WO2010021260A1 - 表面処理セラミックス部材、その製造方法および真空処理装置 - Google Patents
表面処理セラミックス部材、その製造方法および真空処理装置 Download PDFInfo
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Abstract
Description
セラミックス焼結体としては、本来の化学的に安定な機能を発現させるために、気孔率が1%以下の緻密質で微小組織を呈するものを用いる。気孔率が1%を超えると、機械的特性及び耐食性が低下するからである。また、セラミックス溶射被膜の場合は、緻密に焼結した焼結体と比較すると多孔質であり、さらに機械的強度が弱いとともに、比表面積が大きいので、耐食性や耐久性も劣る。このため、脱粒などによるパーティクルが発生しやすい材料であるため、本発明の表面処理セラミックス部材には用いることができない。
本発明の表面処理セラミックス部材は、上記のセラミックス焼結体の表面にケイ素アルコキシド化合物重合体のゾルゲル膜からなる皮膜を形成したものである。ケイ素アルコキシド化合物は、室温下もしくは加熱により重合反応が進行して容易に硬化し、装置運転中も安定的に存在するからである。また、処理されるデバイスがシリコン系材料で構成されている場合、仮に飛散した場合でも悪影響を及ぼしにくいからである。さらに、ケイ素アルコキシド化合物重合体のゾルゲル膜は、溶液を用いて膜を形成できる点で簡便であるというメリットもある。
(1)表面処理セラミックス部材の任意箇所を波長分散型の電子プローブマイクロアナライザ(EPMA)にて皮膜材由来の主要元素(例えば、Si系アルコキシド化合物の場合、主要元素はSiである。)の分布比率をマッピングする。
(2)上記(1)と同様の方法でセラミックス基材由来の主要元素(例えば、アルミナの場合、主要元素はAlである。)の分布比率をマッピングし、補完関係になっていることを確認する。
(3)検出されたX線検出強度とその面積比から、皮膜材由来の主要元素の面積率を求めこれを皮膜の面積率とする。具体的には、X線散乱、表面性状によるノイズの影響を除外するため、X線検出強度の最大値の0.20倍となる値を閾値として、X線検出強度を2区分に分け、X線検出強度が閾値以上となる領域における面積率を皮膜の面積率とする。
SEM試験用スパッタ成膜装置(サンユー電子製、SC-704)を用いて、試験片に予め金蒸着し、導電膜を形成し、分析装置(日本電子製、JXA-8100)により、100μm×100μm視野、加速電圧15kVの条件によって、SEM像と、基材由来の元素および皮膜材由来の元素の分布をスキャニングして、マップ表示した。これにより、基材由来の元素および皮膜材由来の元素の分布が補完関係になっていることを確認した。その後、検出されたX線検出強度の最大値の0.20倍となる値を閾値として2区分に分け、X線検出強度が閾値以上となる領域における面積率を皮膜の面積率とした。
純水を入れたビーカーの中に各試験片を挿入し、このビーカーを、超音波発信機を備えた槽の中に装着した後、室温で104kHzの超音波を1分間負荷し、ビーカーの純水中に飛散したパーティクルの数を液中パーティクルカウンター(測定範囲0.5~20μm)で測定し、1μm以上のパーティクルの数を表1に示す。
Claims (8)
- 気孔率が1%以下のセラミックス焼結体基材の少なくとも一部に皮膜形成表面を有するセラミックス部材であって、
皮膜形成表面が、ケイ素アルコキシド化合物重合体のゾルゲル皮膜と基材表面とが混在してなる、
表面処理セラミックス部材。 - 前記ゾルゲル皮膜の面積率が、前記皮膜形成表面全体の5~80%であることを特徴とする請求項1に記載の表面処理セラミックス部材。
- 前記皮膜形成表面において、セラミックス焼結体基材表面の凹部が選択的に前記ゾルゲル皮膜によって被覆されていることを特徴とする請求項1または2に記載の表面処理セラミックス部材。
- 真空処理装置または雰囲気処理装置に用いられることを特徴とする請求項1から3までのいずれかに記載の表面処理セラミックス部材。
- 少なくとも処理雰囲気に接する部分に、前記皮膜形成表面が形成されていることを特徴とする請求項4に記載の表面処理セラミックス部材。
- 気孔率が1%以下のセラミックス焼結体基材の表面にケイ素アルコキシド化合物重合体のゾルゲルからなる皮膜材を塗布した後、硬化前の皮膜材がセラミックス焼結体表面の凹部に残存するような条件で皮膜材の一部を除去し、セラミックス焼結体表面の凹部に残存した皮膜材を硬化させることを特徴とする表面処理セラミックス部材の製造方法。
- 皮膜材の一部の除去が、拭き取りにより行われることを特徴とする請求項6に記載の表面処理セラミックス部材の製造方法。
- 請求項1~5のいずれかに記載の表面処理セラミックス部材を用いた真空処理装置。
Priority Applications (3)
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CN200980132385.4A CN102123970B (zh) | 2008-08-20 | 2009-08-10 | 表面处理陶瓷构件、其制造方法及真空处理装置 |
KR1020117003716A KR101276506B1 (ko) | 2008-08-20 | 2009-08-10 | 표면 처리 세라믹스 부재, 그 제조 방법 및 진공 처리 장치 |
US13/026,356 US8231967B2 (en) | 2008-08-20 | 2011-02-14 | Surface-treated ceramic member, method for producing the same and vacuum processing apparatus |
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JP2008211292A JP5537001B2 (ja) | 2008-08-20 | 2008-08-20 | 表面処理セラミックス部材、その製造方法および真空処理装置 |
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US9034199B2 (en) | 2012-02-21 | 2015-05-19 | Applied Materials, Inc. | Ceramic article with reduced surface defect density and process for producing a ceramic article |
US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
US9090046B2 (en) | 2012-04-16 | 2015-07-28 | Applied Materials, Inc. | Ceramic coated article and process for applying ceramic coating |
US9604249B2 (en) | 2012-07-26 | 2017-03-28 | Applied Materials, Inc. | Innovative top-coat approach for advanced device on-wafer particle performance |
US9343289B2 (en) | 2012-07-27 | 2016-05-17 | Applied Materials, Inc. | Chemistry compatible coating material for advanced device on-wafer particle performance |
DE102013104186A1 (de) * | 2013-04-25 | 2014-10-30 | Coatec Gmbh | Lagerring, elektrisch isolierende Beschichtung und Verfahren zum Aufbringen einer elektrisch isolierenden Beschichtung |
US9865434B2 (en) | 2013-06-05 | 2018-01-09 | Applied Materials, Inc. | Rare-earth oxide based erosion resistant coatings for semiconductor application |
US9850568B2 (en) | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
US11047035B2 (en) | 2018-02-23 | 2021-06-29 | Applied Materials, Inc. | Protective yttria coating for semiconductor equipment parts |
CN108937607B (zh) * | 2018-09-18 | 2021-02-05 | 杭州蜗牛实业有限公司 | 一种表面防粘炊具的制作方法 |
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JP3126635B2 (ja) | 1994-07-11 | 2001-01-22 | 東洋鋼鈑株式会社 | アルミナセラミックス焼結体 |
JPH1121187A (ja) | 1997-07-02 | 1999-01-26 | Ngk Insulators Ltd | セラミックス製品の洗浄方法 |
EP0985510B1 (en) * | 1998-02-05 | 2003-09-24 | Nippon Sheet Glass Co., Ltd. | Article with uneven surface, process for producing the same, and composition therefor |
JP2001152307A (ja) | 1999-11-29 | 2001-06-05 | Nippon Steel Hardfacing Co Ltd | 耐食性を有し、長期間使用に耐える複合皮膜の形成方法およびその複合皮膜を有する部材 |
JP2002180233A (ja) | 2000-12-14 | 2002-06-26 | Ntn Corp | 封孔処理セラミックス絶縁層および軌道輪 |
JP2003119087A (ja) | 2001-10-17 | 2003-04-23 | Ngk Insulators Ltd | 複合コーティング材料、積層体、耐蝕性部材、耐ハロゲンガスプラズマ用部材および複合コーティング材料の製造方法 |
JP2003335589A (ja) | 2002-05-20 | 2003-11-25 | Nihon Ceratec Co Ltd | 耐食性複合部材およびその製造方法 |
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JPH06737A (ja) * | 1991-03-29 | 1994-01-11 | Shin Etsu Chem Co Ltd | 静電チャック基板 |
JPH11312729A (ja) * | 1998-04-28 | 1999-11-09 | Kyocera Corp | 静電チャック |
JP2002037660A (ja) * | 2000-07-24 | 2002-02-06 | Toshiba Ceramics Co Ltd | 耐プラズマ性アルミナセラミックスおよびその製造方法 |
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JP5537001B2 (ja) | 2014-07-02 |
CN102123970A (zh) | 2011-07-13 |
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JP2010047434A (ja) | 2010-03-04 |
KR20110033860A (ko) | 2011-03-31 |
US20110151237A1 (en) | 2011-06-23 |
CN102123970B (zh) | 2014-01-29 |
US8231967B2 (en) | 2012-07-31 |
TWI400217B (zh) | 2013-07-01 |
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