JP5100917B1 - レーザ加工方法 - Google Patents
レーザ加工方法 Download PDFInfo
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- JP5100917B1 JP5100917B1 JP2012525788A JP2012525788A JP5100917B1 JP 5100917 B1 JP5100917 B1 JP 5100917B1 JP 2012525788 A JP2012525788 A JP 2012525788A JP 2012525788 A JP2012525788 A JP 2012525788A JP 5100917 B1 JP5100917 B1 JP 5100917B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
【選択図】図2
Description
図1は、本発明の実施の形態にかかるレーザ加工方法を適用するレーザ加工機の概略構成を示す図である。レーザ加工機100は、被加工物3へレーザ光L(パルスレーザ光)を照射することにより、被加工物3にレーザ加工を施す装置である。
2 加工制御装置
3 被加工物
10 ビーム整形部
11、12 ガルバノスキャナ
13、14 ガルバノミラー
15 fθレンズ
16 XYテーブル
21 第1の照射領域
22 第2の照射領域
23 重畳領域
24 掘削領域
100 レーザ加工機
L レーザ光
Claims (4)
- 被加工物の掘削領域へ、前記掘削領域に対して小さいビーム断面をなし掘削を一様とするレーザ光を順次照射させ、前記掘削領域を加工するレーザ加工方法であって、
第1の形状のビーム断面をなし、前記被加工物上にて、前記第1の形状のビーム断面に相当する第1の照射領域をなすレーザ光を、前記掘削領域の全体へ順次照射させる第1の加工工程と、
前記第1の形状より小さい第2の形状のビーム断面をなし、前記被加工物上にて、前記第2の形状のビーム断面に相当する第2の照射領域をなすレーザ光を、前記掘削領域へ順次照射させる第2の加工工程と、を含み、
前記第1の加工工程では、前記第1の照射領域の一部分同士が互いに重畳する重畳領域を形成するように、前記第1の照射領域をなすレーザ光を順次照射させ、
前記第2の加工工程では、前記掘削領域のうち前記重畳領域以外の領域に前記第2の照射領域が含まれるように、前記第2の照射領域をなすレーザ光を順次照射させることを特徴とするレーザ加工方法。 - 前記第1の形状および前記第2の形状が、いずれも矩形であることを特徴とする請求項1に記載のレーザ加工方法。
- 前記第2の照射領域の中心位置を、前記第1の照射領域の中心位置に一致させることを特徴とする請求項1または2に記載のレーザ加工方法。
- 前記第2の照射領域の外縁の一部を、前記第1の照射領域のうち前記掘削領域の外縁を構成する部分に一致させることを特徴とする請求項1または2に記載のレーザ加工方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/079539 WO2013094025A1 (ja) | 2011-12-20 | 2011-12-20 | レーザ加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5100917B1 true JP5100917B1 (ja) | 2012-12-19 |
JPWO2013094025A1 JPWO2013094025A1 (ja) | 2015-04-27 |
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Application Number | Title | Priority Date | Filing Date |
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JP2012525788A Active JP5100917B1 (ja) | 2011-12-20 | 2011-12-20 | レーザ加工方法 |
Country Status (3)
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JP (1) | JP5100917B1 (ja) |
KR (1) | KR20130086388A (ja) |
WO (1) | WO2013094025A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012212131A1 (de) * | 2012-07-11 | 2014-06-26 | Semikron Elektronik Gmbh & Co. Kg | Substrat und Verfahren zur Bruchvorbereitung eines Substrats für mindestens ein Leistungshalbleiterbauelement |
KR102581115B1 (ko) * | 2021-10-20 | 2023-09-21 | 주식회사 휴비스 | 에나멜선 탈피를 위한 레이저 가공 헤드 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000263263A (ja) * | 1999-03-12 | 2000-09-26 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
JP2004314154A (ja) * | 2003-04-18 | 2004-11-11 | Murata Mfg Co Ltd | レーザスキャニング加工方法 |
JP2007090438A (ja) * | 2007-01-11 | 2007-04-12 | Sumitomo Heavy Ind Ltd | レーザ加工方法 |
-
2011
- 2011-12-20 WO PCT/JP2011/079539 patent/WO2013094025A1/ja active Application Filing
- 2011-12-20 JP JP2012525788A patent/JP5100917B1/ja active Active
- 2011-12-20 KR KR1020137017497A patent/KR20130086388A/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000263263A (ja) * | 1999-03-12 | 2000-09-26 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
JP2004314154A (ja) * | 2003-04-18 | 2004-11-11 | Murata Mfg Co Ltd | レーザスキャニング加工方法 |
JP2007090438A (ja) * | 2007-01-11 | 2007-04-12 | Sumitomo Heavy Ind Ltd | レーザ加工方法 |
Also Published As
Publication number | Publication date |
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JPWO2013094025A1 (ja) | 2015-04-27 |
KR20130086388A (ko) | 2013-08-01 |
WO2013094025A1 (ja) | 2013-06-27 |
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