WO2023103157A1 - Led灯带的制造方法 - Google Patents

Led灯带的制造方法 Download PDF

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Publication number
WO2023103157A1
WO2023103157A1 PCT/CN2022/073283 CN2022073283W WO2023103157A1 WO 2023103157 A1 WO2023103157 A1 WO 2023103157A1 CN 2022073283 W CN2022073283 W CN 2022073283W WO 2023103157 A1 WO2023103157 A1 WO 2023103157A1
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WO
WIPO (PCT)
Prior art keywords
led
wires
led lamp
avoidance
base
Prior art date
Application number
PCT/CN2022/073283
Other languages
English (en)
French (fr)
Inventor
刘明剑
朱更生
吴振雷
周凯
Original Assignee
东莞市欧思科光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞市欧思科光电科技有限公司 filed Critical 东莞市欧思科光电科技有限公司
Priority to US18/119,286 priority Critical patent/US11965626B2/en
Publication of WO2023103157A1 publication Critical patent/WO2023103157A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present application relates to the technical field of light emitting diodes, in particular to a method for manufacturing an LED light strip.
  • the light-emitting diode (full name in English: light-emitting diode, referred to as: LED) and the driver chip are packaged in the installation groove of the LED bracket by using packaging glue to form LED lamp beads, and then multiple LEDs are connected through power lines, signal lines, etc. Lamp beads are connected in series and parallel to form LED light strips, which has become the mainstream processing method of LED light strips on the market.
  • the power line and the signal line are directly welded to the pins, and then the part of the signal line between the two pins is cut off, so that The signal input line and signal transmission line are obtained, but the power line and signal line are prone to weak welding or welding is not firm during welding, and it is easy to cause problems such as pin deformation when cutting the signal line, resulting in high defect rate and low reliability of the light strip. Poor, prone to the risk of failure during the lifetime.
  • the purpose of the embodiment of the present application is to provide a method for manufacturing an LED light strip, aiming at improving the yield rate and the processing reliability of the LED light strip.
  • a method for manufacturing an LED light strip comprising the following steps:
  • each of the bearing bases has a plurality of conductive parts and at least one avoidance through hole, and every two conductive parts are arranged on the bearing base at intervals along the first linear track, and at least one of the An avoidance through hole is provided between the two conductive parts arranged along the first straight track;
  • the carrying base and the at least two wires are welded, so that each wire is welded to the two conductive parts arranged along the first linear track, and at least one wire is transversely straddling the avoidance through hole between the two conductive parts arranged along the first straight track to form a punching part;
  • each of the LED lamp beads has a plurality of pins, and each of the pins is matched with one of the conductive parts;
  • it also includes performing shell removal treatment on the at least two wires, so that each of the wires is formed with a core exposed part that is compatible with the bearing base, and each exposed core part is connected to the The two conductive parts arranged along the first straight track of one piece of the bearing base are connected, so that when the bearing base is welded to the at least two wires, each exposed part of the wire core is connected to the The two conductive parts arranged along the first straight track are respectively welded, and at least one exposed core part straddles all the conductive parts between the two conductive parts along the first straight track. The avoidance through hole is formed to form the punched part.
  • the bearing base when the bearing base is welded to the at least two wires, it also includes the step of dispensing solder paste on the exposed part of the wire core and/or the bearing base;
  • the bearing base when the bearing base is welded to the LED lamp holder, it further includes the step of dispensing solder paste on the conductive part and/or the pin part.
  • it also includes the step of encapsulating the LED lamp bead, the bearing base and the wire, so that the welding position of the LED lamp bead and the bearing base and the bearing base and the bearing base.
  • the welding parts of the at least two wires are insulated and sealed;
  • the method further includes the step of encapsulating the LED lamp bead, the bearing base, and the part of the wire welded with the bearing base in a lamp housing.
  • the encapsulation treatment step is to seal the LED bead, the bearing base and the at least two wires with encapsulation glue.
  • the LED lamp bead includes an LED lamp holder, an LED chip assembly and an LED packaging glue;
  • the LED lamp holder includes an insulating base and a plurality of conductive terminals; each of the conductive terminals is fixed on the insulating base, and each of the conductive terminals has a solid crystal part and is exposed outside the insulating base. of the pin portion;
  • the LED chip assembly is electrically connected to the die-bonding part
  • the LED encapsulant encapsulates the LED chip assembly and the die-bonding part.
  • the insulating base forms a cavity for accommodating the LED chip assembly and the LED encapsulant, and all the crystal-bonding parts are penetrated in the cavity;
  • the insulating base has a bottom surface and a top surface, the crystal-bonding part is exposed on the top surface, the pin part is exposed on the bottom surface, and the LED encapsulant is fixed on the top surface by molding noodle.
  • the LED lamp holder has a limiting protrusion
  • the limiting protrusion is formed on the surface of the LED lamp holder facing the bearing base, and is matched with the avoidance through hole;
  • the LED chip assembly includes a driver chip and at least one light-emitting chip, and the driver chip is electrically connected to the light-emitting chip.
  • the number of the at least two wires is two, the number of the avoidance through hole is one, and one of the wires straddles the avoidance through hole to form the punching part;
  • the number of the at least two wires is more than two, the number of the avoidance through hole is one, and one of the wires crosses the avoidance through hole to form the punching part;
  • the number of the at least two wires is more than two, the number of the avoidance through holes is two or more, and one of the wires straddles the two wires located along the first straight line.
  • the avoidance through hole between the conductive parts is formed to form the punched part.
  • one LED lamp bead is welded on each of the bearing bases;
  • the LED lamp bead includes an LED lamp holder, and the orthographic projection of the bottom of the LED lamp holder on the bearing base does not exceed the area enclosed by the outer edge of the bearing base.
  • the orthographic projection of the bottom of the LED lamp holder on the bearing base is located in the area surrounded by the outer edge of the bearing base;
  • the orthographic projection of the bottom of the LED lamp holder on the bearing base coincides with the area surrounded by the outer edge of the bearing base.
  • the manufacturing method of the LED light strip provided by the present application firstly welds the wires to the carrying base with avoidance through holes, and the carrying base has a plurality of conductive parts, When welding, a wire is welded to two conductive parts arranged at intervals along the first straight track, and the avoidance through hole is arranged between the two conductive parts arranged at intervals along the first track, so that the wire is connected between the two conductive parts.
  • FIG. 1 is a schematic diagram of the three-dimensional structure of the LED base module provided in Embodiment 1 of the present application;
  • FIG. 2 is a schematic cross-sectional view of a bearing base provided in Embodiment 1 of the present application;
  • FIG. 3 is a schematic diagram of the exploded structure of the LED module provided in Embodiment 1 of the present application.
  • FIG. 4 is a schematic diagram of the three-dimensional structure of the LED lamp bead from which the LED encapsulant is removed provided in Embodiment 1 of the present application;
  • FIG. 5 is a schematic diagram of the three-dimensional structure of the LED light strip provided in Embodiment 1 of the present application.
  • Fig. 6 is a schematic perspective view of the three-dimensional structure of the lamp housing provided in Embodiment 1 of the present application;
  • Fig. 7 is a schematic diagram of the exploded structure of the lamp housing provided in Embodiment 1 of the present application.
  • Fig. 8 is a schematic perspective view of the three-dimensional structure of an LED light strip including a light housing provided in Embodiment 1 of the present application;
  • FIG. 9 is a schematic flow chart of the manufacturing method of the LED light strip according to Embodiment 1 of the present application.
  • Fig. 10 is a schematic flow chart of the manufacturing method of the LED light strip according to Embodiment 1 of the present application.
  • FIG. 11 is a schematic diagram of the three-dimensional structure of the bearing base provided in Embodiment 2 of the present application.
  • Fig. 12 is a schematic perspective view of the three-dimensional structure of the bearing base provided by another embodiment of the second embodiment of the present application.
  • FIG. 13 is a schematic diagram of a three-dimensional structure of a bearing base provided in Embodiment 3 of the present application.
  • Fig. 14 is a schematic diagram of the three-dimensional structure of the LED lamp bead provided in Embodiment 4 of the present application;
  • Fig. 15 is a schematic perspective view of the three-dimensional structure of the LED lamp bead provided in Embodiment 4 of the present application from another perspective;
  • Fig. 16 is a three-dimensional schematic diagram of removing the LED sealant from the LED lamp bead provided in Embodiment 4 of the present application;
  • FIG. 17 is a schematic diagram of an exploded structure of an LED lamp bead provided in Embodiment 4 of the present application.
  • LED lamp holder 111. Insulation base; 110. Recess; 112. Conductive terminal; 1121. Solid crystal part; 1122. Pin part; 11221. Second signal input terminal; 1101, the top surface; 1102, the bottom surface;
  • Bearing base 120. Avoidance through hole; 121. Conductive part; 12101. First end; 12102. Second end; 1211. First signal input end; 1212. First signal output end;
  • LED lamp bead 211. LED chip component; 2111. driver chip; 2112. light-emitting chip; 2113. connecting wire; 212. LED packaging glue;
  • Lamp housing 320. Accommodating cavity; 3201. Glue injection hole; 3202. Wire hole; 321. First housing; 322. Second housing;
  • Figures 1 to 5 are schematic structural views of the LED base module 10, the LED module 20, the LED light strip 30 and the corresponding components provided in this embodiment;
  • Figures 9 to 10 are LEDs provided in this embodiment Schematic flow chart of the manufacturing method of the light strip 30 .
  • the LED base module 10 of this embodiment includes an LED lamp holder 11 and a bearing base 12 for carrying the LED lamp holder 11 .
  • the LED lamp holder 11 includes an insulating base 111 and a plurality of conductive terminals 112, the insulating base 111 is formed with a cavity 110 for accommodating the LED chip assembly 211 and the LED encapsulant 212; the plurality of conductive terminals 112 are formed by injection molding It is fixed on the insulating base 111, and each conductive terminal 112 has a crystal-bonding part 1121 and a pin part 1122, and the crystal-bonding part 1121 is penetrated in the cavity 110 for electrically connecting with the LED chip assembly 211, and the pins The portion 1122 is exposed outside the insulating base 111 for connecting with the carrying base 12 .
  • the carrying base 12 has a plurality of conductive parts 121 and at least one avoidance through hole 120; each conductive part 121 has a first end 12101 and a second end 12102, and the first end 12101 and the second end 12102 are respectively set On the two opposite end faces of the bearing base 12, the first end 12101 is used for electrical connection with the pin part 1122, and the second end 12102 is used for electrical connection with the wire; at least one avoidance through hole 120 is used for crossing over The lead punching avoidance of the via hole 120 is avoided.
  • the supporting base 12 is formed with an avoidance through hole 120, and the avoidance through hole 120 is arranged between two conductive parts 121. , the wire forms a cross-line part at the position facing the avoidance through hole 120.
  • the cross-wire part is directly opposite to the avoidance through hole 120, it is convenient to punch the cross-wire part to punch out the wire, and during the punching process, the punching
  • the cutting device 40 will not impact or damage the LED lamp holder 11, and can effectively protect the LED lamp holder 11.
  • the good product rate can reach more than 99.7%. .
  • the insulating base 111 has a bottom surface 1102 and a top surface 1101, the cavity 110 is recessed from the top surface 1101 to the bottom surface 1102, and the crystal bonding part 1121 is formed from the insulating base.
  • the conductive portion 121 extends from the bottom end surface 1102 to the top end surface 1101 on the carrier base 12, and the first end portion 12101 formed by the conductive portion 121 Towards the bottom end surface 1102, and the conductive part 121 forms the second end portion 12102 facing away from the bottom end surface 1102, which is conducive to the matching and electrical connection between the first end portion 12101 and the pin portion 1122, and is also conducive to the second end portion 12102 and the second end portion 12102.
  • the wires are matched and electrically connected, which can effectively realize that the LED lamp holder 11 and the wires are respectively welded on opposite sides of the carrying base 12;
  • the avoidance through hole 120 is formed on the carrying base along the direction from the bottom end surface 1102 to the top end surface 1101. seat 12, so that it is welded in the wires of the bearing base 12, one of the wires crosses the avoidance through hole 120 on the surface of the bearing base 12 facing away from the LED lamp holder 11, and when punching, the cutter passes through the avoidance through hole 120, that is The wires spanning the avoidance via hole 120 can be cut off.
  • At least some conductive parts 121 are spaced apart to form a first conductive pair.
  • one conductive part 121 is an input terminal and the other conductive part 121 is an output terminal.
  • the avoidance via hole 120 is formed between the two conductive portions 121 of a first conductive pair.
  • the conductive part 121 at the end is transmitted to the next LED chip assembly 211 through wires, so that cascaded signal transmission of multiple LED modules 20 can be realized.
  • the structural design of avoiding the through hole 120 can improve the processing reliability of the LED light strip 30 , avoid damage or damage to the LED lamp holder 11 when the wire is punched, and can effectively solve the impact of the punching on the welding reliability. Except for the two conductive portions 121 forming the first conductive pair, the rest of the conductive portions 121 may not be distributed in pairs, or may be distributed in pairs.
  • the number of the first conductive pair is one group.
  • the conductive part 121 as the input terminal is the first signal input terminal 1211
  • the conductive part 121 as the output terminal. is the first signal output terminal 1212 .
  • the number of avoidance vias 120 is one, and the avoidance vias 120 are arranged between the first signal input end 1211 and the first signal output end 1212;
  • the output end 1212 straddles the avoidance through hole 120 when extending, so as to facilitate the punching of the wire, so as to cut off the jumper part connected between the first signal input end 1211 and the first signal output end 1212, and avoid the first signal input
  • the terminal 1211 is directly connected with the first signal output terminal 1212 through a wire crossing the escape hole 120 .
  • the number of the first conductive pairs is three groups, and the avoidance via hole 120 is disposed between the two conductive parts 121 of one group of the first conductive pairs.
  • the number of groups of the first conductive pairs is not limited to one group or three groups, and may also be two groups or more than four groups, which can be specifically set according to actual needs.
  • the carrying base 12 includes any one of a BT resin substrate (BT), a printed circuit board (PCB), a PCBA board, and a flexible printed circuit board (FPCB).
  • BT BT resin substrate
  • PCB printed circuit board
  • FPCB flexible printed circuit board
  • the LED lamp holder 11 has a limiting protrusion (not shown in the figure), and the limiting protrusion is formed on the surface facing the LED lamp holder 11 and the bearing base 12, that is, the limiting protrusion
  • the position protrusion extends from the bottom surface 1102 of the LED lamp holder 11 to the carrying base 12 . In this way, when the LED lamp holder 11 is installed on the bearing base 12 , the limit protrusion is plugged into the avoidance through hole 120 to improve the positioning reliability and connection reliability of the LED lamp holder 11 and the bearing base 12 .
  • the orthographic projection of the bottom surface 1102 of the LED lamp holder 11 on the carrying base 12 does not exceed the area enclosed by the outer edge of the carrying base 12 .
  • at least one LED lamp holder 11 can be installed on one carrying base 12 , so that the effect of carrying multiple LED lamp beads 21 on one carrying base 12 can be realized.
  • the orthographic projection of the bottom end surface 1102 of the LED lamp holder 11 on the bearing base 12 falls into the area surrounded by the outer edge of the bearing base 12 .
  • each bearing base 12 Multiple LED lamp beads 21 can be installed.
  • the orthographic projection of the bottom end surface 1102 of the LED lamp holder 11 on the bearing base 12 coincides with the area surrounded by the outer edge of the bearing base 12.
  • Such a structural design ensures that each bearing base 12 One LED lamp bead 21 can be installed.
  • the structural design of the carrying base 12 and the LED lamp holder 11 can make the welding of the LED lamp holder 11 and the wire no longer limited to the size of the LED lamp holder 11, but depends on the carrying base 12, and will be directly connected to the LED lamp holder.
  • the method of welding wires on 11 is changed to welding wires on the carrying base 12 , so that the processing efficiency of the LED light strip 30 can be effectively improved and the yield rate of the LED light strip 30 can be improved.
  • this embodiment also provides an LED module 20 .
  • the LED module 20 includes the above-mentioned carrying base 12 and LED lamp bead 21; wherein, one conductive part 121 in the carrying base 12 is a first signal input end 1211, and the other conductive part 121 is a first signal output end 1212, An escape hole 120 is disposed between the first signal input end 1211 and the first signal output end 1212 .
  • the LED lamp bead 21 includes an LED chip assembly 211, an LED encapsulant 212 and the above-mentioned LED lamp holder 11; the LED chip assembly 211 is installed in the cavity 110, and is electrically connected with the die-bonding part 1121; the LED encapsulant 212 is filled in the cavity In the cavity 110; one pin part 1122 in the LED lamp holder 11 is used as the second signal input end 11221, and the other pin part 1122 is used as the second signal output end 11222; the second signal input end 11221 is used to communicate with the first signal input end
  • the terminal 1211 is matched and connected, and the second signal output terminal 11222 is used for matching and connecting with the first signal output terminal 1212 .
  • the LED chip assembly 211 includes a driver chip 2111 (ie, an IC chip) and at least one light emitting chip 2112 , wherein the driver chip 2111 is electrically connected to the light emitting chip 2112 .
  • the driving chip 2111 is installed in one of the die-bonding parts 1121 , and one type of light-emitting chip 2112 is correspondingly mounted in one of the die-bonding parts 1121 .
  • the LED chip assembly 211 further includes a connection wire 2113, each light-emitting chip 2112 is electrically connected to the driver chip 2111 through the connection wire 2113, and at the same time, the driver chip 2111 is electrically connected to the die-bonding part 1121 through the connection wire 2113 , so that the signal input from the first signal input terminal 1211 can be transmitted to the driver chip 2111; each light-emitting chip 2112 is electrically connected to the die-bonding part 1121 for installing the light-emitting chip 2112 through the connecting wire 2113.
  • the light-emitting chip 2112 includes a blue LED chip, a green LED chip, a red LED chip, a white LED chip, etc., and each light-emitting chip 2112 is correspondingly installed in a crystal-bonding part 1121; or a crystal-bonding part 1121 More than two light-emitting chips 2112 are mounted at intervals on the top.
  • this embodiment also provides an LED light strip 30 .
  • the LED light strip 30 includes a wire assembly 31 and at least two LED modules 20 .
  • the wire assembly 31 includes at least a power line 311, a signal input line 312, and at least one signal transmission line 313, and each supporting base 12 is welded with at least one LED light bead 21;
  • the power line 311 is used to connect the LED light bead 21 to an external power supply
  • one end of the signal input line 312 is connected to an external signal source, and the other end is connected to the first signal input end 1211 of one of the carrying bases 12 to input signals to the LED strip 30;
  • one end of the signal transmission line 313 is connected to the The first signal output end 1212 of one of the carrying bases 12 is connected, and the other end is connected to the first signal input end 1211 of the other carrying base 12, so that the signal is cascaded between two adjacent LED lamp beads 21 transmission.
  • the power line 311 is connected to one conductive portion 121 of the remaining conductive portions 121 of each carrying base 12 , so as to realize power supply to the LED strip 30 .
  • the wire assembly 31 further includes a ground wire 314 for grounding the LED strip 30 .
  • the LED light strip 30 further includes an insulating sealant (not shown in the figure), and the insulating sealant at least wraps the parts where the LED module 20 and the wire assembly 31 are connected to each other.
  • the insulating sealant completely seals the exposed parts of the wire assembly 31 and the LED module 20, so as to avoid electric leakage at the welding part of the LED lamp bead 21 and the carrying base 12, and at the same time prevent the connection between the carrying base 12 and the wire assembly. 31
  • the welding part leaks electricity.
  • other lines may be added to the wire assembly 31 according to actual needs.
  • the LED light strip 30 further includes a lamp housing 32.
  • the lamp housing 32 has a housing cavity 320 for housing the LED module 20, and the sealant is filled in the housing. In the cavity 320 , the LED module 20 is sealed, and the lamp housing 32 is transparent for the light of the LED lamp bead 21 to pass through.
  • one LED lamp housing 32 accommodates one LED module 20 , or one LED lamp housing 32 accommodates more than two LED modules 20 .
  • the lamp housing 32 includes a first housing 321 and a second housing 322, the first housing 321 and the second housing 322 are interlocked to form the lamp housing 32, and the first housing 321 and the second housing 322 The second housing 322 encloses and forms the receiving cavity 320 .
  • the lamp housing 32 is formed with a glue injection hole 3201 and a wire hole 3202, wherein the glue injection hole 3021 is used for injecting a sealant to seal the LED module 20. 321 and the second housing 322 are glued and fixed, and the wire hole 3202 allows the wire assembly 31 welded with the LED module 20 to pass through the lamp housing 32 .
  • this embodiment also provides a manufacturing method of the LED light strip 30 .
  • the manufacturing method of the LED light strip 30 includes the following steps:
  • Step S01 extend at least two wires along a first straight track PQ, and there is an interval between two adjacent wires.
  • step S01 before at least two wires are extended along the first straight track PQ, it also includes the step of removing the insulation layer of at least two wires, by stripping the insulation layer of the wires, each wire A core exposed portion 310 that is compatible with the carrying base 12 is formed, and each exposed core portion 310 is connected to two conductive portions 121 provided on a carrying base 12 along the first straight track PQ, so that the carrying base
  • each core exposed portion 310 is welded to the two conductive portions 121 arranged along the first straight line PQ, and at least one core exposed portion 310 straddles the line located along the first straight line PQ.
  • the through hole 120 between the two conductive parts 121 of the line track PQ is avoided to form a punched part.
  • at least two wires are extended along the first straight track PQ to form a wire assembly 31 .
  • the insulation layer removal process is performed on the wires, that is, the enameled wire layer is removed.
  • the wires are first straightened to keep the wires in a tight state, which is beneficial to the first straight track PQ.
  • a relatively precise core exposed portion 310 is obtained in the extending direction, and two adjacent exposed core portions 310 of two wires are enclosed to form an exposed area for supporting a supporting base 12 .
  • three wires are arranged side by side along the first straight track PQ to form the wire assembly 31 , and the three wires are all formed with core exposed parts 310 at the same extension length.
  • the wire is guided and extended along the first straight track PQ by the lead rod, and the wire extending along the first straight track PQ is crimped by the crimping board to avoid twisting and deformation of the wire.
  • Detectors and encoders are used to measure the length of the wire extension in order to determine the area of insulation stripping.
  • the number of wires is not limited to two or three, and more than three wires may constitute the wire assembly 31 .
  • Step S02 arranging at least two bearing bases 12 on at least two wires at intervals along the first straight track PQ.
  • the carrying base 12 is placed on the exposed core portion 310 of the wire.
  • it before the bearing base 12 is placed on the wire core exposed portion 310, it also includes coating solder paste on the wire core exposed portion 310 of the wire, so as to improve the welding of the bearing base 12 and the wire core exposed portion 310 reliability.
  • solder paste can also be applied on the carrying base 12 , or other methods can be used to improve the welding effect between the carrying base 12 and the wire.
  • the number of carrying bases 12 is at least two, and there are two exposed areas formed by at least two wires, and the two exposed areas are arranged at intervals along the first straight track PQ, so that each exposed area can area placed.
  • the number of bearing bases 12 is more than two, the number of exposed areas is the same as the number of bearing bases 12 , and each exposed area corresponds to a bearing base 12 .
  • the carrying base 12 forms multiple sets of first conductive pairs, and the multiple sets of first conductive pairs are arranged at intervals along the second straight track RS, the second straight track RS and the first straight track PQ are perpendicular to each other, Each set of the first conductive pair corresponds to a wire, so that the two conductive portions 121 of each set of the first conductive pair are correspondingly welded to a wire.
  • Step S03 welding the carrying base 12 and at least two wires, so that each wire is welded to the two conductive parts 121 arranged along the first straight track PQ, and the cross-wire part of at least one wire straddles the The through hole 120 between the two conductive parts 121 arranged along the first straight track PQ avoids the through hole 120 to form a punching part.
  • step S03 the carrying base 12 and the wire are welded and fixed by the hot air mechanism. After the welding is completed, one of the wires straddles the avoidance through hole 120, that is, a wire crossing portion (not shown in the figure) is formed, and the wire crossing portion The conductive parts 121 at opposite ends and opposite sides of the avoidance through hole 120 are soldered and fixed respectively, so as to facilitate subsequent punching of the wire.
  • Step S04 perform punching processing on the punching part, so that the wire is punched off.
  • step S04 the crossover portion of the wire is punched by the punching device 40 .
  • the wire welded with the bearing base 12 is first turned over so that the wire faces up and the bearing base 12 faces down, and the bearing base 12 leans against the support, the cutting knife 41 is from top to bottom, and Feed along the central axis direction of the avoidance through hole 120 and insert into the avoidance through hole 120 to punch off the cross-wire portion, so that the wire straddling the avoidance through hole 120 is divided into two parts.
  • the central axis of the through hole 120 withdraws from the avoidance through hole 120 to complete punching.
  • the punched wire is a signal line, that is, a multi-section signal line is formed, and one of the signal lines is a signal input line 312, and the signal lines of the remaining sections are a signal transmission line 313, and one end of the signal input line 312 is connected to an external signal source.
  • each section of signal transmission line 313 is connected between two adjacent bearing bases 12, so as to realize the level of the signal source between the LED lamp beads 21 couplet.
  • Steps S05-S06 laying at least one LED lamp bead 21 on the surface of each supporting base 12 facing away from the wire.
  • step S05 the wire welded with the carrying base 12 is first turned over so that the surface of the carrying base 12 facing away from the wire faces upwards, so as to facilitate the arrangement of the LED lamp beads 21 on the carrying base 12 .
  • it before arranging the LED lamp beads 21 on the bearing base 12, it also includes coating solder paste on the bearing base 12, so as to facilitate welding of the LED lamp beads 21 and the bearing base 12, and improve welding reliability. and welding firmness.
  • solder paste may also be coated on the conductive portion 121 of the LED lamp bead 21 .
  • each pin of the LED lamp bead 21 should be matched with one conductive part 121 .
  • the LED lamp holder 11 has a limiting protrusion (not shown in the figure), and the limiting protrusion is formed on the surface facing the LED lamp holder 11 and the bearing base 12 , and is compatible with the avoidance through hole 120 , when the LED lamp bead 21 is arranged on the bearing base 12 , the limiting protrusion is inserted into the avoidance through hole 120 .
  • the reliability of the connection between the LED lamp bead 21 and the carrying base 12 can be effectively improved by inserting the limiting protrusion into the avoidance through hole 120 .
  • Step S07 welding the lead part 1122 and the conductive part 121 .
  • step S07 the LED lamp bead 21 and the bearing base 12 are welded by a hot air mechanism, so as to realize fixing the LED lamp bead 21 on the bearing base 12 .
  • a hot air mechanism ensures that the orthographic projection of the bottom surface 1102 of the LED lamp holder 11 on the bearing base 12 does not exceed the area surrounded by the outer edge of the bearing base 12 .
  • the orthographic projection of the bottom surface 1102 of the LED lamp holder 11 on the bearing base 12 falls within the area surrounded by the outer edge of the bearing base 12 .
  • the orthographic projection of the bottom surface 1102 of the LED lamp holder 11 on the bearing base 12 coincides with the area surrounded by the outer edge of the bearing base 12 , thus ensuring that each bearing base 12 is welded with A piece of LED lamp bead 21.
  • step S07 it also includes insulating and sealing the welding parts of the wire and the carrying base 12 and the welding parts of the carrying base 12 and the LED lamp bead 21, and through the insulating and sealing process, the LED lamp bead 21 and the carrying base 12 are insulated and sealed.
  • the welding parts of the bearing base 12 and the welding parts of the at least two wires are insulated and sealed to improve the reliability of the LED strip 30 .
  • a sealant is attached to the welding position of the carrying base 12 and the wire and the welding position of the carrying base 12 and the LED lamp bead 21 , followed by UV curing and sealing.
  • an epoxy cure seal is used.
  • step S07 it also includes loading the carrying base 12 and the LED lamp bead 21 welded to the carrying base 12 into the lamp housing 32, and then installing the carrying base 12 and the LED lamp bead 21 Carry out sealing treatment.
  • the first housing 321 is covered on the end of the LED lamp bead 21 back to the bearing base 12, while the second housing 322 is covered on the end of the bearing base 12 facing away from the LED lamp bead 21, and the The first shell 321 and the second shell 322 are fastened together to form a cavity 320 for accommodating the LED lamp bead 21 and the carrying base 12
  • the lead assembly 31 welded to the carrying base 12 passes through the light housing through the lead hole 3202 32, and then inject glue into the glue injection hole 3201 of the accommodating cavity 320 to seal, and cure by UV or epoxy, and through curing, the first shell 321 and the second shell 322 are also fixed by the sealant.
  • a lamp housing 32 contains a bearing base 12 and LED lamp beads 21 welded to the
  • the LED base module 10 Please refer to Fig. 11, Fig. 12 and Fig. 1 to Fig. 10, the LED base module 10, the LED lamp module LED module 20, the LED light strip 30 and the manufacturing method and embodiment of the LED light strip 30 provided by this embodiment
  • the difference between the two mainly lies in the structural differences as follows:
  • an escape through hole 120 is opened in the bearing base 12 , and the avoidance through hole 120 is disposed between two conductive portions 121 of a first conductive pair.
  • the number of avoidance vias 120 is two
  • the number of first conductive pairs is one set
  • one avoidance via hole 120 is arranged between the first signal input end 1211 and the first signal output end 1212
  • the other avoidance through hole 120 is used for fixing the LED lamp holder 11 so as to fix the LED lamp bead 21 .
  • the number of the first conductive pairs is two groups, and one avoidance through hole 120 is correspondingly provided between the two conductive parts 121 of each group of the first conductive pair.
  • the number of the first conductive pairs is three groups, and the two avoidance via holes 120 are respectively disposed between the two conductive parts 121 of one group of the first conductive pairs.
  • the number of avoidance via holes 120 is three, and each avoidance via hole 120 is correspondingly disposed between two conductive portions 121 of a group of first conductive pairs.
  • the number of the first conductive pairs and the number of escape vias 120 may be other numbers.
  • the LED base module 10 the LED module 20, the LED light strip 30 and the corresponding parts and the manufacturing method of the LED light strip 30 provided by the second embodiment are the same. Reference can be made to the corresponding design in Embodiment 1, and to save space, details are not repeated here.
  • an avoidance through hole 120 is opened in the bearing base 12, and the avoidance through hole 120 is arranged between the two conductive parts 121 of a first conductive pair, and the avoidance through hole 120 is arranged in the bearing base 12 central locations.
  • the avoidance through hole 120 is arranged close to the edge of the bearing base 12, while the avoidance through hole 120 is formed with a gap that opens toward the circumferential side wall of the bearing base 12, and the gap starts from the first One end 12101 extends toward the second end 12102, so that the punching device 40 can not only feed along the central axis direction of the avoidance through hole 120 to realize punching, but also can feed along the second straight track RS to realize punching. cut.
  • the LED base module 10 the LED module 20, the LED light strip 30 and the corresponding parts and the manufacturing method of the LED light strip 30 provided by the third embodiment are the same as Reference can be made to the corresponding design in Embodiment 1, and to save space, details are not repeated here.
  • the LED base module 10 Please refer to FIG. 14 to FIG. 17 and FIG. 1 to FIG. 10 , the LED base module 10 , the LED lamp module LED module 20 , the LED light strip 30 and the manufacturing method and embodiment of the LED light strip 30 provided by this embodiment
  • the difference between one to any one of the three embodiments mainly lies in the following structural differences:
  • the insulating base 111 is formed with a cavity 110 for accommodating the LED chip assembly 211 and the LED encapsulant 212; a plurality of conductive terminals 112 are fixed on the insulating base by injection molding 111, and each conductive terminal 112 has a crystal-bonding part 1121 and a pin part 1122, the crystal-bonding part 1121 is penetrated in the cavity 110 for electrically connecting with the LED chip assembly 211, and the pin part 1122 is exposed to the insulating
  • the base 111 is used for connecting with the carrying base 12 .
  • the carrying base 12 has a plurality of conductive parts 121 and at least one escape hole 120 .
  • the insulating base 111 does not form the concave cavity 110, and the insulating base 111 and the plurality of conductive terminals 112 are fixed and formed by molding (Molding), that is, the insulating material is filled in a plurality of conductive terminals by molding.
  • An insulating base 111 is formed in the three-dimensional space formed by the conductive terminals 112, and each conductive terminal 112 is fixed on the insulating base 111, and the crystal-bonding part 1121 and the pin part 1122 of each conductive terminal 112 are exposed to the insulating base 111,
  • the die-bonding part 1121 is partially embedded in the top surface 1101 of the insulating base 111
  • the pin part 1122 is partially embedded in the bottom end surface 1102 of the insulating base 111
  • the LED chip assembly 211 is mounted on the crystal-bonding part 1121
  • the LED encapsulant 212 is pressed onto the top surface 1101 of the insulating base 111 and covers the LED chip assembly 211 by molding.
  • Such a structural design can enable the LED strip 30 to emit light from multiple sides, that is, emit light from the front of the LED lamp bead 21, and also emit light from the circumferential side of the LED lamp bead 21, so that the LED lamp strip 30 has a greater illumination effect .
  • Embodiment 4 Except that the above-mentioned structural setting scheme is different from Embodiment 1, Embodiment 2, and Embodiment 3, the LED base module 10, LED module 20, LED strip 30 and corresponding parts and LED lamps provided in Embodiment 4 are different.
  • the manufacturing method of the light strip 30 can refer to the corresponding design of any one of the first embodiment to the third embodiment, and to save space, details are not repeated here.

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Abstract

一种LED灯带（30）的制造方法，包括以下步骤：将至少两条导线沿第一直线轨迹（PQ）延伸设置，且相邻的两条导线之间具有间隔（S01）；将至少两块承载基座（12）沿第一直线轨迹（PQ）间隔布设于至少两条导线上（S02）；每块承载基座（12）具有避让通孔（120）和多个导电部（121），每两个导电部（121）沿第一直线轨迹（PQ）间隔设于承载基座（12），且至少一个避让通孔（120）设于沿第一直线轨迹（PQ）设置的两个导电部（121）之间；将承载基座（12）和导线进行焊接处理，使每条导线与沿第一直线轨迹（PQ）设置的两个导电部（121）分别焊接，且至少一条导线横跨避让通孔（120），以形成冲切部（S03）；对冲切部进行冲切处理(S04)；在每块承载基座（12）背对导线的表面布设LED灯珠（21）(S05-S06)；将LED灯珠（21）与导电部（121）焊接处理（S07）。LED灯带（30）的制造方法可有效提高LED灯带（30）的良品率和可靠性。

Description

LED灯带的制造方法 技术领域
本申请涉及发光二极管技术领域，尤其涉及一种LED灯带的制造方法。
背景技术
通过将采用封装胶将发光二极管(英文全称：light-emitting diode，简称：LED)和驱动芯片封装于LED支架的安装槽中以形成LED灯珠，再通过电源线、信号线等将多块ED灯珠经过串并联连接形成LED灯带，已经成为目前市面上LED灯带的主流加工方式。然而，在LED灯带的制造过程中，受限于LED支架的结构和引脚间距，电源线和信号线直接与引脚焊接，再将信号线位于两个引脚之间的部分切断，从而得到信号输入线和信号传输线，但是电源线、信号线在焊接时容易出现虚焊或者焊接不牢固，对信号线进行切断时还容易导致引脚变形等问题，导致灯带不良率高、可靠性较差，在寿命期内容易出现失效的风险。
技术问题
本申请实施例的目的是提供一种LED灯带的制造方法，旨在提高LED灯带加工的良品率和LED灯带加工可靠性。
技术解决方案
本申请的目的提供的技术方案如下：
LED灯带的制造方法，包括以下步骤：
将至少两条导线沿第一直线轨迹延伸设置，且相邻的两条所述导线之间具有间隔；
将至少两块承载基座沿所述第一直线轨迹间隔布设于所述至少两条导线上，且每块所述承载基座跨接于所述至少两条导线在相同延伸长度的部位；
其中，每块所述承载基座具有多个导电部和至少一个避让通孔，每两个所述导电部沿所述第一直线轨迹间隔设于所述承载基座，且至少一个所述避让通孔设于沿所述第一直线轨迹设置的两个所述导电部之间；
将所述承载基座和所述至少两条导线进行焊接处理，使每条所述导线与沿所述第一直线轨迹设置的两个所述导电部分别焊接，且至少一条所述导线横跨位 于沿所述第一直线轨迹设置的两个所述导电部之间的所述避让通孔，以形成冲切部；
对所述冲切部进行冲切处理，使所述导线被冲断；
在每块所述承载基座背对所述导线的表面布设至少一颗LED灯珠；
其中，每颗所述LED灯珠具有多个引脚部，且每个所述引脚部与一个所述导电部相配适；
将所述引脚部与所述导电部焊接处理。
优选地，还包括对所述至少两条导线进行壳层去除处理，使每条所述导线形成有与所述承载基座相配适的线芯裸露部，且每个所述线芯裸露部与一块所述承载基座沿所述第一直线轨迹设置的两个所述导电部连接，以使所述承载基座与所述至少两条导线焊接时，每个所述线芯裸露部与沿所述第一直线轨迹设置的两个所述导电部分别焊接，且至少一个所述线芯裸露部横跨位于沿所述第一直线轨迹的两个所述导电部之间的所述避让通孔，以形成所述冲切部。
优选地，所述承载基座和所述至少两条导线焊接时，还包括在所述线芯裸露部和/或所述承载基座进行锡膏点膏处理的步骤；
和/或，所述承载基座与所述LED灯座焊接时，还包括在所述导电部和/或所述引脚部进行锡膏点膏处理的步骤。
优选地，还包括对所述LED灯珠、所述承载基座以及所述导线进行封装处理的步骤，以使所述LED灯珠和所述承载基座的焊接部位以及所述承载基座和所述至少两条导线的焊接部位实现绝缘密封；
或者，还包括将所述LED灯珠、所述承载基座以及与所述承载基座焊接的局部所述导线封装于灯壳的步骤。
优选地，所述封装处理步骤为采用封装胶将所述LED灯珠、所述承载基座以及所述至少两条导线的部位进行密封。
优选地，所述LED灯珠包括LED灯座、LED芯片组件和LED封装胶；
所述LED灯座包括绝缘基座和多个导电端子；每个所述导电端子均固定于所述绝缘基座，且每个所述导电端子具有固晶部和露于所述绝缘基座外的所述引 脚部；
所述LED芯片组件与所述固晶部电性连接；
所述LED封装胶封装所述LED芯片组件和所述固晶部。
优选地，所述绝缘基座形成凹腔，以容置所述LED芯片组件和LED封装胶，所有的所述固晶部穿设于所述凹腔内；
或者，所述绝缘基座具有底端面和顶端面，所述固晶部外露于所述顶端面，所述引脚部外露于所述底端面，所述LED封装胶通过模压固定在所述顶端面。
优选地，所述LED灯座具有限位凸起，所述限位凸起形成于所述LED灯座与所述承载基座正对的表面，且与所述避让通孔相配适；
和/或，所述LED芯片组件包括驱动芯片和至少一种发光芯片，所述驱动芯片与所述发光芯片电性连接。
优选地，所述至少两条导线的数量为两条，所述避让通孔的数量为一个，其中一条所述导线跨于所述避让通孔，以形成所述冲切部；
或者，所述至少两条导线的数量为两条以上，所述避让通孔的数量为一个，其中一条所述导线横跨于所述避让通孔，以形成所述冲切部；
或者，所述至少两条导线的数量为两条以上，所述避让通孔的数量为两个或两个以上，其中一条所述导线横跨位于沿所述第一直线轨迹的两个所述导电部之间的所述避让通孔，以形成所述冲切部。
优选地，每块所述承载基座上焊接有一颗所述LED灯珠；
所述LED灯珠包括LED灯座，所述LED灯座的底部在所述承载基座上的正投影不超出所述承载基座的外边缘围成的区域。
优选地；所述LED灯座的底部在所述承载基座上的正投影位于所述承载基座的外边缘所围成的区域内；
或者，所述LED灯座的底部在所述承载基座上的正投影与所述承载基座的外边缘所围成的区域重合。
有益效果
本申请的有益效果在于：与现有技术相比，本申请提供的LED灯带的制造方法，先将导线与具有避让通孔的承载基座进行焊接，并且承载基座具有多个导 电部，焊接时，一条导线焊接于沿第一直线轨迹间隔布设的两个导电部，避让通孔设于沿第一轨迹间隔布设的两个导电部之间，使得导线在两个导电部之间的部位跨越于避让通孔，从而对导线进行冲切时，避让通孔为冲切提供避让空间，不仅避免冲切设备冲伤或者损坏承载基座，而且还解决了直接在LED灯珠上焊接导线和冲切导线时存在的虚焊或者焊接不牢固以及引脚变形等问题，从而使得LED灯带制造的良品率得到有效提高，且在使得LED灯带的制造精度得到降低的同时还提高了加工效率，使得制造得到的LED灯带的质量和可靠性得到有效提高。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例一提供的LED基座模组的立体结构示意图；
图2为本申请实施例一提供的承载基座的剖视示意图；
图3为本申请实施例一提供的LED模组的爆炸结构示意图；
图4为本申请实施例一提供的去除LED封装胶的LED灯珠的立体结构示意图；
图5为本申请实施例一提供的LED灯带的立体结构示意图；
图6为本申请实施例一提供的灯壳的立体结构示意图；
图7为本申请实施例一提供的灯壳的爆炸结构示意图；
图8为本申请实施例一提供的包括灯壳的LED灯带的立体结构示意图；
图9为本申请实施例一的LED灯带的制造方法流程示意图；
图10为本申请实施例一的LED灯带的制造方法流程示意图；
图11为本申请实施例二提供的承载基座的立体结构示意图；
图12为本申请实施例二另一实施方式提供的承载基座的立体结构示意图；
图13为本申请实施例三提供的承载基座的立体结构示意图；
图14为本申请实施例四提供的LED灯珠的立体结构示意图；
图15为本申请实施例四提供的LED灯珠另一视角的立体结构示意图；
图16为本申请实施例四提供的LED灯珠去除LED密封胶的立体结构示意图；
图17为本申请实施例四提供的LED灯珠的爆炸结构示意图。
附图标记：
10、LED基座模组；
11、LED灯座；111、绝缘基座；110、凹腔；112、导电端子；1121、固晶部；1122、引脚部；11221、第二信号输入端；11222、第二信号输出端；1101、顶端面；1102、底端面；
12、承载基座；120、避让通孔；121、导电部；12101、第一端部；12102、第二端部；1211、第一信号输入端；1212、第一信号输出端；
20、LED模组；
21、LED灯珠；211、LED芯片组件；2111、驱动芯片；2112、发光芯片；2113、连接线；212、LED封装胶；
30、LED灯带；
31、导线组件；310、线芯裸露部；311、电源线；312、信号输入线；313、信号传输线；314、接地线；
32、灯壳；320、容纳腔；3201、注胶孔；3202、导线孔；321、第一壳体；322、第二壳体；
40、冲切设备；41、切刀；PQ、第一直线轨迹；RS、第二直线轨迹。
本申请的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
实施例一
图1至图5所示为本实施例提供的LED基座模组10、LED模组20以及LED灯带30及相应的零部件的结构示意图；图9至图10为本实施例提供的LED灯带30的制造方法流程示意图。
请参阅图1和图3，本实施例的LED基座模组10包括LED灯座11和用 于承载LED灯座11的承载基座12。其中，LED灯座11包括绝缘基座111和多个导电端子112，绝缘基座111形成有用于容置LED芯片组件211和LED封装胶212的凹腔110；多个导电端子112通过注塑成型方式固定于绝缘基座111，且每个导电端子112具有固晶部1121和引脚部1122，固晶部1121穿设于凹腔110内以用于与LED芯片组件211电性连接，而引脚部1122露于绝缘基座111外以用于与承载基座12连接。承载基座12具有多个导电部121和至少一个避让通孔120；每个导电部121均具有第一端部12101和第二端部12102，第一端部12101和第二端部12102分别设于承载基座12的两相对端面，第一端部12101用于与引脚部1122电性连接、第二端部12102用于与导线电性连接；至少一个避让通孔120用于供跨越于避让通孔120的导线冲切避让。本实施例中，承载基座12形成有避让通孔120，并且避让通孔120设于两个导电部121之间，当一条导线跨越在避让通孔120且分别与两个导电部121焊接时，导线在与避让通孔120正对的部位形成跨线部，由于跨线部与避让通孔120正对，方便对跨线部进行冲切以冲断导线，并且在冲切过程中，冲切设备40不会冲击或者损坏LED灯座11，能有效地对LED灯座11形成保护，利用本实施例的LED基座模组10制造成LED灯带30时，良品率可以达到99.7％以上。
请参阅图2和图1，在一些实施方式中，绝缘基座111具有底端面1102和顶端面1101，凹腔110从顶端面1101向底端面1102的方向凹陷，固晶部1121从绝缘基座111穿设于凹腔110，引脚部1122外露于底端面1102；导电部121沿底端面1102至顶端面1101的方向延伸设于承载基座12，并且导电部121形成的第一端部12101朝向底端面1102，而导电部121形成第二端部12102背对底端面1102，这样有利于第一端部12101与引脚部1122相适配电性连接，同时有利于第二端部12102与导线相适配电性连接，可以有效地的实现在承载基座12的相对两侧分别焊接有LED灯座11和导线；避让通孔120沿底端面1102至顶端面1101的方向形成于承载基座12，使得焊接于承载基座12的导线中，其中一条导线在承载基座12背对LED灯座11的表面跨越避让通孔120，冲切时，切刀穿过避让通孔120，即可将跨越避让通孔120的导线切断。
请参阅图1，在一些实施方式中，至少部分导电部121两两间隔组成第一导电对，在同一组第一导电对中，一个导电部121为输入端、另一个导电部121为输出端；避让通孔120形成于一组第一导电对的两个导电部121之间。这样的结构设计，当一条导线连接于第一导电对的两个导电部121之间时，导线的局部跨越于避让通孔120形成跨线部，并且跨线部的相对两端为焊接部，将焊接部与两个导电部121对应进行焊接后，方便对导线进行冲切，使得作为输入端的导电部121与作为输出端的导电部121之间的传输不能由横跨在两个导电部121之间的导线直接传输，而是从作为输入端的导电部121经一引脚部1122传输至安装于凹腔110的LED芯片组件211，再由LED芯片组件211另一引脚部1122传输至作为输出端的导电部121并经过导线传输至下一个LED芯片组件211，从而可以实现多块LED模组20的信号级联传输。而避让通孔120的结构设计，可以提高LED灯带30的加工可靠性，避免对导线进行冲切时，损伤或者损坏LED灯座11，也可以有效解决冲切对焊接可靠性的影响。除了形成第一导电对的两个导电部121外，其余的导电部121可以不成对分布，也可以成对分布。
请参阅图1和图2，在一些实施方式中，第一导电对的数量为一组，第一导电对中，作为输入端的导电部121为第一信号输入端1211、作为输出端的导电部121为第一信号输出端1212。此时，避让通孔120的数量为一个，并且避让通孔120设于第一信号输入端1211和第一信号输出端1212之间；以供导线沿着第一信号输入端1211向第一信号输出端1212延伸时横跨于避让通孔120，从而方便对导线进行冲切，以截断连接在第一信号输入端1211和第一信号输出端1212之间的跨线部，避免第一信号输入端1211和第一信号输出端1212通过横跨于避让通孔120的导线直接连通。在一些实施方式中，第一导电对的数量为三组，避让通孔120设置于其中一组第一导电对的两个导电部121之间。当然，第一导电对的组数不局限于一组或者三组，也可以是两组或者四组以上，具体可以根据实际需要进行设定。
请参阅图1或图2，在一些实施方式中，承载基座12包括BT树脂基板(BT)、印刷电路板(PCB)、PCBA板以及柔性印刷电路板(FPCB)中的任一种。以列 举的这几种板作为承载基座12，一方面具有良好的绝缘性能，另一方面还便于冲切加工。
请参阅图1，在一些实施方式中，LED灯座11具有限位凸起(图中未标示)，限位凸起形成于LED灯座11与承载基座12正对的表面，亦即限位凸起自LED灯座11的底端面1102向承载基座12延伸。从而方便承载基座12安装LED灯座11时，限位凸起插接于避让通孔120中，以提高LED灯座11和承载基座12的定位的可靠性和连接可靠性。
请参阅图1，在一些实施方式中，LED灯座11的底端面1102在承载基座12上的正投影不超出承载基座12的外边缘围成的区域。这样的结构设计，可以在一块承载基座12上安装至少一块LED灯座11，从而可以实现一块承载基座12搭载多颗LED灯珠21的效果。在一些实施方式中，LED灯座11的底端面1102在承载基座12上的正投影落入承载基座12的外边缘所围成的区域内，这样的结构设计，每块承载基座12可以安装多颗LED灯珠21。在一些实施方式中，LED灯座11的底端面1102在承载基座12上的正投影与承载基座12的外边缘所围成的区域重合，这样的结构设计，确保每块承载基座12可以安装一颗LED灯珠21。承载基座12和LED灯座11的结构设计，可以使得LED灯座11与导线的焊接不再受限于LED灯座11的尺寸，而是取决于承载基座12，将直接在LED灯座11上焊接导线的方式转变成在承载基座12焊接导线，从而可以有效提到LED灯带30的加工效率以及提高LED灯带30制造的良品率。
请参阅图3和图4，在上述LED基座模组10的基础上，本实施例还提供一种LED模组20。LED模组20包括上述的承载基座12以及LED灯珠21；其中，承载基座12中的一个导电部121为第一信号输入端1211，另一个导电部121为第一信号输出端1212，一个避让通孔120设于第一信号输入端1211和第一信号输出端1212之间。LED灯珠21包括LED芯片组件211、LED封装胶212和上述的LED灯座11；LED芯片组件211安装于凹腔110中，并且与固晶部1121电性连接；LED封装胶212填充于凹腔110中；LED灯座11中的一个引脚部1122作为第二信号输入端11221，另一个引脚部1122作为第二信号输出端11222；第 二信号输入端11221用于与第一信号输入端1211相配适连接，第二信号输出端11222用于与第一信号输出端1212相配适连接。
请参阅图4，在一些实施方式中，LED芯片组件211包括驱动芯片2111(即IC芯片)和至少一种发光芯片2112，其中，驱动芯片2111与发光芯片2112电性连接。在一些实施方式中，驱动芯片2111安装于其中一个固晶部1121，一种发光芯片2112对应安装在一个固晶部1121。在一些实施方式中，LED芯片组件211还包括连接线2113，每种发光芯片2112通过连接线2113与驱动芯片2111实现电连接，同时，驱动芯片2111通过连接线2113实现与固晶部1121电连接，从而自第一信号输入端1211输入的信号可以传递至驱动芯片2111中；每种发光芯片2112通过连接线2113实现与用于安装该种发光芯片2112的固晶部1121电连接。在一些实施方式中，发光芯片2112包括蓝光LED芯片、绿光LED芯片、红光LED芯片、白光LED芯片等，每一种发光芯片2112对应安装在一个固晶部1121；或者一个固晶部1121上间隔安装有两个以上的发光芯片2112。
请参阅图5和图3，在上述LED模组20的基础上，本实施例还提供一种LED灯带30。
具体地，LED灯带30包括导线组件31以及至少两个LED模组20。其中，导线组件31至少包括电源线311、信号输入线312和至少一条信号传输线313，每块承载基座12至少焊接有一颗LED灯珠21；电源线311用于将LED灯珠21与外部电源实现电连通，而信号输入线312的一端与外部信号源连接、另一端与其中一块承载基座12的第一信号输入端1211连接，以向LED灯带30输入信号；信号传输线313的一端与其中一块承载基座12的第一信号输出端1212连接、另一端与另一块承载基座12的第一信号输入端1211连接，以使信号在相邻的两颗LED灯珠21之间级联传输。
请参阅图5和图1，在一些实施方式中，电源线311与每个承载基座12其余导电部121中的一个导电部121连接，从而可以实现向LED灯带30供电。在一些实施方式中，导线组件31还包括接地线314，接地线314用于将LED灯带30接地。在一些实施方式中，LED灯带30还包括绝缘密封胶(图中未示意)， 绝缘密封胶至少包裹LED模组20和导线组件31相互连接的部位。在一些实施方式中，绝缘密封胶对导线组件31裸露的部位和LED模组20进行全部密封，从而避免LED灯珠21和承载基座12焊接的部位漏电，同时避免承载基座12与导线组件31焊接的部位漏电。在一些实施方式中，导线组件31除了电源线311、信号输入线312、信号传输线313以及接地线314外，还可以根据实际需要增加其他线。
请参阅图6、图7以及图8，在一些实施方式中，LED灯带30还包括灯壳32，灯壳32具有容纳腔320，以用于收容LED模组20，密封胶则填充于容纳腔320中，将LED模组20进行密封，并且灯壳32具有透光性，以供LED灯珠21的光透过。在一些实施方式中，一个LED灯壳32里收容有一个LED模组20，或者一个LED灯壳32收容有两个以上的LED模组20。在一些实施方式中，灯壳32包括第一壳体321和第二壳体322，第一壳体321和第二壳体322相互扣合而形成灯壳32，并且由第一壳体321和第二壳体322围合形成容纳腔320。在一些实施方式中，灯壳32形成有注胶孔3201和导线孔3202，其中注胶孔3021用于供密封胶注入以实现对LED模组20的密封，同时密封胶还将第一壳体321和第二壳体322进行胶接固定，而导线孔3202则供与LED模组20焊接的导线组件31穿出灯壳32。
请参阅图9和图10，在上述LED灯带30的基础上，本实施例还提供一种LED灯带30的制造方法。
具体地，LED灯带30的制造方法包括以下步骤：
步骤S01、将至少两条导线沿第一直线轨迹PQ延伸设置，且相邻的两条导线之间具有间隔。
在步骤S01中，将至少两条导线沿第一直线轨迹PQ延伸设置之前，还包括对至少两条导线进行绝缘层去除处理的步骤，通过对导线进行绝缘层的剥除，使每条导线形成有与承载基座12相配适的线芯裸露部310，且每个线芯裸露部310与一块承载基座12沿第一直线轨迹PQ设置的两个导电部121连接，以使承载基座12与至少两条导线焊接时，每个线芯裸露部310与沿第一直线轨迹PQ 设置的两个导电部121分别焊接，且至少一个线芯裸露部310横跨位于沿第一直线轨迹PQ的两个导电部121之间的避让通孔120，以形成冲切部。在本实施例中，至少两条导线沿第一直线轨迹PQ延伸设置，形成导线组件31。
在一些实施方式中，对导线进行绝缘层去除处理，即去除漆包线层，绝缘层去除时，先将导线拉直，使导线保持绷紧的状态，从而有利于在沿第一直线轨迹PQ的延伸方向上获得较为精准的线芯裸露部310，由两条导线相邻的两个线芯裸露部310围合形成裸露区域，以供支撑一块承载基座12。在一些实施方式中，三条导线沿第一直线轨迹PQ并排设置以形成导线组件31，并且三条导线在相同的延伸长度均形成有线芯裸露部310。在一些实施方式中，通过引线杆将导线沿第一直线轨迹PQ引导延伸，并且通过压线板将对沿第一直线轨迹PQ延伸的导线进行压线处理，避免导线扭曲变形，同时通过探测器以及编码器来计量导线延伸的长度，以便于确定绝缘层剥离的区域。在一些实施方式中，导线的数量不局限于两条或者三条，也可以是三条以上构成导线组件31。
步骤S02、将至少两块承载基座12沿第一直线轨迹PQ间隔布设于至少两条导线上。
在步骤S02中，承载基座12放置在导线的线芯裸露部310。在一些实施方式中，在将承载基座12放置在线芯裸露部310之前，还包括向导线的线芯裸露部310上涂布锡膏，以提高承载基座12和线芯裸露部310的焊接可靠性。在一些实施方式中，也可以在承载基座12上涂布锡膏，或者采用其他可以提高承载基座12和导线焊接效果的方式也可以。在一些实施方式中，承载基座12的数量最少为两块，至少两条导线形成的裸露区有两个，并且两个裸露区沿第一直线轨迹PQ间隔设置，从而可以在每个裸露区放置。在一些实施方式中，承载基座12的数量为两块以上，裸露区的数量与承载基座12的数量相同，并且每个裸露区对应放置一块承载基座12。
在一些实施方式中，承载基座12形成有多组第一导电对，并且多组第一导电对沿第二直线轨迹RS间隔设置，第二直线轨迹RS和第一直线轨迹PQ相互垂直，每组第一导电对对应与一条导线正对，从而使得每组第一导电对的两个导 电部121对应与一条导线焊接。
步骤S03、将承载基座12和至少两条导线进行焊接处理，使每条导线与沿第一直线轨迹PQ设置的两个导电部121分别焊接，且至少一条导线的跨线部横跨位于沿第一直线轨迹PQ设置的两个导电部121之间的避让通孔120，以形成冲切部。
在步骤S03中，通过热风机构将承载基座12和导线进行焊接固定，焊接结束，其中一条导线横跨于避让通孔120，即形成跨线部(图中未标示)，并且跨线部的相对两端与避让通孔120相对两侧的导电部121分别实现焊接固定，以方便后续对该导线进行冲切。
步骤S04、对冲切部进行冲切处理，使导线被冲断。
在步骤S04中，通过冲切设备40对导线的跨线部进行冲切。冲切时，先将焊接有承载基座12的导线进行翻转，使得导线朝上而承载基座12朝下，并且承载基座12抵靠在支撑件上，切刀41自上而下，且沿着避让通孔120的中心轴方向进给并插入避让通孔120，以冲断跨线部，使得横跨于避让通孔120的导线被分成两部分，冲切结束，切刀41沿避让通孔120的中心轴退出避让通孔120，完成冲切。整个冲切过程，切刀41只冲断导线的跨线部，而不冲切导线其他线段，切刀41也不与承载基座12发生碰触，有效地避免了冲切设备40对承载基座12的损伤甚至破坏，同时可以提高冲切效率。被冲断的导线，即为信号线，即形成多段信号线，并且其中一段信号线为信号输入线312，其余段的信号线为信号传输线313，信号输入线312的一端与外部信号源连接，以通过承载基座12的导电部121向LED灯珠21输入信号，每一段信号传输线313连接于相邻的两块承载基座12之间，以实现信号源在LED灯珠21之间的级联。
步骤S05～S06、在每块承载基座12背对导线的表面布设至少一颗LED灯珠21。
在步骤S05中，先将焊接有承载基座12的导线进行翻转，使得承载基座12背对导线的表面朝上，从而便于将LED灯珠21布设于承载基座12。在一些实施方式中，在将LED灯珠21布设于承载基座12前，还包括在承载基座12上 涂布锡膏，以利于LED灯珠21和承载基座12焊接，提高焊接可靠性和焊接牢固性。在一些实施方式中，也可以在LED灯珠21的导电部121涂布锡膏。在布设LED灯珠21时，应使得LED灯珠21的每个引脚与一个导电部121相配适。
在一些实施方式中，LED灯座11具有限位凸起(图中未示意)，限位凸起形成于LED灯座11与承载基座12正对的表面，且与避让通孔120相配适，在将LED灯珠21布设于承载基座12时，限位凸起插入避让通孔120中。通过限位凸起插接于避让通孔120，可以有效提高LED灯珠21与承载基座12连接的可靠性。
步骤S07、将引脚部1122与导电部121焊接处理。
在步骤S07中，通过热风机构将LED灯珠21和承载基座12进行焊接，实现将LED灯珠21固定在承载基座12上。焊接时，确保LED灯座11的底端面1102在承载基座12上的正投影不超出承载基座12的外边缘围成的区域。在一些实施方式中，LED灯座11的底端面1102在承载基座12上的正投影落在承载基座12的外边缘所围成的区域内。在一些实施方式中，LED灯座11的底端面1102在承载基座12上的正投影与承载基座12的外边缘所围成的区域重合，从而可以确保每块承载基座12上焊接有一块LED灯珠21。
经过步骤S07，还包括对导线与承载基座12的焊接部位以及承载基座12与LED灯珠21的焊接部位进行绝缘密封处理，通过绝缘密封处理，以使LED灯珠21和承载基座12的焊接部位以及承载基座12和至少两条导线的焊接部位实现绝缘密封，提高LED灯带30的可靠性。在一些实施方式中，在承载基座12和导线焊接的部位以及承载基座12和LED灯珠21焊接的部位附上密封胶，随后进行UV固化密封。在一些实施方式中，采用环氧固化密封。
在另一些替代的实施方式中，经过步骤S07后，还包括将承载基座12以及焊接于承载基座12的LED灯珠21装入灯壳32，随后对承载基座12和LED灯珠21进行密封处理。具体是将第一壳体321盖合于LED灯珠21背承载基座12的端部，而第二壳体322则盖合于承载基座12背对LED灯珠21的端部，部并且第一壳体321和第二壳体322相互扣合以形成收容LED灯珠21和承载基座 12的容纳腔320，焊接于承载基座12的导线组件31则从导线孔3202穿出灯壳32，再向容纳腔320的注胶孔3201中注胶密封，并通过UV固化或者环氧固化，通过固化，第一壳体321和第二壳体322同样被密封胶固定。在一些实施方式中，一个灯壳32内容置有一块承载基座12和焊接于承载基座12的LED灯珠21。在一些实施方式中，一个灯壳32内容置密封有两块以上的承载基座12和焊接于承载基座12的LED灯珠21。
利用本实施例提供的LED灯带30的制造方法制造五种型号的LED灯带30，并对每种LED灯带30进行测试，测试时按表1所示的交流电压对每条LED灯带30通电，在通电后统计每条LED灯带30中LED灯珠21不亮的数量，结果如表1所示。
表1
Figure PCTCN2022073283-appb-000001
从表1可以看出，采用本实施例的LED灯带30的制造方法获得的五种型号的LED灯带，良品率均达到99.7％以上，可以说明本申请提供的制造方法可以获得较高的良品率。
实施例二
请参阅图11、图12以及图1至图10，本实施例提供的LED基座模组10、LED灯模组LED模组20以及LED灯带30和LED灯带30的制造方法与实施例一的区别主要在于如下所述结构上的不同：
对于实施例一，承载基座12中开设有一个避让通孔120，并且避让通孔120设于一组第一导电对的两个导电部121之间。而在本实施例中，避让通孔120 的数量为两个，第一导电对的数量为一组，其中一个避让通孔120设于第一信号输入端1211和第一信号输出端1212之间；另一个避让通孔120则用于供LED灯座11固定以对LED灯珠21进行固定。在一些实施方式中，第一导电对的数量为两组，每组第一导电对的两个导电部121之间分别对应设有一个避让通孔120。在一些实施方式中，第一导电对的数量为三组，两个避让通孔120分别设置于一组第一导电对的两个导电部121之间。在一些实施方式中，避让通孔120的数量为三个，每个避让通孔120对应设置于一组第一导电对的两个导电部121之间。当然，第一导电对的数量以及避让通孔120的数量可以是其他数。
除了上述的结构设置方案与实施例一不同外，本实施例二提供的LED基座模组10、LED模组20以及LED灯带30及相应的零部件以及LED灯带30的制造方法等均可参照实施例一对应设计，为节约篇幅，在此不再展开赘述。
实施例三
请参阅图13以及图1至图10，本实施例提供的LED基座模组10、LED灯模组LED模组20以及LED灯带30和LED灯带30的制造方法与实施例一的区别主要在于如下所述结构上的不同：
对于实施例一，承载基座12中开设有一个避让通孔120，并且避让通孔120设于一组第一导电对的两个导电部121之间，并且避让通孔120设于承载基座12的中心位置。而在本实施例中，在一些实施方式中，避让通孔120靠近承载基座12的边缘设置，同时避让通孔120形成有开口朝向承载基座12周向侧壁的缺口，且缺口自第一端部12101向第二端部12102延伸，使得冲切设备40既能够沿着避让通孔120的中心轴方向进给以实现冲切，又能够沿着第二直线轨迹RS进给以实现冲切。
除了上述的结构设置方案与实施例一不同外，本实施例三提供的LED基座模组10、LED模组20以及LED灯带30及相应的零部件以及LED灯带30的制造方法等均可参照实施例一对应设计，为节约篇幅，在此不再展开赘述。
实施例四
请参阅图14至图17以及图1至图10，本实施例提供的LED基座模组10、 LED灯模组LED模组20以及LED灯带30和LED灯带30的制造方法与实施例一至实施例三任一项的区别主要在于如下所述结构上的不同：
对于实施例一至实施例三的任一实施例，绝缘基座111形成有用于容置LED芯片组件211和LED封装胶212的凹腔110；多个导电端子112通过注塑成型方式固定于绝缘基座111，且每个导电端子112具有固晶部1121和引脚部1122，固晶部1121穿设于凹腔110内以用于与LED芯片组件211电性连接，而引脚部1122露于绝缘基座111外以用于与承载基座12连接。承载基座12具有多个导电部121和至少一个避让通孔120。而在本实施例中，绝缘基座111没有形成凹腔110，绝缘基座111和多个导电端子112通过模压成型(Molding)固定成型，即通过模压成型的方式将绝缘材料填充在由多个导电端子112形成的立体空间里形成绝缘基座111，并且每个导电端子112固定于绝缘基座111，每个导电端子112的固晶部1121和引脚部1122均外露于绝缘基座111，如固晶部1121局部嵌设于绝缘基座111的顶端面1101，而引脚部1122则局部嵌设于绝缘基座111的底端面1102，LED芯片组件211则安装于固晶部1121，最后再将LED封装胶212通过模压(Molding)的方式，压合在绝缘基座111的顶端面1101并覆盖LED芯片组件211。这样的结构设计，可以使得LED灯带30能够从多面出光，即从LED灯珠21的正面出光，还能够从LED灯珠21的周向侧面出光，使得LED灯带30具有较大的照射效果。
除了上述的结构设置方案与实施例一、实施例二、实施例三不同外，本实施例四提供的LED基座模组10、LED模组20以及LED灯带30及相应的零部件以及LED灯带30的制造方法等均可参照实施例一至实施例三任一项对应设计，为节约篇幅，在此不再展开赘述。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (11)

  1. LED灯带的制造方法，其特征在于，包括以下步骤：
    将至少两条导线沿第一直线轨迹延伸设置，且相邻的两条所述导线之间具有间隔；
    将至少两块承载基座沿所述第一直线轨迹间隔布设于所述至少两条导线上，且每块所述承载基座跨接于所述至少两条导线在相同延伸长度的部位；
    其中，每块所述承载基座具有多个导电部和至少一个避让通孔，每两个所述导电部沿所述第一直线轨迹间隔设于所述承载基座，且至少一个所述避让通孔设于沿所述第一直线轨迹设置的两个所述导电部之间；
    将所述承载基座和所述至少两条导线进行焊接处理，使每条所述导线与沿所述第一直线轨迹设置的两个所述导电部分别焊接，且至少一条所述导线横跨位于沿所述第一直线轨迹设置的两个所述导电部之间的所述避让通孔，以形成冲切部；
    对所述冲切部进行冲切处理，使所述导线被冲断；
    在每块所述承载基座背对所述导线的表面布设至少一颗LED灯珠；
    其中，每颗所述LED灯珠具有多个引脚部，且每个所述引脚部与一个所述导电部相配适；
    将所述引脚部与所述导电部焊接处理。
  2. 如权利要求1所述的LED灯带的制造方法，其特征在于，还包括对所述至少两条导线进行壳层去除处理，使每条所述导线形成有与所述承载基座相配适的线芯裸露部，且每个所述线芯裸露部与一块所述承载基座沿所述第一直线轨迹设置的两个所述导电部连接，以使所述承载基座与所述至少两条导线焊接时，每个所述线芯裸露部与沿所述第一直线轨迹设置的两个所述导电部分别焊接，且至少一个所述线芯裸露部横跨位于沿所述第一直线轨迹的两个所述导电部之间的所述避让通孔，以形成所述冲切部。
  3. 如权利要求2所述的LED灯带的制造方法，其特征在于，所述承载基座和所述至少两条导线焊接时，还包括在所述线芯裸露部和/或所述承载基座进 行锡膏点膏处理的步骤；
    和/或，所述承载基座与所述LED灯座焊接时，还包括在所述导电部和/或所述引脚部进行锡膏点膏处理的步骤。
  4. 如权利要求1所述的LED灯带的制造方法，其特征在于，还包括对所述LED灯珠、所述承载基座以及所述导线进行封装处理的步骤，以使所述LED灯珠和所述承载基座的焊接部位以及所述承载基座和所述至少两条导线的焊接部位实现绝缘密封；
    或者，还包括将所述LED灯珠、所述承载基座以及与所述承载基座焊接的局部所述导线封装于灯壳的步骤。
  5. 如权利要求4所述的LED灯带的制造方法，其特征在于，所述封装处理步骤为采用封装胶将所述LED灯珠、所述承载基座以及所述至少两条导线的部位进行密封。
  6. 如权利要求1所述的LED灯带的制造方法，其特征在于，所述LED灯珠包括LED灯座、LED芯片组件和LED封装胶；
    所述LED灯座包括绝缘基座和多个导电端子；每个所述导电端子均固定于所述绝缘基座，且每个所述导电端子具有固晶部和露于所述绝缘基座外的所述引脚部；
    所述LED芯片组件与所述固晶部电性连接；
    所述LED封装胶封装所述LED芯片组件和所述固晶部。
  7. 如权利要求6所述的LED灯带的制造方法，其特征在于，所述绝缘基座形成凹腔，以容置所述LED芯片组件和LED封装胶，所有的所述固晶部穿设于所述凹腔内；
    或者，所述绝缘基座具有底端面和顶端面，所述固晶部外露于所述顶端面，所述引脚部外露于所述底端面，所述LED封装胶通过模压固定在所述顶端面。
  8. 如权利要求6所述的LED灯带的制造方法，其特征在于，所述LED灯座具有限位凸起，所述限位凸起形成于所述LED灯座与所述承载基座正对的表面，且与所述避让通孔相配适；
    和/或，所述LED芯片组件包括驱动芯片和至少一种发光芯片，所述驱动芯片与所述发光芯片电性连接。
  9. 如权利要求1至8任一项所述的LED灯带的制造方法，其特征在于，所述至少两条导线的数量为两条，所述避让通孔的数量为一个，其中一条所述导线跨于所述避让通孔，以形成所述冲切部；
    或者，所述至少两条导线的数量为两条以上，所述避让通孔的数量为一个，其中一条所述导线横跨于所述避让通孔，以形成所述冲切部；
    或者，所述至少两条导线的数量为两条以上，所述避让通孔的数量为两个或两个以上，其中一条所述导线横跨位于沿所述第一直线轨迹的两个所述导电部之间的所述避让通孔，以形成所述冲切部。
  10. 如权利要求1至8任一项所述的LED灯带的制造方法，其特征在于，每块所述承载基座上焊接有一颗所述LED灯珠；
    所述LED灯珠包括LED灯座，所述LED灯座的底部在所述承载基座上的正投影不超出所述承载基座的外边缘围成的区域。
  11. 如权利要求10所述的LED灯带的制造方法，其特征在于，所述LED灯座的底部在所述承载基座上的正投影位于所述承载基座的外边缘所围成的区域内；
    或者，所述LED灯座的底部在所述承载基座上的正投影与所述承载基座的外边缘所围成的区域重合。
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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514791A (en) * 1983-09-12 1985-04-30 Naomitsu Tokieda Lamp ribbon
CN103367344A (zh) * 2012-04-11 2013-10-23 光宝电子(广州)有限公司 连板料片、发光二极管封装品及发光二极管灯条
CN112838153A (zh) * 2021-02-02 2021-05-25 东莞市华彩威科技有限公司 一种led灯串、制造方法以及用于该led灯串中的led器件
CN213599119U (zh) * 2020-12-30 2021-07-02 深圳市逸飞光电科技有限公司 灯珠以及灯串
CN213686267U (zh) * 2020-12-03 2021-07-13 深圳市诚功伟业科技有限公司 一种新型三线串联式灯串
CN214147795U (zh) * 2021-01-11 2021-09-07 黄萍 信号串联的移位寄存贴片发光二极管灯珠用印制电路板
CN113566128A (zh) * 2021-08-05 2021-10-29 深圳市天成照明有限公司 便于切线的灯珠、灯串以及灯串加工方法
CN214580580U (zh) * 2020-12-07 2021-11-02 张小锋 一种led灯串通电快接机构及led灯串

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19627856A1 (de) * 1996-07-11 1998-01-15 Happich Fahrzeug & Ind Teile Beleuchtungsleiste und Verfahren zur Herstellung
CN100547282C (zh) * 2002-04-25 2009-10-07 林原 可挠性发光体装置及其制造方法
US20110232087A1 (en) * 2010-03-29 2011-09-29 Cheng-Chung Chiu Method for manufacturing led light strings
CN202048540U (zh) * 2010-07-23 2011-11-23 王定锋 用三条扁平导线制作的led灯电路板
US20120238045A1 (en) * 2010-12-22 2012-09-20 E. I. Du Pont De Nemours And Company Three dimensional light emitting diode systems, and compositions and methods relating thereto
KR101278835B1 (ko) * 2011-06-28 2013-07-01 이형곤 엘이디용 회로기판원판, 회로기판, 엘이디유닛, 조명기구 및 제조방법
CN104565962A (zh) * 2013-10-25 2015-04-29 鹤山丽得电子实业有限公司 一种单层导电层双面发光的柔性led条形灯
CN107525048A (zh) * 2016-06-22 2017-12-29 鹤山市银雨照明有限公司 一种led灯板、其制作方法及一种led条形灯
CN205896724U (zh) * 2016-07-19 2017-01-18 鹤山市银雨照明有限公司 一种双面发光led灯板及led条形灯
US10288235B1 (en) * 2017-03-03 2019-05-14 Willis Electric Co., Ltd. Refractive decorative lighting string
US20180283668A1 (en) * 2017-03-31 2018-10-04 Sensio America, LLC Modular power system for cabinets
CN110030507A (zh) * 2018-01-06 2019-07-19 王定锋 一种导线电路板led灯带及其制作方法
CN210928187U (zh) * 2018-11-04 2020-07-03 铜陵国展电子有限公司 一种含增强抗拉线的线路板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514791A (en) * 1983-09-12 1985-04-30 Naomitsu Tokieda Lamp ribbon
CN103367344A (zh) * 2012-04-11 2013-10-23 光宝电子(广州)有限公司 连板料片、发光二极管封装品及发光二极管灯条
CN213686267U (zh) * 2020-12-03 2021-07-13 深圳市诚功伟业科技有限公司 一种新型三线串联式灯串
CN214580580U (zh) * 2020-12-07 2021-11-02 张小锋 一种led灯串通电快接机构及led灯串
CN213599119U (zh) * 2020-12-30 2021-07-02 深圳市逸飞光电科技有限公司 灯珠以及灯串
CN214147795U (zh) * 2021-01-11 2021-09-07 黄萍 信号串联的移位寄存贴片发光二极管灯珠用印制电路板
CN112838153A (zh) * 2021-02-02 2021-05-25 东莞市华彩威科技有限公司 一种led灯串、制造方法以及用于该led灯串中的led器件
CN113566128A (zh) * 2021-08-05 2021-10-29 深圳市天成照明有限公司 便于切线的灯珠、灯串以及灯串加工方法

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