JP2013215804A - Laser processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of reducing damages to a light modulator and improving productivity in a process of processing a workpiece using laser light with high light energy.SOLUTION: A laser processing apparatus includes: a first laser light source 10 and a second laser light source 20 for emitting laser light; a light modulator 30 for selecting and forming the laser light emitted from the first laser light source 10; and an irradiation optical system 40 for irradiating a workpiece B with the laser light.

Description

  The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus that processes a workpiece by irradiating a laser beam.

  In general, flat display (FPD: Flat Panel Display) such as liquid product display (LCD: Liquid Crystal Display) and plasma display panel (PDP: Plasma Display Panel), semiconductor wafer (wafer), multilayer printed circuit board (multilayer printed circuit board). In order to form a pattern on a substrate, etc., a pattern material is applied on the substrate, and the pattern material is selectively exposed using a photomask, so that the pattern material portion having a changed chemical property is used. Alternatively, a step of selectively removing other portions is used.

  Recently, instead of a photomask, a spatial light modulator (SLM) is used to irradiate laser light at a predetermined position, direction, and shape on a substrate to form a pattern. A processing apparatus using a laser is used.

  The spatial light modulator mainly uses a one-dimensional scanner using a galvano mirror or a polygon mirror. Compared to this, the array type spatial light modulator such as DMD (Digital Micromirror Device) has a wider area that can irradiate laser light at a time, improving the productivity and improving the configuration and control method of the processing equipment. It has the advantage of being relatively easy.

Korean Published Patent No. 10-2009-0012470 Korean Published Patent No. 10-2009-0033817

  In the case of a one-dimensional scanner using a galvano mirror or a polygon mirror, it is manufactured using a sufficiently large reflecting surface, and is used as a material that can accommodate the wavelength and optical energy of laser light necessary for processing. In addition, a coating or the like can be performed, and damage due to laser light is not generated. However, in the case of an array type spatial light modulator, it is manufactured in a fine size by a semiconductor process or the like in order to obtain sufficient spatial resolution. For this reason, there is a problem that a material or a coating for enduring the optical energy of the laser beam necessary for processing cannot be processed, and the optical energy such as the laser beam necessary for processing is deteriorated without being endured.

  Further, in the case where damage due to laser light does not occur as in a one-dimensional scanner such as a galvano mirror or a polygonal mirror, sufficient light energy necessary for processing must be applied to the processing target. The time for applying light becomes longer, and the productivity is limited.

  The present invention has been made in view of the above-mentioned problems, and its object is to reduce damage to the optical modulator and improve productivity in a processing process of a processing object in which a laser beam with high light energy is used. An object of the present invention is to provide a laser processing apparatus that can improve the above.

  In order to solve the above-described object, a laser processing apparatus according to Embodiment 1 of the present invention includes a first laser light source and a second laser light source that emit laser light, and laser light emitted from the first laser light source. And an irradiation optical system for irradiating the workpiece with the laser light.

  According to an embodiment, the first laser light source emits laser light as light energy that does not damage the optical modulator.

  According to an embodiment, the second laser light source is provided so that the laser beam is directly irradiated onto the object to be processed, and emits laser light as light energy that does not process the object to be processed. To do.

  According to one embodiment, the sum of the light energy of the first laser light source and the light energy of the second laser light source is larger than the light energy required when processing the workpiece.

According to one embodiment, the first laser light source and the second laser light source are any one of an Nd: YAG laser, an Nd: YLF laser, an Nd: YVO4 laser, a titanium sapphire femtosecond laser, and a CO ₂ laser. Or one.

  According to an embodiment, the light modulator is any one of a galvano mirror, a polygon mirror, a DMD, an LCD, or a photomask.

  According to one embodiment, the irradiation optical system includes a light expander that expands the laser light modulated by the light modulator, and a microlens that collects the laser light expanded by the light expander. And a projection lens that projects the laser beam condensed by the microlens onto the object to be processed.

  In order to solve the above-described object, a laser processing apparatus according to Embodiment 2 of the present invention includes a first laser light source and a second laser light source that emit laser beams having different wavelengths, and the first laser light source. An optical modulator for selecting and shaping the emitted laser light, and an irradiation optical system for irradiating the workpiece with the laser light, provided between the irradiation optical system and the processing target, It further includes a dichroic lens that selectively transmits or reflects the laser light emitted from the irradiation optical system and the laser light emitted from the second laser light source.

  According to an embodiment, the first laser light source emits laser light as light energy that does not damage the optical modulator.

  According to an embodiment, the second laser light source is provided so that the laser beam is directly irradiated onto the object to be processed, and emits laser light as light energy that does not process the object to be processed. To do.

  According to one embodiment, the sum of the light energy of the first laser light source and the light energy of the second laser light source is larger than the light energy required when processing the workpiece.

According to one embodiment, the first laser light source and the second laser light source are any one of an Nd: YAG laser, an Nd: YLF laser, an Nd: YVO4 laser, a titanium sapphire femtosecond laser, and a CO ₂ laser. Or one.

  According to an embodiment, the light modulator is any one of a galvano mirror, a polygon mirror, a DMD, an LCD, or a photomask.

  According to one embodiment, the irradiation optical system includes a light expander that expands the laser light modulated by the light modulator, a microlens that collects the laser light expanded by the light expander, and And a projection lens that projects the laser beam condensed by the microlens onto the object to be processed.

  In order to solve the above object, a laser processing apparatus according to Embodiment 3 of the present invention emits light from a first laser light source and a second laser light source that emit laser light, and from the first laser light source. Laser light emitted from the first laser light source and the second laser light source, which includes an optical modulator that selectively forms laser light and an irradiation optical system that irradiates the workpiece with the laser light. And a polarization converter that changes the polarization of the light.

  According to an embodiment, a laser beam that is provided between the irradiation optical system and the workpiece and that is irradiated from the irradiation optical system and a laser beam emitted from the second laser light source is selectively used. And a polarizing lens that transmits or reflects the light.

  According to an embodiment, the first laser light source emits laser light as light energy that does not damage the optical modulator.

  According to an embodiment, the second laser light source is provided so that the laser beam is directly irradiated onto the object to be processed, and emits laser light as light energy that does not process the object to be processed. To do.

  According to one embodiment, the sum of the light energy of the first laser light source and the light energy of the second laser light source is greater than the light energy required when processing the workpiece.

According to one embodiment, the first laser light source and the second laser light source are selected from among an Nd: YAG laser, an Nd: YLF laser, an Nd: YVO4 laser, a titanium sapphire beam laser, and a CO ₂ laser. It is provided by any one of these.

  According to an embodiment, the light modulator is any one of a galvano mirror, a polygon mirror, a DMD, an LCD, or a photomask.

  According to one embodiment, the irradiation optical system includes a light expander that expands the laser light modulated by the light modulator, a microlens that collects the laser light expanded by the light expander, and the And a projection lens that projects the laser beam condensed by the microlens onto the object to be processed.

  According to the embodiment of the present invention, the optical modulator is damaged by processing the processing object by combining laser beams emitted from the two laser light sources as light energy that does not damage the optical modulator. In addition, the workpiece can be processed, and maintenance and repair costs due to damage to the optical modulator can be reduced.

  In addition, the use of the optical modulator produces an effect that the processing apparatus can be simplified.

  In addition, by separately applying the laser light to the object to be processed by the two laser light sources, it is possible to reduce the time required to apply the light energy necessary for processing and to improve the productivity. Play.

It is a block diagram which shows the laser processing apparatus by Embodiment 1 of this invention. It is a block diagram which shows the laser processing apparatus using a photomask. It is a block diagram which shows the laser processing apparatus by Embodiment 2 of this invention. It is a block diagram which shows the laser processing apparatus by Embodiment 3 of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Each embodiment shown below is given as an example so that those skilled in the art can sufficiently communicate the idea of the present invention. Therefore, the present invention is not limited to the embodiments described below, but can be embodied in other forms. In the drawings, the size and thickness of the device can be exaggerated for convenience. Like reference numerals refer to like elements throughout the specification.

  The terminology used herein is for the purpose of describing embodiments and is not intended to limit the invention. In this specification, the singular includes the plural unless specifically stated otherwise. As used herein, “includes” a stated component, step, action, and / or element does not exclude the presence or addition of one or more other components, steps, actions, and / or elements. Want to be understood.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a configuration diagram illustrating a laser processing apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a configuration diagram illustrating a laser processing apparatus using a photomask.

  As shown in FIG. 1, the laser processing apparatus according to the first embodiment of the present invention includes a first laser light source 10, a second laser light source 20, an optical modulator 30, and an irradiation optical system 40.

  The laser processing apparatus is an apparatus for processing a workpiece B with laser light emitted from a laser light source, and is used for melting, cutting, printing of pictures and characters, exposure, formation of a circuit pattern on a substrate, and circuit pattern formation. Predetermined processing such as recovery (repair) is performed on the processing object B.

  Examples of the processing object B include, but are not limited to, a flat panel display, a semiconductor wafer, and a laminated printed board. For example, a general sample may be used.

  The first laser light source 10 and the second laser light source 20 emit laser light. The laser light emitted from the first laser light source 10 is reflected by the reflecting mirror 50 and is incident on the optical modulator 30, and the laser light emitted from the second laser light source 20 is directly applied to the workpiece B to be processed. Irradiated. In this case, the reflection mirror 50 is provided so as to reflect the laser light, change the optical path, and guide the laser light emitted from the first laser light source 10 to the optical modulator 30. According to one embodiment, the reflection mirror 50 may not be used depending on the position of the first laser light source 10 and the position of the light modulator 30, and may be used in large numbers.

  According to one embodiment, the second laser light source 20 may be provided on one side of the workpiece B in order to directly irradiate the workpiece B with laser light, and one or a plurality of the second laser light sources 20 are provided. Also good.

The first laser light source 10 and the second laser light source 20 are any one of an Nd: YAG laser, an Nd: YLF laser, an Nd: YVO4 laser, a titanium sapphire femtosecond laser, and a CO ₂ laser. May be provided.

  The first laser light source 10 emits laser light as light energy that does not damage an optical modulator 30 described later, and the second laser light source 20 has light energy that does not process the workpiece B. The laser beam is emitted.

  According to one embodiment, the sum of the optical energies of the laser beams emitted from the first laser light source 10 and the second laser light source 20 may be provided higher than the light energy required when processing the workpiece B. desirable.

  Specifically, the laser light from the first laser light source 10 that emits light energy that does not damage the optical modulator 30 and the second laser light source that emits light energy that does not process the workpiece B. By combining the laser light from 20 and processing the workpiece B using these, damage to the optical modulator 30 can be prevented. Therefore, the maintenance and repair costs due to the damage of the optical modulator 30 can be reduced, and the processing apparatus can be simplified.

  Compared to using one laser light source, the laser light from the two laser light sources is applied separately to the workpiece, thereby reducing the time required to apply the light energy required for processing. , Productivity can be improved.

  Further, in the embodiment of the present invention, it has been described that a laser light source is used. However, not only the laser light source but also light that can process the workpiece B such as an LED (Light Emitting Diode) or a lamp. Any structure that emits light may be used.

  The light modulator 30 selects and shapes the laser light emitted from the first laser light source 10, and may be provided by a DMD (Digital Micromirror Device).

  In this case, the DMD can selectively irradiate the laser beam with the laser beam and irradiate the workpiece B, and may be provided in an upper region of the workpiece B.

  The DMD may be configured in a two-dimensional array so that a large number of micromirrors can be adjusted in angle. The inclination angle of each micromirror may be provided so that it can be switched between at least two types.

  In addition, each micromirror can be independently switched between an “on state” and an “off state” depending on the tilt angle, and the state may be selectively switched by a control unit (not shown). In this case, the control unit may store data indicating whether or not the incident laser light can be irradiated.

  Therefore, the DMD switches the micromirror to the “on state” or “off state” according to the data of the control unit, and when the incident laser light is incident on the micromirror in the on state, it reflects in the vertical direction and is processed The object B is irradiated. On the other hand, when the laser light is incident on the micromirror in the off state, the laser beam is reflected in a direction different from the vertical direction and is not irradiated on the workpiece B.

  The irradiation optical system 40 is provided on the moving path of the laser beam, and has a light expander 41 that expands the laser beam, and a certain size so that the laser beam expanded by the light expander 41 hits the region to be processed. And a projection lens 43 for projecting the laser beam condensed by the microlens 42 onto the workpiece B, and processing the laser beam shaped by the optical modulator 30. The object B is irradiated.

  According to an embodiment, the light modulator 30 may be provided by a galvano mirror, a polygon mirror, or an LCD (Liquid Crystal Display).

  In addition, as shown in FIG. 2, the light modulator 30 may be provided by a photomask.

  When the light modulator 30 is provided by a photomask, the laser light that is provided between the irradiation optical system 40 and the workpiece B is selectively transmitted through the irradiation optical system 40. The processing object B is irradiated.

  In this case, since the workpiece B is preheated by the second laser light source 20, only the region selectively transmitted by the photomask is processed.

  Next, a processing method of the processing object B by the laser processing apparatus provided as described above will be described with reference to FIG.

  First, the second laser light source 20 emits laser light as light energy that does not allow the workpiece B to be processed. The laser light emitted from the second laser light source 20 is applied to the entire area or a partial area of the workpiece B to preheat the workpiece B.

  Subsequently, the light modulator 30 selects the laser light emitted from the first laser light source 10 according to data from a control unit (not shown), reflects it in the vertical direction, and irradiates the reflected laser light. By processing the optical system 40 and irradiating the processing object B, the processing object B is processed.

  In other words, the workpiece B preheated by the second laser light source 20 is irradiated with the laser light emitted from the first laser light source 10 and selected by the optical modulator 30, whereby the workpiece B Are processed into the position, direction and shape selected by the light modulator 30.

  Therefore, by processing the workpiece B using two laser light sources, the processing speed can be increased compared to using one laser light source.

  FIG. 3 is a block diagram showing a laser processing apparatus according to Embodiment 2 of the present invention.

  The laser processing apparatus according to Embodiment 2 of the present invention is a laser processing apparatus that uses two laser light sources that emit laser beams having different wavelengths.

  As shown in FIG. 3, the laser processing apparatus according to Embodiment 2 of the present invention includes a first laser light source 110 and a second laser light source 120 that emit laser beams of different wavelengths, and the first laser light source 110. An optical modulator 130 that selectively reflects the emitted laser light to form it, and an irradiation optical system 140 that irradiates the workpiece with the laser light formed by the optical modulator 130. The laser processing apparatus is provided between the irradiation optical system 130 and the workpiece B, and selectively selects the laser light emitted to the irradiation optical system 130 and the laser light emitted from the second laser light source 120. A dichroic lens 160 that transmits or reflects the light is further included.

  The first laser light source 110 emits laser light as light energy that does not damage the optical modulator 130, and the second laser light source 120 emits light as light energy that does not process the workpiece B. Emits laser light. According to one embodiment, the sum of the optical energy of the laser beams emitted from the first laser light source 110 and the second laser light source 120 is preferably set higher than the energy required when processing the workpiece B. .

  That is, the optical modulator 130 is damaged by processing the processing object using a laser beam having an output that is low enough not to damage the optical modulator 130 and a laser beam that can only preheat the processing object B. The maintenance and repair costs due to can be reduced. Further, the processing apparatus can be simplified and productivity can be improved.

  The dichroic lens 160 transmits laser light having a certain wavelength and reflects other laser light, and is provided between the irradiation optical system 130 and the workpiece B.

  The dichroic lens 160 is reflected by the light modulator 130, transmits the laser light from the first laser light source 110 processed by the irradiation optical system 140, and projects the laser light onto the workpiece B. Laser light from the second laser light source 120 having a different wavelength can be reflected and applied to the workpiece B.

  Specifically, when using a large number of laser beams that emit laser beams having different wavelengths, the workpiece B is processed by irradiating a plurality of laser beams having different wavelengths through a dichroic lens 160 in one direction. Will be able to.

  Therefore, the workpiece B is preheated by the laser light from the second laser light source 120 that emits light energy that is not processed by the workpiece B, and the light modulator 130 emits light from the first laser light source 110. Therefore, the processing speed can be increased as compared with the case of using one laser light source.

  FIG. 4 is a block diagram showing a laser processing apparatus according to Embodiment 3 of the present invention.

  The laser processing apparatus according to Embodiment 3 of the present invention is a laser processing apparatus that uses two laser light sources that emit laser light having the same wavelength.

  As shown in FIG. 4, a laser processing apparatus according to Embodiment 3 of the present invention includes a first laser light source 210 and a second laser light source 220 that emit laser light having the same wavelength, and the first laser light source 210. An optical modulator 230 that selectively reflects the emitted laser light and forms it, and an irradiation optical system 240 that irradiates the workpiece B with the laser light formed by the light modulator 230. The laser processing apparatus further includes a polarization conversion unit 270 that changes the polarization of the laser light emitted from the first laser light source 210 and the second laser light source 220.

  The laser processing apparatus is provided between the irradiation optical system 240 and the workpiece B, and is based on the polarization of the laser light emitted to the irradiation optical system 240 and the laser light emitted from the second laser light source 220. It further includes a polarizing lens 260 that selectively transmits or reflects.

  The polarization converter 270 is provided in the first laser light source 210, and converts the polarization direction of the laser light emitted from the first laser light source 210 into a vertical direction, and a second laser light source. 220, and a horizontal polarization conversion unit 272 that converts the polarization direction of the laser light emitted from the second laser light source 220 into a horizontal direction.

  According to one embodiment, the vertical polarization converter 271 and the horizontal polarization converter 272 may be provided with their positions changed. That is, a horizontal polarization conversion unit 272 is installed in the first laser light source 210 and a vertical polarization conversion unit 271 is installed in the second laser light source 220 to convert the polarization of the laser light emitted from each laser light source. Also good.

  The polarizing mirror 260 selectively transmits or reflects laser light depending on the polarization direction, and is provided between the irradiation optical system 230 and the workpiece B. Consists of either a horizontal polarizing mirror that transmits horizontal laser light and reflects vertical laser light or a vertical polarizing mirror that transmits vertical laser light and reflects horizontal laser light May be.

  For example, laser light emitted from the second laser light source 220 and whose polarization has been converted in the horizontal direction by the horizontal polarization converter 272 is reflected by the polarizing mirror 260 to the workpiece B to preheat the workpiece B. It becomes like this. Of the laser light emitted from the first laser light source 210 and whose polarization is converted in the vertical direction by the vertical polarization converter 271, the laser light selectively reflected and shaped by the light modulator 230 is The processing target B is processed by being processed by the irradiation optical system 240 and irradiating the processing target B through the polarizing mirror 260.

  In this case, the first laser light source 210 emits laser light as light energy that does not damage the optical modulator 230, and the second laser light source 220 has light energy that does not process the workpiece B. The laser beam is emitted.

  According to an embodiment, the sum of the optical energy of the laser light emitted from the first laser light source 210 and the second laser light source 220 is preferably higher than the energy required when processing the workpiece B. .

  That is, by processing the processing object using a laser beam having an output that is small enough not to damage the optical modulator 230 and a laser beam that can only preheat the processing object B, the optical modulator 230 is damaged. Maintenance and repair costs can be reduced. Further, the processing apparatus can be simplified and productivity can be improved.

  Further, by processing the workpiece B using two laser beams, the processing speed can be increased as compared to using one laser light source.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

DESCRIPTION OF SYMBOLS 10 1st laser light source 20 2nd laser light source 30 Optical modulator 40 Irradiation optical system 41 Optical magnifying device 42 Micro lens 43 Projection lens 50 Reflection mirror B Processing target object

Claims (11)

A first laser light source that emits a first laser beam;
An optical modulator that selectively forms the first laser light emitted from the first laser light source;
An irradiation optical system for irradiating the object to be processed with the first laser beam.   The laser processing apparatus according to claim 1, further comprising a second laser light source that emits a second laser beam. A first laser light source and a second laser light source that emit laser beams of different wavelengths;
An optical modulator that selectively forms the first laser light emitted from the first laser light source;
An irradiation optical system for irradiating the workpiece with the first laser beam,
Provided between the irradiation optical system and the object to be processed, and selectively transmits or reflects the laser light emitted from the irradiation optical system and the second laser light emitted from the second laser light source. A laser processing apparatus further including a dichroic lens. A first laser light source and a second laser light source for emitting laser light;
An optical modulator that selectively forms the first laser light emitted from the first laser light source;
An irradiation optical system for irradiating the workpiece with the first laser beam,
A laser processing apparatus further comprising a polarization conversion unit that changes polarization of the first laser light emitted from the first laser light source and the second laser light emitted from the second laser light source.   Provided between the irradiation optical system and the object to be processed, and selectively transmits or reflects the laser light emitted from the irradiation optical system and the second laser light emitted from the second laser light source. The laser processing apparatus according to claim 4, further comprising a polarizing lens.   The laser processing apparatus according to any one of claims 2 to 5, wherein the first laser light source emits laser light as light energy that does not damage the optical modulator.   The second laser light source is provided so that the second laser light is directly irradiated onto the object to be processed, and emits the second laser light as light energy that does not process the object to be processed. Item 7. The laser processing apparatus according to any one of Items 2 to 6.   The sum of the light energy of the said 1st laser light source and the light energy of the said 2nd laser light source is larger than the light energy required at the time of the process of a process target object, The any one of Claim 2 to 7 Laser processing equipment. The first laser light source and the second laser light source are configured by any one of an Nd: YAG laser, an Nd: YLF laser, an Nd: YVO4 laser, a titanium sapphire femtosecond laser, and a CO ₂ laser. The laser processing apparatus according to any one of claims 2 to 8.   10. The laser processing apparatus according to claim 2, wherein the optical modulator is configured by any one of a galvano mirror, a polygon mirror, an LCD, a DMD, and a photomask. The irradiation optical system is
A light expander that expands the laser light modulated by the light modulator;
A microlens for condensing the laser light magnified by the light magnifier;
The laser processing apparatus of any one of Claim 2 to 10 including the projection lens which projects the laser beam condensed with the said micro lens on a process target object.

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