WO2010058619A1 - 回路基板、表示パネル及び表示装置 - Google Patents
回路基板、表示パネル及び表示装置 Download PDFInfo
- Publication number
- WO2010058619A1 WO2010058619A1 PCT/JP2009/062060 JP2009062060W WO2010058619A1 WO 2010058619 A1 WO2010058619 A1 WO 2010058619A1 JP 2009062060 W JP2009062060 W JP 2009062060W WO 2010058619 A1 WO2010058619 A1 WO 2010058619A1
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- WO
- WIPO (PCT)
- Prior art keywords
- wiring
- circuit board
- external connection
- connection terminal
- contact hole
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Definitions
- the present invention relates to a circuit board, a display panel, and a display device. More specifically, the present invention relates to a circuit board suitable for narrowing the frame of a display device, a display panel including the circuit board, and a display device.
- LCD liquid crystal displays
- PDP plasma displays
- inorganic electroluminescence (inorganic EL) displays organic electroluminescence (organic EL) displays
- Portable electronic devices such as mobile phones and PDAs on which these flat panel displays are mounted are required to be further reduced in size and weight, and in accordance with this, downsize around the display area (frame area). That is, there is a tendency to narrow the frame.
- a peripheral circuit necessary for driving such as a drive circuit (driver circuit) is mounted on the frame region of the substrate constituting the display panel.
- drive circuit drive circuit
- a common wiring that supplies power to a scanning line driving circuit that drives scanning lines a common wiring that supplies power to a signal line driving circuit that drives signal lines, and an interlayer insulation that insulates each of the common wirings.
- a display device including a film and a plurality of external connection terminals respectively positioned on a plurality of contact holes provided in the interlayer insulating film so as to expose a part of each of the common wirings ( For example, see Patent Document 1.)
- an anisotropic conductive film is disposed on an external connection terminal and is connected to the outside by the anisotropic conductive film.
- an external connection terminal and a common wiring are connected by a contact hole, and a flexible printed circuit board (FPC: Flexible Print) is provided on the external connection terminal via an anisotropic conductive film containing conductive particles.
- An external member such as Circuits
- the common wiring and the external connection terminal are overlapped as described above, the frame area is smaller than the case where the external connection terminal and the common wiring are arranged without overlapping. Although it can be made smaller, there was room for ingenuity to further narrow the frame.
- the present invention has been made in view of the above-described situation, and provides a circuit board capable of narrowing the frame in a display device or the like while preventing a connection failure between a wiring and an external connection terminal. It is the purpose.
- the inventor has a configuration in which an external connection terminal is connected to a wiring through at least one contact hole, and a configuration of a circuit board in which an anisotropic conductive film including conductive particles is provided on the external connection terminal.
- the present invention is a circuit board in which a wiring, an insulating film, and an external connection terminal are arranged in this order on a substrate, and the circuit board includes an anisotropic conductive film containing conductive particles on the external connection terminal.
- the external connection terminal is connected to the wiring through at least one contact hole formed in the insulating film, and one or more contact holes connected to the specific external connection terminal when formed in a plan view are formed.
- the length from one end of the region to the other end is a circuit board larger than the diameter of the conductive particles.
- the circuit board of the present invention is a circuit board in which wirings, insulating films, and external connection terminals are arranged in this order on the board. That is, the circuit board has wirings and external connection terminals arranged on the substrate, and an insulating film arranged between them.
- the wiring is usually a member that serves as a current path in the circuit board.
- the wiring is not particularly limited.
- the wiring in the case of being provided in a display device includes a power supply wiring for supplying power from the outside, a signal from the outside, or a signal from a circuit board. Signal wiring for transmitting the signal to the outside.
- signal wiring is connected to a driver circuit or the like in the circuit board.
- a driver circuit or the like is provided outside, a source wiring, a gate wiring, an auxiliary capacitance wiring, or the like that transmits a signal to a pixel for display is provided as a signal wiring.
- the external connection terminal is a terminal used to transmit power and / or signals from the outside (for example, an external member such as an FPC) to the wiring or a terminal used to transmit signals from the circuit board to the outside. It has conductivity.
- the configuration of the external connection terminal is not particularly limited, and may be, for example, a single layer film formed of a single layer conductive film or a stacked film in which a plurality of conductive films are stacked.
- the insulating film is a film formed of an insulating material for electrically dividing (insulating) the wiring and the external connection terminal at a portion other than a portion connected via a contact hole or the like.
- an organic insulating material, an inorganic insulating material such as an inorganic oxide, an inorganic nitride, or the like can be used, and the material is not particularly limited.
- the insulating film may be a single layer or a plurality of layers. When the insulating film is composed of a plurality of layers, a conductive layer may be interposed between the insulating films as long as the plurality of external connection terminals are arranged so as not to conduct each other.
- the circuit board includes an anisotropic conductive film containing conductive particles on an external connection terminal.
- the anisotropic conductive film is a film that has conductivity in the out-of-plane direction (normal direction with respect to the substrate plane) but does not have conductivity in the in-plane direction (substrate plane direction). Accordingly, each terminal of the external member and each external connection terminal of the circuit board can be electrically connected in a one-to-one correspondence.
- the anisotropic conductive film has adhesiveness in order to physically bond the external connection terminal and the external member.
- an anisotropic conductive film one that conducts the external connection terminal and the external member by conductive particles contained in the insulating material is suitable.
- the shape of the conductive particles is not particularly limited, and may be a cubic shape, an octahedral shape, or the like, but a spherical shape is preferable.
- the external connection terminal is connected to the wiring through at least one contact hole formed in the insulating film, and when viewed in a plan view, is a region in which one or more contact holes connected to a specific external connection terminal are formed.
- the length from one end to the other end is larger than the diameter of the conductive particles.
- the external member and the external connection terminal are connected by the anisotropic conductive film, and are disposed directly below the external connection terminal (in a region overlapping when viewed in plan).
- the wiring is connected through a contact hole formed in the insulating film.
- one external connection terminal is one It can be roughly divided into a form in which contact holes are provided (first form) and a form in which a plurality of contact holes are provided for one external connection terminal (second form).
- the contact hole 818 is formed as in the circuit board shown in the schematic cross-sectional view of FIG.
- a conductive portion of the contact hole 818 connecting the external connection terminal 816 and the wiring 815 on the insulating film 814 that is formed in a region that is not broken is destroyed by the conductive particles 817b, resulting in poor connection.
- the conductive layer on the wall surface of the contact hole is thinner than the conductive layer on the terminal surface.
- connection failure may occur.
- the external connection terminal is connected to the wiring through only one contact hole, and when viewed in plan, the contact hole is at least partly formed of conductive particles. It has a longer diameter than In this way, when there is one contact hole provided in a specific external connection terminal, the length from one end to the other end of the region where the contact hole is formed is the length of the diameter of the contact hole itself, at least There may be a portion longer than the diameter of the conductive particles in one direction. That is, it is sufficient that the maximum diameter of the contact hole is longer than the diameter of the conductive particles.
- the length of the major axis of the contact hole (the major axis is considered to be the minor axis in a square or true circular contact hole) is the diameter of the conductive particle. Longer form. According to the first aspect, it is possible to effectively suppress the contact hole from being broken and the disconnection between the external connection terminal and the wiring due to the pressing of the conductive particles, which is effective in preventing connection failure.
- the diameter of the conductive particles means the diameter itself when the conductive particles are spherical, and means the maximum diameter when the conductive particles are non-spherical such as an ellipsoidal shape. is doing.
- the diameter of the conductive particles can be measured using, for example, an optical microscope. Moreover, what is necessary is just to select arbitrary one among the several conductive particles which overlap with a specific external connection terminal, for example for the conductive particle used for a measurement.
- the external connection terminal is connected to the wiring through a plurality of contact holes, and when viewed from above, from one end to the other end of the region where the plurality of contact holes are formed. Is longer than the diameter of the conductive particles.
- a plurality of contact holes a group of contact holes
- the distance from one location of the outer edge of one contact hole to one location of the outer edge of another contact hole is made larger than the diameter of the conductive particles.
- the distance L from end to end of the plurality of contact holes 8 may be longer than the diameter of the conductive particles 17b.
- the wiring is connected to one external connection terminal through two or more contact holes, even if one contact hole becomes defective in connection, the connection to the external connection terminal is ensured by another contact hole. Thus, disconnection between the external connection terminal and the wiring can be prevented.
- the length from end to end of two or more contact holes connected to one external connection terminal that is, from any one of the outer edges of the contact hole provided in one external connection terminal to the other It is sufficient that the maximum length up to this point (one place on the outer edge of the same contact hole or one place on the outer edge of another contact hole) is larger than the diameter of the conductive particles, In the form in which each of the contact holes has a diameter larger than the diameter of the conductive particles, the connection between the external connection terminal and the wiring can be particularly reliably ensured.
- one or more contact holes connected to a specific external connection terminal are formed in consideration of a margin with respect to the deformation amount due to the pressing pressure.
- the maximum length from one end to the other end of the region is preferably at least 1.5 times the diameter of the conductive particles.
- each contact hole provided on the substrate may be different, for example, may be different for each external connection terminal to be connected.
- one contact hole in the substrate when one contact hole is formed in one external connection terminal
- a group of contact holes a plurality of contact holes are formed in one external connection terminal.
- the anisotropic conductive film contains conductive particles having a diameter smaller than the length from one end to the other end of the one formed in the smallest size.
- the contact hole formed in the insulating film is usually formed by dry etching, wet etching, or the like. However, when the contact hole is viewed in cross section, it becomes a tapered shape or a reverse tapered shape, and the upper surface of the insulating film (external connection)
- the length from one end of the contact hole to the other end may be different between the terminal side surface and the lower surface (substrate side surface). In this case, the length from one end to the other end of the region where one or more contact holes connected to a specific external connection terminal are formed at least on the upper surface of the insulating film may be larger than the diameter of the conductive particles. If at least the length from one end of the contact hole to the other end of the upper surface of the insulating film is larger than the diameter of the conductive particles, it is possible to sufficiently prevent the external connection terminals from being damaged due to the conductive particles.
- the shape of the contact hole may be, for example, a polygonal shape such as a square shape, a rectangular shape, or a triangular shape; a circular shape such as a perfect circle shape or an oval shape;
- the major axis of the ellipse is larger than the diameter of the conductive particle even if the minor axis of the ellipse is smaller than the diameter of the conductive particle If it is a thing, it can prevent that the conduction
- the contact hole may be a long hole when viewed in plan, and the maximum diameter of the long hole may be larger than the diameter of the conductive particles. Moreover, in order to prevent connection failure more reliably, it is preferable that the maximum diameter of the long hole is 1.5 times or more the diameter of the conductive particles.
- the long hole is a hole having a short diameter and a long diameter when seen in a plan view, and includes various shapes such as an ellipse, a rectangle, and an isosceles triangle.
- the short diameter means the shortest diameter in the hole when viewed in plan
- the long diameter means the longest diameter in the hole when viewed in plan.
- the area of the contact hole is not particularly limited, but is preferably larger than the area of the conductive particles when viewed in plan.
- the contact area between the wiring and the external connection terminal increases, so that the resistance at the connection portion can be reduced.
- the external member connected to the anisotropic conductive film is not particularly limited, and includes, for example, electronic components such as resistors, capacitors, coils, connectors, diodes, transistors; flexible printed circuit boards (FPCs), Examples thereof include a chip (COG: Chip On Glass) or a resin film (COF: Chip On film) on which an integrated circuit (IC: Integrated Circuit) including circuit elements and wirings is formed.
- FPCs flexible printed circuit boards
- Examples thereof include a chip (COG: Chip On Glass) or a resin film (COF: Chip On film) on which an integrated circuit (IC: Integrated Circuit) including circuit elements and wirings is formed.
- Other examples include a printed wiring board (PWB: Printed Wiring Board), a printed circuit board (PCB: Printed Circuit Board), and a tape carrier package (TCP: Tape Carrier Package).
- PWB Printed Wiring Board
- PCB printed circuit board
- TCP Tape Carrier Package
- the circuit board of the present invention preferably includes an external member on the anisotropic conductive film. And it is preferable that the said external member is equipped with an electroconductive protrusion in the area
- a conductive protrusion is also referred to as “external connection wiring” or “bump”.
- Such conductive protrusions are connected to the external connection terminals via the conductive particles in the anisotropic conductive film.
- the configuration of the circuit board of the present invention is not limited by other components as long as the above-described wiring, insulating film, external connection terminal, anisotropic conductive film, and contact hole are essential.
- the circuit board of the present invention can be suitably used as a display device substrate used in a liquid crystal display device or the like.
- driving of a pixel that is a minimum unit constituting a display image driving of a pixel that is a minimum unit constituting a display image.
- a switching element such as a thin film transistor (TFT) for performing display; a wiring such as a source wiring and a gate wiring for transmitting a signal to the pixel; a pixel electrode for performing display; and the like.
- TFT thin film transistor
- a circuit such as a driver circuit, a power supply circuit, an electrostatic discharge (ESD) protection circuit or the like is provided. Also good.
- the driver circuit include a source driver circuit and a gate driver circuit.
- the circuit constituting the driver circuit include an inverter including a transmission gate, a latch circuit, a timing generator, a power supply circuit, and the like.
- the wiring has a wide portion protruding sideways in the extending direction when viewed in plan, and the contact hole is provided in the wide portion.
- the wiring has a wide portion that spreads laterally with respect to the extending direction when seen in a plan view, and a contact hole is formed in the insulating film on the wide portion. It is preferable that the terminal and the wiring are connected.
- the extending direction is a direction in which the wiring extends in a straight line, and in a case where a series of wiring is bent at a plurality of locations, the direction is extended at the location connected to the external connection terminal, in other words. And the direction from the bent portion toward the external connection terminal.
- the direction indicated by the white arrow in FIG. means the width direction of the wiring.
- a preferred form of the wide portion includes a form that protrudes only to one side with respect to the extending direction of the wiring when viewed in plan. Projecting only to one side with respect to the extending direction means that the width of the wiring is increased (widened) in any one of the width directions. According to this, since the width of the wiring can be expanded only in the direction in which no other wiring is arranged, the length from one end of the contact hole to the other end is increased without increasing the distance between the wirings. Thus, connection failure between the wiring and the external connection terminal can be prevented. In addition, for example, when two or more wirings extend in parallel, the distance between the wirings can be reduced while preventing the wirings from contacting each other as compared to the case where both the wirings protrude in the width direction.
- the wiring area can be further reduced.
- the line width of the pad portion of the contact hole is usually larger than the wiring width. Therefore, in the form in which the wide portion protrudes in both the width directions, the distance between the wirings increases. It is difficult to increase the number of wires arranged under the external connection terminals.
- the shape of the wide portion is not particularly limited as long as it is a shape spreading laterally with respect to the extending direction.
- the wide portion where the wiring 19 spreads in a semicircular shape.
- the shape of 19a as shown in FIG. 14 (b), the shape of the wide portion 20a in which the wiring 20 spreads in a square shape, and the width of the wide portion 21a in which the wiring 21 spreads in a triangular shape as shown in FIG. 14 (c). Shape may be sufficient.
- the corner is usually rounded for patterning accuracy.
- the square shape is substantially square. Any shape can be used as long as it can be regarded as a triangular shape.
- the wide part 15a may be formed at the tip of the wiring 15, or as shown in FIG. A wide portion 16 a may be formed in the middle of 16.
- the wide portion protrudes only to one side with respect to the extending direction of the wiring
- two or more wirings extending in parallel when the circuit board is viewed in plan view, and the extending direction thereof Wiring having two or more external connection terminals arranged in parallel, the two or more wirings having a wide portion protruding toward the end side or inside of the circuit board, and the wide portion protruding from the wiring portion.
- the length in the extending direction is shorter than the adjacent wiring is preferable.
- the circuit board has two or more wirings extending in parallel when viewed in plan and two or more external connection terminals arranged in the extending direction, and the two or more wirings are circuit A wiring having a wide portion protruding toward the end side of the substrate and arranged on the end side has a length in the extending direction longer than the adjacent wiring (adjacent wiring arranged on the inner side).
- the circuit board has two or more wirings extending in parallel when viewed in plan, and two or more external connection terminals arranged in the extending direction, the two or more wirings,
- a wiring that has a wide portion protruding toward the inside of the circuit board and that is disposed inside has a shorter length in the extending direction than the adjacent wiring (adjacent wiring disposed on the end side).
- the form is preferred.
- the direction in which the wide portion protrudes is one of the sides with respect to the extending direction of the wiring, and the length in the extending direction of the wiring arranged on the side from which the wide portion protrudes is shortened.
- the wide portion protrudes to the side where the wiring is not arranged. For this reason, even if the wide portion is provided, the distance between the wide portion of the wiring and the wiring adjacent to the wiring is not shortened between the wirings extending in parallel. Accordingly, the wide portion can be provided while sufficiently securing the distance between the wirings, and the wirings can be further integrated. As a result, the area of the region in which the wiring is arranged can be reduced, so that the frame can be narrowed when the circuit board of the present invention is used as a display device substrate.
- the length in the extension direction is a length in the direction from the bent portion of the wiring to the direction of the external connection terminal indicated by B1, B2, and the like.
- parallel is not limited to being completely parallel, but may be anything that can be regarded as substantially parallel.
- two or more wirings extend in parallel. In this case, the case where the angle between the wirings is within 5 ° is included.
- the end side of the circuit board is a side closer to the end of the circuit board on both sides of the wiring extension direction.
- the inside of the circuit board is the opposite side to the side where the end of the circuit board is close, on both sides of the wiring extension direction.
- the arrangement form of the two or more external connection terminals is not particularly limited as long as the wirings are arranged in the extending direction.
- the plurality of external connection terminals are rectangular in shape
- the short The external connection terminals whose sides are parallel to the extension direction of the wiring and the external connection terminals whose long sides are parallel to the extension direction of the wiring may be alternately arranged. From the viewpoint of reducing the area of the region where the wiring is arranged, it is preferable that the external connection terminals whose short sides are parallel to the extending direction of the wiring are arranged in a line at intervals.
- the form (1) is suitable for uniforming the wiring resistance between the end-side wiring and the inner wiring, and is advantageous for improving the operational stability of the circuit board. This is because, when two or more parallel wires are bent at the corners of the substrate as in the circuit board shown in FIG. 1, the wires on the end side are longer than the wires on the inner side, so the wires on the end side are bent. This is because the length of the end-side wiring and the inner wiring can be made uniform by making the length in the extending direction shorter than the inner wiring.
- the form (2) is suitable for reducing the area of the region where the wiring is arranged, and is advantageous for narrowing the frame when the circuit board of the present invention is used as a display device substrate.
- the inner wiring is made shorter in the extending direction than the end-side wiring, so that a region where no wiring is arranged is formed in the inner region under the external connection terminal.
- an element such as can be arranged.
- a circuit such as a transistor and wiring connected thereto are provided under the external connection terminal. The area for arranging and forming circuits and the like is reduced.
- a preferable form of the circuit board of the present invention is a form in which the two or more wirings are connected to the external connection terminals through contact holes having different areas.
- the wiring is not disposed on one of the wide portions of the wiring (one on the side with respect to the extending direction).
- the area of the contact hole can also be increased.
- the contact resistance between the external connection terminal and the wiring can be adjusted, for example, a difference in wiring resistance caused by a difference in wiring length can be compensated. Further, by increasing the area of the contact hole, it is possible to suppress the occurrence of connection failure.
- a preferable form of the circuit board of the present invention is a form in which the two or more wirings are connected to a contact hole having a larger area as the wiring length is longer. Since the above wiring is usually the same wiring width, the wiring resistance increases as the wiring length increases.For example, in the case shown in FIG. Wiring resistance is smaller for the wiring located inside the circuit board having a shorter wiring length. Therefore, by increasing the area of the contact hole in the wiring having a long wiring length and reducing the area of the contact hole in the wiring having a short wiring length, the resistance in the contact hole portion can be adjusted and the wiring resistance can be made uniform. . By making the wiring resistance uniform, the stability of the operation of the circuit board is improved.
- the wiring length means the length of a series of wirings connected to the elements in the circuit, and the series of wirings may be configured by connecting wirings formed in different layers to each other. Good.
- the present invention further includes a display panel including the circuit board and a display device including the display panel.
- the present invention can be applied to various display devices, for example, a liquid crystal display, a plasma display, an inorganic electroluminescence display, an organic electroluminescence display, and the like.
- the length from one end to the other end of the region in which one or more contact holes connected to one external connection terminal are formed is larger than the diameter of the conductive particles.
- the display device by forming the wide portion in the wiring, in addition to suppressing connection failure, the distance between the wirings can be shortened. Accordingly, if the display device is narrowed, the display device can be reduced in size or weight, and thus can be suitably used for a portable electronic device such as a mobile phone or a PDA.
- circuit board of the present invention it is possible to stabilize the connection between the wiring and the external connection terminal and suppress the occurrence of connection failure.
- FIG. 3 is a schematic plan view illustrating an end portion of the circuit board according to the first embodiment.
- 2 is a schematic cross-sectional view showing an end portion of the circuit board according to Embodiment 1.
- FIG. 6 is a schematic plan view illustrating an end portion of a circuit board according to Embodiment 2.
- FIG. 5 is a schematic cross-sectional view showing an end portion of a circuit board according to Embodiment 2.
- FIG. 10 is a schematic plan view showing an end portion of a circuit board according to Embodiment 3.
- FIG. 6 is a schematic cross-sectional view showing an end portion of a circuit board according to Embodiment 3.
- FIG. 6 is a schematic plan view showing an end portion of a circuit board according to Embodiment 4.
- FIG. 4 is a schematic plan view illustrating an end portion of a circuit board according to Embodiment 4.
- FIG. 10 is a schematic plan view showing an end portion of a circuit board according to Embodiment 5.
- FIG. 10 is a schematic plan view showing an end portion of a circuit board according to Embodiment 6.
- FIG. It is a plane schematic diagram which shows the edge part of the circuit board which concerns on the comparison form 1. It is a cross-sectional schematic diagram which shows the edge part of the circuit board which concerns on the comparison form 1.
- FIG. (A) is a plane schematic diagram which shows the example in which the wide part was provided in the front-end
- (b) is a plane schematic diagram which shows the example in which the wide part was provided in the middle of wiring.
- FIG. 2 is a schematic plan view showing a form in which a wide portion is provided for each contact hole.
- (A) is a plane schematic diagram which shows the example which made the wide part protrude from the wiring in the semicircle shape
- (b) is the plane which shows the example which made the wide part protrude from the wiring in the shape of a quadrilateral
- (c) is a schematic plan view showing an example in which the wide portion protrudes from the wiring in a triangular shape.
- FIG. 1 is a schematic plan view illustrating an end portion of a circuit board according to the first embodiment.
- FIG. 2 is a schematic cross-sectional view when the circuit board shown in FIG. 1 is cut along line AB.
- the circuit substrate according to the first embodiment is a display device substrate used in a liquid crystal display device, and is not illustrated in FIGS. 1 and 2, but a thin film transistor used for driving a pixel is provided inside the circuit substrate. Pixel electrodes, driver circuits, and the like are formed.
- the base coat film 111, the first insulating film 112, the second insulating film 113, the wiring 115, and the third insulating film 114 are formed on the substrate 110 at the end of the circuit board according to the first embodiment. Arranged in order.
- an external connection terminal 116 in which a metal film 116a and a transparent conductive film 116b are stacked is disposed on the third insulating film 114.
- the film thickness of the third insulating film 114 is, for example, 0.5 to 4 ⁇ m, and the film thickness of the external connection terminal is, for example, 100 to 1000 nm.
- the external connection terminal 116 is connected to the wide portion 115 a of the wiring through a contact hole 118 formed in the third insulating film 114.
- An anisotropic conductive film 117 is disposed on the external connection terminal 116 in order to electrically connect the external connection terminal 116 and the external connection wiring 119a of the flexible printed circuit board (FPC) 119.
- the anisotropic conductive film 117 contains conductive particles 117b in an insulating material 117a.
- the FPC 119 is provided with an external connection wiring 119a and the like on the surface of the resin substrate 119b.
- the wiring 115 and the external connection are connected through the contact hole 118 formed in the third insulating film 114.
- Terminal 116 is connected.
- the wiring 115 extends along the end of the substrate 110 and bends from the right direction to the lower direction in FIG.
- a plurality of external connection terminals 116 having the same shape are arranged at intervals from the corners of the substrate 110, and each wiring 115 extends along the end of the substrate 110 in FIG. 1. It extends downward (in the direction in which the wiring extends), and is connected to the contact hole 118 by a wide portion 115a directly below the corresponding external connection terminal 116.
- the wide portion 115a is a portion where the wiring is widened so as to protrude toward the end side (outside) of the substrate 110 in order to dispose the contact hole 118, and is the end of the wiring 115 in this embodiment.
- the wirings 115 extending in parallel the wiring 115 formed on the end side of the substrate 110 is provided with the wide portion 115a in the upper part of FIG. 1, that is, the length of the bent wiring is shortened. ing.
- the width of the wiring 115 is, for example, 2 to 4 ⁇ m.
- the width of the wide portion 115a (the width to the side with respect to the extending direction) is, for example, 4 to 6 ⁇ m.
- the contact hole 118 is provided for each external connection terminal 116.
- the contact hole 118 has a rectangular shape, and the length of the major axis (the length of the diameter) is, for example, 3 to 8 ⁇ m. Note that the length of the major axis of the contact hole indicates the length of the upper surface of the third insulating film 114.
- the diameter of the conductive particles 117b is made smaller than the length of the long axis of the contact hole, for example, 2 to 6 ⁇ m. This value is based on the diameter (maximum diameter) when the circuit board is viewed in plan after the FPC 119 is attached.
- the diameter of the conductive particles can be calculated by an optical measurement method using an optical microscope. The value of the diameter of the conductive particles is the same in other embodiments described later.
- connection terminal 116 and the external connection wiring 119a of the FPC 119 are not easily electrically disconnected, and the connection reliability is excellent.
- the wide portion 115a that protrudes only to the end side of the circuit board is formed in the wiring 115, so that the distance between the wirings 115 can be shortened. For this reason, it is possible to reduce the area that needs to be secured in the substrate surface in order to arrange the wiring 115 and to narrow the frame.
- the wiring 115 arranged on the end side of the circuit board is connected to the external connection terminal 116 so that the length from the bent portion of the wiring is shortened, the length of the wiring arranged on the end side is shortened. And the length of the wiring arranged inside can be made close, and the resistance between the wirings 115 can be made uniform.
- the length of the wiring P arranged on the most end side of the circuit board is A1 + B1
- the length of the wiring Q adjacent thereto is A2 + B2. Since A1> A2 and B1 ⁇ B2, the wiring lengths of the wiring P and the wiring Q are closer compared to the case where the wiring is arranged in order from the wiring arranged inside, and both wirings Can be made uniform.
- FIG. 3 is a schematic plan view illustrating an end portion of the circuit board according to the second embodiment.
- FIG. 4 is a schematic cross-sectional view of the circuit board shown in FIG. 3 taken along line CD.
- the thickness of the wiring, the insulating film, and the like is the same as that of the first embodiment.
- the circuit substrate according to the second embodiment includes a base coat film 211, a semiconductor layer 220, a first insulating film (gate insulating film) 212, a gate wiring 222, and a second insulating film 213 on the substrate 210. Arranged in this order. On the second insulating film 213, a wiring 215 (in FIG. 4, the wide portion 215a of the wiring 215 is shown) and a source / drain wiring 221 are arranged. The source / drain wiring 221 is connected to the semiconductor layer 220 through a contact hole 218 formed in the second insulating film 213 and the first insulating film (gate insulating film) 212.
- a third insulating film 214 is disposed on the wiring 215 and the source / drain wiring 221, and an external connection terminal 216 in which a metal film 216a and a transparent conductive film 216b are stacked is disposed thereon. .
- the external connection terminal 216 is connected to the wide portion 215 a of the wiring 215 through a contact hole 218 formed in the third insulating film 214.
- An anisotropic conductive film 217 is disposed on the external connection terminal 216 in order to electrically connect the external connection wiring 219 a of the FPC 219 and the external connection terminal 216.
- the anisotropic conductive film 217 contains conductive particles 217b in an insulating material 217a. Note that the FPC 219 is provided with an external connection wiring 219a and the like on the surface of the resin substrate 219b.
- the wiring 215 is externally connected to the wide portion 215 a of the wiring 215 extending in parallel via the contact hole 218 formed in the third insulating film 214.
- Terminal 216 is connected.
- the wiring 215 is connected to the external connection terminal 216 so that the longer the wiring arranged inside the circuit board, the shorter the length from the bent portion of the wiring, and the wiring 215 spreads (projects) inside the circuit board. ) It has a wide portion 215a.
- the width of the wiring 215 is, for example, 2 to 4 ⁇ m, and the width of the wide portion 215 a is 4 to 6 ⁇ m.
- the contact hole 218 has a rectangular shape, and the length of the major axis is 3 to 8 ⁇ m, which is larger than the diameter of the conductive particles. Note that the length of the major axis of the contact hole (the length of the diameter) indicates the length of the upper surface of the third insulating film 214.
- connection positions of the wiring 115 and the external connection terminals 116 are in order from the inner side to the end side of the circuit board. Therefore, an empty area is formed near the inside of the circuit board under the external connection terminal to which the wiring arranged on the end side of the circuit board is connected. Therefore, in addition to the wiring 115 connected to the external connection terminal 116, a wiring, a semiconductor layer, and the like constituting the transistor can be formed under the external connection terminal 116, so that the frame can be further narrowed.
- FIG. 5 is a schematic plan view showing an end portion of the circuit board according to the third embodiment.
- FIG. 6 is a schematic cross-sectional view of the circuit board shown in FIG. 5 taken along line EF.
- the thickness of the wiring, the insulating film, and the like is the same as that of the first embodiment.
- the circuit substrate according to the third embodiment is a display device substrate used in a liquid crystal display device, and is not shown in FIGS. 5 and 6, but inside the circuit substrate is a thin film transistor and a pixel used for driving pixels. Electrodes, driver circuits, and the like are formed.
- a base coat film 311, a first insulating film (gate insulating film) 312, a second insulating film 313, a wiring 315, and a third are formed on the substrate 310.
- An insulating film 314 is arranged in this order.
- an external connection terminal 316 in which a metal film 316a and a transparent conductive film 316b are stacked is disposed on the third insulating film 314. The external connection terminal 316 is connected to the wide portion 315 a of the wiring through a contact hole 318 formed in the third insulating film 314.
- An anisotropic conductive film 317 is disposed on the external connection terminal 316 in order to electrically connect the external connection wiring 319 a of the FPC 319 and the external connection terminal 316.
- the anisotropic conductive film 317 contains conductive particles 317b in an insulating material 317a. Note that the FPC 319 is provided with an external connection wiring 319a and the like on the surface of the resin substrate 319b.
- the circuit board according to the third embodiment is connected to the external connection terminal 316 through the contact hole 318 formed in the third insulating film 314 in the wide portion 315a of the wiring 315 extending in parallel. ing. Then, the wiring 315 is connected to the external connection terminal 316 so that the wiring arranged on the inner side of the circuit board has a shorter length from the bent portion of the wiring, and spreads (projects) to the inner side of the circuit board. A wide portion 315a is provided. At this time, the width of the wiring 315 is, for example, 2 to 4 ⁇ m, and the width of the wide portion 315a is decreased in order from the wiring arranged on the end side of the circuit board to the wiring arranged inside. The width is designed to be 4 to 6 ⁇ m, for example.
- the contact hole 318 has a rectangular shape, and the diameter of the contact hole 318 increases in the order from the wiring arranged on the end side of the circuit board to the wiring arranged on the inner side in the same manner as the width of the wide portion 315a.
- the length of the long axis of the contact hole 318 is larger than the diameter of the conductive particle 317b.
- the resistance between the wirings 315 can be made uniform.
- the resistance at the connection portion between the wiring 315 and the external connection terminal 316 is lower. Therefore, the wiring resistance that has been increased due to the longer wiring length can be brought closer to other shorter wiring. it can.
- the innermost wiring R is C1 + D1 and the second wiring S is arranged in the illustrated range. Then, C2 + D2, and the wiring length of the wiring R arranged on the inner side is longer, so that the area of the contact hole 318 is made larger as the wiring arranged on the outer side.
- FIG. 7 is a schematic plan view showing an end portion of the circuit board according to the fourth embodiment.
- the circuit board according to the fourth embodiment has substantially the same configuration as that of the first embodiment except that the width of the circuit board is not provided and the area of the contact hole is different. It is.
- wirings 415 extending in parallel are connected to the external connection terminals 416 through contact holes 418 formed in the third insulating film 414. At this time, a plurality of contact holes 418 are provided in one wiring and are connected to the external connection terminal 416 at a plurality of locations. Note that the width of the wiring 415 is 3 to 5 ⁇ m.
- each contact hole 418 The length of the major axis of each contact hole 418 is 2 to 4 ⁇ m, the interval between the contact holes 418 is 2 to 4 ⁇ m, and six contact holes 418 are formed for each wiring.
- the length from one end of the region where the contact hole 418 to 416 is formed to the other end is 22 ⁇ m (breakdown: 6 ⁇ 2 ⁇ m + 5 ⁇ 2 ⁇ m) to 44 ⁇ m (breakdown: 6 ⁇ 4 ⁇ m + 5 ⁇ 4 ⁇ m).
- the diameter of the conductive particles is 2 to 6 ⁇ m, a plurality of contact holes 418 are formed on one wiring 415 and are connected to the external connection terminals 416 at a plurality of locations.
- the wide portion is not formed in the wiring.
- the wide portion may be formed for each contact hole.
- FIG. 8 is a schematic plan view showing an end portion of the circuit board according to the fifth embodiment.
- the circuit board according to the fifth embodiment has substantially the same configuration as that of the first embodiment, except that the wiring shape is not provided and the contact hole area is different. It is.
- wirings 515 extending in parallel are connected to the external connection terminals 516 through contact holes 518 formed in the third insulating film 514.
- the contact hole 518 has a long hole shape (rectangular shape) that is long in the extending direction of the wiring 515.
- the major axis of the rectangular shape is 3 to 20 ⁇ m, which is larger than the diameter of the conductive particles.
- the wide portion is not formed in the fifth embodiment, it is more preferable that the wide portion is formed in the wiring 515 and the contact hole 518 is a long hole.
- FIG. 9 is a schematic plan view showing an end portion of the circuit board according to the sixth embodiment.
- the circuit board according to the sixth embodiment has substantially the same configuration as that of the first embodiment except that the wiring shape such as the shape of the wide portion is different and the area of the contact hole is different.
- wirings 615 extending in parallel are connected to the external connection terminals 616 through contact holes 618 formed in the third insulating film 614. At this time, the wiring 615 has a wide portion 615a that protrudes to both sides with respect to the direction in which the wiring extends (extension direction).
- the length of the long axis of each contact hole 618 is 4 to 9 ⁇ m
- the diameter of the conductive particles 617 b is 3 to 6 ⁇ m
- the length of the long axis of the contact hole 618 is larger than the diameter of the conductive particles 617 b. Is also enlarged. According to this, since the length of the major axis of the contact hole 618 is larger than the diameter of the conductive particles 617b, disconnection due to the conductive particles 617b can be prevented.
- the width of the wiring 615 is 2 to 4 ⁇ m
- the width of the wide portion 615a is 3 to 6 ⁇ m.
- the distance between the wirings is shorter in the wide part than in the forms shown in the first to fifth embodiments. Become. For this reason, in order to prevent a short circuit between the wirings in the wide portion, it is necessary to ensure a certain distance between the wirings, and the number of wirings arranged immediately below the external connection terminals may be limited.
- FIG. 10 is a schematic plan view illustrating an end portion of the circuit board according to the first comparative embodiment.
- FIG. 11 is a schematic cross-sectional view taken along line GH of the circuit board shown in FIG.
- the first insulating film 813 and the wiring 815 are arranged on the substrate 810 at the end of the circuit board according to the first comparative example.
- a second insulating film 814 is disposed on the wiring 815, and an external connection terminal 816 made of metal is disposed thereon.
- the external connection terminal 816 is connected to the wiring 815 through a contact hole 818 formed in the third insulating film 814.
- an anisotropic conductive film 817 for connecting the external connection wiring 819a of the flexible printed circuit board (FPC) 819 and the external connection terminal 816 is disposed on the external connection terminal 816.
- the anisotropic conductive film 817 is obtained by containing conductive particles 817b in an insulating material 817a.
- the external connection wiring 819 a formed over the anisotropic conductive film 817 is electrically connected to the external connection terminal 816 through the anisotropic conductive film 817.
- the FPC 819 is provided with an external connection wiring 819a and the like on the surface of the resin substrate 819b.
- the circuit board according to the comparative embodiment 1 is connected to the external connection terminal 816 through the contact hole 818 formed in the second insulating film 814 at the tip of the wiring 815 extending in parallel.
- the length of the major axis of the contact hole 818 is 2 ⁇ m.
- the length of the major axis of the contact hole 818 indicates the length of the upper surface of the second insulating film 814.
- the diameter of the conductive particles 817b is 5 ⁇ m. As described above, since the length of the long axis of the contact hole 818 is smaller than the diameter of the conductive particles 817b, connection failure occurs when the conductive particles 817b are crushed.
- Circuit Board According to Embodiments 1 to 6 (Method for Manufacturing Circuit Board According to Embodiments 1 to 6)
- a method for manufacturing a circuit board according to Embodiments 1 to 6 will be described.
- the circuit board according to the second embodiment shown in FIGS. 3 and 4 will be described as an example.
- the circuit boards according to the first and third to sixth embodiments can be modified by appropriately changing the shape of the wiring, the shape of the contact hole, and the like. It can be manufactured by a similar method.
- substrate 210 cleaning and pre-annealing are performed on the substrate 210 as pretreatment.
- substrate 210 is not specifically limited, From viewpoints, such as cost, a glass substrate, a resin substrate, etc. are suitable.
- steps (1) to (10) are performed.
- a SiON film and a SiO x film are formed on a pre-treated substrate 210 by a plasma enhanced chemical vapor deposition (PECVD) method or the like, thereby forming a base coat film 211.
- the source gas for forming the SiON film include a mixed gas of monosilane (SiH 4 ), nitrous oxide gas (N 2 O), and ammonia (NH 3 ).
- the SiO x film is preferably formed by using tetraethyl orthosilicate (TEOS) gas as a source gas.
- the base coat film 211 may be a silicon nitride (SiN x ) film using a mixed gas of monosilane (SiH 4 ) and ammonia (NH 3 ) as a source gas.
- amorphous silicon (a-Si) film is formed by PECVD.
- the source gas for forming the a-Si film include SiH 4 and disilane (Si 2 H 6 ). Since the a-Si film formed by the PECVD method contains hydrogen, a treatment (dehydrogenation treatment) for reducing the hydrogen concentration in the a-Si layer is performed at about 500 ° C. Subsequently, laser annealing is performed to melt, cool, and solidify the a-Si film to form a polysilicon (p-Si) film. For laser annealing, for example, an excimer laser is used.
- a treatment for applying a metal catalyst may be performed without performing a dehydrogenation treatment.
- solid phase crystallization heat treatment may be performed as a pretreatment for laser annealing.
- dry etching with carbon tetrafluoride (CF 4 ) gas is performed to pattern the p-Si film, thereby forming the semiconductor layer 220.
- CF 4 carbon tetrafluoride
- a first insulating film (gate insulating film) 212 made of silicon oxide is formed using TEOS gas as a source gas.
- the material of the first insulating film 212 is not particularly limited, and a SiN x film, a SiON film, or the like may be used.
- Examples of the source gas for forming the SiN x film and the SiON film include the same source gases as those described in the base coat film forming step.
- the first insulating film 212 may be a stacked body made of the plurality of materials.
- a tantalum nitride (TaN) film and a tungsten (W) film are formed by sputtering.
- a resist film is patterned into a desired shape by photolithography, argon (Ar), sulfur hexafluoride (SF 6 ), carbon tetrafluoride (CF 4 ), oxygen (O 2 ), chlorine (
- the gate electrode 222 is formed by performing dry etching using a mixed gas prepared by adjusting the amount of Cl 2 ) or the like as an etching gas.
- Examples of the metal used for the gate electrode 222 include a low resistance metal such as tantalum (Ta), molybdenum (Mo), molybdenum tungsten (MoW), and aluminum (Al), and a high melting point metal having a flat surface and stable characteristics. It is done. Further, the gate electrode 222 may be a stacked body made of the plurality of materials.
- a SiN x film is formed as a second insulating film 213 on the entire surface of the substrate by PECVD.
- a SiON film, a TEOS film, or the like may be used.
- a thin cap film for example, a TEOS film having a thickness of about 50 nm is formed below the second insulating film 213. Etc. may be formed.
- first source / drain wiring 221 and the source region or drain region of the semiconductor layer 220 are electrically connected through contact holes formed in the first insulating film 212 and the second insulating film 213.
- an Al—Si alloy or the like may be used instead of Al.
- the gate electrode material (Ta, Mo, MoW, W, TaN, etc.) may be used.
- a third insulating film 214 made of silicon oxide is formed on the entire surface of the substrate using TEOS gas as a source gas.
- TEOS gas As the third insulating film 214, a SiON film, a TEOS film, or the like may be used. An organic insulating film may be used.
- External connection terminal forming step A metal film and an ITO film are formed on the third insulating film 214 in which the contact hole 218 is formed by sputtering or the like, and patterned into a desired shape by photolithography, and then external connection is performed.
- a metal film 216a and a transparent conductive film 216b constituting the terminal 216 are formed.
- the metal film 216a is not particularly limited, for example, a laminated film of an aluminum film and a molybdenum film is preferable.
- the aluminum film has high conductivity, it easily causes electrolytic corrosion. Therefore, by forming a molybdenum film as a barrier film on the aluminum film, corrosion of the aluminum film can be prevented.
- the external connection terminal is a laminated film of a metal film and a transparent conductive film, but is not particularly limited, and may be only a metal film.
- the anisotropic conductive film 217 is attached to the external connection terminal 216, and the FPC 219 having the external connection wiring 219a is attached to the anisotropic conductive film 217.
- a sealing material is formed on a circuit board and is bonded to, for example, a counter substrate on which a color filter or the like is formed.
- the sealing material is not particularly limited, and an ultraviolet curable resin, a thermosetting resin, or the like can be used. Thereafter, liquid crystal is sealed between the circuit board and the counter substrate to complete a liquid crystal display panel.
- a liquid crystal display device can be obtained by mounting a polarizing plate or the like on the liquid crystal display panel.
- the liquid crystal display device thus formed can prevent a connection failure between the external connection terminal and the wiring and reduce the area of the substrate used for the arrangement of the wiring, thereby reducing the display frame with a narrow frame. It can be.
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Abstract
Description
以下に本発明を詳述する。
本発明の回路基板における好ましい形態について以下に詳しく説明する。
図1は、実施形態1に係る回路基板の端部を示す平面模式図である。図2は、図1に示す回路基板を線分A-Bで分断したときの断面模式図である。実施形態1に係る回路基板は、液晶表示装置に用いられる表示装置用基板であり、図1及び図2中には図示されていないが、回路基板の内側には画素の駆動に用いられる薄膜トランジスタ、画素電極、ドライバ回路等が形成されている。
図3は、実施形態2に係る回路基板の端部を示す平面模式図である。図4は、図3に示す回路基板を線分C-Dで分断したときの断面模式図である。なお、実施形態2に係る回路基板において、配線、絶縁膜等の厚みについては実施形態1と同様である。
図5は、実施形態3に係る回路基板の端部を示す平面模式図である。図6は、図5に示す回路基板を線分E-Fで分断したときの断面模式図である。なお、実施形態3に係る回路基板において配線、絶縁膜等の厚みについては実施形態1と同様である。実施形態3に係る回路基板は、液晶表示装置に用いられる表示装置用基板であり、図5及び6中には図示されていないが、回路基板の内側には画素の駆動に用いられる薄膜トランジスタ、画素電極、ドライバ回路等が形成されている。
図7は、実施形態4に係る回路基板の端部を示す平面模式図である。実施形態4に係る回路基板は、図7に示すように、幅広部が設けられていない等の配線形状の違い、コンタクトホールの面積が異なること以外は、実質的に実施形態1と同様の構成である。
図8は、実施形態5に係る回路基板の端部を示す平面模式図である。実施形態5に係る回路基板は、図8に示すように、幅広部が設けられていない等の配線形状の違い、コンタクトホールの面積が異なること以外は、実質的に実施形態1と同様の構成である。実施形態5に係る回路基板は、平行して伸長する配線515が第三絶縁膜514に形成されたコンタクトホール518を介して外部接続端子516と接続されている。このとき、コンタクトホール518は、配線515の伸長方向に長い、長穴の形状(長方形状)である。このような形状であれば、コンタクトホールの一部が導電粒子により圧壊されたとしても、接続部分の全体が破壊されることはなく、接続不良を防止することができる。このときの長方形状の長径は3~20μmとされ、導電粒子の直径よりも大きくされる。なお、実施形態5では幅広部を形成していないが、配線515に幅広部を形成し、更にコンタクトホール518が長穴である形態であればより好ましい。
図9は、実施形態6に係る回路基板の端部を示す平面模式図である。実施形態6に係る回路基板は、図9に示すように、幅広部の形状等の配線形状の違い、コンタクトホールの面積が異なること以外は、実質的に実施形態1と同様の構成である。実施形態6に係る回路基板は、平行して伸長する配線615が第三絶縁膜614に形成されたコンタクトホール618を介して外部接続端子616と接続されている。このとき、配線615には、配線が伸長する方向(伸長方向)に対して両方の側方に突出した幅広部615aを有している。このとき、各コンタクトホール618の長軸の長さは4~9μmとされ、導電粒子617bの直径は、3~6μmとされ、コンタクトホール618の長軸の長さは、導電粒子617bの直径よりも大きくされる。これによれば、コンタクトホール618の長軸の長さが導電粒子617bの直径よりも大きいため、導電粒子617bによる断線を防止することができる。このとき、配線615の幅は、2~4μmとされ、幅広部615aの幅は3~6μmとされる。
図10は、比較形態1に係る回路基板の端部を示す平面模式図である。図11は、図10に示す回路基板の線分G-Hで分断したときの断面模式図である。
図11で示すように、比較形態1に係る回路基板の端部では、基板810上に第一絶縁膜813及び配線815が配置されている。配線815上には、第二絶縁膜814が配置され、その上には、金属から形成された外部接続端子816が配置されている。外部接続端子816は、第三絶縁膜814に形成されたコンタクトホール818を介して配線815に接続されている。
以下に、実施形態1~6に係る回路基板の製造方法ついて説明する。ここでは、図3及び4で示す実施形態2の回路基板を例にとって説明するが、実施形態1、3~6の回路基板についても、配線の形状、コンタクトホールの形状等を適宜変更すれば、同様の方法により製造することができる。
前処理した基板210上に、プラズマ化学気相成長(Plasma Enhanced Chemical Vapor Deposition:PECVD)法等によりSiON膜及びSiOx膜を成膜し、ベースコート膜211を形成する。SiON膜形成のための原料ガスとしては、モノシラン(SiH4)、亜酸化窒素ガス(N2O)及びアンモニア(NH3)の混合ガス等が挙げられる。なお、SiOx膜は、原料ガスとして正珪酸四エチル(Tetra Ethyl Ortho Silicate:TEOS)ガスを用いて形成されることが好ましい。また、ベースコート膜211には、原料ガスとしてモノシラン(SiH4)及びアンモニア(NH3)の混合ガス等を用いた窒化シリコン(SiNx)膜等を用いてもよい。
PECVD法により、アモルファスシリコン(a-Si)膜を形成する。a-Si膜形成の原料ガスとしては、例えば、SiH4、ジシラン(Si2H6)等が挙げられる。PECVD法により形成したa-Si膜には水素が含まれているため、約500℃でa-Si層中の水素濃度を低減する処理(脱水素処理)を行う。続いて、レーザアニールを行い、a-Si膜を溶融、冷却、固化させることにより、ポリシリコン(p-Si)膜とする。レーザアニールには、例えば、エキシマレーザを用いる。また、連続粒界結晶シリコン(CG-シリコン)化するため、脱水素処理せずに、金属触媒を塗布する処理を行ってもよい。p-Si膜の形成には、レーザアニールの前処理として、固相結晶化の熱処理を行ってもよい。次に、四フッ化炭素(CF4)ガスによるドライエッチングを行い、p-Si膜をパターニングし、半導体層220が形成される。なお、半導体層220には、後述する第一絶縁膜の形成工程後、又は、ゲート電極の形成工程後に、イオンドーピング法等を用いてソース領域、ドレイン領域、チャネル領域等を形成する。
次に、原料ガスとしてTEOSガスを用いて、酸化シリコンからなる第一絶縁膜(ゲート絶縁膜)212を形成する。第一絶縁膜212の材質は、特に限定されず、SiNx膜、SiON膜等を用いてもよい。SiNx膜及びSiON膜形成のための原料ガスとしては、ベースコート膜の形成工程で述べたものと同様の原料ガスが挙げられる。また、第一絶縁膜212は、上記複数の材料からなる積層体でもよい。
次に、スパッタリング法を用いて、窒化タンタル(TaN)膜、及び、タングステン(W)膜を成膜する。次に、フォトリソグラフィ法によりレジスト膜を所望の形状にパターン形成した後、アルゴン(Ar)、六フッ化硫黄(SF6)、四フッ化炭素(CF4)、酸素(O2)、塩素(Cl2)等の分量を調整して作製された混合ガスをエッチングガスとして用いてドライエッチングを行い、ゲート電極222を形成する。ゲート電極222に用いられる金属としては、タンタル(Ta)、モリブデン(Mo)、モリブデンタングステン(MoW)、アルミニウム(Al)等の低抵抗金属、表面が平坦で特性の安定した高融点金属等が挙げられる。また、ゲート電極222は、上記複数の材料からなる積層体であってもよい。
次に、基板の全面にPECVD法により、SiNx膜を第二絶縁膜213として形成する。第二絶縁膜213としては、SiON膜、TEOS膜等を用いてもよい。また、トランジェント劣化等を防止してTFT特性の信頼性向上、及び、電気特性の安定化を図るため、第二絶縁膜213の下の階層に膜厚50nm程度の薄いキャップ膜(例えば、TEOS膜等)を形成してもよい。
次に、フォトリソグラフィ法によりレジスト膜を所望の形状にパターン形成した後、フッ酸系のエッチング溶液を用いて第一絶縁膜212及び第二絶縁膜213のウェットエッチングを行い、ソース・ドレイン配線221と半導体層220とを接続するためのコンタクトホールを形成する。なお、エッチングには、ドライエッチングを用いてもよいし、ウェットエッチングとドライエッチングを組み合わせてもよい。
次に、スパッタ法等で、チタン(Ti)膜、アルミニウム(Al)膜、Ti膜をこの順で形成する。次に、フォトリソグラフィ法によりレジスト膜を所望の形状にパターン形成した後、ドライエッチングによりTi/Al/Tiの金属積層膜をパターニングし、第一ソース・ドレイン配線221を形成する。このとき、第一ソース・ドレイン配線221と半導体層220のソース領域又はドレイン領域とが第一絶縁膜212及び第二絶縁膜213に形成されるコンタクトホールを介して導通される。また、ソース・ドレイン配線221を構成する金属としては、Alに代えてAl-Si合金等を用いてもよい。なお、ここでは、配線の低抵抗化のためにAlを用いたが、高耐熱性が必要で抵抗値のある程度の増加が許される短い配線構造にする場合は、上述したゲート電極材料(Ta、Mo、MoW、W、TaN等)を用いてもよい。
次に、基板全面に、原料ガスとしてTEOSガスを用いて、酸化シリコンからなる第三絶縁膜214を形成する。第三絶縁膜214としては、SiON膜、TEOS膜等を用いてもよい。また、有機絶縁膜を用いてもよい。
次に、レジスト膜を基板全面に形成し、フォトリソグラフィ法によりレジスト膜を所望の形状にパターニング後、フッ酸系のエッチング溶液を用いて第三絶縁膜214のウェットエッチングを行い、外部接続端子216と配線215とを接続するためのコンタクトホール218を形成する。なお、エッチングには、ドライエッチングを用いてもよいし、レジスト膜の現像と第三絶縁膜214のエッチングとを一括して行ってもよい。
コンタクトホール218を形成した第三絶縁膜214上に、スパッタ法等によって、金属膜とITO膜を形成し、フォトリソグラフィ法によって所望の形状にパターニングし、外部接続端子216を構成する金属膜216a、透明導電膜216bを形成する。金属膜216aは特に限定されないが、例えば、アルミニウム膜とモリブデン膜の積層膜等が好ましい。アルミニウム膜は導電性が高いものであるが、電食を生じやすいものであるため、アルミニウム膜上にバリア膜のモリブデン膜を形成することによって、アルミニウム膜の腐食を防止することができる。また、通常、アルミニウム膜とモリブデン膜とは一括してパターニングすることとなるため、アルミニウム膜の端部を腐食から防止するために、ITO等の透明導電膜をその上から成膜し、端部を被覆する。これにより、腐食防止を図ることができる。また、透明導電膜216bは、表示装置において画素の駆動を行う画素電極と同一の工程で形成されることが好ましく、これにより、製造工程の簡略化を図ることができる。また、上述した実施形態1~6では外部接続端子を金属膜と透明導電膜との積層膜としているが、特に限定されるものではなく、金属膜のみであってもよい。
15a、16a、17a、18a、19a、20a、21a、115a、215a、315a、415a、515a、615a:幅広部
17b、117b、217b、317b、417b、517b、617b、817b:導電粒子
8、28a、28b、38a、38b、118、218、318、818:コンタクトホール
110、210、310、410、510、610、810:基板
111、211、311:ベースコート膜
112、212、312、812:第一絶縁膜
113、213、313、814:第二絶縁膜
114、214、314、414、514、614:第三絶縁膜
116、216、316、416、516、616、816:外部接続端子
116a、216a、316a:金属膜
116b、216b、316b:透明導電膜
117、217、317、417、517、617、817:異方性導電膜
117a、217a、317a、417a、517a、617a、817a:絶縁材料
119、219、319、819:FPC
119a、219a、319a、819a:外部接続配線
119b、219b、319b、819b:樹脂基板
220:半導体層
221:ソース・ドレイン配線
222:ゲート電極
Claims (11)
- 基板上に配線、絶縁膜及び外部接続端子がこの順に配置された回路基板であって、
該回路基板は、外部接続端子上に、導電粒子を含む異方性導電膜を備え、
該外部接続端子は、絶縁膜に形成された少なくとも1つのコンタクトホールを介して配線に接続され、
平面視したときに、特定の外部接続端子に接続する1以上のコンタクトホールが形成された領域の一端から他端までの長さは、導電粒子の直径よりも大きいことを特徴とする回路基板。 - 前記外部接続端子は、1つのコンタクトホールのみを介して配線に接続され、
平面視したときに、該コンタクトホールは、少なくとも一部で、導電粒子の直径よりも長い径を有することを特徴とする請求項1記載の回路基板。 - 前記外部接続端子は、複数のコンタクトホールを介して配線に接続され、
平面視したときに、該複数のコンタクトホールが形成された領域の一端から他端までの長さは、導電粒子の直径よりも大きいことを特徴とする請求項1記載の回路基板。 - 前記配線は、平面視したときに、その伸長方向に対して側方に突出した幅広部を有し、
前記コンタクトホールは、該幅広部に設けられていることを特徴とする請求項1~3のいずれかに記載の回路基板。 - 前記幅広部は、平面視したときに、前記配線の伸長方向に対して一方の側方のみに突出していることを特徴とする請求項4記載の回路基板。
- 前記回路基板は、平面視したときに、平行して伸長する2以上の配線と、その伸長方向に並ぶ2以上の外部接続端子を有し、
該2以上の配線は、回路基板の端部側に向かって突出した幅広部を有し、かつ端部側に配置された配線が、その隣り合う配線よりも伸長方向への長さが短いことを特徴とする請求項5記載の回路基板。 - 前記回路基板は、平面視したときに、平行して伸長する2以上の配線と、その伸長方向に並ぶ2以上の外部接続端子を有し、
該2以上の配線は、回路基板の内側に向かって突出した幅広部を有し、かつ内側に配置された配線が、その隣り合う配線よりも伸長方向への長さが短いことを特徴とする請求項5記載の回路基板。 - 前記2以上の配線は、異なる面積のコンタクトホールで外部接続端子に接続されていることを特徴とする請求項6又は7記載の回路基板。
- 前記2以上の配線は、配線長が長いほど面積の大きいコンタクトホールに接続されていることを特徴とする請求項8記載の回路基板。
- 請求項1~9のいずれかに記載の回路基板を備えることを特徴とする表示パネル。
- 請求項10記載の表示パネルを備えることを特徴とする表示装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/127,314 US20110205716A1 (en) | 2008-11-19 | 2008-07-01 | Circuit substrate, display panel and display device |
RU2011124958/28A RU2483389C2 (ru) | 2008-11-19 | 2009-07-01 | Подложка схемы, дисплейная панель и дисплейное устройство |
BRPI0921573A BRPI0921573A2 (pt) | 2008-11-19 | 2009-07-01 | substrato de circuito, painel de exibição e dispositivo de exibição |
JP2010539165A JP5043202B2 (ja) | 2008-11-19 | 2009-07-01 | 回路基板、表示パネル及び表示装置 |
CN200980143641.XA CN102203840A (zh) | 2008-11-19 | 2009-07-01 | 电路基板、显示面板和显示装置 |
EP09827400.4A EP2360661B1 (en) | 2008-11-19 | 2009-07-01 | Circuit substrate, display panel, and display device |
Applications Claiming Priority (2)
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JP2008296055 | 2008-11-19 | ||
JP2008-296055 | 2008-11-19 |
Publications (1)
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WO2010058619A1 true WO2010058619A1 (ja) | 2010-05-27 |
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Family Applications (1)
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PCT/JP2009/062060 WO2010058619A1 (ja) | 2008-11-19 | 2009-07-01 | 回路基板、表示パネル及び表示装置 |
Country Status (7)
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US (1) | US20110205716A1 (ja) |
EP (1) | EP2360661B1 (ja) |
JP (1) | JP5043202B2 (ja) |
CN (1) | CN102203840A (ja) |
BR (1) | BRPI0921573A2 (ja) |
RU (1) | RU2483389C2 (ja) |
WO (1) | WO2010058619A1 (ja) |
Cited By (5)
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US8698000B2 (en) | 2008-12-05 | 2014-04-15 | Sharp Kabushiki Kaisha | Substrate for display device and display device |
KR20140087499A (ko) * | 2012-12-31 | 2014-07-09 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 |
US8780310B2 (en) | 2008-11-26 | 2014-07-15 | Sharp Kabushiki Kaisha | Display device having higher-layer wiring that does not overlap connection portion |
JP2019086628A (ja) * | 2017-11-06 | 2019-06-06 | 株式会社ジャパンディスプレイ | 表示装置 |
CN112640100A (zh) * | 2018-09-03 | 2021-04-09 | 株式会社自动网络技术研究所 | 电路结构体及电气连接箱 |
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WO2013047661A1 (ja) * | 2011-09-30 | 2013-04-04 | 京セラ株式会社 | 表示装置 |
KR101980766B1 (ko) * | 2012-12-27 | 2019-05-21 | 엘지디스플레이 주식회사 | 터치 패널 내장형 유기 발광 다이오드 표시 장치 |
JP6299445B2 (ja) * | 2014-06-04 | 2018-03-28 | 日立金属株式会社 | コネクタ付きケーブル及びコネクタ |
CN104142588B (zh) * | 2014-07-30 | 2017-01-25 | 深圳市华星光电技术有限公司 | 液晶显示面板以及液晶显示器 |
US9429801B2 (en) * | 2014-07-30 | 2016-08-30 | Shenzhen China Star Optoelectronics Technology Co., Ltd | LCD panel and LCD device |
CN104979326B (zh) * | 2015-07-09 | 2017-12-05 | 深圳市晶泓科技有限公司 | Led发光组件、led发光面板和led显示屏 |
TWI735455B (zh) * | 2015-08-10 | 2021-08-11 | 南韓商東友精細化工有限公司 | 電極連接單元及包括其的電裝置 |
KR102482822B1 (ko) | 2017-10-24 | 2022-12-30 | 삼성디스플레이 주식회사 | 표시 장치 |
CN107658320B (zh) * | 2017-10-26 | 2021-01-15 | 京东方科技集团股份有限公司 | 功能面板及其制造方法、显示装置 |
CN111480088B (zh) * | 2017-12-28 | 2022-05-27 | 株式会社高迎科技 | 检查插入于基板的多个引脚的插入状态的方法及基板检查装置 |
KR102089474B1 (ko) | 2017-12-28 | 2020-03-17 | 주식회사 고영테크놀러지 | 기판에 삽입된 복수의 핀의 삽입 상태를 검사하는 방법 및 기판 검사 장치 |
TWI653748B (zh) * | 2018-03-02 | 2019-03-11 | 友達光電股份有限公司 | 陣列基板 |
JP7547866B2 (ja) * | 2020-08-26 | 2024-09-10 | セイコーエプソン株式会社 | 電気光学装置、及び電子機器 |
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- 2009-07-01 JP JP2010539165A patent/JP5043202B2/ja not_active Expired - Fee Related
- 2009-07-01 CN CN200980143641.XA patent/CN102203840A/zh active Pending
- 2009-07-01 EP EP09827400.4A patent/EP2360661B1/en not_active Not-in-force
- 2009-07-01 RU RU2011124958/28A patent/RU2483389C2/ru not_active IP Right Cessation
- 2009-07-01 WO PCT/JP2009/062060 patent/WO2010058619A1/ja active Application Filing
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8780310B2 (en) | 2008-11-26 | 2014-07-15 | Sharp Kabushiki Kaisha | Display device having higher-layer wiring that does not overlap connection portion |
US8698000B2 (en) | 2008-12-05 | 2014-04-15 | Sharp Kabushiki Kaisha | Substrate for display device and display device |
KR20140087499A (ko) * | 2012-12-31 | 2014-07-09 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 |
KR102000052B1 (ko) | 2012-12-31 | 2019-07-15 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 |
JP2019086628A (ja) * | 2017-11-06 | 2019-06-06 | 株式会社ジャパンディスプレイ | 表示装置 |
CN112640100A (zh) * | 2018-09-03 | 2021-04-09 | 株式会社自动网络技术研究所 | 电路结构体及电气连接箱 |
Also Published As
Publication number | Publication date |
---|---|
BRPI0921573A2 (pt) | 2016-02-10 |
US20110205716A1 (en) | 2011-08-25 |
RU2011124958A (ru) | 2012-12-27 |
JPWO2010058619A1 (ja) | 2012-04-19 |
EP2360661A1 (en) | 2011-08-24 |
EP2360661A4 (en) | 2013-01-02 |
EP2360661B1 (en) | 2014-01-08 |
CN102203840A (zh) | 2011-09-28 |
RU2483389C2 (ru) | 2013-05-27 |
JP5043202B2 (ja) | 2012-10-10 |
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