WO2009072569A1 - カーボンブラック分散ポリアミド酸溶液組成物、それを用いた半導電性ポリイミド樹脂ベルトの製造方法及び半導電性ポリイミド樹脂ベルト - Google Patents

カーボンブラック分散ポリアミド酸溶液組成物、それを用いた半導電性ポリイミド樹脂ベルトの製造方法及び半導電性ポリイミド樹脂ベルト Download PDF

Info

Publication number
WO2009072569A1
WO2009072569A1 PCT/JP2008/072070 JP2008072070W WO2009072569A1 WO 2009072569 A1 WO2009072569 A1 WO 2009072569A1 JP 2008072070 W JP2008072070 W JP 2008072070W WO 2009072569 A1 WO2009072569 A1 WO 2009072569A1
Authority
WO
WIPO (PCT)
Prior art keywords
acid solution
polyamic acid
polyimide resin
carbon black
composition
Prior art date
Application number
PCT/JP2008/072070
Other languages
English (en)
French (fr)
Inventor
Naoki Nishiura
Akira Ichino
Takashi Kuraoka
Toru Murakami
Takeshige Nakayama
Original Assignee
Gunze Limited
Ube Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gunze Limited, Ube Industries, Ltd. filed Critical Gunze Limited
Priority to CN2008801194863A priority Critical patent/CN101889059B/zh
Priority to EP08857838.0A priority patent/EP2218755B1/en
Priority to US12/734,960 priority patent/US8686106B2/en
Priority to JP2009544714A priority patent/JP5409385B2/ja
Priority to KR1020107014671A priority patent/KR101480800B1/ko
Publication of WO2009072569A1 publication Critical patent/WO2009072569A1/ja
Priority to HK11104279.1A priority patent/HK1150169A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
    • G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
    • G03G15/1605—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support
    • G03G15/162—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support details of the the intermediate support, e.g. chemical composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/12—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers
    • B29K2105/165—Hollow fillers, e.g. microballoons or expanded particles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/16—Transferring device, details
    • G03G2215/1604—Main transfer electrode
    • G03G2215/1623—Transfer belt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

　本発明は、高い固形分濃度及び高いカーボンブラック含有量を有するカーボンブラック分散ポリアミド酸溶液組成物を提供する。さらに、該ポリアミド酸溶液組成物を用いた中間転写ベルトを提供する。ビフェニルテトラカルボン酸二無水物と芳香族ジアミンとを有機極性溶媒中で反応して得られるポリアミド酸溶液に、カーボンブラックを均一分散させてなるカーボンブラック分散ポリアミド酸溶液組成物であって、該ビフェニルテトラカルボン酸二無水物が、２，３，３’，４’－ビフェニルテトラカルボン酸二無水物および３，３’，４，４’－ビフェニルテトラカルボン酸二無水物を含み、芳香族ジアミンが、４，４’－ジアミノジフェニルエーテルおよびｐ－フェニレンジアミンを含み、かつ該ポリアミド酸溶液中の固形分濃度が２５重量％以上であるカーボンブラック分散ポリアミド酸溶液組成物である。
PCT/JP2008/072070 2007-12-06 2008-12-04 カーボンブラック分散ポリアミド酸溶液組成物、それを用いた半導電性ポリイミド樹脂ベルトの製造方法及び半導電性ポリイミド樹脂ベルト WO2009072569A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN2008801194863A CN101889059B (zh) 2007-12-06 2008-12-04 炭黑分散聚酰胺酸溶液组合物,用该组合物制造半导电聚酰亚胺树脂带的方法和半导电聚酰亚胺树脂带
EP08857838.0A EP2218755B1 (en) 2007-12-06 2008-12-04 Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt
US12/734,960 US8686106B2 (en) 2007-12-06 2008-12-04 Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt
JP2009544714A JP5409385B2 (ja) 2007-12-06 2008-12-04 カーボンブラック分散ポリアミド酸溶液組成物、それを用いた半導電性ポリイミド樹脂ベルトの製造方法及び半導電性ポリイミド樹脂ベルト
KR1020107014671A KR101480800B1 (ko) 2007-12-06 2008-12-04 카본 블랙이 분산된 폴리아미드산 용액 조성물, 이를 이용한 반도전성 폴리이미드 수지 벨트의 제조 방법 및 반도전성 폴리이미드 수지 벨트
HK11104279.1A HK1150169A1 (en) 2007-12-06 2011-04-28 Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-316198 2007-12-06
JP2007316198 2007-12-06

Publications (1)

Publication Number Publication Date
WO2009072569A1 true WO2009072569A1 (ja) 2009-06-11

Family

ID=40717746

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072070 WO2009072569A1 (ja) 2007-12-06 2008-12-04 カーボンブラック分散ポリアミド酸溶液組成物、それを用いた半導電性ポリイミド樹脂ベルトの製造方法及び半導電性ポリイミド樹脂ベルト

Country Status (7)

Country Link
US (1) US8686106B2 (ja)
EP (1) EP2218755B1 (ja)
JP (1) JP5409385B2 (ja)
KR (1) KR101480800B1 (ja)
CN (1) CN101889059B (ja)
HK (1) HK1150169A1 (ja)
WO (1) WO2009072569A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018051980A1 (ja) * 2016-09-14 2018-03-22 住友化学株式会社 液晶性樹脂組成物
CN109456481A (zh) * 2018-11-22 2019-03-12 桂林电子科技大学 一种氧化石墨烯/聚酰亚胺黑膜的制备方法
CN111025848A (zh) * 2019-12-31 2020-04-17 阜阳欣奕华材料科技有限公司 一种高分子分散剂及其应用

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8980410B2 (en) * 2013-03-15 2015-03-17 Lighting Science Group Corporation Thermally conductive sheet and associated methods
US9963578B2 (en) 2013-07-17 2018-05-08 Nexolve Corporation Black polyimides and synthesis thereof
KR101714892B1 (ko) 2014-08-26 2017-03-09 주식회사 엘지화학 표면 코팅된 양극 활물질, 이의 제조방법, 및 이를 포함하는 리튬 이차전지
CN106566462A (zh) * 2015-10-09 2017-04-19 北京化工大学 一种耐高温聚酰亚胺胶黏剂的制备方法
CN114874441B (zh) * 2022-07-12 2022-11-01 明士(北京)新材料开发有限公司 一种化学增幅型正性光敏聚酰亚胺涂层胶及其制备方法与应用

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115887A (ja) * 1985-11-15 1987-05-27 日東電工株式会社 フレキシブル印刷回路基板
JPH07156287A (ja) 1993-12-10 1995-06-20 Gunze Ltd 半導電性ポリイミド系無端ベルトとその製造方法
JPH1063115A (ja) 1996-08-20 1998-03-06 Fuji Xerox Co Ltd 画像形成装置およびその中間転写ベルトの製造方法
JPH1083122A (ja) 1996-09-06 1998-03-31 Fuji Xerox Co Ltd 画像形成装置および中間転写体ベルトとその製造方法
JP2000129001A (ja) * 1998-10-21 2000-05-09 Ube Ind Ltd ポリイミド樹脂成形体
JP2001260151A (ja) 2000-03-15 2001-09-25 Gunze Ltd 無端管状フイルムとその使用
JP2002341673A (ja) 2001-05-21 2002-11-29 Nitto Denko Corp 半導電性ベルト
JP2003266454A (ja) 2002-03-13 2003-09-24 Nitto Denko Corp シームレス単層ベルト及びその製造方法
JP2006225625A (ja) * 2005-01-19 2006-08-31 Nitto Denko Corp 半導電性樹脂組成物および配線回路基板
JP2007001262A (ja) * 2005-06-27 2007-01-11 Gunze Ltd 面方向に等方性の誘電率を持ったポリイミド系樹脂ベルト
WO2008035647A1 (fr) * 2006-09-19 2008-03-27 Gunze Limited Composition de solution d'acide polyamique au noir de carbone dispersé, et procédé de fabrication d'une courroie de résine de polyimide semi-conductrice
JP2008076518A (ja) * 2006-09-19 2008-04-03 Gunze Ltd 半導電性ポリイミド樹脂ベルト及びその製造方法
JP2008074900A (ja) * 2006-09-19 2008-04-03 Gunze Ltd 半導電性ポリイミド樹脂ベルト及びその製造方法
WO2008059801A1 (fr) * 2006-11-13 2008-05-22 Ube Industries, Ltd. Procédé de fabrication d'une solution d'acide polyamide et solution d'acide polyamique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2746643B2 (ja) 1989-04-17 1998-05-06 住友ベークライト株式会社 フレキシブルプリント回路板およびその製造方法
JP3530065B2 (ja) * 1999-03-31 2004-05-24 グンゼ株式会社 半導電性ポリアミド酸組成液及びそれを用いた半導電性無端管状ポリイミドフイルム
EP1721924B1 (en) 2004-03-03 2014-12-17 Gunze Limited Endless tubular polyimide film
CN1807509A (zh) * 2005-01-19 2006-07-26 日东电工株式会社 半导电性树脂组合物及配线电路基板
KR101540827B1 (ko) 2007-11-29 2015-07-30 우베 고산 가부시키가이샤 폴리아믹산 용액의 제조 방법 및 폴리아믹산 용액

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115887A (ja) * 1985-11-15 1987-05-27 日東電工株式会社 フレキシブル印刷回路基板
JPH07156287A (ja) 1993-12-10 1995-06-20 Gunze Ltd 半導電性ポリイミド系無端ベルトとその製造方法
JPH1063115A (ja) 1996-08-20 1998-03-06 Fuji Xerox Co Ltd 画像形成装置およびその中間転写ベルトの製造方法
JPH1083122A (ja) 1996-09-06 1998-03-31 Fuji Xerox Co Ltd 画像形成装置および中間転写体ベルトとその製造方法
JP2000129001A (ja) * 1998-10-21 2000-05-09 Ube Ind Ltd ポリイミド樹脂成形体
JP2001260151A (ja) 2000-03-15 2001-09-25 Gunze Ltd 無端管状フイルムとその使用
JP2002341673A (ja) 2001-05-21 2002-11-29 Nitto Denko Corp 半導電性ベルト
JP2003266454A (ja) 2002-03-13 2003-09-24 Nitto Denko Corp シームレス単層ベルト及びその製造方法
JP2006225625A (ja) * 2005-01-19 2006-08-31 Nitto Denko Corp 半導電性樹脂組成物および配線回路基板
JP2007001262A (ja) * 2005-06-27 2007-01-11 Gunze Ltd 面方向に等方性の誘電率を持ったポリイミド系樹脂ベルト
WO2008035647A1 (fr) * 2006-09-19 2008-03-27 Gunze Limited Composition de solution d'acide polyamique au noir de carbone dispersé, et procédé de fabrication d'une courroie de résine de polyimide semi-conductrice
JP2008076518A (ja) * 2006-09-19 2008-04-03 Gunze Ltd 半導電性ポリイミド樹脂ベルト及びその製造方法
JP2008074900A (ja) * 2006-09-19 2008-04-03 Gunze Ltd 半導電性ポリイミド樹脂ベルト及びその製造方法
WO2008059801A1 (fr) * 2006-11-13 2008-05-22 Ube Industries, Ltd. Procédé de fabrication d'une solution d'acide polyamide et solution d'acide polyamique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2218755A4

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018051980A1 (ja) * 2016-09-14 2018-03-22 住友化学株式会社 液晶性樹脂組成物
CN109456481A (zh) * 2018-11-22 2019-03-12 桂林电子科技大学 一种氧化石墨烯/聚酰亚胺黑膜的制备方法
CN109456481B (zh) * 2018-11-22 2021-07-20 桂林电子科技大学 一种氧化石墨烯/聚酰亚胺黑膜的制备方法
CN111025848A (zh) * 2019-12-31 2020-04-17 阜阳欣奕华材料科技有限公司 一种高分子分散剂及其应用
CN111025848B (zh) * 2019-12-31 2023-04-11 阜阳欣奕华材料科技有限公司 一种高分子分散剂及其应用

Also Published As

Publication number Publication date
KR20100099247A (ko) 2010-09-10
CN101889059A (zh) 2010-11-17
JPWO2009072569A1 (ja) 2011-04-28
JP5409385B2 (ja) 2014-02-05
EP2218755B1 (en) 2014-04-02
US20100247888A1 (en) 2010-09-30
US8686106B2 (en) 2014-04-01
EP2218755A1 (en) 2010-08-18
EP2218755A4 (en) 2011-11-16
KR101480800B1 (ko) 2015-01-09
CN101889059B (zh) 2012-06-20
HK1150169A1 (en) 2011-11-04

Similar Documents

Publication Publication Date Title
WO2009072569A1 (ja) カーボンブラック分散ポリアミド酸溶液組成物、それを用いた半導電性ポリイミド樹脂ベルトの製造方法及び半導電性ポリイミド樹脂ベルト
WO2010114338A3 (ko) 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
CN106279691B (zh) 聚酰亚胺前体、聚酰亚胺及其制备中所用的材料
KR102641711B1 (ko) 폴리아미드산 용액 조성물 및 폴리이미드 필름
JP6544055B2 (ja) ポリイミド膜の製造方法
WO2008078620A1 (ja) 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法
WO2008120787A1 (ja) 芳香族ポリイミドおよびその製造方法
WO2011081314A3 (ko) 대전방지특성 또는 전기전도특성을 가지는 전방향족 폴리이미드 분말의 제조방법
WO2008092168A3 (en) Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
WO2008132960A1 (ja) 新規なポリイミド前駆体組成物及びその利用
US20070292701A1 (en) Novel Polyimide Film Improved in Adhesion
TW200628514A (en) Unsaturated group-containing polyimide resin, photosensitive resin composition containing the same and cured resin thereof
WO2006083407A3 (en) Method to prepare bis(halophthalimides)
TW200734383A (en) Polyimide film
TW200728355A (en) Polycyclic polyimides and compositions and methods relating thereto
CA2634249A1 (en) Two-stage cure polyimide oligomers
CN104211980B (zh) 一种低介电常数聚酰亚胺薄膜及其制备方法
TW200643104A (en) Thermosetting resin composition
WO2009022619A1 (ja) ポリイミド樹脂組成物、該ポリイミド樹脂組成物を与えるポリイミド前駆体樹脂組成物およびそれらの製造方法、ならびにポリイミドフィルムおよびその製造方法
WO2010126132A3 (ja) 変性ポリイミドの製造方法及び変性ポリイミド
TW200641008A (en) Method for manufacturing polyimide film
EP2119739A3 (en) Polyimide, polyamic acid and processes for the production thereof
WO2011049357A3 (ko) 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 동박 적층판
WO2009037834A1 (ja) 半導体装置用プライマー樹脂及び半導体装置
WO2008155811A1 (ja) ６，６－ポリイミド共重合体及びその製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880119486.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08857838

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009544714

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2008857838

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12734960

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20107014671

Country of ref document: KR

Kind code of ref document: A