CN214147795U - 信号串联的移位寄存贴片发光二极管灯珠用印制电路板 - Google Patents

信号串联的移位寄存贴片发光二极管灯珠用印制电路板 Download PDF

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CN214147795U
CN214147795U CN202120056607.7U CN202120056607U CN214147795U CN 214147795 U CN214147795 U CN 214147795U CN 202120056607 U CN202120056607 U CN 202120056607U CN 214147795 U CN214147795 U CN 214147795U
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黄萍
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Abstract

一种信号串联的移位寄存贴片发光二极管灯珠用印制电路板，是双面PCB，双面PCB的一面从左到右依次上下设有：分别与电源线连接的上下电源导电片、分别与地线连接的上下地导电片以及分别与信号线连接的上下信号导电片，上下信号导电片之间设有隔断电连接的切口，上信号导电片是一信号输入端，下信号导电片是与上信号导电片隔断电连接的一信号输出端，信号线包括上下信号线，上信号线与上信号导电片电连接，下信号线与下信号导电片电连接。结构简单，制造方便，可以弥补由三芯导线以贴片形式组合成的灯串的数据信号无法传递的缺陷。采用自动组装机的冲压操作隔断上下信号导电片之间的电连接，具有更加有利于自动组装机操作的进一步的技术效果。

Description

信号串联的移位寄存贴片发光二极管灯珠用印制电路板
技术领域
本实用新型涉及发光体用印制电路板，特别是涉及一种信号串联的移位寄存贴片发光二极管灯珠用印制电路板。
背景技术
信号串联的移位寄存(Shift Register)贴片型灯串，是采用移位寄存信号传输方式通过外接数据信号线控制发光二极管(Light Emitting Diodes，缩略词LED)芯片花色变化，并以贴片形式固定在以三芯导线串联连接的灯串。灯串上每个表面贴装(SurfaceMounted Devices，缩略词SMD)LED灯珠即贴片LED灯珠的信号输入端输入的数据信号经驱动芯片处理获取所需工作指令后再由信号输出端将剩余数据往下一级传递，依此传递模式依序获取每个贴片LED灯珠所需的花色数据，所述灯串使用的贴片LED灯珠及其驱动芯片集成在各式材质的印制电路板(Printed Circuit Board，缩略词PCB)上，其电源和数据信号的传递包括电源正极端、电源对地端、传递数据信号的一信号输入端，以及传递数据信号的一信号输出端。信号线必须经过驱动芯片内部处理后再往下级传递，导致贴片LED灯珠必须以串联形式连接。然而，现有由三芯导线(Triple Conductor)以贴片形式组合成的灯串，贴片LED灯珠是以贴片形式直接架桥在三根平行的包括导体与绝缘层的导线上，如此设计的信号线连接，被导通成为并联状态，数据信号无法依串联顺序移位寄存，导致数据信号无法有效传递而失效。
发明内容
本实用新型所要解决的技术问题是弥补上述现有技术的缺陷，提供一种信号串联的移位寄存贴片发光二极管灯珠用印制电路板。
本实用新型的技术问题通过以下技术方案予以解决。
这种信号串联的移位寄存贴片发光二极管灯珠用印制电路板，是双面印制电路板(Printed Circuit Board，缩略词PCB)，所述双面PCB的一面从左到右依次上下设有：
分别与电源线连接的上电源导电片、下电源导电片，
分别与地线连接的上地导电片、下地导电片，
以及分别与信号线连接的上信号导电片、下信号导电片，
所述上电源导电片由自动组装机的贴片操作依次完成与下电源导电片、电源线的电连接，所述上地导电片由自动组装机的贴片操作依次完成与下地导电片、地线的电连接。
这种信号串联的移位寄存贴片LED灯珠用PCB的特点是：
所述双面PCB右侧的上信号导电片与下信号导电片之间设有隔断电连接的切口。
所述上信号导电片是一信号输入端，所述下信号导电片是与所述上信号导电片隔断电连接的一信号输出端。
所述信号线包括上信号线，以及下信号线，所述上信号线与上信号导电片电连接，所述下信号线与下信号导电片电连接，适用于信号串联的移位寄存贴片发光二极管(LightEmitting Diodes，缩略词LED)灯珠，确保移位寄存数据信号得以正常传递，可以弥补现有制造由三芯导线以贴片形式组合成的灯串的数据信号，无法依串联顺序移位寄存，导致数据信号无法有效传递而失效的缺陷。
本实用新型的技术问题通过以下进一步的技术方案予以解决。
所述信号线包括上信号线，以及由自动组装机以裁刀具对准载台缺口和所述切口冲压操作而与所述上信号线隔断的下信号线，即采用自动组装机的冲压操作隔断所述上信号导电片与下信号导电片之间的电连接，更加有利于自动组装机的操作。
本实用新型的技术问题通过以下再进一步的技术方案予以解决。
所述切口的形状是满足隔断上信号导电片与下信号导电片之间的电连接的形状。
所述切口的尺寸是满足隔断上信号导电片与下信号导电片之间的电连接的尺寸。
所述双面PCB的另一面设有驱动芯片，以及包括至少三个不同颜色的LED芯片集成的发光单元。
本实用新型与现有技术对比的有益效果，包括结构简单，制造方便，可以弥补现有制造由三芯导线以贴片形式组合成的灯串的数据信号，无法依串联顺序移位寄存，导致数据信号无法有效传递而失效的缺陷。优选方案中采用自动组装机的冲压操作隔断上下信号导电片之间的电连接，具有更加有利于自动组装机操作的进一步的技术效果。
附图说明
图1是本实用新型具体实施方式的组成示意图。
图中数字标记如下：1-双面PCB，2-上电源导电片，3-下电源导电片，4-上地导电片，5-下地导电片，6-上信号导电片，7-下信号导电片，8-切口，9-电源线，10-地线，11-上信号线，12-下信号线。
具体实施方式
下面结合具体实施方式并对照附图对本实用新型作进一步详细说明。应该强调的是，下述说明的实施例仅仅是示例性、非限制性和非排他性的。
实施例
一种如图1所示的信号串联的移位寄存贴片LED灯珠用PCB，是双面PCB1，双面PCB1的一面设有驱动芯片以及包括三个不同颜色的LED芯片集成的发光单元，双面PCB1的另一面从左到右依次上下对称设有：分别与电源线9连接的上电源导电片2、下电源导电片3，分别与地线10连接的上地导电片4、下地导电片5，以及分别与信号线连接的上信号导电片6、下信号导电片7。上电源导电片2由自动组装机的贴片操作依次完成与下电源导电片3、电源线9的电连接，上地导电片4由自动组装机的贴片操作依次完成与下地导电片5、地线10的电连接。
双面PCB1右侧的上下对称的上信号导电片6与下信号导电片7之间设有隔断电连接的切口8。
信号线包括与上信号导电片6电连接的上信号线11、与下信号导电片7电连接的下信号线12，上信号线11由自动组装机的贴片操作完成与上信号导电片6的电连接，下信号线12由自动组装机的贴片操作完成与下信号导电片7的电连接，上信号导电片6是一信号输入端，下信号导电片7相对应上信号导电片6是隔断电连接的另一信号输出端，适用于信号串联的移位寄存贴片LED灯珠，确保移位寄存数据信号得以正常传递，可以弥补现有制造由三芯导线以贴片形式组合成的灯串的数据信号，无法依串联顺序移位寄存，导致数据信号无法有效传递而失效的缺陷。。
本实施例的PCB用于信号串联的移位寄存贴片LED灯珠的具体制造过程是：
先将移位寄存贴片LED灯珠和三芯导线采用表面黏贴式封装工艺(SurfaceMounted Technology，缩略词SMT)架桥在三芯导线的三根导线上方，并确保LED灯珠用双面PCB1的上信号导电片6先由自动组装机的贴片操作依次完成与下信号导电片7、下信号线12的可靠电连接，经过对准校正后由自动组装机以裁刀具对准载台缺口和切口8后冲压操作隔断上信号导电片6与下信号导电片7之间的电连接，即冲断连接在作为信号输入端的信号导电片6和作为信号输出端的下信号导电片7之间的导线，使原先连接信号输入端和信号输出端的导线，成为隔断电连接的上信号线11和下信号线12，上信号线11与上信号导电片6电连接，下信号线12与下信号导电片7电连接，移位寄存贴片LED灯珠的数据信号经信号输入端进入驱动芯片内部处理后再由信号输出端传递给下一级的移位寄存贴片LED灯珠，采用这种信号串联连接方式可以确保移位寄存数据信号得以正常传递。而采用自动组装机的冲压操作隔断上信号导电片6与下信号导电片7之间的电连接，更加有利于自动组装机的操作。
本实施例的PCB的切口8的形状是满足隔断上信号导电片5与下信号导电片7之间的电连接的形状。
本实施例的PCB的切口8的尺寸是满足隔断上信号导电片5与下信号导电片7之间的电连接的尺寸。
以上内容是结合具体的优选实施方式对本实用新型所作的进一步详细说明，不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说，在不脱离本实用新型构思的前提下做出若干等同替代或明显变型，而且性能或用途相同，都应当视为属于本实用新型由所提交的权利要求书确定的专利保护范围。

Claims (5)

1.一种信号串联的移位寄存贴片发光二极管灯珠用印制电路板，是双面PCB，所述双面PCB的一面从左到右依次上下设有：
分别与电源线连接的上电源导电片、下电源导电片，
分别与地线连接的上地导电片、下地导电片，
以及分别与信号线连接的上信号导电片、下信号导电片，
其特征在于：
所述双面PCB右侧的上信号导电片与下信号导电片之间设有隔断电连接的切口；
所述上信号导电片是一信号输入端，所述下信号导电片是与所述上信号导电片隔断电连接的一信号输出端；
所述信号线包括上信号线，以及下信号线，所述上信号线与上信号导电片电连接，所述下信号线与下信号导电片电连接。
2.如权利要求1所述的信号串联的移位寄存贴片发光二极管灯珠用印制电路板，其特征在于：
所述下信号线是由自动组装机以裁刀具对准载台缺口和所述切口冲压操作而与所述上信号线隔断的下信号线。
3.如权利要求1或2所述的信号串联的移位寄存贴片发光二极管灯珠用印制电路板，其特征在于：
所述切口的形状是满足隔断上信号导电片与下信号导电片之间的电连接的形状。
4.如权利要求1或2所述的信号串联的移位寄存贴片发光二极管灯珠用印制电路板，其特征在于：
所述切口的尺寸是满足隔断上信号导电片与下信号导电片之间的电连接的尺寸。
5.如权利要求1所述的信号串联的移位寄存贴片发光二极管灯珠用印制电路板，其特征在于：
所述双面PCB的另一面设有驱动芯片，以及包括至少三个不同颜色的发光二极管LED芯片集成的发光单元。
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Family Cites Families (5)

* Cited by examiner, † Cited by third party
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US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8878073B2 (en) * 2012-06-18 2014-11-04 Regal Beloit America, Inc. Printed circuit board and methods of manufacturing the same
CN104979326B (zh) * 2015-07-09 2017-12-05 深圳市晶泓科技有限公司 Led发光组件、led发光面板和led显示屏
CN107710424B (zh) * 2015-08-06 2019-07-12 林谊 Led像素点、发光组件、发光面板和显示屏
CN110071068B (zh) * 2018-01-23 2024-01-09 方略电子股份有限公司 显示装置及其制造方法

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