JP2007000878A - Apparatus and method for laser beam machining - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for laser beam machining, which apparatus can relax the limitation of a feed speed due to the time necessary for returning the irradiating position of a laser beam. <P>SOLUTION: A holding mechanism holds a workpiece and moves it in the X direction at a specified speed. A beam scanner makes the laser beam radiate toward the workpiece, and further moves the irradiating position in the X direction and in the Y direction. A control device moves the irradiating position of the laser beam from a first position toward a second position in the Y direction, and further moves the irradiating position of the laser beam in the X direction at the same speed as the feed speed of the workpiece. After that, the irradiating position is moved in the direction opposite to the X direction by the same distance as the distance moved in the X direction in the first process. The irradiating position is moved from the second position toward the first position, and further is moved in the X direction at the same speed as the feed speed of the workpiece. Then, the irradiating position is moved in the direction opposite to the X direction by the same distance as the distance moved in the X direction in the third process. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus and a processing method, and more particularly to a processing apparatus and a processing method for performing processing by causing a laser beam to enter the processing target while feeding the processing target in one direction.

  The laser processing method disclosed in the following Patent Document 1 will be described. A perforation extending in the width direction is formed by scanning the pulse laser beam in the width direction while feeding the band-shaped workpiece at a constant speed in the length direction. Depending on the feed speed of the workpiece, the laser beam incident position is gradually shifted in the same direction as the feed direction as it approaches the opposite edge from the edge on the machining start side. Perforated perforations can be formed.

JP 2000-280082 A

  When the scanning from one edge of the workpiece to the other edge is completed and one perforation is formed, the incident position of the laser beam is returned to the scanning start edge. Next, when the position where the perforation is to be formed is sent to the incident position of the laser beam, scanning of the laser beam is started to form the perforation. Next, if the time at which the position where the perforation is to be formed is sent to the laser beam incident position is sufficiently longer than the time to return the laser beam incident position from the scan end position to the scan start position, The time for returning does not affect the processing time.

  However, when the perforation is arranged in a short cycle with respect to the length direction of the workpiece, the time at which the position where the perforation is to be formed next is sent to the laser beam incident position is the laser beam incident position. The time to return is approaching. In such a case, speeding up of the feeding speed is limited by the time for returning the incident position.

  An object of the present invention is to provide a laser processing apparatus and a processing method that can alleviate the limitation of the feed rate caused by the time required to return the incident position of the laser beam.

  According to a first aspect of the present invention, a laser light source that emits a laser beam, a holding mechanism that holds a workpiece and sends the workpiece at a speed in a first direction, and the laser light source. The laser beam emitted from the laser beam is made incident on the workpiece held by the holding mechanism and sent in the first direction, and the incident position of the laser beam is changed to the first direction and the first direction. A beam scanner that can be moved in a second direction orthogonal to the laser light source, and a control device that controls the laser light source and the beam scanner, wherein the control device has a first direction with respect to the second direction. A first step of moving the incident position of the laser beam from the position toward the second position and moving the laser beam in the first direction at the same speed as the feed speed of the workpiece; and the incident position of the laser beam. The first A second step of moving in the opposite direction by the same distance as the distance moved in the first direction in the first step, and from the second position toward the first position with respect to the second direction. A third step of moving the incident position of the laser beam and moving the laser beam in the first direction at the same speed as the feed speed of the workpiece; and the incident position of the laser beam opposite to the first direction. In addition, there is provided a laser processing apparatus for controlling the beam scanner so that the fourth step of moving the same distance as the distance moved in the first direction in the third step is repeated.

  According to a second aspect of the present invention, a laser light source that emits a laser beam, a holding mechanism that holds a workpiece and sends the workpiece at a speed in a first direction, and the laser light source The emitted laser beam is incident on the workpiece that is held by the holding mechanism and is sent in the first direction, and the incident position of the laser beam is changed between the first direction and the first direction. A beam scanner capable of moving in a second direction orthogonal to each other, and first and second coordinate storage units for storing coordinate data of a plurality of points to which the laser beam is to be incident in order. And a control device that controls the beam scanner based on data stored in the second coordinate storage unit, and the control device is based on data stored in the first coordinate storage unit. Control the beam scanner And that step, and a step of controlling the beam scanner on the basis of the data stored in the second coordinate storage unit, the laser processing apparatus is provided which alternately repeated.

  According to a third aspect of the present invention, a laser light source that emits a laser beam, a holding mechanism that holds a workpiece and sends the workpiece at a speed in a first direction, and the laser light source The emitted laser beam is incident on the workpiece that is held by the holding mechanism and is sent in the first direction, and the incident position of the laser beam is changed between the first direction and the first direction. A beam scanner capable of moving in a second direction perpendicular to each other; first and second coordinate storage units for storing coordinate data of a plurality of points on which laser beams should be incident in order; And a processing mode storage unit that stores information indicating one of the direction processing modes, and the beam scanner based on the first and second coordinate storage units and data stored in the processing mode storage unit Control system And when the information stored in the processing mode storage unit indicates a reciprocating processing mode, the control device scans the beam based on data stored in the first coordinate storage unit. And the step of controlling the beam scanner based on the data stored in the second coordinate storage unit are alternately repeated, and the information stored in the processing mode storage unit is In the case of indicating the direction processing mode, a laser processing apparatus is provided that repeats the step of controlling the beam scanner based on the data stored in the first coordinate storage unit.

  According to a fourth aspect of the present invention, while the workpiece is fed in the first direction at the first speed, (a) the second direction from the first position with respect to the second direction perpendicular to the first direction. And (b) moving the incident position of the laser beam to the first direction in the first direction, and moving the incident position in the first direction at the first speed. And (c) a laser beam from the second position to the first position with respect to the second direction, and a step of moving the laser beam by the same distance as the distance moved in the first direction in the step a. Moving the incident position at the first speed in the first direction, and (d) moving the incident position of the laser beam in a direction opposite to the first direction, The same distance as the distance moved in the first direction in the step c Laser processing method for performing a plurality of times and the step of moving only in the order is provided.

  According to the first aspect, processing (outward path processing) is performed while moving the incident position of the laser beam from the first position toward the second position, and from the second position toward the first position. Processing (return path processing) is performed while moving the incident position of the laser beam. When the reciprocating process is performed, it is not necessary to return the incident position to the scanning start position as compared with the case where the process is performed while moving in one direction, so that a high-speed process can be performed.

  According to the second aspect, the forward path machining can be performed based on the data set in the first coordinate storage unit, and the backward path machining is performed based on the data set in the second coordinate storage unit. It can be carried out. In addition, by setting the same data in the first and second coordinate storage units, it is possible to perform unidirectional processing.

  According to the third aspect, by changing the information set in the machining mode storage unit, it is possible to perform machining in any mode of reciprocating machining and unidirectional machining.

  According to the fourth aspect, reciprocating processing is performed. Compared to the case where the processing is performed while moving in one direction, it is not necessary to return the incident position to the scanning start position, so that high-speed processing can be performed.

FIG. 1A shows a schematic diagram of a laser processing apparatus according to an embodiment. The laser light source 1 emits a pulse laser beam. As the laser light source 1, for example, a CO ₂ gas laser oscillator is used. Other laser oscillators such as a solid-state laser oscillator such as a YAG laser may be used.

  A pulsed laser beam emitted from the laser light source 1 enters the branching device 2. The branching device 2 branches the incident pulse laser beam into 16 laser beams. For example, a 16-branch splitter 2 can be configured by using a plurality of two-branch beam splitters.

  The branched 16 pulse laser beams are incident on the workpiece 20 via the beam scanner 3 and the focusing lens 4, respectively. The workpiece 20 has an elongated strip shape, is fed from the supply reel 9, and is taken up by the take-up reel 10. An XY orthogonal coordinate system is introduced in which the direction in which the workpiece 20 is sent is the positive direction of the X axis and the width direction of the workpiece 20 is the Y axis direction. Four support rollers 12 are arranged between the supply reel 9 and the take-up reel 10. Each support roller 12 supports the workpiece 20 from below.

  Each of the beam scanners 2 includes, for example, an X mirror 3X, a Y mirror 3Y, and a mirror driving device, and scans an incident pulse laser beam in a two-dimensional direction. When the X mirror 3X is swung, the incident position of the pulse laser beam moves in the X axis direction on the surface of the workpiece 20, and when the Y mirror 3Y is swung, it moves in the Y axis direction. The focusing lens 4 is composed of, for example, an fθ lens, and focuses the pulse laser beam scanned by the beam scanner 3 onto the surface of the workpiece 20. The 16 beam scanners 3 and the 16 focusing lenses 4 are arranged in a matrix of 4 rows and 4 columns in the XY plane.

  The drive mechanism 11 drives the supply reel 9 and the take-up reel 10. The feeding reel 9, the take-up reel 10, the support roller 12, and the drive mechanism 11 constitute a holding device 8 that holds the workpiece 20. The control device 15 controls the laser light source 1, the beam scanner 3, and the drive mechanism 11.

  FIG. 1B shows a plan view of the main part of the workpiece 20. A set of beam scanners 3 and a focusing lens 4 allow a pulsed laser beam to be incident on an arbitrary position within one scanable region 5. This area 5 is called a “scannable area”. The scannable areas 5 are arranged in a matrix of 4 rows and 4 columns. The four scan processing regions 5 arranged in the Y-axis direction constitute one row of the scannable regions 5. One support roller 12 is arranged corresponding to each of the four rows of the scannable region 5.

  Of the region within the scannable region 5, the position in the height direction of the portion 5a in contact with the support roller 12 is restrained by the support rollers 12A to 12D. However, since the workpiece 20 has flexibility, a portion that is not in contact with the support roller 12 sinks downward due to gravity, and the position in the height direction is not stable. In order to maintain a constant beam spot size at the laser beam incident position, it is preferable to perform processing in the portion 5 a in contact with the support roller 12. The portion 5a that is in contact with the support roller 12 is referred to as an “appropriate processing region”.

  FIG. 1C shows an area 5 b that is actually processed in the scannable area 5. This region 5b is referred to as an “actual processing region”. The actual machining area 5b is arranged in the proper machining area 5a. The length in the Y-axis direction of one actual machining area 5b is 1/16 of the width of the workpiece 20 to be machined. The four actual processing regions 5b in the four scannable regions 5 arranged in the X axis direction are arranged so as not to overlap each other in the Y axis direction. These four actual machining areas 5b cover 1/4 of the width of the workpiece 20 to be machined. That is, when the workpiece 20 is sent in the X-axis direction, any point located within the range of the width to be machined passes through one actual machining area 5b. For this reason, it can process without a flaw within the range of the width which should be processed.

  Next, with reference to FIGS. 2A and 2B, unidirectional processing of the laser processing method according to the embodiment will be described.

  FIG. 2A shows a plan view of one actual processing region 5b. For example, the length of one actual processing region 5b in the Y-axis direction is about 60 mm, and the width is about 2 mm. Between the start point 6S located in the vicinity of one end and the end point 6E located in the vicinity of the other end, the incident target positions 6 where the pulse laser beam should be incident are arranged at a constant pitch, for example, 2 mm. When the beam scanner 3 is controlled and the incident position of the pulse laser beam is set to one incident target position 6, laser pulses having a predetermined number of shots are emitted. The pulse laser beam is scanned in parallel to the Y axis from the start point 6S to the end point 6E, and sequentially enters the incident target position 6.

  When scanning to the end point 6E, the process returns to the start point 6S and starts scanning in the next cycle. In this way, scanning in one direction from the start point 6S to the end point 6E is repeated. The speed at which the incident position of the pulse laser beam moves in the Y-axis direction is constant and is the same in all cycles.

  FIG. 2B shows a locus 21 to be processed on the surface of the processing object 20, that is, a locus of a position where a laser pulse is incident. During the processing, the processing object 20 moves at a constant speed in the positive direction of the X axis. For this reason, a row of workpiece points parallel to a straight line slightly inclined from the Y-axis direction is formed. Since the feed speed of the workpiece 20 is constant and the scanning speed of the pulse laser beam in the Y-axis direction is also constant, the plurality of rows of workpiece points are all parallel to each other.

  Next, with reference to FIG. 2 (C) and FIG. 2 (D), reciprocal processing of the laser processing method according to the embodiment will be described.

  FIG. 2C shows a plan view of one actual processing region 5b. Incidence target of an odd-numbered pulse laser beam on a straight line connecting an odd-numbered row start point 6So located near one end of the actual machining region 5b and an odd-numbered row end point 6Eo located near the other end. The positions 6o are arranged at a constant pitch. The end point 6Eo is shifted from the start point 6So by a length Dx in the positive direction of the X axis. This length Dx is, for example, 2 mm.

  An even-numbered column start point 6Se is arranged at a position shifted by a length Dx in the negative X-axis direction from the odd-numbered column end point 6Eo, and is shifted from the odd-numbered column start point 6So by a length Dx in the X-axis positive direction. The even-numbered end point 6Ee is arranged. The incident target positions 6e of the even-numbered pulse laser beams are arranged at a constant pitch on a straight line connecting the start point 6Se and the end point 6Ee of the even-numbered line. The pitch in the Y-axis direction of the odd-numbered incident target positions 6o and the even-numbered incident target positions 6e is, for example, 2 mm.

  At the time of processing, the pulse laser beam is scanned so that the laser pulses are sequentially incident on the incident target positions 6o in the odd rows from the start point 6So in the odd rows to the end point 6Eo. The pulse laser beam scanning method will be specifically described below.

  First, the beam scanner 3 is controlled and settled so that the pulse laser beam is incident on the starting point 6So. Here, “settling” means that the posture of the oscillating reflecting mirror or the like of the beam scanner 3 is changed to a target posture and is substantially stationary after a transient state. After the beam scanner 3 is set, a pulse laser beam is emitted.

  Next, the beam scanner 3 is set so that the pulse laser beam is incident on the next incident target position 6o. During the period when the beam scanner 3 is not settled and is in a transient state, the laser beam is not emitted. Assuming that the laser beam is continuously emitted during this transient state, the moving speed of the virtual incident position of the laser beam in the positive direction of the X axis is equal to the feed speed of the workpiece 20. Or faster than that. When the moving speed of the virtual incident position is faster than the feed speed of the workpiece 20, the beam scanner 3 is set and then the incident target position 6o on the workpiece 3 is sent to the virtual incident position. A pulse laser beam is emitted.

  The above-described control of the beam scanner 3 and the emission of the pulse laser beam are repeated. Finally, the beam scanner 3 is set so that the pulse laser beam is incident on the end point 6Eo, and the pulse laser beam is incident on the end point 6Eo.

  The moving speed of the incident position where the pulse laser beam is actually incident in the positive direction of the X axis is equal to the feed speed of the workpiece 20.

  After scanning to the end point 6Eo in the odd-numbered row, the incident position of the pulse laser beam is moved to the start point 6Se in the even-numbered row. Thereafter, the pulsed laser beam is scanned so that the laser pulses are sequentially incident on the target incidence positions 6e in the even columns from the start point 6Se in the even columns to the end point 6Ee. Also at this time, the moving speed of the incident position of the pulse laser beam in the positive direction of the X-axis is equal to the feed speed of the workpiece 20. After scanning to the end point 6Ee in the even-numbered column, the incident position of the pulse laser beam is returned to the start point 6So in the odd-numbered column. The moving speed of the incident position of the pulse laser beam is constant.

  FIG. 2D shows a locus 22 to be processed on the surface of the workpiece 20 that has been reciprocated, that is, a locus of a position where a laser pulse is incident. The workpiece 20 is fed by a length Dx in the positive direction of the X axis during the scan times of the odd-numbered and even-numbered rows of the pulse laser beam. For this reason, the row of the machining points 22 parallel to the Y-axis direction is formed in both the odd-numbered scanning period and the even-numbered scanning period.

  Next, a laser processing method according to the first embodiment will be described with reference to FIG. FIG. 3A shows a flowchart of the laser processing method according to the first embodiment, and FIG. 3B shows data set in the control device 15 when performing reciprocating processing. ) Shows data set in the control device 15 when unidirectional machining is performed.

  The control device 15 is provided with a processing mode storage unit, a first coordinate storage unit, and a second coordinate storage unit that indicate whether to perform reciprocating processing or unidirectional processing.

  When the “reciprocating processing mode” is set in the processing mode storage unit, as shown in FIG. 3B, the first coordinate storage unit stores coordinate data indicating the beam incidence target positions in the even-numbered columns, that is, The coordinate data of the incident positions 6e in the even-numbered columns shown in FIG. 2C is set, and the coordinate data indicating the target positions of the incident beams in the odd-numbered columns is stored in the second coordinate storage unit, that is, in FIG. The coordinate data of the incident position 6o in the odd-numbered column shown is set. When the “one-way machining mode” is set in the machining mode storage unit, as shown in FIG. 3C, the first coordinate storage unit stores coordinate data indicating the target position of beam incidence during one-way machining, That is, the coordinate data of the incident position 6 at the time of the unidirectional machining shown in FIG. At this time, the information set in the second coordinate storage unit is not used for processing.

  A case where the “reciprocating processing mode” is set in the processing mode storage unit will be described. The workpiece 20 is fed at a constant speed in the positive direction of the X axis.

  As shown in FIG. 3A, at the start of machining, the machining column number is first set to 1. Next, it is determined whether the processing is one-way processing or reciprocating processing. Since the “reciprocating machining mode” is set in the machining mode storage unit, the process proceeds to a step of determining whether machining is performed on even-numbered columns or odd-numbered columns. Since the processing column number is 1, that is, an odd number, the beam scanner 3 and the laser light source 1 are controlled using the coordinate data set in the second coordinate storage unit. The beam scanner 3 controls the incident position of the pulse laser beam so that the pulse laser beam is incident on the incident target position 6o in order from the start point 6So to the end point 6Eo in the odd-numbered row shown in FIG. Is done. A laser pulse of a predetermined number of shots is emitted from the laser light source 1 every time the incident position of the pulse laser beam is set to each incident target position 6o in the odd-numbered row. Thereby, the process for odd-numbered one row is performed.

  When the processing for one row is completed, the beam scanner 3 is moved so that the incident position of the pulse laser beam moves to the start point of the coordinate data set in the first coordinate storage unit, that is, the start point 6Se of the even row. Control. Thereafter, 1 is added to the processing column number. It is determined whether or not all rows have been processed. If not finished, the process returns to the step of determining whether to perform one-way machining or reciprocating machining. Since the “reciprocating machining mode” is set in the machining mode storage unit, the process proceeds to a step of determining whether machining is performed on even-numbered columns or odd-numbered columns.

  Since the processing column number is 2, the beam scanner 3 and the laser light source 1 are controlled using the coordinate data set in the first coordinate storage unit. The beam scanner 3 controls the incident position of the pulse laser beam so that the pulse laser beam is incident on the incident target position 6e in order from the start point 6Se to the end point 6Ee in the even-numbered column shown in FIG. Is done. A laser pulse of a predetermined number of shots is emitted from the laser light source 1 every time the incident position of the pulsed laser beam is set to each incident target position 6e in the even-numbered row. Thereby, the processing for even-numbered one row is performed.

  When the processing for the even-numbered one row is completed, the beam scanning is performed so that the incident position of the pulse laser beam moves to the start point of the coordinate data set in the second coordinate storage unit, that is, the start point 6So of the odd-numbered row. The device 3 is controlled. Thereafter, 1 is added to the processing column number. It is determined whether or not all rows have been processed. If not finished, the process returns to the step of determining whether to perform one-way machining or reciprocating machining. When all the rows have been processed, the laser processing ends. In this way, even-numbered column processing based on the coordinate data set in the first coordinate storage unit and odd-numbered column processing based on the coordinate data set in the second coordinate storage unit And are repeated alternately.

  Next, a case where the “one-way machining mode” is set in the machining mode storage unit will be described.

  As shown in FIG. 3A, at the start of machining, the machining column number is first set to 1. Next, it is determined whether the processing is one-way processing or reciprocating processing. Since the “one-way machining mode” is set in the machining mode storage unit, one column of machining is performed using the coordinate data set in the first coordinate storage unit. When the processing for one row is completed, the beam scanner 3 is controlled so that the target incident position of the pulse laser beam moves to the coordinate data start point 6Se set in the first coordinate storage unit.

  Thereafter, 1 is added to the processing column number. It is determined whether or not all rows have been processed. If not finished, the process returns to the step of determining whether to perform one-way machining or reciprocating machining. Since “one-way machining mode” is set in the machining mode storage unit, machining for one column using the coordinate data set in the first coordinate storage unit again, and in the first coordinate storage unit Return the set coordinate data to the start point 6Se. In this way, processing is always performed based on the coordinate data set in the first coordinate storage unit. When all the rows have been processed, the laser processing ends.

  As described above, by using the laser processing apparatus according to the embodiment, laser processing can be performed by any one of the preferred methods of unidirectional processing and reciprocating processing.

  In the case of performing unidirectional processing, when one row of processing is completed, the incident position must be returned from the end point 6E to the start point 6S shown in FIG. On the other hand, in the case of reciprocating machining, the incident position may be moved by the amount of deviation Dx in the Y-axis direction. Therefore, in the case of reciprocating machining, it is possible to shorten the time for returning the incident position to the starting point, compared to unidirectional machining.

  Further, when the feed speed of the workpiece 20 is increased, the pulse laser beam is scanned in the Y-axis direction from one end to the other end of the actual processing region 5b shown in FIGS. 2 (A) and 2 (C). It is conceivable that the workpiece 20 moves in the width of the actual machining region 5b, for example, 2 mm or more during the period. In this case, when reciprocating is performed, the odd and even columns cannot be arranged in parallel. Accordingly, the distribution of the workpiece points is not uniform.

  When unidirectional processing is performed, the direction of each row is greatly inclined from the Y-axis direction, but the even-numbered row and the odd-numbered row are inclined in the same direction. For this reason, all the rows are parallel to each other, and the processing points can be uniformly distributed.

Hereinafter, an example of a criterion for determining which of reciprocating processing and unidirectional processing should be adopted will be described. The time to scan the pulse laser beam from the start point to the end point of the target position of the pulse laser beam is T _S , the time to return from the end point to the start point in one-way processing is T _B , and the pitch of the workpiece point in the X-axis direction is Px the X-axis direction of the width of the working area 5b Wx, the feeding speed of the workpiece at the time of adopting the reciprocating machining v _2, the feed speed when employing a one-way process and v _1.

In the case of performing unidirectional machining, since the workpiece is sent by the pitch Px between the scanning time T _S and the return time T _B , the following equation is established.
v ₁ = Px / (T _S + T _B ) (1)
When performing reciprocating machining, the workpiece length to be sent during the scanning time T _S is the X-axis direction of the width of the actual machining area 5b or less Wx, and shall not exceed the pitch Px. Therefore, the following formula must be satisfied.
v ₂ ≦ Wx / T _S (2)
v ₂ ≦ Px / T _S (3)
Consider a case where the pitch Px is equal to or less than the width Wx in the X-axis direction of the actual machining region 5b. Feeding speed v ₂ in the case of performing a reciprocating machining is limited by the above equation (3). Compared equations (1) and (3), it can be seen that the feed velocity v ₂ when the reciprocating processable faster than the feed speed v ₁ during the one-way process. For this reason, it is preferable to employ reciprocating processing in order to shorten the processing time.

Next, a case where the pitch Px is larger than the width Wx in the X-axis direction of the actual machining region 5b will be considered. Feeding speed v ₂ during reciprocation processing is limited by the above equation (2). Therefore, the following expression Px / (T _S + T _B )> Px / T _S (4)
Is established, the feed rate when unidirectional machining is adopted can be made faster than the feed rate when reciprocating machining is adopted.

As described above, a suitable processing method is adopted according to the scanning time T _S of the pulse laser beam, the return time T _B , the pitch Px in the X-axis direction, and the width Wx of the actual processing region 5b in the X-axis direction. It is preferable.

  Next, a laser processing method according to the second embodiment will be described with reference to FIG. FIG. 4A shows a flowchart of the laser processing method according to the second embodiment, and FIG. 4B shows data set in the control device 15 when performing reciprocating processing. ) Shows data set in the control device 15 when unidirectional machining is performed.

  The control device 15 is provided with a first coordinate storage unit and a second coordinate storage unit. In the case of performing reciprocal machining, as shown in FIG. 4B, the even-numbered columns shown in FIG. 2C are incident on the first coordinate storage unit and the second coordinate storage unit, respectively. The coordinate data of the target position 6e and the coordinate data of the incident target positions 6o in the odd-numbered columns are set. In the case of performing unidirectional processing, as shown in FIG. 4C, the incident at the time of unidirectional processing shown in FIG. 2A is applied to both the first coordinate storage unit and the second coordinate storage unit. The coordinate data of the target position 6 is set.

  As shown in FIG. 4A, the laser processing method according to the second embodiment determines whether the laser processing method according to the first embodiment shown in FIG. 3A is one-way processing or reciprocating processing. The process was omitted and the reciprocating process was always performed.

  During the reciprocating process, the process is performed in the same procedure as in the first embodiment. The flow of processing during unidirectional machining is the same as that during reciprocating machining, but the coordinate data of the incident target position during unidirectional machining is used for machining even-numbered rows and odd-numbered rows. It is done. For this reason, as a result, the one-way processing similar to the first embodiment can be performed.

  In the above embodiment, the laser beam is made incident on the object to be drilled, but the processing method of the above embodiment can be applied to other laser processing. For example, the present invention can be applied to a print head, a plotter, a laser marking device, or the like of a laser printer.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

(A) is the schematic of the laser processing apparatus by an Example, (B) And (C) is a top view of the principal part of a process target object. (A) is a top view which shows the beam incidence target position in the actual process area | region at the time of one-way processing, (B) is a plane which shows distribution of the to-be-processed point of the processing target processed by one-way processing (C) is a plan view showing a beam incident target position in an actual machining area at the time of reciprocating machining, and (D) is a distribution of processing points of a workpiece to be machined by reciprocating machining. FIG. (A) is a flowchart of the laser processing method according to the first embodiment, (B) is a diagram showing data set in the control device during reciprocating processing, and (C) is during one-way processing. It is a figure which shows the data set to a control apparatus. (A) is a flowchart of the laser processing method according to the second embodiment, (B) is a diagram showing data set in the control device during reciprocating processing, and (C) is during one-way processing. It is a figure which shows the data set to a control apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser light source 2 Branch device 3 Beam scanner 4 Focusing lens 5 Scanable area | region 5a Proper processing area | region 5b Actual processing area | region 6 Beam incident target position 8 Holding device 9 Feed reel 10 Take-up reel 11 Drive mechanism 12 Support roller 15 Control apparatus 20 Processing object 21 Processing point

Claims (4)

A laser light source for emitting a laser beam;
A holding mechanism for holding the workpiece and feeding the workpiece at a speed in the first direction;
The laser beam emitted from the laser light source is incident on a workpiece held in the holding mechanism and sent in the first direction, and the incident position of the laser beam is set in the first direction and the first direction. A beam scanner capable of moving in a second direction orthogonal to the direction of one;
A controller for controlling the laser light source and the beam scanner;
The controller is
A first laser beam is moved from the first position toward the second position with respect to the second direction, and is also moved in the first direction at the same speed as the feed speed of the workpiece. Process,
A second step of moving the incident position of the laser beam in the opposite direction to the first direction by the same distance as the distance moved in the first direction in the first step;
The incident position of the laser beam is moved from the second position toward the first position with respect to the second direction, and is also moved in the first direction at the same speed as the feed speed of the workpiece. A third step;
The beam scanner is configured to repeat the fourth step of moving the incident position of the laser beam in the direction opposite to the first direction by the same distance as the distance moved in the first direction in the third step. Laser processing device to control. A laser light source for emitting a laser beam;
A holding mechanism for holding the workpiece and feeding the workpiece at a speed in the first direction;
The laser beam emitted from the laser light source is incident on a workpiece held in the holding mechanism and sent in the first direction, and the incident position of the laser beam is set in the first direction and the first direction. A beam scanner capable of moving in a second direction orthogonal to the direction of one;
Including first and second coordinate storage units for storing coordinate data of a plurality of points to which laser beams should be incident in order, and the beam based on the data stored in the first and second coordinate storage units A control device for controlling the scanner,
The controller is
Controlling the beam scanner based on data stored in the first coordinate storage unit, and controlling the beam scanner based on data stored in the second coordinate storage unit A laser processing device that repeats the above alternately. A laser light source for emitting a laser beam;
A holding mechanism for holding the workpiece and feeding the workpiece at a speed in the first direction;
The laser beam emitted from the laser light source is incident on a workpiece held in the holding mechanism and sent in the first direction, and the incident position of the laser beam is set in the first direction and the first direction. A beam scanner capable of moving in a second direction orthogonal to the direction of one;
First and second coordinate storage units that store coordinate data of a plurality of points to which laser beams should be incident in order, and a processing mode storage unit that stores information indicating either the reciprocating processing mode or the unidirectional processing mode A control device for controlling the beam scanner based on the data stored in the first and second coordinate storage unit and the processing mode storage unit,
The controller is
When the information stored in the processing mode storage unit indicates a reciprocating processing mode, the step of controlling the beam scanner based on data stored in the first coordinate storage unit, and the second And alternately repeating the step of controlling the beam scanner based on the data stored in the coordinate storage unit,
When the information stored in the processing mode storage unit indicates a unidirectional processing mode, a laser processing apparatus that repeats the step of controlling the beam scanner based on data stored in the first coordinate storage unit . While feeding the workpiece in the first direction at the first speed,
(A) The incident position of the laser beam is moved from the first position to the second position with respect to the second direction orthogonal to the first direction, and also in the first direction at the first speed. Moving the incident position;
(B) moving the incident position of the laser beam in the opposite direction to the first direction by the same distance as the distance moved in the first direction in the step a;
(C) Move the incident position of the laser beam from the second position to the first position with respect to the second direction, and also move the incident position in the first direction at the first speed. Process,
(D) Laser processing for sequentially executing the step of moving the laser beam incident position in the opposite direction to the first direction by the same distance as the distance moved in the first direction in the step c. Method.

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