WO2009116786A2 - 발열체 및 이의 제조방법 - Google Patents
발열체 및 이의 제조방법 Download PDFInfo
- Publication number
- WO2009116786A2 WO2009116786A2 PCT/KR2009/001339 KR2009001339W WO2009116786A2 WO 2009116786 A2 WO2009116786 A2 WO 2009116786A2 KR 2009001339 W KR2009001339 W KR 2009001339W WO 2009116786 A2 WO2009116786 A2 WO 2009116786A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pattern
- heating element
- heating
- conductive heating
- conductive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 183
- 238000000034 method Methods 0.000 claims abstract description 74
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 238000007639 printing Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000010304 firing Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 35
- 239000011521 glass Substances 0.000 claims description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 238000007645 offset printing Methods 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000007646 gravure printing Methods 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000002985 plastic film Substances 0.000 claims description 5
- 229920006255 plastic film Polymers 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 230000001788 irregular Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 37
- 230000020169 heat generation Effects 0.000 description 12
- 239000002904 solvent Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- -1 polyethylene naphthalate Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000012461 cellulose resin Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/04—Heating means manufactured by using nanotechnology
Definitions
- the present invention relates to a heating element and a method of manufacturing the same. Specifically, the present invention relates to a heating element and a method of manufacturing the same, which is not noticeable and has excellent heat generation performance at low voltage.
- the heating glass utilizes the concept of attaching a hot wire sheet to the glass surface or forming a hot wire directly on the glass surface and applying heat to both terminals of the hot wire to generate heat from the hot wire, thereby raising the temperature of the glass surface. It is also important that automotive or architectural pyrogenic glass has a low resistance in order to generate heat well, but it should not be distracting to human eyes.
- an object of the present invention is to provide a heating element that is inconspicuous and excellent in heat generation performance at low voltage, and a method for easily manufacturing the heating element at low cost.
- the present invention is to determine the shape of the pattern of the line width of the pattern is 100 micrometers or less and the opening ratio of the pattern is 70% or more and 99% or less, the paste comprising a conductive heating material on at least one surface of the resin film Printing according to the determined pattern, baking the paste including the printed conductive heating material to form a conductive heating pattern, and forming a bus bar at both ends of the conductive heating pattern, and the conductive Provided is a method of manufacturing a heating element comprising the step of bonding a transparent substrate to at least one surface of the resin film having a heating pattern, and providing a power supply unit connected to the bus bar.
- the present invention is a conductive resin pattern disposed on at least one surface of a) a resin film, b) the resin film, the line width of the pattern is 100 micrometers or less and the aperture ratio of the pattern is 70% or more and 99% or less, c) the conductive heating pattern Bus bars provided at both ends, d) a power source connected to the bus bar, and e) a heating element comprising a transparent substrate provided on at least one surface of the resin film on which the conductive heating pattern is formed.
- the conductive heating pattern of the heating element is preferably formed by an offset printing method, a gravure printing method, a plasmo printing method or an inkjet printing method, or a combination method of one or more of the printing methods.
- the method of manufacturing a heating element according to the present invention can provide a heating element having a conductive heating pattern excellent in heat generation performance at low voltage and low resistance due to thin line width, and is easy to process and low in cost.
- 1 is a schematic diagram showing an offset printing process.
- Figure 2 shows an example of a heating element for a vehicle according to an embodiment of the present invention.
- FIG 3 is a photograph of a heating element according to an exemplary embodiment of the present invention.
- 9 to 14 illustrate the shape of the conductive heating pattern according to the embodiment of the present invention.
- the method for manufacturing a heating element according to the present invention comprises determining a shape of a pattern in which the line width of the pattern is 100 micrometers or less and the opening ratio of the pattern is 70% or more and 99% or less, the paste comprising a conductive heating material on at least one surface of the resin film.
- the opening ratio of the pattern is more preferably 70% or more and 97.5% or less, and more preferably 80% or more and 97.5% or less.
- the shape of the conductive heating pattern is determined in advance in the form of the line width of the pattern of 100 micrometers or less and the opening ratio of the pattern of 70% or more and 99% or less, and the conductive heating by printing method according to the determined pattern.
- the shape of the conductive heating pattern is made thinner as described above, but by narrowing the line spacing than before, by controlling the opening ratio, that is, the area not occupied by the pattern to a certain range, the sheet resistance is low and the heating performance is excellent while the low voltage is excellent. Since the pattern is hard to discern with the naked eye, a heating element capable of securing a visual field can be provided.
- the shape of the pattern may be determined in advance, and the heating pattern may be formed on the transparent substrate as it is by the printing method, thereby predicting the shape of the conductive heating pattern to be finally formed. Accordingly, the shape of the heating pattern or the performance of the heating element on the mass-produced heating element can be predicted, and these can be easily managed. Therefore, it is much more advantageous to manage the state and performance of the heating element as compared to the randomly formed pattern.
- the manufacturing process of the heating element may be further simplified, and various materials and various printing methods such as a roll printing process may be utilized.
- the printing method is not particularly limited, and an offset printing method, a gravure printing method, a plasmo printing method or an inkjet printing method, or a combination method of one or more of the above printing methods may be used.
- the printing method may use a roll to roll method, a roll to plate, a plate to roll or a plate to plate method.
- offset printing may be performed by filling a paste on a patterned intaglio and then performing a primary transfer with a silicone rubber called a blanket, and then performing a secondary transfer by bringing the blanket and the resin film into close contact.
- Gravure printing may be performed by winding a blanket engraved with a pattern on a roll, filling a paste into a pattern, and transferring the resin film to a resin film.
- the above schemes as well as the above schemes may be used in combination. It is also possible to use printing methods known to those skilled in the art.
- the intaglio may be manufactured by precisely etching the glass having the desired conductive heating pattern engraved thereon, or may be metal or DLC (Diamond-like Carbon) coating on the glass surface for durability.
- the intaglio may be produced by etching a metal plate.
- the offset printing method is most preferable in order to implement a more precise conductive heating pattern.
- 1 illustrates an offset printing method.
- the blanket is first transferred by rotating the blanket, and the blanket is rotated as a second step to form a resin film 2.
- Car is killed.
- the conductive heating material it is preferable to use a metal having excellent thermal conductivity as the conductive heating material.
- the specific resistance value of the conductive heating material may have a value of 1 microOhm cm or more and 200 microOhm cm or less.
- the conductive heating material copper, silver, carbon nanotubes (CNT), or the like may be used, and silver is most preferred.
- the conductive heating material may be used in the form of particles. In the present invention, copper particles coated with silver may also be used as the conductive heating material.
- the paste may further include an organic binder to facilitate the printing process in addition to the aforementioned conductive heating material.
- the organic binder has a property of volatilization in the firing process.
- the organic binder include polyacrylic resins, polyurethane resins, polyester resins, polyolefin resins, polycarbonate resins, cellulose resins, polyimide resins, polyethylene naphthalate resins, and modified epoxy resins. It doesn't happen.
- the paste may further include glass frit.
- the glass frit may be selected from commercially available products, but it is preferable to use an environmentally friendly glass frit free of lead.
- the glass frit used should have an average aperture of 2 micrometers or less and a maximum aperture of 50 micrometers or less.
- a solvent may be further added to the paste.
- the solvent may include butyl carbitol acetate, carbitol acetate, cyclohexanon, cellosolve acetate, terpineol, and the like. The scope of the present invention is not limited.
- the weight ratio of each component is 50-90% of the conductive heating material, 1-20% of the organic binder, and 0.1-10 of glass frit. % And solvent 1-20% are preferred.
- the paste described above may be printed such that the line width of the conductive heating pattern is 100 micrometers or less, preferably 70 micrometers or less, more preferably 50 micrometers or less, even more preferably 30 micrometers or less by printing. Can be.
- the line width is set to 30 micrometers or less, the conductive heating pattern is hardly noticeable visually, which is advantageous for securing a visual field.
- the line width of the conductive heating pattern can be 5 micrometers or more and 30 micrometers or less by the printing method.
- the above-described heating pattern may be uniformly formed in line width and line height by the above-described method, and may be adjusted to include different line widths or line heights artificially. That is, when using the printing method using the paste it is possible to adjust the line spacing of the conductive heating pattern. Since the opening ratio in the pattern, that is, the ratio of the area of the resin film not covered by the pattern is preferably 70% or more, the interval between the lines of the conductive heating pattern is preferably 30 mm or less. When the conductive heating patterns do not cross each other, the interval between the lines of the conductive heating patterns is preferably printed at 200 micrometers or more and 30 mm or less. The height of the line from the resin film can be printed from 1 to 100 micrometers, preferably about 3 micrometers.
- the line width and line height of the heating pattern can be made uniform.
- the uniformity of the heating pattern may be within the range of ⁇ 3 micrometers in the case of line width, and may be within the range of ⁇ 1 micrometer in the case of line height.
- the printing pattern may be a stripe, a rhombus, a square grid, a circle, a wave pattern, a grid, a two-dimensional grid, or the like as shown in FIGS. 3 and 4 to 7, but is not limited thereto. It is preferable that the light emitted from a certain light source is designed so as not to impair optical properties by diffraction and interference. In other words, in order to minimize the regularity of the pattern, it is also possible to use a pattern consisting of irregular spacing and line thickness of sine wave, sine wave and lattice structure. In addition, in order to improve the optical properties, various patterns as shown in FIG. 8 may be added to the pattern. In addition, additional dot patterns may be irregularly formed without being connected to the pattern.
- the pattern and the dot pattern have a size of 30 micrometers or less.
- the print pattern can be a combination of two or more patterns.
- the line constituting the heating pattern may be a straight line, but various modifications such as curved lines, wavy lines, and zigzag lines are possible.
- the line width and the line height can be made uniform.
- at least a part of the conductive heating pattern may be artificially formed differently from the other patterns.
- a desired heating pattern can be obtained.
- the heating pattern of the corresponding area and the remaining area may be different.
- the line width or line spacing of the printing pattern may be different so that at least a part of the heating pattern is different from the remaining printing patterns. This can generate heat faster or more efficiently where desired. That is, the line spacing may be adjusted as illustrated in FIGS.
- the heating element according to the present invention may include at least two regions having different line widths or line intervals of the heating pattern.
- the heating element may include a region in which the conductive heating pattern is not formed.
- the conductive heating pattern By preventing the conductive heating pattern from being formed at least a portion of the heating element, transmission and reception of a specific frequency may be possible, and information transmission and reception between an internal space and the external space may be possible.
- the area where the conductive heating line is not formed may be determined according to a desired transmission / reception frequency. For example, in order to pass an electromagnetic wave of 1.6 GHz used in GPS, an area having a long side of 1/2 (9.4 cm) or more of the wavelength is required.
- the region in which the conductive heating pattern is not formed may have an area capable of transmitting and receiving a desired frequency, and the form thereof is not particularly limited.
- a region in which the conductive heating pattern is not formed may provide a heating element in which at least one semicircular region having a diameter of 5-20 cm is provided for passing electromagnetic waves.
- the conductive heating pattern may be blackened.
- the conductive heating pattern may be blackened by adding a blackening material to the paste for forming the heating pattern or by performing blackening after printing and baking the paste.
- Blackening materials that may be added to the paste include metal oxides, carbon black, carbon nanotubes, black pigments, colored glass frits, and the like.
- the composition of the paste is 50-90 wt% of the conductive heating material, 1-20 wt% of the organic binder, 1-10 wt% of the blackening material, 0.1-10 wt% of the glass frit, and 1-20 wt% of the solvent. It is good to do.
- the composition of the paste is 50-90 wt% of the conductive heating material, 1-20 wt% of the organic binder, 0.1-10 wt% of the glass frit, and 1-20 wt% of the solvent. good.
- the blackening treatment after firing includes immersion in an oxidizing solution such as Fe or Cu ion-containing solution, immersion in a halogen ion-containing solution such as chlorine ion, immersion in hydrogen peroxide, nitric acid, and the like, and treatment with halogen gas.
- the resin film it is preferable to use a film formed of a polymer resin as the resin film.
- the polymer resin may be one or more resins selected from polyacrylic resins, polyurethane resins, polyester resins, polyolefin resins, polycarbonate resins, cellulose resins, polyethylene naphthalate, PVB, and EVA.
- the substrate in the form of a film may be rigid or flexible.
- the resin film is a polymer film, it is best to use a low temperature calcined silver conductive paste for the conductive paste.
- the low temperature here is 50 degrees to 350 degrees, preferably 200 degrees or less, and more preferably 150 degrees or less.
- the resin film is polyethylene terephthalate (PET)
- PET polyethylene terephthalate
- the thickness of the resin film is preferably 12.5-500 micrometers, preferably 50-250 micrometers.
- the bus bar may be formed simultaneously with the formation of the conductive heating pattern, or may be formed using another printing method after forming the conductive heating pattern.
- the conductive heating pattern may be formed by offset printing, and then bus bars may be formed through screen printing.
- the thickness of the bus bar is preferably 1 to 100 micrometers, preferably 10-50 micrometers. If it is less than 1 micrometer, the contact resistance between the conductive heating pattern and the bus bar increases, which may result in local heat generation of the contacted portion. If it exceeds 100 micrometers, the electrode material cost increases.
- the connection between the bus bar and the power supply can be made through physical contact with the structure, which has good soldering and conductive heat generation.
- Bonding the transparent substrate to at least one surface of the resin film having the conductive heating pattern may be, for example, inserting the resin film printed with the conductive heating pattern between the transparent substrates and bonding using two adhesive films.
- the transparent substrate glass, a plastic substrate, or a plastic film may be used.
- a black pattern may be formed.
- the black pattern may be printed using a paste containing cobalt oxide.
- screen printing is suitable for screen printing, and a thickness of 10-100 micrometers is appropriate.
- the conductive heating pattern and the bus bar may be formed before or after forming the black pattern, respectively.
- the heating element according to the invention may comprise an additional transparent substrate on at least one side.
- a bonding film can be used when bonding the further transparent substrate. Temperature and pressure can be controlled during the bonding process.
- the adhesive film between the heating element and the additional transparent substrate according to the present invention put it in a vacuum bag to increase the temperature under reduced pressure, or by raising the temperature using a hot roll, by removing the air First joining is done.
- the pressure, temperature and time are different depending on the type of adhesive film, but the pressure is usually 300 ⁇ 700 torr, it can gradually raise the temperature from room temperature to 100 °C. At this time, the time is usually preferably within 1 hour.
- the pre-bonded laminate is subjected to the secondary bonding process by the autoclaving process of applying pressure in the autoclave and raising the temperature. Secondary bonding is different depending on the type of adhesive film, it is preferable to perform a slow cooling after 1 hour to 3 hours, preferably about 2 hours at a pressure of 140 bar or more and a temperature of about 130 ⁇ 150 °C.
- a method of bonding in one step using a vacuum laminator device may be used.
- the temperature can be gradually increased to 80 to 150 ° C. while being cooled slowly, while the pressure can be reduced to 100 ° C. ( ⁇ 5 mbar), and then pressurized ( ⁇ 1000 mbar) to join.
- any material having adhesion and becoming transparent after bonding can be used.
- PVB film, EVA film, PU film and the like can be used, but is not limited to these examples.
- the said bonding film is not specifically limited, It is preferable that the thickness is 100-800 micrometers.
- the additional transparent substrate to be bonded may be made of only a transparent substrate, or may be a transparent substrate having a conductive heating pattern manufactured as described above.
- the further transparent substrate may be glass, plastic substrate or plastic film.
- the present invention also relates to a) a resin film, b) a conductive heating pattern disposed on at least one surface of the resin film and having a line width of the pattern of 100 micrometers or less and an opening ratio of the pattern of 70% or more and 99% or less, c) the amount of the conductive heating pattern A bus bar positioned at an end thereof, d) a power supply unit connected to the bus bar, and e) a heating element including a transparent base material provided on at least one surface of the resin film having the conductive heating pattern formed.
- the conductive heating pattern of the heating element is preferably formed by a printing method.
- the heating element may include an additional transparent substrate on at least one surface.
- the transparent substrate may be a glass, a plastic substrate, or a plastic film.
- the conductive heating pattern formed by the printing method may be slightly different depending on the type or printing method of the paste, but the surface may be rounded by the surface tension. Such surface shape cannot be formed by a conventional photolithography method.
- the vertical cross section of the rounded pattern may have a lenticular lens shape.
- the angle between the tangent at the contact point between the pattern and the resin film surface and the surface of the resin film is 80 degrees or less, preferably 75 degrees or less, and more preferably 60 degrees or less.
- the linear region is preferably less than one-fifth in the circumferential direction.
- the line width of the conductive heating pattern of the heating element is 100 micrometers or less, preferably 50 micrometers or less, more preferably 30 micrometers or less, even more preferably 25 micrometers or less, line spacing is 30 mm or less, and the line height is 1 To 100 micrometers, more preferably about 3 micrometers.
- the heating element according to the present invention may be connected to a power source for heat generation, wherein the amount of heat is preferably 100 to 700 W per m 2 , preferably 200 to 300 W.
- the heating element according to the present invention has excellent heat generating performance even at low voltage, for example, 30 V or less, preferably 20 V or less, and thus may be usefully used in automobiles and the like.
- the resistance in the heating element is 5 ohms / square or less, preferably 1 ohm / square or less, more preferably 0.5 ohms / square or less.
- the heating element according to the present invention may have a shape forming a curved surface.
- the opening ratio of the conductive heating pattern that is, the proportion of the region of the resin film not covered by the pattern is preferably 70% or more. It is preferable that the opening ratio of the pattern is constant in the unit area for uniform heat generation and visibility of the heating element.
- the heating element preferably has a transmittance variation of 5% or less for any circle having a diameter of 20 cm. In this case, the heating element can prevent local heating.
- the heating element has a standard deviation of the surface temperature of the transparent substrate after heat generation within 20%, preferably within 10% within 5 minutes after heat generation.
- the heating element according to the present invention has a conductive heating pattern formed by the printing method, five or more pattern lines may be disposed per 1 cm of the bus bar.
- Figure 2 shows a specific embodiment of the car heating element. Assuming that the heating value required in a vehicle is 200 to 300 W, and a heating wire having a line width of 20 micrometers and a height of 1.5 micrometers is formed as shown in the drawing, three heating wires per 1 mm, that is, a heating wire having a pitch of about 330 micrometers Forming will achieve the desired performance.
- the specific resistance of the hot wire material is twice as high, the transmittance becomes 87.8% while producing the same heat amount when the pitch is set to 165 micrometers, which is also a sufficient transmittance even when used for automobiles.
- the stripe type heating element according to FIG. 2 has the following physical properties.
- n number of hot wires
- A cross-sectional area of the conductive wire (cm 2 )
- the line width (w) of the heating wire is 20 micrometers
- the height (h) is 1.5 micrometers
- the specific resistance ( ⁇ ) is 3 * 10 -6 ⁇ cm
- the line spacing (p) is 300 micrometers
- L 1 is 1 m
- R is 0.3 ⁇
- the aperture ratio is 93.3%
- heat of 480W is generated.
- the heating element according to the present invention may be applied to glass used in various transportation means such as automobiles, ships, railways, high speed trains, airplanes, or houses or other buildings.
- the heating element according to the present invention not only has excellent heating characteristics even at low voltage, but also minimizes side effects due to diffraction and interference of a single light source after sunset, and can be formed inconspicuously with the line width as described above. Unlike the prior art, it can also be applied to the windshield of vehicles such as automobiles.
- the low temperature baking silver paste of Fujikura Corporation was used as a silver paste.
- the intaglio used patterned glass in a grid fashion formed at right angles with a width of 20 micrometers and a depth of 7.5 micrometers at intervals of 300 micrometers.
- the primer primer of the polyester After coating the primer primer of the polyester on the PET film (125 micrometers thick), and dried for 2 minutes was subjected to the primer treatment. After forming a grid-type silver pattern using an offset printer using the method shown in Figure 1, it was baked for 30 minutes at 150 °C to form a silver wire.
- the spacing of the formed silver wire was 300 micrometers, the width was 25 micrometers, the height was 1.5 micrometers, and the opening ratio was 84%.
- the composite After cutting the substrate to 275mm x 270mm, placed between 400 micrometers thick EVA, the composite is sandwiched between 270mm x 270mm glass having a thickness of 3mm and bonded at 140 ° C for 30 minutes under 5 atm. Was prepared.
- a bus bar was formed by contacting the copper strip with a clip on the part located outside the laminated glass in the longitudinal direction. At this time, the resistance between both terminals was 5.4 ohm. At this time, when a voltage of 13V was applied, a calorific value of 38W (510W / m 2 ) was shown. As a result of measuring the exothermic phenomenon with an IR vision camera, the temperature increased from 20 degrees to 50 degrees within 5 minutes. In addition, the temperature deviation percentage value obtained by dividing the difference between the highest value and the lowest value of the temperature measured at 20 points in the heating section by the average value was 7% or less during the measurement time.
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/933,077 US20110017719A1 (en) | 2008-03-17 | 2009-03-17 | Heater and manufacturing method for same |
EP09721668.3A EP2275389B1 (en) | 2008-03-17 | 2009-03-17 | Heater and manufacturing method for same |
CN2009801096511A CN101977863A (zh) | 2008-03-17 | 2009-03-17 | 加热件及制备该加热件的方法 |
JP2011500699A JP2011515809A (ja) | 2008-03-17 | 2009-03-17 | 発熱体およびその製造方法 |
Applications Claiming Priority (24)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0024458 | 2008-03-17 | ||
KR20080024461 | 2008-03-17 | ||
KR10-2008-0024461 | 2008-03-17 | ||
KR10-2008-0024460 | 2008-03-17 | ||
KR20080024458 | 2008-03-17 | ||
KR20080024460 | 2008-03-17 | ||
KR10-2008-0026547 | 2008-03-21 | ||
KR20080026545 | 2008-03-21 | ||
KR10-2008-0026545 | 2008-03-21 | ||
KR20080026546 | 2008-03-21 | ||
KR20080026547 | 2008-03-21 | ||
KR20080026550 | 2008-03-21 | ||
KR20080026548 | 2008-03-21 | ||
KR10-2008-0026548 | 2008-03-21 | ||
KR10-2008-0026546 | 2008-03-21 | ||
KR10-2008-0026550 | 2008-03-21 | ||
KR10-2008-0045178 | 2008-05-15 | ||
KR20080045177 | 2008-05-15 | ||
KR10-2008-0045177 | 2008-05-15 | ||
KR20080045176 | 2008-05-15 | ||
KR10-2008-0045176 | 2008-05-15 | ||
KR20080045179 | 2008-05-15 | ||
KR10-2008-0045179 | 2008-05-15 | ||
KR20080045178 | 2008-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009116786A2 true WO2009116786A2 (ko) | 2009-09-24 |
WO2009116786A3 WO2009116786A3 (ko) | 2009-12-17 |
Family
ID=41091387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/001339 WO2009116786A2 (ko) | 2008-03-17 | 2009-03-17 | 발열체 및 이의 제조방법 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2275389B1 (enrdf_load_stackoverflow) |
JP (1) | JP2011515809A (enrdf_load_stackoverflow) |
KR (1) | KR101004171B1 (enrdf_load_stackoverflow) |
WO (1) | WO2009116786A2 (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012524970A (ja) * | 2009-10-21 | 2012-10-18 | エルジー・ハウシス・リミテッド | 発熱フィルム及びそれを含む発熱製品 |
CN102835186A (zh) * | 2010-04-01 | 2012-12-19 | Lg化学株式会社 | 加热元件及其制造方法 |
JP2013512847A (ja) * | 2009-12-04 | 2013-04-18 | サン−ゴバン グラス フランス | 超音波により組み込まれた導線を有するガラスパネル |
WO2014129845A1 (ko) * | 2013-02-22 | 2014-08-28 | 주식회사 엘지화학 | 발열체 및 이의 제조방법 |
WO2017188553A1 (ko) * | 2016-04-29 | 2017-11-02 | 주식회사 엘지화학 | 발열체 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5385192B2 (ja) * | 2010-03-29 | 2014-01-08 | 富士フイルム株式会社 | パターン生成方法及びパターン生成プログラム |
JP5497555B2 (ja) * | 2010-06-30 | 2014-05-21 | 富士フイルム株式会社 | 透明導電性フイルム及び発熱ガラスの製造方法 |
JP5548051B2 (ja) * | 2010-06-30 | 2014-07-16 | 富士フイルム株式会社 | 透明導電性フイルム及び発熱ガラスの製造方法 |
EP2665337A2 (en) * | 2011-01-13 | 2013-11-20 | LG Chem, Ltd. | Heating element and method for manufacturing same |
GB201404084D0 (en) * | 2014-03-07 | 2014-04-23 | Pilkington Group Ltd | Glazing |
DE102014107480B4 (de) | 2014-05-27 | 2016-02-04 | Webasto SE | Kunststoffheckscheibe mit Heckscheibenheizung und Verfahren zur Herstellung derselben |
ES2904881T3 (es) | 2014-06-09 | 2022-04-06 | BABA Mitsuko | Cuerpo generador de calor |
JP6589270B2 (ja) * | 2014-10-27 | 2019-10-16 | 大日本印刷株式会社 | 発熱板用の中間部材 |
JP2016102055A (ja) * | 2014-11-17 | 2016-06-02 | 大日本印刷株式会社 | 合わせガラス、パターンシート及び合わせガラスの製造方法 |
WO2016080406A1 (ja) | 2014-11-17 | 2016-05-26 | 大日本印刷株式会社 | 発熱板、導電性パターンシート、乗り物、及び、発熱板の製造方法 |
US10912155B2 (en) | 2014-11-17 | 2021-02-02 | Dai Nippon Printing Co., Ltd. | Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate |
JP2016102056A (ja) * | 2014-11-17 | 2016-06-02 | 大日本印刷株式会社 | 合わせガラス及びその製造方法 |
JP6293722B2 (ja) * | 2014-12-01 | 2018-03-14 | 大日本印刷株式会社 | 合わせガラス及び合わせガラス用パターンシート |
JP6840452B2 (ja) * | 2015-01-30 | 2021-03-10 | 大日本印刷株式会社 | 合わせガラスおよび導電性発熱体 |
JP6976676B2 (ja) * | 2015-03-31 | 2021-12-08 | 大日本印刷株式会社 | 透明発熱板及び乗り物 |
EP3955704B1 (en) * | 2015-11-17 | 2025-07-23 | Dai Nippon Printing Co., Ltd. | Heating electrode device, electrical heating glass, heat-generating plate, vehicle, window for building, sheet with conductor, conductive pattern sheet, conductive heat-generating body, laminated glass, and manufacturing method for conductive heat-generating body |
JP6913294B2 (ja) * | 2015-12-16 | 2021-08-04 | 大日本印刷株式会社 | 発熱板、導電体付きシート、乗り物及び建築物用窓 |
JP2017204388A (ja) * | 2016-05-11 | 2017-11-16 | 大日本印刷株式会社 | 導電性発熱体および合わせガラス |
FR3056069A1 (fr) * | 2016-09-13 | 2018-03-16 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Reseau percolant de nanofils pour chauffage grande surface. |
FR3056070B1 (fr) * | 2016-09-13 | 2018-10-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Reseau percolant de nanofils pour chauffage localise. |
JP6905831B2 (ja) * | 2017-01-19 | 2021-07-21 | 日本板硝子株式会社 | 合わせガラス |
KR102251892B1 (ko) * | 2017-04-13 | 2021-05-14 | 엘지이노텍 주식회사 | 발열 장치 |
JP7311948B2 (ja) | 2017-11-29 | 2023-07-20 | 日本板硝子株式会社 | ウインドシールド |
JP6984388B2 (ja) * | 2017-12-20 | 2021-12-17 | 住友ベークライト株式会社 | 構造体および内装材 |
DE112019006307T5 (de) | 2018-12-21 | 2021-09-09 | AGC Inc. | Laminiertes Glas |
DE102019111546A1 (de) * | 2019-05-03 | 2020-11-05 | Irlbacher Blickpunkt Glas Gmbh | Leuchte mit einer Beschichtung zur Enteisung |
JP6818260B2 (ja) * | 2019-09-18 | 2021-01-20 | 大日本印刷株式会社 | 発熱板用の中間部材 |
EP4061633A1 (en) * | 2019-11-18 | 2022-09-28 | AGC Glass Europe | Laminated glazing |
WO2023120024A1 (ja) * | 2021-12-24 | 2023-06-29 | 富士フイルム株式会社 | 透明発熱体および透明発熱成形体 |
KR102751849B1 (ko) * | 2023-01-04 | 2025-01-10 | (주)티에이치엔 | 카메라 미러 시스템의 습기제거장치 및 이의 제조방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8100601A (nl) * | 1981-02-09 | 1982-09-01 | Philips Nv | Ruit voorzien van elektrische draad en draad. |
GB8705075D0 (en) * | 1987-03-04 | 1987-04-08 | Pilkington Brothers Plc | Printing |
JPH02165591A (ja) * | 1988-12-20 | 1990-06-26 | Nippon Sheet Glass Co Ltd | 自動車窓用ヒータ線の導体印刷パターン作図装置 |
JPH06139845A (ja) * | 1992-10-27 | 1994-05-20 | Matsushita Electric Ind Co Ltd | パターン化した透明導電膜の形成方法 |
JPH0728740U (ja) * | 1993-11-09 | 1995-05-30 | タムステクノロジー株式会社 | 自動車用曇り止め機能付ミラー |
JPH0872674A (ja) * | 1994-07-08 | 1996-03-19 | Asahi Glass Co Ltd | 電熱窓ガラス |
JPH11322361A (ja) * | 1998-05-08 | 1999-11-24 | Asahi Glass Co Ltd | 導電性ペースト及び導電体付ガラス板 |
DE10126869A1 (de) * | 2001-06-01 | 2002-12-19 | Saint Gobain Sekurit D Gmbh | Elektrisch beheizbare Scheibe |
JP2003157958A (ja) * | 2001-11-20 | 2003-05-30 | Matsushita Electric Ind Co Ltd | 面状発熱体 |
KR200287050Y1 (ko) * | 2002-05-20 | 2002-08-30 | 황종하 | 산화주석코팅유리를 활용한 투명면상접합발열유리 |
GB0408392D0 (en) * | 2004-04-15 | 2004-05-19 | Pilkington Plc | Electrically heated window |
WO2005105691A1 (ja) * | 2004-04-28 | 2005-11-10 | Asahi Glass Company, Limited | 導電性プリントを有するガラス板およびその製造方法 |
JP4679088B2 (ja) * | 2004-07-09 | 2011-04-27 | グンゼ株式会社 | 透明面状発熱体及びその製造方法 |
JP4679087B2 (ja) * | 2004-07-09 | 2011-04-27 | グンゼ株式会社 | 透明面状発熱体及びその製造方法 |
GB0427749D0 (en) * | 2004-12-18 | 2005-01-19 | Pilkington Plc | Electrically heated window |
CN101129092A (zh) * | 2005-02-24 | 2008-02-20 | 埃克阿泰克有限责任公司 | 脉冲宽度调制的除霜器 |
WO2006106759A1 (ja) * | 2005-04-01 | 2006-10-12 | Nissha Printing Co., Ltd. | 車両用透明アンテナおよびアンテナ付き車両用ガラス |
JP4971716B2 (ja) * | 2006-08-10 | 2012-07-11 | 日本板硝子株式会社 | 導電性セラミックス焼結体付き車両用窓ガラス及びその製造方法 |
-
2009
- 2009-03-17 EP EP09721668.3A patent/EP2275389B1/en active Active
- 2009-03-17 JP JP2011500699A patent/JP2011515809A/ja active Pending
- 2009-03-17 WO PCT/KR2009/001339 patent/WO2009116786A2/ko active Application Filing
- 2009-03-17 KR KR1020090022808A patent/KR101004171B1/ko active Active
Non-Patent Citations (2)
Title |
---|
None |
See also references of EP2275389A4 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012524970A (ja) * | 2009-10-21 | 2012-10-18 | エルジー・ハウシス・リミテッド | 発熱フィルム及びそれを含む発熱製品 |
US9609695B2 (en) | 2009-10-21 | 2017-03-28 | Lg Hausys, Ltd. | Heat-generating film, and heat-generating product comprising same |
JP2013512847A (ja) * | 2009-12-04 | 2013-04-18 | サン−ゴバン グラス フランス | 超音波により組み込まれた導線を有するガラスパネル |
CN102835186A (zh) * | 2010-04-01 | 2012-12-19 | Lg化学株式会社 | 加热元件及其制造方法 |
WO2014129845A1 (ko) * | 2013-02-22 | 2014-08-28 | 주식회사 엘지화학 | 발열체 및 이의 제조방법 |
WO2017188553A1 (ko) * | 2016-04-29 | 2017-11-02 | 주식회사 엘지화학 | 발열체 |
US10796818B2 (en) | 2016-04-29 | 2020-10-06 | Lg Chem., Ltd. | Heating element |
Also Published As
Publication number | Publication date |
---|---|
KR20090099503A (ko) | 2009-09-22 |
EP2275389B1 (en) | 2013-09-18 |
EP2275389A2 (en) | 2011-01-19 |
EP2275389A4 (en) | 2011-08-03 |
WO2009116786A3 (ko) | 2009-12-17 |
JP2011515809A (ja) | 2011-05-19 |
KR101004171B1 (ko) | 2010-12-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009116786A2 (ko) | 발열체 및 이의 제조방법 | |
WO2009116787A2 (ko) | 발열체 및 이의 제조방법 | |
WO2009151203A1 (ko) | 발열체 및 이의 제조방법 | |
WO2009151204A1 (ko) | 발열체 및 이의 제조방법 | |
WO2011081456A2 (ko) | 발열체 및 이의 제조방법 | |
WO2013141629A1 (ko) | 발열체 및 이의 제조방법 | |
WO2013162178A1 (ko) | 발열체 및 이의 제조방법 | |
WO2010085097A2 (ko) | 발열체 및 이의 제조방법 | |
WO2012036459A2 (ko) | 발열체 및 이의 제조방법 | |
WO2012096540A2 (ko) | 발열체 및 이의 제조방법 | |
US20110017719A1 (en) | Heater and manufacturing method for same | |
WO2014129845A1 (ko) | 발열체 및 이의 제조방법 | |
WO2016052949A2 (ko) | 발열체 및 이의 제조방법 | |
WO2011087235A2 (ko) | 발열유리 및 이의 제조방법 | |
WO2015056971A1 (ko) | 통신창을 갖는 발열체 | |
WO2012096541A2 (ko) | 발열체 및 이의 제조방법 | |
KR101083883B1 (ko) | 부분 발열체 | |
CN101977863A (zh) | 加热件及制备该加热件的方法 | |
KR20090099504A (ko) | 안테나 기판 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980109651.1 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09721668 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12933077 Country of ref document: US Ref document number: 2009721668 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011500699 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |