JP6533624B2 - Led発光ユニット、led発光パネル及びledディスプレイスクリーン - Google Patents
Led発光ユニット、led発光パネル及びledディスプレイスクリーン Download PDFInfo
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- JP6533624B2 JP6533624B2 JP2018520014A JP2018520014A JP6533624B2 JP 6533624 B2 JP6533624 B2 JP 6533624B2 JP 2018520014 A JP2018520014 A JP 2018520014A JP 2018520014 A JP2018520014 A JP 2018520014A JP 6533624 B2 JP6533624 B2 JP 6533624B2
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Description
前記LEDチップ及び駆動ICがいずれも前記複合層の前側に実装され、前記LEDチップの負極引出リード線が前記駆動ICに接続され、前記複合層の前側に複数のブラインドホールが開設され、前記LEDチップの正極が1つの前記ブラインドホールを介して複合層の内部から正電極に接続され、前記駆動ICのVDDピン引出リード線が1つの前記ブラインドホールを介して複合層の内部から前記正電極に接続され、前記駆動ICのGNDピン引出リード線が1つの前記ブラインドホールを介して複合層の内部から負電極に接続され、前記駆動ICが信号線に接続され、前記信号線は前記駆動ICの信号伝送用のものであり、
前記LEDチップの負極引出リード線、前記駆動ICのVDDピン引出リード線、前記駆動ICのGNDピン引出リード線、及び前記信号線はいずれもボンディングされるゴールドワイヤーである。
図1は本開示の実施形態に係るLED発光ユニットの第1の実施例の正面図である。図1に示すように、該LED発光ユニットは、複合層10と、LEDチップ30を含む少なくとも1つのLEDチップセットと、少なくとも1つの駆動IC20とを含み、前記複合層10は前側に位置する基板11を含み、
前記LEDチップ30及び駆動IC20がいずれも前記複合層10の前側に実装され、前記LEDチップ30の負極引出リード線31が前記駆動IC20に接続され、前記複合層10の前側に複数のブラインドホールが開設され、前記LEDチップ30の正極が1つの前記ブラインドホールを介して複合層10の内部から正電極121に接続され、前記駆動IC20のVDDピン引出リード線31が1つの前記ブラインドホールを介して複合層10の内部から正電極121に接続され、前記駆動IC20のGNDピン引出リード線31が1つの前記ブラインドホールを介して複合層10の内部から負電極122に接続され、前記駆動IC20同士が信号線22を介して接続される。
図2及び図3はそれぞれ本開示の実施形態に係るLED発光ユニットの第2の実施例の正面図及び電極分布模式図である。図2に示すように、LEDチップセットはR−LEDチップ、G−LEDチップ及びB−LEDチップを含む。
前記電極層に正電極121及び負電極122が設置され、前記基板11に前記正電極121又は負電極122に到達する複数のブラインドホールが開設される。
図4は、本開示の実施形態に係るLED発光ユニットの第3の実施例の内部構造模式図である。本実施例の内部構造模式図は第2の実施例の図2のLEDチップセットのレイアウト方式に基づいて実現されるものである。図4に示すように、前記複合層10は、前記基板11の後側に順に設置された第1の電極層、第1の絶縁層13、第2の電極層及び第2の絶縁層15をさらに含み、前記第1の電極層と第2の電極層のうちの一方が正電極121として設置され、他方が負電極122として設置され、前記ブラインドホールは、前記基板11を貫通して正電極121に到達する第1のブラインドホールと、前記基板11を貫通して負電極122に到達する第2のブラインドホールとを含み、前記LEDチップ30の正極引出リード線31が前記第1のブラインドホールを介して前記正電極121に接続され、前記駆動IC20のVDDピン引出リード線31が前記第1のブラインドホールを介して前記正電極121に接続され、前記駆動IC20のGNDピン引出リード線31が前記第2のブラインドホールを介して前記負電極122に接続される。
図5及び図6は、それぞれ本開示の実施形態に係る第4の実施例の正面図及び内部構造模式図である。図5に示すように、5個のLEDチップセットが1つの発光セットを構成し、各発光セットが1つの駆動IC20に対応し、各発光セットが隣接する2行に位置し、一方の行に2つのLEDチップセットがあり、他方の行に3つのLEDチップセットがあり、前記駆動IC20が前記隣接する2行の間に設置される。
図7は、本開示の実施形態に係る第5の実施例の内部構造模式図である。図に示すように、R−LEDチップが銀ペーストを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッド40に実装され、前記G−LEDチップ及びB−LEDチップが絶縁グルーを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッド40に実装される。
11 基板
12 電極層
121 正電極
122 負電極
13 第1の絶縁層
14 第3の絶縁層
15 第2の絶縁層
16 信号配線層
20 駆動IC
21 信号ピン
22 信号線
30 LEDチップ
31 リード線
40 ボンディングパッド
Claims (17)
- LED発光ユニットであって、複合層(10)と、LEDチップ(30)を含む少なくとも1つのLEDチップセットと、少なくとも1つの駆動IC(20)とを含み、前記複合層(10)は前側に位置する基板(11)を含み、
前記LEDチップ(30)及び駆動IC(20)がいずれも前記複合層(10)の前側に実装され、前記LEDチップ(30)の負極引出リード線(31)が前記駆動IC(20)に接続され、前記複合層(10)の前側に複数のブラインドホールが開設され、前記LEDチップ(30)の正極が1つの前記ブラインドホールを介して複合層(10)の内部から正電極(121)に接続され、前記駆動IC(20)のVDDピン引出リード線(31)が1つの前記ブラインドホールを介して複合層(10)の内部から前記正電極(121)に接続され、前記駆動IC(20)のGNDピン引出リード線(31)が1つの前記ブラインドホールを介して複合層(10)の内部から負電極(122)に接続され、前記駆動IC(20)が信号線(22)に接続され、前記信号線(22)は前記駆動IC(20)の信号伝送用のものであり、
前記LEDチップ(30)の負極引出リード線(31)、前記駆動IC(20)のVDDピン引出リード線(31)、前記駆動IC(20)のGNDピン引出リード線(31)、及び前記信号線(22)はいずれもボンディングされるゴールドワイヤーである、LED発光ユニット。 - 前記複合層(10)が透明複合層である請求項1に記載のLED発光ユニット。
- 各前記LEDチップセットが1つの駆動IC(20)に対応し、前記LEDチップセットと駆動IC(20)が行別に間隔的に配列される請求項2に記載のLED発光ユニット。
- 複数のアレイ状に分布するLEDチップセットを含む請求項2に記載のLED発光ユニット。
- 2×1、2×2又は2×3ずつのLEDチップセットが1つの発光セットを構成し、各発光セットが1つの駆動IC(20)に対応し、前記駆動IC(20)が前記発光セットの平面中心に設置される請求項4に記載のLED発光ユニット。
- 5個ずつのLEDチップセットが1つの発光セットを構成し、各発光セットが1つの駆動IC(20)に対応し、各発光セットが隣接する2行に位置し、一方の行に2つのLEDチップセットがあり、他方の行に3つのLEDチップセットがあり、前記駆動IC(20)が前記隣接する2行の間に設置される請求項4に記載のLED発光ユニット。
- 前記駆動IC(20)はパッケージングされていないベアチップである請求項1〜6のいずれか一項に記載のLED発光ユニット。
- 前記複合層(10)は、前記基板(11)の後側に順に設置された電極層及び第2の絶縁層(15)をさらに含み、
前記電極層に前記正電極(121)及び前記負電極(122)が設置され、前記基板(11)に前記正電極(121)又は前記負電極(122)に到達する複数のブラインドホールが開設される請求項1〜6のいずれか一項に記載のLED発光ユニット。 - 前記複合層(10)は、前記基板(11)の後側に順に設置された第1の電極層、第1の絶縁層(13)、第2の電極層及び第2の絶縁層(15)をさらに含み、前記第1の電極層と第2の電極層のうちの一方が前記正電極(121)として設置され、他方が前記負電極(122)として設置され、前記ブラインドホールは、前記基板(11)を貫通して前記正電極(121)に到達する第1のブラインドホールと、前記基板(11)を貫通して前記負電極(122)に到達する第2のブラインドホールとを含み、前記LEDチップ(30)の正極引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のVDDピン引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のGNDピン引出リード線(31)が前記第2のブラインドホールを介して前記負電極(122)に接続される請求項1〜6のいずれか一項に記載のLED発光ユニット。
- 前記複合層(10)は、前記基板(11)の後側に順に設置された第1の電極層、第1の絶縁層(13)、第2の電極層及び第2の絶縁層(15)をさらに含み、前記第1の電極層と第2の電極層のうちの一方が前記正電極(121)として設置され、他方が前記負電極(122)として設置され、前記ブラインドホールは、前記基板(11)を貫通して前記正電極(121)に到達する第1のブラインドホールと、前記基板(11)を貫通して前記負電極(122)に到達する第2のブラインドホールとを含み、前記LEDチップ(30)の正極引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のVDDピン引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のGNDピン引出リード線(31)が前記第2のブラインドホールを介して前記負電極(122)に接続され、前記複合層(10)は、第3の絶縁層(14)と、前記第3の絶縁層(14)を介して前記第1の電極層又は第2の電極層と絶縁する信号配線層(16)とをさらに含み、前記ブラインドホールは、前記基板(11)を貫通して前記信号配線層(16)に到達する第3のブラインドホールを含み、前記信号線(22)が前記信号配線層(16)に設置された信号パターン層であり、前記駆動IC(20)の信号ピン(21)の引出リード線(31)が前記第3のブラインドホールを介して前記信号パターン層に接続される請求項1〜6のいずれか一項に記載のLED発光ユニット。
- 前記複合層(10)は少なくとも2層の前記信号配線層(16)及び少なくとも2層の前記第3の絶縁層(14)を含む請求項10に記載のLED発光ユニット。
- 前記ブラインドホールの底部にボンディングパッド(40)が設置され、前記LEDチップ(30)の正極引出リード線(31)、前記駆動IC(20)のVDDピン引出リード線(31)、前記駆動IC(20)のGNDピン引出リード線(31)、及び前記駆動IC(20)の信号ピン(21)の引出リード線(31)が前記ボンディングパッド(40)を介して前記複合層(10)に電気的に接続される請求項10に記載のLED発光ユニット。
- 1つの前記LEDチップセットはR−LEDチップ、G−LEDチップ及びB−LEDチップを含む請求項12に記載のLED発光ユニット。
- 前記R−LEDチップが銀ペーストを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッドに実装され、前記G−LEDチップ及びB−LEDチップが絶縁グルーを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッドに実装される請求項13に記載のLED発光ユニット。
- 前記LEDチップ(30)及び駆動IC(20)がCOB又はCOGプロセスによって前記基板(11)に実装され、前記基板(11)の前側に透明シーラントが被覆される請求項1に記載のLED発光ユニット。
- 少なくとも2つの請求項1〜15のいずれか一項に記載のLED発光ユニットを含むLED発光パネル。
- 請求項16に記載のLED発光パネルを含むLEDディスプレイスクリーン。
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JP2018530792A (ja) | 2018-10-18 |
CN104979326A (zh) | 2015-10-14 |
WO2017005225A2 (zh) | 2017-01-12 |
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