CN104979326B - Led发光组件、led发光面板和led显示屏 - Google Patents

Led发光组件、led发光面板和led显示屏 Download PDF

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CN104979326B
CN104979326B CN201510400412.9A CN201510400412A CN104979326B CN 104979326 B CN104979326 B CN 104979326B CN 201510400412 A CN201510400412 A CN 201510400412A CN 104979326 B CN104979326 B CN 104979326B
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led
driving
blind hole
composite bed
led chip
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CN104979326A (zh
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林谊
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Shenzhen Jinghong Technology Co ltd
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SHENZHEN JINGHONG TECHNOLOGY Co Ltd
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Priority to RU2018104444A priority patent/RU2680257C1/ru
Priority to PCT/CN2016/098611 priority patent/WO2017005225A2/zh
Priority to US15/743,137 priority patent/US10388638B2/en
Priority to JP2018520014A priority patent/JP6533624B2/ja
Priority to EP16820876.7A priority patent/EP3321961A4/en
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Abstract

本发明公开了LED发光组件、LED发光面板和LED显示屏。该LED发光组件包括一复合层、至少一个包含LED芯片的LED芯片组、至少一个驱动IC；复合层包括一位于前侧的基板；LED芯片和驱动IC均安装于复合层的前侧，LED芯片的负极通过打金线绑定(bonding)方式与驱动IC相连；复合层的前侧开设有多个盲孔，LED芯片的正极过一个盲孔从复合层内部接入正电极；驱动IC的VDD引脚引出导线过一个盲孔从复合层内部接入正电极；驱动IC的GND引脚引出导线过一个盲孔从复合层内部接入负电极；驱动IC之间由信号线连接。本方案实现了一种全透明的LED显示屏，透明度和像素密度都得到大幅度提高。

Description

LED发光组件、LED发光面板和LED显示屏
技术领域
本发明涉及LED显示领域，尤其涉及LED发光组件、LED发光面板和LED显示屏。
背景技术
透明LED显示屏因为通透不阻挡视线及其独特的显示效果，越来越受到市场的青睐，在商场、机场、银行、奢侈品店等高端场合应用越来越广，但是，由于LED显示屏内部控制电路极其复杂，要做到良好的通透效果，既要保证最基本的逻辑电路以驱动所有的LED灯正常工作，又要尽最大限度减少硬件对视线的阻挡，这些硬件包括结构件、电路板、塑料套件以及驱动IC、LED灯等电子元器件，因此，LED显示屏的像素密度越高，其通透效果就越难实现，例如，LED灯正常的封装尺寸就有SMD3535(外型尺寸3.5mm×3.5mm)，SMD3528(外型尺寸3.5mm×2.8mm)，SMD2121(外型尺寸2.1mm×2.1mm)；LED显示屏驱动IC最小封装尺寸也有4mm×4mm，加上复杂的逻辑电路相互连接，基本上无法实现像素间距5mm以下的透明LED显示屏。
目前市场上透明LED显示屏的像素间距一般在10mm以上，也有达到8mm间距的，但是通透度并不理想。如申请号为CN200610164506.1的发明，使用了透明导电膜技术，具有很高的透明度，但是因为透明导电膜阻抗大、压降大的弱点，此材质不能像普通铜箔电路板一样在平面上形成细小的线路，没法在有限的尺寸范围容纳复杂的电路图形，因此只能将LED芯片的间距做得很大，实现简单的亮化及显示简单字符的功能。再如申请号为CN201310011178的发明所揭示的一种透明LED显示屏，因为将驱动IC设置在水平放置的LED灯条上，可以容纳复杂的逻辑电路，其像素间距可达到5-8mm，但是像素间距为5mm以下时，其通透度已经很低，失去了透明LED显示屏的意义。
发明内容
本发明提供了LED发光组件、LED发光面板和LED显示屏，其通过设置复合层，在复合层内布局导电层和绝缘层，将LED芯片和驱动IC安装于复合层的前侧，LED芯片和驱动IC近距离排列，LED芯片和驱动IC主要通过直接的金线绑定方式进行近距离连接，极大的减少了复杂的电路图形层，在复合层上实现了LED芯片和驱动IC的高密度安装，实现了显示细腻的LED显示屏，同时由于未封装的LED芯片和驱动IC尺寸极小，肉眼难以察觉，从而实现了一种透明度极高的LED显示屏。
为实现上述设计，本发明采用以下技术方案：
一方面采用LED发光组件，包括一复合层、至少一个包含LED芯片的LED芯片组、至少一个驱动IC；所述复合层包括一位于前侧的基板；
所述LED芯片和驱动IC均安装于所述复合层的前侧，所述LED芯片的负极引出导线与所述驱动IC相连；所述复合层的前侧开设有多个盲孔，所述LED芯片的正极过一个所述盲孔从复合层内部接入正电极；所述驱动IC的VDD引脚引出导线过一个所述盲孔从复合层内部接入正电极；所述驱动IC的GND引脚引出导线过一个所述盲孔从复合层内部接入负电极；所述驱动IC之间由信号线连接。
另一方面采用一种LED发光面板，包括至少两个前述的LED发光组件。
最后采用一种LED显示屏，包括前述的LED发光面板。
本发明的有益效果为：通过设置复合层，在复合层内布局导电层和绝缘层，将LED芯片和驱动IC安装于复合层的前侧，LED芯片和驱动IC主要通过复合层内部的导电层取电，由绝缘体实现各导电层之间的绝缘，同时，驱动IC和LED芯片之间近距离排列安装，通过金线绑定方式短距离直接连接，减少了驱动IC和LED芯片复杂的电路连接，在复合层上实现了LED芯片和驱动IC的高密度安装，实现了显示细腻的LED显示屏。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对本发明实施例描述中所需要使用的附图作简单的介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据本发明实施例的内容和这些附图获得其他的附图。
图1是本发明具体实施方式中提供的LED发光组件的第一实施例的主视图。
图2是本发明具体实施方式中提供的LED发光组件的第二实施例的主视图。
图3是本发明具体实施方式中提供的LED发光组件的第二实施例的电极分布示意图。
图4是是本发明具体实施方式中提供的LED发光组件的第三实施例的内部结构示意图。
图5是本发明具体实施方式中提供的LED发光组件的第四实施例的主视图。
图6是本发明具体实施方式中提供的LED发光组件的第四实施例的内部结构示意图。
图7是本发明具体实施方式中提供的LED发光组件的第五实施例的内部结构示意图。
图8是本发明具体实施方式中提供的LED发光组件的信号线的走线示意图。
图9是本发明具体实施方式中提供的LED发光面板的结构示意图。
其中：10-复合层；11-基板；12-电极层；121-正电极；122-负电极；13-第一绝缘层；14-第三绝缘层；15-第二绝缘层；16-信号线路层；20-驱动IC；21-信号引脚；22-信号线；30-LED芯片；31-导线；40-焊盘；
具体实施方式
为使本发明解决的技术问题、采用的技术方案和达到的技术效果更加清楚，下面将结合附图对本发明实施例的技术方案作进一步的详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
第一实施例
请参考图1，其是本发明具体实施方式中提供的LED发光组件的第一实施例的主视图。如图所示，该LED发光组件，包括一复合层10、至少一个包含LED芯片30的LED芯片组、至少一个驱动IC 20；所述复合层10包括一位于前侧的基板11；
所述LED芯片30和驱动IC 20均安装于所述复合层10的前侧，所述LED芯片30的负极引出导线31与所述驱动IC 20相连；所述复合层10的前侧开设有多个盲孔，所述LED芯片30的正极过一个所述盲孔从复合层10内部接入正电极121；所述驱动IC 20的VDD引脚引出导线31过一个所述盲孔从复合层10内部接入正电极121；所述驱动IC 20的GND引脚引出导线31过一个所述盲孔从复合层10内部接入负电极122；所述驱动IC 20之间由信号线22连接。
本方案中所描述的前侧是指发光时光线传播的方向所在的一侧，以发光的方向作为本方案描述时的前后参考。
本方案中的一个驱动IC 20可以对应一个LED芯片组，LED芯片组和驱动IC 20分行间隔排列。这种排列方式的组织结构和连接关系都比较简单，在此不做重点阐述。
在本方案中，LED芯片组一般都呈阵列分布，且相邻两行之间的距离和相邻两列之间的距离相等。可以由2×1个、2×2个或2×3个LED芯片组组成一个发光组，每个发光组对应一个驱动IC 20，驱动IC 20设置于发光组的平面中心。本方案中的实施例进行描述时，主要基于2×2的发光组布局方式。
所述复合层10为透明复合层10。复合层10包括多层绝缘或导电的透明材料组成的分层，绝缘的透明材料例如PET、PVC、PC、PE、亚克力等材料；导电的透明材料例如压克力导电透明胶、铟锡氧化物(Indium Tin Oxide,ITO)及铟锌氧化物(Indium Zinc Oxide,IZO)。导电的透明材料一般依附于相邻的绝缘层表面。
通过设置透明复合层10，在透明复合层10内布局透明导电体和透明绝缘体，将LED芯片30和驱动IC 20安装于透明复合层10的前侧，LED芯片30和驱动IC 20主要通过透明复合层10内部的透明导电体连接，由透明绝缘体实现各层透明导电体之间的绝缘，在透明复合层10上实现了LED芯片30和驱动IC 20之外区域的全透明效果，进而提供了一种可以实现像素间距5mm以下，透明度90％以上的LED显示屏。
本方案中的实施例进行描述时，主要基于透明复合层10的实现方式。
在常规的LED显示技术中，每个像素点设置一个或多个LED灯完成预定图像的显示，而LED灯本身的大小决定了现有技术制作的LED显示屏的像素点很大，显示效果不够细腻，且因为LED灯本身的阻挡无法实现高透光率。在本方案中，每个像素点的实现基础不是封装好的LED灯，而是极小的LED芯片30，在当前技术水平下，LED芯片30可以做到0.15mm×0.15mm的尺寸，可以实现细腻的像素输出。同时，采用未封装的裸晶片作为驱动IC 20，其外型尺寸一般在2mm X 2mm以下，远看人眼难以察觉，从而进一步提高透光率。在图1所示的方案的中，每个像素点设置有一个LED芯片30，可以实现最简单的LED显示，其中的LED芯片30的发光颜色为红、绿、蓝或白色，单色发光的LED常用于显示内容比较简单的公告牌等。
在本实施例中，LED芯片30和驱动IC 20的供电通过设置于复合层10内部的透明导电体实现；LED芯片30和驱动IC 20之间、驱动IC 20和驱动IC 20之间的信号传输通过复合层10前侧的信号线22实现。
所述LED芯片30和驱动IC 20通过COB或COG工艺安装于所述基板11上。
所述基板11的前侧覆盖有透明封胶，透明封胶一般采用聚胺脂、环氧树脂、聚乙烯乙酸乙烯酯、聚乙烯醋酸乙烯酯等其中的一种材料。
COB工艺、COG工艺以及封胶工艺在现有技术中多有实现，在此不做进一步说明。
综上所述，通过设置复合层10，在复合层10内布局导电层和绝缘层，将LED芯片30和驱动IC 20安装于复合层10的前侧，LED芯片30和驱动IC 20实现直接连接，避免了普通LED显示屏驱动IC 20通过2层或多层电路板复杂线路与LED芯片30连接的方式，使驱动IC20以最直接、最短程的方式对LED芯片30实现控制，从而在复合层10上实现了LED芯片30和驱动IC 20的高密度安装，同时由于LED芯片30和驱动IC 20采取没有封装的形式，以COB或COG的方式直接安装在透明复合层10上，因其尺寸极小，肉眼难以分辨，同时又可以密集安装，从而实现了极高的透明度和高密度细腻的显示效果。
第二实施例
请参考图2和图3，其分别是本发明具体实施方式中提供的LED发光组件的第二实施例的主视图和电极分布示意图。如图2所示，LED芯片组包括R-LED芯片、G-LED芯片和B-LED芯片。
三种LED芯片30的设置可以提供丰富的色彩变化，实现彩色图像的显示。
在本实施例中，所述复合层10还包括依次设置于所述基板11的后侧的电极层和绝缘层；
所述电极层设置有正电极121和负电极122，所述基板11开设有抵达所述正电极121或负电极122的多个盲孔。
为实现驱动IC 20和LED芯片30的工作，需要正电极121和负电极122供电。如图3所示，电极层不是完全覆盖于基板11的后侧，而是在基板11和绝缘层之间设置了两个独立的电极(正电极121和负电极122)，正电极121和负电极122可以视为处于同一层，但是两者独立工作。透明导电体制作得到的电极层的厚度极小，为了降低供电过程中的线路电阻，电极层的宽度一般会设置得比较大，如果有必要，可以让每个电极层的宽度接近基板11的宽度的一半。
在图3中，基板11开设的盲孔抵达正电极121和负电极122，驱动IC 20的两个电源引脚分别从盲孔接入正电极121和负电极122；当然，LED芯片30的正极也是通过盲孔接入正电极121。
对于驱动IC 20与LED芯片30和内部的连接关系而言，为了保证连接效果，盲孔底部都设置有焊盘40，相当于都是通过焊盘40接入到对应的导电层。导线31和信号线22均为绑定方式打的金线。金线是直径极小，肉眼不可见的线，LED芯片30和驱动IC 20之间、LED芯片30和复合层10内部、驱动IC 20和复合层10内部均通过金线连接。
第三实施例
请参考图4，其是本发明具体实施方式中提供的LED发光组件的第三实施例的内部结构示意图。本实施例中的内部结构示意图主要基于第二实施例图2中LED芯片组的布局方式实现。如图4所示，所述复合层10还包括依次设置于所述基板11的后侧的第一电极层、第一绝缘层13、第二电极层和第二绝缘层15；所述第一电极层和第二电极层中的一个设置为正电极121，另一个设置为负电极122；所述盲孔包括贯穿所述基板11抵达正电极121的第一盲孔、贯穿所述基板11抵达负电极122的第二盲孔；所述LED芯片30的正极引出导线31过所述第一盲孔与所述正电极121相连；所述驱动IC 20的VDD引脚引出导线31过所述第一盲孔与所述正电极121相连，所述驱动IC 20的GND引脚引出导线31过所述第二盲孔与所述负电极122相连。
需要说明的是，图4并不是图2中某个位置的剖面图，仅仅是第二实施例中所示方案的内部结构的示意图，重点在于盲孔的深度及对应的导电层与驱动IC 20或LED芯片30的连接方式。在本方案中，所有与复合层10内部的连接均通过焊盘40实现。在图4所示的方案中，第一电极层设置为正电极121，第二电极层设置为负电极122；两者也可以进行互换，即第一电极层设置为负电极122；第二电极层设置为正电极121。
第四实施例
请参考图5和图6，其分别是本发明具体实施方式中提供的第四实施例的主视图和内部结构示意图。如图5所示，每5个LED芯片组组成一个发光组，每一个发光组对应一个驱动IC 20，每个发光组位于相邻两行，其中一行为2个LED芯片组，另一行为3个LED芯片组，所述驱动IC 20设置于所述相邻两行之间。
一个驱动IC 20驱动5组3个一组的LED芯片组，相邻两个驱动IC 20带载的LED如图5位置交错，这种驱动方式的实际意义在于，常用的驱动IC 20是16个输出通道驱动LED芯片30，如果是5组LED芯片组刚好是15个，如果驱动2×3的LED芯片组，那就需要18个通道，16个通道不够用。当然，如果需要驱动2×3的LED芯片组，是可以制作出有18通道的驱动IC 20的。
在本实施例中的驱动IC-LED芯片组的布局中(包括2+3的布局和2×3的布局)，驱动IC 20只有一个相对的方向便于信号线22的走线，当多个本实施例中的LED发光组件组成一个大的LED发光面板时，只能往水平或竖直方向延伸，往另一方向延伸则会受制于该方向上的LED芯片组。对于这一情况针对性地提出了如图6所示的内部结构并进行走线。
如图6所示，所述复合层10还包括依次设置于所述基板11的后侧的第一电极层、第一绝缘层13、第二电极层和第二绝缘层15；所述第一电极层和第二电极层中的一个设置为正电极121，另一个设置为负电极122；所述盲孔包括贯穿所述基板11抵达正电极121的第一盲孔、贯穿所述基板11抵达负电极122的第二盲孔；所述LED芯片30的正极引出导线31过所述第一盲孔与所述正电极121相连；所述驱动IC 20的VDD引脚引出导线31过所述第一盲孔与所述正电极121相连，所述驱动IC 20的GND引脚引出导线31过所述第二盲孔与所述负电极122相连；还包括第三绝缘层14和通过所述第三绝缘层14与所述第一电极层或第二电极层实现绝缘的信号线路层16；所述盲孔包括贯穿所述基板11抵达所述信号线路层16的第三盲孔；所述信号线22为设置于所述信号线路层16的信号图形层，所述驱动IC 20的信号引脚21引出导线31过所述第三盲孔连接到所述信号图形层。
信号线22设置于复合层10内部时，只有薄薄的一层透明导电膜，为了降低电阻，会拉宽信号线22的宽度形成信号图形层。
因为驱动IC 20的信号线22至少有两条，对应的，可以设置至少2层所述信号线路层16和至少2层所述第三绝缘层14。每一条信号线22形成一信号线路层16，通过一第三绝缘层14与其它导电层绝缘。
在实际的排布方案中，正电极121、负电极122以及两个信号线路层16没有绝对意义上的前后顺序，只需要通过各个绝缘层实现各自之间的绝缘，通过盲孔与对应的部件相连即可。
当然，第二实施例中的LED芯片的布局方式或其它未详细描述的LED芯片的布局方式均可通过内置的信号线路层实现信号的传输。
第五实施例
请参考图7，其是本发明具体实施方式中提供的第五实施例的内部结构示意图。如图所示，R-LED芯片通过银浆固晶安装于所述第一盲孔对应的第一焊盘40上；所述G-LED芯片和B-LED芯片通过绝缘胶水固晶安装于所述第一盲孔对应的第一焊盘40上。
因为焊盘40和LED芯片30都是不透明的，将LED芯片30安装于焊盘40上能够进一步提高透光率，不透明的焊盘40还可阻挡LED芯片30透过复合层10向屏幕后侧发光，本方案应用于建筑上时，可有效消除屏幕发光对室内的影响。同时焊盘40作为一种金属材料制成的结构组件也能够为LED芯片30起到更好的散热效果。
需要说明的是，LED芯片30设置于焊盘40上的方式并不是某一LED芯片30的布局方式中的特定实现方式，对于任何布局方式中的盲孔，都可将LED芯片30设置于对应的焊盘实现本实施例中的设计效果。
整体而言，为了方便后续组装，LED发光组件最好安装尽可能多的LED芯片组，如图8所示，驱动IC 20通过之字形连接形成前后相连的单向信号链路，实现图像数据的传输和显示。
本实施例中还提供了LED发光面板，包括至少两个前述的LED发光组件，所述LED发光组件顺序排列。排列如图9所示。
每个LED发光组件之间通过之字形连接形成前后相连的单向信号链路。也可让每个LED发光组件接入信号总线实现信号接入。
最后，还提供了LED显示屏，设置有如图9所示的LED发光面板。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。

Claims (18)

1.一种LED发光组件，其特征在于，包括一复合层(10)、至少一个包含LED芯片(30)的LED芯片组、至少一个驱动IC(20)；所述复合层(10)包括一位于前侧的基板(11)；
所述LED芯片(30)和驱动IC(20)均安装于所述复合层(10)的前侧，所述LED芯片(30)的负极引出导线(31)与所述驱动IC(20)相连；所述复合层(10)的前侧开设有多个盲孔，所述LED芯片(30)的正极穿过一个所述盲孔从复合层(10)内部接入正电极(121)；所述驱动IC(20)的VDD引脚引出导线(31)穿过一个所述盲孔从复合层(10)内部接入正电极(121)；所述驱动IC(20)的GND引脚引出导线(31)穿过一个所述盲孔从复合层(10)内部接入负电极(122)；所述驱动IC(20)之间由信号线(22)连接。
2.根据权利要求1所述的LED发光组件，其特征在于，所述复合层(10)为透明复合层。
3.根据权利要求2所述的LED发光组件，其特征在于，每个所述LED芯片组对应一个驱动IC(20)，所述LED芯片组和驱动IC(20)分行间隔排列。
4.根据权利要求2所述的LED发光组件，其特征在于，包括多个呈阵列分布的LED芯片组。
5.根据权利要求4所述的LED发光组件，其特征在于，每2×1个、2×2个或2×3个LED芯片组组成一个发光组，每一个发光组对应一个驱动IC(20)，所述驱动IC(20)设置于所述发光组的平面中心。
6.根据权利要求4所述的LED发光组件，其特征在于，每5个LED芯片组组成一个发光组，每一个发光组对应一个驱动IC(20)，每个发光组位于相邻两行，其中一行为2个LED芯片组，另一行为3个LED芯片组，所述驱动IC(20)设置于所述相邻两行之间。
7.根据权利要求1-6任意一项所述的LED发光组件，其特征在于，所述驱动IC(20)为未封装的裸晶片。
8.根据权利要求1-6任意一项所述的LED发光组件，其特征在于，所述导线(31)和信号线(22)均为绑定方式打的金线。
9.根据权利要求1-6任意一项所述的LED发光组件，其特征在于，所述复合层(10)还包括依次设置于所述基板(11)后侧的电极层和第二绝缘层(15)；
所述电极层设置有正电极(121)和负电极(122)，所述基板(11)开设有抵达所述正电极(121)或负电极(122)的多个盲孔。
10.根据权利要求1-6任意一项所述的LED发光组件，其特征在于，所述复合层(10)还包括依次设置于所述基板(11)后侧的第一电极层、第一绝缘层(13)、第二电极层和第二绝缘层(15)；所述第一电极层和第二电极层中的一个设置为正电极(121)，另一个设置为负电极(122)；所述盲孔包括贯穿所述基板(11)抵达正电极(121)的第一盲孔、贯穿所述基板(11)抵达负电极(122)的第二盲孔；所述LED芯片(30)的正极引出导线(31)穿过所述第一盲孔与所述正电极(121)相连；所述驱动IC(20)的VDD引脚引出导线(31)穿过所述第一盲孔与所述正电极(121)相连，所述驱动IC(20)的GND引脚引出导线(31)穿过所述第二盲孔与所述负电极(122)相连。
11.根据权利要求1-6任意一项所述的LED发光组件，其特征在于，所述复合层(10)还包括依次设置于所述基板(11)后侧的第一电极层、第一绝缘层(13)、第二电极层和第二绝缘层(15)；所述第一电极层和第二电极层中的一个设置为正电极(121)，另一个设置为负电极(122)；所述盲孔包括贯穿所述基板(11)抵达正电极(121)的第一盲孔和贯穿所述基板(11)抵达负电极(122)的第二盲孔；所述LED芯片(30)的正极引出的导线(31)穿过所述第一盲孔与所述正电极(121)相连；所述驱动IC(20)的VDD引脚引出的导线(31)穿过所述第一盲孔与所述正电极(121)相连，所述驱动IC(20)的GND引脚引出的导线(31)穿过所述第二盲孔与所述负电极(122)相连；还包括第三绝缘层(14)和通过所述第三绝缘层(14)与所述第一电极层或第二电极层实现绝缘的信号线路层(16)；所述盲孔包括贯穿所述基板(11)抵达所述信号线路层(16)的第三盲孔；所述信号线(22)为设置于所述信号线路层(16)的信号图形层，所述驱动IC(20)的信号引脚(21)引出导线(31)穿过所述第三盲孔连接到所述信号图形层。
12.根据权利要求11所述的LED发光组件，其特征在于，所述复合层(10)包括至少2层所述信号线路层(16)和至少2层所述第三绝缘层(14)。
13.根据权利要求11所述的LED发光组件，其特征在于，所述盲孔底部设置有焊盘(40)，所述导线(31)通过所述焊盘(40)与所述复合层(10)电性连接。
14.根据权利要求13所述的LED发光组件，其特征在于，一个所述LED芯片组包括R-LED芯片、G-LED芯片和B-LED芯片。
15.根据权利要求14所述的LED发光组件，其特征在于，所述R-LED芯片通过银浆固晶安装于所述第一盲孔对应的第一焊盘上；所述G-LED芯片和B-LED芯片通过绝缘胶水固晶安装于所述第一盲孔对应的第一焊盘上。
16.根据权利要求1所述的LED发光组件，其特征在于，所述LED芯片(30)和驱动IC(20)通过COB或COG工艺安装于所述基板(11)上，所述基板(11)的前侧覆盖有透明封胶。
17.一种LED发光面板，其特征在于，包括至少两个如权利要求1-16任意一项所述的LED发光组件。
18.一种LED显示屏，其特征在于，包括如权利要求17所述的LED发光面板。
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