WO2010035583A1 - Appareil et procédé de montage de composant électronique - Google Patents

Appareil et procédé de montage de composant électronique Download PDF

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Publication number
WO2010035583A1
WO2010035583A1 PCT/JP2009/064144 JP2009064144W WO2010035583A1 WO 2010035583 A1 WO2010035583 A1 WO 2010035583A1 JP 2009064144 W JP2009064144 W JP 2009064144W WO 2010035583 A1 WO2010035583 A1 WO 2010035583A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
adhesive tape
tape
tcp
mounting
Prior art date
Application number
PCT/JP2009/064144
Other languages
English (en)
Japanese (ja)
Inventor
悦郎 南浜
治雄 森
圭剛 広瀬
Original Assignee
芝浦メカトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦メカトロニクス株式会社 filed Critical 芝浦メカトロニクス株式会社
Publication of WO2010035583A1 publication Critical patent/WO2010035583A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention porte sur un appareil de montage d'un composant électronique qui comprend : un appareil de découpage (5A, 5B) qui est agencé dans un corps principal d'appareil (1) et découpe un boîtier TCP dans une bande de support ; un moyen de réception/transfert (6A, 6B) qui reçoit et transfère le boîtier TCP découpé ; un moyen d'indexage (18A, 18B) comprenant une pluralité de têtes de maintien qui reçoivent et maintiennent les boîtiers TCP transférés ; un appareil de collage (31A, 31B) qui fait adhérer la bande adhésive sur les boîtiers TCP qui ont été transférés aux têtes de maintien ; un appareil à table qui reçoit et aligne un substrat ; et une tête de montage (53) qui monte sur le substrat aligné le boîtier TCP sur lequel est collée la bande adhésive. L'appareil de collage comprend : une bobine débitrice (34) sur laquelle est enroulée la bande adhésive sur laquelle est collée une bande détachable et qui est agencée au niveau d'une section inférieure à l'intérieur du corps principal d'appareil ; et un moyen de chauffage/mise sous pression (43) qui est agencé au-dessus de la bobine débitrice, et met sous pression et fait adhérer sur le boîtier TCP la bande adhésive, qui a été déroulée de la bobine débitrice avec la bande détachable et coupée à une longueur prédéterminée, tout en chauffant la bande adhésive.
PCT/JP2009/064144 2008-09-29 2009-08-10 Appareil et procédé de montage de composant électronique WO2010035583A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-250518 2008-09-29
JP2008250518A JP5173709B2 (ja) 2008-09-29 2008-09-29 電子部品の実装装置及び実装方法

Publications (1)

Publication Number Publication Date
WO2010035583A1 true WO2010035583A1 (fr) 2010-04-01

Family

ID=42059590

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/064144 WO2010035583A1 (fr) 2008-09-29 2009-08-10 Appareil et procédé de montage de composant électronique

Country Status (3)

Country Link
JP (1) JP5173709B2 (fr)
TW (1) TW201028058A (fr)
WO (1) WO2010035583A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011233708A (ja) * 2010-04-27 2011-11-17 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
EP3275821A4 (fr) * 2015-03-23 2018-11-14 Boe Technology Group Co. Ltd. Appareil de fixation de puce sur un film

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908471B (zh) * 2014-03-12 2021-06-29 苏州海博智能系统有限公司 电子显示屏印刷片材的处理方法
CN104960349B (zh) * 2015-06-11 2021-08-06 苏州海博智能系统有限公司 一种电子显示屏印刷片材的处理设备
CN112768588B (zh) * 2021-01-04 2022-03-08 深圳市科润光电股份有限公司 一种led封装封胶用的加热结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307366A (ja) * 1994-05-13 1995-11-21 Matsushita Electric Ind Co Ltd 異方性導電テープ収納用カセットおよび異方性導電テープの貼着装置
JP2003198197A (ja) * 2001-12-28 2003-07-11 Matsushita Electric Ind Co Ltd 加圧装置及び加圧方法
JP2006216606A (ja) * 2005-02-01 2006-08-17 Alps Electric Co Ltd リールクーラ
JP2008016594A (ja) * 2006-07-05 2008-01-24 Matsushita Electric Ind Co Ltd Ａｃｆ貼付装置、ａｃｆ貼付方法、仮圧着装置、及び液晶ドライバ実装機
WO2008102592A1 (fr) * 2007-02-22 2008-08-28 Shibaura Mechatronics Corporation Appareil et procédé pour le montage d'un composant électronique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307366A (ja) * 1994-05-13 1995-11-21 Matsushita Electric Ind Co Ltd 異方性導電テープ収納用カセットおよび異方性導電テープの貼着装置
JP2003198197A (ja) * 2001-12-28 2003-07-11 Matsushita Electric Ind Co Ltd 加圧装置及び加圧方法
JP2006216606A (ja) * 2005-02-01 2006-08-17 Alps Electric Co Ltd リールクーラ
JP2008016594A (ja) * 2006-07-05 2008-01-24 Matsushita Electric Ind Co Ltd Ａｃｆ貼付装置、ａｃｆ貼付方法、仮圧着装置、及び液晶ドライバ実装機
WO2008102592A1 (fr) * 2007-02-22 2008-08-28 Shibaura Mechatronics Corporation Appareil et procédé pour le montage d'un composant électronique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011233708A (ja) * 2010-04-27 2011-11-17 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
EP3275821A4 (fr) * 2015-03-23 2018-11-14 Boe Technology Group Co. Ltd. Appareil de fixation de puce sur un film

Also Published As

Publication number Publication date
JP2010080876A (ja) 2010-04-08
TW201028058A (en) 2010-07-16
JP5173709B2 (ja) 2013-04-03

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