CN107664924A - A kind of exposure device and method - Google Patents
A kind of exposure device and method Download PDFInfo
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- CN107664924A CN107664924A CN201610617029.3A CN201610617029A CN107664924A CN 107664924 A CN107664924 A CN 107664924A CN 201610617029 A CN201610617029 A CN 201610617029A CN 107664924 A CN107664924 A CN 107664924A
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- exposure
- flexible substrates
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- thick
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a kind of exposure device and method, the device includes flexible substrates and the volume to volume Transmission system for transmitting and fixing the flexible substrates, in addition to the face exposure system axially symmetric on the flexible substrates and back-exposure system, respectively measuring system corresponding with the front and back of the flexible substrates and the master control system being connected respectively with the volume to volume Transmission system, face exposure system, back-exposure system, measuring system.By setting face exposure system and back-exposure system to be exposed respectively to the front and back in flexible substrates respectively, exposure efficiency is not only carried, two different exposure systems are set to realize thick exposure and amendment exposure to exposure figure different in flexible substrates respectively in face exposure system and back-exposure system simultaneously, different deformation quantities is suitable for, greatly improves exposure accuracy.
Description
Technical field
The present invention relates to technical field of lithography, and in particular to a kind of exposure device and method.
Background technology
In volume to volume (English：Roll to roll) in technique, processing substrate is flexible substrates, in the flexible substrates generally
There are multilayer exposing patterns, in flexible substrates flattening process, flattening operation every time all can cause flexible substrates to have different changes
Shape amount, thus traditional proximity printing can not meet the exposure accuracy.
As shown in figure 1, be conventional proximity printing system construction drawing, including light source 1 ', microscope group 2 ' is illuminated, mask 3 ',
Flexible substrates 4 '.The light beam that light source 1 ' is sent is irradiated on mask 3 ' by illumination microscope group 2 ', and the pattern on mask 3 ' is transferred
Onto flexible substrates 4 '.Wherein mask 3 ' is close to flexible substrates 4 ', and general distance is tens microns to hundreds of microns.With
The size of flexible substrates 4 ' is increasing in practical application, and the size of mask 3 ' also tends to maximize, however as mask 3 '
Become large-sized, mask 3 ' produces bending and deformation also increases therewith, so as to greatly reduce exposure accuracy.
The content of the invention
The invention provides a kind of exposure device and method, to solve in the prior art due to each region deformation of flexible substrates
Measure it is inconsistent and the problem of cause exposure accuracy difference.
In order to solve the above-mentioned technical problem, the technical scheme is that：A kind of exposure device, including flexible substrates and use
In transmission and the volume to volume Transmission system of the fixed flexible substrates, in addition to the front axially symmetric on the flexible substrates
Exposure system and back-exposure system, respectively measuring system corresponding with the front and back of the flexible substrates and difference
The master control system being connected with the volume to volume Transmission system, face exposure system, back-exposure system, measuring system.
Further, the volume to volume Transmission system includes the let off roll and wind-up roll being symmetrical set, the flexibility
One end of substrate is on the let off roll, and the other end is on the wind-up roll.
Further, the face exposure system includes the first exposure system and the second exposure system, the back-exposure
System includes the 3rd exposure system and the 4th exposure system, wherein, first exposure system and the 3rd exposure system are with respect to institute
It is axially symmetric to state flexible substrates, both are individually fixed in the first support component and the second support component, the second exposure system
System and the 4th exposure system are axially symmetric on the flexible substrates, and both are respectively arranged on the first moving parts and the second exercise group
On part, it is scanned in the horizontal direction in the case where first moving parts and the second moving parts drive and step motion.
Further, first exposure system and the 3rd exposure system include set gradually along light path the first light source,
First Transmission Fibers, the first light fixture, shaping component, expand component, scanning galvanometer component and field lens, the first light source hair
The light beam gone out is incided on the first light fixture by the first Transmission Fibers, is then shaped to exposure institute light requirement by shaping component
Spot, incided afterwards after expanding component and expanding on scanning galvanometer component, finally focus on flexible substrates by the field lens
On.
Further, first light source is LD light sources or LED light source.
Further, the shaping component is microlens array.
Further, first exposure system and the 3rd exposure system include set gradually along light path the first light source,
Expand component, shaping component, scanning galvanometer component and field lens；First light source sends collimated light beam by expanding component adjustment
After beam diameter, required hot spot is shaped into shaping component.
Further, the shaping component is DOE or ROE components.
Further, first exposure system and the 3rd exposure system include setting gradually the first light source along light path, expanded
Tread assembly, shaping component, focusing lens, object lens and scanning galvanometer component, the first light source output collimated light beam is by expanding
Component adjustment beam diameter after, into shaping component after be shaped to required hot spot, it is each to whole visual field to be then passed through focusing lens
Visual field point position is focused, finally after object lens are imaged, by being reflexed to scanning galvanometer component on focal plane, to flexibility
Substrate is exposed.
Further, first light source is LASER Light Source.
Further, the scanning galvanometer component is two-dimensional scanning mirrors.
Further, the hot spot is rectangular light spot, and spot size is consistent with the line width of exposure figure.
Further, second exposure system and the 4th exposure system include set gradually along light path secondary light source,
Second Transmission Fibers, the second illuminator, even optical assembly, DMD components and projection microscope group, the secondary light source send light beam process
Second Transmission Fibers enter the second illuminator, carry out even light by even optical assembly afterwards, and after DMD components are modulated
The required hot spot of exposure is produced by projecting microscope group projection.
Further, the secondary light source is laser, LED light source or LD light sources.
Further, the vertical distance between first exposure system and the 3rd exposure system and the flexible substrates is big
Vertical distance between second exposure system and the 4th exposure system and the flexible substrates.
Further, the position of focal plane of first exposure system is corresponding with the positive exposure figure of the flexible substrates,
The position of focal plane of 3rd exposure system is corresponding with the exposure figure at the flexible substrates back side.
Further, first support component and the second support component and the first moving parts and the second moving parts
It is each attached on main frame.
Further, the measuring system includes at least one first measuring system corresponding with the flexible substrates front
Corresponding at least one second measuring system with the flexible substrates back side, first measuring system and the second measuring system
For measuring level corresponding to the corresponding face exposure figure of the flexible substrates to position and vertical position.
Further, first measuring system and the second measuring system are connected with a six-freedom motion mechanism respectively.
Further, the master control system is single-chip microcomputer, PLC or MCU.
The present invention also provides a kind of exposure method, comprises the following steps：
S1:Flexible substrates are flattened in volume to volume Transmission system；
S2：The position of the workpiece alignment mark of the thick exposure figure of the flexible substrates front second layer is measured by measuring system
Put, position and the exposure posture of the thick exposure figure of the second layer are obtained by master control system；
S3：According to the position of the thick exposure figure of the second layer and exposure posture, by the first exposure system to the second layer
Thick exposure figure is exposed；
S4：The position of the workpiece alignment mark of the flexible substrates front second layer essence exposure figure is measured by measuring system
Put, position and the exposure posture of second layer essence exposure figure are obtained by master control system；
S5：According to the position of the second layer essence exposure figure and exposure posture, by the second exposure system to the second layer
Smart exposure figure is exposed；
S6：Repeat the above steps S2-S5, by the 3rd exposure system and the 4th exposure system to the flexible substrates back side
The thick exposure figure of the second layer and second layer essence exposure figure be exposed.
Further, it is specially in the step S1：By one end of the flexible substrates on let off roll, the other end
On wind-up roll.
Further, each layer of exposure figure includes some separate exposure figures in the flexible substrates.
Further, the step S2 by six-freedom motion mechanism specifically, make measuring system move to flexible base
Above bottom, the positional information of the workpiece alignment mark of first thick exposure figure in the thick exposure figure of the second layer, the master are measured
The position for the positional information calculation exposure figure that control system obtains according to measurement and exposure posture.
Further, the step S3 is specifically, according to described first the slightly positional information of exposure figure and the exposure
Light posture, the posture of the first exposure system is adjusted by the first support component first, then the master control system root
First exposure system thick exposure figure described to first is opened according to the technological parameter of setting to be exposed, and in end exposure
After close the first light source.
Further, also include in the step S3, the workpiece pair of second thick exposure figure is measured by measuring system
The positional information of fiducial mark note, position and exposure of the master control system according to second thick exposure figure of the positional information calculation
Posture, according to the positional information and exposure posture of the described second thick exposure figure, pass through the first support component pair first
The posture of first exposure system is adjusted, and then the master control system opens first exposure according to the technological parameter of setting
System thick exposure figure described to second is exposed, and the first light source is closed after end exposure；Repeat the above steps straight
All exposed to the thick exposure figure of the second layer.
Further, the step S4 by six-freedom motion mechanism specifically, make measuring system move to flexible base
Above bottom, the positional information of the workpiece alignment mark of first smart exposure figure in second layer essence exposure figure, the master are measured
The position for the positional information calculation exposure figure that control system obtains according to measurement and exposure posture.
Further, the step S5 is specifically, according to the positional information of described first smart exposure figure and exposure
Light posture, the posture of the second exposure system is adjusted by the first moving parts first, then the master control system root
Second exposure system smart exposure figure described to first is opened according to the technological parameter of setting to be exposed, and in end exposure
After close secondary light source.
Further, also include in the step S5, the workpiece pair of second smart exposure figure is measured by measuring system
The positional information of fiducial mark note, position and exposure of the master control system according to second smart exposure figure of the positional information calculation
Posture, according to the positional information of the described second smart exposure figure and exposure posture, pass through the first moving parts pair first
The posture of second exposure system is adjusted, and then the master control system opens second exposure according to the technological parameter of setting
System smart exposure figure described to second is exposed, and secondary light source is closed after end exposure；Repeat the above steps straight
All exposed to second layer essence exposure figure.
Further, exposed corresponding to the thick exposure figure of the positive second layer of the flexible substrates and second layer essence exposure figure
Light region mutually has lap；The thick exposure figure of the second layer and second layer essence exposure figure pair at the flexible substrates back side
The exposure area answered mutually has lap.
Further, the positive second layer essence exposure figure of the flexible substrates is used for positive to the flexible substrates the
Two layers of thick exposure figure are exposed figure amendment, include the frame figure of the thick exposure figure of the positive second layer of the flexible substrates
The inside figure of case and/or the thick exposure figure of the positive second layer of the flexible substrates；The second layer at the flexible substrates back side
Smart exposure figure is used to be exposed figure amendment to the thick exposure figure of the second layer at the flexible substrates back side, including described soft
The frame pattern of the thick exposure figure of the second layer and/or the thick exposure figure of the second layer at the flexible substrates back side of property backside of substrate
Inside figure.
Further, also include before the step S2:Flexible substrates front first layer is measured by measuring system
The position of the workpiece alignment mark of exposure figure, position and the exposure appearance of first layer exposure figure are obtained by master control system
State；According to the position of the first layer exposure figure and exposure posture, first layer exposure figure is entered by the second exposure system
Row exposure.
Further, the position and exposure posture for obtaining first layer exposure figure are specially：Pass through six-freedom motion machine
Structure makes measuring system move to above flexible substrates, measures the workpiece alignment mark of first exposure figure in first layer exposure figure
The positional information of note, the position for the positional information calculation exposure figure that the master control system obtains according to measurement and exposure appearance
State.
Further, the exposure posture includes exposure figure the information on X, Y, Rz, Z, Rx, Ry six direction.
Further, first layer exposure figure is exposed specifically, according to first exposure figure
Positional information and exposure posture, first the first moving parts are adjusted to the posture of the second exposure system, the then master control
System processed opens second exposure system according to the technological parameter of setting and first exposure figure is exposed, and is exposing
Light closes secondary light source after terminating.
Further, the technological parameter includes exposure power, exposure spot diameter, exposure spot sweep speed.
Further, also include before the step S2:The workpiece pair of second exposure figure is measured by measuring system
The positional information of fiducial mark note, position and exposure appearance of the master control system according to second exposure figure of positional information calculation
State, according to the positional information of second exposure figure and exposure posture, first by the first moving parts to second
The posture of exposure system is adjusted, and then the master control system opens second exposure system according to the technological parameter of setting
Second exposure figure is exposed, and secondary light source is closed after end exposure；Repeat the above steps until first
Layer exposure figure all exposes.
Exposure device provided by the invention and method, the device include flexible substrates and for transmitting and fixing the flexibility
The volume to volume Transmission system of substrate, in addition to the face exposure system axially symmetric on the flexible substrates and back-exposure system
System, respectively measuring system corresponding with the front and back of the flexible substrates and respectively with the volume to volume Transmission system,
Face exposure system, back-exposure system, the master control system of measuring system connection.By setting face exposure system and the back side
Exposure system is exposed respectively to the front and back in flexible substrates respectively, not only increases exposure efficiency, while just
Two different exposure systems are set to realize to exposure different in flexible substrates in face exposure system and back-exposure system respectively
The thick exposure and amendment exposure of light figure, are suitable for different deformation quantities, greatly improve exposure accuracy.
Brief description of the drawings
Fig. 1 is existing proximity printing system construction drawing；
Fig. 2 is the structural representation of exposure device in the embodiment of the present invention 1；
Fig. 3 is the structural representation of the first exposure system in the embodiment of the present invention 1；
Fig. 4 is the structural representation of the second exposure system in the embodiment of the present invention 1；
Fig. 5 is the schematic diagram of flexible substrates first layer exposure figure in the embodiment of the present invention 1；
Fig. 6 is the schematic diagram of flexible substrates second layer exposure figure in the embodiment of the present invention 1；
Fig. 7 is the imaging schematic diagram that workpiece alignment marks in the embodiment of the present invention 1；
Fig. 8 is the measurement point distribution figure that exposure figure carries out vertical measurement in the embodiment of the present invention 1；
Fig. 9 is the flow chart of exposure method in the embodiment of the present invention 1；
Figure 10 is the structural representation of the first exposure system in the embodiment of the present invention 2；
Figure 11 is the structural representation of the first exposure system in the embodiment of the present invention 3.
Shown in Fig. 1：1 ', light source；2 ', microscope group is illuminated；3 ', mask；4 ', flexible substrates；
Shown in Fig. 2-11：1st, flexible substrates；11st, exposure figure；111st, workpiece alignment marks；112- mask registration marks
Note；21st, let off roll；22nd, wind-up roll；3rd, face exposure system；31st, the first exposure system；311st, the first light source；312nd, first pass
Lose fibre；313rd, the first light fixture；314th, shaping component；315th, component is expanded；316th, scanning galvanometer component；317th, field lens；
318th, focusing lens；319th, object lens；32nd, the second exposure system；321st, secondary light source；322nd, the second Transmission Fibers；323rd, second
Illuminator；324th, even optical assembly；325th, DMD components；326th, microscope group is projected；4th, back-exposure system；41st, the 3rd exposure system
System；42nd, the 4th exposure system；51st, the first measuring system；52nd, the second measuring system；6th, master control system；71st, the first support group
Part；72nd, the second support component；81st, the first moving parts；82nd, the second moving parts；9th, main frame.
Embodiment
The present invention is described in detail below in conjunction with the accompanying drawings.
As shown in Fig. 2 the invention provides a kind of exposure device, including flexible substrates 1 and for described in transmitting and fixing
The volume to volume Transmission system of flexible substrates 1, in addition to the face exposure system 3 axially symmetric on the flexible substrates 1 and the back of the body
Face exposure system 4, respectively measuring system corresponding with the front and back of the flexible substrates 1 and respectively with the volume pair
Roll up Transmission system, face exposure system 3, back-exposure system 4, the master control system 6 of measuring system connection.It is specifically, flexible
Include multilayer exposure figure in substrate 1, be provided with two layers in the present embodiment, every layer of exposure figure includes some separate exposures
Light figure 11, each exposure figure 11 are correspondingly provided with workpiece alignment mark 111, as illustrated in figures 4-5, in the present embodiment, every layer of exposure
Light figure includes 12 separate exposure figures 11, and the left-right and front-back position of each exposure figure 11 is equipped with workpiece alignment
Mark 111, each correspondence of exposure figure 11 in the different layers exposure figure at front or the back side in measuring system measurement flexible substrates 1
Workpiece alignment mark 111 positional information, master control system 6 obtains exposure figure according to the obtained positional information calculation of measurement
Information on 11 position and exposure posture, including corresponding X, Y, Rz, Z, Rx, Ry six direction of exposure figure 11, and according to exposure
The position of light figure 11 and exposure posture, by face exposure system 3 or back-exposure system 4 respectively to different layers exposure figure
It is exposed.It should be noted that in the present embodiment, the corresponding upper surface in front, the back side corresponds to lower surface, naturally it is also possible to is just
Face corresponds to lower surface, and the back side corresponds to upper surface, and the front and back is intended merely to more clearly illustrate technical scheme, does not play
Act the effect limited.
Preferably, the volume to volume Transmission system includes the let off roll 21 and wind-up roll 22 being symmetrical set, described soft
On the let off roll 21, the other end is in flexible substrates 1 on the wind-up roll 22 for one end of property substrate 1
Flat.
Fig. 2 is continued referring to, the face exposure system 3 includes the first exposure system 31 and the second exposure system 32, institute
Stating back-exposure system 4 includes the 3rd exposure system 41 and the 4th exposure system 42, wherein, first exposure system 31 and
The relatively described flexible substrates 1 of three exposure systems 41 are axially symmetric, and both are individually fixed in the first support component 71 and the second support
On component 72, the exposure system 42 of the second exposure system 32 and the 4th is axially symmetric on the flexible substrates 1, and both distinguish
On the first moving parts 81 and the second moving parts 82, driven in the moving parts 82 of the first moving parts 81 and second
Under be scanned in the horizontal direction and step motion, to adapt on the front of flexible substrates 1 or the back side in different layers exposure figure
The position of different exposure figures 11 and exposure posture, the first exposure system 31 and the 3rd exposure system 41 are respectively with respect to the first support
The support component 72 of component 71 and second is static, is met by adjusting the posture of the first support component 71 and the second support component 72
The position of different exposure figures 11 and exposure posture.Preferably, the exposure system 41 of the first exposure system 31 and the 3rd and institute
State the vertical distance between flexible substrates 1 and be more than the exposure system 42 of the second exposure system 32 and the 4th and the flexible substrates
Vertical distance between 1.The position of focal plane of first exposure system 31 is corresponding with the positive exposure figure 11 of the flexible substrates 1,
The position of focal plane of 3rd exposure system 32 is corresponding with the exposure figure 11 at the back side of flexible substrates 1.Specifically, first exposes
The position of focal plane of the exposure system 41 of photosystem 31 and the 3rd respectively with the thick exposure figure of the second layer on the front and back of flexible substrates 1
It is corresponding, it is exposed respectively, the second exposure system 32 and the 4th exposure system 42 be respectively used to the front of flexible substrates 1 and
First layer exposure figure and second layer essence exposure figure are exposed on the back side.
As shown in figure 3, the exposure system 41 of the first exposure system 31 and the 3rd includes first set gradually along light path
Light source 311, the first Transmission Fibers 312, the first light fixture 313, shaping component 314, expand component 315, scanning galvanometer component
316 and field lens 317, the light beam that first light source 311 is sent incide the first light fixture by the first Transmission Fibers 312
On 313, hot spot needed for exposing then is shaped to by shaping component 314, incides sweep after expanding component 315 and expanding afterwards
Retouch on galvanometer component 316, finally focused on by the field lens 317 in flexible substrates 1.First light source 311 is LD light sources
Or LED light source；The shaping component 314 is DOE (Diffractive Optical Element, diffraction optical element) or ROE
Component；The scanning galvanometer component 316 is two-dimensional scanning mirrors, and the hot spot is rectangular light spot, and spot size and exposure diagram
The line width of shape 11 is consistent.It should be noted that a width of 2-5mm of the exposed lines or so, exposure accuracy is generally tens um magnitudes, exposes
Whole region of the light visual field up to 600mm*600mm, i.e. exposure field covering exposure figure 11.
As shown in figure 4, the exposure system 42 of the second exposure system 32 and the 4th includes second set gradually along light path
Light source 321, the second Transmission Fibers 322, the second illuminator 323, even optical assembly 324, DMD components 325 and projection microscope group 326,
The secondary light source hair 321 goes out light beam and enters the second illuminator 323 by the second Transmission Fibers 322, afterwards by even light group
Part 324 carries out even light, and is carried out by DMD (Digital Micro-Mirror Device, digital micromirror array) component 325
After modulation the required hot spot of exposure is produced by projecting the projection of microscope group 326.The secondary light source 321 be laser, LED light source or
LD light sources.It should be noted that the second exposure system 32 and the 4th exposure system 42 are used to carry out smart exposure to exposing patterns, expose
For light precision up to um magnitudes, exposure field is smaller, generally several several mm of mm*, small line width patterns can be exposed.
Preferably, the support component 72 of the first support component 71 and second and the first moving parts 81 and the second motion
Component 82 is each attached on main frame 9, is provided a supporting role by main frame 9.
Preferably, the measuring system includes at least one first measuring system corresponding with the front of flexible substrates 1
51 and at least one second measuring system 52 corresponding with the back side of flexible substrates 1, first measuring system 51 and second
Measuring system 52 is used to measure the horizontal to position and vertical position of the corresponding face exposure figure 11 of the flexible substrates 1.Specifically
, as seen in figs. 5-6, the respectively schematic diagram of first layer exposure figure and second layer exposure figure, wherein, second layer exposure diagram
Shape includes second layer essence exposure figure and the thick exposure figure of the second layer, the thick exposure figure of the positive second layer of flexible substrates 1
With second layer essence exposure figure corresponding to exposure area mutually there is lap, the 1 positive second layer of the flexible substrates essence
Exposure figure is used to be exposed figure amendment to the thick exposure figure of the positive second layer of flexible substrates 1, similarly, described soft
Exposure area corresponding to the thick exposure figure of the second layer and second layer essence exposure figure at the property back side of substrate 1 mutually has overlapping portion
Point, the second layer essence exposure figure at the back side of flexible substrates 1 is used for the thick exposure diagram of the second layer to the back side of flexible substrates 1
Shape is exposed figure amendment.Certainly, the exposure image of the front and back of flexible substrates 1 can be with identical, can also be different, flexible
Substrate 1 can be fexible film, can also use any workpiece suitable for the present invention program, size can with greater or lesser,
Exposure figure and quantity on workpiece are not limited solely to the exposure figure used in Fig. 4-5, can be that any present invention is achievable
Exposure figure.Each exposure figure 11 is all around equipped with workpiece alignment mark 111, the first measuring system 51 in Fig. 5-6
With the second measuring system 52 by detecting the positions of four workpiece alignment marks 111, so as to obtain corresponding exposure figure 11
Level is to position, as shown in fig. 7, be workpiece alignment mark 111 and the imaging figure of mask alignment mark 112, certain workpiece
Alignment mark 111 and mask alignment mark 112 can also use other forms, and locus between the two ensures can be simultaneously
It is imaged onto in the visual field of measuring system；As shown in figure 8, the first measuring system 51 and the second measuring system 52 are to exposure figure
Mainly by 3 mensurations, three measurement points are relative positioned at exposure figure 11 two respectively for the measurement of 11 vertical position
Bian Shang.Preferably, the measuring system 52 of the first measuring system 51 and second is connected with a six-freedom motion mechanism respectively,
Six-freedom motion is carried out under the drive of six-freedom motion mechanism, to realize position and the exposure posture to exposure figure 11
Measurement.
Preferably, the master control system 6 is single-chip microcomputer, PLC or MCU.
The present invention also provides a kind of exposure method, as shown in figure 9, comprising the following steps：
S1:Flexible substrates 1 are flattened in volume to volume Transmission system；Specifically, one end of the flexible substrates 1 is wound
On let off roll 21, the other end is on wind-up roll 22, to realize flat, each layer of exposure in the flexible substrates 1
Figure includes some separate exposure figures 11.It refer to Fig. 4, two layers of exposure included in the present embodiment, in flexible substrates 1
Light figure, every layer of exposure figure include 12 separate exposure figures 11, the left-right and front-back position of each exposure figure 11
It is equipped with workpiece alignment mark 111.
S2:The workpiece alignment mark 111 of the front first layer exposure figure of flexible substrates 1 is measured by measuring system
Position, position and the exposure posture of first layer exposure figure are obtained by master control system 6；Specifically, transported by six degree of freedom
Motivation structure makes measuring system move to the top of flexible substrates 1, wherein measuring system corresponding with the front of flexible substrates 1 is the first survey
Amount system 51, the positional information of the workpiece alignment mark 111 of first exposure figure 11 in first layer exposure figure is measured, it is described
The position for the positional information calculation exposure figure 11 that master control system 6 obtains according to measurement and exposure posture, exposure figure 11
Position include horizontal level and vertical position, the exposure posture includes exposure figure 11 in six sides of X, Y, Rz, Z, Rx, Ry
Upward information.Wherein, the level of exposure figure 11 is obtained to position by measuring the position of workpiece alignment mark 111, vertical
Position is then measured by 3 mensurations, as shown in figure 8, three measurement points are located at 11 two relative sides of exposure figure respectively
On.
S3：According to the position of the first layer exposure figure and exposure posture, by the second exposure system 32 to first layer
Exposure figure is exposed；Specifically, according to the positional information of described first exposure figure 11 and posture is exposed, first
First moving parts 81 are adjusted to the posture of the second exposure system 32, and then the master control system 6 is according to the work of setting
Skill parameter opens second exposure system 32 and first exposure figure 11 is exposed, and the technological parameter includes exposure
Power, exposure spot diameter, exposure spot sweep speed, in addition to the work by measuring system second exposure figure 11 of measurement
The positional information of part alignment mark 111, wherein measuring system corresponding with the front of flexible substrates 1 is the first measuring system 51, institute
Master control system 6 is stated according to the position of second exposure figure 11 of positional information calculation and exposure posture, according to described second
The positional information and exposure posture of the individual exposure figure 11, first by the first moving parts 81 to the second exposure system 32
Posture is adjusted, and then the master control system 6 opens second exposure system 32 to second according to the technological parameter of setting
The individual exposure figure 11 is exposed；Repeat the above steps until first layer exposure figure all exposes, as shown in figure 5, originally
In embodiment, first layer exposure figure includes 12 separate exposure figures 11, and the second exposure system 32 is according in Fig. 5
The direction of arrow is exposed to exposure figure 11 successively, and each exposure area is A.It should be noted that in a upper exposure
The survey of the positional information of the workpiece alignment mark 111 of next exposure figure 11 is carried out in the exposure process of light figure 11 simultaneously
Amount, to save the time, improve operating efficiency.
S4：The workpiece alignment that the 5 thick exposure figures of the front second layer of flexible substrates 1 are measured by measuring system marks
111 position, wherein measuring system corresponding with the front of flexible substrates 1 is the first measuring system 51, obtained by master control system 6
To the position of the thick exposure figure of the second layer and exposure posture；Specifically, move measuring system by six-freedom motion mechanism
To above flexible substrates 1, the position of the workpiece alignment mark 111 of first thick exposure figure in the thick exposure figure of the second layer is measured
Information, the position for the positional information calculation thick exposure figure that the master control system 6 obtains according to measurement and exposure posture, such as
Shown in Fig. 6, in the present embodiment, the thick exposure figure of the second layer includes a separate thick exposure figure, each thick exposure figure
Be all around provided with workpiece alignment mark 111, the position of thick exposure figure includes horizontal level and vertical position, the exposure
Posture includes exposure figure 11 information on X, Y, Rz, Z, Rx, Ry six direction.Wherein, thick exposure figure is horizontal to position
Put and obtained by measuring the position of workpiece alignment mark 111, vertical position is then measured by 3 mensurations, three measurement points
Respectively on thick two relative sides of exposure figure.
S5：It is right by the first exposure system 31 first according to the position of the thick exposure figure of the second layer and exposure posture
The thick exposure figure of the second layer is exposed；It is first according to the positional information and exposure posture of the described first thick exposure figure
First pass through the first support component 71 to be adjusted the posture of the first exposure system 31, then the master control system 6 is according to setting
The technological parameter put is opened first exposure system 31 thick exposure figure described to first and is exposed, in addition to passes through measurement
The positional information of the workpiece alignment mark 111 of the thick exposure figure of systematic survey second, the master control system 6 is according to the position
Information calculates position and the exposure posture of second thick exposure figure, is believed according to the position of the described second thick exposure figure
Breath and exposure posture, are adjusted, then the master by the first support component 71 to the posture of the first exposure system 31 first
Control system 6 is opened first exposure system 31 thick exposure figure described to second according to the technological parameter of setting and exposed
Light；Repeat the above steps until the thick exposure figure of the second layer all exposes, i.e., the first exposure system 31 is according to the arrow side in Fig. 6
To being exposed successively to 12 thick exposure figures.It should be noted that on carrying out a thick exposure figure exposure process
In carry out simultaneously next thick exposure figure workpiece alignment mark 111 positional information measurement, to save the time, improve work
Make efficiency.
S6：The workpiece alignment that the front second layer essence exposure figure 12 of flexible substrates 1 is measured by measuring system marks
111 position, position and the exposure posture of second layer essence exposure figure are obtained by master control system 6；Specifically, by six certainly
Measuring system is moved to above flexible substrates by degree motion, measure first smart exposure diagram in second layer essence exposure figure
The positional information of the workpiece alignment mark 111 of shape, the positional information calculation exposure that the master control system 6 obtains according to measurement
The position of figure 11 and exposure posture.
S7：It is right by the second exposure system 32 first according to the position of the second layer essence exposure figure and exposure posture
Second layer essence exposure figure is exposed；It is first according to the positional information of the described first smart exposure figure and exposure posture
First pass through the first moving parts 81 to be adjusted the posture of the second exposure system 32, then the master control system 6 is according to setting
The technological parameter put is opened second exposure system 32 smart exposure figure described to first and is exposed, in addition to passes through measurement
The positional information of the workpiece alignment mark 111 of second smart exposure figure of systematic survey, the master control system 6 is according to the position
Information calculates position and the exposure posture of second smart exposure figure, is believed according to the position of the described second smart exposure figure
Breath and exposure posture, are adjusted, then the master by the first moving parts 81 to the posture of the second exposure system 32 first
Control system 6 is opened second exposure system 32 smart exposure figure described to second according to the technological parameter of setting and exposed
Light；Repeat the above steps until all exposures of second layer essence exposure figure, are modified exposure, more by the second exposure system 32
Different deformation quantities is adapted to well, greatly improves exposure accuracy.It should be noted that in the exposed of a upper smart exposure figure
The measurement of the positional information of the workpiece alignment mark 111 of next smart exposure figure is carried out in journey simultaneously, to save the time, is improved
Operating efficiency.
As shown in fig. 6, corresponding to the thick exposure figure of the 1 positive second layer of flexible substrates and second layer essence exposure figure
Exposure area mutually has lap, and the positive second layer essence exposure figure of flexible substrates 1 is used for the flexible base
The thick exposure figure of the positive second layer of bottom 1 is exposed figure amendment, including the 1 positive second layer of the flexible substrates slightly exposes
The inside figure of the frame pattern of figure and/or the thick exposure figure of the positive second layer of the flexible substrates 1.
S8：Repeated the above steps S2-S7, and the flexible substrates 1 are carried on the back by the 3rd exposure system and the 4th exposure system
The thick exposure figure of first layer exposure figure, the second layer and second layer essence exposure figure in face are exposed.Pass through first
Four exposure systems 42 are exposed to the first layer exposure figure at the back side of flexible substrates 1, then pass through the 3rd exposure system
41 and the 4th exposure system the thick exposure figure of the back side second layer of flexible substrates 1 and second layer essence exposure figure are exposed respectively
Light, and measuring system corresponding with the back side of flexible substrates 1 is the second measuring system 52, with the 41 corresponding support of the 3rd exposure system
Component is the second support component 72, is the second moving parts 82 with 42 corresponding moving parts of the 4th exposure system.The flexibility
Exposure area corresponding to the thick exposure figure of the second layer and second layer essence exposure figure at the back side of substrate 1 mutually has lap,
The second layer essence exposure figure at the back side of flexible substrates 1 is used for the thick exposure figure of the second layer to the back side of flexible substrates 1
It is exposed figure amendment, including the frame pattern of the thick exposure figure of the second layer at the back side of the flexible substrates 1 and/or described soft
The inside figure of the thick exposure figure of the second layer at the property back side of substrate 1.In the present embodiment, the exposure of the front and back of flexible substrates 1
Figure is identical, and also identical for the step of exposure of front and back, therefore, it will not go into details herein.
Embodiment 2
As shown in Figure 10, as different from Example 1, in the present embodiment, first exposure system 31 and the 3rd exposes
System 41 include set gradually along light path the first light source 311, expand component 315, shaping component 314, scanning galvanometer component 316
With field lens 317；First light source 311 is LASER Light Source, and the collimated light beam sent adjusts beam diameter by expanding component 315
Afterwards, required hot spot pattern is shaped into shaping component 314, hot spot pattern can be rectangular light spot, and method can certainly be it
His shape.The shaping component 314 is DOE (Diffractive Optical Elements, diffraction optical element) or ROE
(refractive Optical Elements, refraction optical element).
Embodiment 3
As shown in figure 11, unlike above-described embodiment 1-2, the exposure system 41 of the first exposure system 31 and the 3rd
Including setting gradually the first light source 311 along light path, expanding component 315, shaping component 314, focusing lens 318, object lens 319 and sweep
Galvanometer component 316 is retouched, first light source 311 is LASER Light Source, and output collimated light beam is straight by expanding the adjustment light beam of component 315
Behind footpath, into shaping component 314 after be shaped to needed for hot spot pattern, be then passed through focusing lens 318 to each visual field of whole visual field
Focused point position so that each visual field point light beam is focused in plane, finally after the imaging of object lens 319, by scanning
Galvanometer component 316 is reflexed on focal plane, and flexible substrates 1 are exposed.Wherein hot spot pattern can be rectangular light spot, and method is worked as
Can also be so other shapes.
In summary, exposure device provided by the invention and method, the device include flexible substrates 1 and for transmitting and consolidating
The volume to volume Transmission system of the fixed flexible substrates 1, in addition to the face exposure system axially symmetric on the flexible substrates 1
With back-exposure system, respectively with the front and back of the flexible substrates 1 corresponding measuring system and respectively with the volume
The master control system 6 connected to volume Transmission system, face exposure system 3, back-exposure system 4, measuring system.By setting just
Face exposure system 3 and back-exposure system 4 are exposed respectively to the front and back in flexible substrates 1 respectively, are not only improved
Exposure efficiency, while it is various in face exposure system 3 and back-exposure system 4 respectively to set different exposure systems to carry out again
The exposure of figure, different deformation quantities is suitable for, greatly improves exposure accuracy.
Although embodiments of the present invention are illustrated in specification, these embodiments are intended only as prompting,
It should not limit protection scope of the present invention.It is equal that various omission, substitution, and alteration are carried out without departing from the spirit and scope of the present invention
It should include within the scope of the present invention.
Claims (37)
1. a kind of exposure device, including flexible substrates and the volume to volume Transmission system for transmitting and fixing the flexible substrates,
Characterized in that, also include the face exposure system and back-exposure system axially symmetric on the flexible substrates, respectively with
Measuring system corresponding to the front and back of the flexible substrates and respectively with the volume to volume Transmission system, face exposure
System, back-exposure system, the master control system of measuring system connection.
2. exposure device according to claim 1, it is characterised in that the volume to volume Transmission system includes being symmetrical set
Let off roll and wind-up roll, one end of the flexible substrates is on the let off roll, and the other end is wound on the wind-up roll
On.
3. exposure device according to claim 1, it is characterised in that the face exposure system include the first exposure system and
Second exposure system, the back-exposure system include the 3rd exposure system and the 4th exposure system, wherein, first exposure
System and the relatively described flexible substrates of the 3rd exposure system are axially symmetric, and both are individually fixed in the first support component and second
On support component, second exposure system and the 4th exposure system are axially symmetric on the flexible substrates, and both are respectively arranged on
On first moving parts and the second moving parts, in the case where first moving parts and the second moving parts drive in the horizontal direction
It is scanned and step motion.
4. exposure device according to claim 3, it is characterised in that first exposure system and the 3rd exposure system include
The first light source for being set gradually along light path, the first Transmission Fibers, the first light fixture, shaping component, expand component, scanning galvanometer
Component and field lens, the light beam that first light source is sent are incided on the first light fixture by the first Transmission Fibers, Ran Houjing
Cross shaping component be shaped to exposure needed for hot spot, incided afterwards after expanding component and expanding on scanning galvanometer component, finally
Focused on by the field lens in flexible substrates.
5. exposure device according to claim 4, it is characterised in that first light source is LD light sources or LED light source.
6. exposure device according to claim 4, it is characterised in that the shaping component is microlens array.
7. exposure device according to claim 3, it is characterised in that first exposure system and the 3rd exposure system include
The first light source for being set gradually along light path, expand component, shaping component, scanning galvanometer component and field lens；The first light source hair
Go out collimated light beam after expanding component adjustment beam diameter, required hot spot is shaped into shaping component.
8. exposure device according to claim 7, it is characterised in that the shaping component is DOE or ROE components.
9. exposure device according to claim 3, it is characterised in that first exposure system and the 3rd exposure system include
The first light source is set gradually along light path, expands component, shaping component, focusing lens, object lens and scanning galvanometer component, described first
Light source output collimated light beam through expanding component adjustment beam diameter after, into shaping component after be shaped to required hot spot, then
Whole visual field each visual field point position is focused by focusing lens, finally after object lens are imaged, by scanning galvanometer
Component is reflexed on focal plane, and flexible substrates are exposed.
10. according to the exposure device of claim 7 or 9, it is characterised in that first light source is LASER Light Source.
11. according to 4 or 7 or 9 exposure device of claim, it is characterised in that the scanning galvanometer component is two-dimensional scan
Galvanometer.
12. according to 4 or 7 or 9 exposure device of claim, it is characterised in that the hot spot is rectangular light spot, and hot spot chi
It is very little consistent with the line width of exposure figure.
13. exposure device according to claim 3, it is characterised in that second exposure system and the 4th exposure system bag
Include the secondary light source set gradually along light path, the second Transmission Fibers, the second illuminator, even optical assembly, DMD components and projection lens
Group, the secondary light source send light beam and enter the second illuminator by the second Transmission Fibers, are carried out afterwards by even optical assembly
Even light, and produce the required hot spot of exposure by projecting microscope group projection after DMD components are modulated.
14. the exposure device according to claim 13, it is characterised in that the secondary light source is laser, LED light source or LD
Light source.
15. exposure device according to claim 3, it is characterised in that first exposure system and the 3rd exposure system with
Vertical distance between the flexible substrates be more than second exposure system and the 4th exposure system and the flexible substrates it
Between vertical distance.
16. exposure device according to claim 3, it is characterised in that the position of focal plane of first exposure system with it is described
The positive exposure figure of flexible substrates is corresponding, the position of focal plane of the 3rd exposure system and the exposure at the flexible substrates back side
Figure is corresponding.
17. exposure device according to claim 3, it is characterised in that first support component and the second support component with
And first moving parts and the second moving parts be each attached on main frame.
18. exposure device according to claim 1, it is characterised in that the measuring system is included with the flexible substrates just
At least one first measuring system corresponding to face and at least one second measuring system corresponding with the flexible substrates back side, institute
State the first measuring system and the second measuring system be used to measure level corresponding to the corresponding face exposure figure of the flexible substrates to
Position and vertical position.
19. the exposure device according to claim 18, it is characterised in that first measuring system and the second measuring system point
It is not connected with a six-freedom motion mechanism.
20. exposure device according to claim 1, it is characterised in that the master control system is single-chip microcomputer, PLC or MCU.
21. a kind of exposure method, it is characterised in that comprise the following steps：
S1:Flexible substrates are flattened in volume to volume Transmission system；
S2：The position of the workpiece alignment mark of the thick exposure figure of the flexible substrates front second layer is measured by measuring system,
Position and the exposure posture of the thick exposure figure of the second layer are obtained by master control system；
S3：According to the position of the thick exposure figure of the second layer and exposure posture, by the first exposure system to the thick exposure of the second layer
Light figure is exposed；
S4：The position of the workpiece alignment mark of the flexible substrates front second layer essence exposure figure is measured by measuring system,
Position and the exposure posture of second layer essence exposure figure are obtained by master control system；
S5：According to the position of the second layer essence exposure figure and exposure posture, second layer essence is exposed by the second exposure system
Light figure is exposed；
S6：Repeat the above steps S2-S5, by the 3rd exposure system and the 4th exposure system to the of the flexible substrates back side
Two layers of thick exposure figure and second layer essence exposure figure are exposed.
22. the exposure method according to claim 21, it is characterised in that be specially in the step S1：By the flexible base
The one end at bottom is on let off roll, and the other end is on wind-up roll.
23. the exposure method according to claim 21, it is characterised in that each layer of exposure figure wraps in the flexible substrates
Containing some separate exposure figures.
24. the exposure method according to claim 23, it is characterised in that the step S2 by six degree of freedom specifically, transported
Motivation structure makes measuring system move to above flexible substrates, measures the work of first thick exposure figure in the thick exposure figure of the second layer
The positional information of part alignment mark, the position for the positional information calculation exposure figure that the master control system obtains according to measurement
With exposure posture.
25. the exposure method according to claim 24, it is characterised in that the step S3 is specifically, according to described first
The positional information and exposure posture of the thick exposure figure, are entered by the first support component to the posture of the first exposure system first
Row adjusts, and then the master control system opens first exposure system thick exposure described to first according to the technological parameter of setting
Light figure is exposed, and the first light source is closed after end exposure.
26. the exposure method according to claim 25, it is characterised in that also include in the step S3, pass through measuring system
The positional information of the workpiece alignment mark of second thick exposure figure of measurement, the master control system is according to the positional information calculation
The position of second thick exposure figure and exposure posture, according to described second the slightly positional information of exposure figure and the exposure
Posture, the posture of the first exposure system is adjusted by the first support component first, then the master control system according to
The technological parameter of setting is opened first exposure system thick exposure figure described to second and is exposed, and after end exposure
Close the first light source；Repeat the above steps until the thick exposure figure of the second layer all exposes.
27. the exposure method according to claim 23, it is characterised in that the step S4 by six degree of freedom specifically, transported
Motivation structure makes measuring system move to above flexible substrates, measures the work of first smart exposure figure in second layer essence exposure figure
The positional information of part alignment mark, the position for the positional information calculation exposure figure that the master control system obtains according to measurement
With exposure posture.
28. the exposure method according to claim 27, it is characterised in that the step S5 is specifically, according to described first
The positional information and exposure posture of the smart exposure figure, are entered by the first moving parts to the posture of the second exposure system first
Row adjusts, and then the master control system is opened second exposure system essence described to first according to the technological parameter of setting and exposed
Light figure is exposed, and secondary light source is closed after end exposure.
29. the exposure method according to claim 28, it is characterised in that also include in the step S5, pass through measuring system
The positional information of the workpiece alignment mark of second smart exposure figure of measurement, the master control system is according to the positional information calculation
The position of second smart exposure figure and exposure posture, according to the positional information of described second smart exposure figure and exposure
Posture, the posture of the second exposure system is adjusted by the first moving parts first, then the master control system according to
The technological parameter of setting is opened second exposure system smart exposure figure described to second and is exposed, and after end exposure
Close secondary light source；Repeat the above steps until second layer essence exposure figure all exposes.
30. the exposure method according to claim 21, it is characterised in that the thick exposure diagram of the positive second layer of flexible substrates
Exposure area corresponding to shape and second layer essence exposure figure mutually has lap；The second layer at the flexible substrates back side is thick
Exposure area corresponding to exposure figure and second layer essence exposure figure mutually has lap.
31. the exposure method according to claim 30, it is characterised in that the positive second layer essence exposure diagram of flexible substrates
Shape is used to be exposed figure amendment to the thick exposure figure of the positive second layer of the flexible substrates, including the flexible substrates are just
The frame pattern of the thick exposure figure of the second layer in face and/or the interior view of the thick exposure figure of the positive second layer of the flexible substrates
Shape；The second layer essence exposure figure at the flexible substrates back side is used for the thick exposure figure of the second layer to the flexible substrates back side
It is exposed figure amendment, including the frame pattern of the thick exposure figure of the second layer at the flexible substrates back side and/or described soft
The inside figure of the thick exposure figure of the second layer of property backside of substrate.
32. the exposure method according to claim 21, it is characterised in that also include before the step S2:It is by measuring
The position of the workpiece alignment mark of flexible substrates front first layer exposure figure described in unified test amount, the is obtained by master control system
The position of one layer of exposure figure and exposure posture, according to the position of the first layer exposure figure and exposure posture, pass through second
Exposure system is exposed to first layer exposure figure.
33. the exposure method according to claim 32, it is characterised in that obtain position and the exposure appearance of first layer exposure figure
State is specially：Measuring system is moved to above flexible substrates by six-freedom motion mechanism, measure first layer exposure figure
In first exposure figure workpiece alignment mark positional information, the positional information that the master control system obtains according to measurement
Calculate position and the exposure posture of the exposure figure.
34. the exposure method according to claim 33, it is characterised in that it is described exposure posture include exposure figure X, Y,
Information on Rz, Z, Rx, Ry six direction.
35. the exposure method according to claim 32, it is characterised in that first layer exposure figure is exposed specifically,
According to the positional information of first exposure figure and exposure posture, the first moving parts are to the second exposure system first
Posture be adjusted, then the master control system opens second exposure system to first according to the technological parameter of setting
The exposure figure is exposed, and secondary light source is closed after end exposure.
36. the exposure method according to claim 35, it is characterised in that the technological parameter includes exposure power, exposure light
Spot diameter, exposure spot sweep speed.
37. the exposure method according to claim 32, it is characterised in that also include before the step S2:It is by measuring
The positional information of the workpiece alignment mark of two exposure figures of unified test flow control, the master control system is according to the positional information calculation
The position of second exposure figure and exposure posture, according to the positional information of second exposure figure and exposure appearance
State, the posture of the second exposure system is adjusted by the first moving parts first, then the master control system is according to setting
The technological parameter put opens second exposure system and second exposure figure is exposed, and is closed after end exposure
Secondary light source；Repeat the above steps until first layer exposure figure all exposes.
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