CN206519655U

CN206519655U - Optical machining device

Info

Publication number: CN206519655U
Application number: CN201621403006.4U
Authority: CN
Inventors: 中岛智宏; 中村凉真; 杉浦康; 杉浦康一
Original assignee: Ricoh Co Ltd
Current assignee: Ricoh Co Ltd
Priority date: 2015-12-24
Filing date: 2016-12-20
Publication date: 2017-09-26
Anticipated expiration: 2026-12-20
Also published as: TW201722602A; TWI682823B; JP2017113788A; CN106914703B; CN106914703A

Abstract

The utility model is related to optical machining device, and the stop position occurred during its object is to improve delivery section intermittent delivery workpiece deviates the Working position caused and deviateed.Optical machining device of the present utility model has the light source (11) that processing light (L) is irradiated to machining area (36), the processed part on workpiece is set to be sequentially sent to the delivery section (32) of machining area to conveying direction (B) intermittent delivery workpiece (35), further there is position detection part (33, 34), the position detection part is arranged on and the side of one end end one on the perpendicular width of conveying direction (B), when being stopped at for the processed part on workpiece (35) on machining area (36), detect the position of the detection mark (37) on the workpiece.

Description

Optical machining device

Technical field

The present invention relates to optical machining device.

Background technology

Existing optical machining device is intermittent when being processed with processing light to the processed part of long workpiece Workpiece is conveyed, the machining area that the processed part of workpiece is sequentially sent to be processed with processing light, in processing During object stops during conveying, light processing is carried out to the processed part in machining area.

For example, patent document 1 (JP spy 2003-205384 publications) discloses a kind of laser processing device.The laser adds Frock is put to pulling out workpiece from the workpiece supply unit for the long workpiece for keeping wound into rolls, and is caused The processed part of the workpiece is moved to laser processing area, and the processed part of the workpiece is entered with laser Row Laser Processing.The laser processing device carries out two-dimensional scan with scanning galvanometer (light scanning apparatus), to machining area (optical scanning Scope) in workpiece processed partial illumination light source transmitting laser beam (processing light), on workpiece Ito thin film implement pattern processing, or machining is carried out in itself to the workpiece formed with sheet metal.Processing knot Shu Hou, laser processing device further pulls out workpiece so that next be processed is partially moved to machining area, to the quilt Processing part is laser machined.In this way, above-mentioned working process is repeated in laser processing device.

Above-mentioned optical machining device is by intermittently conveying workpiece, by the processed part of workpiece successively Machining area is sent into, and during workpiece stops conveying, light is carried out to the processed object part for entering machining area Processing.But, for the conveying error of conveying device, it may occur however that the stopping of stop position skew problem, i.e. workpiece Deviate target location in position.In the event of such stop position off normal, the light on the processed part of light irradiation is subject to processing Irradiation position just deviates the position of needs processing, so that the problem of occurring Working position deviation.

The content of the invention

In order to solve the above problems, have in optical machining device of the invention：Illumination part, wherein possessing transmitting processing light Light source, for irradiating the processing light to machining area；And, delivery section is intermittently defeated for defined conveying direction Workpiece is sent, the processed part on the machined surface of the workpiece is sequentially sent to the machining area, it is special Levy and be, further with first position test section, the first position test section is arranged on perpendicular with the conveying direction Width on the side of one end end one, stop at the processing district for the processed part on the workpiece When on domain, the position of first detection mark of the detection on the workpiece.

Working position deviation of the present invention caused by for improving the stop position deviation of workpiece has excellent Effect.

Brief description of the drawings

Fig. 1 is the structural representation of the major part of the laser pattern processing unit (plant) of embodiment.

Fig. 2 is one of the laser oscillator in above-mentioned laser pattern processing unit (plant) to illustrate and be intended to.

Fig. 3 is the schematic diagram of the variation of the light scanning apparatus in above-mentioned laser pattern processing unit (plant).

Fig. 4 is one of the processing object delivery section in above-mentioned laser pattern processing unit (plant) to illustrate and be intended to.

Fig. 5 is that another illustration of the processing object delivery section in above-mentioned laser pattern processing unit (plant) is intended to.

Fig. 6 is laser light when carrier is located at diverse location on main scanning direction respectively in above-mentioned laser pattern processing unit (plant) The schematic diagram on road.

Fig. 7 is when carrier does not carry in the variation of scanning galvanometer carrier and is located at diverse location on main scanning direction respectively Laser optical path schematic diagram.

Fig. 8 is that the laser pattern processing unit (plant) of embodiment carries out a flow chart of pattern working process.

Fig. 9 is deviateed between the center of telltale mark and target location O under a workpiece halted state Schematic diagram.

Figure 10 is the schematic diagram of the posture deviation of carrier when carrier stops.

Figure 11 is when being processed part implementation working process to the machined surface of workpiece is divided into 12 pieces successively Processing sequence explanation figure.

Figure 12 is to need between each piece of processed part to keep a continuous wiring pattern schematic diagram.

Figure 13 is for describing to improve the schematic diagram that telltale mark site error causes the bias of carrier posture to occur error.

Figure 14 is the flow chart of the pattern working process of variation.

Embodiment

One embodiment that optical machining device of the present invention is applied to laser pattern processing unit (plant) is described below.

The workpiece of laser pattern processing unit (plant) of the present invention is that ito thin film is formed on matrix, by swashing The ito thin film that light (processing light) is irradiated on the workpiece, removes a part of ito thin film, and implementing pattern to ito thin film adds Work.But, optical machining device of the present invention is not limited by the laser pattern processing unit (plant) that present embodiment 1 is related to, together Sample goes for processing other processing devices such as processing unit (plant), the machining of other patterns and with beyond laser Light be used as device for being processed of processing light etc..

Embodiment

Fig. 1 is the structural representation of the major part of the laser pattern processing unit (plant) of present embodiment 1.

The laser pattern processing unit (plant) of present embodiment 1 possesses laser output section 1, laser scanning section 2, processing object conveying Portion 3 and control unit 4.

Laser output section 1 has the laser oscillator 11 and light beam expander 12 as light source.Light beam expander 12 is used for expanding Exported from laser oscillator 11, as the beam diameter for the laser L for processing light.

Laser scanning section 2 has the f θ lens 22 as convergent portion, and the f θ lens 22 are used for that scanning galvanometer will be passed through (galvano meteric scanner) 21,22 scan laser L converge to the surface of workpiece 35 (machined surface) or (with workpiece surface at a distance of the position of prescribed depth) inside the workpieces such as the interface between matrix and ito thin film, Scanning galvanometer 21,22 therein is for driving the X axis scanning for rotating reflection laser L to use and Y-axis by stepper motor 21b Two Galvano speculum 21a of scanning, to the light scanning apparatus for causing laser L to be scanned in X axis and Y-axis.

Processing object delivery section 3 has a pair that workpiece 35 is moved on sub-scanning direction (Y-axis) defeated Send roller to 32,32 clamping workpieces 35 are conveyed along sub-scanning direction with the conveying roller.

Control of the laser oscillator 11 of laser output section 1 by Laser Driven portion 10.Specifically, Laser Driven portion 10 is controlled System is luminous with the laser oscillator 11 of the scanning motion gearing of the scanning galvanometer 21 of laser scanning section 2.It can use to matrix Heat effect caused by less below the 100ns of loss pulse hair shake generation pulse optical fiber as laser oscillator 11, other light sources can also be used.

Fig. 2 is a construction module figure of the laser oscillator 11 of present embodiment 1.

The laser oscillator 11 of present embodiment 1 is known as MOPA (Master Oscillator Power Amplifier pulse optical fiber).The laser oscillator 11 impulse generator 73 causes light source LD74 pulses hair to shake, Generate light source light.Laser oscillator 11 includes the impulse engine portion 70 of multistage amplification that carried out with optical fiber amplifier, guided from arteries and veins Rush the laser L of the output of engine part 70 output optical fibre 71 and made with collimating optical system 83 as collimated light beam forming portion Obtain the out-feed head 72 that laser L essentially becomes collimated light beam injection.In present embodiment 1, only out-feed head 72 is arranged on In laser output section 1.

Impulse engine portion 70 is included with optical fiber 78, excited LD76, the preposition amplification portion of coupler 77 and with optical fiber 82nd, the main amplification portion of excited LD80, coupler 81.Optical fiber is the double-clad structure of fiber cores doped rare earth elements, by encouraging oneself Play LD76 and absorb excited light, the roundtrip between the speculum of output end and the incidence end setting of optical fiber, until laser hair shakes. Mark 79 represents to block the isolation part of reverse light in Fig. 2, and mark 79 represents the bandpass filter for being used for removing ASE light.

Present embodiment 1 uses the 1064nm of near-infrared as light source LD74 wavelength.In addition, can also be according to processing The material of object, selects the various suitable wavelength such as 532nm, the 355nm of the 3rd higher harmonics of the second higher harmonics.In addition, swashing Light vibration generator 11 can also use solid state laser, such as crystallize to form lasing medium with Yttrium Orthovanadate with excited light irradiation, produce and swash Light shakes the YVO4 etc. of hair.

In the scanning galvanometer 21 of laser scanning section 2, each is used for rotating X axis scanning with each with Y-axis scanning Controls of the Galvano speculums 21a stepper motor 21b by scanning galvanometer control unit 20.Scanning galvanometer control unit 20 is according to structure Into the wiring factor data (line initial point coordinate and line terminal point coordinate) of processing graphic pattern, to control each stepper motor 21b, change phase For angle of inclination (inclination of the reflecting surface relative to the optical axis of the laser in incidence reflection face of Galvano speculum 21a reflectings surface Angle), the angle of inclination is changed on the direction parallel to X axis or the direction parallel to Y-axis.So just cause each Galvano speculums 21a since scanning angle of inclination to the rotation at end of scan angle of inclination, initial point that can be with line feature X-Y coordinate with terminal is corresponding.

X axis scanning and Y-axis scanning in present embodiment 1 using scanning galvanometer as light scanning apparatus, still The present invention is not limited thereto, it is allowed to use well-known light scanning apparatus.Can also be to the optical scanning device of X axis scanning The light scanning apparatus put with Y-axis scanning uses different light scanning apparatus.For example as shown in figure 3, being made with scanning galvanometer 21 For the scanning means of Y-axis scanning, and to the scanning of X axis then to drive the polygonal mirror that polygonal mirror 91a is rotated with motor 91 Scanner 91 is used as scanning means.Now as shown in figure 3, the laser L reflected by polygonal mirror 91a is via the beam incident optical of lens 92 Sensor 93, based on the light-receiving time of optical sensor 93, to carry out the optical scanning control of X axis.

Carrier 25 can be mobile in main scanning direction (X axis), and laser scanning section 2 is carried on the carrier 25.The quilt of carrier 25 On timing belt 27, the timing belt 27 is hung between driving pulley 27a and follow-up pulley 27b.Driving is slided with driving The synchronous motor 26 that wheel 27a is connected, drives timing belt 27 so that the carrier 25 on timing belt 27 prolongs along in main scanning direction The linear guide 29 (referring to Fig. 4) stretched, is moved on main scanning direction (X axis).The output exported according to linear encoder 28 Signal (address signal), can detect position of the carrier 25 on main scanning direction.The acceptor's scan control section 24 of stepper motor 26 Control.

Present embodiment 1 using using timing belt mobile device as carrying laser scanning section 2 carrier 25 movement Device, but the present invention is not limited, can also can make the device that moves linearly with straight line locating platform etc. to replace, Or using the mobile device of two-dimensional movement can be made.

Workpiece delivery section 3 possesses the conveying roller constituted with driven roller 32a and driven voller 32b to 32.Wherein, drive Roller 32a is driven by timing belt 31a by stepper motor 31.Stepper motor 31 is under the control of subscan control unit 30, with defeated Send roller to 32 clamping workpieces 35, make the workpiece 35 to the conveying target location on sub-scanning direction (Y-axis) It is mobile.Workpiece delivery section 3 intermittently conveys workpiece, by the processed part on workpiece 35 successively Send into the scanning range for the laser L that laser scanning section 2 is irradiated.

It is specific as follows.Processing object delivery section 3 possesses as the first monitoring camera 33 of position detection part and the second monitoring The telltale mark 37 formed on surface on camera 34, the main scanning direction for shooting workpiece 35 near two ends.It is secondary Scan control section 30 passes through the progressively progressive conveying on workpiece conveying direction B (sub-scanning direction) with small quantity of stepper motor 31 Workpiece 35, meanwhile, the view data of the first monitoring camera 33 and the output of the second monitoring camera 34 is obtained successively.Then, Detection telltale mark 37 is handled etc. by pattern match, the processing object amount of movement of distance conveying target location is calculated, according to this Result of calculation controls stepper motor 31 so that the sub-scanning direction position of workpiece 35 is moved to conveying target location.

Fig. 4 is the construction module figure of a processing object delivery section 3.

The workpiece 35 of present embodiment 1 is wound onto on roll 51, is the big scroll of length.From roll The 51 processing object parts pulled out are clamped along entrance guide plate 52 by conveying roller to 32 clamping part, in drive of the conveying roller to 32 Under dynamic, it is set to after being rolled out from roll 51 in machine table 53.Countless pores are formed in machine table 53, is extracted out and is formed with pump 58 In the air of the blank part 57 at the back side of machine table 53, workpiece 35 is adsorbed on the surface of machine table 53, to ensure processing Flatness of the object 35 on machining area 36.The cutter that workpiece by processing is moved in main scanning direction 54 are cut into prescribed level, are then discharged into pallet 55.

Present embodiment 1 is using from being rolled onto by the way of piece, by the workpiece 35 on roll 51 from coiling Axle 51 is rolled out, and the workpiece by processing then is cut into piece discharge.In addition, it would however also be possible to employ as shown in Figure 5 The mode from roll-to-roll, will by processing workpiece wound into rolls.

In the example as shown in fig. 5, the workpiece by processing is attached to this by a pair of removings of clearers 64 and added After the processing dirt on work object surface, it is winding on roll 67.Adsorbed using pasting the viscous suction of roller 65 and reclaiming in clearer Processing dirt on 64.In the example as shown in fig. 5, in order to protect the workpiece surface after processing to avoid being abraded, The upper and lower surface of the workpiece 35 by processing is attached to laminated film, is then wound with roll 67.Laminated film from THIN COMPOSITE deflector roll 66 is wound up on roll 67 after rolling out together with the workpiece by processing.

Control unit 4 possesses control PC40, for being managed collectively whole this laser pattern processing unit (plant) of control.Control PC40 with Laser driver portion 10, scanning galvanometer control unit 20, main scanning control unit 24, subscan control unit 30 etc. are connected, and management is each The state in portion, controls time course.

The light beam expander 12 of laser output section 1 is constituted with multi-disc lens, on laser optical path, and the f θ with laser scanning section 2 are saturating The position of the immediate lens 39 of mirror 22 can be moved up in the optical axis axle of laser.Movement is produced by the position of lens 39, The carrier for carrying laser scanning section 2 can as will be described be finely tuned so that carrier stops at main scanning direction Each stop target location on when focusing distance it is consistent.In other words, light beam expander 12 has the focusing function being finely adjusted, So that the laser beam L of incident scanning galvanometer 21 turns into collimated light beam.

In addition actuator is also equipped with, for according to each stopping target location on main scanning direction, to the position of lens 39 Put progress and adjustment is individually moved.By causing each stops the focusing distance of target location to turn into variable range, even if carrier phase Occur small deviation for the depth of parallelism of the moving direction of machined surface, f θ lens 22 can be also adjusted to good precision Image space.

In present embodiment 1, laser L is machining area 36 in X axis relative to the scanning range of workpiece 35 It can be obtained with respective maximum length L in Y-axis to following formula (1).Here, setting the focal lengths of f θ lens 22 as f, respectively Galvano speculums 21a maximum tilt angle is θ (being, for example, ± 20 °),

L=f × θ (1)

As shown in formula (1), scanning range (the Galvano speculums 21a of the width of machining area 36 by scanning galvanometer 21 Maximum tilt angle) limitation.Here, the scanning range of scanning galvanometer 21 is wider, just it is more difficult to obtain on workpiece 35 Good convergence.Therefore, it is difficult to maintain the processing uniformity in machining area 36.It follows that expanding sweeping for scanning galvanometer 21 Scope is retouched, that is, expanding Galvano speculums 21a maximum tilt angle θ has certain limitation.Therefore, swept by increase Retouch the scanning range (Galvano speculums 21a maximum tilt angle) of galvanometer 21 has to widen the width of machining area 36 Limitation.

On the other hand, from formula (1), the focal length f length of increase f θ lens 22 can increase the width of machining area 36 Degree.But, focal length f is accomplished by setting workpiece 35 more greatly that must to leave f θ lens 22 more remote, can cause this laser pattern The problem of processing unit (plant) maximizes.

And if setting stepper motor 21b umber of pulse as P, then X axis and the respective machining resolution σ of Y-axis can be used Following formula (2) is obtained.

σ=f × (2 π/P) (2)

Here, as shown in formula (2), the focal length f of f θ lens 22 is bigger, and machining resolution σ is smaller.It follows that by means of High machining resolution σ realizes high-precision fining-off and realizes both the bigger machining area of width relations of compromising each other.Therefore, examining When considering by means of machining resolution, also there is limitation by increasing focal length f to increase the width of machining area 36.

It is still further contemplated that setting travel mechanism, travel mechanism can not only cause workpiece 35 in subscan Direction (Y-axis) is mobile, can also be moved on main scanning direction (X axis)., can be relative to processing using the travel mechanism Region 36, changes the processed part of feeding workpiece 35, while to each processed part on main scanning direction successively Implement working process, at the workpiece implementation processing therefore, it is possible to exceed machining area 36 to the length of main scanning direction Reason.

But, setting can not only be in sub-scanning direction (Y-axis) and can be in the mobile processing pair of main scanning direction (X axis) As the travel mechanism of thing, it will cause this laser pattern processing unit (plant) to maximize.Processing pair especially in present embodiment 1 As thing 35 is the large-scale workpiece that sub-scanning direction length exceedes machining area 36, if will be further in main scanning direction (X axis) mobile this large-scale workpiece, then need Large-scale Mobile mechanism.And such Large-scale Mobile mechanism has phase When big weight, thus inertia is big, it is difficult to high-speed mobile, therefore also there is the problem of reducing production efficiency.

In this regard, scanning range of the present embodiment 1 using the mobile laser L on main scanning direction (X axis), rather than move The composition of dynamic workpiece 35.It is specific as follows.Carrier 25 carries laser scanning section 2 so that laser scanning section 2 can be swept in master The side of retouching is moved up.This way it is not necessary to move workpiece 35 on main scanning direction, but swept with by scanning galvanometer 21 The laser L retouched comes the scope on scanning machining object surface, i.e. machining area 36, relative to workpiece 35 in main scanning side Relative movement upwards.Hereby it is possible to cause the processed of workpiece 35 to be partially moved to machining area 36 successively, implement to add Work processing, main scanning direction (X axis) even if the width of machining area 36 it is narrow, also can to width exceed the machining area 35 The large-scale workpiece 35 of width, implements working process.

Present embodiment 1 need not increase machining area, just can be to the large-scale workpiece more than machining area 36 35 implement working process, as a result, being conducive to keeping high machining resolution σ, realize the high-precision of large-scale workpiece 35 Processing.Moreover, in present embodiment 1, as the carrying object carried on the carrier 25 of main scanning direction mobile means actually Only laser scanning section 2, i.e. only scanning galvanometer 21 and f θ lens 22.The weight of the carrying object is ten compared with workpiece 35 Divide light, thus be conducive to carrier 25 in the high-speed mobile of main scanning direction, improve production efficiency.

In addition, as the carrying object carried on carrier 25, as long as at least carrying the optically focused for processing light injection part as constituting The f θ lens 22 in portion just may be used.Therefore most light-duty composition is only carries f θ lens 22 on carrier 25.On the other hand, if with adding Work object 35 compares the element of lighter in weight, and these elements can also be equipped on carrier 25 together with f θ lens 22.For example such as The grade light scanning apparatus of scanning galvanometer 21 can be carried on present embodiment, carrier 25, a part of laser output section 1 can also be carried Or whole laser output section 1.

In present embodiment 1, be incident on the laser L of the carrier 25 moved on main scanning direction light path, i.e., it is defeated from laser Go out the laser L of the output of portion 1 light path, parallel to X axis.Therefore, as shown in fig. 7, no matter carrier is moved to main scanning direction (X Any position on axially), the laser L exported from laser output section 1 incides the same position on carrier 25.Accordingly, i.e., Just carrier 25 is moved on main scanning direction (X axis), and the light path of the laser L after incident carrier 25 is still identical, is swept to master When retouching mutually different machining area 36-1 and 36-2 implementation working process on direction, identical working process can be implemented.

But in present embodiment 1, after carrier 25 is moved, the optical path length of the laser L before incident carrier 25 occurs Change.Therefore, the laser L of incident carrier 25 is if non-parallel collect light, then the position with carrier 25 on main scanning direction Difference is put, irradiating the laser L of workpiece 35 focus will change, the beam diameter of the laser L on workpiece 35 Size variation etc., so as to produce influence to machining accuracy.

To this in present embodiment 1, the generally parallel light beams of laser L that laser oscillator 11 is exported are anti-via two Penetrate after mirror 14 and 15 reflects and projected from light beam expander 12, then the laser L exported by the reflection of speculum 16 from laser output section 1 Also it is about collimated light beam.Therefore, collected if the laser L of incident carrier 25 is almost parallel, even if carrier 25 move after Position on main scanning direction changes, and substance will not also occur for the focus for the laser L being irradiated on workpiece 35 Change, so as to will not occur the influences such as the beam diameter variation of the laser L on workpiece 35.Therefore, for main scanning direction When implementing working process on upper mutually different machining area 36-1 and 36-2, processing can be implemented with identical machining accuracy Processing, without carrying out the operations such as focus adjustment, is conducive to improving production efficiency.

But, if on carrier 2 in addition to laser scanning section 2, also carrying and being taken on whole laser output section 1, i.e. carrier 25 Carry the grade of laser oscillator 11 light source in itself, even if then carrier 25 is moved, the focus for the laser L being irradiated on workpiece 35 It will not change, however, the carrying object weight increase on carrier 25, needs to consider that carrier 25 is difficult to asking for high-speed mobile for this Topic.The weight of light source is generally higher than on the weight of other elements, usual carrier 25 and does not carry light source, to effectively reduction carrier 25 Inertia, realize the high-speed mobile of carrier 25, improve production efficiency.

On the other hand, in order to reduce the weight of carrying object on carrier 25, as shown in fig. 7, it is also contemplated that on carrier 25 not Carry the grade light scanning apparatus of scanning galvanometer 21.In the composition shown in Fig. 7, the laser L that laser output section 1 ' is exported passes through fixation Scanning galvanometer 21 in the laser scanning section 2 ' of setting, in the direction parallel with X axis, the side parallel with Y-axis is scanned up. The laser L so scanned so that light beam is changed into the element of collimated light beam, is handled by the grade of collimating mirror 61 by light beam parallelization, into After the collimated light beam parallel to X axis, projected from laser scanning section 2 '.Turn into almost parallel after the output of laser scanning section 2 ' Laser L is incident along X axis relative to carrier 25 after the scanning of light beam, after the reflection by the speculum 16 ' on carrier 25, is making Under guiding for the f θ lens 22 of light concentrating components, converge on workpiece 35.

Composition even shown in Fig. 7, is collected because the laser L of incident carrier 25 is almost parallel, so regardless of carrier 25 It is moved and the position on main scanning direction changes, the laser L being irradiated on workpiece 35 focus is not yet Can occur substantial variation, so as to will not occur the influences such as the beam diameter variation of the laser L on workpiece 35.Therefore, When implementing working process on mutually different machining area 36-1 and 36-2 on main scanning direction, it is not necessary to carry out focus adjustment etc. Operation, can implement working process with identical machining accuracy, be conducive to improving production efficiency.

Fig. 8 is that the laser pattern processing unit (plant) of present embodiment 1 carries out a flow chart of pattern working process.

First, according to control PC40 control instruction, the control stepper motor 31 of subscan control unit 30 so that processing object Thing 35 moves (S1) along sub-scanning direction to processing object conveying direction B.Then, formed on the surface of workpiece 35 Telltale mark 37 be moved to after the camera watch region of the first supervision camera 33 and the second supervision camera 34, from the first supervision camera 33 With detection telltale mark 37 (S2) in the view data of the second supervision camera 34.PC40 is controlled to calculate the detection knot of telltale mark 37 Fruit is to the workpiece amount of movement between conveying target location, according to the result of calculation, to cause subscan control unit 30 to control Stepper motor 31 processed.Accordingly, the workpiece 35 moved on sub-scanning direction is stopped on conveying target location.

After workpiece 35 stops, control PC40 obtains the figure of the first supervision camera 33 and the output of the second supervision camera 34 As data, bias (the X axis bias of workpiece between the center and target location of telltale mark 37 is calculated Δx_w, workpiece Y-axis bias Δ y_w, workpiece inclination bias).The every processing pair obtained As thing bias Δ x_w、Δy_w、The offset (deviation) for being used as editing objective position is used, control is saved in In internal memory in PC40.

Fig. 9 is deviation between the center of telltale mark 37 and target location O under a workpiece halted state Schematic diagram.

The center O for the image that the first supervision camera 33 and the second supervision camera 34 are shot is calculated with being shown on the image Telltale mark 37 center between departure, obtain the centre bit of telltale mark 37 under workpiece halted state Put the departure between the O of target location.Present embodiment is workpiece with the bias on X axis (main scanning direction) X axis bias Δ x_w, the bias in Y-axis (main scanning direction) be workpiece Y-axis bias Δ y_w, connection plus The straight line of two telltale marks 37 formed in work object 35 on the identical sub-scanning direction position at main scanning direction two ends Relative to the angle of X axis (main scanning direction), that is, tilt workpiece biasTo represent the workpiece Departure.

Hereafter, control PC40 causes pump 58 to act, to forming the air-breathing of blank part 57 in the behind of machine table 53 so that processing Object 35 is attracted to the surface of machine table 53, keeps the position of workpiece 35 not to be moved (S3).Then, control The processed numbering of part N for being used to determine to be processed part on workpiece 35 is set as 0 (S4) by PC40, passes through main scanning Control unit 24 control stepper motor 26, carry out carrier positions initialization process so that the standby carrier 25 of position of readiness along Main scanning direction is mobile to carrier conveying direction A (direction for leaving laser output section 1), stops at defined location base (S5)。

In initialization process, the address signal that control PC40 is exported according to linear encoder 28, acquirement stops at base The main scanning direction position of the carrier 25 of position.Then, the address signal exported according to linear encoder 28, detection control PC40 Difference between the position of the location base of management and the actual carrier 25 stopped, the difference is used to hereafter sweep the master of carrier 25 Retouch the control of direction position.In addition, the difference can also be used as the offset (bias) of editing objective position.

Then, PC40 is controlled according to the bias Δ x of above-mentioned workpiece_w、Δy_w、Each target of carrier The bias Δ x of stop position and actual stop position_cAnd the carrier posture bias δ x being described below_w、δy_w、With following formula (3-1) to (3-3), the offset i.e. disagreement value A of the editing objective position for compensating process data is obtained D_xi、ΔD_yi、I of the following formula (3-1) into (3-3) is each stop position (first on the main scanning direction for represent carrier Stop position i=1, the second stop position i=2, the 3rd stop position i=3) numbering.

It is described herein carrier posture bias δ x_i、δy_i、

Figure 10 is the schematic diagram of the posture deviation of the carrier 25 when carrier stops.As shown in Figure 10, carrier 25 can be along Straight line conductor 29 is moved, therefore, there is the vibration gap needed between carrier 25 and straight line conductor 29.In addition, straight line conductor 29 Also there is very straightforward etc. mismachining tolerance.The posture of carrier 25 and target appearance when these gaps or mismachining tolerance stop due to carrier There is deviation between gesture.The deviation is represented by following various rotation errors, i.e., around parallel to carrier moving direction, that is, surround Rotation error (front and rear error alpha) parallel to the rotary shaft of main scanning direction (X axis), around parallel to workpiece 35 The direction of machined surface and perpendicular to the direction of carrier moving direction, i.e., around the rotation parallel to sub-scanning direction (Y-axis) The rotation error (left and right error β) of axle and the normal direction (Z axis to) around the machined surface parallel to workpiece 35 Rotary shaft rotation error (up-down error γ).

Rotation error α, β, γ when above-mentioned carrier 25 stops is with position (the first stop position i for make it that carrier stops =1, second stop position i=2, the 3rd stop position i=3) it is different and different.Present embodiment considers also to arrive so that carrier stops Position only, different deviation Δ D is used to each stop position_xi、ΔD_yi、As long as but stop position is not It is both that within allowed band, common deviation value can also be used to each stop position.

In addition, if carrier posture bias δ x_i、δy_i、Caused Working position deviates within tolerance band, And carrier posture bias need not be compensated.

Carrier posture is inclined caused by above-mentioned rotation error α, β, the γ when carrier 25 stops of present embodiment measured in advance From amount δ x_i、δy_i、And be stored in the measured value in control PC40 internal memory.The measured value for example can be by the following method Obtain.

First, by with the deviation Δ D of current point in time_xi、ΔD_yi、Compensate the state of editing objective position Under, the processing graphic pattern of measure is processed respectively in the first stop position, the second stop position, the 3rd stop position.Then, with setting The processing graphic pattern on each stop position by processing is shot in the supervision camera 23 on carrier 25, according to the photographed images number According to bias of the measurement between the Working position and target Working position for the processing graphic pattern that each stop position is processed.Specifically It is as follows.Measure the bias between image data and the ideal image data of measure pattern.Then, it is inclined with what is detected Bias caused by rotation error when stopping from amount as carrier 25, the bias is added to the existing load being stored in internal memory Body posture bias δ x_i、δy_i、On, to carrier posture bias δ x_i、δy_i、It is updated.The measure can not also make With special measure pattern, and processing graphic pattern when using processing in the past.

Carrier posture bias δ x caused by rotation error α, β, γ when carrier 25 stops_i、δy_i、Survey Fixed method is simultaneously only not limited to the above method.Terminate measure pattern for example, it is also possible to be taken out from laser pattern processing unit (plant) The workpiece 35 of processing, the workpiece 35 is set to as defined in image-scanning device etc. and determined on device, each Bias on individual stop position between the Working position and target Working position of processing graphic pattern of the measurement by processing, is counted with this Measured value updates the carrier posture bias δ x being stored in internal memory_i、δy_i、

Then, the processed numbering of part N of workpiece 35 is set as 1 (S6) by control PC40.Then, PC40 is controlled Stepper motor 26 is controlled by main scanning control unit 24 so that the carrier 25 positioned at location base is moved to carrier conveying direction A, Stop on the first stop position, first stop position is used for the on the workpiece 35 of original adoption working process One, which is processed part N=1, implements working process (S7).

Here, present embodiment 1 is in order to realize the high machining resolution below 5 μm of positional precision, setting scanning galvanometer The size of laser scanning scope, i.e. machining area 36 on the workpiece of 21 scannings, is 150mm × 150mm.Therefore, plus The processing pair of the area to be machined on work object, for example, 450mm (main scanning direction) × 600mm (sub-scanning direction) size As thing 35 is in working process, as shown in figure 11, whole area to be machined is divided into 3 pieces along main scanning direction, and along Sub-scanning direction is divided into 4 pieces.Then, successively this 12 pieces (being processed part N=1 to 12) areas to be machined are implemented to add successively Work processing, so as to complete the working process of whole area to be machined.Each in Figure 11 is processed on part 36-1 to 36-24 Numeral represents processing sequence, and dotted line represents the severing line of workpiece 35.

Here, present embodiment is different with two kinds of silver coating to the ito thin film formed on workpiece 35 with laser L Material implements pattern processing respectively.For ito thin film and silver coating, the processing conditions used according to the difference of material (including swash Light L light quantity, laser L wavelength, laser L irradiation time etc.) also differ.Here, present embodiment is for main scanning side Three pieces of upward processed parts, after the pattern processing for implementing ITO with the processing conditions of ito film first, by the processing conditions The processing conditions of silver coating is switched to, the pattern that again same as described above three pieces are processed with part implementation silver coating adds Work.Now, the processing conditions of setting ito film is different with the processing conditions of silver coating.Three pieces of quilts on main scanning direction After the processing part ito film of (N=1 to 3) and two kinds of pattern working processes of silver coating terminate, workpiece 35 is sent Toward processing object conveying direction portion B, restart the processing that other three pieces of main scanning direction is processed part (N=4 to 6).

In other words so that carrier 25 successively from location base be moved to the first Working position, the second Working position, the 3rd plus Station puts (S6, S7), and the processed part of corresponding ito thin film on workpiece 35 is implemented to add on each stop position Work handles (S8, S9, S10), and after the working process of the 3rd Working position is terminated (S11's be), come back to the base position.Then, In order to carry out silver coating processing (S12's is no), the processed portion for determining the processed part on workpiece 35 is set Lacing N is N-3 (S13).Then, again by carrier 25 from location base be moved to the first Working position, the second Working position, 3rd Working position (S6, S7), to the processed part of corresponding silver coating on workpiece 35 on each stop position Implement working process (S8, S9, S10, S11), terminate after the working process of the 3rd Working position (S12's be), come back to the base position Put.

On the other hand, on sub-scanning direction, carrier 25 is moved to the 3rd Working position and terminates silver coating working process Afterwards (S11's be), to next first Working position working process start before, control PC40 passes through subscan control unit 30 control stepper motors 31 so that workpiece 35 moves 150mm (S13) to target conveying direction B, then keep adding Work object 35 (S14) position is constant.Then carrier 25 is caused to be moved to the first Working position, the second machining position successively again Put, the 3rd Working position implements the working process (S5 to S11) of ito thin film and silver coating.

Present embodiment is stopped on each stop position (S7) in carrier 25, before beginning pattern working process (S10), The address signal that control PC40 is sent according to linear encoder 28, the master for obtaining the carrier 25 stopped on each stop position sweeps Retouch direction position.The address signal then sent according to linear encoder 28, the target stop position of detection control PC40 management Difference between the position of the actual stopping of carrier 25, and then it regard the difference as carrier positions bias Δ x_cIt is temporarily stored to In internal memory (S8).Then, control PC40 reads Δ x from internal memory_w、Δy_w、Carrier positions bias Δ x_cAnd carrier Posture bias δ x_i、With above-mentioned formula (3-1) to (3-3), deviation Δ D is obtained_xi、ΔD_yi、(S9)。

Then, the control PC40 deviation Δ D obtained_xi、ΔD_yi、To correct the origin of coordinates of process data. And then, control PC40 carries out working process according to the process data on the basis of the corrected origin of coordinates.

If it is each independent that each in workpiece is processed part, each stop position of carrier 25 can also be On the separated position of each machining area 36.But if processed part is not independent mutually, but be processed by multiple Part constitutes a processing object, then in this case, and each of each stop position of carrier 25 or workpiece stop Stop bit, which is put, to be needed to allow on the position that each machining area 36 is abutted or a part is repeated.Especially as present embodiment is real Capable pattern processing is, it is necessary to which so that the wiring pattern being processed between part is continuous, in this case it is necessary to avoid being processed Need continuous wiring pattern because of deviation between part and caused by it is discontinuous.

Be this present embodiment set each processed part when, between 12 processed parts be provided with some tens of pm Repeat region so that adjacent processed part partly overlaps from each other.By setting such overlapping region, even if leaving The error that can not be compensated, can also improve discontinuous wiring.

Figure 12 is to be processed between each piece of part to need to keep a continuous wiring pattern schematic diagram.

Wiring pattern of Figure 12 displays across processed each piece of numbering of part N=1, N=2, N=4.With oblique line table in Figure 12 The region shown is overlapping region, and dotted line represents the preferable Working position based on target process data, and solid line is represented to being processed Implement the practical wiring pattern after working process in numbering of part N=1 processed part.

As shown in figure 12, according to supervision camera it was observed that supervision camera viewing area, in main scanning direction (X-axis To) on the numbering N=2 adjacent with numbering N=1 processed part processed part and be processed with numbering N=2 The adjacent numbering N=3 in part processed part, sets the offset (y-coordinate deviation) of Y-axis coordinate, for compensating processing The sub-scanning direction position of object 35.On the other hand, for processed with numbering N=1 on sub-scanning direction (Y-axis) The adjacent numbering N=4 in part processed part and the numbering N=7's adjacent with numbering N=4 processed part is added The Ministry of worker point and then the numbering N=10 adjacent with numbering N=7 processed part processed part, set the benefit of X-axis coordinate Value (x coordinate deviation) is repaid, for compensating the main scanning direction position of workpiece 35.These offsets can in advance be write Enter to control PC40 internal memory, these offsets are then read when to each piece of processed part working process, compensate process data The origin of coordinates.

As described above, while movement on main scanning direction and sub-scanning direction, being processed part to 12 pieces, (N=1 is extremely 12) working process is implemented.Terminate when all working processes (S14's be), whole 450mm × 600mm area to be machined plus After the completion of work processing, with the cutting off processing object 35 (S17) of cutter 54, it is discharged in pallet 55.As in this embodiment When implementing to process to the workpiece 35 wound with roll-shaped, it is only necessary to before winding terminates, be repeatedly carried out so that carrier 25 are moved to the first Working position, the second Working position, the 3rd Working position from location base successively, implement ito thin film and silver After the working process of coating, moving 150mm action along processing object conveying direction B just can (S18).

Deviate to represent to calculate compensation process data deviation with the stop position of processing object delivery section 3 in present embodiment It is worth Δ D_xi、ΔD_yi、Workpiece bias Δ x_w、Δy_w、But if telltale mark 37 deviates processing Assigned position on object 35, then the amount of the deviation is in itself also comprising error.Formed for example, being printed on workpiece 35 During telltale mark 37, its printing precision is if ± 10 μm, then the printing error will directly influence processing object bias Δ x_w、Δy_w、Error.

For above-mentioned situation, for example as shown in figure 13, the processing object at least one end of workpiece is conveyed Two supervision cameras 34-1 and 34-2 are set on the B of direction.Now, two 34-1 and 34-2 points of supervision cameras are for example opened into a spacing From the distance first, is used as first position detection dress equivalent to the regulation processing object conveying capacity of processing object delivery section 3 The supervision camera 34-1 positioned at the side of processing object conveying direction upstream one put shoots telltale mark 37, detects in the shooting image Telltale mark.After workpiece 35 to be moved to processing object delivery section 3 regulation conveying capacity, equally act as the 3rd The supervision camera 34-2 positioned at the side of processing object conveying direction downstream one of position detecting device shoots telltale mark 37, and detection should Telltale mark in shooting image.Then, according to the image of the supervision camera 34-1 shootings positioned at the side of upstream one, it is located to export Original telltale mark position (setting test position) on the image that the supervision camera 34-2 of the side of downstream one is shot, and then obtain position Actual telltale mark position (actually detected position) and above-mentioned original in the image that the supervision camera 34-2 of the side of downstream one is shot Bias between some telltale mark positions (setting test position).If processing object bias Δ x_w、Δy_w、Meter The above-mentioned bias obtained is considered in calculation, then can obtain the processing object bias for excluding the positional precision error of telltale mark 37 Δx_w、Δy_w、

Variation

Describe the variation of the pattern working process of present embodiment below.

In the above-described embodiment, for three pieces of processed parts on main scanning direction, processed first with ito thin film Condition is implemented after the pattern processing of ito thin film, and the processing conditions is switched into silver coating processing conditions, processed with silver coating Condition, is processed the pattern processing that silver coating group is implemented in part to three pieces again.In this variation, processed first with silver coating Condition is processed part for each piece to be carried out silver coating pattern and processes, then by the processing conditions be switched to ito thin film with plus Work condition, with ito thin film processing conditions, the pattern processing that ito thin film is carried out in part is processed to same.This variation Processing sequence in the processing sequence of silver coating and ito thin film and above-mentioned embodiment on the contrary, in this regard, can also equally use with Above-mentioned embodiment identical processing sequence.

The composition of the laser pattern processing unit (plant) used in the pattern working process of this variation and above-mentioned embodiment The composition of the middle laser pattern processing unit (plant) used is identical.

Figure 14 is the flow chart of the pattern working process of this variation.

In this variation, control PC40 causes workpiece 35 along sub-scanning direction to processing object conveying direction B moves (S1), stops the movement of workpiece 35 near target transfer position, keeps the workpiece 35 (S2, S3) It is motionless.Then, set and be processed numbering of part N as 0 (S4), to determine the processed part on workpiece 35, with master Scan control section 24 controls stepper motor 26, carries out the carrier positions initialization process (S5) stopped in regulation location base.

Secondly, control PC40 is identical with above-mentioned embodiment, obtains editing objective position for compensating process data Offset, i.e. deviation Δ D_xi、ΔD_yi、Then, control PC40 sets the processed numbering of part of workpiece 35 N is 1 (S6), and stepper motor 26 is controlled with main scanning control unit 24 so that the carrier 25 positioned at location base is to carrier conveying side Moved to A, and carrier 25 is stopped on the first stop position (S7).First stop position is to initially carrying out at processing First processed part N=1 working process enforcing location on the workpiece 35 of reason.Then, control PC40 is according to linear The address signal that encoder 28 is sent, obtains the main scanning direction position of carrier 25 stopped on the first stop position, and upper State that embodiment is identical, the difference between the stop position of the target stop position of detection control PC40 management and the carrier 25 of reality Value, regard the difference as carrier positions bias Δ x_cIt is temporarily stored in internal memory (S8).Then, control PC40 is read from internal memory Δx_w、Δy_w、Carrier positions bias Δ x_cAnd carrier posture bias δ x_i、With above-mentioned formula (3-1) To (3-3), deviation Δ D is obtained_xi、ΔD_yi、(S9)。

In this variation, control PC40 reads the process data of silver coating first, with the deviation Δ D obtained_xi、Δ D_yi、To correct the origin of coordinates of silver coating process data.Then, on the first stop position, control PC40 according to The process data on the basis of the origin of coordinates after correction, implements silver coating pattern with silver coating processing conditions and processes (S10- 1).Then, control PC40 reads the process data of ito thin film, with the deviation Δ D obtained_xi、ΔD_yi、To correct The origin of coordinates of ito thin film process data.Then, processing conditions is switched to ito thin film processing conditions by control PC40, the On one stop position, part is processed to same and implements ito thin film pattern processing (S10-2).

As described above, after the pattern working process of the silver coating and ito thin film on the first stop position terminates, controlling PC40 The processed numbering of part N of workpiece 35 is set to 2 (S6), stepper motor 26 is controlled with main scanning control unit 24 so that Carrier 25 is moved to the second stop position, and being processed part N=2 to second on workpiece 35 carries out working process (S7).Hereafter, it is identical with the first stop position, the pattern processing (S10-1) of silver coating is carried out on the second stop position, afterwards Carry out the pattern processing (S10-2) of ito thin film.After working process on the second place terminates, similarly in the 3rd stop position The upper pattern processing (S10-1) for carrying out silver coating, carries out the pattern processing (S10-2) of ito thin film afterwards.

Then, identical with above-mentioned embodiment, control PC40 controls stepper motor 31 by subscan control unit 30 so that Workpiece 35 moves 150mm (S13) to target conveying direction B, then keeps workpiece 35 (S14) motionless. Carrier 25 is then caused to be moved to the first Working position, the second Working position, the 3rd Working position successively and implement silver painting again The working process (S5 to S11) of layer and ito thin film.

Telltale mark 37 in present embodiment be on workpiece 35 print silver coating when and meanwhile formed with silver The mark that coating is constituted, but the present invention is not limited thereto.Processing silver coating can also be for example equal to laser scanning, or Telltale mark 37 is formed with ito thin film on etching and processing workpiece 35 etc..

The shape of telltale mark 37 in present embodiment is circular, but the present invention is not limited, can also use two Intersection wire shaped that the square crossing of root straight line is formed etc., is preferred beneficial for being matched the shape to detect with image procossing.It is fixed The shape of position mark 37 can select suitable shape according to monitoring method of telltale mark 37 etc..

With two bit scan devices as light scanning apparatus in the description of present embodiment, in this regard, can also be using linear Scanning means.

In addition, exemplified by present embodiment is using ito thin film and silver coating as processing object, and the present invention is not limited. The present disclosure applies equally to the other materials such as including copper coating in processing object.

Above is the example of the present invention, distinctive effect is played in following various modes.

Mode A

A kind of optical machining device, such as laser pattern processing unit (plant), wherein having：Illumination part, such as laser output section 1 with And laser scanning section 2 etc., for the machining area such as irradiation of machining area 36 processing light, wherein possessing the light for launching the processing light Source, such as launches laser L laser oscillator 11；Delivery section, such as processing object delivery section 3, for defined conveying side To such as processing object conveying direction B (Y-axis) intermittently conveys workpiece, by the workpiece such as processing pair As the grade of thing 35 machined surface on processed part be sequentially sent to the machining area 36；And, machining control portion is such as controlled PC40 etc., in the state of being stopped at for the processed part on the workpiece on the machining area, according to adding Number evidence, carries out machining control, and the processing light irradiated with the light source processes this and is processed part, it is characterised in that with position Test section, such as supervision camera 33,34-1,34-2 are put, institute is stopped at for the processed part on the workpiece When stating on machining area, the position of the detection mark such as telltale mark 37 on the workpiece is detected, it is described to add Work control unit compensates the stop position of the workpiece of the delivery section conveying according to the testing result of the position detection part Deviate (processing object bias Δ x_w、Δy_w、) caused by Working position deviate.

The manner detects the position that the detection on workpiece is marked with first position test section, according to the inspection Result is surveyed, stop position bias of the workpiece when delivery section stops conveying is grasped, to deviate the stop position The Working position caused, which deviates, to be compensated.

Mode B

Optical machining device based on mode A, it is characterised in that the machining control portion carry out the machining control when, So that two adjacent processed parts on the conveying direction are adjacent to each other on workpiece or partly overlap.

The manner enables optical machining device on the workpiece conveying direction of delivery section, continuously to processing pair As implementing processing between each processed part on thing.So just can be to the workpiece conveying direction in delivery section On, it is not mutual independence that each, which is processed part, on workpiece, but is constituted a processing pair with multiple processed parts The workpiece of elephant implements working process.In such working process, it is desirable to which each has continuously between being processed part Property, and require that each is processed part and has high Working position precision.And the manner can control the processing that delivery section is conveyed Working position caused by the stop position of object deviates deviates, it is thus possible to obtain the high manufacturing accuracy needed.

Mode C

Optical machining device based on mode A or mode B, it is characterised in that the position detection part is examined comprising first position Survey portion and second place test section, the first position test section, such as supervision camera 34 are located at workpiece for detecting The position of the first detection mark of the upper side of one end end one with the perpendicular width of the conveying direction, second Test section, such as supervision camera 33 are put, the machining area is stopped at for the processed part on the workpiece When upper, detected on the workpiece located at the position of the second detection mark of the side of other end end one on the width Put, the position and described second that the first detection that the machining control portion is detected according to the first position test section is marked The position for the second detection mark that position detection part is detected, to compensate the workpiece of the delivery section conveying in width Relative stop position between the two ends end in direction, which deviates, (to be tilted processing object to deviateDeng) Working position that causes is inclined From.

The optical machining device of the manner can reduce because of the workpiece two ends in the direction of the width that delivery section is conveyed Working position produced by deviateing between end with respect to stop position deviates.

Mode D

Optical machining device based on any one mode among mode A to mode C, it is characterised in that the position detection Portion further has the 3rd position detection part, for by the first position test section such as detection such as supervision camera 34-1 Conveyed afterwards by the delivery section, and then the processed part on the workpiece is stopped on the machining area When, the position that detection is marked with the same detection detected by the first position test section, the machining control portion compensation The Working position that deviation between the calculating test position of the same detection mark and actually detected position is caused deviates, The calculating test position refers to, is exported according to the testing result of the first position test section with the 3rd position detection part The result of calculation that the same detection is obtained with the position of mark is detected, the actually detected position refers to, described 3rd Put the position of the actually detected same detection mark arrived of test section.

When the positional precision of the detection mark on workpiece is poor, caused by producing the site error Working position deviate.The manner according to the testing result of first position test section and the testing result of the 3rd position detection part, To obtain the deviation between the calculating test position of detection mark and actually detected position, according to the deviation, grasp, which is located at, to be added The site error of detection mark on work object.Therefore, even in the detection mark on workpiece In the case that positional precision is poor, the Working position that can also suppress to thereby result in deviates.

Mode E

Optical machining device based on mode A any one mode into mode D, it is characterised in that the machining control portion By compensating the process data according to the testing result of the position detection part, deviate to compensate Working position.

The stop position of workpiece for being conveyed by delivery section deviates the compensation that the Working position caused deviates, It is contemplated that the method compensated using the stop position that workpiece is adjusted by delivery section.But, due to conveying Portion is larger to the minimum control unit (the minimum bias that can compensate for) of the stop position of workpiece, therefore can not compensate The Working position of smile deviates.Due to reasons such as necessary errors present in delivery section conveying, it is difficult to realize delivery section with high-precision Degree causes workpiece movement slight distance under halted state.

And the optical machining device of the manner utilizes the method for compensating process data, the minimum bias that this method can compensate for Mutually it is equal with machining resolution (least unit for the Working position that can be controlled), it is thus possible to compensate small Working position inclined From.

Mode F

Optical machining device based on mode E, it is characterised in that the machining control portion is according to the inspection of the position detection part Result is surveyed, to compensate the process data so that by the Working position on the processed part of the processing light irradiation to institute State conveying direction (Y-axis) mobile.

The manner can the Working position of the workpiece that is conveyed by delivery section of high-accuracy compensation in the conveying direction it is inclined From.

Mode G

Optical machining device based on mode E or mode F, it is characterised in that the machining control portion is examined according to the position The testing result in survey portion compensates the process data so that by the Working position on the processed part of the processing light irradiation To perpendicular to the direction of the conveying direction (X axis) movement.

The manner can be on the workpiece that is conveyed from delivery section of high-accuracy compensation Working position to perpendicular to described The direction (X axis) of conveying direction is mobile.

Mode H

Optical machining device based on mode E any one mode into mode G, it is characterised in that the machining control portion The process data is compensated according to the testing result of the position detection part so that by the processed portion of the processing light irradiation Working position on point is moved to the direction of the rotary shaft rotation around the normal direction parallel to the machined surface.

The manner can high-accuracy compensation surround parallel to the normal direction of machined surface on workpiece rotary shaft Working position on the direction of rotation deviates.

Mode I

Optical machining device based on mode A any one mode into mode H, it is characterised in that whenever by described defeated When sending the processed part on the workpiece of portion's intermittent delivery to stop on the machining area, the position detection The position of detection mark of portion's detection on the workpiece.

The manner can compensate Working position deviation with the precision more increased.

Mode J

Optical machining device based on mode A any one mode into mode I, it is characterised in that the illumination part tool Standby optical scanning portion, such as scanning galvanometer 21, for the direction of the machined surface parallel to the workpiece and perpendicular to The side of the conveying direction scans up the processing light of the light source transmitting, and further with move portion, such as carrier 25 is used for The processing light injection part of the mobile illumination part, such as f θ lens 22 so that the processing light injection part exists with the processing light The parallel side in scanning direction on the machined surface of the workpiece is moved up.

The processing light injection part of the manner launches the processing light of light scanner section scanning to the machined surface of workpiece, The manner utilizes move portion so that the processing optical scanning side that processing light injection part can be on the machined surface with workpiece Moved up to parallel side.So, the optical machining device of the manner can implement working process to larger workpiece, close In larger workpiece, such as more than machining area 36, i.e., more than the processing optical scanning processing pair using the scanning of optical scanning portion As the scanning range of the machined surface on thing.

Mode K

A kind of optical machining device, wherein having：Illumination part, such as laser output section 1 and laser scanning section 2, wherein Possess the light source of transmitting processing light, such as launch laser L laser oscillator 11, for being shone to machining area such as machining area 36 Penetrate the processing light；And, delivery section, such as processing object delivery section 3, for defined conveying direction, such as processing object to be defeated Direction B (Y-axis) etc. is sent, workpiece is intermittently conveyed, by being added for the workpiece such as grade of workpiece 35 Processed part on work face is sequentially sent to the machining area, it is characterised in that further with first position test section, such as Supervision camera 34,34-1 etc., the position detection part are arranged on one end on the width perpendicular with the conveying direction The side of end one, when stopping at for the processed part on the workpiece on the machining area, detection is located at should The position of the first detection mark such as telltale mark 37 on workpiece.

Mode L

Optical machining device based on mode K, it is characterised in that further with second place test section, such as supervision camera 33 etc., the second place test section is different from the first position test section, is arranged on other end end on the width The side of portion one.

Mode M

Optical machining device based on mode K or L, it is characterised in that further with the 3rd position detection part, such as monitoring phase Machine 34-2, the 3rd position detection part is different from the first position test section such as supervision camera 34-1, is arranged on described one On the position held the side of end one and be separated by a certain distance on the conveying direction with the first position test section.

Mode N

A kind of optical machining device, wherein having：Illumination part, such as laser output section 1 and laser scanning section 2, wherein Possess the light source of transmitting processing light, such as launch laser L laser oscillator 11, for being shone to machining area such as machining area 36 Penetrate the processing light；And, delivery section, such as processing object delivery section 3, for defined conveying direction, such as processing object to be defeated Direction B (Y-axis) etc. is sent, workpiece is intermittently conveyed, by being added for the workpiece such as grade of workpiece 35 Processed part on work face is sequentially sent to the machining area, it is characterised in that further with position detection part, such as monitors Camera 33,34,34-1,34-2 etc., the position detection part, which is arranged on, to be able to detect that on the position of detection mark, is used for The workpiece as described in being stopped at the processed part on workpiece 35 on machining area when, detection is located at The position that mark such as telltale mark 37 is used with detection on the workpiece.

Mode O

Optical machining device based on mode N, it is characterised in that the first position test section includes first position test section With second place test section, the first position test section such as supervision camera 34 etc., be arranged on be able to detect that be located at What the first detection on the workpiece of the side of one end end one on the perpendicular width of the conveying direction was marked On the position of position, the second place test section such as supervision camera 33 etc. is different from the first position test section, is set The mark of the second detection on the width on the workpiece of the side of other end end one is being able to detect that, should Second detection marks different with mark from the described first detection.

Mode P

Optical machining device based on mode N or O, it is characterised in that the position detection part further has the 3rd position Test section, such as supervision camera 34-2, the 3rd position detection part and the first position test section and second place test section Difference, is arranged on and is able to detect that by the first position test section the as described in after the detection such as supervision camera 34-2 On the position of one detection mark.

Claims

1. a kind of optical machining device, wherein having：

Illumination part, wherein possessing the light source of transmitting processing light, for irradiating the processing light to machining area；And,

Delivery section, for defined conveying direction, intermittently conveying workpiece, by being processed for the workpiece Processed part on face is sequentially sent to the machining area,

Characterized in that, further having first position test section, the first position test section is arranged on and the conveying side To the side of one end end one on perpendicular width, institute is stopped at for the processed part on the workpiece When stating on machining area, the position of first detection mark of the detection on the workpiece.

2. optical machining device according to claim 1, it is characterised in that further with second place test section, this Two position detection parts are different from the first position test section, are arranged on the side of other end end one on the width.

3. optical machining device according to claim 1 or 2, it is characterised in that further with the 3rd position detection part, should 3rd position detection part is different from the first position test section, is arranged on the side of one end end one and in the conveying side On the position being separated by a certain distance upwards with the first position test section.

4. a kind of optical machining device, wherein having：

Characterized in that, further having position detection part, the position detection part, which is arranged on, is able to detect that detection is marked Position on, when stopping at for the processed part on the workpiece on the machining area, detection located at should The position marked with detection on workpiece.

5. optical machining device according to claim 4, it is characterised in that

The position detection part includes first position test section and second place test section,

The first position test section, which is arranged on, to be able to detect that and is located at the width perpendicular with the conveying direction On the side of one end end one workpiece on the first detection mark position position on,

The second place test section is different from the first position test section, is arranged on and is able to detect that located at the width The second detection mark on direction on the workpiece of the side of other end end one, second detection mark and described first Detection is different with mark.

6. optical machining device according to claim 5, it is characterised in that the position detection part further has the 3rd Test section is put, the 3rd position detection part is different from the first position test section and second place test section, is arranged on energy On the position for enough detecting first detection mark after being detected by the first position test section.