WO2009133901A1 - 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体 - Google Patents

回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体 Download PDF

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Publication number
WO2009133901A1
WO2009133901A1 PCT/JP2009/058392 JP2009058392W WO2009133901A1 WO 2009133901 A1 WO2009133901 A1 WO 2009133901A1 JP 2009058392 W JP2009058392 W JP 2009058392W WO 2009133901 A1 WO2009133901 A1 WO 2009133901A1
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WIPO (PCT)
Prior art keywords
circuit
adhesive
filler
circuit connection
film
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PCT/JP2009/058392
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English (en)
French (fr)
Japanese (ja)
Inventor
智康 本多
貢 藤縄
猛 堀内
俊之 柳川
Original Assignee
日立化成工業株式会社
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Priority to CN2009801144712A priority Critical patent/CN102017816A/zh
Publication of WO2009133901A1 publication Critical patent/WO2009133901A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to a circuit connecting material, a film adhesive using the same, an adhesive reel, and a circuit connecting structure.
  • Circuit connection materials are required to have various properties such as adhesiveness, heat resistance, and reliability in a high temperature and high humidity state.
  • the adherend bonded by the circuit connecting material is not only an organic base material such as a printed wiring board or polyimide, but also a metal such as copper or aluminum, or a substrate made of various materials such as ITO, SiN, or SiO 2.
  • the material is used. For this reason, it is necessary to design the molecule according to the material of the surface of the adherend.
  • thermosetting resin using an epoxy resin having high adhesion and high reliability has been used (for example, Patent Documents 1 and 2). reference).
  • an epoxy resin, a curing agent such as a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst that promotes the reaction between the epoxy resin and the curing agent are generally used.
  • the thermal latent catalyst is an important factor for determining the curing temperature and the curing rate, and various compounds have been used from the viewpoints of storage stability at room temperature and curing rate during heating.
  • the desired adhesion was obtained by curing at a temperature of 170 to 250 ° C. for 1 to 3 hours.
  • the above-mentioned circuit connecting material is stored and used as an adhesive reel by winding a film adhesive formed in a layer on one surface of a support (base film) around a winding core.
  • This adhesive reel undergoes a slitting process in which a film adhesive having an adhesive layer made of a circuit connecting material on a base material such as PET is cut to a width of about 10 to 50 cm, and is then wound up to remove the original fabric. It is produced by continuously cutting it into a narrow width of about 0.5 to 5 mm while winding it out and winding it around a core again.
  • the film-like adhesive is cut smoothly and that the cut surface of the film-like adhesive is sufficiently smooth and easy to wind. . Further, when the film adhesive is fed out from the adhesive reel, it is required to have good blocking resistance that the film adhesive is not easily peeled off from the base film.
  • the adhesive composition tends to adhere to the slit blade, and the slit end surface is disturbed to maintain good slit properties. It becomes impossible to do.
  • the circuit connection material oozes out due to the winding pressure, and the circuit adhesive material is easily peeled off from the base film, resulting in deterioration of blocking resistance.
  • the present invention has been made in view of the above circumstances, and has a sufficiently excellent slit property and anti-blocking property when formed into a film, and sufficiently when used for forming a circuit connection structure.
  • An object of the present invention is to provide a circuit connection material capable of realizing a low connection resistance.
  • Another object of the present invention is to provide a circuit connection structure having a sufficiently low connection resistance by using the circuit connection material described above.
  • this invention has the slit property which was excellent by having the adhesive bond layer which consists of the above-mentioned circuit connection material, and when it is set as an adhesive reel, it is the film adhesive which has the blocking resistance sufficiently excellent, and
  • An object is to provide an adhesive reel provided with a film adhesive.
  • a circuit that is interposed between a pair of opposed circuit electrodes and electrically connects the pair of circuit electrodes by pressurizing the pair of circuit electrodes in a facing direction.
  • a circuit connection material comprising a bonding material and a filler dispersed in the bonding composition, wherein the content of the filler is 1 to 25% by volume.
  • the circuit connection material of the present invention contains a specific amount of filler dispersed in the adhesive composition, it has a sufficiently excellent slit property when formed into a film, and an adhesive reel and In this case, it has a sufficiently excellent blocking resistance. Further, by using this circuit connection material, a circuit connection structure having a sufficiently low connection resistance can be formed. As a factor for obtaining such an effect, by containing a specific amount of filler, the flow of the adhesive composition is moderately suppressed while maintaining conductivity, and the adhesive composition to the slit blade is also provided. Is sufficiently suppressed. In addition, it is considered that the flow of the adhesive composition is suppressed due to the occurrence of friction at the interface between the adhesive composition and the filler. However, the factors for obtaining the effects of the present invention are not limited to those described above.
  • the average particle diameter of the filler in the circuit connecting material of the present invention is preferably 0.1 to 30 ⁇ m. By containing a filler having such an average particle size, the conductivity can be improved.
  • the filler in the circuit connecting material of the present invention contains a thermoplastic resin, and the glass transition temperature (Tg) of the filler is preferably 50 to 120 ° C. As a result, a circuit connection material having excellent heat resistance and excellent anisotropic conductivity can be obtained.
  • the filler in the circuit connection material of the present invention is preferably spherical particles. Thereby, the dispersibility of the filler in the circuit connecting material can be made more uniform.
  • the adhesive composition in the circuit connecting material of the present invention preferably contains (1) a curing agent that generates free radicals and (2) a radical polymerizable substance. Moreover, it is more preferable that the adhesive composition contains (3) conductive particles. By containing the conductive particles, it is possible to obtain a circuit connection material having further excellent conductivity.
  • the filler contained in the circuit connection material of the present invention preferably contains plastic particles.
  • the filler content in the circuit connecting material is preferably 3 to 20% by volume, more preferably 5 to 15% by volume, and even more preferably 5 to 9.5% by volume.
  • the present invention also provides a film adhesive comprising a base film and an adhesive layer provided on one surface of the base film and made of the circuit connection material described above.
  • Such a film-like adhesive is excellent in handleability and has an adhesive layer made of a circuit connecting material having the above-mentioned characteristics, so that it has a sufficiently excellent slit property and is sufficient when used as an adhesive reel. It has excellent blocking resistance.
  • the present invention also provides an adhesive reel comprising the above-mentioned film adhesive and a core around which the film adhesive is wound.
  • This film adhesive has a film adhesive having the above-mentioned characteristics, and is therefore sufficiently excellent in blocking resistance.
  • the diameter of the core in the adhesive reel of the present invention is preferably 30 to 150 mm.
  • the width and length of the film adhesive are preferably 0.3 to 10 mm and 50 to 500 m, respectively.
  • a circuit connection structure including a pair of circuit electrodes disposed opposite to each other and electrically connected, and a circuit connection portion provided between the pair of circuit electrodes and connecting the pair of circuit electrodes. And the circuit connection structure which a circuit connection part has the hardened
  • circuit connection structure is formed by using the above circuit connection material, the conductivity between the circuit electrodes facing each other is maintained well, and the insulation between adjacent electrodes is also maintained well. can do. That is, the circuit connection structure of the present invention has excellent anisotropic conductivity.
  • one of the pair of circuit electrodes is a circuit electrode of a semiconductor element
  • the other of the pair of circuit electrodes is a circuit electrode of a mounting substrate on which the semiconductor element is mounted.
  • a circuit connection material that has both a sufficiently excellent slit property and blocking resistance when formed into a film and can realize a sufficiently low connection resistance when used for forming a circuit connection structure.
  • the circuit connection structure which has a sufficiently low connection resistance can be provided by using the above-mentioned circuit connection material.
  • a film adhesive having an excellent slit property by having an adhesive layer made of the above-described circuit connecting material, and having a sufficiently excellent blocking resistance when used as an adhesive reel. And an adhesive reel provided with such a film adhesive can be provided.
  • FIG. 1 is a schematic cross-sectional view of a circuit connection structure according to a preferred embodiment of the present invention. It is process sectional drawing which shows typically an example of the manufacturing method of the circuit connection structure which concerns on the said embodiment.
  • FIG. 1 is a schematic cross-sectional view showing a cross section parallel to the longitudinal direction and the thickness direction of a film adhesive according to a preferred embodiment of the present invention.
  • the film adhesive 5 has a base film 6 and an adhesive layer 20 provided on one surface thereof.
  • the base film 6 has a film shape.
  • the base film 6 preferably has a length of about 1 to 200 m, a thickness of about 4 to 200 ⁇ m, and a width of about 0.5 to 30 mm.
  • the length, thickness, and width of the base film 6 are not limited to the above ranges.
  • the width of the base film 6 is preferably wider than the width of the film-like circuit connecting material (adhesive layer) 20 provided thereon.
  • the base film 6 is, for example, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride.
  • Various films selected from the group consisting of a fluororesin film, a synthetic rubber system and a liquid crystal polymer can be used.
  • a release paper and a nonwoven fabric may be sufficient.
  • the circuit connection material 20 contains an adhesive composition 21 and a filler 22.
  • insulating particles or fibers having insulating properties can be used. Specific examples include metal particles, aerosil, calcium carbonate, silica sand, carbon fibers, plastic particles made of a thermoplastic resin such as polystyrene, and stress relaxation particles.
  • One of these fillers can be used alone or in combination of two or more.
  • the filler 22 is preferably a spherical particle from the viewpoint of dispersibility.
  • the content of the filler 22 is 1 to 25% by volume, preferably 3 to 20% by volume, more preferably 5 to 15% by volume, based on the entire circuit connecting material 20 (100% by volume). More preferably, it is 5 to 9.5% by volume.
  • By setting the content to 5% by volume or more it is possible to achieve both a good slit property and a good blocking resistance at a higher level.
  • a circuit connection structure having a sufficiently sufficiently low connection resistance can be formed.
  • volume% indicating the content of the filler is a ratio calculated on the basis of the volume of the circuit connection material 20 before curing at 23 ° C.
  • the volume of each component contained in the circuit connection material 20 can be obtained by converting from the mass using the specific gravity. Further, as another method of conversion, there is a method in which a component to be converted is introduced into a graduated cylinder or the like containing a solvent (water, alcohol, etc.), and the volume of the component is calculated based on the increased volume. It is done. In this case, it is necessary to select a solvent that does not dissolve or swell the component and that wets the component well.
  • the average particle diameter of the filler 22 is preferably 0.1 to 30 ⁇ m, more preferably 1 to 15 ⁇ m.
  • the average particle size is less than 0.1 ⁇ m, the dispersibility in the adhesive composition 21 tends to decrease.
  • the average particle size exceeds 30 ⁇ m, conduction between circuit electrodes facing each other tends to be hindered, and a circuit connection structure having a sufficiently low connection resistance tends to be hardly obtained.
  • the average particle size of the filler 22 and conductive particles described later is calculated as follows. First, a 3000-fold particle image is observed with a scanning electron microscope (SEM: for example, trade name “S800” manufactured by Hitachi, Ltd.), and a plurality of particles are arbitrarily selected. At this time, 30 or more particles are selected for the sake of accuracy, but this is not a limitation when the number of particles is less than 30. Next, the maximum particle size and the minimum particle size are measured for each of the plurality of selected particles. Then, the square root of the product of the maximum particle size and the minimum particle size is calculated, and this is set as the particle size of one particle. After obtaining the particle diameter of one particle for all the selected particles, the average particle diameter is obtained by dividing the sum of the particle diameters by the number of measured particles.
  • SEM scanning electron microscope
  • the filler 22 is preferably insulating particles containing a thermoplastic resin as a main component.
  • the thermoplastic resin include polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyolefin, ethylene / vinyl acetate copolymer resin, polyvinyl alcohol, acrylic resin, methacrylic resin, ASB resin, AS resin, MBS resin, polyimide resin, and polyamide. Resins, phenoxy resins, poly (meth) acrylate resins, polyimide resins, polyurethane resins, polyester resins, polyvinyl butyral resins, and the like can be used. One of these thermoplastic resins can be used alone or in combination of two or more.
  • thermoplastic resins ethylene / vinyl acetate copolymer resin and polyester are preferable from the viewpoint of ensuring conduction more reliably.
  • the glass transition temperature (Tg) of the filler 22 is preferably 50 to 120 ° C, more preferably 80 to 100 ° C.
  • Tg glass transition temperature
  • the glass transition temperature is less than 50 ° C.
  • the heat resistance of the circuit connecting material 20 tends to decrease.
  • the glass transition temperature exceeds 120 ° C. conduction between circuit electrodes facing each other tends to be hindered. There is a tendency that it is difficult to obtain a circuit connection structure having a sufficiently low connection resistance.
  • the adhesive composition 21 includes a resin composition 24 and conductive particles 26.
  • the resin composition 24 preferably contains (1) a curing agent that generates free radicals and (2) a radical polymerizable substance as essential components.
  • a curing agent that generates free radicals radiation polymerization initiator
  • known compounds such as peroxides and azo compounds that are conventionally known can be used.
  • peroxides having a one-minute half-life temperature of 90 to 175 ° C. and a molecular weight of 180 to 1,000 are preferred from the viewpoints of stability, reactivity, and compatibility.
  • 1 minute half-life temperature refers to the temperature at which the half-life is 1 minute
  • half-life refers to the time until the concentration of the compound decreases to half of the initial value
  • 1,1,3,3-tetramethylbutylperoxyneodecanoate di (4-tert-butylcyclohexyl) peroxydicarbonate, di (2-ethylhexyl) peroxydicarbonate, cumylper Oxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethylperoxynodecanoate, t-hexylperoxyneo Decanoate, t-butyl peroxyneodecanoate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2 , 5-Di (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethyl
  • the curing agent it is preferable to use a compound that generates radicals when irradiated with light of 150 to 750 nm.
  • Known compounds can be used as such compounds.
  • Photoinitiation, Photopolymerization, and Photocuring, J. MoI. -P. ⁇ -acetaminophenone derivatives and phosphine oxide derivatives described in Fouassier, Hanser Publishers (1995), p17 to p35 are more preferred because of their high sensitivity to light irradiation.
  • These compounds can be used individually by 1 type or in combination of 2 or more types. Moreover, you may use in combination with the above-mentioned peroxide and azo compound.
  • the content of the curing agent in the circuit connecting material 20 is preferably 1 to 20% by mass, more preferably 3 to 10% by mass.
  • the content of the curing agent is preferably 1 to 20% by mass, more preferably 3 to 10% by mass.
  • the content of the curing agent is too large, the adhesiveness of the circuit connection material 20 tends to be lowered.
  • the content of the curing agent is too small, curing of the adhesive composition tends to be difficult to proceed smoothly.
  • radically polymerizable substance (radical polymerizable compound) known substances can be used.
  • a radically polymerizable substance can be used in the state of a monomer or an oligomer, and a monomer and an oligomer can also be mixed and used.
  • radical polymerizable substance examples include epoxy (meth) acrylate oligomers, urethane (meth) acrylate oligomers, polyether (meth) acrylate oligomers, polyester (meth) acrylate oligomers and the like, trimethylolpropane tri (meth) acrylate , Polyethylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (Meth) acrylate, isocyanuric acid modified bifunctional (meth) acrylate, isocyanuric acid modified trifunctional (meth) acrylate, bisphenol full orange (Meth) acryloyloxy group is introduced into the compound in which ethylene glycol or propylene glycol is added
  • R 1 and R 2 each independently represent hydrogen or a methyl group, and k and l each independently represent an integer of 1 to 8.
  • R 3 and R 4 each independently represent hydrogen or a methyl group, and m and n each independently represent an integer of 0 to 8.
  • the content of the radical polymerizable substance in the circuit connecting material 20 is preferably 30 to 80% by mass, more preferably 40 to 70% by mass.
  • Examples of the conductive particles 26 include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
  • the conductive particles 26 may have non-conductive glass particles, ceramic particles, plastic particles, or the like as nuclei and the nuclei covered with the metal or carbon.
  • the conductive particles 26 having deformability are used as described above, the contact area between the circuit electrodes and the conductive particles 26 is increased when the circuit electrodes are connected, so that the connection reliability can be improved.
  • the average particle diameter of the conductive particles 26 is preferably 1 to 18 ⁇ m from the viewpoint of achieving both good dispersibility and good conductivity.
  • the content of the conductive particles 26 in the circuit connecting material 20 is preferably 0.1 to 30% by volume, more preferably 0.1 to 10% by volume. When the content is less than 0.1% by volume, when the circuit connection structure is formed, the excellent conductivity between the electrodes arranged to face each other tends to be impaired. On the other hand, when the content exceeds 30% by volume, a short circuit between adjacent circuit electrodes tends to occur when a circuit connection structure is formed.
  • the content of the conductive particles 26 can be obtained in the same manner as the content of the filler 22.
  • the total content of the conductive particles 26 and the filler 22 in the circuit connecting material 20 is preferably 1 to 30% by volume, more preferably 5 to 20% by volume, and still more preferably 10 to 18% by volume. It is. By setting the content to 1 to 30% by volume, it becomes possible to achieve both excellent slit property and blocking resistance.
  • the circuit connection material 20 may contain a thermoplastic resin in the adhesive composition 21.
  • a thermoplastic resin polyimide resin, polyamide resin, phenoxy resin, poly (meth) acrylate resin, polyimide resin, polyurethane resin, polyester resin, polyvinyl butyral resin, or the like can be used.
  • These thermoplastic resins may contain a siloxane bond or a fluorine substituent.
  • These thermoplastic resins can be suitably used as long as the resins to be mixed are completely compatible with each other or microphase separation occurs and becomes cloudy.
  • thermoplastic resin contained in the adhesive composition 21 and the thermoplastic resin contained in the filler 22 are the same resin component.
  • the dispersibility of the filler 22 in the adhesive composition 21 can be made more uniform, and it is possible to achieve both better slitting properties and blocking resistance.
  • the film forming property of the circuit connecting material can be improved as the weight average molecular weight of the thermoplastic resin contained in the adhesive composition 21 is increased. Further, in selecting the composition of the circuit connecting material, the selection range of the melt viscosity that affects the fluidity can be made wider.
  • the weight average molecular weight of the thermoplastic resin contained in the adhesive composition 21 is preferably 5,000 to 150,000, more preferably 10,000 to 80,000. When the weight average molecular weight is less than 5,000, the good film forming property of the circuit connecting material tends to be impaired. On the other hand, when the weight average molecular weight exceeds 150,000, the compatibility with other components of the adhesive composition tends to decrease.
  • the circuit connection material 20 may contain a stabilizer in the adhesive composition 21 for the purpose of controlling the curing rate or improving the storage stability.
  • a stabilizer known compounds can be used without particular limitation.
  • preferable stabilizers include quinone derivatives such as benzoquinone and hydroquinone, phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol, 2,2,6,6-tetramethylpiperidine-1-oxyl and 4- Examples include aminoxyl derivatives such as hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, and hindered amine derivatives such as tetramethylpiperidyl methacrylate.
  • the content of the stabilizer is preferably 0.01 to 30 parts by mass, more preferably 0.05 to 10 parts by mass with respect to 100 parts by mass of the thermoplastic resin.
  • the content is less than 0.01 parts by mass, the effect of addition tends to decrease, and when it exceeds 30 parts by mass, the compatibility with other components tends to decrease.
  • the circuit connection material 20 may contain an adhesion aid such as a coupling agent represented by an alkoxysilane derivative or a silazane derivative, an adhesion improver, or a leveling agent in the adhesive composition 21.
  • adhesion assistants it is preferable to include a compound represented by the following general formula (C).
  • the above-mentioned adhesion assistant may contain 1 type individually or in combination of 2 or more types.
  • R 10 , R 11 and R 12 are each independently hydrogen, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an alkoxycarbonyl having 1 to 5 carbon atoms.
  • R 13 is a (meth) acryloyl group, vinyl group, isocyanate group, imidazole group, mercapto group, amino group, methylamino group, dimethylamino group, benzylamino group, phenylamino group, cyclohexyl An amino group, a morpholino group, a piperazino group, a ureido group or a glycidyl group is shown.
  • P represents an integer of 1 to 10.
  • the circuit connecting material 20 may contain a rubber component for the purpose of stress relaxation and adhesion improvement.
  • rubber components include polyisoprene, polybutadiene, carboxyl-terminated polybutadiene, hydroxyl-terminated polybutadiene, 1,2-polybutadiene, carboxyl-terminated 1,2-polybutadiene, hydroxyl-terminated 1,2-polybutadiene, acrylic rubber, styrene- Butadiene rubber, hydroxyl-terminated styrene-butadiene rubber, acrylonitrile-butadiene rubber, carboxyl group, hydroxyl group, (meth) acryloyl group or morpholine group-containing acrylonitrile-butadiene rubber, carboxylated nitrile rubber, hydroxyl-terminated poly (oxypropylene) ), Alkoxysilyl group-terminated poly (oxypropylene), poly (oxytetramethylene) glycol, polyolefin glycol, and
  • the rubber component those containing a cyano group or a carboxyl group, which are highly polar groups, in the side chain or terminal are preferable from the viewpoint of improving adhesiveness.
  • Specific examples include acrylonitrile-butadiene rubber, acrylonitrile-butadiene rubber containing carboxyl group, hydroxyl group, (meth) acryloyl group or morpholine group at the polymer terminal, and carboxylated nitrile rubber.
  • the content of acrylonitrile as a polar group is preferably 10 to 60 mol%.
  • Varnish is prepared by dissolving or dispersing each component used as a raw material for circuit connection materials in a solvent. The obtained varnish is applied on one surface of the base film 6 and the solvent is volatilized to form the adhesive layer 20 on the base film 6.
  • a solvent that can be used a solvent that is not reactive with the adhesive composition and additives and that exhibits sufficient solubility is used.
  • these solvents those having a boiling point of 50 to 150 ° C. at normal pressure are preferable. If the boiling point is less than 50 ° C., it may volatilize if left at room temperature (25 ° C.), and use in an open system tends to be limited. On the other hand, when the boiling point exceeds 150 ° C., it is difficult to volatilize the solvent, and when a circuit connection structure is formed by a circuit connection material obtained using such a solvent, excellent connection reliability tends to be impaired. There is.
  • FIG. 2 is a perspective view showing a preferred embodiment of the adhesive reel of the present invention.
  • An adhesive reel 10 shown in FIG. 2 includes a cylindrical core 1 and circular side plates 2 that are provided on both end surfaces of the core 1 in the axial direction and have a through hole 2a in the center.
  • the film adhesive 5 is wound on the outer surface F1 of the winding core 1 to constitute a wound body. Further, the adhesive reel 10 has a shaft hole 10a into which a rotation shaft of a normal crimping apparatus is inserted. The adhesive reel 10 is set so that the shaft hole 10a is inserted into the rotating shaft of the crimping apparatus, and the film adhesive 5 can be fed out in the direction of arrow E. The drawn-out film adhesive 5 can be used for connection of a pair of circuit electrodes arranged to face each other.
  • the adhesive reel 10 Since the adhesive reel 10 has a wound body around which the film adhesive 5 having the circuit connection material 20 is wound, the bleeding of the adhesive component is sufficiently suppressed, and the blocking resistance is sufficiently excellent. ing. For this reason, the adhesive reel 10 can pay out the film adhesive 5 smoothly. Thereby, the yield in the manufacturing process of the circuit connection structure can be sufficiently improved.
  • the diameter of the core 1 is preferably 30 to 150 mm, more preferably 50 to 120 mm. When the diameter of the winding core 1 is in such a range, the effect of the present invention can be obtained more easily.
  • the width of the film adhesive 5 wound on the reel is preferably 0.3 to 10 mm, more preferably 0.5 to 5 mm, and the length is preferably 50 to 500 m, more preferably 100 to 300 mm. It is. If the film adhesive 5 has the above size, the effect of the present invention can be obtained more easily.
  • circuit connection structure (Circuit connection structure) Next, a preferred embodiment of a circuit connection structure manufactured using the film adhesive 5 having the above circuit connection material will be described.
  • FIG. 3 is a schematic cross-sectional view of a circuit connection structure according to a preferred embodiment of the present invention.
  • the circuit connection structure 100 includes a first circuit member 30 and a second circuit member 40 that are disposed to face each other, and the first circuit member 30 and the second circuit member 40 are disposed between the first circuit member 30 and the second circuit member 40.
  • a connecting portion 50 to be connected is provided.
  • the first circuit member 30 includes a circuit board 31 and a first circuit electrode 32 formed on one surface (main surface) 31 a of the circuit board 31.
  • the second circuit member 40 includes a circuit board 41 and a second circuit electrode 42 formed on one surface (main surface) 41 a of the circuit board 41.
  • Specific examples of the one circuit member 30 (40) include chip components such as a semiconductor chip (IC chip), a resistor chip, and a capacitor chip. These circuit members 30 (40) include a large number of circuit electrodes. Specific examples of the other circuit member 40 (30) to which the circuit member 30 (40) is connected include a flexible tape having metal wiring, a flexible printed wiring board, and glass on which indium tin oxide (ITO) is deposited. Examples thereof include a wiring board such as a board.
  • ITO indium tin oxide
  • circuit boards 31 and 41 include inorganic materials such as semiconductors, glass and ceramics, organic materials such as polyimide and polycarbonate, and composite materials such as glass / epoxy.
  • the first circuit electrode 32 and the second circuit electrode 42 are disposed so as to face each other through the connection portion 50.
  • the first circuit electrode 32 and the second circuit electrode 42 are each composed of one kind selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, and indium tin oxide (ITO). It may be composed of two or more.
  • the material of the surface of the 1st circuit electrode 32 and the 2nd circuit electrode 42 may be the same in all the circuit electrodes, and may differ.
  • connection part 50 is comprised from the hardened
  • the first circuit electrode 32 and the second circuit electrode 42 arranged to face each other are electrically connected through the conductive particles 26. That is, the conductive particles 26 are in direct contact with both the first circuit electrode 32 and the second circuit electrode 42.
  • the filler 22 is uniformly dispersed in the cured product 28 in the connection portion 50.
  • the first circuit member 30 and the second circuit member 40 are fixed by the connection portion 50 having good adhesiveness. Therefore, the connection resistance between the first circuit electrode 32 and the second circuit electrode 42 is sufficiently reduced, and the connection reliability between the first circuit electrode 32 and the second circuit electrode 42 is extremely good. It becomes.
  • the circuit connection structure 100 of the present embodiment has sufficiently excellent anisotropic conductivity.
  • circuit connection structure 100 is manufactured by thermosetting the resin composition 24 contained in the circuit connection material 20.
  • the film adhesive 5 fed out from the adhesive reel 10 is cut to a predetermined length, and the circuit connecting material 20 faces the first circuit electrode 32 provided on the first circuit board 31. In this way, the film adhesive 5 is placed on the first circuit member 30. And the base film 6 is peeled from the circuit connection material 20 (FIG. 4A).
  • heating temperature shall be the temperature which the resin composition 24 of the circuit connection material 20 does not harden
  • the heating temperature is preferably 50 to 190 ° C. Heating and pressing are preferably performed in the range of 0.5 to 120 seconds.
  • the second circuit member 40 is placed on the circuit connection material 20 so that the second circuit electrode 42 faces the first circuit member 30. And the whole is pressurized in the arrow A and B direction of FIG.4 (d), heating the circuit connection material 20.
  • FIG. The heating temperature at this time is set to a temperature at which the resin composition 24 of the circuit connecting material 20 can be cured.
  • the heating temperature is preferably from 100 to 250 ° C, more preferably from 150 to 200 ° C. If the heating temperature is less than 100 ° C, the curing rate tends to be slow, and if it exceeds 250 ° C, side reactions tend to proceed.
  • the heating time is preferably in the range of 0.5 to 120 seconds. It is more preferable that the heating and pressurization in which the heating and the pressurization are performed in parallel be 150 to 200 ° C., 3 MPa, and 10 seconds.
  • connection portion 50 is cured by the heating and pressurization described above to form the connection portion 50, and the circuit connection structure 100 as shown in FIG. 3 is obtained.
  • the connection conditions are appropriately selected depending on the application to be used, the adhesive composition, and the circuit member.
  • the circuit connection material 20 may be appropriately irradiated with actinic rays or energy rays.
  • actinic rays or energy rays include ultraviolet light, visible light, and infrared light.
  • energy rays include electron beams, X-rays, ⁇ rays, and microwaves.
  • Example 1 [Preparation of raw materials] In order to produce a film adhesive, the following raw materials were prepared.
  • phenoxy resin Union Carbide, trade name: PKHC, weight average molecular weight: 45,000
  • 1 mass of toluene
  • ethyl acetate molecular weight 77.1 ° C.
  • the phenoxy resin solution having a solid content of 40% by mass was prepared by dissolving in the mixed solvent mixed in the ratio).
  • urethane acrylate weight average molecular weight: 20,000
  • phosphate ester dimethacrylate manufactured by Kyoeisha Chemical Co., Ltd., trade name: Light Ester P-2M, weight average molecular weight: 322
  • Conductive particles were prepared as follows. A nickel layer having a thickness of 0.2 ⁇ m was provided by performing electrolytic nickel plating on the surface of commercially available polystyrene particles. Conductive particles having an average particle diameter of 5 ⁇ m, in which a gold layer having a thickness of 0.04 ⁇ m is formed by electroless gold plating on the outside of the nickel layer, and a nickel layer and a gold layer are sequentially laminated on the surface of polystyrene particles. Got.
  • spherical plastic particles (average particle diameter: 5 ⁇ m) mainly composed of a thermoplastic resin (polystyrene) were prepared.
  • the coating solution is applied to a fluororesin film (base film) with a thickness of 80 ⁇ m using a coating device, and dried with hot air at 70 ° C. for 10 minutes to form a base film and the surface thereof.
  • a film adhesive having an adhesive layer (thickness: 40 ⁇ m) was obtained.
  • the content of the filler in the adhesive layer (circuit connection material) of the film adhesive was 15% by volume, and the content of conductive particles was 1.5% by volume.
  • a slit blade is inserted perpendicularly to the surface opposite to the base film side of the film adhesive, and the film adhesive is wound up at a speed of 0.1 m / s while cutting the film adhesive.
  • a reel-shaped product adheresive reel
  • a (good) indicates that the slit property (cutting property and winding property) is good
  • B (somewhat poor) indicates that the slit end surface has a problem such as disorder of the slit end surface, and cannot be slit.
  • C (defect) was evaluated as “C (defect)”.
  • connection resistance was evaluated as follows. First, flexible printed wiring board (FPC board, PI thickness: 38 ⁇ m) with copper circuit (line width 250 ⁇ m, pitch 500 ⁇ m, thickness 8 ⁇ m) and printed wiring board (PCB) with copper circuit (line width 250 ⁇ m, pitch 500 ⁇ m, thickness 35 ⁇ m) Substrate, thickness: 0.7 mm).
  • FPC board flexible printed wiring board
  • PCB printed wiring board
  • the film-like adhesive produced as described above is cut into a predetermined size (2 mm ⁇ 40 mm), and the copper circuit of the FPC board and the adhesive layer of the film-like adhesive face each other at 65 ° C., 0
  • the film adhesive and the FPC board were bonded together under the condition of .98 MPa (10 kgf / cm 2 ).
  • the base film was peeled from the film adhesive, and the copper circuit of the FPC board and the copper circuit of the PCB board were aligned so that the copper circuit of the PCB board and the adhesive layer faced each other.
  • the circuit connection material interposed under the conditions of 160 ° C. and 3 MPa, the copper circuit of the FPC board and the copper circuit of the PCB board are heated in a direction opposite to each other, and the connection using the circuit connection material is performed.
  • a circuit connection structure was obtained (heating and pressing time: 20 seconds).
  • connection resistance value in the direction in which the FPC board and the PCB board face each other was measured by measuring the resistance value between adjacent circuits with a multimeter. . The measurement was performed at 45 points between different adjacent circuits, and the average value was obtained. The case where the average connection resistance value was 0.5 ⁇ or less was evaluated as “A (good)”, and the case where the connection resistance value exceeded 0.5 ⁇ was evaluated as “B (defective)”. The evaluation results are as shown in Table 1.
  • Example 2 A film adhesive was prepared in the same manner as in Example 1 except that the blending amount of the plastic particles with respect to the mixed solution was 5% by volume, and each evaluation was performed in the same manner as in Example 1. The results were as shown in Table 1.
  • the content of plastic particles in the adhesive layer (circuit connection material) of the film adhesive was 5% by volume, and the content of conductive particles was 1.5% by volume.
  • Phenoxy resin high molecular weight epoxy resin, weight average molecular weight: 50,000
  • acrylic rubber weight average molecular weight: 100,000
  • toluene molecular weight 110.6 ° C.
  • ethyl acetate molecular weight 77.1 ° C.
  • NovaCure HX-3941HP product name, manufactured by Asahi Kasei Kogyo Co., Ltd. was prepared as a curing agent (latent curing accelerator).
  • This NOVACURE HX-3941HP is obtained by dispersing microencapsulated particles (average particle size 2.5 ⁇ m) obtained by coating the surface with a crosslinked polyurethane with an imidazole-modified product as a core, in a liquid epoxy resin. .
  • Conductive particles were prepared as follows. A nickel layer having a thickness of 0.1 ⁇ m was provided on the surface of the flexible epoxy cured sphere by electroless nickel plating. As a result, conductive particles having a particle diameter of 5.2 ⁇ m were obtained.
  • plastic particles (average particle diameter: 5 ⁇ m) mainly composed of a thermoplastic resin (polystyrene) were prepared.
  • the coating liquid is applied to a biaxially stretched polypropylene film (base film) having a thickness of 50 ⁇ m by using a coating apparatus, and is dried with hot air at 90 ° C. for 15 minutes.
  • a film-like adhesive having an adhesive layer (thickness: 25 ⁇ m) formed on was obtained.
  • the content of the filler in the adhesive layer (circuit connection material) of the film adhesive was 15% by volume, and the content of conductive particles was 1.5% by volume.
  • Example 4 A film adhesive was produced in the same manner as in Example 3 except that the amount of the plastic particles blended with respect to the mixed solution was 5% by volume, and each evaluation was performed in the same manner as in Example 1. The results were as shown in Table 1.
  • the content of the filler in the adhesive layer (circuit connection material) of the film adhesive was 5% by volume, and the content of conductive particles was 1.5% by volume.
  • Example 1 A film adhesive was prepared in the same manner as in Example 1 except that no plastic particles were added, and each evaluation was performed in the same manner as in Example 1. The results were as shown in Table 1.
  • Example 2 A film adhesive was produced in the same manner as in Example 1 except that the blending amount of the plastic particles with respect to the mixed solution was 0.1% by volume, and each evaluation was performed in the same manner as in Example 1. The results were as shown in Table 1.
  • the content of plastic particles in the adhesive layer (circuit connection material) of the film adhesive was 0.1% by volume, and the content of conductive particles was 1.5% by volume.
  • Example 3 A film adhesive was prepared in the same manner as in Example 1 except that the amount of plastic particles added to the mixed solution was 50% by volume, and each evaluation was performed in the same manner as in Example 1. The results were as shown in Table 1.
  • the content of plastic particles in the adhesive layer (circuit connection material) of the film adhesive was 50% by volume, and the content of conductive particles was 1.5% by volume.
  • Example 4 A film adhesive was prepared in the same manner as in Example 3 except that the amount of plastic particles added to the mixed solution was 0.1% by volume, and each evaluation was performed in the same manner as in Example 1. The results were as shown in Table 1.
  • the content of plastic particles in the adhesive layer (circuit connection material) of the film adhesive was 0.1% by volume, and the content of conductive particles was 1.5% by volume.
  • the film adhesives and adhesive reels produced in Examples 1 to 4 were good in slit property and blocking resistance. Further, the connection resistance of the circuit connection structures formed using the circuit connection materials of Examples 1 to 4 was sufficiently low.
  • Comparative Examples 1, 2, and 4 in which the content of plastic particles (filler) was 0.1% by volume or less, the slit property and the blocking resistance were not good. In Comparative Example 1, since the slits were not possible, the blocking resistance could not be evaluated. Moreover, in Comparative Example 3 in which the content of the plastic particles (filler) was too large, 50% by volume, the slit resistance and the blocking resistance were good, but the connection resistance increased.
  • a circuit connection material that has both a sufficiently excellent slit property and blocking resistance when formed into a film and can realize a sufficiently low connection resistance when used for forming a circuit connection structure.
  • the circuit connection structure which has a sufficiently low connection resistance can be provided by using the above-mentioned circuit connection material.
  • a film adhesive having an excellent slit property by having an adhesive layer made of the above-described circuit connecting material, and having a sufficiently excellent blocking resistance when used as an adhesive reel. And an adhesive reel provided with such a film adhesive can be provided.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
PCT/JP2009/058392 2008-04-28 2009-04-28 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体 WO2009133901A1 (ja)

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JP5936882B2 (ja) * 2012-03-02 2016-06-22 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
KR20150005516A (ko) * 2012-04-25 2015-01-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체
JP6180159B2 (ja) * 2013-04-04 2017-08-16 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6149683B2 (ja) * 2013-10-18 2017-06-21 日立化成株式会社 フィルム状回路接続材料及びこれを用いた接続構造体
JP6580595B2 (ja) * 2014-04-30 2019-09-25 コンパニー ゼネラール デ エタブリッスマン ミシュラン 抑制発泡体のストリップを含むタイヤ
JP2016178029A (ja) * 2015-03-20 2016-10-06 デクセリアルズ株式会社 異方性導電フィルム
JP6746942B2 (ja) * 2016-02-20 2020-08-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
WO2016152791A1 (ja) * 2015-03-20 2016-09-29 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
KR102417443B1 (ko) * 2015-11-03 2022-07-06 주식회사 아모그린텍 자기장 차폐시트의 제조방법 및 이를 통해 제조된 자기장 차폐시트를 포함하는 안테나 모듈
CN108603078A (zh) * 2016-01-29 2018-09-28 日立化成株式会社 粘接剂膜及其制造方法、粘接剂带以及粘接剂膜用卷轴

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