradiation time Lt between point a～point d and galvano scanner movement time Gt total, i.e. swashing from first row
Light processing starts the time to the Laser Processing of secondary series starts.(2) formula represents due to α ＜ 1, therefore Gx ＜ Px.That is, electricity
The side of the X-direction of scanner apart from Gx than hole X-direction processing spacing Px less.
Then, with reference to Fig. 4, one example of the Laser Processing of the present invention is illustrated.(A) of Fig. 4 represents at first point
A positioning laser aiming point and on the point a irradiating laser (shooting) moment.Stain represents the current irradiation position of laser
(in the newest hole of current time processing), white point represents machined hole.
(B) of Fig. 4 represent by the aiming point of laser from point a with respect to X positive direction and Y positive direction to acute angle scanning direction from
And the moment in second point b irradiating laser.If the angle for constituting the moving direction of aiming point with X positive direction is set to θ (＜
90 °), then the angle that the moving direction of aiming point is constituted with Y positive direction is 90 ° of-θ.Machined object W also works as to X-direction mobile phase
In aiming point sweep time (electric scanning movement time) from point a to point b and laser irradiation time and time, therefore hole a1
It is arranged in the same position of X-direction with second point b.
(C) of Fig. 4 represent by the aiming point of laser from point b with respect to X positive direction and Y positive direction to acute angle scanning direction from
And the moment in thirdly c irradiating laser.Same as described above, machined object W is also to X-direction movement equivalent to from point b to point c's
Aiming point sweep time (electric scanning movement time) and laser irradiation time and time, therefore hole a1, b1 and thirdly hole
C1 is arranged in the same position of X-direction.In other words, hole a1, b1, c1 is formed a line in the Y direction.In addition, will then process
Hole d (being represented with the round dot of dotted line) in the outside of electric scanning region GA.
The aiming point of laser is scanned so as to the wink in the 4th point of d irradiating laser by (D) expression of Fig. 4 from point c to X negative direction
Between.Machined object W is to X-direction movement equivalent to aiming point sweep time (electric scanning movement time) from point c to point d and laser
The time of the sum of irradiation time, therefore X-direction spacing Px of the hole d1 of hole c1 and the 4th point is than the side of the X-direction in electric scanning region
Bigger apart from Gx.
(E) of Fig. 4 represents by the aiming point of laser from point d with respect to X positive direction and Y negative direction to acute angle scanning direction simultaneously
Moment in the 5th point of e irradiating laser.Machined object W is to X-direction movement equivalent to the aiming point sweep time from point d to point e
(electric scanning movement time) and laser irradiation time and time, therefore hole d1 be arranged in the identical of X-direction with the 5th point of e1
On position.
(F) of Fig. 4 represents by the aiming point of laser from point e with respect to X positive direction and Y negative direction to acute angle scanning direction simultaneously
Moment in the 6th point of f irradiating laser.Machined object W is to X-direction movement equivalent to the aiming point sweep time from point e to point f
(electric scanning movement time) and laser irradiation time and time, therefore the hole f1 of hole d1, e1 and the 6th point be arranged in X-direction
Same position on.In this condition, hole g (being represented with the round dot of dotted line) then to be processed is in the outer of electric scanning region GA
Side.
(G) of Fig. 4 represents and scans the aiming point of laser from point f to X negative direction and the aiming point of laser is back to the
The moment of 1 point of g (identical with a).Machined object W is to X-direction movement equivalent to aiming point (electricity sweep time from point f to point g
The scanning motion time) with laser irradiation time and time, therefore by aiming point is back to and first point of a identical position
G is put, bigger apart from Gx than the side of the X-direction in electric scanning region so as to spacing Px of hole f1 and hole g1.Afterwards, same as described above
The step of ground repeats (A)～(G).
As the method for transmission machined object W, in addition to workbench 40, can be by using multiple transfer rollers in X side
It is passed up machined object W.In the case that machined object is for continuous rolled sheet material, by make as described above aiming point with
The mode for describing 8 words carries out the scanning of unicursal such that it is able to be processed on the long side direction of sheet material incessantly, and not
Stop can sheet material.Also, due to being processed to 2 row holes in the scanning of 1 circulation, therefore production is higher.By
In need not after the such scanning of alignment, therefore, it is possible to reduce the useless time.Machined object W only need to be moved with fixed speed
And galvano scanner 20 was scanned with the cycle for specifying, therefore control simple.Electric scanning region GA can be set in abnormal
The central part for affecting smaller light collecting lenss 30 of change, therefore can carry out high-precision processing.
Although the example for 1 machined object W being processed in the Y direction to 3 holes, energy is shown in Fig. 3, Fig. 4
The number of enough arbitrarily setting hole.Additionally, though it is shown that separating determining deviation processing hole in the Y-direction of machined object W
Example, but the unfixed hole machined of the spacing that can also carry out Y-direction.Additionally it is possible to using covering with multiple pin holes
Film, spectroscope etc., multiple Kong Weiyi groups are carried out while processing.In this case, one group of hole is considered as set figure, gathers figure
Each be partitioned on the basis of process spacing.
- the 2 embodiment-
(a) of Fig. 5 illustrates the scanning example of the second embodiment of aiming point, and (b) of Fig. 5 is shown in the hole that process on machined object W
Position.In Fig. 5, overall as being represented by dashed line in (a) be scanned in the way of describing 8 words, with from upper left to
6 holes are processed by the scan line of bottom right and from lower-left to the scan line of upper right respectively.Therefore, identical with Fig. 3, hole is in Y side
It is arranged in string upwards, and Y-direction spacing is fixed.Square mark represents the shooting (or hole site) of first row, rhombus mark
Will represents the shooting (or hole site) of secondary series.Number of times is shot from there through increasing in scan line, by increasing capacitance it is possible to increase per string
Hole number.
- the 3 embodiment-
(a) of Fig. 6 illustrates the scanning example of the 3rd embodiment of aiming point, and (b) of Fig. 6 is shown in the hole that process on machined object W
Position.In Fig. 6, although as being represented by dashed line in (a), entirety is scanned in the way of describing 8 words, but is swept
Line is retouched for polyline shaped rather than oblique single straight wire as shown in Figure 5.From upper left to the scan line of bottom right and from lower-left to upper right
Scan line symmetrically shape.Therefore, hole is arranged in string in the Y direction, but Y-direction spacing is not fixed.In the Y direction
The number in the processing hole of arrangement is every string 7.Square mark represents the shooting (or hole site) of first row, diamond sign table
Show the shooting (or hole site) of secondary series.
- the 4 embodiment-
(a) of Fig. 7 illustrates the scanning example of the fourth embodiment of aiming point, and (b) of Fig. 7 is shown in the hole that process on machined object W
Position.In Fig. 7, overall as being represented by dashed line in (a) be scanned in the way of describing 8 words, scan line and Fig. 6
Compare further and be bent into polyline shaped, and from upper left to the scan line of bottom right with from scan line from lower-left to upper right in left and right non-
Symmetrically.Although the electric scanning region GA of first～3rd embodiment is rectangle, the electric scanning region GA of the embodiment
Parallelogram.Therefore, hole is not arranged in string in the Y direction, in meandering shape or staggered arrangement.Arrange in the Y direction
Processing hole number be every string 6.Square mark represents the shooting (or hole site) of first row, and diamond sign represents the
The shooting (or hole site) of two row.
- the 5 embodiment-
(a) of Fig. 8 illustrates the scanning example of the 5th embodiment of aiming point, and (b) of Fig. 8 is shown in the hole that process on machined object W
Position.In Fig. 8, as being represented by dashed line in (a), entirety is scanned in the way of describing 8 words, but from upper left
To bottom right scan line with from scan line from lower-left to upper right in left and right asymmetric.Although scan line is similar to the embodiment of Fig. 7,
But the angle of bend of broken line is bigger in contrast.Therefore, although the Y-direction spacing in hole is fixed, but is not in the Y direction
It is arranged in string.Specifically, in meandering shape or staggered arrangement.The number in the processing hole for arranging in the Y direction is each
Row 6.Square mark represents the shooting (or hole site) of first row, and diamond sign represents shooting (or the hole position of secondary series
Put).Series 1 is moved according to point a～b～c～d～e～f, carries out laser irradiation therebetween on the point of square mark.?
After return action having been carried out according to point f～g in X negative direction, series 2 is moved according to g～h～i～j～k～l, therebetween
Laser irradiation is carried out on the point of diamond sign.Different from other embodiment, in this embodiment, between point ab, between cd, between ef,
Scanning between hi, between jk is X negative direction.
- the 6 embodiment-
(a) of Fig. 9 illustrates the scanning example of the sixth embodiment of aiming point, and (b) of Fig. 9 is shown in the hole that process on machined object W
Position.Although the situation of Fig. 9 is also entirety being scanned in the way of describing 8 words, carry out near each point multiple
Shooting.Multiple in the Y direction near the aperture for arranging therefore, it is possible to be formed at one.
- the 7 embodiment-
Figure 10 shows the variation of the scanning sequency of electric scanning region GA, the hole site of machined object W and aiming point.This
Place, in the GA of electric scanning region, is scanned, in scan line in the way of so that aiming point is in an inclined direction moved back and forth
On a, b, c, d, e each point after irradiating laser, a point is returned again to.It is not irradiated in the way for being back to point a from point e.Pass through
Point a → b → c → d → e → a is repeated as 1 circulation, so as to process the hole for being arranged in string in the Y direction, and
And continual perforate processing can be carried out.On machined object W, multiple (being 5 herein) the hole H for forming a line in the Y direction are in X
Spacing Px of the spaced up regulation in side is formed.In this case, the side of the X-direction of electric scanning region GA apart from Gx than spacing Px
Less, if therefore make aiming point return according to point e → point a during time (Px-Gx)/V, can be continuously and uninterruptedly
Processing.
In Fig. 10, although the scanning pattern for showing point a → b → c → d → e is a linear example, but also may be used
To be set to polyline shaped as Fig. 6, Fig. 7, Fig. 8.The hole for processing in this case can as shown in Figure 6 Y-direction spacing uneven, or
Person is as shown in Figure 7 in meandering shape.In addition, can be set to from point e to the return action of point a linear so that returning within the shortest time
Return.
The above embodiments illustrate only several examples of the present invention, according to the position in hole to be processed, can be any
Ground selects the motion track of aiming point.That is, 8 shape, Z-shaped are not limited to, incline reciprocal shape.Additionally, in the above-described embodiment,
The example that hole machined is carried out on sheet material is illustrated, but can also be carried out groove processing, rule, cut out, cutting off, marking
Other processing such as note.As machined object, in addition to ceramic green sheet, can be ceramic wafers, semiconductor wafer, resin film,
Printed base plate, metallic plate etc. can be with any machined objects of Laser Processing.
Label declaration
W machined object
1 laser processing device
10 laser oscillators
20 galvano scanner
30 light collecting lenss
40 XY worktables (delivery unit)
50 control devices
Claims (5)
1. a kind of laser processing, which is used for controlling delivery unit and galvano scanner, and the delivery unit can make processed
Thing is moved in the X direction along the X/Y plane with the main surface parallel of the machined object, and the galvano scanner is made from LASER Light Source
The laser-bounce of injection is simultaneously radiated on machined object, it is characterised in that
Comprise the steps of：While so that the delivery unit is moved with fixed speed in the X direction, using the electric scanning
Instrument makes the aiming point of laser scan in X-direction and Y-direction in the way of describing fixation locus in electric scanning region, and is sweeping
The assigned position on line is retouched to machined object irradiating laser,
It is processed in the condition shown by following formula and scope：
Px/V≥Σ(Lt+Gt)···(1)
Gx=Px × α (2)
Px：The benchmark processing spacing of the X-direction of machined object
V：The X-direction translational speed of machined object
Lt：Laser irradiation time
Gt：Electric scanning movement time (traveling time of aiming point and stabilization time)
Gx：The distance on the side of the X-direction in electric scanning region
α：Constant (0<α<1).
2. laser processing as claimed in claim 1, it is characterised in that
While making the delivery unit move with fixed speed in X positive direction, repeat following first step to the 8th
Step：
The first step of first point for the laser being radiated on X/Y plane；
By the galvano scanner, the aiming point of the laser is scanned from described first point entirety to X positive direction and Y positive direction
Second step；
Irradiate the of the laser in the second point that displacement has been carried out with respect to described first point in X positive direction and Y positive direction
Three steps；
The four steps that the aiming point of the laser scanned from the second point to X negative direction is made by the galvano scanner；
In the 5th step for thirdly irradiating the laser for having carried out displacement with respect to the second point in X negative direction；
So that the aiming point of the laser is scanned from the thirdly entirety to X positive direction and Y negative direction by the galvano scanner
The 6th step；
Irradiating the of the laser with respect to described displacement has thirdly been carried out in X positive direction and Y negative direction the 4th point
Seven steps；And
So that the aiming point of the laser is scanned to X negative direction and make the laser from described 4th point by the galvano scanner
Aiming point is back to described first point of the 8th step.
3. laser processing as claimed in claim 1 or 2, it is characterised in that
It is processed in the condition shown by following formula and scope：
Px/V≥Gy/Py×(Lt+Gyt)+Gxt+Lt···(3)
Gy：The Y-direction distance in electric scanning region
Py：The benchmark processing spacing of the Y-direction of machined object
Lt：Laser irradiation time
Gyt：Y-direction electric scanning movement time
Gxt：X-direction electric scanning movement time
4. the laser processing as described in any one in claims 1 to 3, it is characterised in that
With the 9th step, its in the scanning way of the second step, during second point is moved to from described first point
The laser is irradiated,
Also there is the tenth step, which is thirdly being moved at described 4th point from described in the scanning way of the 6th step
During irradiate the laser.
5. a kind of laser processing device, it is characterised in that include：
Delivery unit, the delivery unit make machined object with the X/Y plane of the main surface parallel of the machined object in along X side
To being moved with fixed speed；
Galvano scanner, the galvano scanner makes the laser-bounce that projects from LASER Light Source and is radiated at the machined object, and
The aiming point of laser is made with X-direction and Y side by way of describing fixation locus in electric scanning region by the galvano scanner
It is scanned upwards；
Laser oscillator, the moment of assigned position of the laser oscillator in the aiming point arrival scan line of laser produces swashs
Light；And
Control unit, the control unit synchronizes control to the delivery unit, galvano scanner, laser oscillator, to meet
Condition and scope shown by following mathematical expression：
Px/V≥Σ(Lt+Gt)···(1)
Gx=Px × α (2)
Px：The benchmark processing spacing of the X-direction of machined object
V：The X-direction translational speed of machined object
Lt：Laser irradiation time
Gt：Electric scanning movement time (traveling time of aiming point and stabilization time)
Gx：The distance on the side of the X-direction in electric scanning region
α：Constant (0<α<1).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014131973 | 2014-06-27 | ||
| JP2014-131973 | 2014-06-27 | ||
| PCT/JP2015/067941 WO2015199046A1 (en) | 2014-06-27 | 2015-06-23 | Laser machining method and laser machining device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106457470A true CN106457470A (en) | 2017-02-22 |
| CN106457470B CN106457470B (en) | 2018-08-21 |
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| CN201580034997.5A Active CN106457470B (en) | 2014-06-27 | 2015-06-23 | Laser processing and laser processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6365666B2 (en) |
| KR (2) | KR101989410B1 (en) |
| CN (1) | CN106457470B (en) |
| WO (1) | WO2015199046A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785257A (en) * | 2017-06-29 | 2020-02-11 | 松下知识产权经营株式会社 | Laser processing system and control method of laser processing system |
| CN112937077A (en) * | 2021-04-16 | 2021-06-11 | 赵成刚 | High-precision silk-screen printing laser plate-making machine |
| CN114981034A (en) * | 2020-02-20 | 2022-08-30 | 欧姆龙株式会社 | Laser processing device and control method of laser processing device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6665747B2 (en) * | 2016-09-28 | 2020-03-13 | ブラザー工業株式会社 | Laser marker device |
| JP2019206025A (en) * | 2018-05-29 | 2019-12-05 | 武井電機工業株式会社 | Laser processing method and laser processing apparatus |
| KR102543759B1 (en) | 2021-04-27 | 2023-06-14 | 주식회사 대곤코퍼레이션 | Laser Machining System And Its Method Using Fixed Map-Based Alignment Compensation Control |
| CN116551215B (en) * | 2023-07-06 | 2023-09-05 | 北京新科以仁科技发展有限公司 | Laser scanning control method, device, equipment and storage medium of laser |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3077539B2 (en) | 1994-12-22 | 2000-08-14 | 松下電器産業株式会社 | Laser processing method |
| US6926487B1 (en) * | 1998-04-28 | 2005-08-09 | Rexam Ab | Method and apparatus for manufacturing marked articles to be included in cans |
| US20030047695A1 (en) * | 2001-09-07 | 2003-03-13 | Preco Laser Systems, Llc | System and method for synchronizing a laser beam to a moving web |
| JP2003227062A (en) | 2002-01-31 | 2003-08-15 | Toppan Printing Co Ltd | Processed article of nonwoven fabric |
| JP4040896B2 (en) * | 2002-03-28 | 2008-01-30 | 住友重機械工業株式会社 | Laser processing method and laser processing apparatus |
| JP5628524B2 (en) | 2010-01-08 | 2014-11-19 | 三菱電機株式会社 | Processing control device, laser processing device, and processing control method |
-
2015
- 2015-06-23 JP JP2016529581A patent/JP6365666B2/en active Active
- 2015-06-23 KR KR1020197003637A patent/KR101989410B1/en active IP Right Grant
- 2015-06-23 KR KR1020167034860A patent/KR20170002635A/en active Search and Examination
- 2015-06-23 CN CN201580034997.5A patent/CN106457470B/en active Active
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785257A (en) * | 2017-06-29 | 2020-02-11 | 松下知识产权经营株式会社 | Laser processing system and control method of laser processing system |
| CN110785257B (en) * | 2017-06-29 | 2021-08-27 | 松下知识产权经营株式会社 | Laser processing system and control method of laser processing system |
| CN114981034A (en) * | 2020-02-20 | 2022-08-30 | 欧姆龙株式会社 | Laser processing device and control method of laser processing device |
| CN112937077A (en) * | 2021-04-16 | 2021-06-11 | 赵成刚 | High-precision silk-screen printing laser plate-making machine |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015199046A1 (en) | 2015-12-30 |
| JP6365666B2 (en) | 2018-08-01 |
| KR20170002635A (en) | 2017-01-06 |
| JPWO2015199046A1 (en) | 2017-04-20 |
| CN106457470B (en) | 2018-08-21 |
| KR20190016141A (en) | 2019-02-15 |
| KR101989410B1 (en) | 2019-06-14 |
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