CN106457470B - Laser processing and laser processing device - Google Patents
Laser processing and laser processing device Download PDFInfo
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- CN106457470B CN106457470B CN201580034997.5A CN201580034997A CN106457470B CN 106457470 B CN106457470 B CN 106457470B CN 201580034997 A CN201580034997 A CN 201580034997A CN 106457470 B CN106457470 B CN 106457470B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of laser processing and processing unit (plant) that can Gao Jingdu while fixed speed continuous moving on one side making machined object and continuous laser is processed incessantly.It comprises the following steps：Machined object (W) is set to be moved in the X direction with fixed speed on one side, the aiming point of laser is set to be scanned in x-direction and y-direction in the way of describing fixation locus in electric scanning region by galvano scanner on one side, laser is irradiated in specified position in scan line to machined object, and is processed in the condition and range shown by following formula：Px/V≥Σ(Lt+Gt)…(1)；Gx=Px × α ... (2).Px：The X-direction benchmark of machined object processes spacing, V：The X-direction movement speed of machined object, Lt：Laser irradiation time, Gt：Electric scanning actuation time (traveling time of aiming point and stabilization time), Gx：The distance on the side of the X-direction in electric scanning region, α：Constant (0<α<1).
Description
Technical field
The present invention relates to use laser to implement hole machined to machined object, groove processing, cross, cut out, cut off, mark
The method and device of processing.As tablets such as machined objects, including ceramic green sheet, chip, organic film, printed base plate, metallic plate
Shape material, sheet material.
Background technology
In patent document 1, the laser that will be projected from laser light source is disclosed with galvano scanner (galvano scanner)
It carries out reflection and carries out light harvesting by light collecting lens to be radiated at the laser processing device on machined object.In utilization laser to carrying
In the case that the large-scale sheet material being placed on XY worktable carries out hole machined, since the primary region that can be processed is limited, it should add
Tooling sets cut zone to implement hole machined.By dividing to carry out hole machined, cause according to by galvano scanner
Pincushion distortion, the distortion performance caused by light collecting lens and hole the relationships such as positional precision, using allowable range as primary plus
Work area domain is set.
But it due to being processed in each region, has the following problems：It needs to repeat temporary in workbench
To the defined area illumination laser then such step of mobile work platform in the state of stopping, the loss of time is more, when processing
Between it is elongated.
On the other hand, in patent document 2, it is proposed that following laser processing：To being formed on machined object
Multiple processing holes when being laser machined successively, make the irradiation position of laser at electric scanning region (galvano area) on one side
Interior movement makes XY worktable ceaselessly be moved at least one of X-direction or Y-direction direction with defined speed on one side
It is dynamic.This method is different from patent document 1, due to that workbench need not be made to stop in each machining area, it is thus possible to which meeting can
Shorten process time.
However, in patent document 2, needing to carry out coordination control to XY worktable and galvano scanner so that become laser
The processing hole of processing object and as it is next laser processing object processing hole both sides be all located in electric scanning region.I.e., by
Be all located in electric scanning region with next processing hole in needing to be set to current processing hole, thus to configure with scanning
In the case that multiple holes on the vertical direction in direction carry out multiple row processing, the processing ending point of each row is needed that waiting is arranged
Time so that the processing starting point of next column is located in electric scanning region, or needs to expand electric scanning machining area
(galvano operation area).As a result, generate useless stand-by period, or distort larger lens end into
Row processing, it is thus possible to ability, positional precision and processing quality can be made to decline.
Existing technical literature
Patent document
Patent document 1：Japanese Patent Laid-Open 8-174256 Patent Document 2：Japanese Patent Laid-Open 2011-
No. 140057 bulletins
Invention content
The technical problems to be solved by the invention
The purpose of the present invention is to propose to one kind can while machined object is with fixed speed continuous moving high-precision and
The laser processing and processing unit (plant) of continuous laser processing incessantly.
Solve the technical solution of technical problem
The present invention is a kind of laser processing, is used to control：Along the X/Y plane of the main surface parallel with machined object
Enable the transmission unit and make the laser reflection projected from laser light source and photograph that the machined object moves in the X direction
Penetrate the galvano scanner on machined object.Including following step：Transmission unit is set to be carried out in the X direction with fixed speed on one side
It is mobile, on one side by galvano scanner make the aiming point of laser in electric scanning region in the way of describing fixation locus in X-direction
And scanned in Y-direction, and laser is irradiated in the specified position in scan line to machined object, to shown by following formula
Condition and range in be processed.
Px/V≥Σ(Lt+Gt)···(1)
Gx=Px × α (2)
Px：The X-direction benchmark of machined object processes spacing
V：The X-direction movement speed (fixation) of machined object
Lt：Laser irradiation time
Gt：Electric scanning actuation time (traveling time of aiming point and stabilization time)
Gx：The distance on the side of the X-direction in electric scanning region
α：Constant (0<α<1)
(1) when the left side of formula indicates that machined object is mobile used in the benchmark of the X-direction of machined object processing spacing
Between, the right indicates laser irradiation time (actuation time of laser oscillator) and (aiming of galvano scanner of electric scanning actuation time
The traveling time of point and stabilization time) it is total.That is, indicating the laser processing since the laser processing of first row to secondary series
Time until beginning.(1) in formula, machined object mobile time ratio used in the X-direction processing spacing of machined object swashs
The sum of light irradiation time and electric scanning actuation time are longer, therefore illustrate can incessantly continuous laser processing condition.
(2) formula refers to due to α ＜ 1, and the distance on the side of the X-direction in electric scanning region is processed than the benchmark of the X-direction of machined object
Spacing smaller.That is, showing the fixed condition in electric scanning region.Assuming that α ＞ 1, then movement of the electric scanning aiming point in machined object
It shifts on direction (X-direction), electric scanning region will be exceeded.If exceeding, once carrying out alignment action later, just will produce
The loss of time.By being set as α ＜ 1, so as to be laser machined incessantly in same electric scanning region.
It can also indicate as follows to replace (1) formula.
Px/V=Ta+Tb (4)
Herein, Ta is the total of the process time of Y-direction, and Tb is the process time of the return of X-direction.
Generally, galvano scanner make lighter in weight reflective mirror move come scanning laser, thus while can carry out at a high speed and
High-precision scanning, but actuating range is smaller.On the other hand, although the moving range of machined object is larger, it can be difficult to high
Fast movement/moment stops.In view of above-mentioned characteristic, pass through synchronous control electric scanning under conditions of satisfaction (1) formula, (2) formula
The movement of instrument, laser oscillator and machined object is held so as to the machining area to continuous machined object in the X direction
Continuous ground is laser machined (incessantly), so as to improve processing efficiency.Need to only machined object be made continuously to be moved with fixed speed
It is dynamic, therefore control becomes simple, and the time of machined object stopping can be eliminated, and total elapsed time can be shortened.Electric scanning
Region can be set in the central portion for the smaller light collecting lens that distort, therefore can carry out high-precision processing.
In the present specification, the scanning carried out " in a manner of describing fixation locus " refer to so-called " unicursal at " sweep
It retouches.That is, according to the track for being back to initial coordinate points via other points from the coordinate points where aiming point.Track example
It such as can be the reciprocating movement of straight line, can also be triangle, 8 shape, as long as being back in electric scanning region original
Coordinate points are such to scan track, can be arbitrarily track.Electric scanning region refers to the areas XY that galvano scanner can be scanned
In domain and according to the pincushion distortion of galvano scanner, the permitted model of relationship of the distortion performance and Working position precision of light collecting lens
It encloses, wherein containing the track.The action that galvano scanner carries out interval usually carries out point-to-point control.In this control,
So that aiming point is rapidly moved until from current processing stand to next processing stand, during next processing stand stops from
Laser oscillator irradiates laser.Furthermore it is possible to make galvano scanner continuous action to replace the method for making galvano scanner intermitten.
As long as the transmission unit of the present invention can make machined object in the X direction along the X/Y plane of the main surface parallel with machined object
Mobile unit, such as XY worktable, only in an X direction upper mobile workbench, the belt conveyor moved in the X direction
Etc. arbitrary transmission unit.Moreover, in the case where machined object is continuous rolled sheet material, transfer roller conduct can also be used
Transmission unit.
The scan path of the aiming point of galvano scanner is preferably set as 8 shape.That is, making transmission unit in X pros on one side
It is moved upwards with fixed speed, repeats the below first~the 8th step on one side.That is, by laser irradiation on X/Y plane
First point of first step；The aiming point of laser is scanned from first point of entirety to X positive directions and Y positive directions by galvano scanner
Second step；In the third for the second point irradiation laser for having carried out displacement in X positive directions and Y positive directions relative to first point
Step；Make the four steps that the aiming point of laser is scanned from second point to X negative directions by galvano scanner；Relative to second point
The 5th step for thirdly irradiating laser of displacement has been carried out in X negative directions；By galvano scanner make the aiming point of laser from
Thirdly whole the 6th step scanned to X positive directions and Y negative directions；Relative to thirdly in X positive directions and Y negative directions
The 7th step of the 4th point of irradiation laser of displacement is carried out；Keep the aiming point of laser negative from the 4th point to X by galvano scanner
The 8th step that direction is scanned and the aiming point of laser is made to be back at first point.In addition, in the second step, it is " whole to X pros
To and the scanning of Y positive directions " refer to even if locally lie in be not " X positive directions and Y positive directions " part, if comprehensive second step
It says, and " to X positive directions and Y positive directions " scanning." entirety " in 6th step is also the identical meaning.If as described above
So that aiming point is scanned in 8 shape, then can be recycled at 1 in upper in the Y direction carry out 2 row processing.Due to need not be as it
The such useless scanning of alignment afterwards, therefore can efficiently process multiple holes, slot.
Preferably satisfaction with shown by following formula condition and range be used as the processing item according to the scan path of 8 shape
Part.
Px/V≥Gy/Py×(Lt+Gyt)+Gxt+Lt···(3)
Gx：The distance on the side of the X-direction in electric scanning region
Gy：The Y-direction distance in electric scanning region
Py：The benchmark of the Y-direction of machined object processes spacing
Lt：Laser irradiation time
Gyt：Y-direction electric scanning actuation time
Gxt：X-direction electric scanning actuation time
(3) left side of formula indicates the machined object time used in the benchmark processing spacing movement of the X-direction of machined object,
The first item on the right indicates the Y-direction distance of the sum of laser irradiation time and Y-direction electric scanning actuation time and electric scanning region
Between processing times product, i.e. laser scans the process time of a row in the Y direction.Section 2 is X-direction electric scanning action
Time, Section 3 are laser irradiation times.By meeting the condition formula, so as in the scan path according to 8 shape
In the case of, it is processed incessantly.
Although 8 above-mentioned shape paths are to carry out 4 laser irradiations from first step to total the 8th step
Example, but can be in the way of the scanning of second step i.e. from setting irradiation laser during being moved to second point at first point
9th step, can also be in the way of the scanning of the 6th step i.e. from setting irradiation laser during being thirdly moved to the 4th point
The tenth step.Laser irradiation number in 9th step and the tenth step is not limited to 1 arbitrary number of times.Thereby, it is possible to
Multiple holes are processed when being moved to Y-direction.
Invention effect
As described above, according to the present invention, it can make machined object in the X direction with fixed speed continuous moving on one side, on one side
Aiming point using galvano scanner scanning laser in x and y directions makes it depict fixation locus in electric scanning region,
Laser is irradiated in specified position to machined object.Moreover, machined object the processing spacing movement of the X-direction of machined object it is used when
Between it is longer than the sum of laser irradiation time and electric scanning actuation time, the distance on the side of the X-direction in electric scanning region is than being processed
The benchmark of the X-direction of object processes spacing smaller, therefore can make machined object not in the state of keeping electric scanning region to fix
It is carried out lasting laser processing with stopping.As a result, it is possible to realize the laser processing for taking into account precision and production.
Description of the drawings
Fig. 1 is an exemplary overall diagram of laser processing device according to the present invention.
Fig. 2 is the block diagram of control device.
Fig. 3 shows the one of the scanning sequency in the electric scanning region of the present invention, the hole site of machined object and aiming point
A example.
Fig. 4 is the figure for the 1st embodiment for showing laser processing.
Fig. 5 shows the position (b) of the scanning example (a) and the hole processed on machined object W of the aiming point of the 2nd embodiment.
Fig. 6 shows the position (b) of the scanning example (a) and the hole processed on machined object W of the aiming point of the 3rd embodiment.
Fig. 7 shows the position (b) of the scanning example (a) and the hole processed on machined object W of the aiming point of the 4th embodiment.
Fig. 8 shows the position (b) of the scanning example (a) and the hole processed on machined object W of the aiming point of the 5th embodiment.
Fig. 9 shows the position (b) of the scanning example (a) and the hole processed on machined object W of the aiming point of the 6th embodiment.
Figure 10 is the figure for the 7th embodiment for showing laser processing.
Specific implementation mode
Fig. 1 shows an exemplary overall diagram of laser processing device according to the present invention.The laser of the present embodiment adds
It is the device for processing via etc. on an example i.e. ceramic green sheet W of machined object that tooling, which sets 1,.Laser processing device 1
Including laser light source, that is, laser oscillator 10, the galvano scanner for making the aiming point (or optical axis) of laser L be scanned up in the side XY
20 and light collecting lens 30.Specifically, galvano scanner 20 includes the reflective mirror 21 for making aiming point scan in the X direction and causes
Dynamic device 22, the reflective mirror 23 for making aiming point scan in the Y direction and actuator 24.Also, it is arranged in the lower section of light collecting lens 30
Machined object W can be loaded on the workbench along the XY worktable 40 that X/Y plane moves.XY worktable 40 has in X-direction
The upper motor 41 for driving the workbench 40 and the motor 42 for driving workbench 40 in the Y direction.Control device 50 passes through cloth
Line is connect with laser oscillator 10, the actuator 22,24 of galvano scanner 20 and motor 41,42, can be in aftermentioned method
Synchronous control laser oscillator 10, galvano scanner 20 and XY worktable 40.
As used shown in dotted line in Fig. 1, the continuous moving in the X direction of workbench 40 can be made on one side, on one side to machined object W
The region S1 zonally extended in the X direction laser machined incessantly.After the processing for completing region S1, make work
Platform 40 moves 1 spacing along Y-direction, so that workbench 40 is moved in the X direction with fixed speed on one side again, on one side to adjacent
Region S2 is laser machined incessantly.Thus, it is possible to efficiently carry out hole machined to the whole region of machined object W.
Fig. 2 shows the block diagrams of control device 50.From galvano scanner 20 and motor 41,42 position is sent to control device 50
Information.Location information of the control device 50 based on input synchronizes laser oscillator 10, galvano scanner 20 and workbench 40
Control.Specifically, if the Y-direction movement of workbench 40 is completed, positioning is sent from motor 42 to control device 50 and is completed
Signal makes aiming point be moved to initial position by galvano scanner 20.Workbench 40 is set to be moved in the X direction with fixed speed on one side
It is dynamic, on one side by galvano scanner 20 in electric scanning region with defined sequential scan aiming point, and in specified position from laser
Oscillator 10 irradiates laser to process hole on machined object W.
Fig. 3 shows that one of the scanning sequency of electric scanning region GA, the hole site of machined object W and aiming point shows
Example.Herein, aiming point is scanned to unicursal in a manner of describing 8 words in the GA of electric scanning region, and in scan line
A, b, c, d, e (identical as b), f, g (identical as a) each point irradiate laser.Although machined object W is in the X direction with fixation
Speed V movements, but electric scanning region GA is maintained at fixed position.It is followed by regarding point a → b → c → d → e → f → g as 1
Ring is repeated, so as to carry out continual trepanning processing.On machined object W, multiple (these for forming a line in the Y direction
Place be 3) hole H separate in the X direction as defined in spacing formed.Herein, if the processing spacing of the X-direction in hole is set as Px, is incited somebody to action
The X-direction movement speed of machined object W is set as V, laser irradiation time (single fraction irradiation) is set as to Lt, by electric scanning actuation time
It is set as Gt and the distance on the side of the X-direction in electric scanning region is set as Gx, then following relationship can be obtained：
Px/V≥Σ(Lt+Gt)···(1)
Gx=Px × α (0 ＜ α ＜ 1) (2).
In addition, also including for the laser irradiation required rise time and when declining in laser irradiation time Lt
Between.
(1) left side of formula indicate machined object W the processing spacing movement of the benchmark of the X-direction of machined object it is used when
Between, the right indicates that the actuation time Gt's of irradiation time Lt and galvano scanner between point a~point d is total, i.e. swashing from first row
Light processing starts the time until the laser processing of secondary series starts.(2) formula is indicated due to α ＜ 1, Gx ＜ Px.That is, electric
The distance Gx on the side of the X-direction of scanner processes spacing Px smallers than the X-direction in hole.
Then, one example of the laser processing of the present invention is illustrated with reference to Fig. 4.(A) of Fig. 4 is indicated at first point
A positions the aiming point of laser and irradiates the moment of laser (shooting) on point a.Stain indicates the current irradiation position of laser
(in the newest hole of current time processing), white point indicates machined hole.
(B) of Fig. 4 indicate by the aiming point of laser from point a relative to X positive directions and Y positive directions to acute angle direction scan from
And irradiate the moment of laser in second point b.If the angle that the moving direction of aiming point and X positive directions are constituted is set as θ (＜
90 °), then the moving direction of aiming point and the angle that Y positive directions are constituted are 90 ° of-θ.Machined object W is also suitable to X-direction movement
In aiming point sweep time (electric scanning actuation time) and the laser irradiation time from point a to point b and time, therefore hole a1
It is arranged in the same position of X-direction with second point b.
(C) of Fig. 4 indicate by the aiming point of laser from point b relative to X positive directions and Y positive directions to acute angle direction scan from
And irradiate the moment of laser in thirdly c.Same as described above, machined object W is also equivalent to X-direction movement from point b to point c's
Aiming point sweep time (electric scanning actuation time) and laser irradiation time and time, therefore hole a1, b1 and third spot hole
C1 is arranged in the same position of X-direction.In other words, hole a1, b1, c1 forms a line in the Y direction.In addition, then to process
Hole d (being indicated with the dot of dotted line) in the outside of electric scanning region GA.
(D) of Fig. 4 indicates to scan the aiming point of laser from point c to X negative directions to irradiate the wink of laser in the 4th point d
Between.Machined object W is equivalent to aiming point sweep time (electric scanning actuation time) and laser from point c to point d to X-direction movement
The time of the sum of irradiation time, therefore the X-direction spacing Px of hole c1 and the 4th point of hole d1 are than the side of the X-direction in electric scanning region
Distance Gx biggers.
(E) of Fig. 4 indicates from point d to scan the aiming point of laser simultaneously to acute angle direction relative to X positive directions and Y negative directions
The moment of laser is irradiated in the 5th point e.Machined object W is equivalent to the aiming point sweep time from point d to point e to X-direction movement
(electric scanning actuation time) and laser irradiation time and time, therefore hole d1 is arranged in the identical of X-direction with the 5th point e1
On position.
(F) of Fig. 4 indicates from point e to scan the aiming point of laser simultaneously to acute angle direction relative to X positive directions and Y negative directions
The moment of laser is irradiated in the 6th point f.Machined object W is equivalent to the aiming point sweep time from point e to point f to X-direction movement
(electric scanning actuation time) and laser irradiation time and time, therefore hole d1, e1 and the 6th point of hole f1 are arranged in X-direction
Same position on.In this state, the hole g then to be processed (being indicated with the dot of dotted line) is in the outer of electric scanning region GA
Side.
(G) of Fig. 4 is indicated to scan the aiming point of laser from point f to X negative directions and the aiming point of laser is back to the
The moment of one point g (identical as a).Machined object W is equivalent to the aiming point sweep time (electricity from point f to point g to X-direction movement
The scanning motion time) with laser irradiation time and time, therefore by the way that aiming point is back to position identical with the first point a
G is set, thus side distance Gx biggers of the spacing Px of hole f1 and hole g1 than the X-direction in electric scanning region.Later, same as described above
Ground repeats the step of (A)~(G).
Method as transmission machined object W can be by using multiple transfer rollers in the side X other than workbench 40
It is passed up machined object W.Machined object be continuous rolled sheet material in the case of, by make as described above aiming point with
The mode for describing 8 words carries out the scanning of unicursal, so as to be processed incessantly on the long side direction of sheet material, without
Sheet material can be made to stop.Also, 2 row holes are processed in the scanning due to that can be recycled at 1, production is higher.By
The scanning as it need not be aligned later, therefore the useless time can be reduced.Machined object W need to only be moved with fixed speed
And galvano scanner 20 is scanned with the defined period, therefore is controlled simple.Electric scanning region GA can be set in abnormal
The central portion of the smaller light collecting lens 30 of influence of change, therefore high-precision processing can be carried out.
Although showing the example for processing 3 holes in the Y direction for 1 machined object W, energy in Fig. 3, Fig. 4
The number of enough arbitrarily setting hole.In addition, though it is shown that separating determining deviation processing hole in the Y-direction of machined object W
Example, but can also carry out the unfixed hole machined of spacing of Y-direction.Additionally it is possible to use covering with multiple pin holes
Film, spectroscope etc., multiple Kong Weiyi groups are carried out while being processed.In this case, one group of hole is considered as set figure, gathers figure
It is each be partitioned on the basis of process spacing.
- the 2 embodiment-
(a) of Fig. 5 shows that the scanning example of the second embodiment of aiming point, (b) of Fig. 5 show to process on machined object W
Hole position.It in Fig. 5, is integrally scanned in a manner of describing 8 words as being represented by dashed line in (a), with from a left side
On to the scan line of bottom right and from lower-left to the scan line of upper right, 6 holes are processed respectively.Therefore, identical as Fig. 3, hole
It is arranged in a row in the Y direction, and Y-direction spacing is fixed.Rectangular mark indicates the shooting (or hole site) of first row, water chestnut
Shape mark indicates the shooting (or hole site) of secondary series.From there through shooting number is increased in scan line, can increase every
The number in the hole of one row.
- the 3 embodiment-
(a) of Fig. 6 shows that the scanning example of the 3rd embodiment of aiming point, (b) of Fig. 6 show to process on machined object W
Hole position.In Fig. 6, although being integrally scanned in a manner of describing 8 words as being represented by dashed line in (a),
It is that scan line is linear for polyline shaped rather than oblique single straight as shown in Figure 5.From upper left to the scan line of bottom right with from lower-left to
The scan line of upper right is in symmetric shape.Therefore, hole is arranged in a row in the Y direction, but Y-direction spacing and is not fixed.In the side Y
The number in the processing hole arranged upwards is each row 7.Rectangular mark indicates the shooting (or hole site) of first row, diamond shape mark
Will indicates the shooting (or hole site) of secondary series.
- the 4 embodiment-
(a) of Fig. 7 shows that the scanning example of the fourth embodiment of aiming point, (b) of Fig. 7 show to process on machined object W
Hole position.In Fig. 7, integrally it is scanned in a manner of describing 8 words as being represented by dashed line in (a), scan line
Polyline shaped is further bent into compared with Fig. 6, and the scan line from upper left to bottom right is in from lower-left to the scan line of upper right
Left and right is asymmetric.Although the electric scanning region GA of first~3rd embodiment is rectangle, the electric scanning area of the embodiment
Domain GA is parallelogram.Therefore, hole is not arranged in a row in the Y direction, in meandering shape or staggered arrangement.In the Y direction
The number in the processing hole of upper arrangement is each row 6.Rectangular mark indicates the shooting (or hole site) of first row, diamond sign
Indicate the shooting (or hole site) of secondary series.
- the 5 embodiment-
(a) of Fig. 8 shows that the scanning example of the 5th embodiment of aiming point, (b) of Fig. 8 show to process on machined object W
Hole position.In Fig. 8, integrally it is scanned in a manner of describing 8 words as being represented by dashed line in (a), but from
Upper left is asymmetric in left and right to the scan line of bottom right and the scan line from lower-left to upper right.Although the embodiment of scan line and Fig. 7
It is similar, but the bending angle bigger of broken line in contrast.Therefore, although the Y-direction spacing in hole is fixed, in the Y direction
It is not to be arranged in a row.Specifically, in meandering shape or staggered arrangement.The number in the processing hole arranged in the Y direction
It is each row 6.It is rectangular mark indicate first row shooting (or hole site), diamond sign indicate secondary series shooting (or
Person hole site).Series 1 is moved according to point a~b~c~d~e~f, carries out laser on the point of rectangular mark therebetween
Irradiation.After having carried out return action in X negative directions according to point f~g, series 2 is moved according to g~h~i~j~k~l
It is dynamic, therebetween laser irradiation is carried out on the point of diamond sign.It is different from other embodiment, in this embodiment, between point ab, cd
Between, scanning between ef, between hi, between jk be X negative directions.
- the 6 embodiment-
(a) of Fig. 9 shows that the scanning example of the sixth embodiment of aiming point, (b) of Fig. 9 show to process on machined object W
Hole position.It is scanned, is carried out near each point more in a manner of describing 8 words although the case where Fig. 9 is also entirety
Secondary shooting.It is multiple in the Y direction close to the aperture of arrangement therefore, it is possible to be formed at one.
- the 7 embodiment-
Figure 10 shows the variation of the scanning sequency of electric scanning region GA, the hole site of machined object W and aiming point.
Herein, it in the GA of electric scanning region, is scanned in a manner of so that aiming point is in an inclined direction moved back and forth, in scan line
A, b, c, d, e each point on irradiation laser after, return again to a points.It is back in the way of point a without irradiation from point e.It is logical
It crosses and is repeated point a → b → c → d → e → a as 1 cycle, so as to process the hole for being arranged in a row in the Y direction,
And continual trepanning processing can be carried out.On machined object W, multiple (being herein 5) hole H for forming a line in the Y direction
Spacing Px is formed as defined in separating in the X direction.In this case, between the distance Gx ratios on the side of the X-direction of electric scanning region GA
Away from Px smallers, if therefore so that aiming point is returned according to point e → point a during time (Px-Gx)/V, between capable of continuing not
It processes disconnectedly.
In Fig. 10, though it is shown that the scan path of point a → b → c → d → e is a linear example, but also may be used
To be set as polyline shaped as Fig. 6, Fig. 7, Fig. 8.The hole processed in this case can Y-direction spacing as shown in Figure 6 it is uneven, or
Person is as shown in Figure 7 in meandering shape.In addition, can be set as linear so that returning in the shortest time from point e to the return action of point a
It returns.
Several examples that the above embodiments illustrate only the present invention can be arbitrary according to the position in the hole to be processed
Ground selects the motion track of aiming point.That is, being not limited to 8 shape, Z-shaped, tilting reciprocal shape.In addition, in the above-described embodiment,
Example for carrying out hole machined on sheet material is illustrated, but can also carry out groove processing, cross, cut out, cutting off, marking
Other processing such as note.As machined object, other than ceramic green sheet, can be ceramic wafers, semiconductor wafer, resin film,
Printed base plate, metallic plate etc. can use the arbitrary machined object of laser processing.
Label declaration
W machined objects
1 laser processing device
10 laser oscillators
20 galvano scanners
30 light collecting lens
40 XY worktables (transmission unit)
50 control devices
Claims (4)
1. a kind of laser processing, is used to control transmission unit and galvano scanner, the transmission unit can make to be processed
Object moves in the X direction along the X/Y plane of the main surface parallel with the machined object, and the galvano scanner makes from laser light source
The laser reflection of injection is simultaneously radiated on machined object, which is characterized in that
So that the transmission unit is moved in the X direction with fixed speed on one side, makes taking aim at for laser using the galvano scanner on one side
It is scanned in x-direction and y-direction in a manner of describing 8-shaped track in electric scanning region on schedule, and the rule in scan line
Positioning is set irradiates laser to machined object, including following first step is to the 8th step：
By first point of first step of the laser irradiation on X/Y plane；
The aiming point of the laser is scanned from described first point entirety to X positive directions and Y positive directions by the galvano scanner
Second step；
The of the laser is irradiated in the second point for having carried out in X positive directions and Y positive directions displacement relative to described first point
Three steps；
Make the four steps that the aiming point of the laser is scanned from the second point to X negative directions by the galvano scanner；
In the 5th step for thirdly irradiating the laser for having carried out displacement in X negative directions relative to the second point；
The aiming point of the laser is set to be scanned from the thirdly entirety to X positive directions and Y negative directions by the galvano scanner
The 6th step；
The of the laser is being irradiated relative to thirdly carried out displacement in X positive directions and Y negative directions the 4th point
Seven steps；And
So that the aiming point of the laser is scanned from described 4th point to X negative directions by the galvano scanner and makes the laser
Aiming point is back to described first point of the 8th step,
It is processed in condition and range shown by following formula：
Px/V≥Σ(Lt+Gt)···(1)
Gx=Px × α (2)
Px：The benchmark of the X-direction of machined object processes spacing
V：The X-direction movement speed of machined object
Lt：Laser irradiation time
Gt：Electric scanning actuation time (traveling time of aiming point and stabilization time)
Gx：The distance on the side of the X-direction in electric scanning region
α：Constant (0<α<1).
2. laser processing as described in claim 1, which is characterized in that
It is processed in condition and range shown by following formula：
Px/V≥Gy/Py×(Lt+Gyt)+Gxt+Lt···(3)
Gy：The Y-direction distance in electric scanning region
Py：The benchmark of the Y-direction of machined object processes spacing
Lt：Laser irradiation time
Gyt：Y-direction electric scanning actuation time
Gxt：X-direction electric scanning actuation time.
3. laser processing as claimed in claim 1 or 2, which is characterized in that
With the 9th step, the second step scanning on the way, during from second point is moved at described first point
The laser is irradiated,
Also have the tenth step, the 6th step scanning on the way, be thirdly moved at described 4th point from described
During irradiate the laser.
4. a kind of laser processing device, which is characterized in that including：
Transmission unit, the transmission unit make machined object in the X/Y plane of the main surface parallel with the machined object along the side X
It is moved to fixed speed；
Galvano scanner, the galvano scanner make the laser reflection projected from laser light source and are radiated on the machined object, and
The galvano scanner make the aiming point of laser in electric scanning region in a manner of describing 8-shaped track in X-direction and the side Y
It is scanned upwards；
Laser oscillator, which generates at the time of the aiming point of laser reaches the specified position in scan line swashs
Light；And
Control unit, the control unit synchronize control to the transmission unit, galvano scanner, laser oscillator, to meet
Condition shown by mathematical expression below and range：
Px/V≥Σ(Lt+Gt)···(1)
Gx=Px × α (2)
Px：The benchmark of the X-direction of machined object processes spacing
V：The X-direction movement speed of machined object
Lt：Laser irradiation time
Gt：Electric scanning actuation time (traveling time of aiming point and stabilization time)
Gx：The distance on the side of the X-direction in electric scanning region
α：Constant (0<α<1),
The control that described control unit is carried out includes the following steps：
By first point of first step of the laser irradiation on X/Y plane；
The aiming point of the laser is scanned from described first point entirety to X positive directions and Y positive directions by the galvano scanner
Second step；
The of the laser is irradiated in the second point for having carried out in X positive directions and Y positive directions displacement relative to described first point
Three steps；
Make the four steps that the aiming point of the laser is scanned from the second point to X negative directions by the galvano scanner；
In the 5th step for thirdly irradiating the laser for having carried out displacement in X negative directions relative to the second point；
The aiming point of the laser is set to be scanned from the thirdly entirety to X positive directions and Y negative directions by the galvano scanner
The 6th step；
The of the laser is being irradiated relative to thirdly carried out displacement in X positive directions and Y negative directions the 4th point
Seven steps；And
So that the aiming point of the laser is scanned from described 4th point to X negative directions by the galvano scanner and makes the laser
Aiming point is back to described first point of the 8th step.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014131973 | 2014-06-27 | ||
| JP2014-131973 | 2014-06-27 | ||
| PCT/JP2015/067941 WO2015199046A1 (en) | 2014-06-27 | 2015-06-23 | Laser machining method and laser machining device |
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| CN106457470A CN106457470A (en) | 2017-02-22 |
| CN106457470B true CN106457470B (en) | 2018-08-21 |
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| JP (1) | JP6365666B2 (en) |
| KR (2) | KR101989410B1 (en) |
| CN (1) | CN106457470B (en) |
| WO (1) | WO2015199046A1 (en) |
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| JP6665747B2 (en) * | 2016-09-28 | 2020-03-13 | ブラザー工業株式会社 | Laser marker device |
| EP3646983B1 (en) * | 2017-06-29 | 2021-10-20 | Panasonic Intellectual Property Management Co., Ltd. | Laser machining system and methods of controlling laser machining system |
| JP2019206025A (en) * | 2018-05-29 | 2019-12-05 | 武井電機工業株式会社 | Laser processing method and laser processing apparatus |
| JP7338501B2 (en) * | 2020-02-20 | 2023-09-05 | オムロン株式会社 | LASER PROCESSING APPARATUS AND CONTROL METHOD OF LASER PROCESSING APPARATUS |
| CN112937077A (en) * | 2021-04-16 | 2021-06-11 | 赵成刚 | High-precision silk-screen printing laser plate-making machine |
| KR102543759B1 (en) | 2021-04-27 | 2023-06-14 | 주식회사 대곤코퍼레이션 | Laser Machining System And Its Method Using Fixed Map-Based Alignment Compensation Control |
| CN116551215B (en) * | 2023-07-06 | 2023-09-05 | 北京新科以仁科技发展有限公司 | Laser scanning control method, device, equipment and storage medium of laser |
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| JP3077539B2 (en) | 1994-12-22 | 2000-08-14 | 松下電器産業株式会社 | Laser processing method |
| US6926487B1 (en) * | 1998-04-28 | 2005-08-09 | Rexam Ab | Method and apparatus for manufacturing marked articles to be included in cans |
| US20030047695A1 (en) * | 2001-09-07 | 2003-03-13 | Preco Laser Systems, Llc | System and method for synchronizing a laser beam to a moving web |
| JP2003227062A (en) | 2002-01-31 | 2003-08-15 | Toppan Printing Co Ltd | Processed article of nonwoven fabric |
| JP4040896B2 (en) * | 2002-03-28 | 2008-01-30 | 住友重機械工業株式会社 | Laser processing method and laser processing apparatus |
| JP5628524B2 (en) | 2010-01-08 | 2014-11-19 | 三菱電機株式会社 | Processing control device, laser processing device, and processing control method |
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| WO2015199046A1 (en) | 2015-12-30 |
| CN106457470A (en) | 2017-02-22 |
| JP6365666B2 (en) | 2018-08-01 |
| KR20170002635A (en) | 2017-01-06 |
| JPWO2015199046A1 (en) | 2017-04-20 |
| KR20190016141A (en) | 2019-02-15 |
| KR101989410B1 (en) | 2019-06-14 |
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