WO2010032427A1 - 部品実装装置及び部品実装方法 - Google Patents
部品実装装置及び部品実装方法 Download PDFInfo
- Publication number
- WO2010032427A1 WO2010032427A1 PCT/JP2009/004581 JP2009004581W WO2010032427A1 WO 2010032427 A1 WO2010032427 A1 WO 2010032427A1 JP 2009004581 W JP2009004581 W JP 2009004581W WO 2010032427 A1 WO2010032427 A1 WO 2010032427A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- mounting
- stage
- chip
- relay
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
Definitions
- the present invention relates to a component mounting apparatus and a component mounting method for mounting a component such as a die obtained by dicing a silicon wafer on a substrate.
- a die bonding apparatus has a component supply stage that supplies a die (component) obtained by dicing a thinned silicon wafer by dicing, and a die picked up by a pickup head from the component supply stage to the mounting head.
- a component relay stage for temporary placement and a component mounting stage for bonding a die to a substrate by a mounting head.
- the component relay stage is used when the die is mounted face up. When the die is mounted face down, the pickup head is turned upside down, and the die in the face down posture is directly delivered to the mounting head.
- the pickup head reciprocates between the component supply stage and the component relay stage, and the mounting head reciprocates between the component relay stage and the component mounting stage to perform die bonding. Efficient movement without causing unnecessary waiting time is an important issue in improving production efficiency.
- the present invention provides a component mounting apparatus that improves the production efficiency by optimizing the arrangement of the three stages of the component supply stage, the component relay stage, and the component mounting stage, and realizing efficient movement of the pickup head and the mounting head.
- An object is to provide a component mounting method.
- the component mounting apparatus includes a component supply stage, a pickup head that picks up a component from the component supply stage, a component relay stage that temporarily places the picked-up component, and the component relay stage.
- a mounting head for receiving a temporarily placed component; and a component mounting stage for mounting the component received by the mounting head on a substrate.
- the component relay stage is at a height between the component supply stage and the component mounting stage.
- a component mounting apparatus is the component mounting apparatus according to claim 1, wherein a space in which at least a part of the component supply stage moving in the horizontal direction can enter is below the component relay stage. Is formed.
- the component mounting apparatus is the component mounting apparatus according to claim 1 or 2, wherein the component relay stage is arranged at a height near the component mounting stage.
- a component mounting apparatus is the component mounting apparatus according to any one of claims 1 to 3, wherein the pickup head is capable of entering the component relay stage and around a horizontal axis.
- the mounting head receives a component that has been reversed as the pickup head is reversed, or a component that is temporarily placed on the component relay stage without being reversed.
- the component mounting method includes a temporary placement step of picking up a component supplied at a component supply stage with a pickup head and temporarily placing it on the component relay stage, and temporarily placing the component on the component relay stage.
- a component mounting method including a mounting step of receiving a mounted component by a mounting head and mounting the component on a substrate, wherein the component is supplied from the first height by the component supply stage in the temporary placement step to a first height. It is transferred to the component relay stage at a second height higher than the height, and in the mounting step, the second height at which the component relay stage is arranged is changed to a third height higher than the second height.
- the pickup head is moved from the component relay stage to the component supply so as to pick up the component at the component supply stage.
- the component relay stage is arranged at a height between the component supply stage and the component mounting stage, the moving distance of the pickup head that moves between the component supply stage and the component relay stage, the component mounting stage, and the component A balance with the moving distance of the mounting head that moves between the relay stages is achieved.
- the production efficiency in the component mounting apparatus and the component mounting method is improved by efficiently moving the two heads in which the movement distances are balanced without causing unnecessary waiting time.
- FIG. 1 is a perspective view of a component mounting apparatus according to an embodiment of the present invention
- FIG. 2 is a schematic configuration diagram of the component mounting apparatus according to an embodiment of the present invention.
- the component mounting apparatus 1 includes a wafer sheet holder 2, a pickup head 5 that takes out the chip 4 from the wafer sheet 3 held by the wafer sheet holder 2, and a chip that temporarily places the chip 4 that the pickup head 5 takes out from the wafer sheet 3.
- Dispenser 10 for applying paste adhesive first camera 11 for confirming the position and orientation of chip 4 adhered to wafer sheet 3, and position and orientation of chip 4 temporarily placed on chip relay table 6
- a third camera 13 for confirming, the mounting head 7 is provided with a fourth camera 14 for confirming the position and orientation of the chip 4 received.
- the first camera 11, the second camera 12, and the third camera 13 are respectively arranged vertically above the imaging target, and the vertical lower side is used as an imaging region.
- the 4th camera 14 is arrange
- the mounting head 7 is movable in the vertical direction and the horizontal direction (first direction) by the first linear motion device 20 and the second linear motion device 21.
- the dispenser 10 is movable in the vertical direction and the horizontal direction (first direction) similarly to the mounting head 7 by the third linear motion device 22 and the second linear motion device 21.
- the pickup head 5 is attached to the tip of a rotary arm 23 extending in a second direction orthogonal to the first direction in the horizontal plane.
- the rotary arm 23 is rotatable around the central axis, and the pickup head 5 is turned upside down by this rotation, so that the direction of the nozzle 24 can be changed upward or downward.
- the pickup head 5 is mounted on the fourth linear motion device 25 together with the rotary arm 23, and is movable in the vertical direction and the horizontal direction (first direction and second direction).
- the wafer sheet holder 2 is movable in the horizontal direction (first direction and second direction) at a predetermined height by the fifth linear motion device 26.
- a push-up device 27 for the chip 4 is provided below the wafer sheet holder 2, a push-up device 27 for the chip 4 is provided.
- the push-up device 27 is arranged so as to have a vertical positional relationship with the first camera 11 in the vertical direction.
- By moving the wafer sheet holder 2 horizontally with respect to the push-up device 27, an arbitrary chip 4 among the plurality of chips attached to the wafer sheet is positioned vertically above the push-up device 27.
- the chip 4 pushed upward by the pushing device 27 is adsorbed by the nozzle 24 of the pickup head 5 and peeled off from the wafer sheet 3.
- the chip relay table 6 is movable in the first and second directions at a predetermined height by the sixth linear motion device 28 and the substrate support table 9 by the seventh linear motion device 29.
- the chip 4 adsorbed by the nozzle 30 mounted downward on the dispenser 10 and the mounting head 7 moves in the first direction, and the substrate 8 moves in the second direction. And the chip 4 is mounted at that position.
- the chip 4 picked up by the pickup head 5 is temporarily placed on the chip relay table 6 without being inverted, and the chip 4 is picked up by the mounting head 7 and mounted on the substrate 8.
- the pickup head 5 is turned upside down, the chip 4 picked up from the wafer sheet 3 in the face up posture is reversed and converted into the face down posture, and then directly delivered to the mounting head 7. .
- the chip relay table 6 and the substrate support table 9 are arranged on the table 31 in parallel in the first direction.
- the substrate support table 9 is disposed at a position higher than the chip relay table 6.
- the table 31 is supported on the machine base on the substrate support table 9 side, and a space is formed below the chip relay table 6.
- the wafer sheet holder 2 is disposed on the chip relay table 6 side of the table 31 and at a position lower than the table 31.
- the space formed below the chip relay table 6 is a space into which a part of the wafer sheet holder 2 can enter when positioning an arbitrary chip 4 vertically above the push-up device 27.
- the component mounting apparatus 1 moves the pickup head 5 between the wafer sheet 3 held by the wafer sheet holder 2 and the chip relay table 6 to move the chip 4.
- the mounting head 7 is temporarily placed, and the chip 4 is mounted by moving between the chip relay table 6 and the substrate 8 supported by the substrate support table 9.
- the chips 4 are transferred from the first height at which the wafer sheet 3 is arranged to the chip relay table 6 at a second height higher than the first height
- the chip 4 is transferred from the second height at which the chip relay table 6 is disposed to the substrate 8 at a third height higher than the second height.
- the step of temporarily placing the chip 4 includes a step of moving the pickup head 5 from the chip relay table 6 to the wafer sheet 3 so as to pick up the chip 4 from the wafer sheet 3 (first step), and a step of moving the picked-up chip 4 into the chip.
- the step of moving the pickup head 5 from the wafer sheet 3 to the chip relay table 6 to be temporarily placed on the relay table 6 includes the step of mounting the chip 4 so that the chip 4 is received at the chip relay table 6.
- a step of moving the substrate 8 supported by the support table 9 fourth step.
- the second step and the chip are performed when the second step is performed in the step of temporarily placing the chip 4 so that no movement waiting time occurs in any of the heads. It is desirable to perform mounting at a timing such that the mounting head 7 receives the chip 4 immediately after the pickup head 5 temporarily places the chip 4 by performing the fourth step in the process of mounting 4 in parallel.
- the first step is performed in the step of temporarily placing the chip 4
- the first step and the fourth step in the step of mounting the chip 4 are performed in parallel, and the pickup head 5 is attached to the wafer sheet 3 on the chip 4.
- the mounting is performed at a timing such that the mounting head 7 heads to mount the chip 4 on the substrate 8 immediately after the head is picked up. Therefore, in the component mounting apparatus 1, as described above, the movement time of the pickup head 5 and the mounting head 7 is balanced by disposing the chip relay table 6 at a height between the wafer sheet holder 2 and the substrate support table 9. I am trying.
- the specific height at which the chip relay table 6 is arranged is determined in consideration of the movement speed and horizontal movement distance of the pickup head 5 and the mounting head 7, the time required for pickup and mounting, and the like. Since chip mounting generally requires time for positioning, heating, and the like, it is often preferable to dispose the chip relay table 6 closer to the substrate support table 9 in order to reduce the movement distance of the mounting head 7.
- the chip relay table 6 By arranging the chip relay table 6 in this way, when the mounting head 7 receives the chip 4, the chip 4 is not temporarily placed on the chip relay table 6, or the pickup head 5 temporarily places the chip 4. The occurrence of a situation in which the previous chip 4 is temporarily placed when it comes to the vehicle is eliminated, and the production efficiency is improved.
- the horizontal movement distance of the pickup head 5 can be shortened by providing a space that allows the wafer sheet holder 2 to enter below the table 31, so that the chip relay table 6 is further arranged closer to the substrate support table 9. Is possible.
- the moving distance of the mounting head 7 is shortened, and the moving distance of both the heads 5 and 7 is shortened as a whole, so that the production efficiency is further improved.
- the present invention is useful for a component mounting apparatus and a component mounting method for mounting a component delivered between a plurality of heads on a substrate.
Abstract
Description
2 ウェハシートホルダ
3 ウェハシート
4 チップ
5 ピックアップヘッド
6 チップ中継テーブル
7 実装ヘッド
8 基板
9 基板支持テーブル
Claims (5)
- 部品供給ステージと、
前記部品供給ステージから部品をピックアップするピックアップヘッドと、
ピックアップした部品を仮置きする部品中継ステージと、
前記部品中継ステージに仮置きされた部品を受け取る実装ヘッドと、
前記実装ヘッドで受け取った部品を基板に実装する部品実装ステージを備え、
前記部品中継ステージが前記部品供給ステージと前記部品実装ステージの間の高さになるように配置されていることを特徴とする部品実装装置。 - 水平方向に移動する部品供給ステージの少なくとも一部が進入可能な空間が部品中継ステージの下方に形成されていることを特徴とする請求項1に記載の部品実装装置。
- 部品中継ステージが部品実装ステージ寄りの高さに配置されていることを特徴とする請求項1または2に記載の部品実装装置。
- 前記ピックアップヘッドは前記部品中継ステージ上に進入可能でかつ水平軸周りに反転可能であり、
前記実装ヘッドは、前記ピックアップヘッドの反転に伴って反転された部品、もしくは反転されないまま前記部品中継ステージに仮置きされた部品を受け取ることを特徴とする請求項1乃至3の何れかに記載の部品実装装置。 - 部品供給ステージで供給される部品をピックアップヘッドでピックアップして部品中継ステージに仮置きする仮置き工程と、
前記部品中継ステージに仮置きされた部品を実装ヘッドで受け取って基板に実装する実装工程を有する部品実装方法であって、
前記仮置き工程で、前記部品供給ステージにより部品が供給される第一の高さから、第一の高さよりも高い第二の高さにある部品中継ステージに移送され、
前記実装工程で、前記部品中継ステージが配置された第二の高さから、第二の高さよりも高い第三の高さにある基板に移送され、且つ
前記仮置き工程は、前記部品を前記部品供給ステージにおいてピックアップするよう前記ピックアップヘッドを前記部品中継ステージから前記部品供給ステージに移動させる第一工程と、前記部品を前記部品中継ステージに仮置きするよう前記ピックアップヘッドを前記部品供給ステージから前記部品中継ステージに移動させる第二工程とからなり、
前記実装工程は、前記部品を前記部品中継ステージにおいて受け取るよう前記実装ヘッドを前記基板から前記部品中継ステージに移動させる第三工程と、前記部品を前記基板に実装するよう前記実装ヘッドを前記部品中継ステージから前記基板へ移動させる第四工程とからなり、
前記仮置き工程における前記第二工程と前記実装工程における第三工程が並行して行われることを特徴とする部品実装方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801363029A CN102160162A (zh) | 2008-09-19 | 2009-09-14 | 元件安装装置和元件安装方法 |
US13/119,816 US20110162189A1 (en) | 2008-09-19 | 2009-09-14 | Component mounting device and component mounting method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008240464A JP2010073924A (ja) | 2008-09-19 | 2008-09-19 | 部品実装装置 |
JP2008-240464 | 2008-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010032427A1 true WO2010032427A1 (ja) | 2010-03-25 |
Family
ID=42039277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/004581 WO2010032427A1 (ja) | 2008-09-19 | 2009-09-14 | 部品実装装置及び部品実装方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110162189A1 (ja) |
JP (1) | JP2010073924A (ja) |
KR (1) | KR20110073453A (ja) |
CN (1) | CN102160162A (ja) |
TW (1) | TW201013860A (ja) |
WO (1) | WO2010032427A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019103051A1 (ja) * | 2017-11-21 | 2019-05-31 | 株式会社ハリーズ | 電子部品取付装置及び電子装置の製造方法 |
WO2020235535A1 (ja) * | 2019-05-21 | 2020-11-26 | 株式会社ハリーズ | 電子部品取付装置、電子装置の製造方法及びストラップの製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5980933B2 (ja) * | 2012-09-06 | 2016-08-31 | 富士機械製造株式会社 | 部品実装機の制御システム及び制御方法 |
KR101422401B1 (ko) * | 2013-04-03 | 2014-07-22 | 세메스 주식회사 | 발광 소자 칩 본딩 장치 |
CN103551842B (zh) * | 2013-10-30 | 2016-07-06 | 京东方科技集团股份有限公司 | 一种膜片安装装置 |
EP3125661B1 (en) * | 2014-03-24 | 2020-09-23 | FUJI Corporation | Die mounting system and die mounting method |
KR101647968B1 (ko) * | 2015-03-19 | 2016-08-16 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조용 칩 어태치 장치 |
KR102372519B1 (ko) * | 2017-09-29 | 2022-03-10 | 가부시키가이샤 신가와 | 실장 장치 |
KR102201532B1 (ko) * | 2019-04-05 | 2021-01-12 | 주식회사 새너 | 유닛 픽커 및 그것을 갖는 소잉 소팅 시스템 |
KR102440196B1 (ko) * | 2019-04-05 | 2022-09-06 | 주식회사 새너 | 유닛 픽커 및 그것을 갖는 소잉 소팅 시스템 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022347A (ja) * | 1996-07-04 | 1998-01-23 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング装置 |
JP2002326177A (ja) * | 2001-04-27 | 2002-11-12 | Kyocera Corp | 電子部品実装装置 |
JP2007158102A (ja) * | 2005-12-06 | 2007-06-21 | Shibuya Kogyo Co Ltd | ボンディング装置 |
JP2009135366A (ja) * | 2007-12-03 | 2009-06-18 | Panasonic Corp | 部品実装装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3549327B2 (ja) * | 1996-03-11 | 2004-08-04 | 松下電器産業株式会社 | 部品装着方法及び部品装着機 |
JP3420073B2 (ja) * | 1997-07-28 | 2003-06-23 | 松下電器産業株式会社 | 部品供給装置及び方法 |
JP3719051B2 (ja) * | 1999-07-02 | 2005-11-24 | 松下電器産業株式会社 | 電子部品の実装装置および実装方法 |
JP2001135995A (ja) * | 1999-11-05 | 2001-05-18 | Matsushita Electric Ind Co Ltd | 部品実装装置及び方法 |
EP1231829B1 (en) * | 1999-11-05 | 2006-03-15 | Matsushita Electric Industrial Co., Ltd. | Component mounting machine and method |
SG112893A1 (en) * | 2000-08-22 | 2005-07-28 | Matsushita Electric Ind Co Ltd | Component mounting apparatus and method |
JP3747054B2 (ja) * | 2001-12-04 | 2006-02-22 | Towa株式会社 | ボンディング装置及びボンディング方法 |
JP3973439B2 (ja) * | 2002-02-07 | 2007-09-12 | 松下電器産業株式会社 | 電子部品実装装置及び方法 |
JP4564235B2 (ja) * | 2003-02-24 | 2010-10-20 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
JP4156460B2 (ja) * | 2003-07-09 | 2008-09-24 | Tdk株式会社 | ワークのピックアップ方法及びその装置、実装機 |
JP4510571B2 (ja) * | 2004-09-22 | 2010-07-28 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
JP4016982B2 (ja) * | 2004-11-18 | 2007-12-05 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
-
2008
- 2008-09-19 JP JP2008240464A patent/JP2010073924A/ja active Pending
-
2009
- 2009-09-14 US US13/119,816 patent/US20110162189A1/en not_active Abandoned
- 2009-09-14 KR KR1020117006065A patent/KR20110073453A/ko not_active Application Discontinuation
- 2009-09-14 WO PCT/JP2009/004581 patent/WO2010032427A1/ja active Application Filing
- 2009-09-14 CN CN2009801363029A patent/CN102160162A/zh active Pending
- 2009-09-18 TW TW098131494A patent/TW201013860A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022347A (ja) * | 1996-07-04 | 1998-01-23 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング装置 |
JP2002326177A (ja) * | 2001-04-27 | 2002-11-12 | Kyocera Corp | 電子部品実装装置 |
JP2007158102A (ja) * | 2005-12-06 | 2007-06-21 | Shibuya Kogyo Co Ltd | ボンディング装置 |
JP2009135366A (ja) * | 2007-12-03 | 2009-06-18 | Panasonic Corp | 部品実装装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019103051A1 (ja) * | 2017-11-21 | 2019-05-31 | 株式会社ハリーズ | 電子部品取付装置及び電子装置の製造方法 |
JPWO2019103051A1 (ja) * | 2017-11-21 | 2020-12-17 | 株式会社 ハリーズ | 電子部品取付装置及び電子装置の製造方法 |
US11670526B2 (en) | 2017-11-21 | 2023-06-06 | Hallys Corporation | Electronic component mounting device for mounting electronic components |
JP7297673B2 (ja) | 2017-11-21 | 2023-06-26 | 株式会社ジャルコ | 電子部品取付装置及び電子装置の製造方法 |
WO2020235535A1 (ja) * | 2019-05-21 | 2020-11-26 | 株式会社ハリーズ | 電子部品取付装置、電子装置の製造方法及びストラップの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2010073924A (ja) | 2010-04-02 |
TW201013860A (en) | 2010-04-01 |
US20110162189A1 (en) | 2011-07-07 |
KR20110073453A (ko) | 2011-06-29 |
CN102160162A (zh) | 2011-08-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010032427A1 (ja) | 部品実装装置及び部品実装方法 | |
KR101977987B1 (ko) | 다이 본더 및 본딩 방법 | |
JP4788759B2 (ja) | 部品実装装置 | |
CN107180772B (zh) | 芯片贴装装置以及半导体器件的制造方法 | |
JP6797569B2 (ja) | 半導体製造装置および半導体装置の製造方法 | |
JP6573813B2 (ja) | ダイボンダおよび半導体装置の製造方法 | |
US8220787B2 (en) | Part mounting device | |
KR101666276B1 (ko) | 콜릿 및 다이 본더 | |
US11189507B2 (en) | Chip packaging apparatus and method thereof | |
JP6513226B2 (ja) | 電子部品ハンドリングユニット | |
JP2007158102A (ja) | ボンディング装置 | |
KR20140086361A (ko) | 다이 본딩 방법 및 장치 | |
JP5018747B2 (ja) | 部品実装装置および部品実装方法 | |
JPH09186180A (ja) | ダイボンディング装置 | |
JP6717630B2 (ja) | 電子部品の実装装置 | |
WO2015075832A1 (ja) | ボンディング装置およびボンディング方法 | |
CN110970322A (zh) | 一种芯片贴片设备及芯片贴片方法 | |
JP5682958B2 (ja) | 部品実装機 | |
JPH06268050A (ja) | ダイスボンディング装置 | |
JP4862872B2 (ja) | 部品実装装置 | |
JP2021016004A (ja) | 半導体製造装置および半導体装置の製造方法 | |
JP2014027225A (ja) | ウェハカート及び電子部品装着装置 | |
JP2001319938A (ja) | チップ移送装置 | |
JP4752889B2 (ja) | 部品実装装置 | |
JP5953069B2 (ja) | ダイボンダ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980136302.9 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09814272 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20117006065 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09814272 Country of ref document: EP Kind code of ref document: A1 |